An RTD thermal resistance type test terminal and device

Abstract

An RTD (Resistant Temperature Detector) test terminal and device are disclosed, relating to the field of PLC testing technology. Addressing the problems of excessive manual wiring and switching operations, low testing efficiency, susceptibility to connection errors or omissions, and difficulty in achieving rapid and stable multi-channel measurements in existing PLC testing processes, this invention provides an RTD test terminal. The terminal includes a main body with a circuit board, probes and pin sleeves, a cover plate, an upper cover plate, a back clamp bracket, a back clamp, a back clamp baffle, and pin sleeve slots. The probes and pin sleeves are used to contact the tested terminal. The circuit board is used for electrical connection with the probes and switching output levels. The cover plate and upper cover plate are used for encapsulation, and the back clamp bracket, back clamp, and back clamp baffle are used for clamping and mounting. This test terminal is suitable for rapid testing and switching measurements of RTD signal channels in PLC cabinets.

Description

Technical Field

[0001] This relates to the field of PLC testing technology, specifically to RTD (Resistive Temperature Detector) type test terminals. Background Technology

[0002] In industrial automation control systems, PLCs, as the core unit for field signal acquisition, logic operations, and execution control, typically require targeted functional testing and signal verification during the factory, assembly, commissioning, and maintenance phases. Especially in temperature detection-related circuits, RTD (Resistant Temperature Detector) signals are widely used in various control cabinets, process control devices, and complete sets of automation equipment due to their stability and accuracy in temperature measurement. Current PLC testing technologies typically employ external wires, discrete terminals, analog signal sources, and manual switching of input channels to test each channel. For example, testers first write or call test programs based on the wiring method and channel configuration of the RTD modules in the PLC cabinet under test, then connect the test leads one by one to the corresponding terminals to perform numerical output, switching, and measurement verification for each channel. For test objects with a small number of channels and a simple structure, this method can basically meet the testing requirements; however, when the number of PLC modules increases, the terminal arrangement becomes compact, and test tasks are frequently switched, traditional testing methods rely heavily on manual experience and operational proficiency, often requiring repeated plugging and unplugging, point-by-point wiring, and item-by-item adjustments, resulting in low overall testing efficiency.

[0003] Furthermore, most existing test fixtures adopt a split structure, with loose assembly relationships between various test components. This is not conducive to rapid alignment and stable connection, nor to simultaneous testing of multiple channels. In practical applications, testers not only need to set up the test program, but also need to switch the corresponding output values ​​according to different channels or operating conditions. This involves many steps and long connection paths, making it prone to problems such as incorrect insertion, missing connections, poor contact, or untimely switching. Especially when multiple RTD terminals need to be continuously tested, traditional methods often struggle to balance test speed, connection stability, and ease of replacement, thus affecting the accuracy and consistency of test results. At the same time, as the scale of industrial automation systems continues to expand, the types of modules and wiring relationships inside PLC cabinets are becoming increasingly complex. Existing testing methods that rely on manual connection and switching one by one are increasingly unable to meet the testing requirements of high efficiency, low error, and ease of assembly and maintenance.

[0004] In summary, existing technologies suffer from drawbacks such as excessive manual wiring and switching operations during PLC testing, low testing efficiency, susceptibility to connection errors or omissions, difficulty in achieving rapid and stable measurement of multiple channels, inconvenience in plugging and unplugging test fixtures, and insufficient overall structural stability. Summary of the Invention

[0005] To address the shortcomings of existing technologies, such as excessive manual wiring and switching during PLC testing, low testing efficiency, susceptibility to connection errors or omissions, difficulty in achieving rapid and stable measurement across multiple channels, inconvenient tooling replacement, and insufficient overall structural stability, the technical solution provided by this invention is as follows: An RTD (Resistive Temperature Detector) test terminal includes: The test terminal body is provided with a circuit board part, a probe and a needle sleeve part, a cover plate, an upper cover plate, a back clip bracket, a back clip, a back clip baffle and a needle sleeve groove. The probe and needle sleeve portion is disposed on the upper part of the test terminal body, and includes a plurality of probes arranged at intervals and needle sleeves disposed corresponding to the probes. The needle sleeve groove is disposed on the test terminal body and is used to position the needle sleeve. The circuit board portion is disposed inside the test terminal body and is electrically connected to the plurality of probes. The circuit board portion is provided with a switching element for switching output levels. The cover plate and the upper cover plate are disposed on the outside of the test terminal body and are used to encapsulate the circuit board portion; The back clip bracket is disposed on the rear side of the test terminal body, the back clip is connected to the back clip bracket, and the back clip baffle is disposed at an adjacent position to the back clip and is used to limit the back clip. The testing method is as follows: Align the probe and pin sleeve of the RTD resistance test terminal with the corresponding terminal of the end to be tested, and fix the RTD resistance test terminal at the test position by means of the back clip bracket, back clip and back clip baffle. Based on the circuit board portion, a one-to-one conductive relationship is established between multiple test channels and multiple probes; The current switching state of each switching element on the circuit board is obtained, and the output level corresponding to each test channel is determined based on the current switching state of each switching element. According to the output level corresponding to each test channel, a test signal corresponding to each output level is generated in the circuit board section; The test signals of each test channel are transmitted to the probes connected to the corresponding test channels. The test signals of each test channel are synchronously output to multiple terminals of the test device through multiple probes to complete the multi-channel test of the test device. During the test, in response to the switching operation of the switching element, the output level of the corresponding test channel is redefined, and the test signal output by the corresponding probe is updated.

