Multilayer electronic component

Abstract

This disclosure provides a multilayer electronic component. The multilayer electronic component includes: a capacitor comprising a ceramic body and an outer electrode, the ceramic body including alternating dielectric layers and inner electrodes with the dielectric layers intermediate between the inner electrodes, the outer electrode disposed on the ceramic body and connected to the inner electrodes; and an organic layer configured to cover at least a portion of the outer surface of the capacitor and comprising a crosslinked polymer, the crosslinked polymer comprising at least one selected from the group consisting of polyacetylene polymers and polystyrene polymers, wherein the crosslinked polymer may have functional groups, the functional groups comprising one or more selected from the group consisting of silyl groups, phosphate groups, thiol groups, carboxyl groups, and isocyanate groups.

Description

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2024-0201938, filed on December 31, 2024, with the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference. Technical Field

[0002] This disclosure relates to a multilayer electronic component. Background Technology

[0003] Multilayer ceramic capacitors (MLCCs, a type of multilayer electronic component) are surface-mount capacitors mounted on printed circuit boards in various types of electronic products, such as image display devices including liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, smartphones, and mobile phones, for charging or discharging. Such multilayer ceramic capacitors are used as components in a wide variety of electronic devices due to their small size, guaranteed high capacitance, and ease of installation.

[0004] Recently, coating the surface of multilayer ceramic capacitors with hydrophobic agents has been considered a method to improve the moisture-proof reliability of multilayer ceramic capacitors. Silane coupling agents are mainly used as hydrophobic agents for coating multilayer ceramic capacitors, but research is needed on hydrophobic agents with improved thermal and chemical stability to improve the coating's lifespan. Summary of the Invention

[0005] Technical issues One aspect of this disclosure is to provide a multilayer electronic component with excellent reliability.

[0006] However, the problems to be solved by this disclosure are not limited to those described above, and will be more readily understood in the process of describing specific embodiments of this disclosure.

[0007] Technical solutions to the problem A multilayer electronic component according to embodiments of the present disclosure may include: a capacitor including a ceramic body and an outer electrode, the ceramic body including alternating dielectric layers and inner electrodes with the dielectric layers interposed between the inner electrodes, the outer electrode disposed on the ceramic body and connected to the inner electrode; and an organic layer configured to cover at least a portion of the outer surface of the capacitor and comprising a crosslinked polymer, the crosslinked polymer comprising at least one selected from the group consisting of polyacetylene polymers and polystyrene polymers, wherein the crosslinked polymer may have functional groups, the functional groups comprising one or more selected from the group consisting of silyl groups, phosphate groups, thiol groups, carboxyl groups and isocyanate groups.

[0008] A multilayer electronic component according to embodiments of the present disclosure may include: a capacitor including a ceramic body and an outer electrode, the ceramic body including alternating dielectric layers and inner electrodes with the dielectric layers interposed between the inner electrodes, the outer electrode disposed on the ceramic body and connected to the inner electrode; and an organic layer configured to cover at least a portion of the outer surface of the capacitor, the organic layer including a crosslinked polymer, the crosslinked polymer including repeating units derived from a self-assembled monolayer material including a head and a link portion connected to the head, the head including one or more selected from the group consisting of silyl groups, phosphate groups, thiol groups, carboxyl groups and isocyanate groups, wherein the link portion may have at least one carbon-carbon double bond.

[0009] Beneficial effects According to one aspect of this disclosure, multilayer electronic components with excellent moisture resistance and reliability can be provided. Attached Figure Description

[0010] Figure 1 This is a perspective view schematically illustrating a multilayer electronic assembly according to an embodiment of the present disclosure.

[0011] Figure 2 This is a perspective view schematically showing a capacitor according to an embodiment of the present disclosure.

[0012] Figure 3 schematically showing along Figure 1 The cross-sectional view taken from line I-I'.

[0013] Figure 4 schematically showing along Figure 1 The cross-sectional view taken from line II-II'.

[0014] Figure 5 This is a schematic diagram illustrating the process of forming the organic layer.

