Display module and display device

Abstract

This application discloses a display module and a display device. The display module includes: at least one display unit, the display unit including a substrate, the substrate including a first surface and a second surface opposite to each other, the second surface including an exposed first conductive region; a support structure, the support structure being fixedly connected to the second surface of the display unit; the surface of the support structure facing the display unit includes an exposed second conductive region, the second conductive region being connected to the first conductive region through an electrical adhesive layer, thereby controlling the adhesion of the electrical adhesive layer by controlling the voltage difference across the two sides of the electrical adhesive layer, realizing the fixation and separation of the display unit and the support structure, and reducing the subsequent maintenance cost of the display module.

Description

Technical Field

[0001] This application relates to the field of display technology, and more particularly to a display module and a display device. Background Technology

[0002] In recent years, Micro LED display technology has rapidly penetrated the high-end commercial display and near-eye display fields due to its advantages such as high brightness, high contrast, and long lifespan, becoming one of the mainstream development directions for display modules. Currently, display modules typically consist of a support structure and display units fixed to the support structure. How to achieve the fixation and separation between the support structure and the display units to reduce the subsequent maintenance costs of the display module has become one of the research directions for those skilled in the art. Summary of the Invention

[0003] In view of the above problems, this application provides a display module and a display device to reduce the subsequent maintenance cost of the display module. The specific solution is as follows:

[0004] A display module, comprising:

[0005] At least one display unit, the display unit including a substrate, the substrate including opposing first and second surfaces, the second surface including an exposed first conductive region;

[0006] A support structure is fixedly connected to the second surface of the display unit;

[0007] The surface of the support structure facing the display unit includes an exposed second conductive region, which is connected to the first conductive region by an electrical adhesive layer.

[0008] A display device includes the above-described display module.

[0009] In the display module provided in this application embodiment, the first conductive area and the second conductive area are connected by an electrical adhesive layer. Therefore, when the display unit in the subsequent display module is damaged, a voltage signal can be applied to the electrical adhesive layer corresponding to the display unit to reduce the adhesiveness of the electrical adhesive layer corresponding to the display unit, so that the display unit can be separated from the support structure. This realizes the separation of the display unit and the support structure in the display module, and facilitates the maintenance of the display module when the display unit is damaged. Attached Figure Description

[0010] The above and other features, advantages, and aspects of the embodiments of this disclosure will become more apparent from the accompanying drawings and the following detailed description. Throughout the drawings, the same or similar reference numerals denote the same or similar elements. It should be understood that the drawings are schematic, and the originals and elements are not necessarily drawn to scale.

[0011] Figure 1 This application provides a partial structural schematic diagram of a display module.

[0012] Figure 2 for Figure 1 The image shown is a top view of the second surface of the substrate in the display module;

[0013] Figure 3 A partial structural schematic diagram of the display unit in a display module provided in this application;

[0014] Figure 4 This application provides a partial structural diagram of the support structure in a display module.

[0015] Figure 5 A partial structural schematic diagram of another display module provided in this application;

[0016] Figure 6 A partial structural schematic diagram of another display module provided in this application;

[0017] Figure 7 A partial structural schematic diagram of another display module provided in this application;

[0018] Figure 8 A partial structural schematic diagram of another display module provided in this application;

[0019] Figure 9 A partial structural schematic diagram of another display module provided in this application;

[0020] Figure 10 for Figure 8 A partial structural diagram including the support structure, drive circuit board, and electrical adhesive layer;

[0021] Figure 11 A partial structural schematic diagram of another display module provided in this application;

[0022] Figure 12 A partial structural schematic diagram of another display module provided in this application;

[0023] Figure 13 A schematic diagram of the electrical connection between the conductor of the first conductive region and the first connector in another display module provided in this application;

[0024] Figure 14 A schematic diagram of the electrical connection between the conductor of the first conductive region and the first connector in another display module provided in this application;

[0025] Figure 15 for Figure 3A magnified view of a portion of region A in the middle;

[0026] Figure 16 for Figure 3 Another magnified view of region A in the middle;

[0027] Figure 17 for Figure 1 A magnified view of a portion of region D in the middle;

[0028] Figure 18 To display the corresponding module Figure 15 A magnified view of the location;

[0029] Figure 19 A partial structural schematic diagram of another display module provided in this application;

[0030] Figure 20 A top view of the second surface of the substrate in a display module provided in another embodiment of this application;

[0031] Figure 21 A top view of the second surface of the substrate in a display module provided in yet another embodiment of this application;

[0032] Figure 22 A top view of the second surface of the substrate in a display module provided in another embodiment of this application;

[0033] Figure 23 This is a top view of a display device provided in one embodiment of this application;

[0034] Figure 24 This is a top view of a display device provided in another embodiment of this application. Detailed Implementation

[0035] The embodiments of this application will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0036] Various modifications and variations can be made to this application without departing from its spirit or scope, which will be apparent to those skilled in the art. Therefore, this application is intended to cover modifications and variations falling within the scope of the corresponding claims (the claimed technical solutions) and their equivalents. It should be noted that the implementation methods provided in the embodiments of this application can be combined with each other without contradiction.

[0037] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0038] As described in the background section, how to achieve the fixation and separation between the support structure and the display unit in order to reduce the subsequent maintenance cost of the display module has become one of the research directions for those skilled in the art.

[0039] In view of this, embodiments of this application provide a display module, such as... Figure 1 and Figure 2 As shown, the display module includes:

[0040] At least one display unit 100, such as Figure 1 and Figure 3 As shown, the display unit 100 includes a substrate 10, which includes a first surface and a second surface facing each other, and the second surface of the substrate 10 includes an exposed first conductive region 12.

[0041] Support structure 20, such as Figure 1 and Figure 4 As shown, the support structure 20 is fixedly connected to the second surface of the display unit 100. The surface of the support structure 20 facing the display unit 100 includes an exposed second conductive region 21. The second conductive region 21 and the first conductive region 12 are connected by an electrical adhesive layer 30.

[0042] Optionally, in one embodiment of this application, the following continues... Figure 1 and Figure 3 As shown, a light-emitting device layer 11 is provided on the first surface of the substrate 10. The light-emitting device layer 11 includes periodically arranged red light-emitting units, green light-emitting units and blue light-emitting units, so that the display unit can realize color display. However, this application does not limit this and it depends on the specific situation.