[0006] Furthermore, in a preferred embodiment, the plurality of probes are arranged at intervals along the width direction of the test terminal body, the plurality of needle sleeves are provided in a one-to-one correspondence with the plurality of probes, and the plurality of needle sleeve grooves are distributed along the arrangement direction of the plurality of probes.

[0007] Furthermore, in a preferred embodiment, a plurality of switching elements are provided on the circuit board portion, the plurality of switching elements are arranged at intervals along the width direction of the test terminal body, and are correspondingly connected to the plurality of probes.

[0008] Furthermore, in a preferred embodiment, the cover plate is disposed on the lower outer side of the test terminal body, and the upper cover plate is disposed on the front outer side of the test terminal body. The cover plate and the upper cover plate together form an encapsulation structure for the circuit board portion.

[0009] Furthermore, in a preferred embodiment, the back clip bracket is fixedly connected to the test terminal body, the back clip is disposed on the rear exterior of the test terminal body, and is connected to the test terminal body through the back clip bracket.

[0010] Furthermore, in a preferred embodiment, the back clip baffle is disposed on the front or lower side of the back clip and is fixedly connected to the test terminal body to limit the range of motion of the back clip.

[0011] Furthermore, in a preferred embodiment, the circuit board portion, the probe and needle sleeve portion, the cover plate, the upper cover plate, the back clip bracket, the back clip, the back clip baffle, and the needle sleeve groove are integrated into a single test terminal structure.

[0012] Furthermore, in a preferred embodiment, the probe and needle sleeve portion is disposed above the circuit board portion, the lower portion of the plurality of probes is connected to the circuit board portion, and the upper portion of the plurality of probes extends out of the test terminal body.

[0013] Furthermore, in a preferred embodiment, the needle sleeve is used to support and limit the probes so that the plurality of probes maintain a predetermined spacing.

[0014] An RTD (Resistive Thermal Device) testing apparatus, the apparatus comprising the aforementioned test terminals.

[0015] Compared with the prior art, the advantages of the technical solution provided by the present invention are as follows: The circuit board is used to carry the electrical connection relationship and range switching relationship of each channel, so that multiple test signals can be integrated and arranged on the same carrier. Compared with the existing common methods of splicing discrete wires, external resistor boxes or temporary terminal blocks, this approach can significantly reduce the workload of manual wire flying and point-by-point wiring, thereby reducing the probability of messy connection paths, incorrect wiring and missing wiring, and providing basic support for completing the centralized testing of 4 channels and 12 terminals at one time.

[0016] The switch on the circuit board controls the gear switching, enabling each channel to output different values. The benefit of this is that it eliminates the need for testers to repeatedly disconnect, replace, or change external analog components to switch test states, as is done in existing technologies. Instead, the value switching can be completed directly on the terminal body, which improves the test switching speed and enhances the consistency of test conditions for different channels. This has a direct effect on shortening the test cycle and reducing human error.

[0017] The probe is used to output signals to the test terminal. The effect of this part is that it changes the signal transmission method between the test terminal and the test object from the traditional manual temporary wiring to a more direct contact output structure. This helps to shorten the signal access path, improve test alignment efficiency and conduction stability, thereby reducing poor contact and test result fluctuations caused by manual clamping and inaccurate terminal positioning.

[0018] The needle sleeve, designed to work in conjunction with the probe, provides installation positioning and structural protection for the probe, making it easier to maintain a relatively stable position during repeated insertions and removals and continuous testing. Compared to some existing exposed test probes or simple wire contact methods, the needle sleeve improves the repeatability and overall durability of the contact area, thus balancing test accuracy and long-term stability.

[0019] The cover plate, which covers the outside of the corresponding component, serves to limit and protect the internal electrical connections, preventing the internal structure from shifting due to external forces, accidental contact, or loose assembly. Compared to open or semi-open test fixtures, the cover plate helps maintain the integrity of the internal structure, improves the overall strength of the product, and reduces the risk of failure caused by external interference in the testing environment.