[0015] Figures 6A to 6D This is a schematic diagram illustrating an example of the process for forming an organic layer. Detailed Implementation

[0016] In the following description, embodiments of the present disclosure will be described with reference to specific examples and accompanying drawings. However, embodiments of the present disclosure may be modified in various other forms, and the scope of the present disclosure is not limited to the embodiments described below. Furthermore, embodiments of the present disclosure may be provided to describe the present disclosure more completely to those skilled in the art. Therefore, for clarity of description, the shape and size of elements in the drawings may be exaggerated, and elements indicated by the same reference numerals in the drawings may be the same elements.

[0017] In the accompanying drawings, for the purpose of clarifying this disclosure, parts irrelevant to the description will be omitted, and thicknesses may be enlarged to clearly show layers and regions. The same reference numerals will be used to denote the same components. Furthermore, throughout the specification, unless otherwise expressly stated, when an element is referred to as "comprising" or "including" an element, it means that the element may also include other elements, without excluding other elements.

[0018] In the accompanying drawings, the first direction X can be defined as the thickness direction, the second direction Y can be defined as the length direction, and the third direction Z can be defined as the width direction.

[0019] Multilayer electronic components Figure 1 This is a perspective view schematically illustrating a multilayer electronic assembly according to an embodiment of the present disclosure.

[0020] Figure 2 This is a perspective view schematically showing a capacitor according to an embodiment of the present disclosure.

[0021] Figure 3 schematically showing along Figure 1 The cross-sectional view taken from line I-I'.

[0022] Figure 4 schematically showing along Figure 1 The cross-sectional view taken from line II-II'.

[0023] Figure 5 This is a schematic diagram illustrating the process of forming the organic layer.

[0024] Figures 6A to 6D This is a schematic diagram illustrating an example of the process for forming an organic layer.

[0025] In the following text, reference will be made to Figures 1 to 6D A multilayer electronic assembly 1000 according to embodiments of the present disclosure is described in detail. Furthermore, a multilayer ceramic capacitor is described as an example of a multilayer electronic assembly, but the present disclosure is not limited thereto and can also be applied to various multilayer electronic assemblies such as inductors, piezoelectric elements, varistors, or thermistors.

[0026] There are no particular restrictions on the size of the multilayer electronic component 1000. The maximum length of the multilayer electronic component 1000 in the second direction can be 0.1 mm to 6.0 mm, the maximum width of the multilayer electronic component 1000 in the third direction can be 0.1 mm to 5.0 mm, and the maximum thickness of the multilayer electronic component 1000 in the first direction can be 0.05 mm to 3.5 mm.

[0027] The multi-layer electronic component 1000 according to an embodiment of the present disclosure may include a capacitor 100 and an organic layer 140. The capacitor 100 includes a ceramic body 110 and external electrodes 131 and 132.

[0028] The capacitor 100 may include a ceramic body 110 and external electrodes 131 and 132. The capacitor 100 may be configured to perform the functions of the multi-layer electronic component 1000 (e.g., the function of forming a capacitance).

[0029] There is no particular limitation on the specific shape of the ceramic body 110. However, as shown, the ceramic body 110 may have a hexahedron shape or a shape similar to a hexahedron shape. Due to the shrinkage of the ceramic powder particles contained in the ceramic body 110 during the sintering process or due to the polishing process of the corners of the ceramic body 110, the ceramic body 110 may not have a completely straight hexahedron shape but may have a substantially hexahedron shape.

[0030] The ceramic body 110 may have a first surface 1 and a second surface 2 that face each other in a first direction, a third surface 3 and a fourth surface 4 that are connected to the first surface 1 and the second surface 2 and face each other in a second direction, and a fifth surface 5 and a sixth surface 6 that are connected to the first surface 1, the second surface 2, the third surface 3, and the fourth surface 4 and face each other in a third direction.

[0031] The ceramic body 110 may include a dielectric layer 111 and internal electrodes 121 and 122 that are alternately arranged with the dielectric layer 111 in a first direction. The plurality of dielectric layers 111 forming the ceramic body 110 are in a sintered state such that the boundary between adjacent dielectric layers 111 may be integrated so that it is difficult to identify without using a scanning electron microscope (SEM).

[0032] The dielectric layer 111 may include, for example, a perovskite-type compound represented by ABO3 as a main component. The perovskite-type compound represented by ABO3 may include, for example, those selected from BaTiO3, (Ba , , y , x , y , y , x , x , y , 1-y , 1-y ,

[0031] , 1-x , 1-y , 1-x , 1- ,

[0032] , 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), Ba(Ti 1-y Zr[[ID=​​​​​​​y )One or more selected from the group consisting of O3 (0 < x ≤ 0.5, 0 < y ≤ 0.5).

