Semiconductor SMD component testing and sorting integrated device

Abstract

This invention provides an integrated testing and sorting device for semiconductor SMD components, relating to the field of semiconductor technology. It includes a support mechanism with a working top plate fixedly mounted on its top. The invention allows for real-time monitoring of the operating status and setting of sorting parameters via an operation display screen. A PLC controller precisely coordinates the start-stop sequence and air path switching of the table mounting mechanism, sorting turntable mechanism, and vibrating feeding mechanism according to preset logic. This design not only provides the equipment with excellent mobility and overall structural rigidity but also effectively eliminates interference between workstations through a central control system, significantly improving the stability, automation level, and overall operating efficiency of the semiconductor SMD component testing and sorting operation.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and in particular to an integrated testing and sorting device for semiconductor SMD components. Background Technology

[0002] In the back-end processes of semiconductor packaging and testing, electrical performance testing and finished product sorting of semiconductor SMD components are core steps to ensure product yield and consistency, directly determining the quality and market competitiveness of semiconductor products. As electronic components develop towards miniaturization, high density, and multi-pin designs, especially with the continuous reduction in microbump pitch, modern packaging and testing production lines place more stringent demands on the automation integration, cycle time, and positioning accuracy of testing and sorting equipment.

[0003] Currently, the industry widely adopts integrated testing and sorting equipment that integrates modules such as vibration feeding, precision testing, and finished product sorting. Through a PLC control system, the timing of each pneumatic actuator is coordinated, achieving fully automated operation of components throughout the entire process, replacing traditional manual sampling or semi-automatic separate operations, and meeting the needs of large-scale continuous production. However, existing equipment has many shortcomings in actual production line applications: the table components are rigidly bolted, lacking horizontal fine-tuning and quick-release design, easily causing flatness deviations and cumbersome adjustment during model changes; the turntable indexing relies solely on electrical control, lacking mechanical hard limits and flexible buffers, resulting in large cumulative indexing errors; the test probes are prone to rigid impacts upon contact, leading to probe wear or pad damage; the sorting station's diversion logic is rigid, easily causing jamming and material mixing; the feeding slide rail is fixed at the end, unable to be finely adjusted, and lacks photoelectric linkage feedback, making it difficult to synchronize the feeding and picking cycles, easily leading to accumulation and deviation.

[0004] These problems severely restrict the continuous operation efficiency and sorting yield of the entire machine, making it unable to adapt to the development trend of miniaturization and high density of SMD components. Therefore, developing an integrated semiconductor SMD component testing and sorting equipment that can solve the above-mentioned defects and take into account the convenience of debugging, positioning accuracy, operation stability and cycle synchronization has become an urgent technical problem to be solved in the current semiconductor packaging and testing equipment field. Summary of the Invention

[0005] The purpose of this invention is to overcome the shortcomings of the prior art.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: including a support mechanism, wherein a working top plate is fixedly installed on the top of the support mechanism;

[0007] A tabletop mounting mechanism is fixedly installed on the top surface of the working top plate;

[0008] The sorting turntable mechanism is coaxially disposed in the middle of the table mounting mechanism and rotatably connected to the table mounting mechanism.

[0009] A vibrating feeding mechanism is provided on one side of the working top plate, with the discharge end facing the feeding station of the sorting turntable mechanism;

[0010] The table mounting mechanism is equipped with a material gripper, a test probe arm and a sorting robot arm. The sorting turntable mechanism is equipped with a positioning station for receiving semiconductor SMD components and a test probe holder. The vibration feeding mechanism is used to directionally transport the components under test to the sorting turntable mechanism.

[0011] In a preferred embodiment, the support mechanism includes a cabinet side panel with a rectangular frame structure. The four corners of the cabinet side panel are locked and fixed to the working top plate and the bottom crossbeam at the bottom via frame corner brackets. The bottom crossbeam is rotatably mounted with casters at the four corners of its bottom surface. A control host box is embedded in the center of the front side of the cabinet side panel. The top of the control host box extends out of the cabinet via a bracket and is fixedly mounted with an operation display screen. The control host box is electrically connected to the operation display screen, and the control host box integrates a PLC controller and a pneumatic control valve group for coordinating and controlling the timing and data feedback of the actions of the table mounting mechanism, the sorting turntable mechanism, and the vibrating feeding mechanism.

[0012] In a preferred embodiment, the tabletop mounting mechanism includes a mounting base plate flatly laid on the top surface of the working top plate. The outer edges of the mounting base plate are covered with edge guards. The mounting base plate and the edge guards are locked together by a plurality of circumferentially distributed mounting adjustment pins. A material-picking horizontal slide is fixedly mounted in the center of the top surface of the mounting base plate. The moving end of the material-picking horizontal slide is connected to the drive cylinder of the material-picking gripper via a connecting flange. A test probe arm and a sorting robotic arm are also fixedly mounted on the top surface of the mounting base plate. The output end of the test probe arm points vertically to the test station of the sorting turntable mechanism, and the output end of the sorting robotic arm covers the sorting discharge station of the sorting turntable mechanism.