[0020] The top cover and the top cover together form a layered encapsulation and clamping structure. This part further improves the overall stability after assembly, creating a more complete clamping and protective relationship between the upper and lower structures of the test terminals. Combined with the integrated design, more robust structure, and easier assembly emphasized in the technical disclosure materials, it can be seen that the top cover not only helps improve the overall mechanical strength but also helps shorten assembly time and reduce the misalignment and loosening of scattered parts during the assembly process.

[0021] The back clamp bracket provides a mounting base and load-bearing support for the back clamp. This transforms the back clamp structure from a simple attachment into an independent structural unit with a clearly defined support relationship. Compared to some existing test fixtures that rely solely on handheld operation, temporary snap-fit, or loose fixing, the back clamp bracket improves the stress stability of the terminals during installation and testing, thereby enhancing reliable fixing during insertion and reducing the adverse effects of shaking on testing accuracy and operational efficiency.

[0022] The back clip is used to quickly fix and remove the test terminal. This allows for faster installation, insertion, removal, and replacement of the terminal in practical applications. Compared to traditional testing methods that require screws, wire crimping, or long-term manual support for alignment, the back clip structure is more suitable for high-frequency testing scenarios. It directly reduces the intensity of manual operation and corresponds to the goal of "facilitating quick replacement and insertion" in the technical disclosure materials.

[0023] Back clamp baffles are used to limit the range of motion or installation position of the back clamp. This results in clearer boundaries and guiding relationships during clamping and release, reducing over-clamping, misalignment, or loosening. Compared to clamping components without auxiliary limiting structures, back clamp baffles help improve assembly consistency and stability for repeated use, thereby ensuring the structural reliability of the test fixture after multiple insertions and removals.

[0024] The needle sleeve slot is used to accommodate and position the needle sleeve. This allows the needle sleeve and its corresponding probe to be arranged in a predetermined position, which is beneficial for the consistent arrangement and rapid alignment of multiple test points. For applications that require simultaneous measurement of 4 channels and 12 terminals, the needle sleeve slot can reduce the mutual interference, positional deviation and assembly error problems common in multi-probe structures, making the overall test structure more suitable for batch and repetitive testing requirements.

[0025] The circuit board, probes and pin sleeves, cover plate, top cover plate, back clamp bracket, back clamp, back clamp baffle, and pin sleeve slot together form an integrated structure. The effect of this integrated combination is that the conductivity, switching, output, fixation, and protection functions that were originally scattered in the existing PLC testing are concentrated into a single test terminal. This can improve the insertion and removal speed and structural robustness, and reduce the reliance on multiple people working together and complex manual wiring. Therefore, it is more suitable for the comprehensive requirements of testing efficiency, accuracy, and repeatability in industrial sites. Attached Figure Description

[0026] Figure 1 A three-dimensional schematic diagram of an RTD-type test terminal; Figure 2 for Figure 1 Side view; Figure 3 for Figure 1 The front view; Figure 4 for Figure 1 Top view; Figure 5 for Figure 1 Rear view; Figure 6 for Figure 1 Exploded view.

[0027] In this diagram, 1 represents the circuit board section, 2 represents the probe and needle sleeve section, 3 represents the cover plate, 4 represents the upper cover plate, 5 represents the back clip bracket, 6 represents the back clip, 7 represents the back clip baffle, and 8 represents the needle sleeve groove. Detailed Implementation

[0028] To make the advantages and benefits of the technical solution provided by the present invention clearer, the technical solution provided by the present invention will now be described in further detail with reference to the accompanying drawings, specifically: Implementation Method 1: This implementation method provides an RTD (Resistive Temperature Detector) test terminal, including: The test terminal body is provided with a circuit board part, a probe and a needle sleeve part, a cover plate, an upper cover plate, a back clip bracket, a back clip, a back clip baffle and a needle sleeve groove. The probe and needle sleeve portion is disposed on the upper part of the test terminal body, and includes a plurality of probes arranged at intervals and needle sleeves disposed corresponding to the probes. The needle sleeve groove is disposed on the test terminal body and is used to position the needle sleeve. The circuit board portion is disposed inside the test terminal body and is electrically connected to the plurality of probes. The circuit board portion is provided with a switching element for switching output levels. The cover plate and the upper cover plate are disposed on the outside of the test terminal body and are used to encapsulate the circuit board portion; The back clip bracket is located on the rear side of the test terminal body. The back clip is connected to the back clip bracket. The back clip baffle is located adjacent to the back clip and is used to limit the back clip.