[0033] The average thickness td of the dielectric layer 111 is not particularly limited. The average thickness td of the dielectric layer 111 can be, for example, 0.1 μm to 20 μm, 0.1 μm to 10 μm, 0.1 μm to 5 μm, 0.1 μm to 2 μm, or 0.1 μm to 0.4 μm.

[0034] The inner electrodes 121 and 122 may include, for example, a first inner electrode 121 and a second inner electrode 122. The first inner electrode 121 and the second inner electrode 122 are alternately arranged in the first direction, and the dielectric layer 111 is interposed therebetween. The first inner electrode 121 and the second inner electrode 122 (a pair of electrodes having different polarities) may be arranged opposite to each other, and the dielectric layer 111 is interposed therebetween.

[0035] The first inner electrode 121 is spaced apart from the fourth surface 4 and may be connected to the first outer electrode 131 on the third surface 3. The second inner electrode 122 is spaced apart from the third surface 3 and may be connected to the second outer electrode 132 on the fourth surface 4.

[0036] The conductive metal included in the inner electrodes 121 and 122 may be one or more selected from the group consisting of Ni, Cu, Pd, Ag, Au, Pt, Sn, W, Ti, and their alloys. More preferably, the inner electrodes 121 and 122 may include Ni, but the present disclosure is not limited thereto.

[0037] The average thickness te of the inner electrodes 121 and 122 is not particularly limited. The average thickness te of the inner electrodes 121 and​​​​​More specifically, the average thickness td of dielectric layer 111 can be measured by calculating the average value after measuring the thickness at multiple points (e.g., five points equally spaced apart in the second direction) of dielectric layer 111. Similarly, the average thickness te of inner electrodes 121 and 122 can be measured by calculating the average value after measuring the thickness at multiple points (e.g., five points equally spaced apart in the second direction) of inner electrodes 121 and 122. The five equally spaced points can be specified in the capacitor forming section Ac.

[0040] Furthermore, when an average value measurement is performed on each of the 10 dielectric layers 111 and the 10 inner electrodes 121 and 122, the average value can then be calculated, and the average thickness td of the dielectric layer 111 and the average thickness te of the inner electrodes 121 and 122 can be further generalized.

[0041] The ceramic body 110 may include a capacitor forming portion Ac and cap portions 112 and 113. A capacitor is formed in the capacitor forming portion Ac by alternately disposed first inner electrodes 121 and second inner electrodes 122 with a dielectric layer 111 interposed therebetween. The cap portions 112 and 113 are disposed on opposing surfaces of the capacitor forming portion Ac in a first direction. The cap portions 112 and 113 do not include inner electrodes and may have a structure similar to that of the dielectric layer 111.

[0042] The average thickness tc of the cover portions 112 and 113 is not specifically limited. The average thickness tc of the cover portions 112 and 113 can be, for example, 150 μm or less, 100 μm or less, 30 μm or less, or 20 μm or less. The average thickness tc of the cover portions 112 and 113 can be, for example, 5 μm or more, 10 μm or more, or 30 μm or more. In this case, the average thickness tc of the cover portions 112 and 113 can refer to the average thickness of each of the first cover portion 112 and the second cover portion 113.

[0043] The average thickness tc of the cover portions 112 and 113 may refer to the average thickness of the cover portions 112 and 113 in the first direction, and may be the average thickness of the ceramic body 110 measured at 5 points that are equally spaced from each other in the cross-sections of the ceramic body 110 in the first and second directions.

[0044] The ceramic body 110 may include edge portions 114 and 115 disposed on opposing surfaces of the capacitor forming portion Ac in a third direction. Edge portions 114 and 115 may refer to regions in the cross-section of the ceramic body 110 in the first and third directions between the ends of the inner electrodes 121 and 122 and the corresponding boundary surfaces of the ceramic body 110. Edge portions 114 and 115 do not include the inner electrodes 121 and 122 and may have a structure similar to that of the dielectric layer 111.