[0013] In a preferred embodiment, the sorting turntable mechanism includes a coaxially stacked turntable adjustment plate and a turntable top cover. The top surface of the turntable top cover has several component receiving slots arranged in a circular array. The turntable adjustment plate and the turntable top cover are slidably connected by multiple lifting guide columns. The bottom of the lifting guide columns passes through the turntable adjustment plate and is fixedly connected to the test probe seat. The bottom of the sorting turntable mechanism is provided with an upper fixing plate and a lower sorting plate. The upper fixing plate is fixed to the working top plate, and the lower sorting plate is rotatably mounted on the bottom surface of the upper fixing plate. The bottom surface of the lower sorting plate is provided with a material discharge through hole corresponding to the component receiving slot.

[0014] In a preferred embodiment, the vibrating feeding mechanism includes a feeding base fixed to the side of the working top plate. A vibrating cylinder is fixed to the top surface of the feeding base by a shock-absorbing pad. A protective cover is detachably fitted to the top of the vibrating cylinder. The inner wall of the vibrating cylinder is provided with a spirally rising feeding track. A feeding slide rail extends horizontally from the outlet of the vibrating cylinder. An outlet adjustment component is mounted at the end of the feeding slide rail. The outlet adjustment component controls the height and horizontal position of the end of the feeding slide rail through a fine-tuning screw to achieve seamless docking with the feeding station of the sorting turntable mechanism.

[0015] In a preferred embodiment, an air source processor is also fixedly installed on one side of the top surface of the mounting base. The air inlet of the air source processor is connected to the air source interface in the control host box via an air pipe. The air outlet of the air source processor is connected in parallel to the drive cylinder of the material handling gripper, the pressing cylinder of the test probe arm, and the gripping cylinder of the sorting robot arm via three independent pneumatic pipelines. The air source processor integrates a precision pressure reducing valve, an oil mist lubricator, and a filter to provide stable and clean compressed air to each actuator cylinder. The pressing stroke of the test probe arm and the rising stroke of the test probe seat are synchronously controlled in a closed loop through sensor signals in the control host box.

[0016] In a preferred embodiment, a positioning gear ring is coaxially fixed to the bottom surface of the upper fixing plate. The outer teeth of the positioning gear ring mesh with the drive gear of an external stepper motor to drive the lower sorting disk and the turntable top cover to perform step-by-step indexing rotation. A spring return pin is sleeved on the outer side of the lifting guide column. The top end of the spring return pin abuts against the bottom surface of the turntable adjusting plate, and the bottom end abuts against the top surface of the upper fixing plate. A limit pin is radially passed through the side of the lower sorting disk. The limit pin slides with the positioning hole on the upper fixing plate to provide mechanical hard limit when the indexing rotation is in place. The spring return pin is used to buffer the instantaneous impact load when the test probe contacts the element to prevent hard collision damage between the precision probe and the semiconductor pad.

[0017] In a preferred embodiment, the mounting adjustment pin is an eccentric adjustment structure. Its threaded section passes through a pre-drilled hole on the edge of the mounting base plate and engages with a threaded blind hole on the inner side of the edge guard plate. The head of the mounting adjustment pin has an internal hexagonal groove. By rotating the mounting adjustment pin, the flatness and levelness of the mounting base plate relative to the working top plate can be finely adjusted. The connecting flange adopts a quick-release dovetail groove structure and slides into contact with the moving end of the material-picking horizontal slide. Locking bolts are provided on the side of the connecting flange. The base of the material-picking gripper achieves quick disassembly and position calibration in the XY axis direction through the connecting flange, facilitating the adaptation to semiconductor SMD components with different packaging specifications.

[0018] In a preferred embodiment, the discharge adjustment assembly includes an L-shaped adjustment bracket fixed to the side of the feeding base and a miniature linear module mounted thereon. The end of the feeding slide rail is fixed to the slider of the miniature linear module. A manual adjustment knob is connected to the end of the lead screw of the miniature linear module. The rotation of the manual adjustment knob causes the feeding slide rail to be finely adjusted in a direction perpendicular to the radial direction of the sorting turntable mechanism. A photoelectric sensor is provided at the end of the feeding slide rail. When the semiconductor SMD element slides to the end stop, a signal is triggered. After receiving the signal, the control host box controls the sorting turntable mechanism to pause feeding and start the picking claw to accurately grasp the material, ensuring orderly feeding in a single row.