[0029] The plurality of probes are arranged at intervals along the width direction of the test terminal body, the plurality of needle sleeves are arranged in a one-to-one correspondence with the plurality of probes, and the plurality of needle sleeve grooves are distributed along the arrangement direction of the plurality of probes; The testing method is as follows: Align the probe and pin sleeve of the RTD resistance test terminal with the corresponding terminal of the end to be tested, and fix the RTD resistance test terminal at the test position by means of the back clip bracket, back clip and back clip baffle. Based on the circuit board portion, a one-to-one conductive relationship is established between multiple test channels and multiple probes; The current switching state of each switching element on the circuit board is obtained, and the output level corresponding to each test channel is determined based on the current switching state of each switching element. According to the output level corresponding to each test channel, a test signal corresponding to each output level is generated in the circuit board section; The test signals of each test channel are transmitted to the probes connected to the corresponding test channels. The test signals of each test channel are synchronously output to multiple terminals of the test device through multiple probes to complete the multi-channel test of the test device. During the test, in response to the switching operation of the switching element, the output level of the corresponding test channel is redefined, and the test signal output by the corresponding probe is updated.

[0030] The circuit board portion is provided with multiple switching elements, which are arranged at intervals along the width direction of the test terminal body and are connected to the multiple probes.

[0031] The cover plate is disposed on the lower outer side of the test terminal body, and the upper cover plate is disposed on the front outer side of the test terminal body. The cover plate and the upper cover plate together form an encapsulation structure for the circuit board portion.

[0032] The back clip bracket is fixedly connected to the test terminal body. The back clip is disposed on the rear exterior of the test terminal body and is connected to the test terminal body through the back clip bracket.

[0033] The back clip baffle is disposed on the front or lower side of the back clip and is fixedly connected to the test terminal body to limit the range of motion of the back clip.

[0034] The circuit board portion, the probe and needle sleeve portion, the cover plate, the upper cover plate, the back clip bracket, the back clip, the back clip baffle, and the needle sleeve groove are integrated into a single test terminal structure.

[0035] The probe and needle sleeve portion is disposed above the circuit board portion, the lower part of the plurality of probes is connected to the circuit board portion, and the upper part of the plurality of probes extends out of the test terminal body.

[0036] The needle sleeve is used to support and limit the probes so that the plurality of probes maintain a predetermined spacing.

[0037] An RTD (Resistive Thermal Device) testing apparatus, the apparatus comprising the aforementioned test terminals.

[0038] Implementation Method Two: Combination Figure 1-6 This embodiment is a further detailed description of the technical solution provided in Embodiment 1, specifically: The RTD (Resistive Temperature Detector) test terminal includes a circuit board (1), probes and pin sleeves (2), a cover plate (3), an upper cover plate (4), a back clip bracket (5), a back clip (6), a back clip baffle (7), and a pin sleeve groove (8). These components, when assembled, form an integrated test terminal structure for multi-channel contact testing of the tested terminal and outputting different test values ​​through an internal range switching mechanism.

[0039] The circuit board section 1 is located inside the main body of the test terminal, below the probe and pin sleeve section 2, and serves as the conductive connection body for the entire test terminal. The circuit board section 1 carries the conductive lines of each channel, the corresponding connections between channels, and the level switching elements. Multiple switching elements are arranged on the circuit board section 1 at intervals along the lateral direction of the test terminal, with each switching element corresponding to a test channel or a set of test output states. By toggling or switching the corresponding switching elements, the output value of the corresponding channel can be changed, allowing the same test terminal to output different analog states under different test requirements. The circuit board section 1 establishes conductive connections with multiple probes, enabling the switched test signal to be output from the corresponding probe to the tested terminal. After being fixed inside the test terminal, the circuit board section 1 not only provides electrical connection but also serves as the assembly base for the internal structure, ensuring a stable positional relationship between the probe, pin sleeve section 2, cover plate 3, and upper cover plate 4.

[0040] The probe and pin sleeve section 2 is located on the upper part of the test terminal body and is an output structure that directly contacts the terminal under test. The probe and pin sleeve section 2 includes multiple probes arranged sequentially in a horizontal direction to form a multi-point parallel output structure. Each probe has an upward-extending contact end and a downward-connected mounting end. The mounting end connects to a corresponding conductive position on the circuit board section 1, and the contact end is used to insert into or abut against the terminal under test, thereby outputting the test signal generated inside the test terminal to the tested area. Multiple probes are arranged at a predetermined spacing, allowing them to simultaneously contact multiple terminal positions. The pin sleeve is located in the probe mounting area and is used to support, position, and isolate the probes. The pin sleeve limits the probe offset after assembly, ensuring that the probes maintain a basically consistent extension height and arrangement spacing, preventing lateral wobbling, skewness, or mutual interference between probes. The probe and pin sleeve section 2 is located at the top of the test terminal, allowing the test terminal to contact multiple terminals under test at once in a top-aligned manner during installation, reducing the amount of work required for connecting individual wires.

