Apparatus and method for detector chip coupling

Abstract

This invention relates to the field of X-ray detector technology, and more particularly to an apparatus and method for coupling detector chips. The invention achieves automatic gripping of the scintillator screen through adsorption holes on a sector block and a negative pressure generating device. A control system enables the horizontal and vertical displacement and adjustment of the sector block, as well as the release of the scintillator screen. Simultaneously, the scintillator is rolled on the horizontal surface of the sector block during release, compacting it and expelling air between the scintillator and the chip, preventing bubble formation.

Description

Technical Field

[0001] This invention relates to the field of X-ray detector technology, and more particularly to apparatus and methods for coupling detector chips. Background Technology

[0002] This section is intended to provide background or context for the embodiments of the invention set forth in the claims. The description herein is not an admission that it is prior art simply because it is included in this section.

[0003] In the production process of X-ray detectors (hereinafter referred to as detectors), scintillators need to be coupled onto the chip. Currently, the scintillator screen is mostly placed manually. This method is labor-intensive and time-consuming, has low production efficiency, is difficult to control, and is prone to generating air bubbles.

[0004] Therefore, traditional scintillator coupling technology needs further improvement and development. Summary of the Invention

[0005] To address the problems of difficulty in controlling and the generation of air bubbles when manually placing scintillator screens in existing technologies, this invention provides a device and method for coupling detector chips, thereby improving production efficiency and product quality.

[0006] To achieve the above objectives, the present invention adopts the following technical solution.

[0007] Firstly, the present invention provides a device for coupling a detector chip, comprising a sector block, a slide rail, a slider, an operating platform, and a control system. The slide rail includes a first slide rail and a second slide rail that are perpendicular to each other. The first slide rail and the second slide rail are perpendicular to and parallel to the operating platform, respectively. The sector block is rotatably connected to the slider via a rotating shaft, and the center of the sector block is located on the axis of the rotating shaft. The slider is slidably connected to the first slide rail and the second slide rail and can move along the first slide rail and the second slide rail under the control of the control system, thereby adjusting the horizontal and vertical distance between the sector block and the operating platform. When the sector block moves horizontally relative to the operating platform, the arc surface of the sector block can roll along a plane parallel to the operating platform. Multiple adsorption holes are spaced along the rolling direction of the sector block on its arc surface. The adsorption holes penetrate the sector block and are connected to corresponding negative pressure generating devices. The control system can control the adsorption force of the adsorption holes.

[0008] By adopting the above scheme, the scintillator screen is automatically grasped through the adsorption holes on the sector block and the negative pressure generating device. The horizontal and vertical displacement and adjustment of the sector block and the release of the scintillator screen are realized through the control system. At the same time, the scintillator is rolled on the horizontal surface of the sector block to compact the scintillator and expel the air between the scintillator and the chip, thus preventing the formation of air bubbles.

[0009] In some embodiments, the slider includes a first slider and a second slider. The sector block is connected to the first slide rail via the first slider, and the first slide rail is connected to the second slide rail via the second slider. The arrangement of the first and second sliders allows for more flexible and diverse movement of the sector block in both horizontal and vertical directions, improving the flexibility of the scintillator coupling process and enhancing the coupling effect.

[0010] In some embodiments, the sector block includes sector block A and sector block B, the slide rail includes first slide rail A and first slide rail B, the first slider includes first slider A and first slider B, the second slider includes second slider A and second slider B, sector block A and sector block B are respectively connected to first slide rail A and first slide rail B via first slider A and first slider B, for adjusting the vertical distance between sector block A and sector block B and the operating platform; first slide rail A and first slide rail B are respectively connected to second slide rail via second slider A and second slider B, for adjusting the horizontal distance between sector block A and sector block B and the operating platform.

[0011] By using two sector blocks, scintillator coupling can be performed in a segmented, localized manner as needed. Alternatively, when coupling the entire scintillator, one half can be bonded first, followed by the other half, according to the designed sequence. This improves bonding efficiency and quality, reduces the generation of air bubbles, and lowers the difficulty of direct coupling of the entire scintillator. The advantages of this solution are particularly pronounced for scintillators with larger areas.

[0012] In some embodiments, the device of the present invention further includes a rectangular frame perpendicular to the operating platform. The second slide rail is disposed on the side of the rectangular frame parallel to the operating platform. The first slide rail is slidably connected to the second slide rail of the rectangular frame via the first slider, and is parallel to the plane of the rectangular frame and perpendicular to the second slide rail. The rectangular frame supports the first and second slide rails, and the rectangular frame is firmly fixed to the operating platform, ensuring their relative positions are fixed. This better guarantees the positional relationship between the slide rails and the operating platform, further ensuring a high-quality coupling process.

[0013] In some embodiments, the first slide rail further includes a limiting stage for limiting the sector block. The distance from the limiting stage to the operating platform is the sum of the shortest distance the sector block extends beyond the limiting stage along the first slide rail direction and the thickness of the scintillator and the chip. The design of the limiting stage ensures that the distance between the sector block and the operating platform is fixed, thereby ensuring that the pressure of the sector block on the scintillator is uniform and stable when the sector block rolls along the operating platform, thus ensuring the consistency of the bonding process quality.