[0043] In the display module provided in this application embodiment, the first conductive region 12 and the second conductive region 21 are connected by an electrical adhesive layer 30. Therefore, when the display unit 100 in the subsequent display module is damaged, a voltage signal can be applied to the electrical adhesive layer 30 corresponding to the display unit 100 to reduce the adhesiveness of the electrical adhesive layer 30 corresponding to the display unit 100, so that the display unit 100 can be separated from the support structure 20. This realizes the separation of the display unit 100 and the support structure 20 in the display module, thereby facilitating the fixing and separation of the display unit 100 and the support structure 20 in the display module, and further facilitating the maintenance of the subsequent display module.

[0044] Optionally, in one embodiment of this application, the adhesiveness of the electrical adhesive layer 30 between the first conductive region 12 and the second conductive region 21 decreases as the voltage difference between the voltage signals applied to both sides of the electrical adhesive layer 30 increases. That is, the adhesiveness of the electrical adhesive layer 30 used to connect the first conductive region 12 and the second conductive region 21 decreases as the voltage difference between the conductor in the first conductive region 12 and the conductor in the second conductive region 21 increases. Thus, when the display unit 100 in the display module is damaged, the adhesiveness of the electrical adhesive layer 30 between the damaged display unit 100 and the support structure 20 can be reduced by increasing the voltage difference applied to both sides of the electrical adhesive layer 30 used to bond the damaged display unit 100 and the support structure 20, so that the damaged display unit 100 can be separated from the support structure 20.

[0045] Optionally, in one embodiment of this application, the electrical adhesive layer is an electro-adhesive tape. It should be noted that an electro-adhesive tape (also known as an electro-adhesive tape or an electro-controlled tape) is a smart tape that uses an electric field or current to actively, quickly, and reversibly reduce its surface tackiness, and has the following characteristics:

[0046] 1. When a specific voltage (usually DC or low-frequency AC) is applied, the adhesion between the electro-adhesive tape and the contact surface will be significantly reduced ("reduced adhesion" or "de-adhesion"). After the voltage is removed, the adhesion will quickly return to the initial level.

[0047] 2. Rapid response: Changes in adhesion typically occur within milliseconds to seconds, resulting in a very rapid response;

[0048] 3. Reversibility: The adhesion state (on / off) can be switched cyclically an unlimited number of times by applying / removing voltage;

[0049] 4. No residue separation: When separating objects under energized (anti-adhesion) conditions, almost no adhesive residue or residue is left on the contact surface;

[0050] 5. Adjustable adhesion: The degree of reduction in adhesion can usually be controlled to some extent by adjusting the voltage. The higher the voltage, the greater the reduction in adhesion (the stronger the de-adhesion effect).

[0051] 6. Low power consumption: It only consumes electrical energy when switching states (applying voltage). Once de-adhesion or restoration of adhesion is completed, it usually does not require continuous power supply when maintaining the adhesive or non-adhesive state (due to electrostatic retention effect or the properties of the material itself), which makes it very energy-efficient.

[0052] 7. Gentle gripping and release: It uses surface adhesion to grip objects with very low and uniform contact stress, making it particularly suitable for gripping fragile, soft, thin, and irregularly shaped objects (such as chips, glass, biological samples, and thin sheet materials), avoiding the damage or deformation that may be caused by traditional mechanical grippers; the release process is also gentle, with the adhesive being "shut down" instantly by electronic control, without the need for strong peeling.

[0053] Therefore, the display module provided in this application embodiment uses the electrical adhesive layer 30 to fix and separate the display unit 100 and the support structure 20, which has advantages such as fast response speed, low power consumption, reusability, and gentle separation process without residue, so as not to damage the display unit.

[0054] It should be noted that, in this embodiment, the display module may include a display unit 100, and so on. Figure 1 As shown, it may also include at least two display units 100, such as Figure 5 As shown, this application does not impose any limitations on this, and the specifics depend on the circumstances. It should also be noted that when the display module includes at least two display units 100, the different display units 100 are fixed on the same support structure 20.

[0055] When a display module includes at least two display units 100, it is inevitable that some display units 100 will be damaged during actual use. In the display module provided in this application embodiment, the first conductive area 12 and the second conductive area 21 are connected by an electrical adhesive layer 30. Thus, when a local display unit 100 in the display module is damaged, a voltage signal can be applied to the electrical adhesive layer 30 corresponding to the display unit 100 at the target position to reduce the adhesiveness of the electrical adhesive layer 30 corresponding to the display unit 100 at the target position, so that the display unit 100 at the target position can be separated from the support structure 20. This achieves precise separation of the local display unit 100 in the display module without affecting the bonding state of other display units 100, thereby facilitating the replacement of the local display unit 100 in the display module. In this way, when a local display unit 100 is damaged, the local display unit 100 can be precisely replaced without replacing the entire display module, resulting in lower subsequent maintenance costs.

[0056] Moreover, the display module provided in this application embodiment uses an electrical adhesive layer 30 to separate the display unit 100 and the support structure 20, eliminating the need for physical pulling space and meeting the design requirements of small-size, high-precision display modules.

[0057] Based on the above embodiments, in one embodiment of this application, the following continues... Figure 5As shown, when the display module includes multiple display units 100, the size of the display module is relatively large. Different electrical adhesive layers 30 need to share a common ground with the power supply. In order to simplify the design of the conductor of the first conductive region 12 and the conductor of the second conductive region 21 used to provide voltage signals to the electrical adhesive layer 30, the conductor of the first conductive region 12 is used to provide voltage signals to the electrical adhesive layer 30, and the conductor of the second conductive region 21 is used to provide ground signals to the electrical adhesive layer 30.

[0058] It should be noted that under a certain voltage, the negative electrode of the electrical adhesive layer 30 will become less sticky and separate. In this embodiment, the conductor of the first conductive region 12 serves as the positive electrode of the electrical adhesive layer 30, which is used to provide a voltage signal to the electrical adhesive layer 30. The conductor of the second conductive region 21 serves as the negative electrode of the electrical adhesive layer 30, which is used to provide a ground signal to the electrical adhesive layer 30. This also facilitates the reduction of the adhesiveness of the electrical adhesive layer 30 after the conductor of the first conductive region 12 is energized, allowing the display unit 100 to separate from the support structure 20. The electrical adhesive layer 30 and the display unit 100 are then separated from the support structure 20 and removed.

