Display package module, forming method, device, related equipment and terminal

Abstract

This invention provides a display packaging module, a forming method, an apparatus, related equipment, and a terminal. The display packaging module includes: a packaging substrate with a front and a back side; the front side of the packaging substrate has a microdisplay chip and chip contact points electrically connected to the microdisplay chip; the back side of the packaging substrate has an array of three-dimensional electrical connection structures electrically connected to the chip contact points, serving as external electrodes for electrical connection between the display packaging module and an external structure; an interconnect structure electrically connecting the microdisplay chip to the chip contact points on the front side of the packaging substrate; and a packaging layer located on the front side of the packaging substrate, the packaging layer at least covering the interconnect area where the interconnect structure is located and exposing the display area of ​​the microdisplay chip. The display packaging module provided by this invention can reduce the overall size of the display packaging module.

Description

Technical Field

[0001] The embodiments of the present invention relate to the field of optoelectronic device technology, specifically to a display packaging module, a forming method, an apparatus, related equipment, and a terminal. Background Technology

[0002] Display packaging modules are core display and light-emitting devices in the field of optoelectronic devices. A typical example is the MicroLED (Micro Light-Emitting Diode) display packaging module. Display packaging modules are modular display units that are independently driven at the pixel level and emit light themselves. They feature high brightness, high contrast, long lifespan, and low power consumption.

[0003] In the prior art, how to improve the design flexibility of display packaging modules and reduce the overall size of display packaging modules is a hot topic of concern for those skilled in the art. Summary of the Invention

[0004] In view of this, embodiments of the present invention provide a display packaging module, a method for forming it, an apparatus, related equipment and a terminal, so as to reduce the overall size of the display packaging module.

[0005] This invention provides a display packaging module, comprising: Micro display chip; A packaging substrate includes a front side and a back side facing each other; wherein, the front side of the packaging substrate is provided with the microdisplay chip and chip contact points electrically connected to the microdisplay chip, and the back side of the packaging substrate is provided with an array of three-dimensional electrical connection structures; a redistribution layer is provided between the front side and the back side of the packaging substrate, and the three-dimensional electrical connection structures are electrically connected to the chip contact points based on the redistribution layer, serving as external electrodes for electrical connection between the display packaging module and external structures; An interconnection structure that electrically connects the microdisplay chip to the chip contact points on the front side of the packaging substrate; The encapsulation layer is located on the front side of the encapsulation substrate, and the encapsulation layer at least covers the interconnect area where the interconnect structure is located, and exposes the display area of ​​the microdisplay chip.

[0006] Optionally, the three-dimensional electrical connection structure is a welding structure or an electrical plug-in structure protruding from the back of the packaging substrate, or the three-dimensional electrical connection structure is located at the edge of the back of the packaging substrate and extends to the sidewall of the packaging substrate.

[0007] Optionally, the encapsulation layer covers the interconnect region and exposes the display region of the microdisplay chip.

[0008] Optionally, the encapsulation layer covers the front side of the encapsulation substrate, excluding the display area of ​​the microdisplay chip.

[0009] Optionally, it may also include: a heat dissipation enhancement structure, which is embedded in or penetrates the packaging substrate, and the projection of the heat dissipation enhancement structure on the packaging substrate at least covers the display area of ​​the microdisplay chip.

[0010] Optionally, the encapsulation layer is epoxy resin or acrylate; The encapsulation layer is formed based on a dispensing process or an injection molding process.

[0011] Optionally, it may also include: a fixing structure between the packaging substrate and the microdisplay chip, wherein the fixing structure is made of adhesive, metal bonding layer or a combination thereof.

[0012] Optionally, the chip area is defined as the area where the microdisplay chip is disposed on the packaging substrate; The three-dimensional electrical connection structure is a welding structure protruding from the back of the packaging substrate, and the welding structure is arranged around the periphery of the chip area; Alternatively, the three-dimensional electrical connection structure is a three-dimensional pad, which is located at the edge of the back side of the packaging substrate and extends to the sidewall of the packaging substrate, and the chip area is located in the area surrounded by the three-dimensional pad; Alternatively, the three-dimensional electrical connection structure is an electrical plug-in structure protruding from the back of the packaging substrate, wherein the back of the packaging substrate is also provided with an invalid electrical plug-in structure, the invalid electrical plug-in structure is located in the chip area, and the invalid electrical plug-in structure and the electrical plug-in structure are evenly arranged as plug-in structures on the back of the packaging substrate.

