Inverter device and inverter control method

Abstract

The present application relates to an inverter device and an inverter control method, and an inverter device according to an embodiment includes: a capacitor to which a DC voltage is applied; a power module to convert a voltage of the capacitor into an AC voltage through a switching element; an MCU to control the power module; a resistance network including a plurality of resistance groups connected in series; and a circuit board on which the MCU and the resistance network are mounted, wherein a resistance group includes a plurality of resistors connected in parallel, and the resistance network is electrically connectable between the capacitor and the power module.

Description

Technical Field

[0001] This invention relates to an inverter device and an inverter control method, and more specifically, to a technique for discharging a capacitor through a resistor or measuring the voltage of a capacitor. Background Technology

[0002] Inverters used in electric and hybrid vehicles involve high-voltage direct current (DC) power supplies, so in order to prevent safety accidents, it is necessary to quickly release the residual voltage of the internal capacitors when the power is cut off.

[0003] General regulations require that, with the power supply off, the residual voltage of a capacitor should be reduced to below 60V within 60 seconds. To achieve this, a ceramic resistor is typically attached to the capacitor. Summary of the Invention

[0004] The purpose of embodiments of the present invention is to provide an inverter device and an inverter control method that, by removing the discharge resistor designed inside the capacitor and reconfiguring the sensing resistor used in the existing circuit board in a new way, can simultaneously perform discharge and sensing functions.

[0005] The purpose of embodiments of the present invention is to provide an inverter device and an inverter control method that can reduce the size of the capacitor and reduce the cost associated with the discharge resistor by removing the discharge resistor designed inside the capacitor.

[0006] The purpose of embodiments of the present invention is to provide an inverter device and an inverter control method, which eliminates the need for wiring to fix the internal discharge resistor of the capacitor or for a structure to support the discharge resistor by removing the discharge resistor designed inside the capacitor.

[0007] The purpose of embodiments of the present invention is to provide an inverter device and an inverter control method that can reduce the cost of wiring and fastening operations by eliminating the discharge resistor designed inside the capacitor.

[0008] The purpose of embodiments of the present invention is to provide an inverter device and an inverter control method, which can prevent mechanical damage to components caused by vibrations generated during vehicle operation or vibration testing by removing the discharge resistor designed inside the capacitor.

[0009] The purpose of embodiments of the present invention is to provide an inverter device and an inverter control method, which improves the durability of the resistor by soldering a resistor that simultaneously performs discharge and sensing functions onto an integrated circuit board disposed inside the inverter.

[0010] The technical problems of this invention are not limited to those mentioned above, and those skilled in the art can clearly understand other technical problems not mentioned from the following description.

[0011] An inverter device based on an embodiment of the present invention includes: a capacitor to which a DC voltage is applied; a power module that converts the voltage of the capacitor to an AC voltage via a switching element; a microcontroller unit (MCU) that controls the power module; a resistor network that includes a plurality of resistor sets connected in series; and a board on which the MCU and the resistor network are mounted, wherein the resistor sets include a plurality of resistors connected in parallel, and the resistor network is electrically connected between the capacitor and the power module.

[0012] In one embodiment, the resistor network can be configured within a predetermined distance from the coupling structure of the circuit board, or configured in the edge region of the circuit board, wherein the coupling structure is used to fasten the circuit board to the housing.

[0013] In one embodiment, the resistor network can be used to discharge the capacitor so that the voltage of the capacitor reaches a voltage lower than a predetermined voltage within a predetermined time, and to measure the voltage of the capacitor.

[0014] In one embodiment, the resistor network can be configured to discharge the voltage of the capacitor to a predetermined voltage within a predetermined time according to predetermined conditions related to the power supply of the inverter device.

[0015] In one embodiment, the predetermined conditions related to the power supply of the inverter device may include: a condition where the power supply to the inverter device is disconnected, a condition where the inverter device is not operating normally, or at least one of any combination thereof.

[0016] In one embodiment, while the voltage of the capacitor is stored and the resistor network is used to measure the voltage of the capacitor, the power supply to the inverter device is disconnected, and the resistor network is used to discharge the capacitor so that the voltage of the capacitor reaches a voltage lower than the predetermined voltage within the predetermined time.

[0017] In one embodiment, the circuit board further includes a third resistor connected in series with the resistor network, the third resistor being capable of dividing the voltage of the capacitor into a voltage input to the MCU.

[0018] In one embodiment, the resistor network includes a first resistor and a second resistor, and the arrangement spacing of the first resistor and the second resistor on the circuit board is determined taking into account the temperature at which the first resistor and the second resistor generate heat.

[0019] In one embodiment, the resistor network includes a predetermined number of resistors, which can be set such that the temperature at which each of the predetermined number of resistors heats up does not exceed a predetermined temperature.

[0020] In one embodiment, the voltage of the capacitor can be measured by the voltage drop between one end of the resistor network and the other end of the resistor network.

[0021] An inverter control method according to an embodiment of the present invention includes the following operations: discharging a capacitor through a resistor network mounted on a board, so that the voltage of the capacitor reaches a voltage lower than a predetermined voltage within a predetermined time; measuring the voltage of the capacitor through the resistor network; and converting the voltage of the capacitor into AC voltage through a power module, wherein the board is equipped with an MCU (Micro Controller Unit) for controlling the power module and the resistor network, the resistor network including multiple resistor sets connected in series and electrically connected between the capacitor and the power module, and the resistor sets may include multiple resistors connected in parallel.

[0022] In an inverter control method based on one embodiment, the resistor network can be configured within a predetermined distance from the coupling structure of the circuit board, or configured in the edge region of the circuit board, wherein the coupling structure is used to fasten the circuit board to the housing.

[0023] In an inverter control method based on one embodiment, the operation of discharging a capacitor through a resistor network to make the capacitor voltage reach a voltage lower than a predetermined voltage within a predetermined time can include: discharging the voltage of the capacitor to a predetermined voltage within a predetermined time through the resistor network according to predetermined conditions related to the power supply of the inverter device.

[0024] In an inverter control method based on one embodiment, predetermined conditions related to the power supply of the inverter device may include: a condition where the power supply to the inverter device is disconnected, a condition where the inverter device is not operating normally, or at least one of any combination thereof.

[0025] In an inverter control method based on one embodiment, the operation of discharging a capacitor through a resistor network to make the capacitor voltage reach a voltage lower than a predetermined voltage within a predetermined time includes: during the period when the voltage of the capacitor is in a state of accumulation and the resistor network is used to measure the voltage of the capacitor, the power supply of the inverter device is disconnected, and the resistor network is used to discharge the capacitor to make the voltage of the capacitor reach a voltage lower than the predetermined voltage within the predetermined time.

[0026] An inverter control method based on one embodiment further includes the following operation: dividing the voltage of the capacitor into the voltage input to the MCU by a third resistor connected in series with the resistor network and installed on the circuit board.

[0027] In an inverter control method based on one embodiment, the resistor network includes a first resistor and a second resistor, and the arrangement spacing of the first resistor and the second resistor on the circuit board is determined taking into account the temperature at which the first resistor and the second resistor generate heat.

[0028] In an inverter control method based on one embodiment, the resistor network includes a predetermined number of resistors, which can be set such that the temperature at which each of the predetermined number of resistors heats up does not exceed a predetermined temperature.