[0059] Based on any of the above embodiments, in one embodiment of this application, such as Figure 6 and Figure 7 As shown, the second surface of the substrate 10 further includes a third conductive region 17, which is used to transmit driving signals to the display unit 100. Specifically, in one embodiment of this application, continuing as... Figure 6 As shown, the conductor of the third conductive region 17 and the conductor of the first conductive region 12 are located in the same film layer; in another embodiment of this application, the following continues... Figure 7 As shown, the conductor of the third conductive region 17 is located on the side of the conductor of the first conductive region 12 away from the second surface of the substrate 10.

[0060] Optionally, in one embodiment of this application, the substrate 10 is a PCB board, which has multiple circuit layers. The multiple circuit layers include a first circuit layer closest to the second surface. At least a portion of the conductors in the first circuit layer constitute a first conductive region. That is, in this embodiment, the first conductive region is at least a portion of the conductor region in the first circuit layer closest to the second surface of the PCB board. It should be noted that a PCB (Printed Circuit Board) is an important electronic component, serving as the support for electronic components and the carrier for the electrical interconnection of electronic components.

[0061] Optionally, in one embodiment of this application, the following continues... Figure 7As shown, the area containing all conductors in the first circuit layer is the first conductive region 12. That is, in this embodiment, the conductors in the first circuit layer are only used to provide voltage signals to the electrical adhesive layer 30. The conductors in the first conductive region 12 and the conductors in the third conductive region 17 are located in different film layers. In actual manufacturing, an additional circuit layer needs to be added on the basis of the original PCB structure as the first circuit layer to provide voltage signals to the electrical adhesive layer 30. In another embodiment of this application, the process continues as follows: Figure 6 As shown, a portion of the conductor region in the first circuit layer is the first conductive region 12. In this embodiment, the conductors of the first conductive region 12 and the conductors of the third conductive region 17 are located in the same film layer. That is, in this embodiment, a portion of the conductor region in the first circuit layer is the first conductive region 12, which is used to provide voltage signals to the electrical adhesive layer 30, and a portion of the conductor region is the third conductive region 17, which is used to transmit drive signals to the display unit 100. In specific manufacturing, the display module reuses the circuit layer closest to its second surface in the original PCB board structure, and uses a portion of the conductors therein to provide voltage signals to the electrical adhesive layer 30.

[0062] It should be noted that, in one embodiment of this application, each circuit layer in the PCB board is a copper circuit layer, and the first conductive region is at least a portion of the copper leakage area on the second surface of the substrate. Considering that the copper leakage on the PCB board is generally connected to the ground signal GND in the display module, and to avoid electrostatic discharge and the influence of external electric fields, in an optional embodiment of this application, the conductor in the first conductive region is connected to the ground signal on the substrate when the substrate is manufactured and there is no signal input. When it is necessary to de-adhede the electrical adhesive layer, the conductor in the first conductive region is electrically connected to the voltage signal to be input, thus initiating the de-adhesion process of the electrical adhesive layer. However, this application does not limit this and depends on the specific circumstances.

[0063] The above embodiments describe the display module using a PCB board as the substrate. In other embodiments of this application, the substrate may also be a glass substrate. The following describes the case where the substrate is a glass substrate.

[0064] In another embodiment of this application, the following continues... Figure 6 As shown, the substrate 10 is a glass substrate. In this embodiment, the conductors of the first conductive region 12 and the conductors of the third conductive region 17 are located in the same film layer. For example, the second surface of the glass substrate has a second circuit layer, and the area where some conductors in the second circuit layer are located is the first conductive region 12, and the area where some conductors are located is the third conductive region 17.

[0065] Optionally, in one embodiment of this application, when the substrate is a PCB board, the display module is a display module manufactured using COB technology, and the substrate is a substrate manufactured using PCBA technology; when the substrate is a glass substrate, the display module is a display module manufactured using COG technology, but this application does not limit this, and it depends on the specific circumstances. It should be noted that PCBA (Printed Circuit Board Assembly) is the manufacturing process of a printed circuit board assembly, including the soldering and assembly of electronic components on a PCB substrate to form the core functional modules of the display module. Specifically, a PCB is usually a bare board without installed components, serving the basic function of an electrical connection carrier, while a PCBA is a functional module after the components have been soldered.

[0066] It should also be noted that COB (Chip on Board, fixing the chip on the interconnect substrate) and COG (Chip on Glass, fixing the chip on the glass substrate) technologies can achieve ultra-high pixel density and seamless splicing, which is beneficial for this display module to be used as a large-size splicing display device (such as a command center giant screen) and a micro display device (such as AR / VR device).

[0067] Based on any of the above embodiments, in one embodiment of this application, such as Figure 8 As shown, the display module also includes:

[0068] The driving circuit board 40 is fixedly connected to the support structure 20 and is used to provide driving signals to the display unit 100 and control the display state of the display unit 100.

[0069] The first connector 51 is located on the second side of the substrate 10 and is electrically connected to the conductor of the third conductive region of the substrate 10.

[0070] The second connector 52 is located on the side of the drive circuit board 40 facing the display unit 100 and is electrically connected to the drive circuit board 40.

[0071] It should be noted that in this embodiment, the second connector 52 is also electrically connected to the first connector 51. That is, in this embodiment, the drive circuit board 40 is electrically connected to the third conductive area on the substrate 10 through the second connector 52 and the first connector 51 in sequence.

[0072] Based on the above embodiments, in one embodiment of this application, the substrate 10 is a glass substrate. Since a conductor layer can only be formed on the first and second surfaces of a glass substrate, and cannot be formed inside, the number of signal lines that can be formed is limited. Therefore, in this embodiment of the application, as... Figure 9As shown, the display module also includes an adapter board 41. One side of the adapter board 41 is electrically connected to the drive circuit board 40, and the other side is electrically connected to at least one display unit 100, for realizing the electrical connection between the drive circuit board 40 and the display unit 100. It should be noted that, in this embodiment, when the display module includes multiple display units 100, the adapter board 41 can realize signal transmission between different display units 100. It should also be noted that, in this embodiment, when the display module includes multiple display units 100, one adapter board 41 can correspond to one display unit 100, or it can correspond to at least two display units 100. This application does not limit this, and it depends on the specific situation.

