Heat dissipation device and electronic device

Abstract

This application provides a heat dissipation device and an electronic device. The heat dissipation device includes a piezoelectric vibrator, a first carrier, a first cover plate, and a second cover plate. The heat dissipation device also includes a heat-conducting air duct. Along a third direction, the heat-conducting air duct has an air outlet and an air inlet arranged in opposite directions. The piezoelectric vibrator includes a vibrating substrate and a piezoelectric element connected to the surface of the vibrating substrate. The heat-conducting air duct includes a first chamber, a second chamber, a first sub-channel, and a second sub-channel. When the piezoelectric element is energized, it causes the vibrating substrate to deform and reciprocate in a second direction. The volumes of the first chamber and the second chamber are repeatedly exchanged between compression and expansion, so that external gas is drawn into the heat-conducting air duct through the air inlet and discharged from the air outlet. The second direction is the thickness direction of the heat dissipation device, and the first direction, the second direction, and the third direction are perpendicular to each other.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, and in particular to a heat dissipation device and electronic device. Background Technology

[0002] With the trend towards thinner and thinner electronic devices such as mobile phones, computers, and tablets, the challenge of dissipating heat from internal heat sources (such as integrated chips, central processing units, and system-on-a-chip) is gradually increasing. Traditionally, heat from these internal heat sources in electronic devices is passively conducted to the outer casing for dissipation. However, passive cooling is less effective than active cooling, and the performance of electronic devices is often limited by their power consumption and poor heat dissipation. Furthermore, existing fans are generally large and noisy, which is not conducive to the needs of electronic devices. Summary of the Invention

[0003] This application provides a heat dissipation device and an electronic device that can actively dissipate heat from the electronic device, reduce noise, and facilitate the thinning of the electronic device.

[0004] In a first aspect, embodiments of this application provide a heat dissipation device, which includes a piezoelectric vibrator, a first carrier, a first cover plate, and a second cover plate. The heat dissipation device also includes a heat-conducting air duct. Along a third direction, the heat-conducting air duct has an air outlet and an air inlet arranged in opposite directions. The piezoelectric vibrator includes a vibrating substrate and a piezoelectric element connected to the surface of the vibrating substrate. The end of the vibrating substrate in a first direction is fixed between the first cover plate and the second cover plate. Along a second direction, the first cover plate, the piezoelectric vibrator, and the second cover plate are stacked. The piezoelectric vibrator is spaced apart from the first cover plate to form a first chamber, and the piezoelectric vibrator is spaced apart from the second cover plate to form a second chamber.

[0005] The first carrier includes a first side surface and a second side surface disposed opposite to the first side surface. The first carrier also includes a first flow channel, which penetrates the first side surface and the second side surface and extends along the third direction. The opening of the first flow channel on the second side surface is the air outlet of the heat dissipation device. The first flow channel includes a first sub-flow channel and a second sub-flow channel, which are spaced apart along the first direction and both penetrate the first side surface. Along the third direction, the first side surface of the first carrier is connected to the same side of the first cover plate and the second cover plate. The air inlet of the heat dissipation device is located on the side of the first cover plate and the second cover plate opposite to the first carrier. The first chamber and the second chamber are both connected to the air inlet. The first chamber is connected to the first sub-flow channel, and the second chamber is connected to the second sub-flow channel and extends along the third direction. The first sub-flow channel and the second sub-flow channel are both connected to the air outlet.

[0006] The heat-conducting air duct includes a first chamber, a second chamber, and a first flow channel. When the piezoelectric element is energized, it causes the vibrating substrate to deform and reciprocate in the second direction. The volumes of the first chamber and the second chamber are repeatedly exchanged between compression and expansion, so that external gas is drawn into the heat-conducting air duct through the air inlet and discharged from the air outlet. The second direction is the thickness direction of the heat dissipation device, and the first direction, the second direction, and the third direction are perpendicular to each other.

[0007] In this embodiment, the piezoelectric vibrator reciprocates along the second direction under the action of the inverse piezoelectric effect, causing the volume of the first and second chambers to be compressed or expanded, resulting in the expulsion of gas from the chambers or the intake of gas from the outside. This process is noiseless, and the device switches between the first and second states during operation. In any state between the first and second states, the vibration of the vibrating substrate compresses the airflow, and the heat dissipation device always draws in air from the inlet and exhausts air from the outlet. In this embodiment, the heat source is located on the outlet side of the heat dissipation device, and the device directly dissipates heat from the outlet using the exhaust gas, ensuring efficient heat dissipation. Furthermore, the outlet and inlet are in opposite directions and are positioned perpendicular to the thickness direction of the vibrating substrate, thereby reducing the thickness dimension of the heat dissipation device and facilitating its thinner design.

[0008] In one embodiment, the piezoelectric element is a sheet made of piezoelectric ceramic. The vibrating substrate can achieve the same small size as silicon-based MENS thin film materials, or even thinner than silicon-based MENS thin films, enabling the heat dissipation device to be thinner while further improving the heat dissipation efficiency, making it more suitable for the needs of miniaturized electronic devices.

[0009] In one embodiment, the piezoelectric vibrator is spaced apart from the first side surface in the third direction, forming a flow-blocking channel. The flow-blocking channel communicates with the first chamber and the second chamber in the second direction. In this embodiment, because part of the airflow returning to the second chamber through the first flow channel and part of the airflow entering the second chamber through the flow-blocking channel collide, they meet and form a vortex at the end of the second chamber near the first support. The vortex, in turn, acts on the airflow returning from the flow-blocking channel and the first flow channel, reducing the amount of gas returning through the first flow channel and the flow-blocking channel, allowing more gas to be blown towards the heat source, further improving the heat dissipation efficiency of the heat source, thereby contributing to a further improvement in the heat dissipation performance of the heat dissipation device.

[0010] In one embodiment, the heat dissipation device further includes two support members, which connect the vibrating substrate to the first cover plate and the vibrating substrate to the second cover plate. The two support members are located at opposite ends of the first cover plate in the first direction. The support members support the vibrating substrate between the first cover plate and the second cover plate to form the first chamber and the second chamber.

[0011] One end of the vibrating substrate is fixedly connected to one of the support members, and the other end is spaced apart from another support member; alternatively, the vibrating substrate is connected to two support members at opposite ends in the first direction. In this embodiment, the support members are used to support and fix the piezoelectric vibrator.

[0012] In one embodiment, the heat dissipation device further includes reinforcing ribs stacked between the support member and the vibrating substrate. Two reinforcing ribs are located at opposite ends of the vibrating substrate in the first direction. Each reinforcing rib includes an extension section located within the first cavity and stacked with the vibrating substrate. In this embodiment, because the width of the reinforcing rib is greater than the width of the first support member, the extension section increases the structural rigidity at the connection point between the vibrating substrate and the first support member, thereby reducing the thickness of the vibrating substrate. Specifically, in this embodiment, the thickness of the vibrating substrate is less than or equal to 0.1 mm. Compared to existing vibrating substrates with greater thickness and no reinforcing ribs, the reduced thickness of the vibrating substrate increases the space of the first and second cavities, increases the vibration frequency of the piezoelectric oscillator, and thus improves the heat dissipation efficiency of the heat dissipation device.

[0013] In one embodiment, the vibrating substrate includes a first surface and a second surface facing away from each other. The piezoelectric element comprises three components: a first piezoelectric element and two second piezoelectric elements. The first piezoelectric element and the two second piezoelectric elements are connected to the first surface, with the first piezoelectric element positioned between and spaced apart from the two second piezoelectric elements. Alternatively, the first piezoelectric element is connected to the first surface, and the two second piezoelectric elements are connected to the second surface. In the second direction, the two second piezoelectric elements are completely offset from the first piezoelectric element. In this embodiment, the first piezoelectric element and the two second piezoelectric elements increase the volume of one of the first or second chambers and decrease the volume of the other, thereby further increasing the amount of gas drawn in and expelled by the heat dissipation device, improving the heat dissipation efficiency of the heat dissipation device for the heat source.

[0014] In one embodiment, the electrode of the first piezoelectric element is the same as the electrodes of the two second piezoelectric elements, and the polarization direction of the first piezoelectric element is opposite to the polarization direction of the two second piezoelectric elements.

[0015] In one embodiment, the heat dissipation device further includes two support members, which connect the vibrating substrate to the first cover plate and the vibrating substrate to the second cover plate. The two support members are located at opposite ends of the vibrating substrate in the first direction. The heat dissipation device further includes two reinforcing ribs, which are stacked between the support members and the vibrating substrate. Each reinforcing rib includes an extension section, which is located in the first cavity and is stacked and connected to the vibrating substrate. In the second direction, two second piezoelectric elements are stacked with the reinforcing ribs respectively.

[0016] In one embodiment, the heat dissipation device includes a second support body, which includes a first side and a second side. The first side and the second side are arranged opposite to each other along the third direction. The second support body also includes a second flow channel that passes through the first side and the second side. The opening of the second flow channel on the first side is the air inlet. The second side is connected to the first cover plate and the second cover plate. The opening of the second flow channel on the second side is opposite to and communicates with the first chamber and the second chamber. In this embodiment, the second support body increases the effective airflow rate of the air inlet.

[0017] In one embodiment, the cross-sectional area of ​​the second flow channel gradually decreases from the first side to the second side, and the area of ​​the opening of the second flow channel on the first side is greater than the area of ​​the opening of the second flow channel on the second side.

[0018] In one embodiment, the second flow channel includes a first wall and a second wall opposite each other along the second direction, the surfaces of the first wall and the second wall being curved away from each other. The shape of the second flow channel in this embodiment is more conducive to airflow.

[0019] In one embodiment, the second flow channel of the heat dissipation device includes a first sub-channel and a second sub-channel, the first sub-channel and the second sub-channel being spaced apart along the second direction, the first sub-channel communicating with the first chamber, and the second sub-channel communicating with the second chamber; both the first sub-channel and the second sub-channel have flow-blocking protrusions on their two walls in the second direction, the flow-blocking protrusions on the two walls of the first sub-channel being alternately and spaced apart in the second direction; the flow-blocking protrusions on the two walls of the second sub-channel being alternately and spaced apart in the second direction.

[0020] The flow-blocking protrusion includes a guiding surface and a flow-blocking surface, which intersect. The guiding surface faces the air inlet and is inclined relative to it, while the flow-blocking surface faces the first chamber and the second chamber. Airflow entering through the air inlet can flow along the guiding surface into the first and second chambers, and the flow-blocking surface can block airflow entering the first and second sub-channels from the first and second chambers. The guiding surface's orientation towards and inclination relative to the air inlet facilitates the flow of external airflow within the first sub-channel, and by blocking airflow from the first or second chamber from exiting through the air inlet, the flow-blocking surface increases the volume of gas flowing into the air inlet and the volume of gas drawn into the second or first chamber, thereby improving heat dissipation efficiency.

[0021] In one embodiment, the first sub-channel includes a third opening and a fourth opening, the fourth opening communicating with the first chamber. The first sub-channel has a plurality of first flow-blocking protrusions protruding from two of its walls in the second direction. The plurality of first flow-blocking protrusions are arranged at intervals along the third direction. Each first flow-blocking protrusion includes a first guiding surface and a first flow-blocking surface. The first guiding surface is set at an angle to the first flow-blocking surface and the wall. The first flow-blocking surface is perpendicular to the wall. The first flow-blocking surface faces the fourth opening of the first sub-channel.

[0022] In one embodiment, the second flow channel of the heat dissipation device includes a first sub-channel and a second sub-channel, the first sub-channel and the second sub-channel are spaced apart along the second direction, the first sub-channel is connected to the first chamber, and the second sub-channel is connected to the second chamber; the ends of the first sub-channel and the second sub-channel facing away from the piezoelectric vibrator constitute the air inlet.

[0023] The second carrier further includes a first fin and a second fin. The first fin is located within the first sub-channel, with a portion of the first fin connected to the wall of the first sub-channel, and the other portion of the first fin is raised relative to the wall of the first sub-channel and is capable of swinging in the second direction. The second fin is located within the second sub-channel, with a portion of the second fin connected to the wall of the second sub-channel, and the other portion of the second fin is raised relative to the wall of the second sub-channel and is capable of swinging in the second direction. The raised directions of the first fin and the second fin are opposite.

[0024] In one embodiment, the first subchannel includes a third opening and a fourth opening, the fourth opening communicating with the first chamber. The first fin includes a first connecting portion and a first movable portion. The first movable portion is connected to one end of the first connecting portion and forms an angle with the first connecting portion. The first connecting portion is fixed to a wall of the first subchannel in the second direction and is close to the third opening. The end of the first movable portion away from the first connecting portion is a first free end, which is located at the fourth opening. The first movable portion is capable of swinging in the second direction, and the first free end is capable of abutting against the wall in the second direction. Alternatively, the first movable portion can be stacked on the wall of the first subchannel.

[0025] In one embodiment, the second subchannel includes a fifth opening and a sixth opening, the sixth opening communicating with the second chamber; the second fin has the same structure as the first fin, including a second connecting portion and a second movable portion, the second fin being connected to the wall of the second subchannel away from the first subchannel and close to the fifth opening, the end of the second movable portion away from the second connecting portion being a second free end, the second free end being located at the sixth opening; the second movable portion is capable of swinging in the second direction, the second free end being capable of abutting against the wall in the second direction; or the second movable portion is capable of being stacked on the wall of the second subchannel.

[0026] In this embodiment, the volume of the first chamber is gradually compressed and reduced, and gas is discharged in two directions: the first inlet and the first outlet. The airflow discharged through the first inlet enters the first sub-channel through the fourth opening. The airflow blows towards the surface of the first movable part and pushes the first movable part to swing relative to the first connecting part, causing the first free end of the first movable part to move closer to the third wall. The distance between the first free end and the third wall gradually decreases and can contact the third wall, and the first sub-channel is completely closed. The first movable part, in turn, acts on the first airflow, causing the first airflow to bounce back into the first chamber to block the exhaust of the first chamber through the first inlet, so that almost all the gas discharged from the first chamber is discharged to the first outlet, thereby increasing the airflow of the first outlet and improving the heat dissipation effect.

[0027] At the same time, the volume of the second chamber gradually increases, and the second chamber generates suction, drawing in gas from both the second inlet and the second outlet. The airflow drawn in through the second inlet and the second sub-channel enters the second chamber, and the airflow pushes the second movable part to swing relative to the second connecting part, causing the second free end of the second movable part to gradually move away from the fourth wall. The distance between the second free end and the fourth wall gradually increases and can contact the fourth wall. The second sub-channel is completely opened, which facilitates the second chamber to draw in air from the outside through the second inlet, increasing the internal airflow.

[0028] In one embodiment, the first fin and the second fin are elastic diaphragms.

[0029] In one embodiment, the second flow channel of the heat dissipation device includes a first sub-channel and a second sub-channel, which are spaced apart along the second direction. The ends of the first and second sub-channels facing away from the piezoelectric vibrator constitute the air inlet. Both the first and second sub-channels have multiple spaced-apart flow-blocking protrusions on their two walls in the second direction. The multiple flow-blocking protrusions on the two walls of the first sub-channel correspond one-to-one and are connected in the second direction to form a first ventilation gap. The first ventilation gap is inclined relative to the extension direction of the first sub-channel.

[0030] The multiple flow-blocking protrusions on the two walls of the second sub-channel are arranged in a one-to-one correspondence and abutment in the second direction to form a second ventilation gap; the second ventilation gap is inclined relative to the extension direction of the second sub-channel.

[0031] The first ventilation gap is connected to the first chamber, and the second ventilation gap is connected to the second chamber. Airflow entering through the air inlet can flow along the first ventilation gap to the first chamber and along the second ventilation gap to the second chamber. The first ventilation gap can block airflow passing through the first chamber from entering the first sub-channel, and the second ventilation gap can block airflow passing through the second chamber from entering the second sub-channel.

[0032] In one embodiment, each of the flow-blocking protrusions includes a guiding surface and a flow-blocking surface. The guiding surface includes two sub-sloping surfaces, which are connected at an included angle and arranged in opposite directions. Both sub-sloping surfaces are connected to and intersect the flow-blocking surface. The included angles between the two sub-sloping surfaces and the flow-blocking surface are equal. The two sub-sloping surfaces face the air inlet and are inclined relative to the air inlet. A gap is formed between the sub-sloping surfaces of two adjacent rows of flow-blocking protrusions in the first direction. In the second direction, each pair of adjacent rows of flow-blocking protrusions are staggered, and the connection point of the two sub-sloping surfaces of the flow-blocking protrusion in the latter row faces the gap between the two flow-blocking protrusions in the former row.

[0033] The first ventilation gap is formed by a gap located within the first sub-channel, and the second ventilation gap is formed by a plurality of gaps located within the second sub-channel; the airflow entering through the air inlet can flow along the sub-inclined surface of the first sub-channel towards the first chamber, and can flow along the sub-inclined surface of the second ventilation gap towards the second chamber; the flow-blocking surface within the first sub-channel can block the airflow passing through the first chamber from entering the first sub-channel, and the flow-blocking surface within the second sub-channel can block the airflow passing through the second chamber from entering the second sub-channel. In this embodiment, when the airflow enters the heat dissipation device, the airflow flows along the sub-inclined surface, that is, it enters the first chamber along the gap between the first and second air ducts. When the airflow exits the heat dissipation device, most of the airflow is blocked by the flow-blocking surface, making it difficult to flow out of the first sub-channel along the gap between the first and second air ducts. Therefore, the flow resistance of the airflow entering the first chamber along the gap between the first and second air ducts is less than the flow resistance of the airflow exiting the heat-conducting air duct through the gap between the first and second air ducts. This facilitates the first sub-channel to draw in gas from outside the heat-conducting air duct through the third opening, then fill the first sub-channel and flow into the first chamber through the fourth opening. It can also suppress the gas from being discharged from the first chamber through the first sub-channel, reduce the airflow rate discharged from the first inlet of the first chamber, and increase the heat dissipation airflow.

[0034] In one embodiment, the first carrier includes a third fin and a fourth fin. The third fin is located within the first sub-channel, a portion of which is connected to the wall of the first sub-channel, and another portion of which is capable of tilting relative to the wall of the first sub-channel and swinging in the second direction. The fourth fin is located within the second sub-channel, a portion of which is connected to the wall of the second sub-channel, and another portion of which is tilted relative to the wall of the second sub-channel and swinging in the second direction. The tilting directions of the third fin and the fourth fin are opposite.

[0035] In one embodiment, the first sub-channel includes a first sub-port and a second sub-port, the first sub-port being opened on the first side and the second sub-port being opened on the second side; the first sub-port is connected to the first chamber and the second sub-port is connected to the second chamber, and the first sub-channel extends along the second direction.

[0036] The third fin includes a third connecting portion and a third movable portion. The third movable portion is connected to one end of the third connecting portion and forms an angle with the third connecting portion. The third connecting portion is connected to the wall of the first sub-channel away from the second sub-channel and close to the first sub-port of the first sub-channel. The end of the third movable portion away from the third connecting portion is a third free end, which is located at the second sub-port. The third movable portion can swing in the second direction, and the third free end can abut against the wall in the second direction; or the third movable portion can be stacked on the wall of the first sub-channel.

[0037] The second sub-channel includes a third sub-port and a fourth sub-port, the fourth sub-port being connected to the second chamber; the fourth fin has the same structure as the third fin, including a fourth connecting portion and a fourth movable portion, the fourth fin being connected to the wall of the second sub-channel away from the first sub-channel and close to the third opening, the end of the fourth movable portion away from the fourth connecting portion being a fourth free end, the fourth free end being located at the fourth sub-port; the fourth movable portion is capable of swinging in the second direction, the fourth free end being capable of abutting against the wall in the second direction; or the fourth movable portion is capable of being stacked on the wall of the second sub-channel.

[0038] In one embodiment, the first chamber includes a first inlet and a first outlet, and the second chamber includes a second inlet and a second outlet, wherein the first inlet or the second inlet constitutes the air inlet.

[0039] The first flow channel further includes a converging channel, which extends from the second side surface toward the first side surface, penetrates the second side surface and forms the air outlet, and the first sub-flow channel and the second sub-flow channel are inclined relative to the converging channel.

[0040] The first sub-channel has a first sub-port and a second sub-port. The first sub-port is opened on the first side surface and is connected to and communicates with the first outlet. The second sub-port is connected to and communicates with the manifold inside the first carrier. The second sub-channel has a third sub-port and a fourth sub-port. The third sub-port is opened on the first side surface and is connected to and communicates with the second outlet. The fourth sub-port is connected to and communicates with the manifold inside the first carrier and is also connected to the second sub-port.

[0041] In one embodiment, there are two piezoelectric vibrators, namely a first piezoelectric vibrator and a second piezoelectric vibrator. The first piezoelectric vibrator and the first cover plate form the first chamber, the second piezoelectric vibrator and the second cover plate form the second chamber, and the first piezoelectric vibrator and the second piezoelectric vibrator form a third chamber. Along the first direction, the ends of the first piezoelectric vibrator and the second piezoelectric vibrator that face away from each other are free ends.

[0042] The first flow channel further includes a third sub-flow channel and a confluence channel. The first, second, and third sub-flow channels are spaced apart along the first direction, and the third sub-flow channel penetrates the first side surface. The confluence channel extends from the second side surface toward the first side surface, penetrates the second side surface, and forms the air outlet. The first, second, and third sub-flow channels are inclined relative to the confluence channel and are all connected to it. The third sub-flow channel communicates with the third chamber. In this embodiment, more chambers can provide greater airflow and improve heat dissipation efficiency.

[0043] In one embodiment, the vibrating substrate of the first piezoelectric vibrator has a first fixed end and a first movable end, and the vibrating substrate of the second piezoelectric vibrator has a second fixed end and a second movable end; the heat dissipation device further includes a first support group and a second support group, the first support group fixing the first fixed end of the vibrating substrate of the first piezoelectric vibrator between the first cover plate and the second cover plate, the first movable end of the vibrating substrate of the first piezoelectric vibrator being spaced apart from the second support group, the second support group fixing the second fixed end of the vibrating substrate of the second piezoelectric vibrator between the first cover plate and the second cover plate, and the second movable end of the vibrating substrate of the second piezoelectric vibrator being spaced apart from the first support group.

[0044] This application also provides an electronic device, comprising a main body, a heat dissipation channel disposed in the main body, the aforementioned heat dissipation device, and a heat source. The heat dissipation device and the heat source are located within the heat dissipation channel, with the air outlet of the heat dissipation device facing the heat source. External gas enters the air inlet of the heat dissipation device through the heat dissipation channel. In this embodiment, the aforementioned heat dissipation device, compared to existing heat dissipation devices, directly drives the volume change of the first and second chambers during the heat dissipation process through the reciprocating vibration of the piezoelectric vibrator. This ensures that gas always enters from the air inlet of the heat-conducting air duct and exits from the air outlet. That is, gas can be directionally drawn in from the air inlet and discharged from the air outlet. The internal structure of the heat-conducting air duct is simple, and the assembly process of the heat dissipation device components is simple, which is beneficial for the assembly and manufacturing of electronic devices and cost control. Furthermore, it enables the heat dissipation device to be thinner, making it more suitable for the needs of miniaturized electronic devices. Attached Figure Description

[0045] To more clearly illustrate the technical solutions in the embodiments or background art of this application, the accompanying drawings used in the embodiments or background art of this application will be described below.

[0046] Figure 1 A simplified structural diagram of the electronic device provided for an embodiment of this application;

[0047] Figure 2 for Figure 1 A perspective view of the electronic device shown;

[0048] Figure 3 for Figure 2 A schematic diagram of the structure of a first embodiment of a heat dissipation device in the electronic device shown;

[0049] Figure 4 for Figure 3 A schematic diagram of the heat dissipation device shown from another angle;

[0050] Figure 5 for Figure 3 The diagram shows an exploded view of the heat dissipation device.

[0051] Figure 6 for Figure 5 A schematic cross-sectional view of one embodiment of the first support body of the heat dissipation device shown.

[0052] Figure 7 for Figure 3 A schematic diagram of the heat dissipation device along the U-U section;

[0053] Figure 8a for Figure 3 The diagram shows a cross-sectional view of the heat dissipation device along FF in the first state.

[0054] Figure 8b for Figure 3 The diagram shows a cross-sectional view of the heat dissipation device along UU in the first state.

[0055] Figure 9a for Figure 3 The heat dissipation device shown is a schematic cross-sectional view along FF in the second state;

[0056] Figure 9b for Figure 3 The diagram shows a cross-sectional view of the heat dissipation device along UU in the first state.

[0057] Figure 10 for Figure 2 A simplified schematic diagram of the heat dissipation device of the electronic device shown.

[0058] Figure 11 for Figure 8a A vector diagram showing the gas flow velocity within the chambers and channels of the heat dissipation device.

[0059] Figure 12 for Figure 2 A schematic diagram of a second embodiment of a heat dissipation device in the illustrated electronic device;

[0060] Figure 13 for Figure 12 A schematic diagram of the cross-sectional structure of the second support body of the heat dissipation device shown;

[0061] Figure 14 for Figure 12 The diagram shows a cross-sectional view of the heat dissipation device along BB in the first state.

[0062] Figure 15 for Figure 12 The heat dissipation device shown is a schematic diagram of a cross-section along BB in the second state;

[0063] Figure 16 for Figure 2 A cross-sectional schematic diagram of a third embodiment of a heat dissipation device in the illustrated electronic device;

[0064] Figure 17 for Figure 16 A vector diagram showing the gas flow velocity within the chambers and channels of a portion of the heat dissipation device.

[0065] Figure 18 for Figure 2 A schematic diagram of a fourth embodiment of a heat dissipation device in an electronic device shown;

[0066] Figure 19 for Figure 2 A schematic diagram of a fifth embodiment of a heat dissipation device in an electronic device shown;

[0067] Figure 20 for Figure 2 A schematic diagram of a sixth embodiment of a heat dissipation device in an electronic device shown;

[0068] Figure 21 for Figure 20 The diagram shows an exploded view of the heat dissipation device.

[0069] Figure 22 for Figure 20 A schematic diagram of one embodiment of the electrode arrangement of the piezoelectric vibrator in the heat dissipation device shown;

[0070] Figure 23 for Figure 20 A schematic diagram of another embodiment of the electrode arrangement of the piezoelectric vibrator in the heat dissipation device shown;

[0071] Figure 24 for Figure 2 A schematic diagram of the seventh embodiment of the heat dissipation device in the illustrated electronic device;

[0072] Figure 25 for Figure 2 A schematic diagram of the structure of an eighth embodiment of the heat dissipation device for the electronic device shown;

[0073] Figure 26 for Figure 25 The diagram shows the structure of the heat dissipation device from another angle;

[0074] Figure 27 for Figure 25 The diagram shows an exploded view of the heat dissipation device.

[0075] Figure 28 for Figure 25 A schematic diagram of the heat dissipation device along the CC direction;

[0076] Figure 29 for Figure 27 A schematic cross-sectional view of one embodiment of the first support body of the heat dissipation device shown.