[0013] Optional, also includes: A transparent overlay layer covering the display area; And / or, A color conversion layer covering the display area.

[0014] This invention also provides a method for forming a display packaging module, comprising: A packaging substrate and a microdisplay chip are provided. The packaging substrate includes a front side and a back side facing each other. The front side of the packaging substrate is provided with chip contact points that are electrically connected to the microdisplay chip. The back side of the packaging substrate is provided with an array of three-dimensional electrical connection structures. A redistribution layer is provided between the front side and the back side of the packaging substrate. The three-dimensional electrical connection structures are electrically connected to the chip contact points based on the redistribution layer, and are used as external electrodes for electrical connection between the display packaging module and an external structure. The microdisplay chip is electrically connected to the chip contact point based on the interconnect structure; An encapsulation layer is formed that at least covers the interconnect region where the interconnect structure is located and exposes the display region of the microdisplay chip.

[0015] Optionally, the provided packaging substrate includes: An initial packaging substrate is provided, the initial packaging substrate including a front side and a back side facing each other; wherein, the front side of the initial packaging substrate is provided with chip contact points electrically connected to the microdisplay chip, and the back side is provided with an array of electrically connected points. A three-dimensional electrical connection structure is formed on the electrical connection point of the initial packaging substrate, and the initial packaging substrate on which the three-dimensional electrical connection structure is formed is used as the packaging substrate.

[0016] Optionally, the three-dimensional electrical connection structure is a solder structure protruding from the back of the packaging substrate, and forming the three-dimensional electrical connection structure at the electrical connection point on the initial packaging substrate includes: Solder balls are formed at the electrical connection points based on the ball-planting process; The solder balls are heated using a reflow process to fix them to the packaging substrate, and the solder balls serve as the welding structure. The step of forming a three-dimensional electrical connection structure on the electrical connection points of the initial packaging substrate is performed after the step of forming a packaging layer that at least covers the interconnect region where the interconnect structure is located and exposes the display region of the microdisplay chip.

[0017] Optionally, the three-dimensional electrical connection structure is an electrical plug-in structure protruding from the back of the packaging substrate, and the three-dimensional electrical connection structure is formed at the electrical connection point of the initial packaging substrate, specifically as follows: A socket groove is formed at the electrical connection point to expose the electrical connection point; a pin is fixedly installed in the socket groove, and the pin serves as the electrical connection structure. or, Based on the injection molding process, pins are fixedly disposed on the electrical connection points of the initial packaging substrate, and the pins are used as the electrical connection structure.

[0018] Optionally, the encapsulation layer that at least covers the interconnect region where the interconnect structure is located and exposes the display region of the microdisplay chip can be formed by: forming the encapsulation layer in the interconnect region based on a dispensing process; or forming the encapsulation layer in other regions on the front side of the encapsulation substrate other than the display region of the microdisplay chip based on a molding process.

[0019] Optionally, the electrical connection between the microdisplay chip and the chip contact point based on the interconnect structure includes: The microdisplay chip is fixedly mounted on the front side of the packaging substrate based on a fixing structure; The electrical contacts of the microdisplay chip are connected to the chip contacts based on the interconnect structure.

[0020] Optionally, the step of providing the initial packaging substrate specifically involves providing a substrate array unit, wherein the substrate array unit includes multiple initial packaging substrates arranged in an array. After forming the encapsulation layer that at least covers the interconnect region where the interconnect structure is located and exposes the display region of the microdisplay chip, the method further includes: The substrate array units are cut to form independent display packaging modules.

[0021] This invention also provides a display device, comprising: The display packaging module described in any of the foregoing embodiments.

[0022] This invention also provides a display device, including a display packaging module as described in any of the foregoing embodiments.

[0023] This invention also provides an optoelectronic device, including a display packaging module as described in any of the foregoing embodiments.