[0029] In an inverter control method based on one embodiment, the operation of converting the voltage of a capacitor to AC voltage via a power module can include: converting the voltage of the capacitor to AC voltage via a predetermined number of switching elements.

[0030] In an inverter control method based on one embodiment, the operation of measuring the voltage of a capacitor via a resistor network can include measuring the voltage of the capacitor by means of the voltage drop between one end of the resistor network and the other end of the resistor network.

[0031] This invention enables the design of circuits that can perform both discharging and sensing functions by reconfiguring the sensing resistors used in existing circuit boards in a new way by removing the discharge resistors designed inside the capacitor.

[0032] In addition, by eliminating the discharge resistor designed inside the capacitor, the present invention can reduce the size of the capacitor and reduce the cost associated with the discharge resistor.

[0033] In addition, by eliminating the discharge resistor designed inside the capacitor, the present invention eliminates the need for wiring to fix the discharge resistor inside the capacitor or for a structure to support the discharge resistor.

[0034] In addition, by eliminating the discharge resistor designed inside the capacitor, the present invention can reduce the cost required for wiring and fastening operations.

[0035] In addition, by eliminating the discharge resistor designed inside the capacitor, the present invention can prevent mechanical damage to components caused by vibrations generated during vehicle operation or vibration testing.

[0036] In addition, the present invention improves the durability of the resistor by soldering a resistor that performs both the discharge and sensing functions onto an integrated circuit board located inside the inverter.

[0037] In addition, it can provide various effects that can be obtained directly or indirectly through this specification. Attached Figure Description

[0038] Figure 1 This is a block diagram illustrating an inverter device based on an embodiment of the present invention.

[0039] Figure 2 This is a diagram showing a portion of a circuit board of an inverter device with a resistor network configured according to an embodiment of the present invention.

[0040] Figure 3 This is a circuit diagram based on an embodiment of the present invention for enabling the resistor network of an inverter device to perform discharge and voltage sensing functions.

[0041] Figure 4 This is a graph showing the DC voltage, power consumption of each resistor, and DC sense voltage measured as the capacitor discharges in an inverter device based on an embodiment of the present invention.

[0042] Figure 5 This is a graph showing the relationship between the DC voltage and the temperature of the resistor in an inverter device based on an embodiment of the present invention.

[0043] Figure 6 This is a flowchart illustrating an inverter device or inverter control method based on an embodiment of the present invention.

[0044] Figure 7 This is a flowchart illustrating the mechanism by which the resistor network of an inverter device based on an embodiment of the present invention performs discharge and voltage sensing functions.

[0045] Figure 8 This is a diagram illustrating a computer system related to an inverter device or inverter control method based on an embodiment of the present invention. Detailed Implementation

[0046] The following detailed description of some embodiments of the present invention will be provided with reference to the exemplary accompanying drawings. It should be noted that when assigning reference numerals to components in the various drawings, the same reference numerals are used as much as possible for the same components, even if they are shown in different drawings. Furthermore, in describing the embodiments of the present invention, detailed descriptions involving well-known structures or functions that might affect the understanding of the present invention will be appropriately omitted.

[0047] Furthermore, in describing the components of embodiments of the present invention, terms such as "first," "second," "A," "B," "(a)," and "(b)" are used. These terms are only used to distinguish different components and do not limit the nature, order, or arrangement of the components. In addition, the expression "at least one of A, B, C or any combination thereof" can include "A or B or C or a combination thereof, i.e., AB or BC or AC or ABC."

[0048] Furthermore, unless otherwise defined, all terms used in this application (including technical and scientific terms) shall be understood to have the meaning commonly understood by those skilled in the art, and terms consistent with the definitions in commonly used dictionaries shall be interpreted as having the same meaning in the context of the relevant art. They shall not be interpreted in a figurative or overly formalized manner unless such meaning is expressly indicated in this application.

[0049] The following is for reference. Figures 1 to 8 Specific embodiments of the present invention will be described.

[0050] Figure 1 This is a block diagram illustrating an inverter device based on an embodiment of the present invention.

[0051] refer to Figure 1 According to an embodiment of the present invention, the inverter device 100 can be implemented inside a vehicle. In this case, the inverter device 100 can be integrated with the vehicle's internal control unit, or it can be implemented as a separate device and connected to the vehicle's control unit through a separate connection unit.

[0052] According to one embodiment, the inverter device 100 may include a capacitor 110, a power module 120, a circuit board 130, a resistor network 140, and an MCU (Micro Controller Unit) 150. Figure 1 The structure of the inverter device 100 shown is exemplary, and the embodiments of the present invention are not limited thereto. For example, the inverter device 100 may also include Figure 1 Other components not shown in the diagram.

[0053] According to one embodiment, capacitor 110 is capable of storing voltage. A direct current (DC) voltage can be applied to capacitor 110. For example, capacitor 110 is capable of storing DC power supplied from a battery and releasing the energy when needed.

[0054] According to one embodiment, capacitor 110 can be connected to the voltage input terminal of the inverter device 100 to which the DC voltage supplied is applied. By connecting capacitor 110 to the voltage input terminal of the inverter device 100, voltage ripple can be effectively eliminated. Voltage ripple is a periodic voltage fluctuation generated during power conversion, which can be caused by switching operations, load variations, or input power supply characteristics. Such voltage ripple can reduce system stability and may negatively affect output quality and performance.

[0055] According to one embodiment, capacitor 110 has the characteristic of storing and releasing electrical energy, which enables it to smooth the voltage of inverter device 100. Capacitor 110 can reduce the amplitude of ripple voltage and help maintain average voltage.

[0056] According to one embodiment, the inverter device 100 can be designed to comply with safety-related regulations. For example, to prevent electric shock accidents when the power supply to the inverter device 100 is disconnected, the inverter device 100 can be designed to reduce the residual voltage in the capacitor 110 for a certain period of time. At this time, the inverter device 100 can reduce the residual voltage in the capacitor 110 for a certain period of time through a discharge resistor.

[0057] According to one embodiment, the power module 120 is capable of converting DC voltage to AC voltage using switching elements. For example, the power module 120 is capable of converting the voltage of a capacitor to AC voltage.

[0058] As a specific example, the power module 120 may include silicon carbide (SIC) elements, insulated gate bipolar transistor (IGBT) elements, or metal-oxide-semiconductor field-effect transistor (MOSFET) elements.

[0059] According to one embodiment, the power module 120 can convert DC voltage to AC voltage using a preset number of switching elements. The preset number can be determined taking into account efficiency, cost, heat generation, or reliability.

[0060] For example, as the number of switching elements increases, the current and voltage that each element needs to handle are distributed, thereby reducing heat generation and power loss, and enabling designs that can handle higher voltages and currents. Furthermore, because the waveform of the output voltage can be controlled more precisely, high-quality AC voltage can be generated.

[0061] Conversely, reducing the number of switching elements simplifies the circuitry and control system, reducing costs and improving ease of maintenance.

[0062] According to one embodiment, the MCU (Micro Controller Unit) 150 can control the power module 120. For example, the MCU 150 can generate drive signals for switching elements and manage the overall operation. The MCU 150 can generate pulse width modulation (PWM) signals to control the on / off state of the switching elements and can adjust the frequency and amplitude of the output voltage.