[0077] Figure 30 for Figure 25 A schematic diagram of the heat dissipation device along DD;

[0078] Figure 31 for Figure 2 A cross-sectional structural schematic diagram of a ninth embodiment of a heat dissipation device in an electronic device shown;

[0079] Figure 32a for Figure 2 A cross-sectional structural schematic diagram of the tenth embodiment of the heat dissipation device in the illustrated electronic device;

[0080] Figure 32b for Figure 32a The diagram shows a cross-sectional view of the heat dissipation device in its first state.

[0081] Figure 33 for Figure 32a A schematic diagram of the cross-sectional structure of the second support body of the heat dissipation device shown;

[0082] Figure 34a for Figure 2 A schematic cross-sectional view of the eleventh embodiment of the heat dissipation device in the illustrated electronic device;

[0083] Figure 34b for Figure 34a The diagram shows a cross-sectional view of the heat dissipation device in its first state.

[0084] Figure 35 for Figure 2 A schematic cross-sectional view of the twelfth embodiment of the heat dissipation device in the illustrated electronic device;

[0085] Figure 36a for Figure 35 The diagram shows the exploded structure of the second carrier.

[0086] Figure 36b for Figure 36a The diagram shows the exploded structure of the second support body from another angle;

[0087] Figure 37 for Figure 35 The diagram shows the structure of the second support body of the heat dissipation device in its first state.

[0088] Figure 38 for Figure 37 The diagram shows the structure of the second support body of the heat dissipation device in the first state from another angle.

[0089] The reference numerals in the attached diagram are: electronic device 1000, heat dissipation device 100, air inlet 101, air outlet 102, heat conduction duct A, piezoelectric vibrator 10, vibrating substrate 11, first surface 13, second surface 14, end surface 18, first piezoelectric element 12, movable end 15, fixed end 16, second piezoelectric element 17, first piezoelectric vibrator 10a, first movable end 15a, first fixed end 16a, second piezoelectric vibrator 10b, second movable end 15b, second fixed end 16b, first carrier 20, first side surface 21, second side surface 22, first flow channel d, first sub-flow channel 23, first sub-port 231, second sub-port 232, first flow channel wall 233, second flow channel wall 234, second sub-flow channel 24, third sub-port 241, and so on. Fourth sub-port 242, Third flow channel wall 243, Fourth flow channel wall 244, Converging channel 25, Third sub-flow channel 26, Fifth sub-port 261, Sixth sub-port 262, First cover plate 30, First surface 31, Second surface 32, Second cover plate 40, Third surface 41, Fourth surface 42, First support member 50, Second support member 60, First chamber a, First outlet a2, First inlet a1, First airflow 1, Second airflow 2, Second chamber b, Second outlet b2, Second inlet b1, Third airflow 3, Fourth airflow 4, Third chamber c, Third outlet c2, Third inlet c1, Second carrier 70, First side 71, Second side 72, Second flow channel 73, First opening 731, Second opening 732, Flow obstruction channel H, First One port H1, the second port H2, the vortex M, the reinforcing rib 80, the extension section 801, the first reinforcing rib 81, the second reinforcing rib 82, the third support 90, the fourth support 91, the outer shell 200, the display screen 300, the heat dissipation channel 400, the air inlet 401, the air outlet 402, the heat source, the first sub-channel 733, the third opening 733a, the fourth opening 733b, the first wall 735, the first flow-blocking protrusion m, the first guide surface m1, the first flow-blocking surface m2, the third wall 736, the second flow-blocking protrusion n, the second guide surface n1, the second flow-blocking surface n2, the second sub-channel 734, the fifth opening 734a, the sixth opening 734b, the second wall 737, the fourth wall 738, the third flow-blocking protrusion o, the fourth flow-blocking protrusion p, the third guide surface o 1. Third flow-blocking surface o2, Fourth guide surface p1, Fourth flow-blocking surface p2, First fin 74, First connecting part 741, First movable part 742, First free end 743, First connecting end 744, Second fin 75, Second connecting part 751, Second movable part 752, Second free end 753, Second connecting end 754, Third fin 27, Third connecting part 271, Third movable part 272, Third free end 273, Third connecting end 274, Fourth fin 28, Fourth connecting part 281, Fourth movable part 282, Fourth free end 283, Fourth connecting end 284, First sub-sloping surface m11, Second sub-sloping surface m12, First abutting surface m3, First gap m4, Third sub-sloping surface n11, Fourth sub-sloping surface n12.Second contact surface n3, second gap n4, fifth sub-slope o11, sixth sub-slope o12, third contact surface o3, third gap o4, seventh sub-slope p11, eighth sub-slope p12, fourth contact surface p3, fourth gap p4, fifth airflow 5, sixth airflow, seventh airflow 7, eighth airflow 8. Detailed Implementation

[0090] The technical solutions will now be described with reference to the accompanying drawings in the embodiments of this application. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0091] Hereinafter, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature.

[0092] Furthermore, in this application, directional terms such as "upper" and "lower" are defined relative to the orientation of the components shown in the accompanying drawings. It should be understood that these directional terms are relative concepts, used for relative description and clarification, and can change accordingly depending on the orientation of the components in the accompanying drawings.

[0093] In this application, unless otherwise expressly specified and limited, the term "connection" shall be interpreted broadly. For example, "connection" may be a fixed connection, a detachable connection, or an integral part; it may be a direct connection or an indirect connection through an intermediate medium.

[0094] This application provides an electronic device. Specifically, the electronic device can be a portable electronic device or other small electronic devices with internal heat sources that require heat dissipation. For example, the electronic device 1000 can be a mobile phone (including candybar phones, foldable phones, etc.), a tablet personal computer, a laptop computer, a navigation device, a personal digital assistant (PDA), a power bank, a mobile WiFi device, a wearable device, an augmented reality (AR) device, a virtual reality (VR) device, or other mobile terminal requiring heat dissipation. It can also be a large-screen TV, a desktop computer, a charging station, or other fixed terminal requiring heat dissipation. Wearable devices can be VR glasses, smart bracelets, and smartwatches, etc.

[0095] For ease of explanation, the embodiments of this application are described using a mobile phone as an example, and all examples are of a candybar mobile phone.

[0096] Please see Figure 1 and Figure 2 , Figure 1 A simplified structural diagram of the electronic device provided for an embodiment of this application. Figure 2 for Figure 1 The diagram shows a perspective view of the electronic device. It should be noted that... Figure 2 The arrows in the diagram represent one implementation of the gas flow direction.

[0097] For ease of description below, let's establish... Figure 1 The XYZ coordinate system is shown. The width direction of the electronic device 1000 is defined as the X-axis (also called the third direction), the length direction as the Y-axis (also called the first direction), and the thickness direction as the Z-axis (also called the second direction). The X, Y, and Z axes are mutually perpendicular. It is understood that the coordinate system of the electronic device 1000 can be flexibly set according to actual needs. This application only provides... Figure 1 The example shown is not intended to constitute a particular limitation on this application.

[0098] The electronic device 1000 provided in this application embodiment includes a heat dissipation device 100 and a main body (not shown in the figure). The main body includes a housing 200, a display screen 300, a circuit board (not shown in the figure), and a heat source. The housing 200 includes a rear shell and a middle frame. Along the Z-axis direction, the rear shell is mounted on one side of the middle frame in the thickness direction. The display screen 300 is mounted on the other side of the middle frame in the thickness direction. The circuit board is disposed on the middle frame. The circuit board can be located between the middle frame and the rear shell, or between the middle frame and the display screen 300. The heat source is disposed on the circuit board. The heat source directly or indirectly contacts the heat dissipation device 100. The electronic device 1000 also includes other devices capable of realizing the functions of the electronic device 1000. These devices are part of the main body and will not be described in detail here.

[0099] The display screen 300 is used to display images, and it can also integrate touch functionality to enable human-computer interaction. The display screen 300 can be, but is not limited to, an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode (AMOLED) display screen, a mini organic light-emitting diode (MLED) display screen, a micro organic light-emitting diode (MOLD) display screen, or a quantum dot light-emitting diode (QLED) display screen. This application does not limit this.

[0100] It should be noted that, Figure 2 The gas enters from one end of the heat dissipation device 100 along its length and exits from the other end. This is illustrated by taking the gas flow direction within the heat dissipation device 100 as its length. The length of the heat dissipation device 100 is the same as the length of the electronic device 1000, the width of the heat dissipation device 100 is the same as the width of the electronic device 1000, and the thickness of the heat dissipation device 100 is the same as the thickness of the electronic device 1000. In fact... Figure 2 The purpose of this illustration is to depict one embodiment of the location of the heat dissipation device 100 within the electronic device 1000, and the relative positional relationship between the housing 200, the heat dissipation device 100, and the heat dissipation channel 400. It is not intended to specifically limit the orientation, connection location, specific structure, or quantity of each device. Furthermore, the structures illustrated in this application's embodiments do not constitute a specific limitation on the electronic device 1000. In other embodiments of this application, the electronic device 1000 may include more or fewer components than illustrated, or combine certain components, or split certain components, or arrange different components.

[0101] The electronic device 1000 also includes a heat dissipation channel 400 disposed in the main body. The heat dissipation channel 400 is connected to the heat conduction air duct in the heat dissipation device 100, or the heat conduction air duct of the heat dissipation device 100 is part of the heat dissipation channel 400. Gas can enter the heat dissipation device 100 through the heat dissipation channel 400, and the gas discharged from the heat dissipation device 100 flows out through the heat dissipation channel 400. The heat dissipation channel 400 can be a gap between the middle frame and the display screen 300, a gap between the middle frame and the circuit board, or a gap between other components inside the electronic device 1000, etc. This application does not limit this.

[0102] Wherein, the heat source (such as Figure 3 The heat source is a component that generates heat during the operation of the electronic device 1000. It transfers heat to the heat dissipation device 100 through direct or indirect contact, and then actively dissipates the heat to the external environment of the electronic device 1000 through a heat dissipation channel 400 connected to the heat dissipation device 100, thus achieving heat dissipation for the electronic device 1000. The heat source can be, but is not limited to, an integrated chip, a system-on-chip (SoC), or a central processing unit (CPU). The heat generated by the heat source directly affects the performance of the electronic device 1000; for example, overheating can cause the electronic device 1000 to malfunction, affecting the user experience. Depending on the actual situation, the number of heat sources inside the electronic device 1000 may be one or more. The number and location of the heat sources can be flexibly adjusted according to the hardware form, layout, and usage scenario of the electronic device 1000; this application does not impose any restrictions in this regard.

[0103] The heat dissipation device 100 can conduct, diffuse, or exchange heat generated by a heat source to actively dissipate heat. The heat dissipation device 100 can prevent the heat source temperature from becoming too high and affecting the performance of the electronic device 1000. The number of heat dissipation devices 100 can be configured as one or more according to the heat dissipation requirements of the electronic device 1000. When multiple heat dissipation devices 100 are configured, they can be arranged at different locations on the electronic device 1000 according to the distribution of the heat source. Alternatively, multiple heat dissipation devices 100 can be used in series. The series connection can be a simple physical stacking or a series structure formed by welding, bonding, or integrated processing.

[0104] In this embodiment, the heat dissipation device 100 is a piezoelectric fan, which exchanges heat with the heat source through air cooling to dissipate heat from the heat source. Specifically, the heat dissipation device 100 actively draws in gas from the external environment of the electronic device 1000 through the heat dissipation channel 400, and discharges the drawn-in gas into the external environment of the electronic device 1000 through the heat dissipation channel 400, thereby achieving heat dissipation of the heat source of the electronic device 1000.

[0105] For example, such as Figure 2 As shown, the air inlet 401 of the heat dissipation channel 400 is located at the top edge of the housing 200, through which gas enters the heat dissipation device 100 from the external environment of the electronic device 1000. The air outlet 402 of the heat dissipation channel 400 is located at the side edge of the housing 200, through which gas in the heat conduction duct of the heat dissipation device 100 is discharged into the heat dissipation channel 400 and discharged into the external environment of the electronic device 100 via the air outlet 402. It can be understood that two openings are formed on the housing 200 of the electronic device 100, both of which communicate with the heat dissipation channel 400. One opening is the air inlet 401 of the heat dissipation channel 400, and the other opening is the air outlet 402 of the heat dissipation channel 400.

[0106] Please continue reading. Figure 2 .

[0107] The heat dissipation device 100 includes a heat-conducting air duct A, an air inlet 101, and an air outlet 102. The air inlet 101 and air outlet 102 are connected to the heat-conducting air duct A and are located at both ends of the gas flow in the heat-conducting air duct A, which are also the two sides along the length of the heat dissipation device 100. In this embodiment, the air inlet 101 and air outlet 102 are opposite ends of the gas flow direction within the heat dissipation device 100. Gas entering the heat dissipation channel 400 through the air inlet 401 enters the heat-conducting air duct A through the air inlet 101. The air outlet 102 is used to discharge the gas inside the heat dissipation device 100 into the heat dissipation channel 400, and then discharge it from the external environment of the electronic device 1000 through the air outlet 402 of the heat dissipation channel 400.

[0108] In this embodiment, the heat source can be located at the air outlet 102 of the heat dissipation device 100, and the gas discharged by the heat dissipation device 100 can dissipate heat from the heat source. In some embodiments, the heat source can be located at the air inlet 101 of the heat dissipation device 100, and the gas drawn into the heat dissipation device 100 can dissipate heat from the heat source. Alternatively, the heat source can be placed close to one side of the heat dissipation device 100 in the thickness direction, and heat dissipation can be achieved through thermal conduction, etc. This application does not impose any limitations on these aspects.

[0109] Please see Figure 3 , Figure 4 and Figure 5 , Figure 3 for Figure 2 The diagram shows a structural schematic of a first embodiment of a heat dissipation device in an electronic device. Figure 4 for Figure 3 The diagram shown is a structural schematic of the heat dissipation device from another angle. Figure 5 for Figure 3 The diagram shows the exploded structure of the heat dissipation device.

[0110] In this embodiment, the heat dissipation device 100 includes a piezoelectric vibrator 10, a first carrier 20, a first cover plate 30, a second cover plate 40, a plurality of first support members 50, and a plurality of second support members 60. Along the Z-axis, the piezoelectric vibrator 10 is located between the first cover plate 30 and the second cover plate 40. The plurality of first support members 50 are supported between the first cover plate 30 and the piezoelectric vibrator 10, forming a first chamber a between the first cover plate 30 and the piezoelectric vibrator 10. The plurality of second support members 60 are supported between the second cover plate 40 and the piezoelectric vibrator 10, forming a second chamber b between the second cover plate 40 and the piezoelectric vibrator 10. The first carrier 20 is connected to the same side of the first cover plate 30 and the second cover plate 40 and communicates with the first chamber a and the second chamber b. The side of the first support body 20 facing away from the first cover plate 30 and the second cover plate 40 constitutes the air outlet 102 of the heat dissipation device 100; the side of the first cover plate 30 and the second cover plate 40 facing away from the first support body 20 constitutes the air inlet 101 of the heat dissipation device 100. In this embodiment, the air outlet 102 and the air inlet 101 are located at both ends of the length direction of the heat dissipation device 100. The first cover plate 30, the second cover plate 40, the first support member 50, and the second support member 60 are all fixedly connected to the first support body 20. It can be understood that the first cover plate 30, the piezoelectric vibrator 10, and the plurality of first support members 50 form a first chamber a. The second cover plate 40, the piezoelectric vibrator 10, and the plurality of second support members 60 form a second chamber b.

[0111] Along the thickness direction (i.e., the Z-axis direction) of the heat dissipation device 100, the first chamber a and the second chamber b are separated by a piezoelectric vibrator 10. The piezoelectric vibrator 10 can reciprocate along the Z-axis direction, causing changes in the volume of the first chamber a and the second chamber b, thereby altering the flow rate and velocity of the gas discharged or drawn into the first chamber a and the second chamber b. For example, when the piezoelectric vibrator 10 deforms towards the first cover plate 30, compressing the volume of the first chamber a and increasing the volume of the second chamber b, gas is discharged from the first chamber a and gas is drawn into the second chamber b. Alternatively, when the piezoelectric vibrator 10 deforms towards the second cover plate 40, increasing the volume of the first chamber a and compressing the volume of the second chamber b, gas is drawn into the first chamber a and gas is discharged from the second chamber b. In other words, the continuous change in volume in the first chamber a and the second chamber b achieves effective forced-air cooling, thus providing good active heat dissipation for the heat source.

[0112] In this embodiment, the first cover plate 30 is a rectangular plate. The first cover plate 30 includes a first surface 31 and a second surface 32. The first surface 31 and the second surface 32 are disposed opposite to each other along the thickness direction of the first cover plate 30. In one embodiment, the first cover plate 30 can be a metal plate.

[0113] In this embodiment, the second cover plate 40 is a rectangular plate. The second cover plate 40 includes a third surface 41 and a fourth surface 42. The third surface 41 and the fourth surface 42 are disposed opposite to each other along the thickness direction of the second cover plate 40. In one embodiment, the second cover plate 40 can be a metal plate.

[0114] The piezoelectric oscillator 10 includes a vibrating substrate 11 and a first piezoelectric element 12. The vibrating substrate 11 includes a first surface 13 and a second surface 14. The first surface 13 and the second surface 14 are disposed opposite to each other along the thickness direction (i.e., the Z-axis direction) of the vibrating substrate 11. The first piezoelectric element 12 is located on the vibrating substrate 11 and connected to the first surface 13 of the vibrating substrate 11. In this embodiment, the first piezoelectric element 12 is located at the center of the vibrating substrate 11. The projection of the first piezoelectric element 12 along the Z-axis direction is completely within the projection of the vibrating substrate 11 along the Z-axis direction. In this embodiment, the area of ​​the first piezoelectric element 12 is smaller than the area of ​​the vibrating substrate 11. The first piezoelectric element 12 can be integrally connected to the vibrating substrate 11 by means not limited to adhesive bonding. In some embodiments, the first piezoelectric element 12 can also be connected to the second surface 14 of the vibrating substrate 11.

[0115] In this embodiment, both the vibrating substrate 11 and the first piezoelectric element 12 are flat rectangular thin plates, and both the first surface 13 and the second surface 14 are smooth surfaces. In one embodiment, the vibrating substrate 11 is a metal plate with a thickness of less than or equal to 1 mm.

[0116] The vibrating substrate 11 is located between the first cover plate 30 and the second cover plate 40. The first cover plate 30, the vibrating substrate 11, and the second cover plate 40 are stacked and spaced apart. The vibrating substrate 11, the first cover plate 30, and the second cover plate 40 are all in the same length direction and all three are in the same width direction.

[0117] The first piezoelectric element 12 is made of a piezoelectric material, such as a piezoelectric crystal or piezoelectric ceramic. Electrodes are provided on the piezoelectric material, and the piezoelectric material exhibits an inverse piezoelectric effect. The inverse piezoelectric effect occurs when a voltage is applied to the electrodes of the piezoelectric material, causing mechanical deformation (such as bending, stretching, or contraction) or mechanical pressure in the dielectric within the piezoelectric material in a certain direction. When the voltage is removed, the piezoelectric material returns to its original shape. Utilizing the inverse piezoelectric effect, when a voltage is applied to the electrodes of the first piezoelectric element 12, the first piezoelectric element 12 undergoes bending deformation along the Z-axis, which in turn causes the vibrating substrate 11 to undergo bending deformation along the Z-axis. The bending deformation of the first piezoelectric element 12 and the vibrating substrate 11 changes from a flat plate shape to an arc-shaped plate shape. When a varying voltage is applied to the electrodes of the first piezoelectric element 12, the bending deformation of the first piezoelectric element 12 along the Z-axis is periodic, meaning that the first piezoelectric element 12 undergoes continuous reciprocating vibration along the Z-axis, thereby causing the vibrating substrate 11 to undergo continuous reciprocating vibration along the Z-axis. The periodic bending deformation of the piezoelectric vibrator 10 is described in detail below. When no voltage is applied to the electrodes of the first piezoelectric element 12, the first piezoelectric element 12 and the vibrating substrate 11 return to their original shape, that is, from an arc-shaped plate to a flat plate.

[0118] In this embodiment, the first support member 50 is a long strip plate, and there are two first support members 50. The length direction of the first support member 50 is consistent with the length direction of the heat dissipation device 100. In one embodiment, the first support member 50 is made of metal material and has a certain strength.

[0119] In this embodiment, the second support member 60 is a long strip plate, and there are two second support members 60. The length direction of the second support member 60 is consistent with the length direction of the heat dissipation device 100. In one embodiment, the second support member 60 is made of metal material and has a certain strength.

[0120] It should be noted that the first support member 50 and the second support member 60 have the same length, width, and thickness. The first support member 50 can be separately formed from the first cover plate 30. The second support member 60 can be separately formed from the second cover plate 40. In some embodiments, the first support member 50 can be integrally formed with the first cover plate 30, and / or, the second support member 60 can be integrally formed with the second cover plate 40. This application does not impose any limitations on this.

[0121] In this embodiment, the first support 20 is an elongated structure. The first support 20 is made of metal. The length direction of the first support 20 is the same as the width direction of the heat dissipation device 100, that is, the length direction of the first support 20 is perpendicular to the length direction of the first support member 50 and the length direction of the second support member 60.

[0122] like Figure 4 and Figure 5As shown, along the Z-axis, the second surface 32 of the first cover plate 30 and the first surface 13 of the vibrating substrate 11 are opposite to and spaced apart. A first support member 50 connects the second surface 32 of the first cover plate 30 and the first surface 13 of the vibrating substrate 11. Two first support members 50 are spaced apart along the width direction (i.e., the X-axis direction) of the heat dissipation device 100, and are located at both ends of the length direction of the first cover plate 30 (vibrating substrate 11). The second surface 32 of the first cover plate 30, the first surface 13 of the vibrating substrate 11, and the two opposite sides of the two first support members 50 form the cavity wall of the first chamber a. A first piezoelectric element 12 is located inside the first chamber a. The opposite sides of the first piezoelectric element 12 along its width direction are spaced apart from the two first support members 50, and the first piezoelectric element 12 and the second surface 32 of the first cover plate 30 are spaced apart along the Z-axis.

[0123] The first chamber a has a first outlet a2 and a first inlet a1. The first outlet a2 and the first inlet a1 are arranged opposite each other along the length direction (i.e., the Y-axis direction) of the heat dissipation device 100.

[0124] Along the Z-axis, the third surface 41 of the second cover plate 40 and the second surface 14 of the vibrating substrate 11 are opposite to each other and spaced apart. A second support member 60 is connected to the second surface 14 of the vibrating substrate 11 and the third surface 41 of the second cover plate 40. Two second support members 60 are spaced apart along the width direction of the heat dissipation device 100 and are located at both ends of the length direction of the second cover plate 40. The third surface 41 of the second cover plate 40, the second surface 14 of the vibrating substrate 11, and the two opposing sides of the two second support members 60 form the cavity wall of the second chamber b.

[0125] The second chamber b has a second outlet b2 and a second inlet b1. The second outlet b2 and the second inlet b1 are arranged opposite to each other along the length of the heat dissipation device 100. The orientation of the first inlet a1 of the first chamber a is the same as the orientation of the second inlet b1 of the second chamber b, and together they form the air inlet 101 of the heat dissipation device 100. The orientation of the first outlet a2 of the first chamber a is the same as the orientation of the second outlet b2 of the second chamber b. The first support body 20 is disposed at the first outlet a2 of the first chamber a and the second outlet b2 of the second chamber b, and the first outlet a2 and the second outlet b2 are connected to the air outlet 102.

[0126] It is understood that the vibrating substrate 11 is a simply supported beam. One end of the vibrating substrate 11 in the width direction is clamped and fixed by a first support member 50 and a second support member 60, and the other end of the vibrating substrate 11 in the width direction is clamped and fixed by another first support member 50 and another second support member 60, so as to ensure that the two opposite ends in the width direction of the vibrating substrate 11 are fixed and immovable, while the two opposite ends in the length direction of the vibrating substrate 11 can move.

[0127] Since the first cover plate 30, the second cover plate 40, the first support member 50, the second support member 60, and the first carrier 20 are all made of metal, the heat dissipation device 100 has high structural rigidity. Furthermore, the first carrier 20 can be fixedly connected to the first cover plate 30, the second cover plate 40, the first support member 50, and the second support member 60 by welding, ensuring the stability of the heat dissipation device 100. In some embodiments, one or more of the first cover plate 30, the second cover plate 40, the first support member 50, the second support member 60, and the first carrier 20 can be made of other materials such as plastic, and these structural components can be connected and fixed by adhesive or screwing.

[0128] Please refer to the following: Figure 5 and Figure 6 , Figure 6 for Figure 5 A schematic cross-sectional view of one embodiment of the first support body of the heat dissipation device shown.

[0129] In this embodiment, the first support body 20 includes a first side surface 21 and a second side surface 22. The first side surface 21 and the second side surface 22 are arranged opposite to each other along the width direction (i.e., the Y-axis direction) of the first support body 20. The first support body 20 is a strip with a generally rectangular cross-section.

[0130] The first carrier 20 also includes a first flow channel d. The first flow channel d penetrates the first side surface 21 and the second side surface 22 of the first carrier 20; the first flow channel d extends along the width direction of the first carrier 20. The first flow channel d is used to connect the first chamber a and the second chamber b with the heat dissipation channel 400.

[0131] In this embodiment, the first flow channel d includes a first sub-flow channel 23, a second sub-flow channel 24, and a confluence channel 25. The first sub-flow channel and the second sub-flow channel are inclined relative to the confluence channel; the first sub-flow channel 23 and the second sub-flow channel 24 are spaced apart and have an opening communicating with the confluence channel 25. The confluence channel 25 extends from the second side surface 22 toward the first side surface 21, and the confluence channel 25 forms the air outlet 102 on the second side surface 22. In this embodiment, the cross-sectional area of ​​the confluence channel 25 is uniformly distributed. Along the Z-axis direction, the openings of the first sub-flow channel 23 and the second sub-flow channel 24 facing away from the confluence channel 25 are spaced apart. It can be understood that the first sub-flow channel 23, the second sub-flow channel 24, and the confluence channel 25 intersect. The extension direction of the confluence channel 25 is the same as the width direction of the first support body 20.

[0132] The first sub-channel 23 is recessed into the first side surface 21 of the first support body 20 and extends toward the second side surface 22. The first sub-channel 23 communicates with the first chamber a and allows gas to be discharged or drawn into the first chamber a. The first sub-channel 23 has a first port 231 and a second port 232. The first port 231 is located on the first side surface 21, and the second port 232 is connected to and communicates with the manifold 25 inside the first support body 20. The cross-sectional area of ​​the first sub-channel 23 gradually decreases from the first port 231 to the second port 232.

[0133] The first sub-channel 23 includes a first channel wall and a second channel wall, which together form part of the first sub-port 231 and the second sub-port 232. The surfaces of the first and second channel walls can be curved or flat. In this embodiment, the surfaces of the first and second channel walls are flat. From the first sub-port 231 to the second sub-port 232, both the first and second channel walls are inclined towards the confluence channel 25. This can be understood as the area of ​​the first sub-port 231 being larger than the area of ​​the second sub-port 232. The inclined arrangement of the first and second channel walls facilitates the natural convergence of gas in the first sub-channel 23 to the confluence channel 25, allowing the gas to fill the confluence channel 25 and flow out through the outlet 102. It also prevents gas outside the heat-conducting duct A from flowing back into the confluence channel 25.