[0024] This invention also provides a terminal, including a display packaging module as described in any of the foregoing embodiments.

[0025] The display packaging module provided in this embodiment of the invention includes: a packaging substrate, the packaging substrate having a front side and a back side facing each other; wherein, the front side of the packaging substrate is provided with a microdisplay chip and chip contact points electrically connected to the microdisplay chip, and the back side of the packaging substrate is provided with an array of three-dimensional electrical connection structures; a redistribution layer is provided between the front side and the back side of the packaging substrate, and the three-dimensional electrical connection structures are electrically connected to the chip contact points based on the redistribution layer, serving as external electrodes for electrical connection between the display packaging module and an external structure; an interconnection structure electrically connecting the microdisplay chip and the chip contact points on the front side of the packaging substrate; and a packaging layer located on the front side of the packaging substrate, the packaging layer at least covering the interconnection area where the interconnection structure is located, and exposing the display area of ​​the microdisplay chip.

[0026] As can be seen, the solution provided in this embodiment of the invention provides a packaging substrate, on which a microdisplay chip and a packaging layer exposing the display area of ​​the microdisplay chip are disposed on the front side, and a three-dimensional electrical connection structure for realizing the electrical connection between the display packaging module and the external structure is disposed on the back side, thereby realizing the display function of the display packaging module and the function of independently connecting to external power and signals. Compared with the flexible circuit board integrated curing solution, this embodiment of the invention does not require the space occupied by the line extension of the flexible circuit board, thereby realizing the reduction of device size.

[0027] Furthermore, compared to the drawbacks of flexible circuit board integrated curing solutions where the circuit length is large and the risk of circuit breakage is high under bending conditions, the present invention's packaging substrate directly connects the micro-display chip to the chip contact points on the front side of the packaging substrate, and connects the chip contact points to the three-dimensional electrical connection structure on the back side, serving as the external electrode for electrical connection between the display packaging module and the external structure. The corresponding electrical connection lines are located inside the packaging substrate, thereby greatly improving the stability of the electrical connection lines and significantly reducing the risk of circuit breakage.

[0028] Furthermore, compared to the drawbacks of flexible circuit board integrated curing solutions, which involve large line lengths leading to high circuit impedance and consequently high device power consumption, the electrical connection lines in the packaging substrate of this invention only need to extend from the front to the back of the packaging substrate. This greatly reduces the length of the corresponding electrical connection lines, thereby significantly reducing the impedance of the electrical connection lines and thus significantly reducing device power consumption.

[0029] In addition, the array-arranged three-dimensional electrical connection structure on the back of the packaging substrate in this embodiment of the invention can improve the connection stability with external structures through its three-dimensional shape, thereby reducing the probability of loose electrical connections and improving the yield of the device.

[0030] Furthermore, in this embodiment of the invention, the microdisplay chip is electrically connected to the external electrodes by a packaging substrate with a redistribution layer, thereby achieving a smaller size in the vertical direction and reducing the device size. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0032] Figure 1 This is a schematic diagram of the structure of a primitive display packaging module prepared in the prior art; Figure 2 This is an exploded view of the display packaging module provided in an embodiment of the present invention; Figure 3 This is an example diagram of the microdisplay chip being bonded to the packaging substrate in the display packaging module provided in this embodiment of the invention; Figure 4 This is a cross-sectional schematic diagram of the display packaging module provided in an embodiment of the present invention; Figure 5 This is a schematic diagram of the back structure of the packaging substrate provided in an embodiment of the present invention; Figure 6This is another schematic diagram of the back structure of the packaging substrate provided in an embodiment of the present invention; Figure 7 This is the corresponding embodiment provided by the present invention. Figure 6 Exploded view of the display packaging module on the packaging substrate; Figure 8 This is another schematic diagram of the back structure of the packaging substrate provided in an embodiment of the present invention; Figure 9 This is the corresponding embodiment provided by the present invention. Figure 8 Exploded view of the display packaging module on the packaging substrate; Figure 10 This is another exploded structural diagram of the display packaging module provided in an embodiment of the present invention; Figure 11 This is a flowchart illustrating a method for forming a display packaging module according to an embodiment of the present invention; Figure 12 This is a front view of a substrate array unit provided in an embodiment of the present invention; Figure 13 This is a back-side example diagram of the substrate array unit provided in an embodiment of the present invention. Detailed Implementation