[0019] In a preferred embodiment, the bottom surface of the lower sorting disc is divided into a qualified test area, a defective test area, and a test area along the circumference, with each area having a corresponding material discharge hole. The end of the sorting robotic arm is equipped with a dual-station suction cup. When the sorting turntable mechanism rotates to the sorting station, the test probe base controls the lifting guide column of the corresponding station to rise and fall according to the test signal. The qualified product station descends and opens the material discharge hole, while the defective product station remains closed. The sorting robotic arm moves synchronously, transferring qualified products to the qualified collection box and defective products to the defective collection box. The continuous feeding of the vibrating feeding mechanism, the stepping rotation test of the sorting turntable mechanism, and the material picking and sorting actions of the table mounting mechanism are all achieved through a preset program in the control host box to realize fully automated assembly line operation.

[0020] Compared with the prior art, the advantages and positive effects of the present invention are as follows:

[0021] 1. This invention allows for real-time monitoring of the operating status and setting of sorting parameters via an operation display screen. The PLC controller precisely coordinates the start-stop sequence and air path switching of the table mounting mechanism, sorting turntable mechanism, and vibrating feeding mechanism according to preset logic. This design not only provides the equipment with excellent mobility and overall structural rigidity but also effectively eliminates interference between workstations through a central control system, significantly improving the stability, automation level, and overall operating efficiency of semiconductor SMD component testing and sorting operations.

[0022] 2. This invention utilizes the eccentric fine-tuning function of the mounting adjustment pin and the quick-release connecting flange structure to achieve high-precision horizontal calibration of the mounting base plate and rapid replacement and adaptation of the material handling gripper. The air source processor provides each actuator with clean compressed air that has been filtered, depressurized, and lubricated, and works in conjunction with sensor signals to achieve closed-loop synchronous control of the test probe arm pressing down and the probe seat rising.

[0023] 3. This invention relies on the positioning gear ring and external stepper motor drive to achieve high-precision indexing rotation, and combines the elastic buffer of the spring reset column and the mechanical hard limit function of the limit pin to complete the precise stopping of the turntable station and the flexible protection of probe contact. The turntable top cover drives the components to pass through the test, testing and sorting areas in sequence. The test probe seat controls the lifting guide column of the corresponding station according to the electrical test results. The qualified product station descends to open the discharge hole, and the dual-station suction cup of the sorting robot arm realizes automatic diversion and collection.

[0024] 4. This invention achieves automatic orientation and arrangement of randomly arranged components through the spiral track of the vibrating cylinder, and uses a miniature linear module in the discharge adjustment assembly and a manual adjustment knob to fine-tune the end position of the feeding slide rail in multiple dimensions. Combined with real-time trigger feedback from the end photoelectric sensor, the control unit can precisely control the gripping timing of the picking claws and the feed rhythm of the turntable. Attached Figure Description

[0025] Figure 1 This invention provides an overall perspective view of a semiconductor SMD component testing and sorting integrated device;

[0026] Figure 2 This invention presents an overall perspective view of a semiconductor SMD component testing and sorting integrated device (showing the side panel of the display cabinet).

[0027] Figure 3 An exploded perspective view of the support cabinet of an integrated testing and sorting device for semiconductor SMD components is provided for this invention.

[0028] Figure 4 This invention provides an exploded perspective view of the table mounting assembly and the material feeding and sorting mechanism of an integrated semiconductor SMD component testing and sorting device;

[0029] Figure 5This invention provides a partial disassembly perspective view of the platform mounting assembly of an integrated semiconductor SMD component testing and sorting device;

[0030] Figure 6 This invention provides a partially enlarged perspective view of the sorting turntable mechanism of an integrated semiconductor SMD component testing and sorting device;

[0031] Figure 7 An exploded perspective view of the sorting turntable mechanism of an integrated semiconductor SMD component testing and sorting device is provided in this invention.

[0032] Figure 8 An exploded perspective view of the vibration feeding mechanism of an integrated testing and sorting device for semiconductor SMD components is presented in this invention.

[0033] Legend:

[0034] 1. Supporting mechanism; 11. Cabinet side panel; 12. Frame corner bracket; 13. Working top plate; 14. Bottom crossbeam; 15. Casters; 16. Control unit box; 17. Operation display screen;

[0035] 2. Tabletop mounting mechanism; 21. Mounting base plate; 22. Edge guard plate; 23. Mounting adjustment pin; 24. Material handling horizontal slide; 25. Connecting flange; 26. Material handling gripper; 27. Air source processor; 28. Test probe arm; 29. ​​Sorting robotic arm;

[0036] 3. Sorting turntable mechanism; 31. Turntable adjusting plate; 32. Turntable top cover; 33. Lifting guide column; 34. Test probe holder; 35. Upper fixing plate; 36. Lower sorting disc; 37. Positioning toothed ring; 38. Limit pin; 39. Spring return column;

[0037] 4. Vibrating feeding mechanism; 41. Feeding base; 42. Protective cover plate; 43. Vibrating cylinder; 44. Discharge adjustment component; 45. Feeding slide rail. Detailed Implementation

[0038] To make the technical problems, technical solutions, and beneficial effects of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the described embodiments are only a part of the embodiments of this application, not all of them. The specific embodiments described herein are only used to explain the invention and are not intended to limit the invention. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0039] It should be further noted that the accompanying drawings and embodiments of the present invention mainly describe the concept of the present invention. Based on this concept, some specific forms and arrangements of connection relationships, positional relationships, power mechanisms, power supply systems, hydraulic systems and control systems may not be fully described. However, under the premise that those skilled in the art understand the concept of the present invention, they can implement the above-mentioned specific forms and arrangements in a well-known manner.