[0134] The second sub-channel 24 is recessed into the first side surface 21 of the first support body 20 and extends towards the second side surface 22. The second sub-channel 24 communicates with the second chamber b and allows gas discharged or drawn into the second chamber b to pass through. The second sub-channel 24 has a third sub-port 241 and a fourth sub-port 242. The third sub-port 241 is located on the first side surface 21, and the fourth sub-port 242 connects to and communicates with the manifold 25 inside the first support body 20. The cross-sectional area of ​​the second sub-channel 24 gradually decreases from the third sub-port 241 to the fourth sub-port 242.

[0135] The second sub-channel 24 includes a third channel wall and a fourth channel wall, which together form part of the third sub-port 241 and the fourth sub-port 242. The surfaces of the third and fourth channel walls can be curved or flat. In this embodiment, the surfaces of the third and fourth channel walls are flat. Both the third and fourth channel walls are inclined towards the confluence channel 25 in the direction from the third sub-port 241 to the fourth sub-port 242. This can be understood as the area of ​​the third sub-port 241 being larger than the area of ​​the fourth sub-port 242. The inclined arrangement of the third and fourth channel walls facilitates the second sub-channel 24 drawing in gas from the third sub-port 241, preventing gas from flowing out from the fourth sub-port 242.

[0136] The manifold 25 is recessed into the second side surface 22 of the first support 20 and extends toward the first side surface 21. The extension directions of the first sub-flow channel 23 and the second sub-flow channel 24 are set at an angle to the width direction of the first support 20. The first flow channel d, including the first sub-flow channel 23, the second sub-flow channel 24, and the manifold 25, is approximately transversely "Y"-shaped. The end of the manifold 25 facing away from the first sub-flow channel 23 and the second sub-flow channel 24 is the air outlet 102.

[0137] Please see and Figure 7 , Figure 7 for Figure 3 The diagram shows a cross-sectional view of the heat dissipation device along the U-U axis.

[0138] In this embodiment, the piezoelectric vibrator 10, the first carrier 20, the first cover plate 30, the second cover plate 40, two first support members 50, and two second support members 60 are assembled. The first flow channel d, the first chamber a, and the second chamber b of the first carrier 20 together constitute the heat-conducting air duct A of the heat dissipation device 100. In this embodiment, the first inlet and the third inlet of the first chamber a and the second chamber b constitute the air inlet. One first support member 50 and its opposite second support member 60 can be regarded as a single support member.

[0139] Specifically, along the Y-axis, the first cover plate 30, the second cover plate 40, the first support member 50, and the second support member 60 are all connected to the first side surface 21 of the first carrier 20. The vibrating base plate 11 is opposite to and in contact with the first carrier 20, and the first sub-port 231 of the first sub-channel 23 is connected to the first outlet a2 of the first chamber a. The third sub-port 241 of the second sub-channel 24 is connected to the second outlet b2 of the first chamber a.

[0140] Since the heat dissipation device 100 applies a changing voltage to the electrodes of the first piezoelectric element 12, causing the piezoelectric oscillator 10 to reciprocate along the Z-axis under the action of the inverse piezoelectric effect, so that the volume of the first chamber a and the second chamber b is discharged to the outside or drawn in from the outside when the gas in the chamber is compressed or expanded, the heat dissipation device 100 has an original state when it is not working and a first state and a second state when it is working, and the first state and the second state switch back and forth when the heat dissipation device 100 is working. Figure 7 The heat dissipation device 100 shown is in its original state, which is when no voltage is applied to the electrodes of the first piezoelectric element 12. In this state, both the first piezoelectric element 12 and the vibrating substrate 11 remain flat. The first state and the second state are described in detail below.

[0141] Please see Figure 8a , Figure 8b , Figure 9a and Figure 9b , Figure 8afor Figure 3 The diagram shows a cross-sectional view of the heat dissipation device along FF in the first state. Figure 8b for Figure 3 The diagram shown is a cross-sectional view of the heat dissipation device along UU in the first state. Figure 9a for Figure 3 The diagram shows a cross-sectional view of the heat dissipation device along FF in the second state. Figure 9b for Figure 3 The diagram shows a cross-sectional view of the heat dissipation device along UU in the second state.

[0142] like Figure 8a and Figure 8b As shown, the first piezoelectric element 12 drives the vibrating substrate 11 to vibrate and deform, and the entire piezoelectric vibrator 10 has an arc-shaped structure and arches towards the first cover plate 30. At this time, the first surface 13 of the vibrating substrate 11 is at a first distance from the second surface 32 of the first cover plate 30, and the second surface 14 of the vibrating substrate 11 is at a second distance from the third surface 41 of the second cover plate 40, and the second distance is greater than the first distance. The heat dissipation device 100 is in the first state. In this embodiment, in the first state, the vibration amplitude of the piezoelectric vibrator 10 towards the first cover plate 30 is the largest. The volume of the first chamber a is the smallest, and the volume of the second chamber b is the largest. Figure 8a and Figure 8b The deformation direction of the piezoelectric vibrator 10 is only one illustrative embodiment.

[0143] like Figure 9a and Figure 9b As shown, the heat dissipation device 100 is in the second state. The first piezoelectric element 12 drives the vibrating substrate 11 to vibrate and deform. The entire piezoelectric vibrator 10 has an arc-shaped structure and arches towards the second cover plate 40. In this embodiment, in the second state, the vibration amplitude of the piezoelectric vibrator 10 towards the second cover plate 40 is the largest. The volume of the first chamber a is the largest, and the volume of the second chamber b is the smallest. Figure 9a and Figure 9b The deformation direction of the piezoelectric vibrator 10 is only one illustrative embodiment. It should be noted that the second state is a state after the transition from the first state.

[0144] In this embodiment, a voltage is applied to the electrode of the first piezoelectric element 12 of the heat dissipation device 100, and the heat dissipation device 100 can change from the original state to the first state, and continuously switch between the first state and the second state to change the volume of the first chamber a and the second chamber b, thereby pushing the gas out through the air outlet 102 and starting to dissipate heat from the heat source.

[0145] In other embodiments, the vibration of the vibrating substrate 11 can still compress airflow in any state between the first and second states. The vibrating substrate 11 has a first distance and a second distance relative to the first cover plate and the second cover plate, respectively, but the first distance and the second distance are smaller than the first distance and the second distance in the first and second states; that is, in any state between the first and second states, the amplitude of the vibrating substrate 11 is smaller than the amplitude in the first and second states. The heat dissipation device 100 can control the magnitude of the voltage applied to the first piezoelectric element 12 according to the actual heat of the heat source, thereby adjusting the amplitude of the piezoelectric vibrator 10.

[0146] It should be noted that, in the first state, the second state, or any state between the first state and the second state, along the Z-axis direction, the piezoelectric vibrator 10 is positioned opposite and spaced apart from the first cover plate 30 and the second cover plate 40, so that there are gaps that can generate airflow and allow it to pass smoothly through the first chamber a and the second chamber b for discharge and intake.

[0147] The heat dissipation process of the heat dissipation device 100 is described below. Figure 8b and Figure 9b The arrows in the diagram indicate the direction of gas flow within the heat dissipation device 100. Among them, Figure 8b and Figure 9b Arrows filled with slanted parallel lines represent the first airflow, solid black arrows represent the second airflow, blank arrows without filling represent the third airflow, and discontinuous arrows represent the fourth airflow.

[0148] Please refer to both together. Figure 8a , Figure 8b , Figure 9a and Figure 9b .

[0149] like Figure 8a and Figure 8b As shown, a voltage is applied to the electrode of the first piezoelectric element 12 of the heat dissipation device 100, and the heat dissipation device 100 begins to operate. The piezoelectric vibrator 10 vibrates from its original state to the first state. The two ends of the vibrating substrate 11 of the piezoelectric vibrator 10, which are connected to the first support member 50 and the second support member 60, remain fixed. The first piezoelectric element 12, carrying the vibrating substrate 11, vibrates from a flat state along the Z-axis towards the first cover plate 30, causing bending deformation. The deformation of the vibrating substrate 11 gradually increases (in this embodiment, the deformation is larger and arc-shaped at the middle position connected to the first piezoelectric element 12). The vibrating substrate 11 generally forms an arc-shaped arch protruding towards the first cover plate 30, such as... Figure 8aAs the piezoelectric vibrator 10 approaches the first cover plate 30, the volume of the first chamber a is gradually compressed, and the gas in the first chamber a is gradually reduced, until the heat dissipation device 100 reaches the first state. Along the thickness direction of the heat dissipation device 100, the vibrating substrate 11 approaches the first cover plate 30. The volume of the first chamber a is smaller than the volume of the second chamber b. The piezoelectric vibrator 10 pushes the gas in the first chamber a to form an airflow that flows directly to the first inlet a1 and the first outlet a2. The deformation of the vibrating substrate 11 of the piezoelectric vibrator 10 also pushes a small portion of the gas to flow towards the first support member 50 and the second support member 60. After being blocked by the first support member 50 and the second support member 60, it flows towards the first inlet a1 and the first outlet a2. Figure 8b As can be seen from the angle shown, the piezoelectric vibrator 10 is closer to the first cover plate 30 than the second cover plate 40, and is roughly parallel to the first cover plate 30.

[0150] The gas in the first chamber a forms two opposing airflows, a first airflow 1 and a second airflow 2, flowing in opposite directions towards the first inlet a1 and the first outlet a2. Both the first airflow 1 and the second airflow 2 are high-speed jets. The first airflow 1 is discharged into the heat dissipation channel 400 through the first inlet a1. The second airflow 2 enters the first sub-channel 23 entirely through the first outlet a2 and flows out through the air outlet 102 to dissipate heat from the heat source.

[0151] Simultaneously, the volume of the second chamber b expands, increasing its size. This creates suction within the second chamber b, drawing in gas from the surrounding environment through both the second inlet b1 and the second outlet b2. The suction in the second chamber b also increases the flow rate of the gas drawn in through the second inlet b1 and the second outlet b2.

[0152] The gas in the second chamber b forms two opposing airflows, a third airflow 3 and a fourth airflow 4, flowing in opposite directions towards the second inlet b1 and the second outlet b2. Both the third airflow 3 and the fourth airflow 4 are high-speed jets. The third airflow 3 is drawn into the second chamber b through the second inlet b1. The fourth airflow 4 is drawn in through the second sub-channel 24 and the second outlet b2. During this process, a small amount of the second airflow 2 discharged outward through the first sub-channel 23 is drawn into the second sub-channel 24 at the intersection with the confluence channel 25 and the second sub-channel 24. In other words, most of the gas drawn into the second chamber b is drawn in through the second inlet b1, and a small portion of the gas drawn into the second chamber b is drawn in through the second outlet b2, meaning the amount of gas in the third airflow 3 is greater than the amount of gas in the fourth airflow 4.

[0153] In this embodiment, the first sub-channel 23 and the second sub-channel 24 converge and connect to the confluence channel 25. During the process of the first chamber a being compressed to generate and discharge airflow, and the second chamber b increasing in volume to generate and draw in airflow, a portion of the second airflow 2, after passing through the first sub-channel 23, will be drawn into the second chamber b through the second sub-channel 24. Specifically, since the second airflow 2 is a high-speed jet, it will be discharged through the confluence channel 25 under the influence of airflow inertia. However, due to the increased volume of the second chamber b generating suction, and the connection between the first sub-channel 23 and the second sub-channel 24, a small portion of the second airflow 2 passing through the first sub-channel 23 will be drawn into the second sub-channel 24 and enter the second chamber b under the suction of the second chamber b; of course, the gas drawn into the second chamber b is mainly drawn in from the second inlet b1.

[0154] In this embodiment, the two ends of the vibrating substrate 11 in the width direction are fixed, while the two ends in the length direction are movable. During the process of the heat dissipation device 100 changing from the original state to the first state, that is, during the process of the vibrating substrate 11 vibrating in the direction of the first cover plate 30, since the vibrating substrate 11 and the first support body 20 are not fixedly connected, and the side of the vibrating substrate 11 facing away from the first support body 20 can also move, the vibrating substrate 11 moves in the direction of the first cover plate 30, the first inlet a1 and the first outlet a2 of the first chamber a are reduced, and the second inlet b1 and the second outlet b2 of the second chamber b are increased, which can increase the flow rate of the first airflow 1 to flow out of the air outlet 102. The airflow rate of the heat dissipation device 100 entering the second chamber b from the second inlet b1 is greater than the airflow rate discharged from the first inlet a1, which is more conducive to the second outlet b2 of the second chamber b in the second state to discharge more gas and improve the heat dissipation effect.

[0155] like Figure 9a and Figure 9bAs shown, a changing voltage is continuously applied to the electrodes of the first piezoelectric element 12 of the heat dissipation device 100, and the heat dissipation device 100 changes from the first state to the second state. The two ends of the vibrating substrate 11 of the piezoelectric vibrator 10 connected to the first support member 50 and the second support member 60 are fixed. The first piezoelectric element 12, along with the vibrating substrate 11, vibrates and bends along the Z-axis towards the second cover plate 40. The middle position of the vibrating substrate 11 changes from a state bulging towards the first cover plate 30 to a flat state, and then changes from a flat state to vibrating towards the second cover plate 40. The vibrating substrate 11 is roughly arched in an arc shape bulging towards the second cover plate 40. As the piezoelectric vibrator 10 approaches the second cover plate 40, the volume of the second chamber b is gradually compressed, and the volume of the second chamber b gradually decreases until the heat dissipation device 100 reaches the second state. Along the thickness direction of the heat dissipation device 100, the vibrating substrate 11 is close to the second cover plate 40. The volume of the first chamber a is larger than the volume of the second chamber b. The piezoelectric vibrator 10 pushes the gas in the second chamber a to form an airflow that flows directly to the second inlet b1 and the second outlet b2. The deformation of the vibrating substrate 11 of the piezoelectric vibrator 10 also pushes a small portion of the gas towards the first support member 50 and the second support member 60. After being blocked by the first support member 50 and the second support member 60, it flows to the second inlet b1 and the second outlet b2. Figure 9b As can be seen from the angle shown, the piezoelectric vibrator 10 is closer to the second cover plate 40 than the first cover plate 30, and is roughly parallel to the second cover plate 40.

[0156] The gas in the second chamber b flows in two opposite directions towards the second inlet b1 and the second outlet b2, forming two opposing airflows: a third airflow 3 and a fourth airflow 4. The third airflow 3 is discharged into the heat dissipation channel 400 through the second inlet b1. The fourth airflow 4 enters the second sub-channel 24 entirely through the second outlet b2 and flows out through the air outlet 102 to dissipate heat from the heat source.

[0157] At the same time, the volume of the first chamber a gradually expands, and the volume of the first chamber a gradually increases, that is, a suction force is generated inside the first chamber a, which draws in the gas from the environment outside the first chamber a from both the first inlet a1 and the first outlet a2. At the same time, the suction force of the first chamber a increases the flow rate of the gas drawn in from the first inlet a1 and the first outlet a2.

[0158] The gas in the first chamber a forms two opposing airflows, a first airflow 1 and a second airflow 2, flowing in opposite directions towards the first inlet a1 and the first outlet a2. The first airflow 1 is drawn into the first chamber a through the first inlet a1. The second airflow 2 is drawn into the first chamber a through the first sub-channel 23 and the first outlet a2. During this process, a small amount of the fourth airflow 4 discharged through the second sub-channel 24 is drawn into the first sub-channel 23 at the intersection of the confluence channel 25 and the first sub-channel 23. In other words, most of the gas drawn into the first chamber a is drawn in through the first inlet a1, while a small portion is drawn in through the first outlet a2; that is, the amount of gas in the first airflow 1 is greater than the amount of gas in the second airflow 2.

[0159] In this embodiment, the first sub-channel 23 and the second sub-channel 24 converge and connect to the confluence channel 25. During the process of the second chamber b being compressed to generate airflow and being discharged, and the first chamber a increasing in volume to generate airflow and be drawn in, a portion of the fourth airflow 4, after passing through the second sub-channel 24, will be drawn into the first chamber a through the first sub-channel 23. Specifically, since the fourth airflow 4 is a high-speed jet, it will be discharged through the confluence channel 25 under the action of airflow inertia. However, due to the increased volume of the first chamber a generating suction, and the connection between the first sub-channel 23 and the second sub-channel 24, a small portion of the fourth airflow 4 passing through the second sub-channel 24 will be drawn into the first chamber a through the first outlet a2 of the first sub-channel 23 under the suction of the first chamber a; of course, the gas drawn into the first chamber a is mainly drawn in from the first inlet a1.

[0160] In this embodiment, the two ends of the vibrating substrate 11 in the width direction are fixed, while the two ends in the length direction are movable. During the transition of the heat dissipation device 100 from the first state to the second state, that is, during the vibration of the vibrating substrate 11 towards the second cover plate 40, since the vibrating substrate 11 and the first support body 20 are not fixedly connected, and the side of the vibrating substrate 11 facing away from the first support body 20 is also movable, the vibrating substrate 11 moves towards the second cover plate 40. The dimensions of the first inlet a1 and the first outlet a2 of the first chamber a both increase, while the dimensions of the second inlet b1 and the second outlet b2 of the second chamber b both decrease. This increases the flow rate of the third airflow 3 and directs it out of the air outlet 102. It can be understood that the airflow rate drawn into the heat dissipation device 100 from the first inlet a1 is greater than the airflow rate discharged from the second inlet b1.

[0161] It should be noted that the first airflow 1, the second airflow 2, the third airflow 3, and the fourth airflow 4 are all air; they are used here only to distinguish the airflow direction within the chambers when the volumes of the first chamber a and the second chamber b are compressed or increased. Specifically, the gas entering or exiting the first inlet a1 of the first chamber a is named the first airflow 1, the gas entering or exiting the first outlet a2 of the first chamber a is named the second airflow 2, the gas entering or exiting the second inlet b1 of the second chamber b is named the third airflow 3, and the gas entering or exiting the second outlet b2 of the second chamber b is named the fourth airflow 4. In this embodiment, the first airflow 1, the second airflow 2, the third airflow 3, and the fourth airflow 4 always have a certain amount of gas.

[0162] In this embodiment, a voltage is initially applied to the electrode of the first piezoelectric element 12 of the heat dissipation device 100, causing the heat dissipation device 100 to transition from its initial state to a first state. The first piezoelectric element 12 drives the vibrating substrate 11 to vibrate towards the first cover plate 30. Then, a changing voltage is applied to the electrode of the first piezoelectric element 12, causing the heat dissipation device 100 to transition from the first state to a second state. The first piezoelectric element 12 then drives the vibrating substrate 11 to vibrate towards the second cover plate 40. As the heat dissipation device 100 switches back and forth between the first and second states during heat dissipation, the piezoelectric vibrator 10 vibrates back and forth along the Z-axis between the first cover plate 30 and the second cover plate 40. The heat dissipation device 100 consistently draws in air from the air inlet 101 and exhausts air from the air outlet 102. In this embodiment, the heat source is located on the side of the air outlet 102 of the heat dissipation device 100. The heat dissipation device 100 utilizes the air exhausted from the air outlet 102 to directly dissipate heat from the heat source, ensuring efficient heat dissipation. Furthermore, the air outlet 102 and the air inlet 101 are in opposite directions and are arranged along the thickness direction perpendicular to the vibrating substrate 11, thereby reducing the size of the heat dissipation device 100 in the thickness direction to a certain extent, which is beneficial to the thinning of the heat dissipation device 100.

[0163] Please refer to the following: Figure 10 and Figure 11 , Figure 10 for Figure 2 The diagram shows a simplified structural representation of the heat dissipation device for the electronic device. Figure 11 for Figure 8b The diagram shows the gas flow velocity within the chambers and channels of the heat dissipation device. It should be noted that... Figure 11 The arrows in the image represent airflow within the heat dissipation device.

[0164] Specifically, such as Figure 11 As shown, when the heat dissipation device 100 changes from the original state to the first state, the volume of the second chamber b gradually increases due to the vibration of the piezoelectric vibrator 10, and a suction force is generated, so that the second chamber b draws in the third airflow 3 from the second inlet b1 and the fourth airflow 4 from the second outlet b2.

[0165] Meanwhile, the volume of the first chamber a gradually decreases. The gas in the first chamber a is compressed by the piezoelectric vibrator 10 and discharged from the first inlet a1 as the first airflow 1, and discharged from the first outlet a2 as the second airflow 2. After the second airflow 2 enters the first sub-channel 23, a small portion of the second airflow 2 will enter the second sub-channel 24 from the intersection of the first sub-channel 23 and the second sub-channel 24 under the suction of the second chamber b, and then be drawn into the second chamber b through the second outlet b2 connected to the second sub-channel 24. At the same time, most of the second airflow 2 enters the confluence channel 25 under the action of gas inertia and is discharged from the heat dissipation device 100 through the air outlet 102. Most of the second airflow 2 discharged from the heat dissipation device 100 is blown towards the heat source located in the heat dissipation channel 400 and exchanges heat with the heat source to achieve heat dissipation. In this process, the gas located in the middle part is discharged rapidly towards the air inlet 101 and the air outlet 102. The airflow is large, which can avoid affecting the exhaust of the first chamber a during the process of the gas being drawn into the second chamber b, thus ensuring the heat dissipation effect.

[0166] In this embodiment, the heat dissipation device 100 uses ceramic piezoelectric sheets to form the driving part of the piezoelectric vibrator 10, and the heat conduction air duct A is divided into a first chamber a and a second chamber b by the piezoelectric vibrator 10. When the heat dissipation device 100 switches back and forth between the first state and the second state, the piezoelectric vibrator 10 can periodically vibrate along the Z-axis between the first cover plate 30 and the second cover plate 40, so that the volume of the first chamber a and the second chamber b is periodically compressed and expanded. In each cycle, the heat dissipation device 100 dissipates heat from the heat source located in the heat dissipation channel 400 by the second airflow 2 discharged when the volume of the first chamber a is compressed, or by the fourth airflow 4 discharged when the volume of the second chamber b is compressed. The heat-conducting air duct A, through the vibration of the piezoelectric vibrator 10, drives the first chamber a and the second chamber b in a reciprocating manner, thus directionally transporting gas from the external environment of the electronic device 1000 to the heat dissipation device 100, and then directionally expelling the gas from the external environment of the electronic device 1000, thereby realizing the function of blowing air for heat dissipation of the heat dissipation device 100. The structure of the heat-conducting air duct A is simple and does not occupy the thickness dimension of the heat dissipation device 100, which is conducive to the thinning of the heat dissipation device 100.

[0167] Furthermore, in each cycle, the amount of gas drawn into the heat dissipation device 100 from the air inlet 101 is greater than the amount of gas discharged from the air outlet 102. The greater the vibration amplitude of the piezoelectric vibrator 10, the greater the amount of gas discharged by the heat dissipation device 100 in each cycle, enabling more active and effective heat dissipation from the heat source located in the heat dissipation channel 400. Moreover, the use of piezoelectric ceramic combined with the vibrating substrate 11 does not generate noise, and the heat dissipation effect of the heat dissipation device 100 on the heat source is better.

[0168] Please see Figure 12 , Figure 12 for Figure 2 A schematic diagram of a second embodiment of the heat dissipation device in the electronic device shown.

[0169] In this embodiment, unlike the structure of the heat dissipation device 100 in the first embodiment described above, the heat dissipation device 100 in this embodiment further includes a second support body 70. The second support body 70 has a second flow channel 73. The second support body 70 is connected to the side of the first cover plate 30 and the second cover plate 40 facing away from the first support body 20. The second support body 70 is disposed at the first inlet a1 of the first chamber a and the second inlet b1 of the second chamber b, and the second flow channel 73 of the second support body 70 communicates with the first chamber a and the second chamber b. The side of the second flow channel 73 facing away from the first cover plate 30 and the second cover plate 40 constitutes the air inlet 101 of the heat dissipation device 100. In this embodiment, the first cover plate 30, the second cover plate 40, the first support member 50, and the second support member 60 are all fixedly connected to the second support body 70.

[0170] In this embodiment, the second support 70 is an elongated structure. The second support 70 is made of metal. The length direction of the second support 70 is the same as the width direction of the heat dissipation device 100, and is perpendicular to the length direction of the first support 50 and the length direction of the second support 60.

[0171] It should be noted that the contents that are the same as those in the first embodiment described above will not be repeated here. For a detailed description, please refer to the first embodiment.

[0172] Please see Figure 13 , Figure 13 for Figure 12 A schematic diagram of the cross-sectional structure of the second support body of the heat dissipation device shown.

[0173] In this embodiment, the second support body 70 includes a first side surface 71 and a second side surface 72. The first side surface 71 and the second side surface 72 are arranged opposite to each other along the width direction of the second support body 70. The second support body 70 is a strip with a generally rectangular cross-section.

[0174] In this embodiment, the second flow channel 73 of the second carrier 70 has a trumpet-shaped structure. The second flow channel 73 passes through the first side 71 and the second side 72 of the second carrier 70, and extends along the width direction of the second carrier 70. The second flow channel 73 is used to connect the first inlet a1 of the first chamber a and the second inlet b1 of the second chamber b, as well as the heat dissipation channel 400.

[0175] In this embodiment, the second flow channel 73 has a first opening 731 and a second opening 732. The first opening 731 is formed on the first side 71, and the second opening 732 is formed on the second side 72. The cross-sectional area of ​​the second flow channel 73 gradually decreases from the first opening 731 to the second opening 732.

[0176] The second flow channel 73 includes a first wall and a second wall opposite to each other along the thickness direction of the second support body 70. The first wall and the second wall form part of the first opening 731 and the second opening 732. The first wall and the second wall extend along the direction of the second support body, and the surfaces of the first wall and the second wall can be curved or flat. In this embodiment, the surfaces of the first wall and the second wall are curved, and the surfaces of the first wall and the second wall are curved away from each other. In the direction from the first opening 731 to the second opening 732, both the first wall and the second wall are inclined towards the second opening 732. It can be understood that the area of ​​the first opening 731 is larger than the area of ​​the second opening 732, and the first wall and the second wall are inclined, which facilitates the natural passage of airflow from the first inlet a1 and the second inlet b1 through the second flow channel 73.

[0177] Please refer to the following: Figure 12 , Figure 14 and Figure 15 , Figure 14 for Figure 12 The diagram shows a cross-sectional view of the heat dissipation device along BB in the first state. Figure 15 for Figure 12 The diagram shows a cross-sectional view of the heat dissipation device along BB in the second state.

[0178] In this embodiment, the piezoelectric vibrator 10, the first carrier 20, the first cover plate 30, the second cover plate 40, the second carrier 70, two first support members 50, and two second support members 60 are assembled. The second carrier 70 is fixedly connected to the first cover plate 30, the second cover plate 40, the first support member 50, and the second support member 60. The second carrier 70 and the first carrier 20 are located at opposite ends along the length of the heat dissipation device 100. The second carrier 70 and the first carrier 20 have the same length and width. The second flow channel 73 of the second carrier 70, the first flow channel d of the first carrier 20, the first chamber a, and the second chamber b together constitute the heat-conducting air duct A of the heat dissipation device 100.

[0179] Specifically, along the Y-axis, the first cover plate 30, the second cover plate 40, the first support member 50, and the second support member 60 are connected to the second side surface 72; the vibration base plate 11 contacts the second side surface 72 of the second carrier 70. The second opening 732 of the second flow channel 73 is opposite to and communicates with the first inlet a1 of the first chamber a and the second inlet b1 of the second chamber b. The first opening 731 of the second flow channel 73 is the air inlet 101.