[0033] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0034] As described in the background section, display packaging modules are the core display and light-emitting devices in the field of optoelectronic devices. Typical devices, such as MicroLED display packaging modules, have advantages such as self-illumination, ultra-high brightness, high contrast, low power consumption, long lifespan, and inorganic stability. Therefore, they are widely used in near-eye displays, automotive optoelectronic devices, and have gradually penetrated into professional displays, transparent displays, optical communications, medical detection, and other scenarios, becoming a key carrier of optoelectronic device technology.

[0035] However, existing display packaging modules typically integrate a flexible printed circuit board (FPC) assembly and a carrier board with a microdisplay chip into a single unit, thereby achieving electrical connection between the microdisplay chip and the external structure through the flexible printed circuit board.

[0036] refer to Figure 1 , Figure 1 This is a schematic diagram of a display packaging module fabricated using existing technology. For example... Figure 1As shown, in this display packaging module, the MicroLED microdisplay chip 10 is fixed on the carrier plate 11, and the carrier plate 11 is fixed on the flexible circuit board assembly 12. The flexible circuit board assembly 12 is used to realize the electrical connection between the MicroLED microdisplay chip 10 and the external structure.

[0037] It can be seen that, reference Figure 1 In the display packaging module shown, the flexible circuit board assembly and the carrier board are integrally solidified, which makes the overall size of the display packaging module relatively large, which is not conducive to further compression of device size.

[0038] However, the inventors believe that miniaturization of display packaging modules is crucial in typical new technologies and fields (such as AR (Augmented Reality) glasses). Therefore, it is necessary to provide a new solution to reduce the size of micro-display packaging modules.

[0039] In view of this, embodiments of the present invention provide a display packaging module, a forming method, an apparatus, related equipment, and a terminal. The display packaging module includes a microdisplay chip; a packaging substrate, the packaging substrate including a front side and a back side; wherein, the front side of the packaging substrate is provided with the microdisplay chip and chip contact points electrically connected to the microdisplay chip, and the back side of the packaging substrate is provided with an array of three-dimensional electrical connection structures, the three-dimensional electrical connection structures electrically connecting the chip contact points, serving as external electrodes for electrical connection between the display packaging module and an external structure; an interconnection structure electrically connecting the microdisplay chip and the chip contact points on the front side of the packaging substrate; and a packaging layer located on the front side of the packaging substrate, the packaging layer at least covering the interconnection area where the interconnection structure is located, and exposing the display area of ​​the microdisplay chip.

[0040] As can be seen, the solution provided in this embodiment of the invention provides a packaging substrate, on which a microdisplay chip and a packaging layer exposing the display area of ​​the microdisplay chip are disposed on the front side, and a three-dimensional electrical connection structure for realizing the electrical connection between the display packaging module and the external structure is disposed on the back side, thereby realizing the display function of the display packaging module and the function of independently connecting to external power and signals. Compared with the flexible circuit board integrated curing solution, this embodiment of the invention does not require the space occupied by the line extension of the flexible circuit board, thereby realizing the reduction of device size.

[0041] Furthermore, compared to the drawbacks of flexible circuit board integrated curing solutions where the circuit length is large and the risk of circuit breakage is high under bending conditions, the present invention's packaging substrate directly connects the micro-display chip to the chip contact points on the front side of the packaging substrate, and connects the chip contact points to the three-dimensional electrical connection structure on the back side, serving as the external electrode for electrical connection between the display packaging module and the external structure. The corresponding electrical connection lines are located inside the packaging substrate, thereby greatly improving the stability of the electrical connection lines and significantly reducing the risk of circuit breakage.

[0042] Furthermore, compared to the drawbacks of flexible circuit board integrated curing solutions, which involve large line lengths leading to high circuit impedance and consequently high device power consumption, the electrical connection lines in the packaging substrate of this invention only need to extend from the front to the back of the packaging substrate. This greatly reduces the length of the corresponding electrical connection lines, thereby significantly reducing the impedance of the electrical connection lines and thus significantly reducing device power consumption.