[0063] According to one embodiment, the MCU 150 is capable of executing various control algorithms for optimizing the operation of the power module 120. For example, the quality of the output voltage can be improved through vector control or sinusoidal pulse width modulation (SPWM).

[0064] According to one embodiment, the MCU 150 can collect and process various sensor data such as current, voltage, and temperature in real time to monitor the status of the system and perform protection operations (e.g., overcurrent and overheat protection shutdown) when necessary.

[0065] According to one embodiment, the MCU 150 can precisely control the timing of switching elements to maximize power conversion efficiency and minimize switching losses.

[0066] According to one embodiment, the MCU 150 can communicate with an external control system or user interface, thereby reporting the inverter's status or changing settings. According to another embodiment, the MCU 150 and the resistor network 140 can be mounted on a circuit board 130.

[0067] According to one embodiment, board 130 may include a circuit board on which MCU 150, resistor network 140, and other circuit elements are mounted. For example, board 130 may perform the function of coordinating and managing electrical connections and controls related to inverter device 100. Board 130 may form signal transmission paths between circuit elements and provide physical structure.

[0068] According to one embodiment, the circuit board 130 can include various interfaces to support electrical connections with external devices. For example, it can be connected to external sensors, power supplies, communication modules, capacitors 110, or power modules 120 via connectors, pin headers, or soldering pads.

[0069] According to one embodiment, the resistor network 140 can be electrically connected between the capacitor 110 and the power module 120. Here, electrical connection can refer to a physical or functional connection state that allows current to flow or voltage to be applied. For example, the resistor network 140 can be connected in series or in parallel with the capacitor 110 and the power module 120.

[0070] According to one embodiment, the resistor network 140 can be directly or indirectly connected to the capacitor 110 or the power module 120. For example, other components can be connected between the resistor network 140 and the capacitor 110. Similarly, other components can be connected between the resistor network 140 and the power module 120.

[0071] According to one embodiment, a resistor network 140 is electrically connected between a capacitor 110 and a power module 120, thereby enabling the measurement of the voltage applied to the power module 120 and the voltage applied to the capacitor 110.

[0072] According to one embodiment, the resistor network 140 can be connected in various ways so that the voltage of the capacitor 110 can be applied to the resistor network 140. For example, the connection between the resistor network 140 and the capacitor 110 can be implemented in series, parallel, or combined connections. Thus, the desired electrical characteristics can be achieved, and the performance required in a specific application environment can be realized.

[0073] According to one embodiment, the resistor network 140 can include multiple resistor sets connected in series.

[0074] According to one embodiment, the resistor group can include multiple resistors connected in parallel. Here, the resistance value of each resistor can be determined to achieve the desired electrical characteristics. The parallel-connected resistor group can reduce the overall resistance value or distribute current through multiple paths. This parallel connection can be used to prevent overload and ensure stable operation. According to one embodiment, the resistor network 140 is used to discharge the capacitor 110 so that the voltage of the capacitor 110 reaches a voltage lower than a predetermined voltage within a predetermined time.

[0075] For example, the predetermined time can be set to the time required for the residual voltage in capacitor 110 to decrease to a safe level in order to prevent electric shock. As a specific example, the predetermined time can be set to 60 seconds.

[0076] For example, the predetermined voltage can be set to the degree to which the residual voltage in capacitor 110 after the power is turned off will not cause an electric shock. As a specific example, the predetermined voltage can be set to below 60V.

[0077] According to one embodiment, when current flows through the resistor network 140, a voltage drop may occur across the resistor network 140. The voltage of the capacitor 110 may be reduced due to the voltage drop across the resistor network 140.

[0078] For example, inverter device 100 can reduce the voltage of capacitor 110 by applying the voltage discharged from capacitor 110 to resistor network 140.

[0079] According to one embodiment, the inverter device 100 can adjust the time required for the voltage discharge of the capacitor 110 by using at least one of the capacitance of the capacitor 110, the resistance of the resistor network 140, or any combination thereof.

[0080] According to one embodiment, the resistor network 140 can be used to measure the voltage of the capacitor 110. For example, the resistor network 140 can include a sensing resistor.

[0081] According to one embodiment, the voltage of capacitor 110 can correspond to the DC voltage applied to capacitor 110. For example, as voltage accumulates in capacitor 110, the voltage of capacitor 110 can get closer and closer to the DC voltage. As a specific example, it can be understood that when capacitor 110 is fully charged, the voltage measured by resistor network 140 is the same as the voltage of capacitor 110.

[0082] According to one embodiment, the resistor network 140 can be configured within a predetermined distance from the coupling structure of the circuit board, or it can be configured in the edge region of the circuit board.

[0083] According to one embodiment, the resistor network 140 can be configured within a predetermined distance from the coupling structure of the circuit board used to fasten the circuit board to the housing.

[0084] According to one embodiment, the fastening structure of the circuit board can include a fastening structure for fastening the circuit board to the housing.

[0085] According to one embodiment, the housing is capable of accommodating an inverter device based on an embodiment of the present invention. That is, the housing is capable of accommodating a capacitor 110, a power module 120, a circuit board 130, and a resistor network 140 based on an embodiment of the present invention.

[0086] According to one embodiment, the circuit board 130 can be fastened and secured to the housing. For example, the circuit board 130 can be fastened to the housing by a fastening structure of the circuit board. In order to fasten the circuit board 130, the housing can include threads, slots, mounting recesses, or structures that perform similar functions corresponding to the fastening structure of the circuit board 130.

[0087] According to one embodiment, the fastening structure of the circuit board can be implemented in various ways for securing the circuit board and stably maintaining electrical connections. The fastening structure is designed with mechanical strength and durability in mind, ensuring the circuit board is firmly positioned and facilitating assembly processes. For example, the fastening structure of the circuit board can include a bolt structure.

[0088] According to one embodiment, the fastening structure can include various fixing methods besides bolt structures. For example, screws, rivets, clips, snap-fit ​​structures, etc., can be used. This structure can be used to fix circuit boards to other electronic components or housings.

[0089] In addition, fastening structures can assist in positioning electronic components and prevent circuit boards from moving due to external impacts or vibrations. Therefore, fastening structures can include shock-absorbing pads, elastic components, or cushioning materials.

[0090] According to one embodiment, the fastening structure of the circuit board can be combined with a heatsink or shielding structure to perform thermal management and electromagnetic shielding functions. For example, according to one embodiment, heat dissipation can be effectively achieved near the fastening structure of the circuit board. Since the fastening structure is a structural element in physical contact with the circuit board, it can be utilized as a heat dissipation path.

[0091] For example, when the fastening structure is made of metal, it can effectively transfer heat generated in the circuit board, thereby dissipating heat to an external heatsink or the device's casing. The fastening structure can be made of highly thermally conductive materials such as aluminum, copper, or alloys. Furthermore, by forming heat dissipation auxiliary structures such as fins or ribs around the fastening structure, air convection can be increased, improving heat dissipation performance. When the fastening structure is positioned in a location where air circulation is easy, heat dissipation can be achieved more quickly through natural or forced convection.

[0092] According to one embodiment, the fastening structure can also be designed to be integrated with the heat sink. In this case, the fastening structure can perform the dual purpose of securing the circuit board while simultaneously dissipating heat. For example, in the presence of high-output components such as power conversion circuits, the fastening structure near the corresponding component can serve as the primary heat dissipation path.