[0180] like Figure 14 As shown, the heat dissipation device 100 is in the first state, as... Figure 15 As shown, the heat dissipation device 100 is in the second state. The vibration principle of the piezoelectric vibrator 10 and the original state of the heat dissipation device 100 are detailed in the description of the first embodiment above. The following only describes the gas flow in the first chamber a and the second chamber b of the heat dissipation device 100 during the heat dissipation process.

[0181] like Figure 14 As shown, a voltage is applied to the electrode of the first piezoelectric element 12, and the heat dissipation device 100 changes from its original state to the first state. The piezoelectric vibrator 10 gradually deforms and approaches the first cover plate 30, and the volume of the first chamber a is gradually compressed and reduced. The gas in the first chamber a is compressed and flows in two directions: the first inlet a1 and the first outlet a2. The cooperation between the piezoelectric vibrator 10 and the first carrier 20 is described in the first embodiment above and will not be repeated here. The gas in the first chamber a forms a first airflow 1 and a second airflow 2 flowing in two directions: the first inlet a1 and the first outlet a2. The first airflow 1 is discharged to the heat dissipation channel 400 through the first inlet a1. The second airflow 2 enters the first sub-channel 23 through the first outlet a2. It should be noted that during the gradual transition from the original state to the first state, the amount of gas in the first airflow 1 gradually decreases, and the amount of gas in the second airflow 2 gradually increases. At this time, all the gas discharged from the first chamber a enters the first sub-channel 23 through the first outlet a2.

[0182] Meanwhile, the volume of the second chamber b gradually increases. Suction is generated within the second chamber b, drawing in the third airflow 3 and the fourth airflow 4 from the second inlet b1 and the second outlet b2, respectively. The third airflow 3 and the fourth airflow 4 flow relative to each other. During this process, a small amount of the second airflow 2 discharged through the first sub-channel 23 is drawn into the second sub-channel 24 at the intersection with the confluence channel 25 and the second sub-channel 24, forming the fourth airflow 4. In other words, the amount of gas in the third airflow 3 is greater than the amount of gas in the fourth airflow 4.

[0183] In this embodiment, during the transition of the heat dissipation device 100 from its original state to its first state, that is, during the vibration deformation of the vibrating substrate 11 towards the first cover plate 30, since the vibrating substrate 11 and the first support body 20 are not fixedly connected, and the vibrating substrate 11 and the second support body 70 are not fixedly connected, the end of the vibrating substrate 11 near the second support body 70 moves relative to the second side surface 72 of the second support body 70 towards the first cover plate 30, and the end of the vibrating substrate 11 near the second support body 70 also moves relative to the second side surface 72 of the second support body 70 towards the first cover plate 30. The dimensions of the first inlet a1 and the first outlet a2 of the first chamber a are both reduced, while the dimensions of the second inlet b1 and the second outlet b2 of the second chamber b are both increased. The gas volume of the first airflow 1 is less than the gas volume of the third airflow 3. The amount of gas drawn into the heat dissipation device 100 from the air inlet 101 is greater than the amount of gas discharged from the air inlet 101, that is, the heat dissipation device 100 can directionally draw in gas from the air inlet 101 and discharge gas to the air outlet 102, ensuring the exhaust volume and thus ensuring the heat dissipation effect.

[0184] Furthermore, as the piezoelectric vibrator 10 gradually approaches the first cover plate 30 from the end near the second support body 70, the first inlet a1 of the first chamber a is gradually blocked by the second side surface 72 of the second support body 70. This causes the amount of gas discharged from the first chamber a through the first inlet a1 to gradually decrease, while the amount of gas discharged from the first chamber a through the first outlet a2 to gradually increase. In other words, the amount of gas in the first airflow 1 gradually decreases, and the amount of gas in the second airflow 2 gradually increases. When the piezoelectric vibrator 10 reaches the first state, the first inlet a1 of the first chamber a is completely blocked by the second side surface 72 of the second support body 70. At this time, the first airflow 1 does not exist, and the amount of gas in the second airflow 2 is at its maximum, meaning that all the gas discharged from the first chamber a forms the second airflow 2. Simultaneously, the second inlet b1 of the second chamber b gradually exposes the second flow channel 73 of the second support body 70, causing the amount of gas in the third airflow 3 drawn in from the second inlet b1 to gradually increase. This makes it easier for the heat dissipation device 100 to draw in more gas from the air inlet 101 and exhaust it from the air outlet 102, thereby further increasing the amount of gas discharged from the heat dissipation device 100 to the heat source and improving the heat dissipation efficiency of the heat dissipation device 100.

[0185] like Figure 15 As shown, a varying voltage is applied to the electrode of the first piezoelectric element 12, causing the heat dissipation device 100 to transition from a first state to a second state. The piezoelectric vibrator 10 gradually deforms and approaches the second cover plate 40. The volume of the second chamber b is gradually compressed and reduced. The gas in the second chamber b is compressed and flows in two directions: the second inlet b1 and the second outlet b2. The cooperation between the piezoelectric vibrator 10 and the first support body 20 at this time is described in the first embodiment above and will not be repeated here.

[0186] The gas in the second chamber b flows in two directions—the second inlet b1 and the second outlet b2—forming a third airflow 3 and a fourth airflow 4. The third airflow 3 is discharged into the heat dissipation channel 400 through the second inlet b1. The fourth airflow 4 enters the second sub-channel 24 through the second outlet b2. It should be noted that during the gradual transition from the first state to the second state, the amount of gas in the third airflow 3 gradually decreases, while the amount of gas in the fourth airflow 4 gradually increases. At this time, all the gas discharged from the second chamber b enters the second sub-channel 24 through the second outlet b2.

[0187] Meanwhile, the volume of the first chamber a gradually increases. Suction is generated within the first chamber a, drawing in the first airflow 1 and the second airflow 2 from both the first inlet a1 and the first outlet a2, respectively. The first airflow 1 is drawn into the first chamber a through the first inlet a1. The second airflow 2 is drawn in through the first sub-channel 23 and the first outlet a2; the first airflow 1 and the second airflow 2 flow relative to each other. During this process, a small amount of the fourth airflow 4 discharged through the second sub-channel 24 is drawn into the first sub-channel 23 at the intersection of the confluence channel 25 and the second sub-channel 24, forming the second airflow 2. In other words, the volume of the first airflow 1 is greater than the volume of the second airflow 2.

[0188] In this embodiment, during the transition of the heat dissipation device 100 from the first state to the second state, that is, during the vibration deformation of the vibrating substrate 11 towards the second cover plate 40, the end of the vibrating substrate 11 near the second support 70 moves relative to the second side surface 72 of the second support 70 towards the second cover plate 40, and the end of the vibrating substrate 11 near the first support 20 moves relative to the first side surface 21 of the first support 20 towards the second cover plate 40. The dimensions of the second inlet b1 and the second outlet b2 of the second chamber b decrease, while the dimensions of the first inlet a1 and the first outlet a2 of the first chamber a increase. The gas volume of the first airflow 1 is greater than the gas volume of the third airflow 3. The amount of gas drawn into the heat dissipation device 100 from the air inlet 101 is greater than the amount of gas discharged from the air inlet 101, that is, the heat dissipation device 100 can directionally draw in gas from the air inlet 101 and discharge gas to the air outlet 102.

[0189] Furthermore, as the piezoelectric vibrator 10 gradually approaches the second cover plate 40 from the end near the second support body 70, the second inlet b1 of the second chamber b is gradually blocked by the second side surface 72 of the second support body 70. This causes the amount of gas discharged from the second chamber b through the second inlet b1 to gradually decrease, while the amount of gas discharged from the second chamber b through the second outlet b2 to gradually increase. In other words, the amount of the third airflow 3 gradually decreases, and the amount of the fourth airflow 4 gradually increases. When the piezoelectric vibrator 10 reaches the second state, the second inlet b1 of the second chamber b is completely blocked by the second side surface 72 of the second support body 70. At this time, the third airflow 3 does not exist, and the amount of the fourth airflow 4 is at its maximum, meaning that all the gas discharged from the second chamber b forms the fourth airflow 4. Simultaneously, the first inlet a1 of the first chamber a gradually exposes the second flow channel 73 of the second support body 70, causing the amount of the first airflow 1 drawn in from the first inlet a1 to gradually increase. This makes it easier for the heat dissipation device 100 to draw in air from the air inlet 101 and exhaust air from the air outlet 102, thereby increasing the amount of gas blown out of the heat dissipation device 100 to the heat source and improving the heat dissipation efficiency of the heat dissipation device 100.

[0190] In summary, the heat-conducting air duct A of the heat dissipation device 100 is divided into a first chamber a and a second chamber b by the piezoelectric vibrator 10. When the heat dissipation device 100 switches back and forth between the first and second states, the piezoelectric vibrator 10 periodically vibrates along the Z-axis between the first cover plate 30 and the second cover plate 40, causing the volumes of the first chamber a and the second chamber b to be periodically compressed and expanded. In each cycle, the gas discharged from the first sub-channel 23 by the compression of the volume of the first chamber a is almost entirely used to dissipate heat from the heat source, or the gas discharged from the second sub-channel 24 by the compression of the volume of the second chamber b is almost entirely used to dissipate heat from the heat source, further improving the heat dissipation efficiency of the heat dissipation device 100 in one cycle.

[0191] It should be noted that "partial obstruction" and "complete obstruction" refer to the relationship between the projection of the second carrier 70 along the Y-axis and the projection of the first inlet a1 or the second inlet b1 along the Y-axis. That is, partial obstruction means the projection of the second carrier 70 along the Y-axis covers part of the first inlet a1 or part of the second inlet b1, while complete obstruction means the projection of the second carrier 70 along the Y-axis completely covers the first inlet a1 or the second inlet b1. Furthermore, the second side 72 of the second carrier 70 has a certain assembly gap with the first inlet a1 and the second inlet b1; the airflow through this assembly gap is negligible.

[0192] In this embodiment, since the first cover plate 30, the second cover plate 40, the first support member 50, the second support member 60, the first carrier 20, and the second carrier 70 are all made of metal, the heat dissipation device 100 has high structural rigidity. Furthermore, the second carrier 70 can be fixedly connected to the first cover plate 30, the second cover plate 40, the first support member 50, and the second support member 60 by welding, ensuring the stability of the piezoelectric vibrator 10. In some embodiments, one or more of the first cover plate 30, the second cover plate 40, the first support member 50, the second support member 60, the first carrier 20, and the second carrier 70 can be made of other materials such as plastic, and these structural components can be connected and fixed by adhesive or screwing.

[0193] Please see Figure 16 and Figure 17 , Figure 16 for Figure 2 A cross-sectional schematic diagram of a third embodiment of the heat dissipation device in the illustrated electronic device. Figure 17 for Figure 16 The diagram shows the gas flow velocity within the chambers and channels of a portion of the heat dissipation device. It should be noted that... Figure 17 The illustration shows the simulation results when the heat dissipation device transitions from the second state to the first state. Figure 17 The arrow in the image represents the second airflow.

[0194] In this embodiment, unlike the structure of the first embodiment described above, the heat dissipation device 100 further includes a flow-blocking channel H. Along the Y-axis, the flow-blocking channel H is located between the piezoelectric vibrator 10 and the first support body 20.

[0195] Specifically, the vibrating substrate 11 of the piezoelectric vibrator 10 includes an end face 18. Along the Y-axis direction, the end face 18 faces the first side surface 21 of the first carrier 20 and is spaced apart from and opposite to the second side surface 22 of the first carrier 20, forming a flow-blocking channel H.

[0196] The flow-blocking channel H connects the first chamber a and the second chamber b in the thickness direction. The flow-blocking channel H has a first opening H1 and a second opening H2, which are arranged opposite to each other along the thickness direction of the flow-blocking channel H. The first opening H1 faces the first chamber a and is adjacent to and communicates with the first outlet a2 of the first chamber a. The second opening H2 faces the second chamber b and is adjacent to and communicates with the second outlet b2 of the second chamber b. It can be understood that the end face 18 of the vibrating substrate 11 and the first side surface 21 of the first support 20 form a portion of the first opening H1 and the second opening H2.

[0197] During the reciprocating vibration of the piezoelectric vibrator 10 in the heat dissipation device 100, the gas passing through the choke channel H also flows reciprocally. For example... Figure 17As shown, when the heat dissipation device 100 transitions from the second state to the first state, since the first chamber a exhausts air and the second chamber b draws air in, a portion of the second airflow 2 in the first chamber a sequentially enters the second chamber b through the first port H1 and the second port H2 of the flow obstruction channel H, flowing with the original gas flow in the second chamber b. Another portion of the second airflow 2 in the first chamber a enters the first sub-flow channel 23. The subsequent flow process of the second airflow 2 through the first sub-flow channel 23 can be referred to the description in the first embodiment, and will not be repeated here.

[0198] Due to the viscosity of the gas, the portion of the second airflow 2 returning to the second chamber b via the second sub-channel 24 and the portion of the second airflow 2 entering the second chamber b via the obstruction channel H collide, causing them to meet and form a vortex M at the end of the second chamber b near the first support 20. The vortex M, in turn, acts on the second airflow 2 returning from the obstruction channel H and the second sub-channel 24, reducing the amount of gas returning via the second sub-channel 24 and the obstruction channel H, thus increasing the amount of gas discharged from the confluence channel 25. This further improves the heat dissipation efficiency of the second airflow 2 on the heat source, thereby contributing to a further improvement in the heat dissipation performance of the heat dissipation device 100. In other words, the obstruction channel H can suppress the return of the second airflow 2 to the second chamber b.

[0199] When the heat dissipation device 100 changes from the first state to the second state, the first chamber a draws in air and the second chamber b exhausts air. Part of the fourth airflow 4 in the second chamber b enters the first chamber a in sequence through the second port H2 and the first port H1 of the flow obstruction channel H. Another part of the fourth airflow 4 in the second chamber b enters the second sub-flow channel 24. The subsequent flow process of the fourth airflow 4 through the second sub-flow channel 24 can be referred to the first embodiment, and will not be repeated here.

[0200] The portion of the fourth airflow 4 returning to the first chamber a via the first sub-channel 23 and the portion of the fourth airflow 4 entering the first chamber a via the obstruction channel H collide, thus forming a vortex M at the end of the first chamber a near the first support 20. The vortex M, in turn, acts on the fourth airflow 4 returning from the obstruction channel H and the first sub-channel 23, reducing the amount of fourth airflow 4 returning through these channels and increasing the amount of fourth airflow 4 exiting from the confluence channel 25. This further enhances the heat dissipation efficiency of the fourth airflow 4 on the heat source, thereby contributing to a further improvement in the heat dissipation performance of the heat dissipation device 100. In other words, the obstruction channel H can suppress the return of the fourth airflow 4 to the first chamber a.

[0201] In addition, the flow-blocking channel H makes the vibrating substrate 11 and the first carrier 20 spaced apart to avoid the piezoelectric vibrator 10 from contacting the first carrier 20 and affecting the vibration amplitude of the piezoelectric vibrator 10.

[0202] It should be noted that the contents that are the same as those in the first embodiment described above will not be repeated here. For a detailed description, please refer to the first embodiment.

[0203] As can be seen from the second and third embodiments, the heat dissipation device 100 may also include both the second support 70 and the flow obstruction channel H. The specific structure and effects can be understood by integrating the content of the second and third embodiments, and will not be elaborated upon here.

[0204] Please see Figure 18 , Figure 18 for Figure 2 A schematic diagram of the fourth embodiment of the heat dissipation device in the electronic device shown.

[0205] In this embodiment, unlike the structure of the first embodiment described above, the vibrating substrate 11 is a cantilever structure. The vibrating substrate 11 includes a movable end 15 and a fixed end 16, which are opposite ends in the width direction of the vibrating substrate 11. The movable end 15 is spaced apart from a first support member 50 and a second support member 60 along the X-axis, meaning the movable end 15 is the movable end of the vibrating substrate 11. The fixed end 16 is clamped and fixed by another first support member 50 and another second support member 60, meaning the fixed end 16 is the stationary end of the vibrating substrate 11. The first piezoelectric element 12 can be located at any position between the movable end 15 and the fixed end 16 of the vibrating substrate 11 (including the movable end 15 and positions near the fixed end 16). Preferably, the first piezoelectric element 12 is located near the fixed end 16 to further increase the vibration amplitude of the vibrating substrate 11.

[0206] The first support member 50 and the second support member 60 near the movable end 15 are stacked and connected along the Z-axis direction. The first support member 50 and the second support member 60 near the movable end 15 of the vibrating substrate 11 can be formed separately. In some embodiments, the first support member 50 and the second support member 60 near the movable end 15 of the vibrating substrate 11 can be formed integrally.

[0207] It should be noted that the gap between the movable end 15 of the vibrating substrate 11 and the first support member 50 and the second support member 60 near the movable end 15 is very small. When the vibrating substrate 11 vibrates, the gap can be approximately considered to have no airflow, that is, it substantially divides the space between the first cover plate 30 and the second cover plate 40 into a first chamber a and a second chamber b. The contents that are the same as those in the first embodiment described above will not be repeated here.

[0208] Please see Figure 19 , Figure 19 for Figure 2A schematic diagram of the fifth embodiment of the heat dissipation device in the illustrated electronic device.

[0209] In this embodiment, unlike the first embodiment described above, the heat dissipation device 100 includes a reinforcing rib 80. The reinforcing rib 80 and the first support member 50 are stacked along the Z-axis. The first support member 50 is connected to the second surface 32 of the first cover plate 30, and the reinforcing rib 80 is connected between the first support member 50 and the vibrating substrate 11. The length direction of the reinforcing rib 80 is the same as the length direction of the first support member 50. The width direction of the reinforcing rib 80 is the same as the width direction of the first support member 50. The width of the reinforcing rib 80 is greater than the width of the first support member 50, and the reinforcing rib 80 extends into the first chamber a along its width direction to increase the structural rigidity at both ends of the vibrating substrate 11 of the heat dissipation device 100.

[0210] Specifically, one end of the reinforcing rib 80 in the width direction is flush with one end of the first support member 50 in the width direction, and the other end of the reinforcing rib 80 in the width direction is an extension 801, which is located in the first chamber a and stacked with the vibrating substrate 11. That is, the first support member 50 and the reinforcing rib 80 form a support structure with a stepped cross-section. The reinforcing rib 80 and the first support member 50 can be separately assembled. Alternatively, the reinforcing rib 80 can be integrated with the first support member 50; this application does not limit this. In this embodiment, two reinforcing ribs 80 are spaced apart along the width direction of the heat dissipation device 100, and each reinforcing rib 80 is connected to the vibrating substrate 11 and a first support member 50. Along the X-axis direction, the first piezoelectric member 12 is located between the two reinforcing ribs 80 and spaced apart from each of the two reinforcing ribs 80. In other embodiments, the extension 801 is located in the second chamber.

[0211] In this embodiment, since the width of the reinforcing rib 80 is greater than the width of the first support member 50, the extension 801 increases the structural rigidity at the connection point between the vibration substrate 11 and the first support member 50, thereby reducing the thickness of the vibration substrate 11. Specifically, the thickness of the vibration substrate 11 in this embodiment is less than or equal to 0.1 mm. Compared to existing vibration substrates 11 with larger thickness and no reinforcing rib 80, the reduced thickness of the vibration substrate 11 increases the space of the first chamber a and the second chamber b, increases the vibration frequency of the piezoelectric vibrator 10, and thus improves the heat dissipation efficiency of the heat dissipation device 100.

[0212] It should be noted that the contents that are the same as those in the first embodiment described above will not be repeated here.

[0213] Please see Figure 20 and Figure 21 , Figure 20 for Figure 2 The diagram shows a sixth embodiment of the heat dissipation device in the electronic device. Figure 21 for Figure 20 The diagram shows the exploded structure of the heat dissipation device.

[0214] In this embodiment, unlike the structure of the fifth embodiment described above, the piezoelectric oscillator 10 further includes a second piezoelectric element 17. The second piezoelectric element 17 is a flat rectangular thin plate, and is made of piezoelectric materials such as piezoelectric ceramics. The second piezoelectric element 17 is stacked and connected to one side of the vibrating substrate 11 in the thickness direction. Utilizing the inverse piezoelectric effect of the piezoelectric material, when a voltage is applied to the electrodes of the second piezoelectric element 17, the second piezoelectric element 17 will bend and deform along the Z-axis, causing the vibrating substrate 11 to bend and deform along the Z-axis. When a varying voltage is applied to the electrodes of the second piezoelectric element 17, the second piezoelectric element 17 undergoes continuous reciprocating vibration along the Z-axis, thereby causing the vibrating substrate 11 to undergo continuous reciprocating vibration along the Z-axis.

[0215] In this embodiment, when a varying voltage is simultaneously applied to the electrodes of the first piezoelectric element 12 and the second piezoelectric element 17, the first piezoelectric element 12 and the second piezoelectric element 17 cause the vibrating substrate 11 to undergo continuous reciprocating vibration along the Z-axis direction. This will be described in detail below.

[0216] In this embodiment, there are two second piezoelectric elements 17. The first piezoelectric element 12 and the two second piezoelectric elements 17 are located together in the second chamber b. The two second piezoelectric elements 17 and the first piezoelectric element 12 are all connected to the second surface 14 of the vibrating substrate 11 and are spaced apart from the third surface 41 of the second cover plate 40. Along the X-axis direction, the first piezoelectric element 12 is located between the two second piezoelectric elements 17 and is spaced apart from the two second piezoelectric elements 17. The first piezoelectric element 12 and the two second piezoelectric elements 17 are located between the two second supports 60, and the two second piezoelectric elements 17 are spaced apart from the two second supports 60 respectively to avoid the second supports 60 from hindering the deformation of the second piezoelectric elements 17. It can be understood that the first piezoelectric element 12 and the second piezoelectric element 17 are located on the same side in the thickness direction of the vibrating substrate 11. The first piezoelectric element 12 is located at the middle position of the vibrating substrate 11, and the two second piezoelectric elements 17 are located at the two edges in the width direction of the vibrating substrate 11 respectively. The projections of the first piezoelectric element 12 and the two second piezoelectric elements 17 along the Z-axis are completely within the projection of the vibrating substrate 11 along the Z-axis.

[0217] It should be noted that the thickness of the first piezoelectric element 12 can be equal to the thickness of the second piezoelectric element 17, or the thickness of the first piezoelectric element 12 can be different from the thickness of the second piezoelectric element 17. In fact, the thicknesses of the first piezoelectric element 12 and the second piezoelectric element 17 can be set as needed to adjust the vibration amplitude of the piezoelectric oscillator 10 accordingly, thereby optimizing the amplitude of the piezoelectric oscillator 10.

[0218] A voltage is applied to the electrodes of the first piezoelectric element 12 and the two second piezoelectric elements 17. The first piezoelectric element 12 causes the center of the vibrating substrate 11 to reciprocate along the Z-axis, and the two second piezoelectric elements 17 cause the two edges of the vibrating substrate 11 to reciprocate along the Z-axis. Compared to setting a single piezoelectric element on the vibrating substrate 11, this embodiment uses the second piezoelectric element 17 and the first piezoelectric element 12 together acting on the vibrating substrate 11. The polarization directions of the first piezoelectric element 12 and the two second piezoelectric elements 17 can be the same or opposite. Alternatively, the polarization directions of the first piezoelectric element 12 and the two second piezoelectric elements 17 can be the same, their electrodes can be opposite, their polarization directions can be opposite, and their electrodes can be the same. When a voltage is applied, the deformation of the first piezoelectric element 12 is opposite to that of the two second piezoelectric elements 17 on either side. This arrangement is beneficial for maximizing the efficiency of using the deformation of the piezoelectric ceramic sheet to excite the vibration substrate 11, thereby increasing the vibration amplitude of the vibration substrate 11. The first piezoelectric element 12 and the two second piezoelectric elements 17 cause the volume of one of the first chamber a or the second chamber b to increase, while the volume of the other decreases. This further increases the amount of gas drawn in and expelled by the heat dissipation device 100, improving the heat dissipation efficiency of the heat dissipation device 100 for the heat source. The specific implementation process is described below.

[0219] Please refer to the following: Figure 20 and Figure 22 , Figure 22 for Figure 20 This is a schematic diagram of one embodiment of the electrode arrangement of the piezoelectric vibrator in the heat dissipation device shown. It should be noted that... Figure 22 In this context, "-" represents the negative electrode and "+" represents the positive electrode. Figure 22 The solid arrows in the diagram represent the polarization directions of the first and second piezoelectric elements.

[0220] In this embodiment, the surface of the first piezoelectric element 12 connected to the vibrating substrate 11 is the negative electrode, and the surface of the first piezoelectric element 12 facing away from the vibrating substrate 11 is the positive electrode. The surface of the second piezoelectric element 17 connected to the vibrating substrate 11 is the negative electrode, and the surface of the second piezoelectric element 17 facing away from the vibrating substrate 11 is also the negative electrode. It can be understood that the electrodes of the first piezoelectric element 12 and the second piezoelectric element 17 are identical. Since the negative electrodes of both the first piezoelectric element 12 and the second piezoelectric element 17 are connected to the vibrating substrate 11, it can be understood that the first piezoelectric element 12 and the second piezoelectric element 17 share a common negative electrode. The first piezoelectric element 12 and the second piezoelectric element 17 can be directly grounded through the vibrating substrate 11, simplifying the circuit connection of the piezoelectric oscillator 10.

[0221] Utilizing the inverse piezoelectric effect, when voltage is simultaneously applied to the electrodes of the second piezoelectric element 17 and the first piezoelectric element 12, the positive and negative electrodes of the first piezoelectric element 12 and the second piezoelectric element 17 are configured identically, and the polarization direction of the first piezoelectric element 12 is opposite to that of the two second piezoelectric elements 17. The first piezoelectric element 12 and the second piezoelectric element 17 will bend and deform along the Z-axis direction, and the deformations of the first piezoelectric element 12 and the second piezoelectric element 17 are opposite, causing the vibrating substrate 11 to bend and deform. This is beneficial for maximizing the efficiency of utilizing the deformation of the piezoelectric material to excite the vibrating substrate 11 to vibrate, increasing the vibration amplitude of the piezoelectric oscillator 10, and thus improving the heat dissipation efficiency of the heat dissipation device 100.

[0222] In some embodiments, the first piezoelectric element 12 and the second piezoelectric element 17 may share a positive electrode, in which case it is necessary to insulate the piezoelectric vibrator 10 and provide an additional grounding point. Alternatively, an insulating layer may be provided between the vibrating substrate 11 and the first piezoelectric element 12 and the second piezoelectric element 17, such as an adhesive layer connecting the vibrating substrate 11 and the first piezoelectric element 12 and the second piezoelectric element 17. The electrodes of the first piezoelectric element 12 and the second piezoelectric element 17 are independent of the vibrating substrate 11, that is, the first piezoelectric element 12 and the second piezoelectric element 17 can be connected to the positive and negative electrodes separately.