[0041] The needle sleeve slots 8 are located in the area where the probes and needle sleeve parts 2 are situated, serving to accommodate each needle sleeve and define its installation position. The needle sleeve slots 8 are sequentially distributed along the arrangement direction of the multiple probes, with each slot corresponding to one or a group of needle sleeves, ensuring a stable lateral position after the needle sleeves are inserted. The needle sleeve slots 8 provide a clear positioning reference for the probes and needle sleeve parts 2 during assembly, ensuring consistency in the center distance, needle exit direction, and overall arrangement of the multiple probes. The needle sleeve slots 8 also limit the movement of the needle sleeves, preventing them from loosening during repeated insertion, removal, and testing. The continuous arrangement of multiple needle sleeve slots 8 forms a unified installation module for the multi-probe structure, improving assembly efficiency and testing consistency.

[0042] Cover plate 3 is located on the lower outer side of the test terminal body to enclose the internal structure and protect the internal components. Cover plate 3 is situated in the lower outer region of the circuit board portion 1, its shape matching the lower contour of the main body. After installation, it covers the bottom and lower front portion of the circuit board portion 1, preventing the internal electrical connection areas from being directly exposed to the outside. Cover plate 3 can be fixed to the main body using fasteners, snap-fit ​​structures, or by engaging with other housing components. In addition to its shielding and protective functions, cover plate 3 also acts as a bottom limit for the internal structure, ensuring the stable assembly of the circuit board portion 1 and its adjacent components. Cover plate 3 forms part of the test terminal housing, ensuring the sealing of the internal structure while also making the overall shape more complete.

[0043] The upper cover plate 4 is located at the lower-middle part of the front side of the test terminal, used to hold and encapsulate the circuit board part 1 and adjacent assemblies. The upper cover plate 4 and the cover plate 3 cooperate with each other in the vertical direction to form a partially enclosed front structure. After installation, the upper cover plate 4 is located on the outside of the circuit board part 1, covering the area except for the internal switching elements, making it less likely for the internal components to shift due to collisions or external forces during use. The upper cover plate 4 also provides auxiliary fixation for the circuit board part 1, keeping it in a stable position inside the terminal. An operating area for the corresponding switching elements is reserved between the upper cover plate 4 and the cover plate 3, allowing the operator to switch gears directly without disassembling the structural components. Thus, the front structure ensures both necessary encapsulation and strength while retaining the convenience of gear operation.

[0044] The back clamp bracket 5 is located at the rear of the test terminal body, providing a mounting base and support structure for the back clamp 6. The back clamp bracket 5 is fixedly connected to the rear of the main body; one part connects to the main body shell or internal support, while the other part extends rearward or outward to form the assembly area for the back clamp 6. The back clamp bracket 5 is used to withstand the forces generated during clamping and disassembly of the back clamp 6, preventing the force on the back clamp 6 from being directly concentrated on other weaker parts. The back clamp bracket 5 also limits the installation posture of the back clamp 6, allowing it to clamp around a predetermined position. When the back clamp bracket 5 and the back clamp 6 are engaged, the test terminal has good stability when connected to the component under test, preventing the main body from shifting due to clamping forces.

[0045] The back clip 6 is located on the external rear side of the test terminal body and is used to quickly fix the test terminal to the component under test or the mounting location. The back clip 6 has a clamping structure, and its shape is suitable for sleeve, snap, or hold from the outside of the object under test. After the back clip 6 is connected to the back clip bracket 5, it forms a quick-clamping assembly located behind the test terminal. In use, the back clip 6 can use its own shape and elasticity or structural clearance to fit with the outer contour of the component under test, allowing the test terminal to be quickly installed in place without additional complicated fastening steps. The back clip 6 makes the installation and removal of the test terminal more convenient and also keeps the test terminal in a more reliable fixed state during testing, reducing test errors caused by unstable contact.

[0046] A back clamp baffle 7 is disposed in the area adjacent to the back clamp 6 and is fixedly connected to the test terminal body. It restricts the range of motion of the back clamp 6 and provides auxiliary protection for the back clamp mounting area. The back clamp baffle 7 is located in front of, below, or to the side of the back clamp 6, spatially cooperating with the back clamp 6 to prevent excessive displacement of the back clamp 6 during clamping, releasing, or resetting. The back clamp baffle 7 can stop the back clamp 6, preventing it from deflecting in an undesirable direction, and also provides partial shielding at the connection point between the back clamp 6 and the main body, improving the overall integrity of the rear clamping area. The back clamp baffle 7, together with the back clamp bracket 5, ensures that the back clamp 6 maintains good installation accuracy and movement boundaries even after repeated use.