[0043] In addition, the array-arranged three-dimensional electrical connection structure on the back of the packaging substrate in this embodiment of the invention can improve the connection stability with external structures through its three-dimensional shape, thereby reducing the probability of loose electrical connections and improving the yield of the device.

[0044] To make the above-mentioned objects, features and advantages of the embodiments of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0045] refer to Figures 2 to 5 ,in, Figure 2 This is an exploded view of the display packaging module provided in an embodiment of the present invention. Figure 3 This is an example diagram showing the bonding of a microdisplay chip to a packaging substrate in a display packaging module provided in an embodiment of the present invention. Figure 4 This is a cross-sectional schematic diagram of the display packaging module provided in an embodiment of the present invention. Figure 5 This is a schematic diagram of the back structure of the packaging substrate provided in an embodiment of the present invention.

[0046] The display packaging module includes: Microdisplay chip 20; The packaging substrate 21 includes a front side 21a and a back side 21b. The front side 21a of the packaging substrate 21 is provided with the microdisplay chip 20 and chip contact points 211 electrically connected to the microdisplay chip 20. The back side 21b of the packaging substrate 21 is provided with an array of three-dimensional electrical connection structures 212, which are electrically connected to the chip contact points 211 and serve as external electrodes for electrically connecting the display packaging module to an external structure. An interconnection structure 23 electrically connects the microdisplay chip 20 to the chip contact points on the front side of the packaging substrate 21; The encapsulation layer 24 is located on the front side of the encapsulation substrate 21. The encapsulation layer 24 at least covers the interconnect area where the interconnect structure 23 is located, and exposes the display area 201 of the microdisplay chip 20.

[0047] The display packaging module is a display unit that can be used independently and electrically connected to external devices. The microdisplay chip 20 has a display area 201 and a non-display area 202. The display area 201 is used to house light-emitting devices to realize the chip's light-emitting display, while the non-display area 202 is used to house auxiliary devices, such as driving circuits, to drive the light-emitting devices to emit light.

[0048] Furthermore, the non-display area 202 of the microdisplay chip 20 is further provided with an electrical contact point 203, which is used to electrically connect to the chip contact point 211 of the packaging substrate 21 to achieve electrical connection to the microdisplay chip. In a specific implementation, the electrical contact point can be a solder joint, such as a solder pad or solder ball, etc., which is not limited in this invention.

[0049] The packaging substrate 21 is used to encapsulate the microdisplay chip 20, thereby providing support and protection for the microdisplay chip 20 while connecting the microdisplay chip 20 to the external electrodes of an external circuit board. In a specific implementation, the packaging substrate may include a core board, an insulating dielectric layer and a conductive line layer stacked on the core board, and a surface treatment layer covering the surface of the packaging substrate.

[0050] The core board is used to provide support for the packaging substrate. In specific examples, the core board material can be one or a mixture of the following materials: metal core board, such as copper; ceramic core board, such as aluminum nitride and alumina; organic core board, such as plastic; glass core board or semiconductor material core board, such as silicon carbide, diamond, etc.

[0051] The conductive wiring layer provides electrical connection lines for the chip contact points of the microdisplay chip and the three-dimensional electrical connection structure for electrical connection with external structures, thereby realizing the electrical connection between the microdisplay chip and the external structure. In a specific implementation, the conductive wiring layer may include a redistribution layer, allowing for corresponding wiring arrangements. Specifically, the three-dimensional electrical connection structure electrically connects to the chip contact points based on the redistribution layer. It should be noted that the redistribution layer can be laid out according to actual needs. The insulating dielectric layer ensures the electrical function of the packaging substrate to prevent short circuits, leakage, etc., in the electrical circuits. The surface treatment layer provides protection for the packaging substrate; in some specific examples, the surface treatment layer may be, for example, a solder resist layer.