[0014] In some embodiments, a suction cup is attached to the outside of the adsorption hole, and the outer edge of the suction cup gradually enlarges from the adsorption hole. The suction cup can enlarge the adsorption area of ​​the adsorption hole, thereby increasing the gripping area of ​​the scintillator, making the adsorption more stable, and providing a larger control area for the scintillator, which is more conducive to the control of the scintillator during the bonding process.

[0015] On the other hand, based on the above-mentioned device, the present invention also provides a method for coupling a detector chip, comprising: placing the chip flat on an operating platform; the control system controlling a plurality of the adsorption holes to generate negative pressure through a negative pressure generating device; using the negative pressure of the adsorption holes to adsorb the scintillator onto the arc surface of the sector block; the control system adjusting the position of the sector block so that it is above the chip; the control system controlling the slider to move downward along the first slide rail until the scintillator of the sector block contacts the operating platform; The control system controls the adsorption force of each adsorption hole through a preset control scheme, places the scintillator on the chip, and drives the slider to move along the second slide rail, so that the arc surface of the fan-shaped block rolls along the plane of the chip, so that the scintillator is in contact with the chip.

[0016] Furthermore, the present invention provides two different solutions for cases where there is one or two sector blocks, to meet different needs, as detailed below.

[0017] In some embodiments, the sector block is a single unit. The control system controls the adsorption force of each adsorption hole through a preset control scheme to place the scintillator on the chip. This includes: controlling the scintillator at one end of the arc surface of the sector block to contact the chip first; taking the straight line passing through the contact point and parallel to the rotation axis of the sector block as the origin, controlling the second slider to move along the second slide rail, so that the sector block rolls on the plane where the chip is located; when the second slider moves a distance L = nK + (n-1)R away from the origin, and the first adsorption hole to the (n-1)th adsorption hole are all in the closed state, reducing the adsorption force of the nth row of adsorption holes, and placing the scintillator on the chip; when the second slider moves a distance L = H away from the origin, the judgment is terminated, and the sector block is controlled to stop moving. Here, n is the sequence number of the row of adsorption holes corresponding to the distance L of the second slider from the origin, the sequence number is counted from the origin, K is the arc length between two adjacent rows of adsorption holes in cm, R is the diameter of the adsorption hole in mm, and H is the length of the scintillator in cm.

[0018] In some other embodiments, the sector blocks include sector block A and sector block B. The control system controls the adsorption force of each adsorption hole through a preset control scheme. Placing the scintillator on the chip includes: controlling the scintillator at the boundary line of sector block A and sector block B to contact the chip first; taking the boundary line between the contact surface of the two sector blocks and the plane where the chip is located as the origin, controlling the second slider A and the second slider B to move along the second slide rail, so that sector block A and sector block B roll away from the chip in the plane where the chip is located. When the second slider moves a distance L = nK + (n-1)R away from the origin. When the first adsorption hole to the (n-1)th adsorption hole are all closed, the adsorption force of the nth row of adsorption holes is reduced, and the scintillator is placed on the chip; when the second slider moves a distance L=Hm away from the origin, the judgment is terminated, and the sector block is controlled to stop moving, where n is the sequence number of the row of adsorption holes corresponding to the distance L of the second slider from the origin, the sequence number is counted from the origin, K is the arc length between two adjacent rows of adsorption holes, in cm, R is the diameter of the adsorption hole, in mm, m is the vertical distance from the axis of rotation of the sector block to the contact surface of the two sector blocks, in mm, and H is the length of the scintillator, in cm.

[0019] The control system drives the sector block, carrying the scintillator, to move to the appropriate position on the chip. During the scintillator coupling process, the system controls the horizontal rolling of the sector block and controls the corresponding adsorption holes to release the adsorption force on the scintillator when the sector block rolls to the corresponding position. This achieves the orderly release of the scintillator, thereby ensuring good coupling effect and coupling efficiency.

[0020] Furthermore, the control system controls the slider to move downward along the first slide rail until the scintillator contacts the operating platform, which includes the control system controlling the first slider to move downward along the first slide rail until the first slider contacts the limiting platform, then determining that the scintillator has contacted the operating platform. Attached Figure Description

[0021] The accompanying drawings, which are included to provide a further understanding of the invention and form part of this application, illustrate exemplary embodiments of the invention and, together with their description, serve to explain the invention and do not constitute an undue limitation thereof. In the drawings: Figure 1 This is a structural diagram of the device used for detector coupling in Embodiment 1 of the present invention; Figure 2 This is a partial detail view of the device for detector coupling in Embodiment 1 of the present invention; Figure 3 This is a diagram illustrating the implementation steps of the detector coupling method in Embodiment 1 of the present invention; Figure 4 This is a scintillator bonding control logic diagram of Embodiment 1 of the present invention; Figure 5 This is the scintillator bonding control logic diagram of Embodiment 2 of the present invention.