[0047] The overall structure of the test terminal is arranged in a top-output, middle-conductivity, front-encapsulation, and rear-clamping manner. The probe and pin sleeve section 2 is located at the top for direct contact with the tested terminal; the circuit board section 1 is located inside the main body, forming the conductive relationship between channels and enabling range switching; the cover plate 3 and upper cover plate 4 are located on the outside, encapsulating and protecting the internal structure; the back clamp bracket 5, back clamp 6, and back clamp baffle 7 are located at the rear, enabling quick installation and stable clamping; the pin sleeve slot 8 is located in the probe mounting area for unified positioning of multiple pin sleeves and probes. With the cooperation of all these structures, the test terminal can integrate multi-probe output, internal value switching, overall encapsulation, and quick fixation functions within a relatively small space.

[0048] This test terminal can perform measurements on 4 channels and 12 terminals simultaneously. Multiple probes are arranged to correspond to multiple test positions, and multiple switching elements on the circuit board section 1 correspond to the output adjustment requirements of each channel, thus enabling each channel to have two settings for outputting different values. During testing, the probes and pin sleeves 2 of the test terminal are aligned with the terminal being tested, and the back clip 6 clamps and corresponding structures to form a clamping and fixing, so that multiple probes simultaneously contact the terminal being tested. Then, the switching elements on the circuit board section 1 are switched according to the test requirements, so that each channel outputs the corresponding test value. Since multiple channels can be centrally located on the same test terminal, and the switching of different values ​​is completed through internal switching elements, the operations of wiring wire by wire, repeated plugging and unplugging, and external switching elements in traditional testing can be reduced.

[0049] The circuit board section 1, probe and pin sleeve section 2, cover plate 3, upper cover plate 4, back clamp bracket 5, back clamp 6, back clamp baffle 7, and pin sleeve groove 8 form an integrated assembly structure. The electrical connection section, output section, and clamping section are all concentrated within the same terminal body, giving the test terminal the characteristics of faster insertion and removal, more robust structure, and easier assembly. The probes are kept in an orderly arrangement through the pin sleeve and pin sleeve groove 8, improving multi-point alignment accuracy; the combination of the circuit board section 1 and the switching element makes the test signal switching more concentrated; the cover plate 3 and upper cover plate 4 encapsulate the internal structure, improving overall stability; the back clamp bracket 5, back clamp 6, and back clamp baffle 7 make the installation and fixing process faster. Therefore, this RTD (Resistor Tolerance) test terminal is suitable for the requirements of rapid connection, centralized testing, and reusability in PLC testing, especially in RTD signal testing scenarios.

[0050] In one embodiment, the electrical control method for the RTD (Resistance Tolerance) test terminal is applied to the aforementioned RTD test terminal. The RTD test terminal includes a circuit board portion 1, a probe and pin sleeve portion 2, a cover plate 3, an upper cover plate 4, a back clamp bracket 5, a back clamp 6, a back clamp baffle 7, and a pin sleeve groove 8. The probe and pin sleeve portion 2 is disposed on the upper part of the test terminal body, the circuit board portion 1 is disposed inside the test terminal body, the cover plate 3 and the upper cover plate 4 encapsulate the internal structure, and the back clamp bracket 5, the back clamp 6, and the back clamp baffle 7 are disposed on the rear side of the test terminal body to form a clamping and fixing relationship with the tested end. The circuit board portion 1 is provided with multiple switching elements, each corresponding to at least one test channel, used to switch the output level of the corresponding test channel. Multiple probes in the probe and pin sleeve portion 2 are electrically connected to each test channel on the circuit board portion 1 to output the test signal generated by the circuit board portion 1 to the tested end.

[0051] During testing, the RTD (Resistance Temperature Detector) test terminal is first moved near the test terminal, aligning the probe and needle sleeve 2 with the corresponding terminal arrangement direction of the test terminal. Multiple probes maintain a predetermined spacing under the support and restraint of the needle sleeve, and maintain a matching arrangement with the test terminal under the positioning function of the needle sleeve groove 8. Then, the probe and needle sleeve 2 are aligned with the multiple terminal positions of the test terminal, so that the contact end of each probe faces the corresponding test terminal. After alignment, the test terminal body is pushed closer to the test terminal, so that multiple probes simultaneously contact multiple test terminals.

[0052] After the probe makes contact with the terminal under test, the back clamp 6 is supported by the back clamp bracket 5, so that the back clamp 6 clamps relative to the outer edge or mounting part of the terminal under test. The back clamp baffle 7 is used to limit the range of motion of the back clamp 6, so that the back clamp 6 maintains the predetermined movement boundary during clamping and avoids excessive displacement. After the back clamp 6 is clamped in place, the test terminal body is stably fixed relative to the terminal under test. At this time, a stable test connection relationship is formed between the probe and the pin sleeve part 2, the circuit board part 1, and the terminal under test. This fixing method eliminates the need for continuous manual support of the test terminal body during the test, which is beneficial for maintaining continuous conductivity between multiple probes and multiple terminals under test.