[0045] The average thickness tm of edge portions 114 and 115 is not particularly limited. The average thickness tm of edge portions 114 and 115 can be, for example, 100 μm or less, 20 μm or less, or 15 μm or less. The average thickness tm of edge portions 114 and 115 can also be, for example, 5 μm or more, or 10 μm or more. In this case, the average thickness tm of edge portions 114 and 115 refers to the average thickness of each of the first edge portion 114 and the second edge portion 115.

[0046] The average thickness tm of the edges 114 and 115 may refer to the average thickness of the edges 114 and 115 in the third direction, and may be the average of the thickness in the third direction measured at 5 points that are equally spaced from each other in the cross section of the ceramic body 110 in the first direction and the third direction.

[0047] External electrodes 131 and 132 may be disposed on the ceramic body 110 and connected to the internal electrodes 121 and 122. For example, external electrodes 131 and 132 may be disposed on the third surface 3 and the fourth surface 4 of the ceramic body 110, respectively, and may extend to a portion of the first surface 1, a portion of the second surface 2, a portion of the fifth surface 5, and a portion of the sixth surface 6. External electrodes 131 and 132 may include a first external electrode 131 disposed on the third surface 3 and connected to the first internal electrode 121, and a second external electrode 132 disposed on the fourth surface 4 and connected to the second internal electrode 122.

[0048] External electrodes 131 and 132 may include a connecting portion CP1 disposed on the third surface 3 and a connecting portion CP2 disposed on the fourth surface 4, as well as strip portions BP1 and BP2 extending from the connecting portions CP1 and CP2 to the first surface 1 and the second surface 2. The first external electrode 131 may include a first connecting portion CP1 disposed on the third surface 3 and a first strip portion BP1 extending from the first connecting portion CP1 to the first surface 1 and the second surface 2. The second external electrode 132 may include a second connecting portion CP2 disposed on the fourth surface 4 and a second strip portion BP2 extending from the second connecting portion CP2 to the first surface 1 and the second surface 2. Strip portions BP1 and BP2 may extend from the connecting portions CP1 and CP2 to the fifth surface 5 and the sixth surface 6.

[0049] The type or shape of the outer electrodes 131 and 132 is not specifically limited, and they may have a multilayer structure. For example, the outer electrodes 131 and 132 may include base electrode layers 131a and 132a in contact with the inner electrodes 121 and 122, and plating layers 131b and 132b disposed on the base electrode layers 131a and 132a.

[0050] The base electrode layers 131a and 132a may be sintered electrode layers comprising metal and glass. The metal included in the base electrode layers 131a and 132a may include at least one selected from, for example, the group consisting of Cu, Ni, Pd, Pt, Au, Ag, Pb and alloys thereof. The glass included in the base electrode layers 131a and 132a may include, for example, oxides of one or more elements selected from, for example, the group consisting of Ba, Ca, Zn, Al, B, and Si.

[0051] In addition, the base electrode layers 131a and 132a may be constructed solely of sintered electrode layers, but this disclosure is not limited thereto. Furthermore, the base electrode layers 131a and 132a may include sintered electrode layers and resin electrode layers. The sintered electrode layers include metal and glass, and the resin electrode layers are disposed on the sintered electrode layers and include metal particles and resin.

[0052] The metal particles contained in the resin electrode layer may include at least one selected from the group consisting of spherical particles and plate-like particles. The metal particles contained in the resin electrode layer may include, for example, at least one selected from the group consisting of Cu, Ni, Pd, Pt, Au, Ag, Pb, Sn, and alloys thereof. The resin contained in the resin electrode layer may include, for example, one or more selected from the group consisting of epoxy resin, acrylic resin, and ethyl cellulose.

[0053] Platings 131b and 132b may include at least one selected from the group consisting of Ni, Sn, Pd, and alloys thereof, and may be formed of multiple layers. Platings 131b and 132b may be, for example, Ni platings or Sn platings, and may also be in the form of Ni platings and Sn platings formed sequentially. Platings 131b and 132b may include multiple Ni platings and / or multiple Sn platings.

[0054] Although the accompanying drawings depict a multilayer electronic assembly 1000 with two external electrodes 131 and 132, it is not limited thereto, and the number or shape of the external electrodes 131 and 132 may be changed according to the shape of the internal electrodes 121 and 122 or for other purposes.