[0022] Wherein, 1-sector block A, 2-first slider A, 3-first slide rail A, 4-second slide rail, 5-second slider A, 6-sector block B, 7-first slider B, 8-first slide rail B, 9-second slider B, 10-rectangular frame, 11-moving platform, 12-operation panel, 13-operation handle, 14-operation button, 15-adsorption hole, 16-arc surface, 17-suction cup, 18-rotation axis, 19-chip, 20-scintillator, 21-vacuum pump, 22-vacuum tube. Detailed Implementation

[0023] In the coupling process of X-ray detectors, especially CMOS image sensor chips, it is necessary to couple a scintillator to the chip. The detector chip coupling device provided by this invention is used for grasping and coupling the scintillator. Using this device, the shape and placement of the scintillator can be precisely controlled when placing the cesium iodide screen (scintillator), ensuring that no air bubbles are generated between the scintillator and the colloid. To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to embodiments and accompanying drawings. The illustrative embodiments and descriptions of this invention are only for explaining the invention and are not intended to limit the invention.

[0024] It should be noted that, without conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments, which also fall within the scope of protection of this invention.

[0025] In the description of this invention, the following terms need to be explained: For directional terms, the terms "center," "lateral," "longitudinal," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise" used in the specification and claims of this application indicate the orientation and positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. They should not be construed as limiting the specific protection scope of the present invention.

[0026] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0027] The terms “comprising” and “having”, and any variations thereof, in the specification and claims of this application are intended to cover non-exclusive inclusion, for example, a process, method, system, product, or device that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such process, method, product, or device.

[0028] When an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or may have an intervening element present. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or may have an intervening element present. When an element is referred to as being "provided with" another element, it can be located on the surface or inside the element.

[0029] Unless otherwise expressly stated, throughout the specification and claims, the term "comprising" or its variations such as "including" or "comprises" shall be understood to include the stated elements or components without excluding other elements or other components.

[0030] In the specification and claims of this application, the term "electrical connection" can refer to a physical contact circuit connection, a communication connection, a wired communication connection, or a wireless communication connection.

[0031] The term "intelligent processing" in the specification and claims of this application can refer to image recognition, image correction, or both. The term "fan-shaped block" in the specification and claims of this application is not necessarily a standard fan shape. Due to the need for assembly, rolling, balance, and stability in actual operation, a "fan-shaped block" may be a block-like structure with two straight sides and an arc segment forming an approximate triangle; in this application, it is uniformly referred to as a "fan-shaped block."

[0032] Example 1

[0033] First, this embodiment provides a device for coupling a detector chip. The device includes a sector block, slide rails, a slider, an operating platform, and a control system. The operating platform is horizontal. The slide rails include a first slide rail and a second slide rail 4 that are perpendicular to each other. The planes containing the first and second slide rails 4 are both perpendicular to the operating platform, and the first and second slide rails 4 are perpendicular and parallel to the operating platform, respectively. The slider is slidably connected to the first and second slide rails 4 and can move along the first and second slide rails 4 under the control of the control system, thereby adjusting the horizontal and vertical distance between the sector block and the operating platform. The slider is slidably connected to the first and second slide rails 4, and the intersection of the first and second slide rails 4 can be designed as an interconnected cross structure. This allows a single slider to move along the first slide rail and at the cross intersection. The track is changed, and the movement enters the second slide rail 4. The sector block is rotatably connected to the slider via the rotating shaft 18, so that the sector block can rotate around the rotating shaft 18. The center of the sector block is located on the axis of the rotating shaft 18. Thus, when the sector block moves horizontally relative to the operating platform, the arc surface 16 of the sector block rolls along a plane parallel to the operating platform, similar to a wheel rolling on the ground. At this time, the distance between the axle and the ground remains unchanged, and it moves in a straight line in a direction parallel to the ground. Therefore, when the sector block moves horizontally relative to the operating platform, the rotating shaft 18 moves in a straight line in a direction parallel to the operating platform, just like an axle. The rotating shaft 18 is connected to the slider. As long as the second slide rail 4 is horizontal with the operating platform, it can be ensured that when the slider moves in the second slide rail 4, the sector block can make a stable rolling motion on the operating platform like a wheel.

[0034] In the above scheme, a single slider is used to move within the first and second slide rails 4. This requires the height of the second slide rail 4 from the operating platform or the size of the sector block to meet certain requirements to ensure a suitable distance between the sector block and the operating platform when the slider moves within the second slide rail 4. However, this structure has limited applicability, only suitable for applications where the total thickness of the chip 19 and scintillator 20 is a specific value. To overcome this problem, alternatively, in some embodiments, two sliders are used: a first slider and a second slider. The sector block is connected to the first slide rail via the first slider, and the first slide rail is connected to the second slide rail 4 via the second slider. By using the first and second sliders, the sector block can move within the first and second slide rails 4 respectively via the first and second sliders, making the movement of the sector block more flexible and diverse in both horizontal and vertical directions. This improves the flexibility of the scintillator 20 coupling process and enhances the coupling effect. For example, after the vertical position of the sector block is adjusted, if horizontal movement is required, there is no need to switch back to the second slide rail 4 through the cross intersection. The sector block can move horizontally directly within the second slide rail 4 at any position in the vertical direction via the second slider. This satisfies the diverse needs of the sector block's position and movement direction and is suitable for the coupling needs of various scintillators 20 or chips 19 with different thicknesses.