[0053] In terms of electronic control logic, multiple test channels and probes are pre-established within circuit board section 1. Each test channel corresponds to one probe, or each test channel corresponds to a specific probe in a group of probes, enabling different probes to handle test signal output tasks for different tested terminals. Multiple switching elements on circuit board section 1 are spaced apart along the width direction, and each switching element is connected to the conductive path of its corresponding test channel. By changing the switching state of each switching element, the continuity relationship or output parameters within the corresponding test channel can be changed, thereby allowing the corresponding test channel to output test signals at different levels.

[0054] In one embodiment, each test channel is configured with two output levels. Before testing, the operator presets each switching element on circuit board section 1 according to the requirements of the test item. In the first switching state, circuit board section 1 causes the corresponding test channel to output a first-level test signal; in the second switching state, circuit board section 1 causes the corresponding test channel to output a second-level test signal. Each test channel can be switched independently or simultaneously as needed for testing. Since multiple switching elements control multiple test channels respectively, multiple channels can be set in parallel on the same RTD (Resistance Tolerance) test terminal without disassembling the test terminal or replacing external wiring one by one.

[0055] Once the switching elements are set, circuit board section 1 generates test signals for each test channel according to the current state of each switching element. The generated test signals are transmitted along the internal conductive path of circuit board section 1 to the corresponding probes. Since the probes and multiple probes in probe sleeve section 2 are in contact with the terminals under test, the test signals of each test channel can be output to multiple terminals of the terminal under test via the corresponding probes, thereby achieving multi-channel synchronous testing. For scenarios requiring simultaneous measurement of 4 channels and 12 terminals, conductive paths and switching elements corresponding to the 4 channels can be set on circuit board section 1, allowing multiple probes to output test signals to the corresponding terminals, thus completing the centralized testing of multiple terminals after a single installation.

[0056] During testing, if it is necessary to change the output value of a certain test channel, it is not necessary to remove the contact between the probe and the probe sleeve 2 and the terminal under test, nor is it necessary to release the fixing state of the back clip 6. Only the switching element corresponding to the test channel needs to be operated. The circuit board part 1 responds to the state change of the switching element, redetermines the output level of the test channel, and updates the corresponding test signal in the internal conductive path. The updated test signal continues to be output to the same terminal under test via the original corresponding probe, realizing online switching test. In this way, different levels of measurement can be completed at the same terminal position without changing the contact state, reducing contact errors and time loss caused by repeated plugging and unplugging.

[0057] To ensure output stability, the probe and pin sleeve section 2 provides lateral constraint and mounting support for each probe, while the pin sleeve groove 8 provides positional limitation for the pin sleeve, ensuring that multiple probes maintain a stable spacing and consistent orientation during insertion and output. Thus, when the circuit board section 1 outputs test signals at different levels, each probe can still maintain stable contact with the corresponding terminal under test, reducing signal output fluctuations caused by probe misalignment, tilting, or loosening. The cover plate 3 and the upper cover plate 4 encapsulate the circuit board section 1 within the test terminal body, protecting the internal area outside the switching elements and preventing the internal conductive structure from being affected by external impacts, accidental contact, or dust during testing, thereby maintaining the stability of the electronic control logic execution.

[0058] In another embodiment, multiple switching elements on circuit board section 1 are arranged sequentially according to channel order, with each switching element directly corresponding to a test channel. Before testing, the operator switches each switching element to the corresponding position according to the test value required for the target channel. After the test terminal body is installed, circuit board section 1 simultaneously generates preset test signals for multiple test channels and outputs them synchronously via multiple probes. After completing the first round of testing, the operator can change the state of only some switching elements, switching some test channels to another output position, while keeping the remaining test channels unchanged. In this way, different channels can be grouped and switched for testing under the same installation state, improving the flexibility of multi-channel testing.

[0059] In another embodiment, the multiple switching elements on circuit board section 1 can also be arranged in groups, with each group of switching elements corresponding to a set of test channels. The operator switches a particular group of switching elements, causing that set of test channels to synchronously switch from the first position to the second position. The remaining test channels maintain their original state. This method is suitable for scenarios where multiple terminals in the tested terminal need to be simultaneously verified in groups, enabling the test terminals to maintain multi-point contact while having the ability to switch output states in groups.