[0073] Specifically, in one embodiment of this application, the adapter board and the drive circuit board are also electrically connected via connectors. For example, a third connector is provided on the side of the adapter board facing the drive circuit board, and a fourth connector is provided on the side of the drive circuit board facing the adapter board. The third connector and the fourth connector are electrically connected. However, this application does not limit this and it depends on the specific circumstances.

[0074] In another embodiment of this application, the substrate is a PCB substrate. Since multiple conductor layers can be disposed inside the PCB substrate, a large number of signal lines can be disposed. In this embodiment, the display module may not include an adapter board, and so on. Figure 8 As shown, but this application does not limit this. In other embodiments of this application, an adapter board may also be provided, depending on the specific circumstances.

[0075] Based on any of the above embodiments, in one embodiment of this application, such as Figure 8 and Figure 10 As shown, Figure 10 for Figure 8 A partial schematic diagram of the supporting structure, electrical adhesive layer, and driving circuit board is shown. In this embodiment, the supporting structure 20 includes a first supporting portion 23 and a second supporting portion 24. In a direction perpendicular to the plane of the substrate 10, the first supporting portion 23 and the driving circuit board 40 do not overlap, while the second supporting portion 24 and the driving circuit board 40 at least partially overlap. Optionally, the driving circuit board 40 can be fixed to the second supporting portion 24 by bolts, clips, or other means to achieve a fixed connection between the driving circuit board 40 and the supporting structure 20.

[0076] Based on the above embodiments, in one embodiment of this application, the following continues... Figure 8 and Figure 10As shown, in the direction perpendicular to the plane of the substrate 10, the maximum thickness of the first support portion 23 is less than the maximum thickness of the second support portion 24. This facilitates the placement of the drive circuit board 40 on the side of the second support portion 24 away from the substrate 10, ensuring that the drive circuit board 40 is located within the space defined by the first support portion 23 in the direction parallel to the plane of the substrate 10. This allows for easier assembly of the rear cover 25 below the support structure 20. Figure 11 As shown, the drive circuit board 40 and the rear cover 25 will not interfere with each other, nor will they damage the drive circuit board 40. However, this application does not limit this to the present invention. In other embodiments of this application, such as... Figure 12 As shown, in the direction perpendicular to the plane of the substrate 10, the maximum thickness of the first support portion 23 can also be equal to the maximum thickness of the second support portion 24. Optionally, in this embodiment, the back cover 25 assembled below the support structure 20 is a U-shaped back cover, so that the drive circuit board 40 and the back cover 25 will not interfere with each other during the assembly of the back cover 25, nor will the drive circuit board 40 be damaged. The specific arrangement depends on the situation.

[0077] Optionally, in one embodiment of this application, such as Figure 13 and Figure 14 As shown, the first connector 51 outputs the voltage signal required by the conductor of the first conductive region 12 corresponding to each display unit 100 through at least one output pin, so as to provide a voltage signal to the electrical adhesive layer 30. Specifically, in one embodiment of this application, the first connector 51 is electrically connected to the conductor of the first conductive region 12 through a first signal line 15, and transmits the voltage signal input at one of its input terminals to the conductor of the first conductive region 12 through the first signal line 15, so as to provide a voltage signal to the electrical adhesive layer 30.

[0078] Based on the above embodiments, in one embodiment of this application, in order to achieve precise separation of the damaged display unit and the support structure in the display module when the display unit in the display module is damaged, the following steps are continued... Figure 13 As shown, the conductor of the first conductive area 12 corresponding to one display unit 100 corresponds to one output pin of the first connector 51. The conductors of the first conductive area 12 corresponding to different display units 100 correspond to different output pins of the first connector 51. That is, the first connector 51 outputs the voltage signal required by the conductor of the first conductive area 12 corresponding to different display units 100 through different output pins, so as to transmit the signal to the conductor of the first conductive area 12 corresponding to different display units through different output pins, thereby realizing the independent control of the conductor of the first conductive area 12 corresponding to different display units 100, thereby enabling the display module to achieve precise separation of the display units corresponding to different first conductive areas 12.

[0079] Based on the above embodiments, in one embodiment of this application, a display unit 100 may be provided with an electrical adhesive layer 30. In this embodiment, the output pin of the first connector 51 can be electrically connected to the conductor of the first conductive region 12 through a first signal line 15. In another embodiment of this application, a display unit 100 may also be provided with at least two electrically insulated electrical adhesive layers 30. In this embodiment, the output pin of the first connector 51 can be electrically connected to the conductor of the first conductive region 12 through at least two first signal lines 15. One first signal line 15 is electrically connected to one conductor of the first conductive region 12. This application does not limit this, and it depends on the specific situation.

[0080] In another embodiment of this application, such as Figure 14 As shown, the first connector 51 outputs the voltage signal required by the conductors of the first conductive region 12 corresponding to at least two display units 100 through an output pin. The conductors of the first conductive region corresponding to different display units 100 are electrically connected to the output pin of the first connector 51 through the control switch 16. This enables independent control of the conductors of different first conductive regions 12 while reducing the number of output pins of the first connector. This allows for precise separation of the local display unit 100 in the display module when a local display unit 100 is damaged.

[0081] Specifically, in one embodiment of this application, the control switch 16 has one input terminal and at least two output terminals. The input terminal of the control switch 16 is electrically connected to the output pin of the first connector 51, and the output terminal of the control switch 16 is electrically connected to the conductor of the first conductive region 12. Different output terminals of the control switch 16 are electrically connected to the conductor of the first conductive region 12 corresponding to different display units 100.

[0082] Similarly, based on the above embodiments, in one embodiment of this application, a display unit 100 may be provided with an electrical adhesive layer 30. In this embodiment, an output terminal of the control switch 16 may be electrically connected to the conductor of the first conductive region 12 through a first signal line 15. In another embodiment of this application, a display unit 100 may also be provided with at least two electrically insulated electrical adhesive layers 30. In this embodiment, an output terminal of the control switch 16 may be electrically connected to the conductor of the first conductive region 12 through at least two first signal lines 15. One first signal line 15 is electrically connected to one conductor of the first conductive region 12. This application does not limit this, and it depends on the specific situation.