[0040] When a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0041] The directional terms "inner" and "outer" refer to the inner and outer contours of each component itself. The terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention.

[0042] For ease of description, spatial relative terms such as "above," "over," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "above" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways, and the spatial relative descriptions used herein will be interpreted accordingly.

[0043] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, and "several" means one or more, unless otherwise explicitly specified.

[0044] The present invention will now describe an integrated testing and sorting device for semiconductor SMD components.

[0045] Example 1

[0046] like Figure 1-8 As shown, the present invention provides a technical solution: a semiconductor SMD component testing and sorting integrated device, comprising: a support mechanism 1, wherein a working top plate 13 is fixedly installed on the top of the support mechanism 1;

[0047] The tabletop mounting mechanism 2 is fixedly installed on the top surface of the working top plate 13;

[0048] The sorting turntable mechanism 3 is coaxially arranged in the middle of the table mounting mechanism 2 and is rotatably connected to the table mounting mechanism 2.

[0049] Vibrating feeding mechanism 4 is located on one side of the working top plate 13, with the discharge end facing the feeding station of the sorting turntable mechanism 3.

[0050] The table mounting mechanism 2 is equipped with a material gripper 26, a test probe arm 28 and a sorting robot arm 29. The sorting turntable mechanism 3 is equipped with a positioning station for receiving semiconductor SMD components and a test probe holder 34. The vibration feeding mechanism 4 is used to directionally transport the components to be tested to the sorting turntable mechanism 3.

[0051] The support mechanism 1 includes a cabinet side panel 11 with a rectangular frame structure. The four corners of the cabinet side panel 11 are locked and fixed to the working top plate 13 and the bottom crossbeam 14 at the bottom through frame corner brackets 12. The bottom crossbeam 14 is rotatably installed with casters 15 at the four corners of the bottom surface. The control host box 16 is embedded in the middle of the front side of the cabinet side panel 11. The top of the control host box 16 extends out of the cabinet through a bracket and is fixedly installed with an operation display screen 17. The control host box 16 is electrically connected to the operation display screen 17. The control host box 16 integrates a PLC controller and a pneumatic control valve group to coordinate and control the action sequence and data feedback of the table mounting mechanism 2, the sorting turntable mechanism 3 and the vibrating feeding mechanism 4.

[0052] In this embodiment, the equipment utilizes a rectangular frame structure provided by the support mechanism 1, coupled with casters 15, and integrates a PLC controller and pneumatic valve assembly within the control unit 16 to achieve centralized control and intelligent scheduling of all machine operation modules. During actual use, operators can monitor the operating status in real time and set sorting parameters via the operation display screen 17. The PLC controller precisely coordinates the start / stop sequence and pneumatic path switching of the table mounting mechanism 2, the sorting turntable mechanism 3, and the vibrating feeding mechanism 4 according to preset logic. This design not only provides the equipment with excellent mobility and overall structural rigidity but also effectively eliminates interference between workstations through the central control system, significantly improving the stability, automation level, and overall operating efficiency of semiconductor SMD component testing and sorting operations.

[0053] Example 2

[0054] like Figure 1-6 As shown, the tabletop mounting mechanism 2 includes a mounting base plate 21 flatly laid on the top surface of the working top plate 13. The outer edge of the mounting base plate 21 is covered with an edge guard plate 22. The mounting base plate 21 and the edge guard plate 22 are locked together by a number of circumferentially distributed mounting adjustment pins 23. A material picking horizontal slide 24 is fixedly installed in the middle of the top surface of the mounting base plate 21. The moving end of the material picking horizontal slide 24 is connected to the drive cylinder of the material picking claw 26 through a connecting flange 25. A test probe arm 28 and a sorting robot arm 29 are also fixedly mounted on the top surface of the mounting base plate 21. The output end of the test probe arm 28 points vertically to the test station of the sorting turntable mechanism 3, and the output end of the sorting robot arm 29 covers the sorting and discharge station of the sorting turntable mechanism 3.

[0055] An air source processor 27 is also fixedly installed on one side of the top surface of the mounting base plate 21. The air inlet of the air source processor 27 is connected to the air source interface in the control host box 16 through an air pipe. The air outlet of the air source processor 27 is connected in parallel to the drive cylinder of the material gripper 26, the pressing cylinder of the test probe arm 28, and the gripping cylinder of the sorting robot arm 29 through three independent pneumatic pipelines. The air source processor 27 integrates a precision pressure reducing valve, an oil mist lubricator, and a filter to provide stable and clean compressed air for each actuator cylinder. The pressing stroke of the test probe arm 28 and the rising stroke of the test probe seat 34 are controlled synchronously in a closed loop through the sensor signals in the control host box 16.