[0060] After the test, the clamping engagement between the back clip 6 and the tested terminal is released, allowing the test terminal body to separate from the tested terminal. Once multiple probes are disengaged from the tested terminal, the entire test process is complete. Because the circuit board section 1, probe and pin sleeve section 2, cover plate 3, upper cover plate 4, back clip bracket 5, back clip 6, back clip baffle 7, and pin sleeve groove 8 are integrated into a single test terminal structure, this electronic control method can complete the contact, fixation, range switching, and signal output of multiple terminals with minimal manual operation. This improves connection efficiency, switching efficiency, and test stability during RTD signal testing.

[0061] The above description of several specific embodiments further details the technical solution provided by the present invention in order to highlight the advantages and benefits of the technical solution provided by the present invention. However, the above-described specific embodiments are not intended to limit the present invention. Any reasonable modifications and improvements to the present invention, combinations of embodiments, and equivalent substitutions based on the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An RTD thermal resistance type test terminal characterized by, include: The test terminal body is provided with a circuit board part, a probe and a needle sleeve part, a cover plate, an upper cover plate, a back clip bracket, a back clip, a back clip baffle and a needle sleeve groove. The probe and needle sleeve portion is disposed on the upper part of the test terminal body, and includes a plurality of probes arranged at intervals and needle sleeves disposed corresponding to the probes. The needle sleeve groove is disposed on the test terminal body and is used to position the needle sleeve. The circuit board portion is disposed inside the test terminal body and is electrically connected to the plurality of probes. The circuit board portion is provided with a switching element for switching output levels. The cover plate and the upper cover plate are disposed on the outside of the test terminal body and are used to encapsulate the circuit board portion; The back clip bracket is disposed on the rear side of the test terminal body, the back clip is connected to the back clip bracket, and the back clip baffle is disposed at an adjacent position to the back clip and is used to limit the back clip. The testing method is as follows: Align the probe and pin sleeve of the RTD resistance test terminal with the corresponding terminal of the end to be tested, and fix the RTD resistance test terminal at the test position by means of the back clip bracket, back clip and back clip baffle. Based on the circuit board portion, a one-to-one conductive relationship is established between multiple test channels and multiple probes; The current switching state of each switching element on the circuit board is obtained, and the output level corresponding to each test channel is determined based on the current switching state of each switching element. According to the output level corresponding to each test channel, a test signal corresponding to each output level is generated in the circuit board section; The test signals of each test channel are transmitted to the probes connected to the corresponding test channels. The test signals of each test channel are synchronously output to multiple terminals of the test device through multiple probes to complete the multi-channel test of the test device. During the test, in response to the switching operation of the switching element, the output level of the corresponding test channel is redefined, and the test signal output by the corresponding probe is updated.

2. The RTD (Resistant Thermistor) test terminal according to claim 1, characterized in that, The plurality of probes are arranged at intervals along the width direction of the test terminal body, the plurality of needle sleeves are arranged in a one-to-one correspondence with the plurality of probes, and the plurality of needle sleeve grooves are distributed along the arrangement direction of the plurality of probes.

3. The RTD (Resistant Temperature Detector) test terminal according to claim 1, characterized in that, The circuit board portion is provided with multiple switching elements, which are arranged at intervals along the width direction of the test terminal body and are connected to the multiple probes.

4. The RTD (Resistant Temperature Detector) test terminal according to claim 1, characterized in that, The cover plate is disposed on the lower outer side of the test terminal body, and the upper cover plate is disposed on the front outer side of the test terminal body. The cover plate and the upper cover plate together form an encapsulation structure for the circuit board portion.

5. The RTD (Resistant Temperature Detector) test terminal according to claim 1, characterized in that, The back clip bracket is fixedly connected to the test terminal body. The back clip is disposed on the rear exterior of the test terminal body and is connected to the test terminal body through the back clip bracket.

6. The RTD (Resistant Temperature Detector) test terminal according to claim 1, characterized in that, The back clip baffle is disposed on the front or lower side of the back clip and is fixedly connected to the test terminal body to limit the range of motion of the back clip.

7. The RTD (Resistant Temperature Detector) test terminal according to claim 1, characterized in that, The circuit board portion, the probe and needle sleeve portion, the cover plate, the upper cover plate, the back clip bracket, the back clip, the back clip baffle, and the needle sleeve groove are integrated into a single test terminal structure.

8. The RTD (Resistive Thermal Device) test terminal according to claim 1, characterized in that, The probe and needle sleeve portion is disposed above the circuit board portion, the lower part of the plurality of probes is connected to the circuit board portion, and the upper part of the plurality of probes extends out of the test terminal body.

9. The RTD (Resistant Temperature Detector) test terminal according to claim 1, characterized in that, The needle sleeve is used to support and limit the probes so that the plurality of probes maintain a predetermined spacing.

10. An RTD (Resistant Thermistor) testing device, characterized in that, The device includes the test terminal as described in claim 1.

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