[0223] Please refer to the following: Figure 20 and Figure 23 , Figure 23 for Figure 20 This is a schematic diagram of another embodiment of the electrode arrangement of the piezoelectric oscillator in the heat dissipation device shown. It should be noted that... Figure 23 In this context, "-" represents the negative electrode and "+" represents the positive electrode. Figure 23 The solid arrows in the diagram represent the polarization directions of the first and second piezoelectric elements.

[0224] In this embodiment, unlike the previous embodiment, the surface of the first piezoelectric element 12 connected to the vibrating substrate 11 is the positive electrode, and the surface of the first piezoelectric element 12 facing away from the vibrating substrate 11 is the negative electrode. The electrode arrangement of the second piezoelectric element 17 remains unchanged; the surface of the second piezoelectric element 17 connected to the vibrating substrate 11 is the negative electrode, and the surface of the second piezoelectric element 17 facing away from the vibrating substrate 11 is also the negative electrode. It can be understood that having the electrodes of the first piezoelectric element 12 and the second piezoelectric element 17 in opposite positions, but with the same polarization direction, can also achieve the effects of the previous embodiment.

[0225] Utilizing the inverse piezoelectric effect, when voltage is simultaneously applied to the electrodes of the second piezoelectric element 17 and the first piezoelectric element 12, the positive and negative electrodes of the first piezoelectric element 12 and the second piezoelectric element 17 are arranged in opposite directions, and the polarization direction of the first piezoelectric element 12 is the same as that of the two second piezoelectric elements 17. The first piezoelectric element 12 and the second piezoelectric element 17 undergo bending deformation along the Z-axis direction, and the deformations of the first piezoelectric element 12 and the second piezoelectric element 17 are the same, which causes the vibrating substrate 11 to undergo bending deformation, further increasing the volume of one of the first chamber a or the second chamber b and further decreasing the volume of the other, thereby further increasing the amount of gas drawn in and discharged by the heat dissipation device 100, and thus improving the heat dissipation efficiency of the heat dissipation device 100 for the heat source.

[0226] In some other embodiments, the piezoelectric materials can also be stacked, the first piezoelectric element 12 can be composed of multiple layers of piezoelectric material, and / or the second piezoelectric element 17 can be composed of multiple layers of piezoelectric material.

[0227] Please see Figure 24 , Figure 24 for Figure 2 A schematic diagram of the seventh embodiment of the heat dissipation device in the illustrated electronic device.

[0228] In this embodiment, unlike the sixth embodiment described above, the first piezoelectric element 12 and the two second piezoelectric elements 17 of the piezoelectric vibrator 10 are located on different sides of the thickness direction of the vibrating substrate 11. When a voltage is applied to the electrodes of the first piezoelectric element 12 and the second piezoelectric element 17, the first piezoelectric element 12 and the second piezoelectric element 17 act simultaneously on the vibrating substrate 11, thereby further increasing the vibration amplitude of the piezoelectric vibrator 10. That is, the amplitude is increased without changing the volume of the first chamber a and the second chamber b, which is equivalent to saving the thickness space of the heat dissipation device 100.

[0229] In this embodiment, the second piezoelectric element 17 is staggered from the first piezoelectric element 12 along the Z-axis direction, meaning the projection of the second piezoelectric element 17 along the Z-axis direction does not overlap with the projection of the first piezoelectric element 12 along the Z-axis direction. Exemplarily, the first piezoelectric element 12 is located within the first chamber a, and along the X-axis direction, it is spaced apart from two reinforcing ribs 80. The first piezoelectric element 12 is located at the center of the vibrating substrate 11. The first piezoelectric element 12 is connected to the first surface 13 of the vibrating substrate 11, with the surface of the first piezoelectric element 12 connected to the vibrating substrate 11 being the negative electrode and the surface of the first piezoelectric element 12 facing away from the vibrating substrate 11 being the positive electrode. Both second piezoelectric elements 17 are located within the second chamber b, and are respectively located at two edges along the width direction of the vibrating substrate 11. Both second piezoelectric elements 17 are connected to the second surface 14 of the vibrating substrate 11, and the surfaces of the two second piezoelectric elements 17 connected to the vibrating substrate 11 are negative electrodes, while the surfaces of the two second piezoelectric elements 17 facing away from the vibrating substrate 11 are positive electrodes. That is to say, the first piezoelectric element 12 and the second piezoelectric element 17 can share a negative electrode and be directly grounded through the vibrating substrate 11, simplifying the circuit connection of the piezoelectric vibrator 10.

[0230] It should be noted that the contents that are the same as those in the sixth embodiment described above will not be repeated here.

[0231] Please see Figure 25 , Figure 26 and Figure 27 , Figure 25 for Figure 2 A schematic diagram of the structure of the eighth embodiment of the heat dissipation device for the electronic device shown. Figure 26 for Figure 25 The diagram shown is a structural schematic of the heat dissipation device from another angle. Figure 27 for Figure 25 The diagram shows the exploded structure of the heat dissipation device.

[0232] In this embodiment, unlike the heat dissipation device 100 in the fourth embodiment described above, the heat dissipation device 100 in this embodiment has two piezoelectric vibrators 10. The two piezoelectric vibrators 10 can divide the interior of the heat dissipation device 100 into three chambers. Furthermore, the structure of the first support 20 is also different. In some embodiments, the number of piezoelectric vibrators 10 is not limited to one or two; it can also be selected as three, four, five, etc., depending on the heat dissipation requirements. With the increase in the number of chambers, the heat dissipation efficiency of the heat dissipation device 100 is further improved.

[0233] Specifically, the heat dissipation device 100 has two piezoelectric vibrators 10, which are referred to as the first piezoelectric vibrator 10a and the second piezoelectric vibrator 10b for ease of description. The structures of the first piezoelectric vibrator 10a and the second piezoelectric vibrator 10b can be found in the first embodiment and the fourth embodiment described above, both including a vibrating substrate 11 and a first piezoelectric element 12, which will not be elaborated upon here. Along the Z-axis, both the first piezoelectric vibrator 10a and the second piezoelectric vibrator 10b are located between the first cover plate 30 and the second cover plate 40. The first piezoelectric vibrator 10a and the second piezoelectric vibrator 10b are spaced apart. The first piezoelectric vibrator 10a is spaced apart from the first cover plate 30. The second piezoelectric vibrator 10b is spaced apart from the second cover plate 40. The projection of the first piezoelectric vibrator 10a along the Z-axis partially overlaps with the projection of the second piezoelectric vibrator 10b along the Z-axis.

[0234] In this embodiment, the first piezoelectric vibrator 10a and the second piezoelectric vibrator 10b have the same structure. The thickness of the vibration substrate 11 of the first piezoelectric vibrator 10a is equal to the thickness of the vibration substrate 11 of the second piezoelectric vibrator 10b. The vibration substrate 11 of the first piezoelectric vibrator 10a and the vibration substrate 11 of the second piezoelectric vibrator 10b are connected to the first cover plate 30 and the second cover plate 40, and both are cantilever structures. The vibration substrate 11 of the first piezoelectric vibrator 10a has a first fixed end 16a and a first movable end 15a. The first fixed end 16a and the first movable end 15a are the opposite ends of the vibration substrate 11 of the first piezoelectric vibrator 10a in the width direction, respectively. The vibration substrate 11 of the second piezoelectric vibrator 10b has a second fixed end 16b and a second movable end 15b. The second fixed end 16b and the second movable end 15b are the opposite ends of the vibration substrate 11 of the second piezoelectric vibrator 10b in the width direction, respectively. The first fixed end 16a of the vibration substrate 11 of the first piezoelectric vibrator 10a and the second fixed end 16b of the vibration substrate 11 of the second piezoelectric vibrator 10b are located on different sides of the width direction of the heat dissipation device 100. The first piezoelectric element 12 of the first piezoelectric vibrator 10a is connected to the first surface 13 of the vibration substrate 11 of the first piezoelectric vibrator 10a. The first piezoelectric element 12 of the second piezoelectric vibrator 10b is connected to the second surface 14 of the vibration substrate 11 of the second piezoelectric vibrator 10b. The vibration directions of the first piezoelectric vibrator 10a and the second piezoelectric vibrator 10b are opposite along the Z-axis.

[0235] In some embodiments, the structures of the first piezoelectric vibrator 10a and the second piezoelectric vibrator 10b may be different, and the thickness of the vibrating substrate 11 of the first piezoelectric vibrator 10a and the second piezoelectric vibrator 10b may be different. For example, one of the vibrating substrates 11 of the first piezoelectric vibrator 10a and the second piezoelectric vibrator 10b may have both ends fixed in the width direction, while one end of the other may be movable and the other end fixed. Alternatively, both ends of the vibrating substrate 11 of the first piezoelectric vibrator 10a and the second piezoelectric vibrator 10b may be fixed in the width direction. That is, one of the vibrating substrates 11 of the first piezoelectric vibrator 10a and the second piezoelectric vibrator 10b may be a cantilever structure, and the other may be a simply supported beam. Alternatively, both the vibrating substrates 11 of the first piezoelectric vibrator 10a and the second piezoelectric vibrator 10b may be simply supported beams. Specific details can be deduced from the above embodiments and will not be elaborated here.

[0236] The heat dissipation device 100 has one first support member 50 and one second support member 60. The first support member 50 and the second support member 60 are located on opposite sides of the width direction of the heat dissipation device 100. The first support member 50 is connected between the first cover plate 30 and the first piezoelectric vibrator 10a. The second support member 60 is connected between the second cover plate 40 and the second piezoelectric vibrator 10b. The thickness of the first support member 50 is equal to the thickness of the second support member 60.

[0237] The heat dissipation device 100 also includes a third support member 90 and a fourth support member 91. The third support member 90 and the fourth support member 91 are located on both sides of the width direction of the heat dissipation device 100. In this embodiment, the third support member 90 is a long strip plate. The length direction of the third support member 90 is the same as the length direction of the second support member 60. The width direction of the third support member 90 is the same as the width direction of the second support member 60. The width of the third support member 90 is equal to the width of the second support member 60, and the third support member 90 is used to support the space between the first cover plate 30 and the second piezoelectric vibrator 10b.

[0238] The fourth support member 91 has the same structure as the third support member 90. The length direction of the fourth support member 91 is the same as the length direction of the first support member 50. The width direction of the fourth support member 91 is the same as the width direction of the first support member 50. The width of the fourth support member 91 is equal to the width of the first support member 50. The fourth support member 91 is used to support the space between the second cover plate 40 and the first piezoelectric vibrator 10a.

[0239] In this embodiment, the thickness of the third support member 90 is equal to the thickness of the fourth support member 91. The sum of the thicknesses of the third support member 90, the second support member 60, and the vibration substrate 11 of the second piezoelectric vibrator 10b is equal to the sum of the thicknesses of the fourth support member 91, the first support member 50, and the vibration substrate 11 of the second piezoelectric vibrator 10b, so as to ensure the uniformity of the thickness of the heat dissipation device 100.

[0240] In this embodiment, the third support member 90 and the fourth support member 91 can be made of metal, and can be fixedly connected to the first carrier 20 by welding. In some embodiments, the third support member 90 and the fourth support member 91 can be made of other materials such as plastic, and can be fixedly connected to surrounding structural members by adhesive or screwing.

[0241] The heat dissipation device 100 also includes a first reinforcing rib 81 and a second reinforcing rib 82. The first reinforcing rib 81 and the second reinforcing rib 82 are located on opposite sides of the width direction of the heat dissipation device 100. In this embodiment, both the first reinforcing rib 81 and the second reinforcing rib 82 are elongated plates. The first reinforcing rib 81 is used to support between the third support member 90 and the vibration substrate 11 of the first piezoelectric vibrator 10a, and to increase the structural rigidity at the third support member 90. The width direction of the first reinforcing rib 81 is the same as the width direction of the third support member 90, and the width of the first reinforcing rib 81 is greater than the width of the third support member 90 and less than the width of the vibration substrate 11 of the first piezoelectric vibrator 10a. The first reinforcing rib 81 and the third support member 90 form a structure with a stepped cross-section. The first reinforcing rib 81 and the third support member 90 can be a separately assembled structure. Alternatively, the first reinforcing rib 81 can be integrated with the third support member 90. This application does not limit this.

[0242] The second reinforcing rib 82 is used to support the fourth support member 91 and the vibration substrate 11 of the second piezoelectric vibrator 10b, and to increase the structural stiffness at the fourth support member 91. The width direction of the second reinforcing rib 82 is the same as the width direction of the fourth support member 91, and the width of the second reinforcing rib 82 is greater than the width of the fourth support member 91 and less than the width of the vibration substrate 11 of the second piezoelectric vibrator 10b. The second reinforcing rib 82 and the fourth support member 91 form a structure with a stepped cross-section. The second reinforcing rib 82 and the fourth support member 91 can be a separately assembled structure. Alternatively, the second reinforcing rib 82 can be integrated with the fourth support member 91. This application does not limit this.

[0243] It is understood that the first reinforcing rib 81 and the second reinforcing rib 82 are respectively provided with an extension section 801, and the extension section 801 supports the first piezoelectric vibrator 10a and the second piezoelectric vibrator 10b.

[0244] Please refer to both together. Figure 27 and Figure 28 , Figure 28 for Figure 25 The diagram shows a cross-sectional view of the heat dissipation device along the CC direction. It should be noted that... Figure 28 The first load-bearing body is not shown in the diagram.

[0245] In this embodiment, the first piezoelectric vibrator 10a, the second piezoelectric vibrator 10b, the first support member 50, the second support member 60, the first reinforcing rib 81, the second reinforcing rib 82, the third support member 90, and the fourth support member 91 are assembled.

[0246] Specifically, the third support member 90 and the first reinforcing rib 81 are supported between the second piezoelectric vibrator 10b and the first cover plate 30. The third support member 90 is connected to the second surface 32 of the first cover plate 30, and the third support member 90 and the first piezoelectric vibrator 10a are spaced apart along the X-axis. The first reinforcing rib 81 is connected to the first surface 13 of the vibration substrate 11 of the second piezoelectric vibrator 10b. The fourth support member 91 and the second reinforcing rib 82 are supported between the first piezoelectric vibrator 10a and the second cover plate 40. The fourth support member 91 is connected to the third surface 41 of the second cover plate 40, and the fourth support member 91 and the second piezoelectric vibrator 10b are spaced apart along the X-axis. The second reinforcing rib 82 is connected to the second surface 14 of the vibration substrate 11 of the first piezoelectric vibrator 10a.

[0247] The third support member 90, the first cover plate 30, the first piezoelectric vibrator 10a, and the first support member 50 form a first chamber a. The first piezoelectric element 12 of the first piezoelectric vibrator 10a is located in the first chamber a and is spaced apart from the first cover plate 30 along the Z-axis. The first fixed end 16a of the vibration substrate 11 of the first piezoelectric vibrator 10a is clamped and fixed by the first support member 50 and the fourth support member 91, and the first movable end 15a of the vibration substrate 11 of the first piezoelectric vibrator 10a is spaced apart from the third support member 90 along the X-axis.

[0248] The fourth support member 91, the second cover plate 40, the second piezoelectric vibrator 10b, and the second support member 60 form a second chamber b. The first piezoelectric element 12 of the second piezoelectric vibrator 10b is located inside the second chamber b and is spaced apart from the second cover plate 40 along the Z-axis. The second fixed end 16b of the vibration base plate 11 of the second piezoelectric vibrator 10b is clamped and fixed by the second support member 60 and the third support member 90, and the first reinforcing rib 81 is located between the third support member 90 and the vibration base plate 11 of the second piezoelectric vibrator 10b. The second movable end 15b of the vibration base plate 11 of the second piezoelectric vibrator 10b is spaced apart from the fourth support member 91 along the X-axis.

[0249] The third support member 90, the fourth support member 91, the first piezoelectric vibrator 10a, and the second piezoelectric vibrator 10b form a third chamber c. The first reinforcing rib 81 and the second reinforcing rib 82 are both located within the third chamber c. The second reinforcing rib 82 is located between the fourth support member 91 and the first piezoelectric vibrator 10a. One end of the second reinforcing rib 82 in the width direction is flush with one end of the first support member 50 in the width direction, and the other end of the second reinforcing rib 82 protrudes into the third chamber c relative to the other end of the first support member 50 in the width direction, thereby increasing the structural rigidity of the vibration substrate 11 of the first piezoelectric vibrator 19a. The first reinforcing rib 81 is located between the third support member 90 and the second piezoelectric vibrator 10b. One end of the first reinforcing rib 81 in the width direction is flush with one end of the second support member 60 in the width direction, and the other end of the first reinforcing rib 81 in the width direction protrudes into the third chamber c relative to the other end of the second support member 60 in the width direction, thereby increasing the structural rigidity of the vibration substrate 11 of the second piezoelectric vibrator 10b.

[0250] It is understandable that, along the Z-axis, the third chamber c is separated from the first chamber a by the first piezoelectric vibrator 10a, and the third chamber c is separated from the second chamber b by the second piezoelectric vibrator 10b.

[0251] It should be noted that the gaps in the X-axis direction between the first piezoelectric vibrator 10a and the third support member 90, and between the second piezoelectric vibrator 10b and the fourth support member 91, are very small. When the first piezoelectric vibrator 10a and the second piezoelectric vibrator 10b vibrate, the airflow within these gaps can be ignored, effectively dividing the space between the first cover plate 30 and the second cover plate 40 into a first chamber a, a second chamber b, and a third chamber c. Furthermore, content identical to the above embodiments will not be repeated here. The second support member 60 and the third support member 90 are referred to as the first support member group, and the first support member 50 and the fourth support member 91 are referred to as the second support member group.

[0252] Please see Figure 29 , Figure 29 for Figure 27 A schematic cross-sectional view of one embodiment of the first support body of the heat dissipation device shown.

[0253] In this embodiment, unlike the structure of the first carrier 20 in the first embodiment described above, the first flow channel d of the first carrier 20 in this embodiment further includes a third sub-flow channel 26. The third sub-flow channel 26 is recessed in the first side surface 21 of the first carrier 20 and extends towards the second side surface 22. Along the Z-axis direction, the third sub-flow channel 26 is spaced apart from the first sub-flow channel 23 and the second sub-flow channel 24, and the third sub-flow channel 26, the first sub-flow channel 23, and the second sub-flow channel 24 are all connected to the confluence channel 25. The first sub-flow channel 23, the second sub-flow channel 24, the third sub-flow channel 26, and the confluence channel 25 intersect. The third sub-flow channel 26 is used to communicate with the third chamber c and to allow gas discharged or drawn into the third chamber c to pass through. The structure and function of the first sub-flow channel 23, the second sub-flow channel 24, and the confluence channel 25 can be referred to the structure in the first embodiment described above, and will not be repeated here.

[0254] In this embodiment, the third sub-channel 26 has a fifth sub-port 261 and a sixth sub-port 262. The fifth sub-port 261 is formed on the first side surface 21, and the sixth sub-port 262 is connected to and communicates with the manifold 25 inside the first carrier 20. The cross-sectional area of ​​the third sub-channel 26 gradually decreases from the fifth sub-port 261 to the sixth sub-port 262.

[0255] The third sub-channel 26 includes a fifth channel wall and a sixth channel wall. The fifth and sixth channel walls form a portion of the fifth sub-port 261 and the sixth sub-port 262. The surfaces of the fifth and sixth channel walls can be curved or flat. In this embodiment, the surfaces of the fifth and sixth channel walls are flat. From the fifth sub-port 261 to the sixth sub-port 262, both the fifth and sixth channel walls are inclined towards the confluence channel 25. This can be understood as the area of ​​the fifth sub-port 261 being larger than the area of ​​the sixth sub-port 262, and the inclined arrangement of the fifth and sixth channel walls facilitating gas flow between the various sub-channels and the confluence channel 25.

[0256] In this embodiment, the first sub-port 231 of the first sub-channel 23, the fifth sub-port 261 of the third sub-channel 26, and the third sub-port 241 of the second sub-channel 24 are sequentially spaced along the Z-axis, i.e., the third sub-channel 26 is located between the first sub-channel 23 and the second sub-channel 24. The sixth sub-port 262 of the third sub-channel 26, the second sub-port 232 of the first sub-channel 23, the fourth sub-port 242 of the second sub-channel 24, and the confluence channel 25 are interconnected. The confluence channel 25 gathers the airflow from the first sub-channel 23, the second sub-channel 24, and the third sub-channel 26 and discharges it to the heat dissipation channel 400. The extension direction of the third sub-channel 26 is set at an angle to the width direction of the first carrier 20. The first channel d, including the first sub-channel 23, the second sub-channel 24, the third sub-channel 26, and the confluence channel 25, is approximately in the shape of a transverse arrow.

[0257] Please see Figure 28 and Figure 30 , Figure 30 for Figure 25 The diagram shows a cross-sectional view of the heat dissipation device along DD.

[0258] In this embodiment, as Figure 30 As shown, the third chamber c has a third outlet c2 and a third inlet c1. The third outlet c2 and the third inlet c1 are arranged opposite to each other along the length of the heat dissipation device 100. The third outlet c2 is opposite to and communicates with the fifth sub-port 261 of the third sub-channel 26 of the first carrier 20. Along the Z-axis, the third outlet c2 is located between the first outlet a2 and the second outlet b2.

[0259] In this embodiment, along the Y-axis direction, the first piezoelectric vibrator 10a, the second piezoelectric vibrator 10b, the first cover plate 30, the second cover plate 40, the first support member 50, the second support member 60, the first reinforcing rib 81, the second reinforcing rib 82, the third support member 90, and the fourth support member 91 all abut against the first side surface 21 of the first carrier 20. The first flow channel d of the first carrier 20 is connected to the first chamber a, the second chamber b, and the third chamber c, and together they constitute the heat-conducting air duct A of the heat dissipation device 100. Among them, the fifth sub-port 261 of the third sub-flow channel 26 of the first carrier 20 is connected to the third outlet c2 of the third chamber c. The cooperation relationship between the first sub-flow channel 23 and the first chamber a, and the cooperation relationship between the second sub-flow channel 24 and the second chamber b are described in the first embodiment above, and will not be repeated here. The confluence channel 25 of the first carrier 20 is located on one side of the second side surface 22 to form the air outlet 102 of the heat dissipation device 100. The first inlet a1 of the first chamber a, the second inlet b1 of the second chamber b, and the third inlet c1 of the third chamber c together constitute the air inlet 101 of the heat dissipation device 100.

[0260] In this embodiment, a varying voltage is applied to the first piezoelectric vibrator 10a and the second piezoelectric vibrator 10b. Under the influence of the inverse piezoelectric effect, the first piezoelectric vibrator 10a and the second piezoelectric vibrator 10b vibrate in opposite directions along the Z-axis, causing the volumes of the first chamber a, the second chamber b, and the third chamber c to change accordingly. This achieves a blower cooling effect to further dissipate heat from the heat source. For example, when the first piezoelectric vibrator 10a bends and deforms towards the first cover plate 30, and the second piezoelectric vibrator 10b bends and deforms towards the second cover plate 40, the volumes of the first chamber a and the third chamber c are compressed and exhaust air, while the volume of the second chamber b increases and draws in air; or, when the first piezoelectric vibrator 10a and the second piezoelectric vibrator 10b bend and deform relative to each other, the volumes of the first chamber a and the third chamber c increase and draw in air, while the second chamber b is vibrated and exhausts air. The specific air intake and exhaust of the heat dissipation device 100 can be found in the above embodiment and will not be repeated here.

[0261] In some embodiments, the heat dissipation device 100 may further include a second carrier 70 similar to that in the second embodiment, wherein the second flow channel 73 of the second sub-flow channel 24 structure is connected to the first inlet a1 of the first chamber a, the second inlet b1 of the second chamber b and the third inlet c1 of the third chamber c, and the second carrier 70 constitutes the air inlet 101 of the heat dissipation device 100.

[0262] In some embodiments, the piezoelectric elements of the piezoelectric vibrator 10 can be configured with a multi-layer structure according to the actual needs of the heat dissipation device 100, such as multiple piezoelectric elements stacked together, to increase the amplitude of the piezoelectric vibrator 10 and achieve high-power heat dissipation.

[0263] Please see Figure 31 , Figure 31 for Figure 2 The diagram shows a cross-sectional view of a ninth embodiment of the heat dissipation device in the illustrated electronic device. It should be noted that... Figure 31 The solid arrows in the diagram represent the direction of gas flow.

[0264] In this embodiment, as described above Figure 12 The second embodiment of the heat dissipation device 100 differs in structure from the second support body 70 in this embodiment. The second flow channel 73 of the second support body 70 includes a first sub-channel 733 and a second sub-channel 734. The first sub-channel 733 and the second sub-channel 734 are spaced apart along the thickness direction of the second support body 70. The first sub-channel 733 communicates with the first chamber a. The second sub-channel 734 communicates with the second chamber b.

[0265] A first sub-channel 733 penetrates the first side surface 71 and the second side surface 72, extending from the first side surface 71 towards the second side surface 72. The extension direction of the first sub-channel 733 is the same as the width direction of the second support body 70. The first sub-channel 733 is used for the passage of gas discharged or drawn into the first chamber a. The first sub-channel 733 has a third opening 733a and a fourth opening 733b. The third opening 733a is located on the first side surface 71 and communicates with the heat dissipation channel 400. The fourth opening 733b is located on the second side surface 72 and connects to and communicates with the first inlet a1 of the first chamber a. The cross-sectional area of ​​the first sub-channel 733 changes periodically from the third opening 733a to the fourth opening 733b.

[0266] The first sub-channel 733 includes a first wall 735 and a third wall 736, which together form part of the third opening 733a and the fourth opening 733b. A plurality of first flow-blocking protrusions m protrude from the wall surface of the first wall 735 facing the first sub-channel 733. The length direction of the plurality of first flow-blocking protrusions m is the same as the length direction of the second support body 70, and they are spaced apart from each other along the width direction of the second support body 70. A plurality of second flow-blocking protrusions n protrude from the wall surface of the third wall 736 facing the first sub-channel 733. The length direction of the plurality of second flow-blocking protrusions n is the same as the length direction of the second support body 70, and they are spaced apart from each other along the width direction of the second support body 70. Along the width direction of the second support body 70, the projections of the first flow-blocking protrusions m and the second flow-blocking protrusions n in the thickness direction of the second support body 70 are alternately spaced. In this embodiment, the first flow-blocking protrusions m and the second flow-blocking protrusions n are elongated protrusions with a triangular cross-section.

[0267] The first flow-blocking protrusion m includes a first guiding surface m1 and a first flow-blocking surface m2. The first guiding surface m1 faces the third opening 733a of the first sub-channel 733, and the first guiding surface m1 is set at an angle to the wall surface of the first wall 735 and the first flow-blocking surface m2. The first flow-blocking surface m2 faces the fourth opening 733b of the first sub-channel 733, and the first flow-blocking surface m2 is perpendicular to the wall surface of the first wall 735. Among them, the first guiding surface m1 of the first flow-blocking protrusion m closest to the third opening 733a is connected at an angle to the first side surface 71 of the second support body 70. It can be understood that the cross-section of the first flow-blocking protrusion m is a right-angled triangle.