[0056] The mounting adjustment pin 23 is an eccentric adjustment structure. Its threaded section passes through the pre-drilled hole on the edge of the mounting base plate 21 and engages with the threaded blind hole on the inner side of the edge guard plate 22. The head of the mounting adjustment pin 23 is provided with an internal hexagonal groove. By rotating the mounting adjustment pin 23, the flatness and levelness of the mounting base plate 21 relative to the working top plate 13 can be finely adjusted. The connecting flange 25 adopts a quick-release dovetail groove structure and slides and engages with the moving end of the material picking horizontal slide table 24. The side of the connecting flange 25 is provided with locking bolts. The base of the material picking claw 26 can be quickly disassembled and positioned in the XY axis direction through the connecting flange 25, which is convenient for adapting to semiconductor SMD components with different package specifications.

[0057] In this embodiment, the platform mounting mechanism 2 utilizes the eccentric fine-tuning function of the mounting adjustment pin 23 and the quick-release connecting flange 25 structure to achieve high-precision level calibration of the mounting base plate 21 and rapid adaptation of the material handling gripper 26. Simultaneously, the air source processor 27 provides filtered, depressurized, and lubricated clean compressed air to each actuator cylinder, coordinating with sensor signals to achieve closed-loop synchronous control of the downward pressure of the test probe arm 28 and the upward movement of the probe seat 34. In practical applications, this structure effectively overcomes flatness deviations caused by long-term equipment operation, significantly shortening the debugging and line changeover time when replacing semiconductor SMD components with different package specifications. Stable air supply and precise stroke synchronization control further ensure the repeatability and positioning accuracy of material handling and testing actions, reducing equipment maintenance costs and improving mass production yield.

[0058] Example 3

[0059] like Figure 1-7 As shown, the sorting turntable mechanism 3 includes a turntable adjustment plate 31 and a turntable top cover 32 stacked coaxially. The top surface of the turntable top cover 32 is provided with a plurality of component receiving slots arranged in a ring array. The turntable adjustment plate 31 and the turntable top cover 32 are slidably connected by a plurality of lifting guide columns 33. The bottom of the lifting guide columns 33 passes through the turntable adjustment plate 31 and is fixedly connected to the test probe seat 34. The bottom of the sorting turntable mechanism 3 is provided with an upper fixing plate 35 and a lower sorting plate 36. The upper fixing plate 35 is fixed on the working top plate 13, and the lower sorting plate 36 is rotatably installed on the bottom surface of the upper fixing plate 35. The bottom surface of the lower sorting plate 36 is provided with a material discharge through hole corresponding to the component receiving slot.

[0060] A positioning gear ring 37 is coaxially fixed to the bottom surface of the upper fixed plate 35. The outer teeth of the positioning gear ring 37 mesh with the drive gear of the external stepper motor to drive the lower sorting disk 36 and the turntable top cover 32 to perform step-by-step indexing rotation. A spring return column 39 is sleeved on the outer side of the lifting guide column 33. The top end of the spring return column 39 abuts against the bottom surface of the turntable adjusting plate 31, and the bottom end abuts against the top surface of the upper fixed plate 35. A limit pin 38 is radially passed through the side of the lower sorting disk 36. The limit pin 38 slides with the positioning hole on the upper fixed plate 35 to provide mechanical hard limit when the indexing rotation is in place. The spring return column 39 is used to buffer the instantaneous impact load when the test probe contacts the element to prevent hard collision damage between the precision probe and the semiconductor pad.

[0061] The bottom surface of the lower sorting tray 36 is divided into a qualified test area, a defective test area, and a test area along the circumference. Each area is equipped with a material discharge through hole. The end of the sorting robot arm 29 is equipped with a dual-station suction cup. When the sorting turntable mechanism 3 rotates to the sorting station, the test probe seat 34 controls the lifting guide column 33 of the corresponding station to rise and fall according to the test signal. The qualified product station lowers and opens the material discharge through hole, while the defective product station remains closed. The sorting robot arm 29 moves synchronously to transfer qualified products to the qualified collection box and defective products to the defective collection box. The continuous feeding of the vibrating feeding mechanism 4, the stepping rotation test of the sorting turntable mechanism 3, and the material picking and sorting actions of the table mounting mechanism 2 are controlled by the preset program in the main unit box 16 to achieve fully automated assembly line operation.