[0052] In a specific implementation, the front side of the packaging substrate may include a chip area and an interconnect area. The chip area is where the microdisplay chip is disposed, and the interconnect area is where an interconnect structure is disposed. The interconnect structure 23 is used to electrically connect the microdisplay chip to the chip contact points on the front side of the packaging substrate. It is understood that, given that the interconnect structure needs to electrically connect the microdisplay chip (specifically, for example, the electrical contact points of the microdisplay chip), the corresponding interconnect area where the interconnect structure is located also covers the area in the chip used for electrical connection. That is, the interconnect area covers the non-display area of ​​the microdisplay chip; that is, the interconnect area and the chip area have at least partial overlap.

[0053] In a specific device configuration, the front side 21a of the packaging substrate 21 may house the microdisplay chip 20 and chip contact points 211 electrically connected to the microdisplay chip 20. Specifically, the microdisplay chip is disposed in the chip region of the packaging substrate, and the chip contact points are located in the interconnect region of the packaging substrate.

[0054] The microdisplay chip can be fixed in the chip area. For example, a fixing structure can be provided between the microdisplay chip and the packaging substrate to fix the microdisplay chip to the packaging substrate. Specifically, the material of the fixing structure is an adhesive, a metal bonding layer, or a combination thereof. For example, the fixing structure can be a die-attach adhesive, which can bond the microdisplay chip to the packaging substrate. In other examples, the material of the fixing structure can also be other colloids, which can bond the microdisplay chip to the substrate. This invention does not impose specific limitations on this.

[0055] In specific implementations, the shape and size of the fixing structure 22 can be the same as the area of ​​the chip region, so that the fixing structure 22 has the effects of stable adhesion, good heat dissipation, and uniform force distribution. In other embodiments, the fixing structure 22 can also be formed by applying adhesive only in the middle and four corners of the chip region. Correspondingly, the projected area of ​​the fixing structure 22 is smaller than the area of ​​the chip region, so that the fixing structure 22 has the characteristics of less adhesive overflow, low cost, thinner thickness, and suitability for narrow bezels; or the fixing structure 22 can be a bezel die-bonding structure, that is, adhesive is applied only around the edge of the microdisplay chip 20, so that the fixing structure 22 has the effects of good heat dissipation in the middle and no adhesive overflow.

[0056] The chip contact point 211 is used to achieve electrical connection between the packaging substrate 21 and the microdisplay chip 20. In a specific example, the chip contact point 211 can be a solder joint, such as a solder pad or solder ball.

[0057] In some optional examples, to enhance the heat dissipation performance of the packaging substrate, a heat dissipation enhancement structure 213 embedded in or penetrating the packaging substrate may be further provided within the chip region of the packaging substrate. The projection of the heat dissipation enhancement structure 213 onto the packaging substrate may at least cover the display area of ​​the microdisplay chip, or cover the chip region of the packaging substrate, thereby providing better heat dissipation performance for the microdisplay chip. The material of the heat dissipation enhancement structure may be, for example, aluminum, copper, or an alloy of aluminum or copper, or a metal-based composite material such as aluminum silicon carbide (AlSiC), copper / molybdenum (Cu / Mo) composite material, copper / tungsten (Cu / W) composite material, etc.

[0058] The back surface 21b of the packaging substrate 21 is further provided with an array of three-dimensional electrical connection structures 212, which are used to electrically connect to the chip contact points on the front side of the packaging substrate. In a specific implementation, the three-dimensional electrical connection structure can be electrically connected to the chip contact points on the front side of the packaging substrate based on a redistribution layer, or it can be directly connected to the chip contact points, thereby achieving electrical connection with the chip contact points.

[0059] It is understood that the three-dimensional electrical connection structure can improve the connection stability with the external structure through its three-dimensional shape, thereby reducing the probability of loose electrical connections and improving the yield of the device.

[0060] In the specific implementation, refer to Figures 5 to 9 The illustrated back side diagram of the packaging substrate shows a three-dimensional electrical connection structure that is a solder structure protruding from the back side of the packaging substrate (see reference). Figure 5 (212) or electrical plug-in structure (refer to) Figure 6 and Figure 7 212, of which, Figure 6 This is a schematic diagram of another back side structure of the packaging substrate provided in an embodiment of the present invention. Figure 7 Correspondence provided for embodiments of the present invention Figure 6 An exploded view of the display packaging module of the packaging substrate), or, the three-dimensional electrical connection structure is located at the edge of the back side of the packaging substrate and extends to the sidewall of the packaging substrate (see reference). Figure 8 and Figure 9 212, of which, Figure 8 This is another schematic diagram of the back structure of the packaging substrate provided in an embodiment of the present invention. Figure 9 Correspondence provided for embodiments of the present invention Figure 8 (Exploded view of the display packaging module on the packaging substrate).