[0093] According to one embodiment, in order to optimize heat dissipation near the fastening structure, airflow channels can be ensured or adequate ventilation holes can be designed to prevent heat buildup.

[0094] According to one embodiment, the fastening structure can include a groove or slot formed on the surface of the circuit board. The groove or slot can include a space capable of accommodating fastening units such as bolts. That is, the fastening structure can include a groove or slot without fastening units such as bolts. Therefore, the resistor network 140 can also be configured within a predetermined distance from the slot or groove formed on the surface of the circuit board.

[0095] According to one embodiment, the resistor network 140 can be configured in the edge region of the circuit board.

[0096] Since the edge areas of a circuit board are typically where airflow is more efficient, the heat generated by the resistor network 140 can be dissipated more effectively. In particular, when the resistor network 140 is positioned in the edge areas taking into account the internal air circulation of the electronic device, heat buildup can be reduced, and the heat can be quickly dissipated to the outside through natural convection or forced airflow.

[0097] Furthermore, when the resistor network 140 is positioned in the edge region, it can physically contact or be positioned close to an external heatsink, metal casing, or heat sink, thereby shortening the heat transfer path. This structure reduces thermal resistance, improves heat dissipation efficiency, and enhances the overall thermal management performance of the device.

[0098] Furthermore, the resistor network 140 can be combined with a highly thermally conductive substrate such as a metal-based PCB to distribute heat throughout the entire substrate. This prevents overheating in specific areas and maintains thermal balance.

[0099] According to one embodiment, by configuring the resistor network in the edge region, a physical distance can be maintained from sensitive electronic components inside the circuit board, thereby reducing thermal interference and performance degradation due to heat. For example, additional vents or cooling fans can be provided near the edge region to maximize heat dissipation.

[0100] According to one embodiment, the resistor network 140 may be configured to discharge the voltage of the capacitor 110 to a predetermined voltage within a predetermined time according to predetermined conditions related to the power supply of the inverter device 100.

[0101] According to one embodiment, the predetermined conditions related to the power supply of the inverter device 100 can include conditions related to the discharge of the voltage of the capacitor 110 in order to prevent electric shock accidents.

[0102] According to one embodiment, predetermined conditions related to the power supply of the inverter device 100 may include: a condition where the power supply to the inverter device 100 is disconnected, a condition where the inverter device 100 is not operating normally, or at least one of any combination thereof.

[0103] For example, resistor network 140 may be configured to discharge capacitor 110 to a predetermined voltage within a predetermined time when the power supply to inverter device 100 is disconnected.

[0104] For example, the power supply to the inverter device 100 may be disconnected in cases where no voltage is applied to the inverter device 100 or where the current flowing to the inverter device 100 is cut off.

[0105] For example, resistor network 140 may be configured to discharge capacitor 110 to a predetermined voltage within a predetermined time when inverter device 100 is not operating normally.

[0106] For example, a malfunction of the inverter device 100 could include a short circuit in the inverter device 100's circuitry. Additionally, a malfunction could include an abnormal change in the inductance value of the inverter device 100. Furthermore, a malfunction could include magnetic saturation caused by excessively high current flowing through the inverter device 100.

[0107] According to one embodiment, while the voltage of capacitor 110 is stored in a state where the resistor network 140 is used to measure the voltage of capacitor 110, the resistor network 140 can be used to discharge capacitor 110 based on the power disconnection of inverter device 100, so that the voltage of capacitor 110 reaches a voltage lower than a predetermined voltage within a predetermined time.

[0108] According to one embodiment, when the voltage of capacitor 110 is not stored, the voltage of capacitor 110 will not discharge even if the power supply to inverter device 100 is disconnected.

[0109] According to one embodiment, the state in which the voltage of the capacitor 110 is not stored can include the state in which only a voltage lower than the predetermined voltage is stored in the capacitor 110.

[0110] For example, when the voltage stored in capacitor 110 is lower than the predetermined voltage, even if the power supply to inverter device 100 is disconnected, inverter device 100 does not need to discharge capacitor 110 to reach a voltage lower than the predetermined voltage within a predetermined time.

[0111] According to one embodiment, even when the power supply to the inverter device 100 is disconnected, the resistor network 140 can perform the function of measuring the voltage of the capacitor 110 without performing the function of discharging the voltage of the capacitor 110, even when the voltage of the capacitor 110 has not accumulated.

[0112] According to one embodiment, when the inverter device 100 is in operation, the resistor network 140 can be used to measure the voltage of the capacitor 110.

[0113] According to one embodiment, a third resistor may also be included, connected in series with the resistor network 140. For example, the third resistor may be used to divide the voltage of the capacitor into a voltage input to the MCU (Micro Controller Unit).

[0114] For example, an MCU can include a processor that performs functions such as measuring the voltage of a battery or processing data. As a specific example, the MCU can identify the voltage of capacitor 110. The MCU can also identify the voltage at which capacitor 110 is discharged.

[0115] According to one embodiment, the MCU can determine whether the voltage of capacitor 110 reaches a voltage lower than a predetermined voltage within a predetermined time.

[0116] According to one embodiment, when the resistor network 140 is used to measure the voltage of the capacitor 110, the voltage of the capacitor 110 can be divided into a voltage that can be applied to the MCU. The voltage that can be applied to the MCU can be set differently depending on the MCU. For example, the voltage of the capacitor 110 can be divided into a voltage above 0V and below 5V.

[0117] According to one embodiment, the third resistor can be used to divide the voltage of capacitor 110. For example, the third resistor can be used to divide the voltage of capacitor 110 according to Ohm's Law or Kirchhoff's Voltage Law.

[0118] According to one embodiment, the third resistor can be connected in series with the resistor network 140.

[0119] For example, the third resistor can be used to divide the voltage of capacitor 110 according to the ratio of the resistance values ​​of the series-connected resistor network 140. As a specific example, the third resistor can be used to divide the voltage of 60V capacitor 110 to 5V. The divided 5V voltage can then be applied to the MCU.

[0120] According to one embodiment, the resistor network 140 can include a plurality of resistors. For example, the resistor network 140 can include a first resistor and a second resistor. Here, the first resistor and the second resistor are merely examples, and the resistor network 140 can include n resistors.

[0121] According to one embodiment, the first resistor and the second resistor can be connected in series or in parallel. For example, the voltage of the capacitor 110 can be applied to the first resistor and the second resistor connected in series. As another example, the voltage of the capacitor 110 can be applied to the first resistor and the second resistor connected in parallel.

[0122] According to one embodiment, when the resistor network 140 includes three or more resistors, the three or more resistors can be connected in at least one manner, such as series, parallel, or any combination thereof. For example, two resistors can be connected in parallel with each other, and another resistor can be connected in series with the two resistors connected in parallel.

[0123] According to one embodiment, when the resistor network 140 includes a plurality of resistors, the plurality of resistors can be connected to each other in at least one manner, such as in series, in parallel, or any combination thereof, to have a target resistance value.

[0124] For example, multiple resistors can be connected in a manner with a specific resistance value that allows capacitor 110 to discharge so that the voltage of capacitor 110 reaches a voltage lower than a predetermined voltage within a predetermined time.