[0055] The multilayer electronic assembly 1000 may include an organic layer 140 configured to cover at least a portion of the outer surface of the capacitor 100. For example, the organic layer 140 may be configured to cover at least a portion of the outer surface of the ceramic body 110. The organic layer 140 may be disposed on at least one of, for example, a first surface 1, a second surface 2, a fifth surface 5, and a sixth surface 6. The organic layer 140 may be disposed continuously on, for example, the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6.

[0056] In this embodiment, the organic layer 140 may be configured to directly contact the outer surface of the ceramic body 110. The organic layer 140 may be configured to directly contact at least one of the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6. The first organic layer 140 may be configured to directly contact the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6, respectively.

[0057] The organic layer 140 may be configured to cover only a portion of the outer surface of the ceramic body 110, but to more effectively improve the moisture resistance reliability of the multilayer electronic assembly 1000, the organic layer 140 may be configured to completely cover the area of ​​the outer surface of the ceramic body 110 not covered by the external electrodes 131 and 132. In this case, the area of ​​the outer surface of the ceramic body 110 not covered by the external electrodes 131 and 132 may refer to, for example, the area of ​​the ceramic body 110 exposed to the outside between the first strip BP1 and the second strip BP2.

[0058] Furthermore, this disclosure only shows a structure in which the organic layer 140 is configured to cover the outer surface of the ceramic body 110, but the disclosure is not limited thereto. For example, the organic layer 140 may be configured to cover at least a portion of the outer surfaces of the external electrodes 131 and 132. Additionally, the organic layer 140 may be configured to cover at least a portion of the outer surface of the ceramic body 110 and at least a portion of the outer surfaces of the external electrodes 131 and 132, respectively. Furthermore, the organic layer 140 may be configured to completely cover the outer surface of the capacitor 100. Additionally, the organic layer 140 may be disposed on the outer surface of the capacitor 100 in an island-like configuration. Furthermore, the organic layer 140 may include a first organic layer and a second organic layer, the first organic layer being configured to cover at least a portion of the outer surface of the ceramic body 110, and the second organic layer being configured to cover at least a portion of the external electrodes 131 and 132. Additionally, the organic layer 140 may have a multilayer structure constructed from multiple layers.

[0059] The organic layer 140 may include a crosslinked polymer. In this disclosure, the term "crosslinked polymer" may refer to a polymer comprising a structure in which specific repeating units are crosslinked. The crosslinked polymer may include at least one selected from, for example, the group consisting of polyacetylene polymers and polystyrene polymers. However, this disclosure is not limited thereto, and the crosslinked polymer may include one or more selected from the group consisting of polyacetylene polymers, polystyrene polymers, silyl crosslinked polymers, and borate-based crosslinked polymers.

[0060] The crosslinked polymer may have one or more functional groups selected from the group consisting of silyl groups, phosphate groups, thiol groups, carboxyl groups, and isocyanate groups. By including the above functional groups, the organic layer 140 can be stably formed on the outer surface of the capacitor 100, thereby improving the thermal and chemical stability of the organic layer 140.

[0061] Specifically, the aforementioned functional groups may be present at the ends of the cross-linked polymer near the capacitor 100. In this case, the aforementioned functional groups may be chemically bonded to the outer surface of the capacitor 100. The chemical bond between the aforementioned functional groups and the outer surface of the capacitor 100 may be, for example, a covalent bond. That is, the organic layer 140 may be chemically adsorbed onto the outer surface of the capacitor 100.

[0062] To ensure the thermal and chemical stability of the organic layer 140, the aforementioned functional groups of the crosslinked polymer can be appropriately determined considering the main components of the outer surface of the capacitor 100 on which the organic layer 140 is disposed. For example, the main component constituting the outer surface of the ceramic body 110 can be ceramic, and the main component constituting the outer surfaces of the external electrodes 131 and 132 can be metal. When the organic layer 140 is configured to cover the outer surface of the ceramic body 110, the functional groups may include at least one selected from the group consisting of silane groups and phosphate groups. The bonding strength of silane groups and phosphate groups with ceramics may be stronger than their bonding strength with metals. Additionally, when the organic layer 140 is configured to cover the outer surfaces of the external electrodes 131 and 132, the functional groups may include thiol groups. The bonding strength of thiol groups with metals is stronger than their bonding strength with ceramics.