[0083] Based on any of the above embodiments, in one embodiment of this application, the driving circuit board 40 is further used to provide a voltage signal to the conductor of the first conductive region 12, so that when the display unit 100 is damaged during the use of the display module, the driving circuit board 40 can provide a voltage signal to the electrical adhesive layer 30 corresponding to the display unit 100, simplifying the subsequent maintenance operation of the display module. However, this application does not limit this. In other embodiments of this application, it is also possible not to use the driving circuit board 40 to provide a voltage signal to the conductor of the first conductive region 12, but instead, when the display unit 100 is damaged during the use of the display module, a voltage signal can be input to the first signal line 15 from outside the display module to achieve precise separation of the display unit 100, thereby simplifying the structure of the driving circuit board 40 in the display module, depending on the specific situation.

[0084] The following description continues with an example of the display module provided in the embodiments of this application, using the example of the driving circuit board 40 also providing a voltage signal to the conductor of the first conductive region 12.

[0085] Optionally, in one embodiment of this application, the drive circuit board 40 controls the display module to enter maintenance mode based on the user's first trigger signal. After the display module enters maintenance mode, it determines the target first conductive area based on the user's second trigger signal. Then, by providing a voltage signal to the conductor of the target first conductive area, it controls the conductor of the target first conductive area to separate from the support structure 20. This allows the user to separate the conductor of the target first conductive area from the support structure using only two trigger signals, thereby achieving automatic and accurate separation of the display unit corresponding to the target first conductive area and improving the automation and integration of the display module.

[0086] Based on any of the above embodiments, in one embodiment of this application, the following continues... Figures 1-5 As shown, the substrate 10 includes a first insulating layer 13, which includes a first opening that exposes a first conductive region 12 to facilitate electrical connection between the first conductive region 12 and a second conductive region 21 on the support structure 20.

[0087] Optionally, in one embodiment of this application, the first insulating layer 13 can be a green oil layer, a PI film, or an ink layer, etc., and this application does not limit this; the specific choice depends on the circumstances. It should be noted that the green oil is a liquid photoresist, which is an acrylic oligomer; the PI film is a polyimide film, a high-performance insulating material with excellent high-temperature resistance, mechanical strength, and chemical stability.

[0088] Specifically, in one embodiment of this application, the following continues... Figure 1 and Figure 5As shown, the first insulating layer 13 covers the edge of the conductor located in the first conductive region 12 to protect the conductor located in the first conductive region 12. However, this application does not limit this and it depends on the specific circumstances.

[0089] It should be noted that, in this embodiment, the following continues... Figure 1 As shown, the electrical adhesive layer 30 has a certain thickness to ensure that when the display unit 100 and the support structure 20 are connected through the electrical adhesive layer 30, the electrical adhesive layer 30 can provide good adhesion, ensuring that the display unit 100 will not detach from the support structure 20. Therefore, based on any of the above embodiments, in one embodiment of this application, such as Figure 15 As shown, Figure 15 for Figure 3 In the enlarged view of region A, the distance from the surface of the first insulating layer 13 away from the first surface of the substrate 10 to the first surface of the substrate 10 is greater than the distance from the surface of the conductor of the first conductive region 12 away from the first surface of the substrate 10 to the first surface of the substrate, so as to ensure that the conductor of the first conductive region 12 will not protrude from the second surface of the substrate 10.

[0090] Continue as Figure 15 As shown, in one embodiment of this application, there is a gap between the electrical adhesive layer 30 and the edge of the first opening along the first direction X. Optionally, the distance from the edge of the electrical adhesive layer 30 to the edge of the first opening along the first direction X is w, where w ≥ 0.1 mm. The first direction X is parallel to the plane of the substrate 10. This ensures that the electrical adhesive layer 30 is located within the first opening when it is pasted in the first opening, within the allowable range of alignment error, thereby ensuring the electrical connection performance and adhesive performance of the electrical adhesive layer 30.

[0091] Optionally, in one embodiment of this application, w < 0.5 mm, to avoid the distance from the edge of the electrical adhesive layer 30 to the edge of the first opening being too large along the first direction X, affecting the planar dimensions of the display module, and causing too much exposure of the conductor in the first conductive area 12, making it susceptible to water and oxygen corrosion. However, this application does not limit this, and it depends on the specific circumstances.

[0092] Specifically, in one embodiment of this application, in the first direction X, the width of the gap between the electrical adhesive layer 30 and the first side of the first opening is the first width w1, and the width of the gap between the electrical adhesive layer 30 and the second side of the first opening is the second width w2. The first side of the first opening and the second side of the first opening are opposite to each other. In this embodiment, the first width w1 and the second width w2 may be equal or unequal. This application does not limit this and it depends on the specific situation.

[0093] Optionally, based on the above embodiments, in one embodiment of this application, such as Figure 16 As shown, the display module further includes an insulating hydrophobic structure 60 in the first direction X, which fills the gap between the electrical adhesive layer 30 and the first opening. This insulating hydrophobic structure 60 protects the electrical adhesive layer 30 from corrosion by water and oxygen in the external environment, thus preventing damage to its electrical connection performance. However, this application does not limit this to specific details; the choice depends on the circumstances.

[0094] Based on any of the above embodiments, continue as follows Figure 1 and Figure 4 As shown, the support structure 20 is a metal frame. A second insulating layer 22 is provided on the side of the support structure 20 facing the display unit 100. The second insulating layer 22 includes a second opening that exposes a second conductive region 21. The first opening and the second opening correspond to each other. An electrical adhesive layer 30 is located at the positions of the first opening and the second opening to achieve electrical connection between the conductor of the second conductive region 21 and the conductor of the first conductive region 12 of the support structure 20. It should be noted that in this embodiment, the second conductive region 21 is a component of the metal frame to further simplify the structure of the display module. However, this application does not limit this. In other embodiments of this application, the conductor of the second conductive region 21 can also be a conductor layer independent of the metal frame, depending on the specific circumstances.