[0125] According to one embodiment, when the resistor network 140 includes multiple resistors, the spacing between the multiple resistors on the circuit board can be determined taking into account the temperature at which each resistor generates heat. For example, the circuit board can be included in the inverter device 100. For example, the resistor network 140 can be designed on the circuit board.

[0126] According to one embodiment, the spacing between resistors with high heating temperatures can be wider than the spacing between resistors with low heating temperatures.

[0127] For example, the spacing between multiple resistors on a circuit board can vary depending on their individual resistance values. As a specific example, the temperature at which heat is released from a resistor can vary depending on its resistance value. Therefore, resistors with larger resistance values ​​can be spaced further apart than resistors with smaller resistance values.

[0128] According to one embodiment, when the resistor network 140 includes a first resistor and a second resistor, the arrangement spacing of the first resistor and the second resistor on the circuit board can be determined by taking into account the temperature at which the first resistor and the second resistor are heated.

[0129] According to one embodiment, the spacing between the first resistor and the second resistor on the circuit board can vary depending on the resistance value of the first resistor or the second resistor.

[0130] According to one embodiment, the resistor network 140 can include a predetermined number of resistors.

[0131] According to one embodiment, the predetermined quantity can be set such that the temperature at which each of the predetermined quantity of resistors heats up does not exceed a predetermined temperature.

[0132] According to one embodiment, the predetermined temperature can be set taking into account the power consumed by each resistor and the heat generated by the resistor. For example, the predetermined temperature can be set to the temperature at which the resistor can function normally.

[0133] According to one embodiment, whether the temperature at which each resistor heats up exceeds a predetermined temperature can be determined by comparing the temperature of the resistor with the temperature around the resistor. For example, the predetermined temperature can be set based on the difference between the temperature at which the resistor heats up and the temperature around the resistor. As a specific example, when setting the predetermined temperature by comparing the temperature of the resistor with the temperature around the resistor, the predetermined temperature can be set to 25 degrees Celsius. In this case, if the temperature of the resistor is 60 degrees Celsius and the temperature around the resistor is 30 degrees Celsius, it can be determined that the temperature of the resistor exceeds the predetermined temperature.

[0134] According to one embodiment, whether the temperature at which each resistor heats up exceeds a predetermined temperature can be determined based on the absolute value of the temperature at which the resistor heats up. In this case, the predetermined temperature can be fixed at a specific temperature. As a specific example, the predetermined temperature can be fixed at 70 degrees Celsius. In this case, if the temperature at which each resistor heats up is 80 degrees Celsius, it can be determined that the temperature of the resistor exceeds the predetermined temperature.

[0135] According to one embodiment, whether the temperature at which each resistor heats up exceeds a predetermined temperature can be determined based on the amount of temperature change of each resistor. For example, the amount of temperature change of each resistor can be calculated based on the temperature difference between the resistor before and after applying voltage to it.

[0136] According to one embodiment, the resistor network 140 can include 24 resistors. For example, the resistor network 140 can include 12 resistor groups, each resistor group including two resistors connected in parallel with each other. In this case, the 12 resistor groups can be connected in series with each other.

[0137] According to one embodiment, the voltage of capacitor 110 can be measured by the voltage drop between one end of resistor network 140 and the other end of resistor network 140.

[0138] For example, the voltage of capacitor 110 can be measured by the voltage drop between a first terminal and a second terminal of resistor network 140. Here, the first terminal can refer to one side of resistor network 140, and the second terminal can refer to the other side of resistor network 140. Inverter device 100 can indirectly identify the voltage change of capacitor 110 by utilizing the voltage drop generated by the current flowing through resistor network 140. Inverter device 100 can effectively monitor the voltage change of capacitor 110 using resistor network 140.

[0139] Reference based on one embodiment Figure 1 By using a resistor network 140 that can be used to discharge the voltage of capacitor 110 and to measure the voltage of capacitor 110, the size of inverter device 100 or capacitor 110 can be reduced and the cost lowered.

[0140] According to one embodiment, the resistor network can include at least one resistor. For example, capacitor discharge or capacitor voltage measurement can be performed through the resistor network via the at least one resistor.

[0141] According to one embodiment, at least one resistor can be used to discharge capacitor 110 so that the voltage of capacitor 110 reaches a voltage lower than a predetermined voltage within a predetermined time.

[0142] According to one embodiment, when current flows through at least one resistor, a voltage drop may be generated across the at least one resistor. The voltage of capacitor 110 can be reduced based on the voltage drop generated across the at least one resistor.

[0143] According to one embodiment, the inverter device 100 can adjust the time required for the voltage discharge of the capacitor 110 by using at least one of the capacitance of the capacitor 110, the size of at least one resistor, or any combination thereof.

[0144] According to one embodiment, at least one resistor can be used to measure the voltage of capacitor 110. According to one embodiment, the voltage of capacitor 110 can correspond to a DC voltage applied to capacitor 110. For example, as voltage accumulates in capacitor 110, the voltage of capacitor 110 can get closer and closer to a DC voltage.

[0145] According to one embodiment, at least one resistor can be used to discharge the voltage of capacitor 110 to a predetermined voltage within a predetermined time, according to predetermined conditions related to the power supply of inverter device 100.

[0146] According to one embodiment, predetermined conditions related to the power supply of the inverter device 100 may include: a condition where the power supply to the inverter device 100 is disconnected, a condition where the inverter device 100 is not operating normally, or at least one of any combination thereof.

[0147] According to one embodiment, during the period when at least one resistor is used to measure the voltage of capacitor 110 while the voltage of capacitor 110 is in a state of accumulation, the at least one resistor can be used to discharge capacitor 110 based on the power supply being disconnected from inverter device 100, so that the voltage of capacitor 110 reaches a voltage lower than a predetermined voltage within a predetermined time.

[0148] According to one embodiment, when the voltage of capacitor 110 is not stored, the voltage of capacitor 110 will not discharge even if the power supply to inverter device 100 is disconnected.

[0149] According to one embodiment, the state in which the voltage of the capacitor 110 is not accumulated can include the state in which the capacitor 110 only accumulates a voltage lower than the predetermined voltage mentioned above.

[0150] According to one embodiment, even when the power supply to the inverter device 100 is disconnected, if the voltage of the capacitor 110 is not stored, at least one resistor can perform the function of measuring the voltage of the capacitor 110, but does not perform the function of discharging the voltage of the capacitor 110.

[0151] According to one embodiment, when the inverter device 100 is in operation, at least one resistor can be used to measure the voltage of the capacitor 110.

[0152] According to one embodiment, a third resistor connected in series with at least one resistor may also be included. For example, the third resistor may be used to divide the voltage of the capacitor into the voltage input to the MCU (Micro Controller Unit).

[0153] According to one embodiment, when at least one resistor is used to measure the voltage of capacitor 110, the voltage of capacitor 110 can be divided into a voltage that can be applied to the MCU. The voltage that can be applied to the MCU can be set differently depending on the MCU. For example, the voltage of capacitor 110 can be divided into a voltage above 0V and below 5V.

[0154] According to one embodiment, the third resistor can be used to divide the voltage of capacitor 110. For example, the third resistor can be used to divide the voltage of capacitor 110 according to Ohm's Law or Kirchhoff's Voltage Law.