[0063] The crosslinked polymer may include, for example, repeating units derived from the self-assembled monolayer material 14. Repeating units derived from the self-assembled monolayer material 14 may refer to repeating units having a structure obtained by polymerizing the self-assembled monolayer material 14. More specifically, the crosslinked polymer included in the organic layer 140 may be formed via crosslinking bonds CS between the self-assembled monolayer materials 14.

[0064] The self-assembled monolayer material 14 can refer to a molecular structure that spontaneously aligns and forms a self-assembled monolayer on the surface of the capacitor 100. The self-assembled monolayer material 14 may include a head 14a and a link portion 14b connected to the head 14a. The link portion 14b may include a tail portion 14c disposed at the end of the link portion 14b.

[0065] The head 14a may include one or more selected from the group consisting of silyl, phosphate, thiol, carboxyl, and isocyanate groups. In this case, the head 14a may be chemically bonded to the surface of the capacitor 100. The head 14a may correspond to the functional group FG of the crosslinked polymer.

[0066] The linking portion 14b serves to align each self-assembled monolayer material 14 and is hydrophobic, thereby providing hydrophobic properties. The linking portion 14b may have at least one carbon-carbon double bond to form crosslinking bonds CS between the self-assembled monolayer materials 14. The type of linking portion 14b is not particularly limited and may include, for example, at least one selected from the group consisting of aliphatic compounds having at least one carbon-carbon double bond and containing five or more carbon atoms, and aromatic compounds having at least one carbon-carbon double bond.

[0067] The tail portion 14c may have, for example, a hydrophobic functional group to improve the moisture resistance reliability of the multilayer electronic component 1000. The tail portion 14c may include, for example, one or more selected from the group consisting of substituted or unsubstituted C2 to C10 olefinic groups, substituted or unsubstituted phenyl groups, halogen groups F, Cl, Br and I, and nitro groups.

[0068] In other words, the organic layer 140 can be a cross-linked self-assembled monolayer. In this case, the thermal and chemical stability of the organic layer 140 can be improved more effectively.

[0069] For example, such as Figure 6A As shown, the self-assembled monolayer material can be a diacetylene compound. The cross-linked polymer formed by cross-linking bonds between the diacetylene-based self-assembled monolayer materials can include polyacetylene polymers. The organic layer 140 can include a polyacetylene polymer having one or more functional groups FG selected from the group consisting of silyl, phosphate, thiol, carboxyl, and isocyanate groups.

[0070] For example, such as Figure 6B As shown, the self-assembled monolayer material can be a styrene-based compound. The cross-linked polymer formed by the cross-linking bonds between the styrene-based self-assembled monolayer materials can include polystyrene-based polymers. The organic layer 140 can include a polystyrene-based polymer having one or more functional groups FG selected from the group consisting of silyl, phosphate, thiol, carboxyl, and isocyanate groups.

[0071] For example, such as Figure 6C As shown, the self-assembled monolayer material can be a silane compound. The cross-linked polymer formed by cross-linking bonds between the silane self-assembled monolayer materials can include a silane cross-linked polymer. Organic layer 140 can include a silane cross-linked polymer having a thiol group as a functional group FG. Organic layer 140 can include, for example, a silanethiol.

[0072] For example, such as Figure 6D As shown, the self-assembled monolayer material can be a borate-based compound. Crosslinked polymers formed through crosslinking bonds between borate-based self-assembled monolayer materials can include borate-based crosslinked polymers. Organic layer 140 can include a borate-based crosslinked polymer having a thiol group as a functional group FG. Organic layer 140 can include, for example, borate-based alkylthiols.

[0073] In addition, the presence, type, and properties of the organic materials included in the organic layer 140 can be determined using methods such as infrared absorption spectroscopy, ultraviolet / visible absorption spectroscopy, and mass spectrometry (MS). 1 The measurements can be performed using techniques such as nuclear magnetic resonance (NMR) spectroscopy, but are not limited to these, and can be performed using general analytical methods widely used in the art.

[0074] In the following, an example of a method for forming a multilayer electronic component 1000 will be described. However, the manufacturing method of the multilayer electronic component is not limited thereto.