[0062] In this embodiment, the sorting turntable mechanism 3 achieves high-precision indexing rotation driven by the positioning gear ring 37 and an external stepper motor. Combined with the elastic buffering of the spring return column 39 and the mechanical hard limiting function of the limit pin 38, it achieves precise stopping of the turntable station and flexible protection of probe contact. During actual operation, the turntable top cover 32 drives the components sequentially through the test, sorting, and untested areas. The test probe holder 34 controls the lifting guide column 33 of the corresponding station based on the electrical test results. The qualified product station descends to open the material discharge hole, and the dual-station suction cups of the sorting robotic arm 29 achieve automatic diversion and collection. This mechanism completely avoids damage to precision probes and semiconductor pads from rigid collisions, achieving seamless connection between testing and sorting processes. While ensuring extremely high sorting accuracy, it significantly improves the continuous operating capacity of the equipment and the service life of core components.

[0063] Example 4

[0064] like Figure 1-8As shown, the vibrating feeding mechanism 4 includes a feeding base 41 fixed to the side of the working top plate 13. The top surface of the feeding base 41 is fixed with a vibrating cylinder 43 by a shock-absorbing pad. The top of the vibrating cylinder 43 is detachably covered with a protective cover plate 42. The inner wall of the vibrating cylinder 43 is provided with a spirally rising feeding track. A feeding slide rail 45 extends horizontally from the outlet of the vibrating cylinder 43. A discharge adjustment component 44 is mounted at the end of the feeding slide rail 45. The discharge adjustment component 44 controls the height and horizontal position of the end of the feeding slide rail 45 by a fine-tuning screw to achieve seamless docking with the feeding station of the sorting turntable mechanism 3.

[0065] The discharge adjustment component 44 includes an L-shaped adjustment bracket fixed to the side of the feeding base 41 and a miniature linear module mounted on it. The end of the feeding slide rail 45 is fixed to the slider of the miniature linear module. The end of the lead screw of the miniature linear module is connected to a manual adjustment knob. The rotation of the manual adjustment knob drives the feeding slide rail 45 to make fine adjustments in a direction perpendicular to the radial direction of the sorting turntable mechanism 3. The end of the feeding slide rail 45 is equipped with a photoelectric sensor. When the semiconductor SMD element slides to the end stop, a signal is triggered. After receiving the signal, the control host box 16 controls the sorting turntable mechanism 3 to stop feeding and start the picking claw 26 to accurately pick up the material, ensuring orderly feeding in a single row.

[0066] In this embodiment, the vibratory feeding mechanism 4 automatically orients and arranges random components via the spiral track of the vibratory cylinder 43, and uses the miniature linear module in the discharge adjustment component 44 and the manual adjustment knob to fine-tune the end position of the feeding slide rail 45 in multiple dimensions. With real-time trigger feedback from the end photoelectric sensor, the control unit 16 can precisely control the gripping timing of the picking claw 26 and the feed rhythm of the turntable. In actual production lines, this feeding system effectively solves problems such as discharge jamming, excess material, or positional deviation in traditional vibratory feeders, achieving orderly and smooth transitional conveying of semiconductor SMD components of different sizes in a single row. Precise end positioning and photoelectric linkage control ensure zero-error docking between the feeding and testing stations, providing reliable front-end material support for the high-speed, continuous, and automated operation of the entire machine.

[0067] Working principle:

[0068] like Figure 1-8As shown, the vibratory feeding mechanism 4 is activated. Under the action of the excitation force, the vibratory cylinder 43 drives the internal semiconductor SMD components to automatically orient and arrange themselves along the spiral track and be conveyed upward. After being protected from dust by the protective cover plate 42, they enter the horizontal feeding slide rail 45. The discharge adjustment component 44 finely adjusts the height and horizontal position of the end of the slide rail through the micro linear module to ensure seamless docking with the feeding station of the sorting turntable mechanism 3. When the component slides to the end of the slide rail and triggers the photoelectric sensor, the control host box 16 receives the signal and immediately instructs the table mounting mechanism 2 to move. The picking horizontal slide 24 drives the picking claw 26 to move to the picking point. The driving cylinder controls the claw to accurately pick up a single component and then places it in the component receiving slot on the top cover 32 of the top surface of the sorting turntable mechanism 3, completing the orderly and stable single-row feeding.

[0069] The sorting turntable mechanism 3, driven by an external stepper motor and a positioning gear ring 37, rotates the lower sorting disc 36 and the top cover 32 in a high-precision stepping indexing manner. At the moment the rotation stops, a limit pin 38 inserts into the positioning hole to provide a mechanical hard limit, while a spring return column 39 provides elastic support to buffer impact. When the turntable carrying the component rotates to the test position, the control unit 16 uses sensor signals to achieve closed-loop synchronous control, instructing the test probe arm 28 to press downwards while simultaneously controlling the test probe seat 34 to rise upwards along the lifting guide column 33. Utilizing the elastic buffering effect of the spring return column 39, the probe makes flexible contact with the semiconductor SMD component pins, thereby performing electrical performance testing. The test data is then transmitted back to the control system in real time for qualification judgment.