[0268] The second flow-blocking protrusion n includes a second guide surface n1 and a second flow-blocking surface n2. The second guide surface n1 faces the third opening 733a of the first sub-channel 733, and the second guide surface n1 is set at an angle to the wall surface of the first wall 735 and the second flow-blocking surface n2. The second flow-blocking surface n2 faces the fourth opening 733b of the first sub-channel 733, and the second flow-blocking surface n2 is perpendicular to the wall surface of the third wall 736. Among them, the second flow-blocking surface n2 of the second flow-blocking protrusion n closest to the fourth opening 733b has the same orientation as the second side surface 72 of the second support body 70.

[0269] The second sub-channel 734 extends through the first side 71 and the second side 72. The extension direction of the first sub-channel 733 is the same as the width direction of the second support body 70. The second sub-channel 734 is used for the passage of gas discharged or drawn into the second chamber b. The second sub-channel 734 has a fifth opening 734a and a sixth opening 734b. The fifth opening 734a is located on the first side 71, and the sixth opening 734b is located on the second side 72, and is connected to and communicates with the second inlet b1 of the second chamber b. The cross-sectional area of ​​the second sub-channel 734 changes periodically from the fifth opening 734a to the sixth opening 734b.

[0270] The second sub-channel 734 includes a second wall 737 and a fourth wall 738, which together form part of the fifth opening 734a and the sixth opening 734b. A plurality of third flow-blocking protrusions o protrude from the wall surface of the second wall 737 facing the second sub-channel 734. The length direction of the plurality of third flow-blocking protrusions o is the same as the length direction of the second support body 70, and they are spaced apart from each other along the width direction of the second support body 70. A plurality of fourth flow-blocking protrusions p protrude from the wall surface of the fourth wall 738 facing the second sub-channel 734. The length direction of the plurality of fourth flow-blocking protrusions p is the same as the length direction of the second support body 70, and they are spaced apart from each other along the width direction of the second support body 70. Along the width direction of the second support body 70, the projections of the third flow-blocking protrusions o and the fourth flow-blocking protrusions p in the thickness direction of the second support body 70 are alternately spaced. In this embodiment, the third flow-blocking protrusions o and the fourth flow-blocking protrusions p are elongated protrusions with a triangular cross-section.

[0271] The third flow-blocking protrusion o includes a third guide surface o1 and a third flow-blocking surface o2. The third guide surface o1 faces the fifth opening 734a of the second sub-channel 734, and the third guide surface o1 is set at an angle to the wall surface of the second wall 737 and the third flow-blocking surface o2. The third flow-blocking surface o2 faces the sixth opening 734b of the second sub-channel 734, and the third flow-blocking surface o2 is perpendicular to the wall surface of the second wall 737. Among them, the third guide surface o1 of the third flow-blocking protrusion o closest to the fifth opening 734a is connected at an angle to the first side surface 71 of the second support body 70.

[0272] The fourth flow-blocking protrusion p includes a fourth guide surface p1 and a fourth flow-blocking surface p2. The fourth guide surface p1 faces the fifth opening 734a of the second sub-channel 734, and is set at an angle to the wall surface of the second wall 737 and the third flow-blocking surface p2. The fourth flow-blocking surface p2 faces the sixth opening 734b of the second sub-channel 734, and is perpendicular to the wall surface of the fourth wall 738. Among them, the fourth flow-blocking surface p2 of the fourth flow-blocking protrusion p closest to the sixth opening 734b has the same orientation as the second side surface 72 of the second support body 70.

[0273] In this embodiment, the guiding surfaces of the first flow-blocking protrusion m, the second flow-blocking protrusion n, the third flow-blocking protrusion o, and the fourth flow-blocking protrusion p are all inclined toward the first chamber a and the second chamber b, so that the external airflow can enter the first sub-channel 733 and the second sub-channel 734 through the third opening 733a and the fifth opening 734a respectively, and flow smoothly in the first sub-channel 733 and the second sub-channel 734.

[0274] When the heat dissipation device 100 changes from the original state to the first state, the volume of the first chamber a is reduced by the piezoelectric vibrator 10, and gas is discharged in two directions: the first inlet a1 and the first outlet a2.

[0275] The gas discharged through the first inlet a1 is blocked by the first flow-blocking protrusion m and the second flow-blocking protrusion n. That is, the first airflow 1 will impact the first flow-blocking surface m2 of the first flow-blocking protrusion m and the second flow-blocking surface n2 of the second flow-blocking protrusion n. The first flow-blocking surface m2 and the second flow-blocking surface n2 face the first inlet a1, increasing the flow resistance of the first airflow 1 from the first chamber a to the first sub-channel 733. This causes most of the first airflow 1 to be bounced back into the first chamber a by the first flow-blocking surface m2 and the second flow-blocking surface n2, while a small portion of the first airflow 1 will pass through the gap between the first flow-blocking protrusion m and the second flow-blocking protrusion n and be discharged through the third opening 733a. This increases the flow rate of the airflow discharged from the air outlet 102 of the heat dissipation device 100, thereby improving the heat dissipation effect. The gas discharged through the first outlet a2 is specifically described in the first embodiment above. Figure 31 For ease of illustration, only solid arrows are used to indicate the direction of the blocked portion of the first airflow 1.

[0276] Simultaneously, the volume of the second chamber b gradually increases, generating suction and drawing gas in from both the second sub-channel 734 and the second outlet b2. The gas drawn in through the second sub-channel 734 flows from the fifth opening 734a to the sixth opening 734b, forming the fifth gas flow 5. The gas drawn in through the second outlet b2 is specifically described in the first embodiment above.

[0277] The third flow-blocking protrusion o and the fourth flow-blocking protrusion p are inclined toward the sixth opening 734b of the second sub-channel 734. The third guide surface o1 of the third flow-blocking protrusion o and the fourth guide surface p1 of the fourth flow-blocking protrusion p are inclined toward the second chamber b, reducing the flow resistance of the fifth airflow 5 to the second chamber b. This allows part of the fifth airflow 5 to flow into the second chamber b not only from the gap between the third guide surface o1 and the fourth wall 738, and the gap between the fourth guide surface p1 and the second wall 737, but also another part of the fifth airflow 5 to impact the third guide surface o1 and the fourth guide surface p1 and enter the second chamber b along the third guide surface o1 and the fourth guide surface p1. All the fifth airflow 5 entering the second chamber b forms the third airflow 3 (e.g., Figure 8b As shown in the figure, for ease of description, the gas drawn into the second chamber b from the air inlet 101 is divided into the third airflow 3 and the fifth airflow 5.

[0278] In this embodiment, when the heat dissipation device 100 changes from the first state to the second state, the volume of the second chamber b is reduced by the piezoelectric vibrator 10, and gas is discharged in two directions: the second inlet b1 and the second outlet b2.

[0279] The gas discharged through the second inlet b1 is blocked by the third flow-blocking protrusion o and the fourth flow-blocking protrusion p. That is, the third airflow 3 will impact the third flow-blocking surface o2 of the third flow-blocking protrusion o and the fourth flow-blocking surface p2 of the fourth flow-blocking protrusion p. The third flow-blocking surface o2 and the fourth flow-blocking surface p2 face the second inlet b1, increasing the flow resistance of the third airflow 3 from the second chamber b to the second sub-channel 734. This causes most of the third airflow 3 to be bounced back into the second chamber b by the third flow-blocking surface o2 and the fourth flow-blocking surface p2, while a small portion of the third airflow 3 will pass through the gap between the third flow-blocking protrusion o and the fourth flow-blocking protrusion p and be discharged through the fifth opening 734a. This increases the flow rate of the airflow discharged from the outlet 102 of the heat dissipation device 100, thereby improving the heat dissipation effect. The gas discharged through the second outlet b2 is specifically described in the first embodiment above.

[0280] Simultaneously, the volume of the first chamber a gradually increases, generating suction and drawing in gas from both the first sub-channel 733 and the first outlet a2. The gas drawn in through the first sub-channel 733 flows from the third opening 733a to the fourth opening 733b, forming a sixth gas flow (not shown in the figure). For details regarding the gas drawn in through the second outlet b2, please refer to the description of the first embodiment above.

[0281] The first flow-blocking protrusion m and the second flow-blocking protrusion n are inclined toward the fourth opening 733b of the first sub-channel 733. The inclined arrangement of the first guide surface m1 of the first flow-blocking protrusion m and the second guide surface n1 of the second flow-blocking protrusion n, with the first guide surface m1 and the second guide surface n1 facing the first chamber a, reduces the flow resistance of the sixth airflow to the first chamber a. This allows part of the sixth airflow to flow into the first chamber a not only from the gap between the first guide surface m1 and the third wall 736 and the gap between the second guide surface n1 and the first wall 735, but also another part of the sixth airflow to impact the first guide surface m1 and the second guide surface n1 and enter the first chamber a along the first guide surface m1 and the second guide surface n1. All the sixth airflow entering the first chamber a forms the first airflow 1. Here, for ease of description, the gas drawn into the first chamber a from the air inlet 101 is divided into the first airflow 1 and the sixth airflow for distinction.

[0282] It is understood that the flow resistance of the first chamber a in drawing gas from the outside of the heat-conducting duct A is less than the flow resistance of the gas discharging from the outside of the heat-conducting duct A. This facilitates the first sub-channel 733 drawing gas in through the third opening 733a, filling the first sub-channel 733, and then flowing into the first chamber a through the fourth opening 733b. It also inhibits the discharge of gas from the first chamber a through the first sub-channel 733, reducing the discharge gas flow rate from the first inlet a1 of the first chamber a. Simultaneously, the flow resistance of the second chamber b in drawing gas from the outside of the heat-conducting duct A is less than the flow resistance of the gas discharging from the outside of the heat-conducting duct A. This facilitates the second sub-channel 734 in drawing gas from the outside of the heat-conducting duct A through the fifth opening 734a, filling the second sub-channel 734, and then flowing into the second chamber b through the sixth opening 734b. It also inhibits the discharge of gas from the second chamber b through the second sub-channel 734.

[0283] The third opening 733a of the first sub-channel 733 and the fifth opening 734a of the second sub-channel 734 constitute the air inlet 101 of the heat-conducting air duct A. Regardless of whether the first chamber a or the second chamber b is drawing in or venting air, the wall shapes of the first sub-channel 733 and the second sub-channel 734 facilitate the intake of the heat-conducting air duct A through the second flow channel 73 from the air inlet 101 and suppress the exhaust of the heat-conducting air duct A into the second flow channel 73, so that more gas is discharged from the air outlet 102 from the heat-conducting air duct A, thereby improving the heat dissipation efficiency of the heat dissipation device 100.

[0284] In one embodiment, the second carrier 70 further includes a first plate, a second plate, and a third plate. The second plate is sandwiched between the first plate and the third plate. The first plate and the second plate form a first sub-channel 733, and the two opposing surfaces of the first plate and the second plate respectively form the walls of the first wall 735 and the third wall 736 of the first sub-channel 733. The third plate and the second plate form a second sub-channel 734, and the two opposing surfaces of the third plate and the second plate respectively form the walls of the second wall 737 and the fourth wall 738 of the second sub-channel 734. It can be understood that the first sub-channel 733 and the second sub-channel 734 are separated by the second plate. A first flow-blocking protrusion m protrudes from the surface of the first plate, a second flow-blocking protrusion n and a third flow-blocking protrusion o protrude from the two surfaces of the second plate in the thickness direction, and a fourth flow-blocking protrusion p protrudes from the surface of the third plate. The first plate, the second plate, and the third plate can be formed separately, and the second plate, the first plate, and the third plate can be fixed together by means not limited to adhesive. Of course, the first plate, the second plate, and the third plate can also be formed integrally.

[0285] Please see Figure 32a and Figure 33 , Figure 32a for Figure 2 The diagram shows a cross-sectional structure of the tenth embodiment of the heat dissipation device in the electronic device. Figure 33 for Figure 32a A schematic diagram of the cross-sectional structure of the second support body of the heat dissipation device shown.

[0286] In this embodiment, the structure of the second support body 70 differs from that of the heat dissipation device 100 in the ninth embodiment described above. The walls of the first sub-channel 733 and the second sub-channel 734 of the second support body 70 are planar, and the second support body 70 further includes a first fin 74 and a second fin 75. The first fin 74 is located within the first sub-channel 733, and a portion of the first fin 74 is connected to the first wall 735 of the first sub-channel 733. Another portion of the first fin 74 can be raised relative to the first wall 735 and can move relative to the first wall 735 and the third wall 736. The second fin 75 is located within the second sub-channel 734, and a portion of the second fin 75 is connected to the second wall 737 of the second sub-channel 734. Another portion of the second fin 75 can be raised relative to the second wall 737 and can move relative to the second wall 737 and the fourth wall 738. The first fin 74 and the second fin 75 are raised in opposite directions.

[0287] In this embodiment, the first fin 74 includes a first connecting portion 741 and a first movable portion 742. The first connecting portion 741 and the first movable portion 742 are connected at an angle, and the first movable portion 742 can swing relative to the first connecting portion 741. The first movable portion 742 includes a first free end 743 and a first connecting end 744, which are opposite ends in the length direction of the first movable portion 742. The first connecting end 744 is connected to the first connecting portion 741. In this embodiment, the first fin 74 is an elastic diaphragm, or the first movable portion 742 can also be an elastic diaphragm.

[0288] The first connecting portion 741 is located closer to the third opening 733a of the first sub-channel 733 than the first movable portion 742. The first connecting portion 741 is connected to the wall surface of the first wall 735 of the first sub-channel 733. The extending direction of the first connecting portion 741 is the same as the width direction of the first sub-channel 733.

[0289] The first movable part 742 is spaced apart from both the first wall 735 and the third wall 736, and is arranged at an angle to both the first movable part 742 and the first wall 735 and the third wall 736. The first movable part 742 is inclined toward the third wall 736 of the first sub-channel 733. The first free end 743 is located at the fourth opening 733b and is close to the first inlet a1. Along the direction from the first connecting end 744 to the first free end 743, the distance from the first movable part 742 to the third wall 736 gradually decreases.

[0290] In this embodiment, the thickness of the first connecting portion 741 can be greater than the thickness of the first movable portion 742, and the first movable portion 742 is spaced apart from the first wall 735. When the first movable portion 742 swings relative to the first connecting portion 741, interference between the first wall 735 of the first sub-channel 733 and the first movable portion 742 is avoided, thus preventing the swing of the first movable portion 742 from being affected. At the same time, the thickness of the first movable portion 742 is less than the thickness of the first connecting portion 741, reducing the impact of the first movable portion 742 on the area of ​​the first sub-channel 733 and increasing the angle at which the first movable portion 742 can swing relative to the first connecting portion 741 towards the first wall 735, thus ensuring the airflow rate from the first sub-channel 733 into the first chamber a.

[0291] It should be noted that when the heat dissipation device 100 is in its natural, unventilated state, that is, when the heat dissipation device 100 is in its original state, the first connecting part 741 and the first movable part 742 are set at an angle. During the heat dissipation process of the heat dissipation device 100, the first movable part 742 will oscillate back and forth relative to the first connecting part 741.

[0292] In this embodiment, the second fin 75 includes a second connecting portion 751 and a second movable portion 752. The second connecting portion 751 and the second movable portion 752 are connected at an angle, and the second movable portion 752 can swing relative to the second connecting portion 751. The second movable portion 752 includes a second free end 753 and a second connecting end 754, which are respectively the two opposite ends of the first movable portion 742 along its length. The second connecting end 754 and the second free end 753 are connected. The second fin 75 is an elastic diaphragm, or the first movable portion 742 is an elastic diaphragm.

[0293] The second connecting portion 751 is located closer to the fifth opening 734a of the second sub-channel 734 than the second movable portion 752. The second connecting portion 751 is connected to the wall surface of the second wall 737 of the second sub-channel 734. The extending direction of the second connecting portion 751 is the same as the width direction of the second sub-channel 734.

[0294] The second movable part 752 is spaced apart from both the second wall 737 and the fourth wall 738, and is arranged at an angle to both the second movable part 752 and the second wall 737 and the fourth wall 738. The second movable part 752 is inclined toward the fourth wall 738 of the second sub-channel 734. The second free end 753 is located at the sixth opening 734b. Along the direction from the second connecting end 754 to the second free end 753, the distance from the second movable part 752 to the fourth wall 738 gradually decreases.

[0295] In this embodiment, the thickness of the second connecting portion 751 is greater than the thickness of the second movable portion 752, and the second movable portion 752 is spaced apart from the second wall 737. When the second movable portion 752 swings relative to the second connecting portion 751, interference between the second wall 737 of the second sub-channel 734 and the second movable portion 752 is avoided, thus preventing the swing of the second movable portion 752 from being affected. At the same time, the thickness of the second movable portion 752 is less than the thickness of the second connecting portion 751, reducing the impact of the second movable portion 752 on the area of ​​the second sub-channel 734 and increasing the angle at which the second movable portion 752 can swing relative to the second connecting portion 751 towards the second wall 737, thereby ensuring the airflow rate from the second sub-channel 734 into the second chamber b.

[0296] It should be noted that when the heat dissipation device 100 is in its natural, unventilated state, that is, when the heat dissipation device 100 is in its original state, the second connecting part 751 and the second movable part 752 are arranged at an angle. During the heat dissipation process of the heat dissipation device 100, the second movable part 752 will oscillate back and forth relative to the second connecting part 751.

[0297] Combination Figure 32a and Figure 33 As shown, the piezoelectric vibrator 10, the first carrier 20, the first cover plate 30, the second cover plate 40, the second carrier 70, two first support members 50, and two second support members 60 are assembled. Along the Y-axis, the first cover plate 30, the second cover plate 40, the first piezoelectric element 12, the vibrating substrate 11, the first support member 50, and the second support member 60 all abut against the second side surface 72 of the second carrier 70. The fourth opening 733b of the first sub-channel 733 is opposite to and communicates with the first inlet a1 of the first chamber a. The sixth opening 734b of the second sub-channel 734 is opposite to and communicates with the second inlet b1 of the second chamber b.

[0298] The heat dissipation process of the heat dissipation device 100 is described below. The vibration principle of the piezoelectric vibrator 10 can be found in the description of the first embodiment above, and will not be repeated here.

[0299] Please refer to the following: Figure 32a , Figure 33 and Figure 32b , Figure 32b for Figure 32a The diagram shows a cross-sectional view of the heat dissipation device in its first state. It should be noted that... Figure 32b The solid arrows in the diagram represent the direction of airflow.

[0300] The heat dissipation device 100 changes from its original state to its first state. The volume of the first chamber a is gradually compressed and reduced, and gas is discharged in two directions: the first inlet a1 and the first outlet a2. The first airflow 1 discharged through the first inlet a1 enters the first sub-channel 733 through the fourth opening 733b. The first airflow 1 blows towards the surface of the first movable part 742 and pushes the first movable part 742 to swing relative to the first connecting part 741, and causes the first free end 743 of the first movable part 742 to move closer to the third wall 736. The distance between the first free end 743 and the third wall 736 gradually decreases and can contact the third wall 736. The first sub-channel 733 is completely closed. The first movable part 742, in turn, acts on the first airflow 1, causing the first airflow 1 to bounce back into the first chamber a, thereby blocking the exhaust of the first chamber a through the first inlet a1. This causes almost all the gas discharged from the first chamber a to be discharged to the first outlet a2, thus increasing the airflow of the first outlet a2 and improving the heat dissipation effect. The process of the gas discharged through the first outlet a2 passing through the first carrier 20 can be referred to the description of the first embodiment above, and will not be repeated here.

[0301] At the same time, the volume of the second chamber b gradually increases, and the second chamber b will generate suction, drawing in gas from both the second inlet b1 and the second outlet b2. The fifth airflow 5 drawn in through the second inlet b1 and the second sub-channel 734 enters the second chamber a to form the third airflow 3 (e.g. Figure 8b As shown), the fifth airflow 5 pushes the second movable part 752 to swing relative to the second connecting part 751, and causes the second free end 753 of the second movable part 752 to gradually move away from the fourth wall 738. The distance between the second free end 753 and the fourth wall 738 gradually increases and can contact the fourth wall 738. The second sub-channel 734 is completely opened, which facilitates the second chamber b to draw air from the outside through the second inlet b1 and increases the internal airflow.

[0302] In this embodiment, during the process of the heat dissipation device 100 changing from the original state to the first state, the first fin 74 can close the first sub-channel 733 to block the first chamber a from exhausting out from the first inlet a1, so that almost all the gas in the first chamber a is exhausted out from the first outlet a2. The second fin 75 can open the second sub-channel 734 to allow the second chamber b to draw in air from the outside from the second inlet b1; thereby increasing the airflow from the air outlet 102 and improving the heat dissipation effect.

[0303] When the heat dissipation device 100 changes from the first state to the second state, the volume of the second chamber b is gradually compressed and reduced, and gas is discharged in two directions: the second inlet b1 and the second outlet b2. The third airflow 3 discharged through the second inlet b1 enters the second sub-channel 734 through the sixth opening 734b. The third airflow 3 blows towards the surface of the second movable part 752 and pushes the second movable part 752 to swing relative to the second connecting part 751, causing the second free end 753 of the second movable part 752 to move closer to the fourth wall 738. The distance between the second free end 753 and the fourth wall 738 gradually decreases and can contact the fourth wall 738. The second sub-channel 734 is completely closed. The second movable part 752, in turn, acts on the third airflow 3, causing the third airflow 3 to bounce back into the second chamber b, thereby blocking the second chamber b from exhausting through the second inlet b1. This causes almost all the gas discharged from the second chamber b to be discharged to the second outlet b2, thus increasing the airflow of the second outlet b2 and improving the heat dissipation effect. The process of the gas discharged through the second outlet b2 passing through the first carrier 20 can be referred to the description of the first embodiment above, and will not be repeated here.

[0304] At the same time, the volume of the first chamber a gradually increases, and the first chamber a generates suction, drawing in gas from both the first inlet a1 and the first outlet a2. The sixth airflow drawn in through the first inlet a1 and the first sub-channel 733 enters the first chamber a, forming the first airflow 1. The sixth airflow pushes the first movable part 742 to swing relative to the first connecting part 741, and causes the first free end 743 of the first movable part 742 to gradually move away from the third wall 736. The distance between the first free end 743 and the third wall 736 gradually increases and can contact the third wall 736. The first sub-channel 733 is completely opened, which facilitates the first chamber a to draw in air from the outside through the first inlet a1, increasing the internal airflow.

[0305] In this embodiment, during the transition of the heat dissipation device 100 from the first state to the second state, the first fin 74 can open the first sub-channel 733 to facilitate the first chamber a to draw air from the outside through the first inlet a1, and the second fin 75 can close the second sub-channel 734 to prevent the second chamber b from exhausting air from the second inlet b1, so that almost all the gas in the second chamber b can be exhausted from the second outlet b2; thereby, the airflow discharged from the air outlet 102 of the heat dissipation device 100 increases, improving the heat dissipation effect of the heat dissipation device 100.

[0306] In this embodiment, the third opening 733a of the first sub-channel 733 and the fifth opening 734a of the second sub-channel 734 of the second carrier 70 constitute the air inlet 101 of the heat dissipation device 100. The heat dissipation device 100 switches back and forth between a first state and a second state. When the first fin 74 of the second carrier 70 opens the first sub-channel 733, the second fin 75 closes the second sub-channel 734, or when the first fin 74 closes the first sub-channel 733, the second fin 75 opens the second sub-channel 734. The first fin 74 and the second fin 75 cooperate with each other to suppress the exhaust of the heat dissipation device 100 from the air inlet 101 without affecting the intake of air from the air inlet 101. This facilitates the directional intake of gas from the air inlet 101 and its exhaust from the air outlet 102, and greatly increases the exhaust volume of the heat dissipation device 100, thereby further improving the heat dissipation efficiency of the heat source.

[0307] Please see Figure 34a , Figure 34a for Figure 2 A cross-sectional structural schematic diagram of the eleventh embodiment of the heat dissipation device in the electronic device shown.

[0308] In this embodiment, as described above Figure 32a The difference between the heat dissipation device 100 in the tenth embodiment shown is that the structure of the first support 20 in this embodiment is the same as that of the second support 70 in the tenth embodiment. In this embodiment, the first flow channel d of the first support 20 includes a first sub-flow channel 23 and a second sub-flow channel 24. The first sub-flow channel 23 is directly connected to the first chamber a and the heat dissipation channel 400, and the second sub-flow channel 24 is directly connected to the second chamber b and the heat dissipation channel 400. The first support 20 includes a third fin 27 and a fourth fin 28. The third fin 27 is located in the first sub-flow channel 23, and a portion of the third fin 27 is connected to the first flow channel wall 233 of the first sub-flow channel 23. Another portion of the third fin 27 can be raised relative to the first flow channel wall 233 and can move relative to the first flow channel wall 233 and the second flow channel wall 234. The fourth fin 28 is located within the second sub-channel 24, and a portion of the fourth fin 28 is connected to the fourth channel wall 244 of the second sub-channel 24. Another portion of the fourth fin 28 can be tilted relative to the third channel wall 243 and can move relative to the third channel wall 243 and the fourth channel wall 244.

[0309] The first sub-channel 23 has a first opening 231 on the first side 71 of the first carrier 20, and a second opening 232 on the second side 72 of the first carrier 20. The extension direction of the first sub-channel 23 is the same as the width direction of the first carrier 20.

[0310] In this embodiment, the third fin 27 includes a third connecting portion 271 and a third movable portion 272. The third connecting portion 271 and the third movable portion 272 are connected at an angle, and the third movable portion 272 can swing relative to the third connecting portion 271. The third movable portion 272 includes a third free end 273 and a third connecting end 274, which are opposite ends in the length direction of the third movable portion 272. The third connecting end 274 is connected to the third connecting portion 271. In this embodiment, the third fin 27 is an elastic diaphragm, or the third movable portion 272 can also be an elastic diaphragm.

[0311] The third connecting portion 271 is closer to the first sub-port 231 of the first sub-channel 23 than the third movable portion 272. The third connecting portion 271 is connected to the wall surface of the first channel wall 233 of the first sub-channel 23. The extending direction of the third connecting portion 271 is the same as the width direction of the first sub-channel 23.

[0312] The third movable part 272 is spaced apart from both the first flow channel wall 233 and the second flow channel wall 234, and is arranged at an angle to both. The third movable part 272 is inclined toward the second flow channel wall 234 of the first sub-flow channel 23. The third free end 273 is located at the second sub-port 232 and is away from the first outlet a2. Along the direction from the third connecting end 274 to the third free end 273, the distance between the third movable part 272 and the second flow channel wall 234 gradually decreases.

[0313] In this embodiment, the thickness of the third connecting portion 271 can be greater than the thickness of the third movable portion 272, and the third movable portion 272 is spaced apart from the first flow channel wall 233. When the third movable portion 272 swings relative to the third connecting portion 271, interference between the first flow channel wall 233 of the first sub-flow channel 23 and the third movable portion 272 is avoided, thus preventing the swing of the third movable portion 272 from being affected. At the same time, the thickness of the third movable portion 272 is less than the thickness of the third connecting portion 271, reducing the impact of the third movable portion 272 on the area of ​​the first sub-flow channel 23 and increasing the angle at which the third movable portion 272 can swing relative to the third connecting portion 271 towards the first flow channel wall 233, thereby ensuring the airflow rate discharged from the first chamber a from the first sub-flow channel 23.