[0035] To achieve more flexible control over the coupling of the scintillator 20, in some embodiments, the sector blocks include sector block A1 and sector block B6, such as... Figure 1 As shown, the slide rail includes a first slide rail A3 and a first slide rail B8, the first slider includes a first slider A2 and a first slider B7, the second slider includes a second slider A5 and a second slider B9, the sector blocks A1 and B6 are respectively connected to the first slide rail A3 and the first slide rail B8 through the first slider A2 and the first slider B7, and are used to adjust the vertical distance between the sector blocks A1 and B6 and the operating platform; the first slide rail A3 and the first slide rail B8 are respectively connected to the second slide rail 4 through the second slider A5 and the second slider B9, and are used to adjust the horizontal distance between the sector blocks A1 and B6 and the operating platform. In actual product design, considering assembly space and part volume, the two sector blocks are connected to the slider via their respective rotation axes 18. Therefore, the centers of the two sector blocks cannot overlap. Consequently, in actual assembly and design, sector blocks A1 and B6 cannot fit together along the ideal sector radius. The shape of the sector blocks must be larger than the ideal sector centered on the rotation axis 18. Therefore, when the two sectors are joined together, the arc surfaces 16 of the two sectors cannot form an ideal arc, resulting in a slight indentation between them. Figure 4As shown, therefore, in the design, when designing the position of the second slider relative to the first slide rail, this factor should be considered to ensure that the distance from the lower edge of the first slider to the operating platform is the sum of the shortest distance of the sector block along the direction of the first slide rail beyond the lower edge of the first slider and the thickness of the scintillator 20 and the chip 19. This ensures that the shortest side at the connection of the two sector blocks can contact the chip 19, thereby preventing the generation of bubbles.

[0036] To further improve the coupling process quality, in some embodiments, the first slide rail further includes a limiting stage, which limits the sector block by limiting the lower edge of the first slider. The limiting stage design ensures a fixed distance between the sector block and the operating platform, thereby ensuring uniform and stable pressure on the scintillator 20 when the sector block rolls along the operating platform, thus guaranteeing consistent bonding process quality. Specifically, the distance from the limiting stage to the operating platform is the sum of the shortest distance the sector block extends beyond the limiting stage along the first slide rail direction and the thickness of the scintillator 20 and the chip 19.

[0037] Optionally, in some embodiments, the device further includes a rectangular frame 10 perpendicular to the operating platform. The second slide rail 4 is located on the side of the rectangular frame 10 parallel to the operating platform. The first slide rail is slidably connected to the second slide rail 4 of the rectangular frame 10 via the first slider, and is parallel to the plane of the rectangular frame 10 and perpendicular to the second slide rail 4. The rectangular frame 10 provides support for the first and second slide rails 4, and the rectangular frame 10 is firmly fixed to the operating platform, ensuring their relative positions are fixed. This better guarantees the positional relationship between the slide rails and the operating platform, further ensuring a high-quality coupling process. The rectangular frame 10 can be a gantry frame or other structures with a certain mechanical strength.

[0038] To achieve coupling of the scintillator 20, it is also necessary to achieve the grasping and release of the scintillator 20. Multiple adsorption holes 15 are provided at intervals on the arc surface 16 of the sector block along the rolling direction of the sector block. The adsorption holes 15 pass through the sector block and are connected to the corresponding negative pressure generating device through the vacuum tube 22. The control system can control the adsorption force of the adsorption holes 15. The adsorption holes 15 can be evenly arranged on the arc surface 16, generally in an intermittent manner. For example, along the rolling direction of the fan-shaped block, rows of adsorption holes 15 are arranged at intervals. There can be one or more adsorption holes 15 in a row. The negative pressure generating device can be any device that can generate negative pressure. In this embodiment, a vacuum pump 21 is selected. The adsorption holes 15 are connected to the vacuum pump 21 through a vacuum tube 22. One vacuum pump 21 is connected to one adsorption hole 15. Alternatively, one vacuum pump 21 can be connected to some or all of the adsorption holes 15 in a row. Or, one vacuum pump 21 can be connected to multiple rows of adsorption holes 15. Here, multiple rows of adsorption holes 15 are generally continuous to facilitate the release of scintillators 20 in the same area. The control system can control the pressure at the adsorption holes 15 by controlling the start and stop of each vacuum pump 21. Alternatively, an on / off valve or similar component that can cut off or open the vacuum can be provided on the adsorption holes 15 or the vacuum tube 22 connecting the vacuum pump 21 and the adsorption holes 15. Optionally, in some embodiments, a suction cup 17 is connected to the outside of the adsorption hole 15, and the outer edge of the suction cup 17 gradually enlarges from the adsorption hole 15, such as... Figure 2 As shown. The suction cup 17 enlarges the adsorption area of ​​the adsorption hole 15, thereby increasing the gripping area of ​​the scintillator 20, making the adsorption more stable, and providing a larger control area for the scintillator 20, which is more conducive to the control of the scintillator 20 during the bonding process. The suction cup 17 can be made of soft or elastic material, which can improve the stability of adsorption and is less likely to damage the scintillator 20.