[0095] In addition, in this embodiment, the following continues... Figure 8 As shown, the second insulating layer 22 can also ensure that even if the drive circuit board 40 and the support structure 20 come into contact, a short circuit will not occur between the drive circuit board 40 and the support structure 20, thus ensuring the overall electrical safety of the display module and the stability of the electrical adhesive layer 30 during de-adhesion.

[0096] Optionally, in one embodiment of this application, the process of forming the second insulating layer includes: firstly, obtaining an insulating layer covering the entire surface of the metal frame by oxidizing the metal frame, and then removing the portion of the insulating layer located in the area to be formed as the second conductive region to obtain a second insulating layer including a second opening.

[0097] Optionally, in one embodiment of this application, the metal frame is an aluminum alloy frame, and the second insulating layer is an aluminum alloy oxide layer formed by an oxidation process. However, this application does not limit this. In other embodiments of this application, the second insulating layer can also be formed on the surface of the metal frame by an attachment process, depending on the specific circumstances.

[0098] It should be noted that the insulating layer obtained by the oxidation process is usually thinner, while the electrical adhesive layer has a certain thickness. In order to avoid the gap between the first insulating layer 13 and the second insulating layer 22 being too large in the direction perpendicular to the plane of the substrate 10, in one embodiment of this application, the thickness of the first insulating layer 13 is greater than the thickness of the second insulating layer 22, so as to ensure that the electrical adhesive layer 30 has a certain thickness while avoiding the gap between the first insulating layer 13 and the second insulating layer 22 being too large in the direction perpendicular to the plane of the substrate 10.

[0099] Optionally, in one embodiment of this application, the thickness of the first insulating layer 13 is in the range of 0μm-10μm (excluding 0) to ensure that the conductor of the first conductive region 12 does not protrude from the second surface of the substrate 10, and at the same time to avoid the gap between the support structure 20 and the display unit 100 being too large due to the thickness of the first insulating layer 13 being too large, which could lead to other problems; the thickness of the second insulating layer 22 is in the range of 1μm-2μm to ensure the insulation effect of the second insulating layer 22, and at the same time to avoid the second insulating layer 22 being too thick, which could affect the thickness of the support structure 20, thereby affecting the thickness of the display module.

[0100] Specifically, in one embodiment of this application, such as Figure 17 As shown, Figure 17 for Figure 1 The enlarged view of region D shows the thickness of the electrical adhesive layer 30 as a = b + c + d + e, where b is the thickness of the first insulating layer 13, c is the thickness of the second insulating layer 22, d is the thickness of the gap between the first insulating layer 13 and the second insulating layer 22 in the direction perpendicular to the substrate 10, and e is the compression amount of the electrical adhesive layer 30 during the assembly of the support structure 20 and the substrate 10. It should be noted that in this embodiment, e > 0 to avoid insufficient compression of the electrical adhesive layer 30, which could lead to poor performance of the electrical adhesive layer 30 and affect the electrical connection performance between the display unit 100 and the support structure 20.

[0101] Optionally, in one embodiment of this application, the total thickness of the first insulating layer 13, the second insulating layer 22 and the electrical adhesive layer 30 is in the range of 15 micrometers to 30 micrometers, but this application does not limit it and it depends on the specific situation.

[0102] It should be noted that in practical applications, due to limitations in process capability, the flatness of the surface of the support structure 20 or the substrate 10 is inevitably subject to errors. Therefore, based on the above embodiments, in one embodiment of this application, the value of d is in the range of 0μm-50μm, in order to avoid the phenomenon that the electrical adhesive layer 30 cannot be tightly bonded to at least one of the second surface of the substrate 10 and the surface of the support structure 20 facing the display unit 100 due to unevenness of the surface of the support structure 20 or the substrate 10, thus ensuring the electrical connection performance and adhesive performance of the electrical adhesive layer 30. However, this application does not limit this, and it depends on the specific circumstances.

[0103] It should also be noted that, while ensuring that the electrical adhesive layer 30 is tightly bonded to the second surface of the substrate 10 and the surface of the support structure 20 facing the display unit 100, the thickness d of the gap between the first insulating layer 13 and the second insulating layer 22 in the direction perpendicular to the substrate 10 should be as small as possible, so as to reduce the probability of dust from the external environment entering the area where the electrical adhesive layer 30 is located.

[0104] Optionally, in this embodiment, there is a gap between the electrical adhesive layer 30 and the edge of the second opening in the first direction X. Optionally, the distance from the edge of the electrical adhesive layer 30 to the edge of the second opening is ≥0.1 mm along the first direction X. The first direction X is parallel to the plane where the substrate 10 is located. When the electrical adhesive layer 30 is pasted in the second opening, within the allowable range of alignment error, it is ensured that the electrical adhesive layer 30 is located in the second opening, thereby ensuring the electrical connection performance and adhesive performance of the electrical adhesive layer 30.

[0105] Based on the above embodiments, in one embodiment of this application, when the gap between the electrical adhesive layer 30 and the first opening in the first direction X is filled with an insulating hydrophobic structure 60, the insulating hydrophobic structure 60 also fills the gap between the second opening and the electrical adhesive layer 30, preventing the electrical adhesive layer 30 from being corroded by water and oxygen in the external environment and affecting the electrical connection performance of the electrical adhesive layer 30. However, this application does not limit this, and it depends on the specific circumstances.

[0106] Based on any of the above embodiments, in one embodiment of this application, the following continues... Figure 2 As shown, the electrical adhesive layer 30 includes a first adhesive portion 31. In a plane parallel to the substrate 10, the distance between the first adhesive portion 31 and the edge of the substrate 10 ranges from 0.1mm to 0.5mm, so as to ensure that the electrical adhesive layer 30 is fully adhered to the second surface of the substrate 10 within the allowable range of bonding accuracy, thereby ensuring the electrical connection performance of the electrical adhesive layer 30.

[0107] Optionally, based on the above embodiments, in one embodiment of this application, the following continues... Figure 2and Figure 19 As shown, a plurality of components 14 are disposed on the substrate 10. In the direction perpendicular to the substrate 10, the top view of the first adhesive portion 31 is annular, which is disposed around the plurality of components 14. That is, in this embodiment, the first adhesive portion 31 is disposed around the outer edge of the second surface of the substrate 10, so as to achieve electrical connection between the display unit 100 and the support structure 20 without affecting the layout of the components 14 inside the substrate 10.