[0314] It should be noted that when the heat dissipation device 100 is in its natural, unventilated state, that is, when the heat dissipation device 100 is in its original state, the third connecting part 271 and the third movable part 272 are set at an angle. During the heat dissipation process of the heat dissipation device 100, the third movable part 272 will oscillate back and forth relative to the third connecting part 271.

[0315] The third sub-port 241 of the second sub-channel 24 is opened on the first side 71 of the first support body 20, and the fourth sub-port 242 is opened on the second side 72 of the first support body 20. The extension direction of the second sub-channel 24 is the same as the width direction of the first support body 20.

[0316] In this embodiment, the fourth fin 28 includes a fourth connecting portion 281 and a fourth movable portion 282. The fourth connecting portion 281 and the fourth movable portion 282 are connected at an angle, and the fourth movable portion 282 can swing relative to the fourth connecting portion 281. The fourth movable portion 282 includes a fourth free end 283 and a fourth connecting end 284, which are the opposite ends of the first movable portion 742 along its length. The fourth connecting end 284 and the fourth free end 283 are connected. In this embodiment, the fourth fin 28 is an elastic diaphragm, or the fourth movable portion 282 can also be an elastic diaphragm.

[0317] The fourth connecting portion 281 is closer to the third sub-port 241 of the second sub-channel 24 than the fourth movable portion 282. The fourth connecting portion 281 is connected to the wall surface of the fourth channel wall 244 of the second sub-channel 24. The extending direction of the fourth connecting portion 281 is the same as the width direction of the second sub-channel 24.

[0318] The fourth movable part 282 is spaced apart from both the fourth flow channel wall 244 and the third flow channel wall 243, and is arranged at an angle to both. The fourth movable part 282 is inclined toward the third flow channel wall 243 of the second sub-flow channel 24. The fourth free end 283 is located at the fourth sub-port 242. Along the direction from the fourth connecting end 284 to the fourth free end 283, the distance between the fourth movable part 282 and the third flow channel wall 243 gradually decreases.

[0319] In this embodiment, the thickness of the fourth connecting portion 281 can be greater than the thickness of the fourth movable portion 282, and the fourth movable portion 282 is spaced apart from the fourth flow channel wall 244. When the fourth movable portion 282 swings relative to the fourth connecting portion 281, interference between the fourth flow channel wall 244 of the second sub-flow channel 24 and the fourth movable portion 282 is avoided, thus preventing the swing of the fourth movable portion 282 from being affected. At the same time, the thickness of the fourth movable portion 282 is less than the thickness of the fourth connecting portion 281, reducing the impact of the fourth movable portion 282 on the area of ​​the second sub-flow channel 24 and increasing the angle at which the fourth movable portion 282 can swing relative to the fourth connecting portion 281 towards the fourth flow channel wall 244, thereby ensuring the airflow rate from the second sub-flow channel 24 into the second chamber b.

[0320] It should be noted that when the heat dissipation device 100 is in its natural, unventilated state, that is, when the heat dissipation device 100 is in its original state, the fourth fin 28 is set at an angle to the fourth connecting part 281 and the fourth movable part 282. During the heat dissipation process of the heat dissipation device 100, the fourth movable part 282 will oscillate back and forth relative to the fourth connecting part 281.

[0321] like Figure 34a As shown, the piezoelectric vibrator 10, the first carrier 20, the first cover plate 30, the second cover plate 40, the second carrier 70, two first support members 50, and two second support members 60 are assembled. The first sub-port 231 of the first sub-channel 23 is opposite to and connected to the first outlet a2 of the first chamber a, and the second sub-port 232 of the second sub-channel 24 is opposite to and connected to the second outlet b2 of the second chamber b. Along the thickness direction of the first carrier 20, the second sub-port 232 of the first sub-channel 23 and the fourth sub-port 242 of the second sub-channel 24 are spaced apart, and the second sub-port 232 and the fourth sub-port 242 together constitute the air outlet 102 of the heat dissipation device 100.

[0322] The heat dissipation process of the heat dissipation device 100 is described below. The vibration principle of the piezoelectric vibrator 10 can be found in the description of the first embodiment above, and will not be repeated here.

[0323] Please combine Figure 34a and Figure 34b , Figure 34b for Figure 34a The diagram shows a cross-sectional view of the heat dissipation device in its first state. It should be noted that... Figure 34b The solid arrows in the diagram indicate the direction of gas flow.

[0324] The heat dissipation device 100 transitions from its original state to its first state. The volume of the first chamber a is compressed and reduced, and gas is discharged in two directions: the first inlet a1 and the first outlet a2. The first airflow 1 discharged through the first inlet a1 is blocked by the first fin 74 of the second carrier 70, as described in the eleventh embodiment above. The second airflow 2 discharged through the first outlet a2 enters the first sub-channel 23. The second airflow 2 blows onto the surface of the third movable part 272 of the third fin 27 and pushes the third movable part 272 of the third fin 27 to swing relative to the third connecting part 271, causing the third free end 273 of the third movable part 272 to approach and contact the first channel wall 233. The first sub-channel 23 is fully opened, allowing almost all the gas in the first chamber a to be discharged from the first outlet a2, thus increasing the airflow at the first outlet a2 and improving the heat dissipation effect. For easy distinction, the second airflow 2 enters through the first sub-port 231 of the first sub-channel 23, forming the eighth airflow 8.

[0325] Simultaneously, the volume of the second chamber b gradually increases, generating suction and drawing in gas from both the second inlet b1 and the second sub-channel 24. The fifth gas flow 5 drawn in through the second inlet b1 is specifically described in the eleventh embodiment above. Gas flowing through the second sub-channel 24 from the fourth sub-port 242 to the third sub-port 241 forms a seventh airflow 7. This seventh airflow 7 blows towards the surface of the fourth movable part 282 and pushes the fourth movable part 282 of the fourth fin 28 to swing relative to the fourth connecting part 281. This causes the fourth free end 283 of the fourth movable part 282 to gradually approach the third channel wall 243, reducing the distance between the fourth free end 283 and the third channel wall 243 until it contacts the third channel wall 243. The second sub-channel 24 is then completely closed. Conversely, the fourth movable part 282 acts on the seventh airflow 7, causing it to rebound back into the heat dissipation channel 400, thus blocking the second chamber b from drawing in gas through the second sub-channel 24. This results in the second chamber b receiving almost entirely gas drawn in from the second inlet b1, causing the heat dissipation device 100 to draw in gas directionally from the air inlet 101. For ease of description, the airflow discharged or drawn in from the second sub-channel 24 through the second chamber b is considered the seventh airflow 7.

[0326] In this embodiment, during the transition of the heat dissipation device 100 from its original state to its first state, the third fin 27 can open the first sub-channel 23 to facilitate the exhaust of the first chamber a from the first outlet a2, thereby improving the heat dissipation efficiency of the heat dissipation device 100. Simultaneously, the fourth fin 28 can close the second sub-channel 24 to prevent the second chamber b from drawing in air from the outside through the second outlet b2, ensuring that the gas drawn into the second chamber b is almost entirely composed of the gas drawn in from the second inlet b1.

[0327] When the heat dissipation device 100 transitions from the first state to the second state, the volume of the second chamber b is gradually compressed and reduced, and gas is discharged in both directions: the second inlet b1 and the second outlet b2. The third airflow 3 discharged through the second inlet b1 can be specifically described in the eleventh embodiment above. The fourth airflow 4 discharged through the second outlet b2 enters the second sub-channel 24. The fourth airflow 4 blows towards the fourth movable part 282 of the fourth fin 28, pushing the fourth movable part 282 of the fourth fin 28 to swing relative to the fourth connecting part 281, causing the fourth free end 283 of the fourth movable part 282 to approach and contact the fourth channel wall 244. The second sub-channel 24 is fully opened, allowing almost all the gas in the second chamber b to be discharged outwards through the second outlet b2, thus increasing the airflow at the second outlet b2 and improving the heat dissipation effect.

[0328] At the same time, the volume of the first chamber a gradually increases, the first chamber a generates suction, and draws in gas from the first inlet a1 and the first sub-channel 23 respectively. The sixth gas flow drawn in through the first inlet a1 can be specifically referred to in the description of the eleventh embodiment above. Gas flowing through the first sub-channel 23 from the second sub-port 232 to the first sub-port 231 forms an eighth airflow 8. The eighth airflow 8 blows onto the surface of the third movable part 272 of the third fin 27 and can push the third movable part 272 of the third fin 27 to swing relative to the third connecting part 271, so that the third free end 273 of the third movable part 272 gradually approaches the second channel wall 234. The distance between the third free end 273 and the second channel wall 234 gradually decreases and can contact the second channel wall 234. The first sub-channel 23 is completely closed. The third movable part 272, in turn, acts on the eighth airflow 8, causing the eighth airflow 8 to rebound back into the heat dissipation channel 400 to block the first chamber a from drawing in gas through the first sub-channel 23. This results in the gas drawn into the first chamber a being almost entirely composed of the gas drawn in by the first inlet a1, causing the heat dissipation device 100 to draw in gas directionally from the air inlet 101.

[0329] In this embodiment, during the transition of the heat dissipation device 100 from the first state to the second state, the third fin 27 can close the first sub-flow channel 23 to prevent the first chamber a from drawing in air from the outside through the first outlet a2, so that the gas drawn into the first chamber a is almost entirely composed of the gas drawn in through the first outlet a2. At the same time, the fourth fin 28 can close the second sub-flow channel 24 to facilitate the exhaust of the second chamber b from the second outlet b2; thereby enabling the heat dissipation device 100 to directionally draw in air from the air inlet 101 and exhaust air from the air outlet 102, improving the heat dissipation efficiency of the heat dissipation device 100.

[0330] In this embodiment, the heat dissipation device 100 switches back and forth between a first state and a second state. The first fin 74 of the second carrier 70 opens the first sub-channel 733, and the second fin 75 closes the second sub-channel 734. The third fin 27 of the first carrier 20 closes the first sub-channel 23, and the fourth fin 28 opens the second sub-channel 24. Alternatively, the first fin 74 closes the first sub-channel 733, the second fin 75 opens the second sub-channel 734, the third fin 27 of the first carrier 20 opens the first sub-channel 23, and the fourth fin 28 closes the second sub-channel 24. The cooperation of the first fin 74, the second fin 75, the third fin 27, and the fourth fin 28 can suppress the exhaust of the heat dissipation device 100 from the air inlet 101 without affecting the intake of air from the air inlet 101. At the same time, it suppresses the intake of air from the air outlet 102 without affecting the exhaust of air from the air outlet 102. This facilitates the directional intake of gas from the air inlet 101 and the exhaust of gas from the air outlet 102, and greatly increases the exhaust volume of the heat dissipation device 100, thereby further improving the heat dissipation efficiency of the heat source.

[0331] Please refer to the following: Figure 35 , Figure 35 for Figure 2 A cross-sectional structural schematic diagram of the twelfth embodiment of the heat dissipation device in the illustrated electronic device.

[0332] In this embodiment, as described above Figure 31 The structure of the second support body 70 in the ninth embodiment differs in that, in this embodiment, the first flow-blocking protrusion m and the second flow-blocking protrusion n are connected one-to-one, and the third flow-blocking protrusion o and the fourth flow-blocking protrusion p are connected one-to-one. Along the thickness direction of the second support body 70, the projection of the first flow-blocking protrusion m completely coincides with the projection of the second flow-blocking protrusion n. The projection of the third flow-blocking protrusion o completely coincides with the projection of the fourth flow-blocking protrusion p.

[0333] Please see Figure 36a and Figure 36b , Figure 36a for Figure 35 The diagram shows the exploded structure of the second carrier. Figure 36b for Figure 36a The diagram shows the exploded structure of the second carrier from another angle.

[0334] For ease of description, the first sub-channel 733 and the second sub-channel 734 of the second carrier 70 are separated into the following: Figure 36a and Figure 36b The structure shown is shown below. In reality, the second load-bearing body 70 can be a one-piece molded structure or a split structure assembled from multiple plates. Here, we will describe it as a one-piece structure.

[0335] In this embodiment, the first flow-blocking protrusion m, the second flow-blocking protrusion n, the third flow-blocking protrusion o, and the fourth flow-blocking protrusion p are all triangular prism protrusions.

[0336] like Figure 36bMultiple first flow-blocking protrusions m are evenly arranged in an array on the first wall 735. In the width direction of the second support body 70, every two adjacent rows of first flow-blocking protrusions m are staggered. A first gap m4 exists between two adjacent first flow-blocking protrusions m to allow gas to pass through. The first guiding surface of each first flow-blocking protrusion m includes a first sub-inclined surface m11 and a second sub-inclined surface m12. The first sub-inclined surface m11 and the second sub-inclined surface m12 are connected at an included angle. The included angles between the first sub-inclined surface m11 and the second sub-inclined surface m12 and the first flow-blocking surface m2 are equal. The first sub-inclined surface m11, the second sub-inclined surface m12, and the first flow-blocking surface m2 form an isosceles triangle, with the first sub-inclined surface m11 and the second sub-inclined surface m12 being the two sides of the isosceles triangle. The first sub-inclined surface m11, the second sub-inclined surface m12, and the first flow-blocking surface m2 are all perpendicular to the wall surface of the first wall 735. The first sub-sloping surface m11 and the second sub-sloping surface m12 both face the third opening 733a of the first sub-channel 733, and both are angled relative to the length direction of the first sub-channel 733 (inclined relative to the third opening 733a). The first flow-blocking surface m2 faces the fourth opening 733b of the first sub-channel 733, and is perpendicular to the length direction of the first sub-channel 733. The first flow-blocking protrusion m also includes a first abutting surface m3. The first abutting surface m3 connects the first sub-sloping surface m11, the second sub-sloping surface m12, and the first flow-blocking surface m2, and faces away from the first wall 735. Along the direction from the third opening 733a to the fourth opening 733b, the connection point of the first sub-sloping surface m11 and the second sub-sloping surface m12 in the second row is opposite to the first gap m4 in the first row, and so on for the other rows. Along the length direction of the first sub-channel 733, multiple first gaps m4 are connected and form a first ventilation gap. The first ventilation gap is inclined relative to the extension direction of the first sub-channel 733, which can also be understood as extending inclined relative to the length or width direction of the second carrier 70.

[0337] like Figure 36aAs shown, multiple second flow-blocking protrusions n are evenly arranged in an array on the third wall 736. In the width direction of the second support body 70, every two adjacent rows of second flow-blocking protrusions n are staggered. A second gap n4 exists between two adjacent second flow-blocking protrusions n to allow gas to pass through. The second guiding surface of the second flow-blocking protrusion n includes a third sub-inclined surface n11 and a fourth sub-inclined surface n12. The third sub-inclined surface n11 and the fourth sub-inclined surface n12 are connected at an included angle. The included angles between the third sub-inclined surface n11 and the fourth sub-inclined surface n12 and the second flow-blocking surface n2 are equal. The third sub-inclined surface n11, the fourth sub-inclined surface n12, and the second flow-blocking surface n2 form an isosceles triangle, with the third sub-inclined surface n11 and the fourth sub-inclined surface n12 being the two sides of the isosceles triangle. The third sub-inclined surface n11, the fourth sub-inclined surface n12, and the second flow-blocking surface n2 are all perpendicular to the wall surface of the third wall 736. The third sub-sloping surface n11 and the fourth sub-sloping surface n12 both face the third opening 733a of the first sub-channel 733, and both are angled relative to the length direction of the first sub-channel 733 (inclined relative to the third opening 733a). The second flow-blocking surface n2 faces the fourth opening 733b of the first sub-channel 733, and is perpendicular to the length direction of the first sub-channel 733. The second flow-blocking protrusion n also includes a second abutment surface n3. The second abutment surface n3 connects the third sub-sloping surface n11, the fourth sub-sloping surface n12, and the second flow-blocking surface n2, and faces away from the third wall 736. Along the direction from the third opening 733a to the fourth opening 733b, the connection point of the third sub-sloping surface n11 and the fourth sub-sloping surface n12 in the second row is opposite to the second gap n4 in the first row, and so on for other rows. Along the length direction of the first sub-channel 733, multiple second gaps n4 are connected and form a second ventilation gap. The second ventilation gap is inclined relative to the extension direction of the first sub-channel 733, which can also be understood as extending inclined relative to the length or width direction of the second support body 70.

[0338] like Figure 36aAs shown, multiple third flow-blocking protrusions o are evenly arranged in an array on the second wall 737. In the width direction of the second support body 70, each pair of adjacent rows of third flow-blocking protrusions o are staggered. A third gap o4 exists between two adjacent third flow-blocking protrusions o to allow gas to pass through. The third guiding surface of the third flow-blocking protrusion o includes a fifth sub-inclined surface o11 and a sixth sub-inclined surface o12. The fifth sub-inclined surface o11 and the sixth sub-inclined surface o12 are connected at an included angle. The included angles between the fifth sub-inclined surface o11 and the sixth sub-inclined surface o12 and the third flow-blocking surface o2 are equal. The fifth sub-inclined surface o11, the sixth sub-inclined surface o12, and the third flow-blocking surface o2 form an isosceles triangle, with the fifth sub-inclined surface o11 and the sixth sub-inclined surface o12 being the two sides of the isosceles triangle. The fifth sub-inclined surface o11, the sixth sub-inclined surface o12, and the third flow-blocking surface o2 are all perpendicular to the wall surface of the second wall 737. The fifth sub-sloping surface o11 and the sixth sub-sloping surface o12 both face the fifth opening 734a of the second sub-channel 734, and both are angled relative to the length direction of the second sub-channel 734 (inclined relative to the fifth opening 734a). The third flow-blocking surface o2 faces the sixth opening 734b of the second sub-channel 734, and is perpendicular to the length direction of the second sub-channel 734. The third flow-blocking protrusion o also includes a third abutment surface o3. The third abutment surface o3 connects the fifth sub-sloping surface o11, the sixth sub-sloping surface o12, and the third flow-blocking surface o2, and faces away from the second wall 737. Along the direction from the fifth opening 734a to the sixth opening 734b, the connection point of the fifth sub-sloping surface o11 and the sixth sub-sloping surface o12 in the second row is opposite to the third gap o4 in the first row, and so on for the other rows. Along the length direction of the second sub-channel 734, multiple third gaps o4 are connected and form a third ventilation gap. The third ventilation gap is inclined relative to the extension direction of the second sub-channel 734, which can also be understood as extending inclined relative to the length or width direction of the second support body 70.

[0339] like Figure 36bAs shown, multiple fourth flow-blocking protrusions p are evenly arranged in an array on the fourth wall 738. In the width direction of the second support body 70, each pair of adjacent rows of fourth flow-blocking protrusions p are staggered. A fourth gap p4 exists between two adjacent fourth flow-blocking protrusions p to allow gas passage. The fourth guiding surface of the fourth flow-blocking protrusion p includes a seventh sub-inclined surface p11 and an eighth sub-inclined surface p12. The seventh sub-inclined surface p11 and the eighth sub-inclined surface p12 are connected at an included angle. The included angles between the seventh sub-inclined surface p11 and the eighth sub-inclined surface p12 and the fourth flow-blocking surface p2 are equal. The seventh sub-inclined surface p11, the eighth sub-inclined surface p12, and the fourth flow-blocking surface p2 form an isosceles triangle, with the seventh sub-inclined surface p11 and the eighth sub-inclined surface p12 being the two sides of the isosceles triangle. The seventh sub-inclined surface p11, the eighth sub-inclined surface p12, and the fourth flow-blocking surface p2 are all perpendicular to the wall surface of the fourth wall 738. The seventh sub-sloping surface p11 and the eighth sub-sloping surface p12 both face the fifth opening 734a of the second sub-channel 734, and both are angled to the length direction of the second sub-channel 734. The fourth flow-blocking surface p2 faces the sixth opening 734b of the second sub-channel 734, and is perpendicular to the length direction of the second sub-channel 734. The fourth flow-blocking protrusion p also includes a fourth abutment surface p3. The fourth abutment surface p3 connects the seventh sub-sloping surface p11, the eighth sub-sloping surface p12, and the fourth flow-blocking surface p2, and faces away from the fourth wall 738. Along the direction from the fifth opening 734a to the sixth opening 734b, the connection point of the seventh sub-sloping surface p11 and the eighth sub-sloping surface p12 in the second row is opposite to the fourth gap p4 in the first row, and so on for the other rows. Along the length direction of the second sub-channel 734, multiple fourth gaps p4 are connected and form a fourth ventilation gap. The fourth ventilation gap is inclined relative to the extension direction of the second sub-channel 734, which can also be understood as extending inclined relative to the length or width direction of the second support body 70.

[0340] In this embodiment, in the thickness direction of the second carrier 70, the first contact surface m3 of each first flow-blocking protrusion m is connected to the second contact surface n3 of a second flow-blocking protrusion n. The first gap m4 of the multiple first flow-blocking protrusions m is connected to and communicates with the second gap n4 of the multiple second flow-blocking protrusions n, which is essentially the connection and communication between the first air duct gap and the second air duct gap, and is also connected to the first chamber a. The first sub-sloping surface m11 and the second sub-sloping surface m12 of the first flow-blocking protrusion m, and the third sub-sloping surface n11 and the fourth sub-sloping surface n12 of the second flow-blocking protrusion n are all set at an angle to the length direction (air inlet direction) of the first sub-channel 733, while the first flow-blocking surface m2 of the first flow-blocking protrusion m and the second flow-blocking surface n2 of the second flow-blocking protrusion n are both perpendicular to the length direction (air outlet direction) of the first sub-channel 733, and the gas passes through the first flow-blocking protrusion m and the second flow-blocking protrusion n. When airflow enters the heat dissipation device 100, the airflow flows along the first sub-inclined surface m11, the second sub-inclined surface m12, the third sub-inclined surface n11, and the fourth sub-inclined surface n12, that is, it enters the first chamber a along the gap between the first and second air ducts. When the airflow exits the heat dissipation device 100, most of the airflow is blocked by the first obstruction surface m2 and the second obstruction surface n2, making it difficult to flow out of the first sub-channel 733 along the gap between the first and second air ducts. Therefore, the flow resistance of the airflow entering the first chamber a along the gap between the first and second air ducts is less than the flow resistance of the airflow exiting the heat-conducting air duct A through the gap between the first and second air ducts. This facilitates the first sub-channel 733 to draw in gas from outside the heat-conducting air duct A through the third opening 733a, then fill the first sub-channel 733 and flow into the first chamber a through the fourth opening 733b, and can suppress the gas exiting the first chamber a from the first sub-channel 733, reducing the gas flow rate exiting from the first inlet a1 of the first chamber a. The specific principle is similar to... Figure 31 The heat dissipation principle of the embodiments shown is similar.

[0341] In the thickness direction of the second carrier 70, the third abutment surface o3 of each third flow-blocking protrusion o is connected to the fourth abutment surface p3 of a fourth flow-blocking protrusion p. The third gaps o4 of multiple third flow-blocking protrusions o are connected to and communicate with the fourth gaps p4 of multiple fourth flow-blocking protrusions p, which is essentially the connection and communication between the third and fourth air duct gaps, and also communicates with the second chamber b. The fifth sub-sloping surface o11 and the sixth sub-sloping surface o12 of the third flow-blocking protrusion o, and the seventh sub-sloping surface p11 and the eighth sub-sloping surface p12 of the fourth flow-blocking protrusion p are all set at an angle to the length direction (air inlet direction) of the second sub-duct 734, while the third flow-blocking surface o2 of the third flow-blocking protrusion o and the fourth flow-blocking surface p2 of the fourth flow-blocking protrusion p are both perpendicular to the length direction (air outlet direction) of the second sub-duct 734. When airflow enters the heat dissipation device 100, the airflow flows along the fifth sub-slope o11, the sixth sub-slope o12, the seventh sub-slope p11, and the eighth sub-slope p12, that is, it enters the second chamber b along the gap between the third and fourth air ducts. When the airflow exits the heat dissipation device 100, most of the airflow is blocked by the third obstruction surface o2 and the fourth obstruction surface p2, making it difficult for the airflow to flow out of the second sub-channel 734 along the gap between the third and fourth air ducts. Therefore, the flow resistance of the airflow entering the second chamber b along the gap between the third and fourth air ducts is less than the flow resistance of the airflow exiting the heat conduction air duct A through the gap between the third and fourth air ducts. This facilitates the second sub-channel 734 to draw in gas from outside the heat conduction air duct A through the fifth opening 734a, then fill the second sub-channel 734 and flow into the second chamber b through the sixth opening 734b, and can suppress the gas discharge from the second chamber b through the second sub-channel 734, reducing the gas flow rate discharged from the second inlet b1 of the second chamber b.

[0342] Please see Figure 37 and Figure 38 , Figure 37 for Figure 35 The diagram shows the structure of the second support body of the heat dissipation device in its first state. Figure 38 for Figure 37 The diagram shows the second support of the heat dissipation device in its first state, viewed from another angle. It should be noted that... Figure 37 and Figure 38 The solid arrows in the diagram represent the direction of gas flow in the first state of the heat dissipation device.

[0343] When the heat dissipation device 100 transitions from its initial state to its first state, the volume of the first chamber a is compressed and reduced, and gas is discharged in two directions: the first inlet a1 and the first outlet a2. The gas discharged through the first inlet a1 is blocked by the first flow-blocking protrusion m and the second flow-blocking protrusion n. That is, the first airflow 1 impacts the first flow-blocking surface m2 of the first flow-blocking protrusion m and the second flow-blocking surface n2 of the second flow-blocking protrusion n. The first flow-blocking surface m2 and the second flow-blocking surface n2 are perpendicular to the flow direction of the first airflow 1, increasing the flow resistance of the first airflow 1 from the first chamber a through the first sub-channel 733 to the heat dissipation channel 400. This causes most of the first airflow 1 to be bounced back into the first chamber a by the first flow-blocking surface m2 and the second flow-blocking surface n2, while a small portion of the first airflow 1 passes through the first ventilation gap and the second ventilation gap and is discharged through the third opening 733a. The gas discharged through the first outlet a2 is specifically described in the first embodiment above.

[0344] Meanwhile, the volume of the second chamber b gradually increases, generating suction and drawing in gas from both the second sub-channel 734 and the second outlet b2. The gas drawn in through the second sub-channel 734 forms the fifth gas flow 5.

[0345] The fifth and sixth sub-sloping surfaces o11 and o12 of the third flow-blocking protrusion o, and the seventh and eighth sub-sloping surfaces p11 and p12 of the fourth flow-blocking protrusion p, are all set at an angle to the flow direction of the fifth airflow 5. Part of the fifth airflow 5 not only passes through the third ventilation gap of the third flow-blocking protrusion o and the fourth ventilation gap of the fourth flow-blocking protrusion p to enter the second chamber b, but another part of the fifth airflow 5 can also flow along the fifth and sixth sub-sloping surfaces o11 and o12 of the third flow-blocking protrusion o, and the seventh and eighth sub-sloping surfaces p11 and p12 of the fourth flow-blocking protrusion p, and enter the second chamber b along the fifth sub-sloping surface o11, the sixth sub-sloping surface o12, the seventh sub-sloping surface p11, and the eighth sub-sloping surface p12; thus, the airflow entering the second chamber b forms the third airflow 3 (e.g., Figure 8b The third airflow shown is 3).