[0039] In addition, for ease of use, a mobile platform 11 can be set on the operating platform. The mobile platform 11 can be electrically connected to the control system, enabling the mobile platform 11 to move on the operating platform. When the scintillator 20 is coupled, the chip 19 can be placed on the mobile platform 11. If necessary, the mobile platform 11 can be controlled to move horizontally relative to the operating platform. When the mobile platform 11 moves, the second slider can move along the second slide rail 4, allowing the sector block to roll in the opposite direction along the mobile platform 11 simultaneously. Alternatively, the second slider can remain stationary, and the sector block can roll relative to the mobile platform 11 under the action of friction during the movement of the mobile platform 11, thus achieving the adhesion of the scintillator 20. The design can be flexibly adapted to the actual scenario and requirements. Furthermore, for ease of operation, an operation panel 12 is provided in the corner of the operating platform, and operation buttons 14 are provided on the side. Various operations can also be achieved by connecting an operation handle 13.

[0040] In the above scheme, sector A is connected to the first slide rail A3 via the first slider A2, and the first slide rail A3 is connected to the second slide rail 4 via the second slider A5. Sector B is connected to the first slide rail B8 via the first slider B7, and the first slide rail B8 is connected to the second slide rail 4 via the second slider B9. This means that sector A1 and sector B6 are connected to the second slide rail 4 via their respective sets of slide rails and sliders, achieving their respective vertical and horizontal displacements. By adopting the above scheme, the scintillator 20 is automatically grasped through the adsorption holes 15 on the sector blocks and the negative pressure generating device. The control system enables the horizontal and vertical displacement and adjustment of the sector blocks, as well as the release of the scintillator 20. Simultaneously, the scintillator 20 is rolled on the horizontal surface of the sector blocks, compacting it and expelling air between the scintillator 20 and the chip 19, preventing air bubbles from forming. Please refer to [reference needed]. Figure 3 The specific method for coupling the scintillator 20 by the device is as follows: (1) Place the chip 19 that needs to be coupled to the scintillator 20 flat on the operating platform, generally in the center of the operating platform, and adjust the operating platform to be horizontal and stable without shaking. (2) The control system controls multiple adsorption holes 15 to generate negative pressure through a negative pressure generating device; generally, in order to fully and stably grasp the scintillator 20, the vacuum pumps 21 of all adsorption holes 15 are turned on. (3) Align the two sector blocks along the straight edge and make them as close as possible, aligning the two ends and the front and back, so that they become a large sector block as a whole. Then unfold the scintillator 20 and adsorb it onto the arc surface 16 of the large sector block. Use the negative pressure of the adsorption hole 15 to adsorb the scintillator 20 onto the arc surface 16 of the large sector block. (4) The control system adjusts the position of the large sector block so that it is above the chip 19. This step can be done by adjusting the large sector block above the operating platform at the beginning, before adsorbing the scintillator 20, or by adjusting the position after adsorption. (5) The control system controls the first slider to move downward along the first slide rail until the fan-shaped block scintillator 20 contacts the operating platform. Here, the two fan-shaped blocks can be controlled together as a large fan-shaped block to descend to a suitable height first, or one side of the fan-shaped block can be controlled to descend first, and then the other fan-shaped block can be controlled to descend. Preferably, the two are combined into a large fan-shaped block and descended together to a suitable position, and then they are attached. The scintillator 20 directly below the arc surface of the large fan-shaped block contacts the chip 19 first, and is attached from the middle to both sides. That is, the scintillator 20 at the junction line between the bottom ends of the two fan-shaped blocks contacts the chip 19 first. Generally, the two fan-shaped blocks are symmetrically designed. When descending, under the action of gravity, the junction line between the bottom ends of the two fan-shaped blocks will generally be located at the lowest point of the large fan-shaped block and will contact the chip 19 first. Of course, this is not limited to this method. Other positions can also contact the chip 19 first. It can be flexibly designed according to actual needs. (6) The control system controls the adsorption force of each adsorption hole 15 through a preset control scheme, places the scintillator 20 on the chip 19, and drives the slider to move along the second slide rail 4, so that the arc surface 16 of the fan-shaped block rolls along the plane of the chip 19, so that the scintillator 20 is in contact with the chip 19.