[0075] First, ceramic powder for forming the dielectric layer 111 is prepared. The ceramic powder may include, for example, one or more selected from the group consisting of BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), Ba(Ti 1-y Zr y )O3 (0 < y < 1), CaZrO3, and (Ca 1-x Sr x )(Zr 1-y Ti y )O3 (0 < x ≤ 0.5, 0 < y ≤ 0.5). The method for synthesizing the ceramic powder BaTiO3 may include, for example, a solid-phase method, a sol-gel method, a hydrothermal synthesis method, etc., but the present disclosure is not limited thereto. Then, the prepared ceramic powder is dried and ground, and then an organic solvent such as ethanol and a binder such as polyvinyl butyral are mixed to prepare a ceramic slurry, and then the ceramic slurry is coated on a carrier film and dried to prepare a ceramic green sheet.

[0076] Next, a conductive paste for an internal electrode containing metal powder, binder, organic solvent, etc. is printed onto the ceramic green sheet to a predetermined thickness using a screen printing method or a gravure printing method, thereby forming an internal electrode pattern.

[0077] Thereafter, the ceramic green sheet printed with the internal electrode pattern is peeled off from the carrier film, and then the ceramic green sheets printed with the internal electrode pattern are stacked and pressed in a predetermined number of layers to form a ceramic multi-layer body. On the upper and lower portions of the ceramic multi-layer body, ceramic green sheets having a predetermined number of layers without an internal electrode pattern formed thereon may be stacked to form cover portions 112 and 113 after sintering. Thereafter, the ceramic multi-layer body may be cut into pieces having a predetermined size, and the cut pieces may be sintered at a temperature of greater than or equal to 1000 °C and less than or equal to 1400 °C to form a ceramic body 110.

[0078] Alternatively, edges 114 and 115 can be formed by coating and sintering a conductive paste for the internal electrodes onto the ceramic green sheet, excluding the area where the edges will form. Alternatively, to suppress steps caused by the internal electrodes 121 and 122, a ceramic multilayer can be cut such that the internal electrode pattern is exposed on both third-direction surfaces of the cut sheet. The sheet for forming the edges can then be attached to both third-direction surfaces of the cut sheet and sintered to form edges 114 and 115.

[0079] Next, external electrodes 131 and 132 can be formed. For example, when the base electrode layers 131a and 132a include sintered electrode layers, the ceramic body 110 can be immersed in an external electrode conductive paste comprising metal powder, glass frit, binder and organic solvent, and then the external electrode conductive paste can be sintered at a temperature of 500°C to 900°C to form sintered electrode layers.

[0080] For example, when the base electrode layers 131a and 132a include resin electrode layers, the ceramic body may be immersed in a conductive resin composition including metal powder, resin, binder and organic solvent, and then cured and heat-treated at a temperature of 250°C to 550°C to form resin electrode layers.

[0081] Furthermore, electroplating and / or electroless plating methods can be performed to form plating layers 131b and 132b on the base electrode layers 131a and 132a.

[0082] Next, the self-assembled monolayer material 14 can be coated onto the capacitor 100 using a liquid phase deposition method or a vapor phase deposition method. The heads 14a of the self-assembled monolayer material 14 can be chemically bonded to the surface of the capacitor 100, thereby forming a self-assembled monolayer on the outer surface of the capacitor 100.

[0083] The self-assembled monolayer material 14 may, for example, contain one or more acetylene, styrene, silyl, and / or borate compounds selected from the group consisting of silyl, phosphate, thiol, carboxyl, and isocyanate groups as the head 14a.

[0084] Next, the organic layer 140 can be formed by crosslinking the self-assembled monolayer material 14 that forms the self-assembled monolayer to form a crosslinked polymer. Polymerization via crosslinking bonds can be initiated by photopolymerization via UV and / or free radical polymerization, but this disclosure is not limited thereto. The crosslinked polymer can be self-crosslinked, but this disclosure is not limited thereto.

[0085] Directly coating the polymer onto the capacitor 100 may require precise control and complex equipment / facilities. According to this disclosure, the self-assembled monolayer material 14 can be coated onto the capacitor 100 in a relatively simple manner. A simple monolayer may have minimal effect on improving the moisture resistance reliability of the multilayer electronic component 1000, but the moisture resistance reliability of the multilayer electronic component 1000 can be effectively improved by forming a crosslinked polymer with excellent water resistance via crosslinking bonds of monomolecules forming the monolayer.