[0346] When the heat dissipation device 100 transitions from the first state to the second state, the volume of the second chamber b is compressed and reduced, and gas is discharged in both directions: the second inlet b1 and the second outlet b2. The gas discharged through the first inlet a1 is blocked by the third flow-blocking protrusion o and the fourth flow-blocking protrusion p. That is, the third airflow 3 impacts the third flow-blocking surface o2 of the third flow-blocking protrusion o and the fourth flow-blocking surface p2 of the fourth flow-blocking protrusion p. The third flow-blocking surface o2 and the fourth flow-blocking surface p2 are both perpendicular to the flow direction of the third airflow 3, increasing the flow resistance of the third airflow 3 from the second chamber b through the second sub-channel 734 to the heat dissipation channel 400. This causes most of the third airflow 3 to be bounced back into the second chamber b by the third flow-blocking surface o2 and the fourth flow-blocking surface p2, while a small portion of the third airflow 3 passes through the third ventilation gap and the fourth ventilation gap and is discharged through the fifth opening 734a. The gas discharged through the second outlet b2 is specifically described in the first embodiment above.

[0347] At the same time, the volume of the first chamber a gradually increases, generating suction in the first chamber a, and drawing in gas from both the first sub-channel 733 and the first outlet a2. The gas drawn in through the first sub-channel 733 forms the sixth gas flow.

[0348] The first sub-sloping surface m11 and the second sub-sloping surface m12 of the first flow-blocking protrusion m, as well as the third sub-sloping surface n11 and the fourth sub-sloping surface n12 of the second flow-blocking protrusion n, are all set at an angle to the flow direction of the sixth airflow. Part of the sixth airflow not only passes through the first ventilation gap of the first flow-blocking protrusion m and the second ventilation gap of the second flow-blocking protrusion n to enter the first chamber a, but another part of the sixth airflow can also flow along the first sub-sloping surface m11 and the second sub-sloping surface m12 of the first flow-blocking protrusion m, as well as the third sub-sloping surface n11 and the fourth sub-sloping surface n12 of the second flow-blocking protrusion n, and enter the first chamber a along the first sub-sloping surface m11, the second sub-sloping surface m12, the third sub-sloping surface n11 and the fourth sub-sloping surface n12; and the airflow entering the first chamber a forms the first airflow 1.

[0349] In this embodiment, the first sub-channel 733 is divided into multiple gaps by the first flow-blocking protrusion m and the second flow-blocking protrusion n, and the second sub-channel 734 is divided into multiple gaps by the third flow-blocking protrusion o and the fourth flow-blocking protrusion p. Regardless of whether the first chamber a or the second chamber b is drawing in or venting air, the shapes of the first guide surface m1 of the first flow-blocking protrusion m and the second guide surface n1 of the second flow-blocking protrusion n, as well as the shapes of the third guide surface o1 of the third flow-blocking protrusion o and the fourth guide surface p1 of the fourth flow-blocking protrusion p, facilitate the intake of heat-conducting air duct A through the second flow channel 73 from the air inlet 101. At the same time, the shapes of the first flow-blocking surface m2 of the first flow-blocking protrusion m and the second flow-blocking surface n2 of the second flow-blocking protrusion n, as well as the shapes of the third flow-blocking surface o2 of the third flow-blocking protrusion o and the fourth flow-blocking surface p2 of the fourth flow-blocking protrusion p, help to suppress the exhaust of heat-conducting air duct A into the second flow channel 73, so that more gas is discharged from the air outlet 102 from the heat-conducting air duct A, thereby improving the heat dissipation efficiency of the heat dissipation device 100.

[0350] In some embodiments, the structure of the first support 20 can be the same as that of the second support 70, so as to facilitate the heat dissipation device 100 to discharge gas through the first flow channel d of the first support 20 and suppress the heat dissipation device 100 to draw in gas through the first flow channel d of the first support 20. This facilitates the heat dissipation device 100 to draw in gas from the air inlet 101 and discharge gas from the air outlet 102, thereby improving heat dissipation efficiency.

[0351] On the one hand, the existing technology of using silicon-based piezoelectric thin films (i.e. silicon-based MENS thin films) can achieve the thinning of electronic devices 1000, but due to the high production difficulty and cost, it cannot be mass-produced, which is also not conducive to the large-scale production of electronic devices 1000.

[0352] The heat dissipation device 100 proposed in this application uses a piezoelectric vibrator 10 made of piezoelectric ceramic to divide the heat conduction air channel A of the heat dissipation device 100 into multiple chambers for heat conduction. The piezoelectric element is a sheet made of piezoelectric ceramic. The vibrating substrate 11 can achieve a size as small as silicon-based MENS thin film material or even thinner than silicon-based MENS thin film. This can realize the thinning of the heat dissipation device 100 while further improving the heat dissipation efficiency of the heat dissipation device 100, making it more suitable for the needs of miniaturized electronic devices 1000.

[0353] On the other hand, existing technologies such as CN220539823U use a piezoelectric jet fan that drives a vibrating diaphragm with a dot array piezoelectric ceramic. The vibrating diaphragm is located outside the partition, which reduces the flow rate and the displacement of the vibrating diaphragm is very small when vibrating at high frequency. This affects the heat dissipation performance of the electronic device 1000 and is not conducive to heat dissipation.

[0354] In this application, the piezoelectric vibrator 10 is located between the first cover plate 30 and the second cover plate 40, forming at least two chambers. The piezoelectric vibrator 10 can periodically vibrate along the Z-axis between the first cover plate 30 and the second cover plate 40, causing the volumes of the first chamber a and the second chamber b to be periodically compressed and expanded. The heat-conducting air duct A drives the first chamber a and the second chamber b in conjunction with the vibration of the piezoelectric vibrator 10, thereby reciprocatingly and directionally transporting gas from the external environment of the electronic device 1000 to the heat dissipation device 100. Sufficient space is provided under high-frequency amplitude to ensure airflow, thereby ensuring the heat dissipation effect of the heat dissipation device 100. In the heat dissipation device 100 proposed in this application embodiment, the number of piezoelectric vibrators 10 can be one or more, and one or more piezoelectric elements can be disposed on the vibration substrate 11 of each piezoelectric vibrator 10. For example, a piezoelectric vibrator 10 includes three piezoelectric elements. The three piezoelectric elements can be located on the same side or different sides of the thickness direction of the vibrating substrate 11. By arranging the three piezoelectric elements in different polarization directions, the vibration amplitude of the piezoelectric vibrator 10 can be further expanded, the heat dissipation efficiency of the heat dissipation device 100 can be improved, and the heat dissipation performance of the electronic device 1000 can be guaranteed.

[0355] Furthermore, in existing technologies, some heat dissipation devices require a certain gap between themselves and the heat source to allow airflow to pass through, and this gap is set in the thickness direction, while the outlet is in the width or length direction, in order to dissipate heat from the heat source.

[0356] Furthermore, the air inlet and outlet of this device are located along the thickness of the device and are completely offset. The inlet and outlet are separated by a vibrating plate. This means that after the airflow enters through the inlet, it is blown onto one surface of the vibrating plate along its thickness, pushed to opposite sides, and flows from the gap between the vibrating plate and the housing to the space corresponding to the other surface of the vibrating plate, before exiting through the outlet. This results in a significant amount of airflow detour, inevitably leading to a larger thickness. Combined with the gap between the device and the heat source, and the direction of the outlet, discharging the airflow occupies a considerable amount of space in the electronic equipment. Moreover, since both the inlet and outlet are located in the vibration direction of the vibrating plate, this affects the airflow velocity.

[0357] The air outlet 102 and air inlet 101 of this application are located in the flow direction of the airflow in the heat-conducting air duct A, which are also the opposite ends of the heat dissipation device 100, and flow along the surface of the vibrating substrate 11. The two ends of the length direction of the heat-conducting air duct A are respectively connected to the air outlet 102 and the air inlet 101, and the orthographic projections of the air outlet 102 and the air inlet 101 at the two ends of the heat dissipation device 100 partially or completely overlap. The airflow passing through the air outlet 102 and the air inlet 101 will not blow directly onto the vibrating substrate 11, but will blow directly onto the heat source. The heat source is located at the narrower end of the heat dissipation device 100, which does not increase the thickness of the electronic device 1000. Even if there is a gap, since the heat source is located at the narrower end of the heat dissipation device 100, the distance between the two outlet ends of the gap and the air outlet 102 is the length of the second side surface 22 on one side of the air outlet 102. This distance is equivalent to the airflow from the air outlet 102 directly dissipating heat from the heat source. After impacting the heat source, the airflow diffuses directly without needing to flow a distance along the length of the heat dissipation device 100 to be discharged. The heat dissipation device 100 of this embodiment saves space in the electronic device 1000. Furthermore, the heat-conducting air duct A between the air outlet 102 and the air inlet 101 causes the two chambers to contract and expand through the vibrating substrate 11. The chambers contract and exhaust gas outward, while the chambers expand and draw in gas. This repetitive process achieves directional gas delivery. The larger the amplitude, the more gas is exhausted per unit cycle, which improves the heat dissipation efficiency.

[0358] Furthermore, in the heat dissipation device 100 proposed in this application embodiment, the number of piezoelectric vibrators 10 can be one or more, and one or more piezoelectric elements can be disposed on the vibration substrate 11 of each piezoelectric vibrator 10. By arranging and deforming the piezoelectric vibrator 10 towards the first cover plate 30 or the second cover plate 40, and by utilizing the inverse piezoelectric effect to better drive the vibration substrate 11 to reciprocate along the Z-axis, the piezoelectric vibrator 10 vibrates periodically along the Z-axis. The vibration of the piezoelectric vibrator 10 causes the volume of multiple chambers to change in tandem, thereby achieving the heat dissipation and ventilation effect of the heat dissipation device 100. For example, a piezoelectric vibrator 10 includes three piezoelectric elements, which can be located on the same side or different sides of the thickness direction of the vibration substrate 11. By arranging the three piezoelectric elements with different electrode orientations, the vibration amplitude of the piezoelectric vibrator 10 can be further expanded, the heat dissipation efficiency of the heat dissipation device 100 can be improved, and the heat dissipation performance of the electronic device 1000 can be guaranteed.

[0359] Furthermore, compared to the heat dissipation device 100 in the prior art, the reciprocating vibration of the piezoelectric vibrator 10 in this embodiment directly drives the volume change of the first chamber a and the second chamber b during the heat dissipation process, ensuring that gas always enters from the air inlet 101 of the heat-conducting air duct A and exits from the air outlet 102 of the heat-conducting air duct A. That is, gas can be directionally drawn in from the air inlet 101 and discharged from the air outlet 102. The internal structure of the heat-conducting air duct A is simple, and the component assembly process of the heat dissipation device 100 is simple, which is beneficial to the assembly and manufacturing of the electronic device 1000 and cost control.

[0360] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A heat dissipation device, characterized in that, The heat dissipation device includes a piezoelectric vibrator, a first carrier, a first cover plate, and a second cover plate. The heat dissipation device also includes a heat-conducting air duct. Along a third direction, the heat-conducting air duct is provided with an air outlet and an air inlet arranged in opposite directions. The piezoelectric vibrator includes a vibrating substrate and a piezoelectric element connected to the surface of the vibrating substrate. The vibrating substrate is fixed at one end in a first direction between the first cover plate and the second cover plate. Along the second direction, the first cover plate, the piezoelectric vibrator, and the second cover plate are stacked. The piezoelectric vibrator is spaced apart from the first cover plate to form a first chamber, and the piezoelectric vibrator is spaced apart from the second cover plate to form a second chamber. The first carrier includes a first side surface and a second side surface disposed opposite to the first side surface. The first carrier also includes a first flow channel, which penetrates the first side surface and the second side surface and extends along the third direction. The opening of the first flow channel on the second side surface is the air outlet of the heat dissipation device. The first flow channel includes a first sub-flow channel and a second sub-flow channel, which are spaced apart along the first direction, and both the first sub-flow channel and the second sub-flow channel penetrate the first side surface. Along the third direction, the first side surface of the first carrier is connected to the same side of the first cover plate and the second cover plate. The air inlet of the heat dissipation device is located on the side of the first cover plate and the second cover plate facing away from the first carrier. The first chamber and the second chamber are both connected to the air inlet. The first chamber is connected to the first sub-channel, and the second chamber is connected to the second sub-channel. They extend along the third direction. The first sub-channel and the second sub-channel are both connected to the air outlet. The heat-conducting air duct includes a first chamber, a second chamber, and a first flow channel. When the piezoelectric element is energized, it drives the vibrating substrate to deform and reciprocate in the second direction. The volumes of the first chamber and the second chamber are repeatedly exchanged between being compressed and expanded, so that external gas is drawn into the heat-conducting air duct through the air inlet and discharged from the air outlet. The second direction is the thickness direction of the heat dissipation device, and the first direction, the second direction, and the third direction are perpendicular to each other.

2. The heat dissipation device according to claim 1, characterized in that, The piezoelectric element is a sheet made of piezoelectric ceramic.

3. The heat dissipation device according to claim 1, characterized in that, The piezoelectric vibrator is disposed at a distance from the first side surface in the third direction, forming a flow-blocking channel. The flow-blocking channel communicates with the first chamber and the second chamber in the second direction.

4. The heat dissipation device according to claim 1, characterized in that, The vibrating substrate is a metal plate with a thickness of less than or equal to 0.1 mm.

5. The heat dissipation device according to claim 1, characterized in that, The heat dissipation device further includes two support members, which connect the vibrating substrate to the first cover plate and the vibrating substrate to the second cover plate. The two support members are located at opposite ends of the first cover plate in the first direction. The support members support the vibrating substrate between the first cover plate and the second cover plate to form the first chamber and the second chamber. One end of the vibrating substrate is fixedly connected to one of the support members, and the other end is spaced apart from another support member; or, the vibrating substrate is connected to two support members at opposite ends in the first direction.

6. The heat dissipation device according to claim 5, characterized in that, The heat dissipation device further includes reinforcing ribs, which are stacked between the support member and the vibration substrate. Two reinforcing ribs are located at opposite ends of the vibration substrate in the first direction. Each reinforcing rib includes an extension section, which is located in the first cavity and is stacked and connected to the vibration substrate.

7. The heat dissipation device according to claim 1, characterized in that, The vibrating substrate includes a first surface and a second surface facing away from each other. The piezoelectric element consists of three components: a first piezoelectric element and two second piezoelectric elements. The first piezoelectric element and the two second piezoelectric elements are connected to the first surface. The first piezoelectric element is located between and spaced apart from the two second piezoelectric elements. Alternatively, the first piezoelectric element is connected to the first surface, and two second piezoelectric elements are connected to the second surface, wherein in the second direction, the two second piezoelectric elements are completely offset from the first piezoelectric element.

8. The heat dissipation device according to claim 7, characterized in that, The electrodes of the first piezoelectric element are the same as the electrodes of the two second piezoelectric elements, and the polarization direction of the first piezoelectric element is opposite to the polarization direction of the two second piezoelectric elements.

9. The heat dissipation device according to claim 7, characterized in that, The heat dissipation device further includes two support members, which connect the vibrating substrate to the first cover plate and the vibrating substrate to the second cover plate. The two support members are located at opposite ends of the vibrating substrate in the first direction. The heat dissipation device further includes two reinforcing ribs, which are stacked between the support member and the vibration substrate. Each reinforcing rib includes an extension section located in the first cavity and stacked with the vibration substrate. In the second direction, two second piezoelectric elements are stacked with the reinforcing ribs respectively.

10. The heat dissipation device according to any one of claims 1-9, characterized in that, The heat dissipation device includes a second carrier, which includes a first side and a second side. The first side and the second side are arranged opposite to each other along the third direction. The second carrier also includes a second flow channel that passes through the first side and the second side. The opening of the second flow channel on the first side is the air inlet. The second side is connected to the first cover plate and the second cover plate. The opening of the second flow channel on the second side is opposite to and communicates with the first chamber and the second chamber.

11. The heat dissipation device according to claim 10, characterized in that, From the first side to the second side, the cross-sectional area of ​​the second flow channel gradually decreases, and the area of ​​the opening of the second flow channel on the first side is greater than the area of ​​the opening of the second flow channel on the second side.

12. The heat dissipation device according to claim 10, characterized in that, The second flow channel includes a first wall and a second wall opposite each other along the second direction, the surfaces of the first wall and the second wall being curved away from each other in an arc shape.

13. The heat dissipation device according to claim 10, characterized in that, The second flow channel of the heat dissipation device includes a first sub-channel and a second sub-channel. The first sub-channel and the second sub-channel are spaced apart along the second direction. The first sub-channel is connected to the first chamber, and the second sub-channel is connected to the second chamber. Both the first sub-channel and the second sub-channel have flow-blocking protrusions on their two walls in the second direction. The flow-blocking protrusions on the two walls of the first sub-channel are alternately and spaced apart in the second direction. The flow-blocking protrusions on the two walls of the second sub-channel are also alternately and spaced apart in the second direction. The flow-blocking protrusion includes a guiding surface and a flow-blocking surface. The guiding surface intersects with the flow-blocking surface. The guiding surface faces the air inlet and is inclined relative to the air inlet. The flow-blocking surface faces the first chamber and the second chamber. The airflow entering through the air inlet can flow along the guide surface to the first chamber and the second chamber, and the flow-blocking surface can block the airflow entering the first sub-channel and the second sub-channel through the first chamber and the second chamber.

14. The heat dissipation device according to claim 13, characterized in that, The first sub-channel includes a third opening and a fourth opening, the fourth opening communicating with the first chamber. The first sub-channel has a plurality of first flow-blocking protrusions protruding from the two walls in the second direction. The plurality of first flow-blocking protrusions are arranged at intervals along the third direction. Each first flow-blocking protrusion includes a first guiding surface and a first flow-blocking surface. The first guiding surface is set at an angle to the first flow-blocking surface and the wall. The first flow-blocking surface is perpendicular to the wall. The first flow-blocking surface faces the fourth opening of the first sub-channel.

15. The heat dissipation device according to claim 10, characterized in that, The second flow channel of the heat dissipation device includes a first sub-channel and a second sub-channel, which are spaced apart along the second direction. The first sub-channel is connected to the first chamber, and the second sub-channel is connected to the second chamber. The ends of the first sub-channel and the second sub-channel facing away from the piezoelectric vibrator constitute the air inlet. The second carrier further includes a first fin and a second fin. The first fin is located within the first sub-channel, with a portion of the first fin connected to the wall of the first sub-channel, and the other portion of the first fin is raised relative to the wall of the first sub-channel and is capable of swinging in the second direction. The second fin is located within the second sub-channel, with a portion of the second fin connected to the wall of the second sub-channel, and the other portion of the second fin is raised relative to the wall of the second sub-channel and is capable of swinging in the second direction. The raised directions of the first fin and the second fin are opposite.

16. The heat dissipation device according to claim 15, characterized in that, The first subchannel includes a third opening and a fourth opening, the fourth opening communicating with the first chamber. The first fin includes a first connecting portion and a first movable portion. The first movable portion is connected to one end of the first connecting portion and forms an angle with the first connecting portion. The first connecting portion is fixed to a wall of the first subchannel in the second direction and is close to the third opening. The end of the first movable portion away from the first connecting portion is a first free end, which is located at the fourth opening. The first movable portion can swing in the second direction, and the first free end can abut against the wall in the second direction; or the first movable portion can be stacked on the wall of the first subchannel.

17. The heat dissipation device according to claim 16, characterized in that, The second sub-channel includes a fifth opening and a sixth opening, the sixth opening being in communication with the second chamber; The second fin has the same structure as the first fin, including a second connecting portion and a second movable portion. The second fin is connected to the wall of the second sub-channel away from the first sub-channel and close to the fifth opening. The end of the second movable portion away from the second connecting portion is a second free end, which is located at the sixth opening. The second movable portion can swing in the second direction, and the second free end can abut against the wall in the second direction; or the second movable portion can be stacked on the wall of the second sub-channel.

18. The heat dissipation device according to claim 16 or 17, characterized in that, The first fin and the second fin are elastic membranes.

19. The heat dissipation device according to claim 10, characterized in that, The second flow channel of the heat dissipation device includes a first sub-channel and a second sub-channel. The first sub-channel and the second sub-channel are spaced apart along the second direction. The ends of the first sub-channel and the second sub-channel facing away from the piezoelectric vibrator constitute the air inlet. Both the first sub-channel and the second sub-channel have multiple spaced flow-blocking protrusions on their two walls in the second direction. The multiple flow-blocking protrusions on the two walls of the first sub-channel correspond one-to-one and are connected in the second direction to form a first ventilation gap. The first ventilation gap is inclined relative to the extension direction of the first sub-channel. The multiple flow-blocking protrusions on the two walls of the second sub-channel are arranged in a one-to-one correspondence and abutment in the second direction to form a second ventilation gap; the second ventilation gap is inclined relative to the extension direction of the second sub-channel. The first ventilation gap is connected to the first chamber, and the second ventilation gap is connected to the second chamber. Airflow entering through the air inlet can flow along the first ventilation gap to the first chamber and along the second ventilation gap to the second chamber. The first ventilation gap can block airflow passing through the first chamber from entering the first sub-channel, and the second ventilation gap can block airflow passing through the second chamber from entering the second sub-channel.

20. The heat dissipation device according to claim 19, characterized in that, Each of the flow-blocking protrusions includes a guiding surface and a flow-blocking surface. The guiding surface includes two sub-sloping surfaces. The two sub-sloping surfaces are connected at an included angle and are arranged in opposite directions. Both sub-sloping surfaces are connected to the flow-blocking surface and intersect with the flow-blocking surface. The included angles between the two sub-sloping surfaces and the flow-blocking surface are equal. The two sub-sloping surfaces face the air inlet and are inclined relative to the air inlet. A gap is formed between the sub-sloping surfaces of two adjacent columns of the flow-blocking protrusions in the first direction. In the second direction, the flow-blocking protrusions in each adjacent row are staggered, and the connection point of the two sub-sloping surfaces of the flow-blocking protrusions in the latter row faces the gap between the two flow-blocking protrusions in the former row. The first ventilation gap is formed by a gap located within the first sub-channel, and the second ventilation gap is formed by a plurality of gaps located within the second sub-channel; The airflow entering through the air inlet can flow along the inclined surface of the first sub-channel toward the first chamber, and can flow along the inclined surface of the second ventilation gap toward the second chamber. The flow-blocking surface in the first sub-channel can block the airflow passing through the first chamber from entering the first sub-channel, and the flow-blocking surface in the second sub-channel can block the airflow passing through the second chamber from entering the second sub-channel.

21. The heat dissipation device according to any one of claims 1-20, characterized in that, The first carrier includes a third fin and a fourth fin. The third fin is located within the first sub-channel, with a portion of the third fin connected to the wall of the first sub-channel. Another portion of the third fin is able to be raised relative to the wall of the first sub-channel and can swing in the second direction. The fourth fin is located within the second sub-channel, with a portion of the fourth fin connected to the wall of the second sub-channel. Another portion of the fourth fin is raised relative to the wall of the second sub-channel and can swing in the second direction. The raised directions of the third fin and the fourth fin are opposite.

22. The heat dissipation device according to claim 21, characterized in that, The first sub-channel includes a first sub-port and a second sub-port, the first sub-port being opened on the first side and the second sub-port being opened on the second side; the first sub-port is connected to the first chamber and the second sub-port is connected to the second chamber, and the first sub-channel extends along the second direction; The third fin includes a third connecting portion and a third movable portion. The third movable portion is connected to one end of the third connecting portion and forms an angle with the third connecting portion. The third connecting portion is connected to the wall of the first sub-channel away from the second sub-channel and close to the first sub-port of the first sub-channel. The end of the third movable portion away from the third connecting portion is a third free end, which is located at the second sub-port. The third movable portion is capable of swinging in the second direction, and the third free end is capable of abutting against the wall in the second direction. Alternatively, the third movable part can be stacked on the wall of the first sub-channel; The second sub-channel includes a third sub-port and a fourth sub-port, the fourth sub-port being connected to the second chamber; the fourth fin has the same structure as the third fin, including a fourth connecting portion and a fourth movable portion, the fourth fin being connected to the wall of the second sub-channel away from the first sub-channel and close to the third opening, the end of the fourth movable portion away from the fourth connecting portion being a fourth free end, the fourth free end being located at the fourth sub-port; the fourth movable portion is capable of swinging in the second direction, the fourth free end being capable of abutting against the wall in the second direction; or the fourth movable portion is capable of being stacked on the wall of the second sub-channel.

23. The heat dissipation device according to any one of claims 1-20, characterized in that, The first chamber includes a first inlet and a first outlet, and the second chamber includes a second inlet and a second outlet, wherein the first inlet or the second inlet constitutes the air inlet; The first flow channel further includes a converging channel, which extends from the second side surface toward the first side surface, penetrates the second side surface and forms the air outlet, and the first sub-flow channel and the second sub-flow channel are inclined relative to the converging channel; The first sub-channel has a first sub-port and a second sub-port. The first sub-port is opened on the first side surface and is connected to and communicates with the first outlet. The second sub-port is connected to and communicates with the manifold inside the first carrier. The second sub-channel has a third sub-port and a fourth sub-port. The third sub-port is opened on the first side surface and is connected to and communicates with the second outlet. The fourth sub-port is connected to and communicates with the manifold inside the first carrier and is also connected to the second sub-port.

24. The heat dissipation device according to any one of claims 1-4, characterized in that, The piezoelectric vibrator consists of two elements, namely a first piezoelectric vibrator and a second piezoelectric vibrator. The first piezoelectric vibrator and the first cover plate form the first chamber, the second piezoelectric vibrator and the second cover plate form the second chamber, and the first piezoelectric vibrator and the second piezoelectric vibrator form a third chamber. Along the first direction, the ends of the first piezoelectric vibrator and the second piezoelectric vibrator that face away from each other are free ends. The first flow channel further includes a third sub-flow channel and a confluence channel. The first sub-flow channel, the second sub-flow channel, and the third sub-flow channel are spaced apart along the first direction. The third sub-flow channel penetrates the first side surface. The confluence channel extends from the second side surface toward the first side surface. The confluence channel penetrates the second side surface and forms the air outlet. The first sub-flow channel, the second sub-flow channel, and the third sub-flow channel are inclined relative to the confluence channel and are all connected and communicate with the confluence channel. The third sub-flow channel communicates with the third chamber.

25. The heat dissipation device according to claim 24, characterized in that, The vibrating substrate of the first piezoelectric vibrator has a first fixed end and a first movable end, and the vibrating substrate of the second piezoelectric vibrator has a second fixed end and a second movable end; The heat dissipation device further includes a first support group and a second support group. The first support group fixes the first fixed end of the vibration substrate of the first piezoelectric vibrator between the first cover plate and the second cover plate. The first movable end of the vibration substrate of the first piezoelectric vibrator is spaced apart from the second support group. The second support group fixes the second fixed end of the vibration substrate of the second piezoelectric vibrator between the first cover plate and the second cover plate. The second movable end of the vibration substrate of the second piezoelectric vibrator is spaced apart from the first support group.

26. An electronic device, characterized in that, It includes a main body, a heat dissipation channel disposed in the main body, a heat dissipation device as described in any one of claims 1-25, and a heat source. The heat dissipation device and the heat source are located in the heat dissipation channel. The air outlet of the heat dissipation device faces the heat source. External air enters the air inlet of the heat dissipation device through the heat dissipation channel.

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