[0041] Specifically, during descent, under the influence of gravity, the boundary line between the bottom edges of the two sector blocks is generally located at the lowest point of the larger sector block, and will be the first to contact chip 19. That is, the scintillator 20 directly below the arc surface of the larger sector block will contact chip 19 first. At this time, the first slider A2 and the first slider B7 both reach their respective limit blocks. Then, the control system controls the first slider A2 and the first slider B7 to stop and begin attaching from the middle to both sides. At this time, it is possible to start attaching from one end of one of the sector blocks. Specifically, taking the right sector block A1 as an example, with the straight line passing through the contact point between the scintillator 20 and the chip 19 and parallel to the rotation axis 18 of the sector block as the origin, the second slider A5 is controlled to move along the second slide rail 4, so that sector block A1 rolls in the plane where chip 19 is located, that is, it rolls to the right. When sector block A1 rolls to the corresponding position, the adsorption hole 15 at the corresponding position is controlled to release the adsorption force on the scintillator 20, so as to achieve the orderly release of the scintillator 20, thereby ensuring good coupling effect and coupling efficiency. The specific control logic follows the following formula: when the second slider A5 moves a distance L = nK + (n-1)Rm away from the origin, and the first adsorption hole 15 to the (n-1)th adsorption hole 15 are all closed, the adsorption force of the nth row of adsorption holes 15 is reduced, and the scintillator 20 is placed on the chip 19; when the second slider moves a distance L = Hm away from the origin, the judgment is terminated, and the fan block A1 is controlled to stop moving, where n is the sequence number of the row of adsorption holes 15 corresponding to the distance L from the origin of the second slider, the sequence number is counted from the origin, K is the arc length between two adjacent rows of adsorption holes 15, in cm, R is the diameter of the adsorption hole 15, in mm, m is the vertical distance from the axis of rotation 18 of fan block A1 to the contact surface of the two fan blocks, in mm, and H is the length of the scintillator 20, in cm.

[0042] Specifically, such as Figure 4 As shown, taking the left end of sector A1 as an example, The condition for vacuum closure of the first adsorption hole 15 on the right is: the sector block A1 moves a distance L1 = Km to the right; The condition for vacuum closure of the second adsorption hole 15 on the right is: the sector block A1 moves to the right by a distance L2 = L1 + K + R = 2K + Rm, and the first adsorption hole 15 on the right is in a closed state. The condition for vacuum closure of the third adsorption hole 15 on the right is: the sector block A1 moves to the right by a distance L3 = L2 + K + R = 3K + 2R - m, and the first and second adsorption holes 15 on the right are in the closed state. The condition for vacuum closure of the fourth adsorption hole 15 on the right is: the sector block A1 moves to the right by a distance L4 = L3 + K + R = 4K + 3R - m, and the first to third adsorption holes 15 on the right are all in the closed state. By analogy, it can be seen that the second slider A5 moves a distance L = nK + (n-1)Rm away from the origin, and the condition for the nth adsorption hole 15 to close is that the first n-1 adsorption holes 15 are all closed. When sector block A1 moves a total distance L=H / 2-m to the right, the judgment is terminated and sector block A1 is stopped moving. H is the length of the scintillator.

[0043] During coupling, both sides can be attached simultaneously, or the control system can control sector block B6 to begin attaching the left half of the scintillator 20 after sector block A1 has completed the attachment of the right half. Specifically, the control system drives the second slider B9 to move to the left along the second slide rail 4, using sector block B6 to complete the attachment of the left half of the scintillator 20. To prevent air bubbles from forming in the scintillator 20 at the seam between the two sector blocks, in actual operation, sector block B6 can be moved to the right a suitable distance first, so that the initial attachment position of sector block B6 covers the right side of the origin. This can completely eliminate air bubbles at the seam and improve coupling quality.

[0044] By using two sector blocks, the scintillator 20 can be coupled in a localized area according to requirements, or half of the scintillator 20 can be bonded first and then the other half can be bonded in the designed order when coupling the whole scintillator 20. This helps to improve bonding efficiency and quality, reduce the generation of air bubbles, and reduce the difficulty of direct coupling of the whole scintillator 20. The advantages of this solution are more prominent, especially for scintillators 20 with a large area.

[0045] For the control scheme of the control system when the scintillator 20 is coupled, the control scheme will be slightly different depending on the structural design of the device.