[0070] After the test is completed, the turntable continues to rotate to the sorting station. The control unit 16 controls the lifting guide column 33 of the corresponding station to perform differentiated actions according to the test results: if it is determined to be a qualified product, the control mechanism drives the guide column to descend, thereby opening the material drop hole at the bottom of the lower sorting plate 36; if it is determined to be a defective product, the guide column remains closed to prevent the component from falling, and the dual-station suction cup at the end of the sorting robot arm 29 is activated, and qualified products and defective products are picked up and transferred to the corresponding collection boxes according to the preset program.

[0071] Throughout the entire operation process, the vibration feeding, turntable transmission, probe testing, and robotic arm sorting actions are cycled and coordinated by the PLC controller, realizing fully automated and efficient operation of semiconductor SMD components from automatic feeding and precision testing to intelligent sorting.

[0072] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

[0073] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0074] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps described in these embodiments do not limit the scope of this application. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

Claims

1. A semiconductor SMD component test and sorting integrated apparatus, characterized by, include: Support mechanism (1), the top of which is fixedly installed with a working top plate (13); The tabletop mounting mechanism (2) is fixedly installed on the top surface of the working top plate (13); The sorting turntable mechanism (3) is coaxially disposed in the middle of the tabletop mounting mechanism (2) and is rotatably connected to the tabletop mounting mechanism (2); Vibrating feeding mechanism (4), the vibrating feeding mechanism (4) is set on one side of the working top plate (13), and the discharge end faces the feeding station of the sorting turntable mechanism (3); The table mounting mechanism (2) is equipped with a material handling gripper (26), a test probe arm (28) and a sorting robot arm (29). The sorting turntable mechanism (3) is equipped with a positioning station for receiving semiconductor SMD components and a test probe holder (34). The vibration feeding mechanism (4) is used to directionally transport the components to be tested to the sorting turntable mechanism (3).

2. The semiconductor SMD component test and sorting all-in-one apparatus according to claim 1, characterized in that: The support mechanism (1) includes a cabinet side panel (11) with a rectangular frame structure. The four corners of the cabinet side panel (11) are locked and fixed to the working top plate (13) and the bottom crossbeam (14) at the bottom through frame corner brackets (12). The bottom crossbeam (14) is rotatably installed with casters (15) at the four corners of the bottom surface. The front middle of the cabinet side panel (11) is embedded with a control host box (16). The top of the control host box (16) extends out of the cabinet through a bracket and is fixedly installed with an operation display screen (17). The control host box (16) is electrically connected to the operation display screen (17). The control host box (16) integrates a PLC controller and a pneumatic control valve group inside, which is used to coordinate and control the action sequence and data feedback of the table mounting mechanism (2), the sorting turntable mechanism (3) and the vibrating feeding mechanism (4).

3. The semiconductor SMD component test and sort all-in-one apparatus according to claim 2, characterized in that: The tabletop mounting mechanism (2) includes a mounting base plate (21) laid flat on the top surface of the working top plate (13). The outer edge of the mounting base plate (21) is covered with an edge guard plate (22). The mounting base plate (21) and the edge guard plate (22) are locked together by a number of circumferentially distributed mounting adjustment pins (23). A material picking horizontal slide (24) is fixedly installed in the middle of the top surface of the mounting base plate (21). The moving end of the material picking horizontal slide (24) is connected to the driving cylinder of the material picking claw (26) through a connecting flange (25). A test probe arm (28) and a sorting robot arm (29) are also fixedly mounted on the top surface of the mounting base plate (21). The output end of the test probe arm (28) points vertically to the test station of the sorting turntable mechanism (3). The output end of the sorting robot arm (29) covers the sorting and discharge station of the sorting turntable mechanism (3).

4. The integrated testing and sorting equipment for semiconductor SMD components according to claim 3, characterized in that: The sorting turntable mechanism (3) includes a turntable adjustment plate (31) and a turntable top cover (32) stacked coaxially. The top surface of the turntable top cover (32) is provided with a number of component receiving slots arranged in a ring array. The turntable adjustment plate (31) and the turntable top cover (32) are slidably connected by multiple lifting guide columns (33). The bottom of the lifting guide column (33) passes through the turntable adjustment plate (31) and is fixedly connected to the test probe seat (34). The bottom of the sorting turntable mechanism (3) is provided with an upper fixing plate (35) and a lower sorting plate (36). The upper fixing plate (35) is fixed on the working top plate (13). The lower sorting plate (36) is rotatably installed on the bottom surface of the upper fixing plate (35). The bottom surface of the lower sorting plate (36) is provided with a material discharge through hole corresponding to the component receiving slot.