[0086] This disclosure is not limited to the above embodiments and drawings, but is defined by the appended claims. Therefore, those skilled in the art can make various substitutions, modifications, or variations without departing from the scope of this disclosure as defined by the appended claims, and such substitutions, modifications, or variations should be construed as being included within the scope of this disclosure.

[0087] Furthermore, the term "example embodiment" does not imply the same embodiment, but is provided to emphasize and explain different unique features. However, the embodiments presented above do not preclude implementation in combination with features of another embodiment. For example, unless there is a description contrary to or contradictory to the item in another embodiment, an item described in a particular embodiment may be understood as a description related to the other embodiment, even if it is not described in another embodiment.

[0088] In this disclosure, the term "connection" includes not only direct connections but also indirect connections such as those via adhesive layers. Additionally, the term "electrical connection" includes both physical connections and non-physical connections. Furthermore, the terms "first," "second," etc., are used to distinguish one element from another and do not limit the order and / or importance associated with the elements. In some cases, without departing from the scope of the exemplary embodiments, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element.

[0089] While embodiments have been described and illustrated above, it will be readily understood by those skilled in the art that modifications and variations may be made without departing from the scope of this disclosure as defined by the appended claims.

Claims

1. A multilayer electronic component, comprising: A capacitor includes a ceramic body and an outer electrode, the ceramic body comprising alternating dielectric layers and inner electrodes with the dielectric layers intermediate between the inner electrodes, and the outer electrode disposed on the ceramic body and connected to the inner electrodes; and An organic layer, configured to cover at least a portion of the outer surface of the capacitor, the organic layer comprising a crosslinked polymer, the crosslinked polymer comprising at least one selected from the group consisting of polyacetylene polymers and polystyrene polymers. The crosslinked polymer includes functional groups, which include one or more selected from the group consisting of silyl groups, phosphate groups, thiol groups, carboxyl groups and isocyanate groups.

2. The multilayer electronic component according to claim 1, wherein, The crosslinked polymer comprises repeating units derived from self-assembled monolayer materials.

3. The multilayer electronic component according to claim 2, wherein, The self-assembling monolayer material includes a head and a connecting portion connected to the head. The head includes the functional groups. The linking portion includes at least one carbon-carbon double bond.

4. The multilayer electronic component according to claim 1, wherein, The organic layer comprises a cross-linked self-assembled monolayer.

5. The multilayer electronic component according to claim 1, wherein, The functional group is chemically bonded to the outer surface of the capacitor.

6. The multilayer electronic assembly according to claim 1, wherein, The organic layer is configured to be in direct contact with the outer surface of the capacitor.

7. The multilayer electronic assembly according to claim 1, wherein, The organic layer is configured to cover at least a portion of the outer surface of the ceramic body.

8. The multilayer electronic component according to claim 1, wherein, The organic layer is configured to completely cover the area of ​​the outer surface of the ceramic body that is not covered by the outer electrode.

9. The multilayer electronic assembly according to claim 7, wherein, The functional group includes at least one selected from the group consisting of silyl groups and phosphate groups.

10. A multilayer electronic component, comprising: A capacitor includes a ceramic body and an outer electrode, the ceramic body comprising alternating dielectric layers and inner electrodes with the dielectric layers intermediate between the inner electrodes, and the outer electrode disposed on the ceramic body and connected to the inner electrodes; and An organic layer, configured to cover at least a portion of the outer surface of the capacitor, the organic layer comprising a cross-linked polymer, The crosslinked polymer comprises repeating units derived from a self-assembled monolayer material. The self-assembly monolayer material includes a head and a connecting portion connected to the head. The head comprises one or more selected from the group consisting of silyl, phosphate, thiol, carboxyl and isocyanate groups, and the link portion has at least one carbon-carbon double bond.

11. The multilayer electronic assembly according to claim 10, wherein, The organic layer is configured to cover at least a portion of the outer surface of the ceramic body.

12. The multilayer electronic assembly according to claim 10, wherein, The organic layer is configured to completely cover the area of ​​the outer surface of the ceramic body that is not covered by the outer electrode.

13. The multilayer electronic assembly according to claim 11, wherein, The head includes at least one selected from the group consisting of silyl groups and phosphate groups.

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