[0046] Example 2

[0047] Example 2 is based on Example 1, with slight adjustments to the device structure. Example 2 uses a large, single, integral sector-shaped block. When the sector-shaped block is a single, integral block, its center is located on the axis of rotation 18. Figure 5 As shown, the problem of the two sector blocks not being concentric with the rotation axis 18, as in Example 1, does not exist. However, the coupling process of the scintillator 20 differs slightly from that in Example 1, as detailed below: Place the chip 19 that needs to be coupled to the scintillator 20 flat on the operating platform, generally in the center of the operating platform, and adjust the operating platform to be horizontal and stable without shaking. The control system controls multiple adsorption holes 15 to generate negative pressure through a negative pressure generating device; generally, in order to fully and stably grasp the scintillator 20, the vacuum pump 21 of all adsorption holes 15 is turned on. Using the negative pressure of the adsorption hole 15, the scintillator 20 is adsorbed onto the arc surface 16 of the sector block; The control system adjusts the position of the sector block so that it is above the chip 19; this step can be done by adjusting the sector block above the operating platform at the beginning, before adsorbing the scintillator 20, or by adjusting the position after it has been adsorbed. The control system controls the slider to move downward along the first slide rail until the fan-shaped block scintillator 20 contacts the operating platform. It is possible that the scintillator 20 at one end of the fan-shaped block contacts the chip 19 first, that is, the contact starts from one end of the fan-shaped block. Alternatively, the scintillator 20 directly below the arc surface of the fan-shaped block contacts the chip 19 first, and the contact starts from the middle and moves to both sides. It is also possible that other positions contact first. The design can be flexibly adjusted according to actual needs. The control system controls the adsorption force of each adsorption hole 15 through a preset control scheme, places the scintillator 20 on the chip 19, and drives the slider to move along the second slide rail 4, so that the arc surface 16 of the fan-shaped block rolls along the plane of the chip 19, so that the scintillator 20 is in contact with the chip 19.

[0048] The aforementioned control system controls the adsorption force of each adsorption hole 15 through a preset control scheme, placing the scintillator 20 onto the chip 19. This includes controlling the scintillator 20 at one end of the arc surface 16 of the sector block to contact the chip 19 first, that is, starting from one end of the arc surface 16. Specifically, taking the straight line passing through the contact point and parallel to the rotation axis 18 of the sector block as the origin, the control system controls the second slider to move along the second slide rail 4, causing the sector block to roll in the plane where the chip 19 is located. The control system drives the sector block, carrying the scintillator 20, to move towards the chip 19 to a suitable position, and controls the horizontal rolling of the sector block during the coupling process of the scintillator 20. When the sector block rolls to the corresponding position, the control system controls the corresponding adsorption hole 15 to release the adsorption force on the scintillator 20, thereby achieving the orderly release of the scintillator 20 and ensuring good coupling effect and coupling efficiency. The specific control logic follows the following formula: when the second slider moves a distance L = nK + (n-1)R away from the origin, and the first adsorption hole 15 to the (n-1)th adsorption hole 15 are all in the closed state, the adsorption force of the nth row of adsorption holes 15 is reduced, and the scintillator 20 is placed on the chip 19; when the second slider moves a distance L = Hm away from the origin, the judgment is terminated, and the fan-shaped block is controlled to stop moving, where n is the sequence number of the row of adsorption holes 15 corresponding to the distance L from the origin of the second slider, the sequence number is counted from the origin, K is the arc length between two adjacent rows of adsorption holes 15, in cm, R is the diameter of the adsorption hole 15, in mm, and H is the length of the scintillator, in cm.

[0049] Specifically, such as Figure 5 As shown, taking the left end of the sector block as an example, The condition for vacuum closure of the first adsorption hole 15 on the right is: the sector block moves a distance L1 = K to the right; The condition for vacuum closure of the second adsorption hole 15 on the right is: the sector block moves to the right by a distance L2 = L1 + K + R = 2K + R, and the first adsorption hole 15 on the right is closed. The condition for vacuum closure of the third adsorption hole 15 on the right is: the sector block moves to the right by a distance L3 = L2 + K + R = 3K + 2R, and the first and second adsorption holes 15 on the right are in the closed state. The condition for vacuum closure of the fourth adsorption hole 15 on the right is: the sector block moves to the right by a distance L4 = L3 + K + R = 4K + 3R, and the first to third adsorption holes 15 on the right are all in the closed state. By analogy, it can be seen that the second slider moves a distance L = nK + (n-1)R away from the origin, and the condition for the nth adsorption hole 15 to close is that the first n-1 adsorption holes 15 are all closed. When the sector block moves a total distance L=H to the right, the judgment is terminated and the sector block is stopped moving. H is the length of the scintillator 20.

[0050] In the description of this invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this invention, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention.

[0051] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features, and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A device for coupling a detector chip, characterized in that, The system includes a sector block, a slide rail, a slider, an operating platform, and a control system. The slide rail includes a first slide rail and a second slide rail that are perpendicular to each other. The first slide rail and the second slide rail are perpendicular to and parallel to the operating platform, respectively. The sector block is rotatably connected to the slider via a rotating shaft, and the center of the sector block is located on the axis of the rotating shaft. The slider is slidably connected to the first slide rail and the second slide rail, and can move along the first slide rail and the second slide rail under the control of the control system, thereby adjusting the horizontal and vertical distance between the sector block and the operating platform. When the sector block moves horizontally relative to the operating platform, the arc surface of the sector block can roll along a plane parallel to the operating platform. The arc surface of the sector block is provided with a plurality of adsorption holes at intervals along the rolling direction of the sector block. The adsorption holes penetrate the sector block and are connected to the corresponding negative pressure generating device. The control system can control the adsorption force of the adsorption holes.