[0155] According to one embodiment, when at least one resistor comprises multiple resistors, the spacing between the multiple resistors on the circuit board can be determined taking into account the temperature at which each of the multiple resistors generates heat. For example, the aforementioned circuit board can be included in an inverter device 100. For example, at least one resistor can be designed on the aforementioned circuit board.

[0156] According to one embodiment, the spacing between resistors with high heating temperatures can be wider than the spacing between resistors with low heating temperatures.

[0157] According to one embodiment, when at least one resistor includes a first resistor and a second resistor, the arrangement spacing of the first resistor and the second resistor on the circuit can be determined by taking into account the temperatures at which the first resistor and the second resistor are heated respectively.

[0158] According to one embodiment, the spacing between the first resistor and the second resistor in the circuit can vary depending on the resistance value of the first resistor or the second resistor.

[0159] According to one embodiment, at least one resistor can include a predetermined number of resistors.

[0160] According to one embodiment, the predetermined quantity can be set such that the temperature at which each of the predetermined quantity of resistors heats up does not exceed a predetermined temperature.

[0161] According to one embodiment, the predetermined temperature can be set taking into account the power consumed by each resistor and the heat generated by the resistor. For example, the predetermined temperature can be set to the temperature at which the resistor can function normally.

[0162] According to one embodiment, the voltage of capacitor 110 can be measured by the voltage drop between one end of at least one resistor and the other end of at least one resistor.

[0163] Figure 2 This is a diagram showing a portion of a circuit board of an inverter device with a resistor network configured according to an embodiment of the present invention.

[0164] Based on an embodiment Figure 2 A portion of the circuit board included in the inverter unit can be shown.

[0165] According to one embodiment, the inverter device may include a circuit board 200 for controlling battery voltage. The circuit board 200 of the inverter device may include a resistor network 210 in which multiple resistors are connected in series or in parallel.

[0166] According to one embodiment, the resistor network 210 can include multiple resistor groups connected in series. A resistor group can include multiple resistors connected in parallel.

[0167] For example, resistor network 210 can include a resistor array that physically contains multiple groups of resistors within a single package.

[0168] For example, a resistor bank can include a resistor array that physically contains multiple resistors within a single package.

[0169] According to one embodiment, the resistor network 210 included in the circuit board 200 of the inverter device can be used to discharge voltage or to measure voltage. For example, the inverter device can use the resistor network 210 to discharge the voltage of a capacitor to 60V within 60 seconds. For example, the inverter device can use the resistor network 210 to measure the voltage of a capacitor.

[0170] According to one embodiment, the resistor network 210 can include a resistor group 220 consisting of two resistors connected in parallel. The spacing between the resistors included in the resistor group 220 can be determined by considering the resistance value or the temperature of the resistors. For example, the higher the temperature at which the resistors heat up, the wider the spacing between the resistors.

[0171] Figure 3 This is a circuit diagram based on an embodiment of the present invention for enabling the resistor network of an inverter device to perform discharge and sensing functions.

[0172] An inverter device based on one embodiment may include circuitry 300 associated with a resistor capable of performing discharge and sensing functions.

[0173] Based on an embodiment Figure 3 The circuit 300 shown may include: a resistor network 310 containing resistors capable of performing discharge and sensing functions, a low-pass filter (LPF) element group 320, or a differential amplifier element group 330. However, this is only an example, and the LPF element group 320 or the differential amplifier element group 330 may be omitted.

[0174] Based on an embodiment Figure 3 A DC voltage can be applied to the circuit 300 shown. For example, the DC voltage of the inverter's DC capacitor can be applied to circuit 300. As a specific example, with the DC voltage of a high-voltage battery applied to the inverter, the inverter's DC capacitor can store electricity. Therefore, it is possible to... Figure 3 The circuit 300 shown applies a voltage to the DC capacitor.

[0175] According to one embodiment, a resistor network 310 including resistors capable of performing discharge and sensing functions may include a resistor network 311 for discharging a capacitor so that the voltage of the capacitor reaches a voltage lower than a predetermined voltage within a predetermined time, or for measuring the voltage of the capacitor.

[0176] Reference based on one embodiment Figure 3 In circuit 300, the number of resistor networks 311 can be determined such that the temperature generated by each resistor network 311 does not exceed a predetermined temperature. In this case, the predetermined temperature can be set taking into account the power consumed by each resistor and the heat generated by the resistor. For example, the predetermined temperature can be set to the temperature at which the resistor can function normally.

[0177] According to one embodiment, the resistor network 311 can be connected in at least one manner, such as series, parallel, or any combination thereof. For example, it includes... Figure 3 The resistor network 311 in circuit 300 may include a total of 24 resistors. As a specific example, resistor network 311 may include a resistor group consisting of two resistors connected in parallel. Furthermore, resistor network 311 may include 12 resistor groups. The 12 resistor groups may be connected in series with each other. However, this is only one embodiment, and the number and connection method of resistor network 311 can be changed in various ways.

[0178] According to one embodiment, a resistor network 310 including resistors capable of performing discharge and sensing functions may include a third resistor 312 for dividing the voltage of a capacitor into a voltage input to an MCU (Micro Controller Unit).

[0179] According to one embodiment, a third resistor 312 can be connected to a resistor network 311 for voltage division of a DC voltage. For example, the third resistor 312 can be connected in series with the resistor network 311 to divide the voltage of a DC capacitor according to Ohm's Law or Kirchhoff's Voltage Law.

[0180] According to one embodiment, the LPF element group 320 may include elements for implementing a low-pass filter. For example, the LPF element group 320 may include a fourth resistor 321 and a second capacitor 322. The LPF element group 320 can perform the function of an electronic filter that allows low-frequency signals to pass through and blocks high-frequency signals.

[0181] According to one embodiment, the differential amplifier element group 330 is capable of amplifying the voltage difference between two input signals. The differential amplifier element group 330 is capable of performing specific functions related to signal processing and improving stability.

[0182] An inverter device based on one embodiment can be used by... Figure 3 The circuit 300 is configured such that the resistor network 311 can simultaneously perform the discharge function and the sensing function.

[0183] Figure 4 This is a graph showing the DC voltage, power consumption of each resistor, and DC sense voltage measured as the capacitor of an inverter device based on an embodiment of the present invention discharges.

[0184] Based on an embodiment Figure 4 It can be shown that when the power supply to the inverter is disconnected after applying DC voltage, the inverter is discharged to reach 60V within 60 seconds.

[0185] Based on an embodiment Figure 4 It can include: a first graph 410 representing the DC voltage as a function of time, a second graph 420 representing the power consumption of each resistor as a function of time, and a third graph 430 representing the DC sense voltage as a function of time.

[0186] Based on an embodiment Figure 4 It can include information about the first moment 401 when the discharge begins and the second moment 402 when the voltage reaches below 60V after the discharge. For example, the interval (P) between the first moment 401 and the second moment 402 can be determined to be 60 seconds. That is, after 60 seconds from the first moment 401 when the discharge begins, i.e., the second moment 402, the result that the DC voltage reaches below 60V can be obtained.

[0187] A first graph 410 based on one embodiment can represent the change of DC voltage over time. The DC voltage can include the voltage of a high-voltage battery. For example, referring to the first graph 410, the DC voltage can start discharging from a voltage of 400V or higher and 500V or lower until it reaches a voltage of 60V or lower.