5. The integrated testing and sorting equipment for semiconductor SMD components according to claim 2, characterized in that: The vibrating feeding mechanism (4) includes a feeding base (41) fixed to the side of the working top plate (13). The top surface of the feeding base (41) is fixed with a vibrating cylinder (43) by a shock-absorbing pad. The top of the vibrating cylinder (43) is detachably covered with a protective cover plate (42). The inner wall of the vibrating cylinder (43) is provided with a spirally rising feeding track. A feeding slide rail (45) extends horizontally from the outlet of the vibrating cylinder (43). A discharge adjustment component (44) is mounted at the end of the feeding slide rail (45). The discharge adjustment component (44) controls the height and horizontal position of the end of the feeding slide rail (45) by a fine-tuning screw to achieve seamless docking with the feeding station of the sorting turntable mechanism (3).

6. The integrated testing and sorting equipment for semiconductor SMD components according to claim 3, characterized in that: An air source processor (27) is also fixedly installed on one side of the top surface of the mounting base plate (21). The air inlet of the air source processor (27) is connected to the air source interface in the control host box (16) through an air pipe. The air outlet of the air source processor (27) is connected in parallel to the drive cylinder of the material handling gripper (26), the pressing cylinder of the test probe arm (28), and the gripping cylinder of the sorting robot arm (29) through three independent pneumatic pipelines. The air source processor (27) integrates a precision pressure reducing valve, an oil mist lubricator, and a filter to provide stable and clean compressed air for each actuator cylinder. The pressing stroke of the test probe arm (28) and the rising stroke of the test probe seat (34) are controlled in a closed loop through sensor signals in the control host box (16).

7. The integrated testing and sorting equipment for semiconductor SMD components according to claim 4, characterized in that: The bottom surface of the upper fixed plate (35) is coaxially fixed with a positioning toothed ring (37). The outer teeth of the positioning toothed ring (37) mesh with the drive gear of the external stepper motor to drive the lower sorting disk (36) and the turntable top cover (32) to perform step-by-step indexing rotation. A spring return column (39) is sleeved on the outside of the lifting guide column (33). The top end of the spring return column (39) abuts against the bottom surface of the turntable adjusting plate (31), and the bottom end abuts against the top surface of the upper fixed plate (35). A limit pin (38) is radially penetrated through the side of the lower sorting disk (36). The limit pin (38) slides with the positioning hole on the upper fixed plate (35) to provide mechanical hard limit when the indexing rotation is in place. The spring return column (39) is used to buffer the instantaneous impact load when the test probe contacts the element to prevent the precision probe from being damaged by hard collision with the semiconductor pad.

8. The integrated testing and sorting equipment for semiconductor SMD components according to claim 3, characterized in that: The mounting adjustment pin (23) is an eccentric adjustment structure. Its threaded section passes through the edge reserved hole of the mounting base plate (21) and engages with the threaded blind hole on the inner side of the edge guard plate (22). The head of the mounting adjustment pin (23) is provided with an internal hexagonal groove. By rotating the mounting adjustment pin (23), the flatness and levelness of the mounting base plate (21) relative to the working top plate (13) can be finely adjusted. The connecting flange (25) adopts a quick-release dovetail groove structure and slides and engages with the moving end of the material picking horizontal slide (24). The side of the connecting flange (25) is provided with locking bolts. The base of the material picking claw (26) can be quickly disassembled and positioned in the XY axis direction through the connecting flange (25), which is convenient for adapting to semiconductor SMD components with different packaging specifications.

9. The integrated testing and sorting equipment for semiconductor SMD components according to claim 5, characterized in that: The discharge adjustment component (44) includes an L-shaped adjustment bracket fixed to the side of the feeding base (41) and a miniature linear module mounted thereon. The end of the feeding slide rail (45) is fixed to the slider of the miniature linear module. The end of the lead screw of the miniature linear module is connected to a manual adjustment knob. The rotation of the manual adjustment knob drives the feeding slide rail (45) to make fine adjustments in a direction perpendicular to the radial direction of the sorting turntable mechanism (3). The end of the feeding slide rail (45) is provided with a photoelectric sensor. When the semiconductor SMD element slides to the end stop, a signal is triggered. After receiving the signal, the control host box (16) controls the sorting turntable mechanism (3) to pause feeding and start the picking claw (26) to accurately pick up the material, ensuring orderly feeding in a single row.

10. A semiconductor SMD component testing and sorting integrated device according to claim 4, characterized in that: The bottom surface of the lower sorting plate (36) is divided into a test qualified area, a test defective area and a test area along the circumference. Each area is provided with a material discharge through hole. The end of the sorting robot arm (29) is provided with a dual-station suction cup. When the sorting turntable mechanism (3) rotates to the sorting station, the test probe seat (34) controls the lifting guide column (33) of the corresponding station to rise and fall according to the test signal. The qualified product station lowers and opens the material discharge through hole, while the defective product station remains closed. The sorting robot arm (29) moves synchronously to transfer qualified products to qualified collection boxes and defective products to defective collection boxes. The continuous feeding of the vibrating feeding mechanism (4), the stepping rotation test of the sorting turntable mechanism (3), and the picking and sorting actions of the table mounting mechanism (2) are achieved through the preset program in the control host box (16) to realize fully automated assembly line operation.

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