[0108] Optionally, in one embodiment of this application, the multiple components may include active components, such as driving circuits, or passive components, such as resistors and / or capacitors. This application does not limit this, and it depends on the specific circumstances.

[0109] In another embodiment of this application, such as Figure 20 As shown, a plurality of components 14 are disposed on the substrate 10. The first bonding portion 31 includes a plurality of sub-bonding portions. In a direction perpendicular to the substrate 10, different sub-bonding portions are located on different sides of the plurality of components 14. Specifically, the first bonding portion 31 includes a first sub-bonding portion 311, a second sub-bonding portion 312, a third sub-bonding portion 313, and a fourth sub-bonding portion 314. The first sub-bonding portion 311 and the second sub-bonding portion 312 are located on opposite sides of the plurality of components 14 in the first direction X. The third sub-bonding portion 313 and the fourth sub-bonding portion 314 are located on opposite sides of the plurality of components 14 in the first direction X. The fourth sub-adhesive portion 314 is located on opposite sides of the plurality of components 14 in the second direction Y. That is, the first sub-adhesive portion 311 is located on the first side of the plurality of components 14, the second sub-adhesive portion 312 is located on the second side of the plurality of components 14, the first side and the second side are opposite to each other on both sides of the plurality of components 14 in the first direction X, the third sub-adhesive portion 313 is located on the third side of the plurality of components 14, and the fourth sub-adhesive portion 314 is located on the fourth side of the plurality of components 14, the third side and the fourth side are opposite to each other on both sides of the plurality of components 14 in the second direction Y.

[0110] It should be noted that, in Figure 2 In the corresponding solution, when the first adhesive portion 31 is an annular adhesive portion, the different parts of the first adhesive portion 31 are an integral structure. Its manufacturing method is as follows: a central portion is removed from an integral planar electrical adhesive layer to form an annular adhesive portion, which is then pasted onto the substrate 10. The central portion that is removed is wasted. Figure 20 In the corresponding solution, the first adhesive portion 31 includes multiple sub-adhesive portions, and the different sub-adhesive portions are strip adhesive portions that are separated from each other. Therefore, during manufacturing, multiple portions can be selected from the roll of strip adhesive tape as sub-adhesive portions and bonded to the substrate 10, resulting in high utilization of the electrical adhesive layer.

[0111] It should also be noted that, in this embodiment, since the display module directly uses the conductor of the first conductive region 12 exposed on the second surface of the substrate 10 as the driving electrode or control electrode of the electrical adhesive layer 30 to transmit voltage signals to the electrical adhesive layer 30, no additional electrodes are required. Furthermore, the conductors of each first conductive region 12 inside the substrate 10 can be electrically connected inside the substrate 10 without additional electrical connections. Therefore, in this embodiment, the first adhesive portion 31 includes multiple discontinuous sub-adhesive portions, which can also achieve unified control of different sub-adhesive portions. Thus, the position of each sub-adhesive portion can be fully set according to the shape, size, flatness, and personalized settings of the second surface of the substrate 10, without the need for integrated design, so as to make full use of the electrical adhesive layer, further improve the utilization rate of the electrical adhesive layer, and reduce the material cost of the electrical adhesive layer.

[0112] Optionally, in one embodiment of this application, such as Figure 21 As shown, the electrical adhesive layer 30 further includes at least one second adhesive portion 32. In a direction perpendicular to the substrate 10, the second adhesive portion 32 is located within the area defined by the first adhesive portion 31 and within the gap between at least some of the components 14 in different rows, so as to make full use of the gap between adjacent rows of components 14. The second adhesive portion 32 is provided to improve the electrical connection performance and the adhesive performance of the electrical adhesive layer 30.

[0113] In another embodiment of this application, such as Figure 22 As shown, the electrical adhesive layer 30 further includes at least one second adhesive portion 32. In a direction perpendicular to the substrate 10, the second adhesive portion 32 is located within the area defined by the first adhesive portion 31 and within the gaps between at least some of the components 14 in different columns, so as to make full use of the gaps between adjacent columns of components 14. The second adhesive portion 32 is provided to improve the electrical connection performance and the adhesive performance of the electrical adhesive layer 30.

[0114] In another embodiment of this application, the electrical adhesive layer further includes at least two second adhesive portions. In a direction perpendicular to the substrate, the second adhesive portions are located within the area defined by the first adhesive portions, and at least one second adhesive portion is located within the gaps between components in different rows and between components in different columns. This fully utilizes the gaps between adjacent rows and adjacent columns of components to improve the electrical connection performance and adhesive performance of the electrical adhesive layer. This application does not limit the specific implementation; the choice depends on the circumstances.

[0115] Based on any of the above embodiments, in one embodiment of this application, in the direction perpendicular to the plane where the substrate is located, the top view of the substrate can be rectangular, that is, the substrate is a rectangular substrate, or it can be trapezoidal, that is, the substrate is a trapezoidal substrate, or it can be triangular or irregular, that is, the substrate is a triangular substrate or a substrate with an irregular shape. This application does not limit this, and it depends on the specific situation.

[0116] Based on any of the above embodiments, in one embodiment of this application, the display module is a Micro LED display module. In this embodiment, each display unit in the display module is a Micro LED display unit. Specifically, each display unit can be a Micro LED display unit using COB technology or a Micro LED display unit using COG technology. This application does not limit this and it depends on the specific circumstances.

[0117] Furthermore, this application embodiment also provides a display device, which may include the display module provided in any of the above embodiments. It should be noted that, in this embodiment, the display device may be a splicing display device, such as... Figure 23 As shown, it can also be a non-splicing display device, such as... Figure 24 As shown, this application does not impose any limitations on this matter; the specific circumstances will determine the appropriate course of action.