[0188] The second graph 420, based on one embodiment, can represent the power consumption of each resistor over time. As discharge begins, the power consumption of each resistor can also decrease. The power consumption of each resistor can be taken into account when calculating the heat generated by the resistor.

[0189] A third graph 430 based on one embodiment can represent a time-based DC sensed voltage. The DC sensed voltage can include a voltage that can be input to an MCU. For example, the DC sensed voltage can include a voltage that is a DC voltage divided into a voltage that can be input to an MCU. As a specific example, the DC sensed voltage can include a voltage that is above 0V and below 5V.

[0190] An inverter device based on one embodiment can discharge a DC voltage to 60V within 60 seconds using a resistor capable of simultaneously performing discharge and sensing functions. Additionally, the inverter device can use a resistor capable of simultaneously performing discharge and sensing functions to measure the DC voltage or the DC sensed voltage.

[0191] Figure 5 This is a graph showing the relationship between the DC voltage and the temperature of the resistor in an inverter device based on an embodiment of the present invention.

[0192] Based on an embodiment Figure 5 Table 500 can include information about the state of charge (SOC) based on DC voltage and information about the temperature of the resistor.

[0193] According to an embodiment Figure 5 The higher the DC voltage, the higher the temperature of the resistor may be. The temperature of the resistor can include the temperature measured due to the heating of the resistor.

[0194] Based on an embodiment Figure 5 The temperature change shown in Table 500 ( (T) can represent the temperature difference between the temperature at which the resistor heats up and the temperature around the resistor. For example, if the temperature of the resistor is 54 degrees Celsius and the temperature around the resistor is 25 degrees Celsius, then the temperature change (T) is... T) can be determined to be 29 degrees.

[0195] According to an embodiment Figure 5 Table 500 shows that the higher the DC voltage, the higher the temperature the resistor can reach. The higher the temperature of the resistor, the greater the temperature change (…). T) can also be larger.

[0196] According to one embodiment, it is possible to utilize the amount of temperature change ( T) is used to determine whether the resistor can properly perform its discharge and sensing functions. For example, in the case of temperature change ( When T is within 50 degrees Celsius, it can be confirmed that the resistor can normally perform the discharge and sensing functions. Therefore, it is possible to determine at least one of the following: the resistance value, the number of resistors, the connection method of the resistors, or any combination thereof, to ensure that the temperature change (T) is within 50 degrees Celsius. (T) can be kept below 50 degrees.

[0197] Reference based on one embodiment Figure 5 It is possible to determine the resistance value, number of resistors, or connection method of the inverter device based on the resistance temperature of DC voltage.

[0198] The following is for reference. Figure 6 and Figure 7Specifically, an inverter device or inverter control method based on an embodiment of the present invention will be described.

[0199] the following, Figure 1 The inverter device 100 is capable of performing Figure 6 or Figure 7 The process. For example, it can be understood as... Figure 6 or Figure 7 The operation is performed by the inverter device 100.

[0200] Figure 6 This is a flowchart illustrating an inverter device or inverter control method based on an embodiment of the present invention.

[0201] According to one embodiment, a capacitor can be discharged through a resistor network mounted on a circuit board, so that the voltage of the capacitor reaches a voltage lower than a predetermined voltage within a predetermined time (S610). For example, the inverter device 100 can use the resistor network to discharge the voltage of the capacitor to a voltage lower than a predetermined voltage within a predetermined time.

[0202] According to one embodiment, the resistor network can include multiple resistor sets connected in series, and each resistor set can include multiple resistors connected in parallel.

[0203] The aforementioned predetermined time can be set to the time required for the residual voltage in the capacitor to decrease to a safe level in order to prevent electric shock. As a specific example, the predetermined time can be set to 60 seconds.

[0204] The aforementioned predetermined voltage can be set to a level where the residual voltage in the capacitor after the power is turned off will not cause an electric shock. As a specific example, the predetermined voltage can be set to below 60V.

[0205] According to one embodiment, the voltage of a capacitor can be measured via a resistor network (S620). For example, an inverter device can utilize a resistor network to measure the voltage of a capacitor. The voltage of the capacitor can include the voltage stored as DC voltage.

[0206] According to one embodiment, the voltage of a capacitor can be converted to AC voltage by a power module (S630). For example, the power module can convert DC voltage to AC voltage by a switching element. That is, the power module can convert the voltage of a capacitor to AC voltage by a switching element.

[0207] According to one embodiment, the circuit board can mount an MCU (Micro Controller Unit) for controlling the power module and a resistor network.

[0208] According to one embodiment, a resistor network is electrically connected between a capacitor and a power module, thereby enabling the simultaneous performance of discharging the capacitor and measuring the voltage of the capacitor.

[0209] According to one embodiment, the inverter device can control the voltage of a high-voltage battery. The voltage of the high-voltage battery can be applied to the inverter device. The inverter device can include a DC capacitor, in which the DC voltage applied to the inverter device can be stored. The DC capacitor can prevent ripple. The DC voltage can then be converted to AC voltage. The AC voltage can be used to drive a motor. At this time, when the power supply to the inverter device is disconnected, the voltage stored in the DC capacitor can be discharged to prevent electric shock accidents. The inverter device uses a resistor capable of performing both a discharge function and a sensing function to discharge the voltage stored in the DC capacitor.

[0210] Figure 7 This is a flowchart illustrating the mechanism by which the resistor network of an inverter device based on an embodiment of the present invention performs discharge and voltage sensing functions.

[0211] According to one embodiment, a DC voltage can be applied to the inverter (S710). The DC voltage can include the DC voltage of the high-voltage battery. Figure 7 The inverter can be understood as an inverter device based on the present invention.

[0212] According to one embodiment, an integrated circuit (S720) capable of applying DC voltage to an inverter is included. The integrated circuit may represent a circuit including a resistor capable of discharging the voltage of a DC capacitor or capable of sensing the DC voltage.

[0213] According to one embodiment, it is possible to determine whether the inverter is powered on (S730).

[0214] According to one embodiment, when the inverter is powered on, the DC capacitor can be charged (S740). The DC capacitor may include a capacitor contained in the inverter device. The DC capacitor can be charged by a DC voltage.

[0215] According to one embodiment, when the inverter is powered on, the DC voltage of the inverter can be sensed (S750). At this time, the DC voltage can be sensed using a resistor capable of sensing the DC voltage. The DC voltage can be continuously sensed during the inverter's power-on period.

[0216] According to one embodiment, it is possible to determine whether the power supply to the inverter is disconnected (S760).

[0217] According to one embodiment, DC voltage can continue to be sensed while the inverter's power supply is not disconnected.

[0218] According to one embodiment, when the power supply to the inverter is disconnected, the DC capacitor can be discharged (S770).

[0219] According to one embodiment, the voltage of the DC capacitor can reach the reference voltage within a reference time after the discharge begins (S780). At this time, the DC capacitor can be discharged by discharging the voltage of the DC capacitor or by a resistor capable of sensing the DC voltage, so as to reach the reference voltage within the reference time.

[0220] For example, the reference time can be set to the time required for the residual voltage in the DC capacitor to decrease to a safe level to prevent electric shock. As a specific example, the reference time can be set to 60 seconds.

[0221] For example, the reference voltage can be set to a level where the residual voltage in the DC capacitor after the inverter is turned off will not cause an electric shock. As a specific example, the reference voltage can be set to below 60V.