2. The apparatus for coupling a detector chip according to claim 1, characterized in that, The slider includes a first slider and a second slider. The sector block is connected to the first slide rail via the first slider, and the first slide rail is connected to the second slide rail via the second slider.

3. The apparatus for coupling a detector chip according to claim 2, characterized in that, The sector block includes sector block A and sector block B, the slide rail includes first slide rail A and first slide rail B, the first slider includes first slider A and first slider B, the second slider includes second slider A and second slider B, and sector block A and sector block B are respectively connected to first slide rail A and first slide rail B through first slider A and first slider B, for adjusting the vertical distance between sector block A and sector block B and the operating platform; The first slide rail A and the first slide rail B are respectively connected to the second slide rail via the second slider A and the second slider B, and are used to adjust the horizontal distance between the sector block A and the sector block B and the operating platform.

4. The apparatus for coupling a detector chip according to claim 2 or 3, characterized in that, It also includes a rectangular frame perpendicular to the operating platform. The second slide rail is located on the side of the rectangular frame parallel to the operating platform. The first slide rail is slidably connected to the second slide rail of the rectangular frame through the first slider, and is parallel to the plane where the rectangular frame is located and perpendicular to the second slide rail.

5. The apparatus for coupling a detector chip according to claim 1, characterized in that, The first slide rail further includes a limiting platform for limiting the sector block. The distance from the limiting platform to the operating platform is the sum of the shortest distance the sector block extends beyond the limiting platform along the first slide rail direction and the thickness of the scintillator and the chip.

6. The apparatus for coupling a detector chip according to claim 1, characterized in that, A suction cup is connected to the outside of the adsorption hole, and the outer edge of the suction cup gradually enlarges from the adsorption hole.

7. A method for coupling a detector chip, implemented based on the apparatus described in claims 1 to 6, characterized in that, include: Place the chip flat on the operating platform; The control system controls multiple adsorption holes to generate negative pressure via a negative pressure generating device. The scintillator is adsorbed onto the arc surface of the sector block by utilizing the negative pressure of the adsorption hole; The control system adjusts the position of the sector block so that it is positioned above the chip; The control system controls the slider to move downward along the first slide rail until the fan-shaped flashing element contacts the operating platform; The control system controls the adsorption force of each adsorption hole through a preset control scheme, places the scintillator on the chip, and drives the slider to move along the second slide rail, so that the arc surface of the fan-shaped block rolls along the plane of the chip, so that the scintillator is in contact with the chip.

8. The method for coupling a detector chip according to claim 7, characterized in that, The sector-shaped block is one unit. The control system controls the adsorption force of each adsorption hole through a preset control scheme, placing the scintillator on the chip, including: The scintillator at one end of the arc surface of the sector block contacts the chip first. Taking the straight line passing through the contact point and parallel to the rotation axis of the sector block as the origin, the second slider is controlled to move along the second slide rail, so that the sector block rolls on the plane where the chip is located. When the second slider moves a distance L=nK+(n-1)R away from the origin, and the first adsorption hole to the (n-1)th adsorption hole are all in the closed state, the adsorption force of the nth row of adsorption holes is reduced, and the scintillator is placed on the chip. When the second slider moves a distance L=H away from the origin, the judgment is terminated and the sector block is stopped. Here, n is the sequence number of the row of adsorption holes when the second slider is L away from the origin, and the sequence number is counted from the origin. K is the arc length between two adjacent rows of adsorption holes in cm. R is the diameter of the adsorption hole in mm. H is the length of the scintillator in cm.

9. The method for coupling a detector chip according to claim 7, characterized in that, The sector-shaped blocks include sector-shaped block A and sector-shaped block B. The control system controls the adsorption force of each adsorption hole through a preset control scheme, placing the scintillator on the chip, including: The scintillator at the boundary between sector A and sector B contacts the chip first. Taking the boundary between the contact surface of the two sector blocks and the plane where the chip is located as the origin, the second slider A and the second slider B are controlled to move along the second slide rail, so that sector A and sector B roll away from the chip in the plane. When the second slider moves a distance L = nK + (n-1)Rm away from the origin, and the first adsorption hole to the (n-1)th adsorption hole are all closed, the adsorption force of the nth row of adsorption holes is reduced, and the scintillator is placed on the chip. When the second slider moves a distance L = Hm away from the origin, the judgment is terminated, and the sector blocks are controlled to stop moving. Wherein, n is the sequence number of the row of adsorption holes when the distance between the second slider and the origin is L, the sequence number is counted from the origin, K is the arc length between two adjacent rows of adsorption holes, in cm, R is the diameter of the adsorption hole, in mm, m is the vertical distance from the center of the rotation axis of the sector block to the contact surface of the two sector blocks, in mm, and H is the length of the scintillator, in cm.

10. The method for coupling a detector chip according to claim 8 or 9, characterized in that, The control system controls the slider to move downward along the first slide rail until the scintillator contacts the operating platform, which includes controlling the first slider to move downward along the first slide rail until the first slider contacts the limiting table, and then determining that the scintillator is in contact with the operating platform.

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