[0118] In summary, the display module and display device provided in this application utilize the conductor of the first conductive area exposed on the second surface of the substrate as one driving electrode of the electrical adhesive layer, and the conductor of the second conductive area exposed on the surface of the support structure as another driving electrode of the electrical adhesive layer. Therefore, without the need to set separate driving electrodes, the display unit and the support structure can be fixed and separated using the electrical adhesive layer, achieving an independent and controllable electro-adhesion reduction effect. Moreover, when the display module includes multiple spliced ​​display units, the different display units are independent of each other and do not affect each other. Thus, when some display units in the display module are damaged, partial screen replacement can be quickly achieved by reducing the adhesion of the electrical adhesive layer, reducing the subsequent maintenance cost of the display module. Furthermore, the structure is simple and it is easy to provide control signals to the electrical adhesive layer.

[0119] The various embodiments in this specification are described in a progressive, parallel, or combined manner. Each embodiment focuses on its differences from other embodiments, and similar or identical parts between embodiments can be referred to interchangeably. For the apparatuses disclosed in the embodiments, since they correspond to the methods disclosed in the embodiments, the descriptions are relatively simple, and relevant parts can be referred to the method section.

[0120] It should be noted that, in the description of this application, the accompanying drawings and embodiments are illustrative rather than restrictive. It should also be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that an article or device comprising a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such an article or device. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in an article or device comprising the aforementioned element.

[0121] The above description of the disclosed embodiments enables those skilled in the art to make or use this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A display module, characterized in that, include: At least one display unit, the display unit including a substrate, the substrate including opposing first and second surfaces, the second surface including an exposed first conductive region; A support structure is fixedly connected to the second surface of the display unit; The surface of the support structure facing the display unit includes an exposed second conductive region, which is connected to the first conductive region by an electrical adhesive layer.

2. The display module according to claim 1, characterized in that, The substrate includes a first insulating layer, the first insulating layer including a first opening, the first opening exposing the first conductive region.

3. The display module according to claim 2, characterized in that, The distance from the surface of the first insulating layer away from the first surface to the first surface is greater than the distance from the surface of the conductor of the first conductive region away from the first surface to the first surface.

4. The display module according to claim 2, characterized in that, Along the first direction, the distance from the edge of the electrical adhesive layer to the edge of the first opening is w, where w ≥ 0.1 mm, and the first direction is parallel to the plane of the substrate.

5. The display module according to claim 4, characterized in that, The display module further includes an insulating hydrophobic structure that fills the gap between the edge of the electrically adhesive layer and the edge of the first opening in the first direction.

6. The display module according to claim 1, characterized in that, The second surface includes a third conductive region for transmitting drive signals to the display unit.

7. The display module according to claim 6, characterized in that, The conductor in the third conductive region is located in the same film layer as the conductor in the first conductive region; or... The conductor of the third conductive region is located on the side of the conductor of the first conductive region away from the second surface.

8. The display module according to claim 7, characterized in that, The substrate is a PCB board, and the conductor of the third conductive region and the conductor of the first conductive region are located in the same film layer or in different film layers. or, The substrate is a glass substrate, and the conductors of the third conductive region and the first conductive region are located in the same film layer.

9. The display module according to claim 8, characterized in that, Also includes: A driving circuit board, which is fixedly connected to the supporting structure, is used to provide driving signals to the display unit; A first connector is located on the second side of the substrate and is electrically connected to the conductor of the third conductive region. The second connector is located on the side of the drive circuit board facing the display unit and is electrically connected to the drive circuit board. The second connector is also electrically connected to the first connector.

10. The display module according to claim 9, characterized in that, The drive circuit board is also used to provide a voltage signal to the conductor in the first conductive region.

11. The display module according to claim 9, characterized in that, The display module includes at least two display units, and different display units are fixed on the same support structure.

12. The display module according to claim 11, characterized in that, The substrate is a glass substrate, and the display module further includes: An adapter board, one side of which is electrically connected to the driving circuit board and the other side of which is electrically connected to at least one of the display units, is used to electrically connect the driving circuit board and the display units.

13. The display module according to claim 11, characterized in that, The first connector outputs the voltage signal required by the conductor of the first conductive area corresponding to each of the display units through at least one output pin.

14. The display module according to claim 13, characterized in that, The first connector outputs the voltage signal required by the conductor of the first conductive area corresponding to different display units through different output pins.

15. The display module according to claim 13, characterized in that, The first connector outputs the voltage signal required by the conductors of the first conductive areas corresponding to at least two of the display units through an output pin. The conductors of the first conductive areas corresponding to different display units are electrically connected to the output pin of the first connector through a control switch.

16. The display module according to claim 2, characterized in that, The support structure is a metal frame, and a second insulating layer is provided on the side of the support structure facing the display unit. The second insulating layer includes a second opening, which exposes the second conductive area. The conductor of the second conductive area is a component of the metal frame.

17. The display module according to claim 16, characterized in that, The thickness of the first insulating layer is greater than the thickness of the second insulating layer.

18. The display module according to claim 16, characterized in that, In a direction perpendicular to the plane of the substrate, the gap between the first insulating layer and the second insulating layer ranges from 0 μm to 50 μm.

19. The display module according to claim 1, characterized in that, The electrical adhesive layer includes a first adhesive portion, and the distance between the first adhesive portion and the edge of the substrate in a plane parallel to the substrate ranges from 0.1 mm to 0.5 mm.

20. The display module according to claim 19, characterized in that, The second surface of the substrate is provided with a plurality of components. In a direction perpendicular to the plane of the substrate, the top view of the first adhesive portion is annular, surrounding the plurality of components.

21. The display module according to claim 19, characterized in that, The second surface of the substrate is provided with a plurality of components, and the first adhesive portion includes a plurality of sub-adhesive portions, which are located on different sides of the plurality of components in a direction parallel to the plane of the substrate.

22. The display module according to any one of claims 19-21, characterized in that, The electrical adhesive layer further includes at least one second adhesive portion, which is located in the area defined by the first adhesive portion in a direction perpendicular to the substrate, and is located in the gap between at least some of the components in different rows or columns.

23. The display module according to claim 1, characterized in that, In a plane perpendicular to the substrate, the top view of the substrate is rectangular, trapezoidal, triangular, or an irregular shape.

24. The display module according to claim 1, characterized in that, The adhesiveness of the electrical adhesive layer decreases as the difference between the voltage on the conductor in the first conductive region and the voltage on the conductor in the second conductive region increases.

25. A display device, characterized in that, Includes any of the display modules as described in claims 1-24.

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