[0222] Figure 8 This is a diagram illustrating a computer system related to an inverter device or inverter control method based on an embodiment of the present invention.

[0223] refer to Figure 8 The computer system 1000 may include at least one processor 1100, memory 1300, user interface input device 1400, user interface output device 1500, storage device 1600 and network interface 1700 connected via bus 1200.

[0224] Processor 1100 may be a central processing unit (CPU) or a semiconductor device that executes processing of multiple instructions stored in memory 1300 and / or storage device 1600. Memory 1300 and storage device 1600 may include various volatile or non-volatile storage media. For example, memory 1300 may include ROM (Read Only Memory) 1310 and RAM (Random Access Memory) 1320.

[0225] Therefore, the steps of the methods or algorithms described in relation to the embodiments disclosed in this specification can be implemented directly by hardware, a software module executed by processor 1100, or a combination of both. The software module may also reside in storage media such as RAM, flash memory, ROM, EPROM, EEPROM, registers, hard disk, removable disk, CD-ROM, etc. (i.e., memory 1300 and / or storage device 1600).

[0226] An exemplary storage medium is connected to a processor 1100, which is capable of reading information from and writing information to the storage medium. Alternatively, the storage medium may be integrated with the processor 1100. The processor and storage medium may also reside within a custom integrated circuit (ASIC). The ASIC may also reside within a user terminal. Alternatively, the processor and storage medium may reside as separate components within the user terminal.

[0227] The above description is merely an exemplary illustration of the technical concept of the present invention. Those skilled in the art to which this invention pertains can make various modifications and improvements without departing from the essential characteristics of the present invention.

[0228] Therefore, the embodiments disclosed in this invention are not intended to limit the technical concept of the invention, but are intended to illustrate it. The scope of the technical concept of the invention is not limited by these embodiments. The scope of protection of the invention should be interpreted in accordance with the appended claims, and should be interpreted as including all technical concepts within their equivalent scope within the scope of the invention.

Claims

1. An inverter device, comprising: A capacitor to which a DC voltage is applied; A power module that converts the voltage of the capacitor into AC voltage via a switching element; The MCU controls the power module; A resistor network comprising multiple groups of resistors connected in series; and The circuit board, on which the MCU and the resistor network are mounted, The resistor group comprises multiple resistors connected in parallel. The resistor network is electrically connected between the capacitor and the power module.

2. The inverter device according to claim 1, characterized in that, The resistor network is configured within a predetermined distance from the fastening structure of the circuit board, or configured in the edge region of the circuit board, wherein the fastening structure is used to fasten the circuit board to the housing.

3. The inverter device according to claim 1, characterized in that, The resistor network is used to discharge the capacitor so that the voltage of the capacitor reaches a voltage lower than a predetermined voltage within a predetermined time, and is also used to measure the voltage of the capacitor.

4. The inverter device according to claim 3, characterized in that, The resistor network is configured to discharge the voltage of the capacitor to a predetermined voltage within a predetermined time according to predetermined conditions related to the power supply of the inverter device.

5. The inverter device according to claim 4, characterized in that, The predetermined conditions related to the power supply of the inverter device include: the condition that the power supply to the inverter device is disconnected, the condition that the inverter device is not operating normally, or at least one of any combination thereof.

6. The inverter device according to claim 3, characterized in that, While the resistor network is used to measure the voltage of the capacitor in a state where the voltage of the capacitor has accumulated, the resistor network is used to discharge the capacitor based on the power disconnection of the inverter device, so that the voltage of the capacitor reaches a voltage lower than the predetermined voltage within the predetermined time.

7. The inverter device according to claim 1, characterized in that, The circuit board further includes a third resistor connected in series with the resistor network. The third resistor is used to divide the voltage of the capacitor into the voltage input to the MCU.

8. The inverter device according to claim 1, characterized in that, The resistor network includes a first resistor and a second resistor. The spacing between the first resistor and the second resistor on the circuit board is determined by taking into account the temperature at which the first resistor and the second resistor generate heat.

9. The inverter device according to claim 1, characterized in that, The resistor network includes a predetermined number of resistors. The predetermined number is set such that the temperature at which each of the predetermined number of resistors heats up does not exceed a predetermined temperature.

10. The inverter device according to claim 1, characterized in that, The voltage of the capacitor is measured by the voltage drop between one end of the resistor network and the other end of the resistor network.

11. An inverter control method, comprising the following operations: The capacitor is discharged by a resistor network mounted on the circuit board so that the voltage of the capacitor reaches a voltage lower than a predetermined voltage within a predetermined time. The voltage of the capacitor is measured through the resistor network; and The voltage of the capacitor is converted to AC voltage via a power module. in, The circuit board is equipped with an MCU that controls the power module and the resistor network. The resistor network comprises multiple resistor groups connected in series and is electrically connected between the capacitor and the power module. The resistor group comprises multiple resistors connected in parallel.

12. The inverter control method according to claim 11, characterized in that, The resistor network is configured within a predetermined distance from the fastening structure of the circuit board, or configured in the edge region of the circuit board, wherein the fastening structure is used to fasten the circuit board to the housing.

13. The inverter control method according to claim 11, characterized in that, The operation of discharging a capacitor through a resistor network to bring the capacitor's voltage down to a lower voltage than a predetermined voltage within a predetermined time includes: The capacitor is discharged to a predetermined voltage within a predetermined time by means of the resistor network according to predetermined conditions related to the power supply of the inverter device.

14. The inverter control method according to claim 13, characterized in that, Predetermined conditions related to the power supply of the inverter device include: The conditions under which the power supply to the inverter device is disconnected, the conditions under which the inverter device is not operating normally, or any combination thereof, are at least one of the following:

15. The inverter control method according to claim 11, characterized in that, The operation of discharging a capacitor through a resistor network to bring the capacitor's voltage down to a lower voltage than a predetermined voltage within a predetermined time includes: While the resistor network is used to measure the voltage of the capacitor in a state where the voltage of the capacitor has accumulated, the power supply to the inverter device is disconnected, and the resistor network is used to discharge the capacitor so that the voltage of the capacitor reaches a voltage lower than the predetermined voltage within the predetermined time.

16. The inverter control method according to claim 11, characterized in that, Further operations include the following: The voltage of the capacitor is divided into the voltage input to the MCU by a third resistor connected in series with the resistor network and mounted on the circuit board.

17. The inverter control method according to claim 11, characterized in that, The resistor network includes a first resistor and a second resistor. The spacing between the first resistor and the second resistor on the circuit board is determined by taking into account the temperature at which the first resistor and the second resistor generate heat.

18. The inverter control method according to claim 11, characterized in that, The resistor network includes a predetermined number of resistors. The predetermined number is set such that the temperature at which each of the predetermined number of resistors heats up does not exceed a predetermined temperature.

19. The inverter control method according to claim 11, characterized in that, The operation of converting the capacitor's voltage to AC voltage via a power module includes: The voltage of the capacitor is converted to AC voltage by a predetermined number of switching elements.

20. The inverter control method according to claim 11, characterized in that, The operation of measuring the voltage of a capacitor using a resistor network includes: The voltage of the capacitor is measured by the voltage drop between one end of the resistor network and the other end of the resistor network.

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