[0061] Wherein, when the three-dimensional electrical connection structure is a solder structure protruding from the back of the packaging substrate, the three-dimensional electrical connection structure can be a solder ball (refer to...). Figure 5(See section 212). Accordingly, an array of solder balls is provided on the back side of the packaging substrate, thereby using the solder balls as external electrodes to achieve electrical connection with external structures. In a specific implementation, this soldering structure can be arranged around the periphery of the chip area. When a heat dissipation enhancement structure is provided on the packaging substrate, the soldering structure is correspondingly arranged around the periphery of the heat dissipation enhancement structure.

[0062] The three-dimensional electrical connection structure is a three-dimensional pad (reference). Figure 8 and Figure 9 In step 212), the three-dimensional pads can be located at the edge of the back side of the packaging substrate and extend to the sidewall of the packaging substrate. Correspondingly, the three-dimensional pads are arranged in an edge array on the packaging substrate, thereby using the three-dimensional pads as external electrodes to achieve electrical connection with external structures. Correspondingly, the chip area of ​​the packaging substrate is located within the area surrounded by the three-dimensional pads.

[0063] The three-dimensional electrical connection structure is an electrical plug-in structure protruding from the back of the packaging substrate (reference). Figure 6 and Figure 7 In the case of (212), the electrical connection structure can be a pin. Correspondingly, the back side of the packaging substrate is provided with an array of pins, thereby using the pins as external electrodes to achieve electrical connection with external structures. In a specific implementation, the back side of the packaging substrate is also provided with a non-functional electrical connection structure, which is located in the chip area of ​​the packaging substrate, thereby playing a heat dissipation role.

[0064] In a specific implementation, both the invalid electrical connection structure and the electrical connection structure can be regarded as connection structures, which are evenly arranged on the back side of the packaging substrate.

[0065] The interconnect structure is used to realize the electrical connection between the microdisplay chip and the chip contact point. Specifically, the interconnect structure can be, for example, a lead, and the material of the lead can be one or a combination of gold, silver, copper, and aluminum.

[0066] Furthermore, the display packaging module may further include a packaging layer 24, which at least covers the interconnect region where the interconnect structure is located and exposes the display region of the microdisplay chip, thereby protecting the interconnect structure. In a specific implementation, the packaging layer 24 may cover the interconnect region and expose the display region of the microdisplay chip; preferably, refer to... Figure 10 Another exploded view of the display packaging module is shown, in which the packaging layer 24 covers the front side of the packaging substrate except for the display area of ​​the microdisplay chip.

[0067] Specifically, the material of the encapsulation layer 24 can be epoxy resin or acrylate; in specific implementations, the encapsulation layer is formed based on a dispensing process or an injection molding process. When the encapsulation layer covers the interconnect region, it can be formed using a dispensing process; while when the encapsulation layer covers the front side of the encapsulation substrate, excluding the display area of ​​the microdisplay chip, it can be formed using an injection molding process.

[0068] In a further implementation, the display packaging module may further include a transparent cover layer located on the front side of the packaging substrate 21 and covering at least the display area. Since the display area needs to maintain high light transmittance and high flatness optical properties, using a transparent cover layer (e.g., cover glass) to cover the display area can protect the display area while ensuring its light transmittance.

[0069] In a further optional implementation, the display packaging module may further include a color conversion layer covering the display area for converting the original display color of the display area. It is understood that color conversion materials, such as quantum dots, phosphors, or phosphor sheets, can be deposited in the display area to form a color conversion layer, thereby converting the original color (original display color) of the display area into other colors, such as converting original blue light into white light through yellow phosphor.

[0070] This invention also provides a method for forming a display packaging module, used to prepare the display packaging module described in any of the foregoing embodiments.

[0071] refer to Figure 11 The illustration shows a flowchart of a method for forming a display packaging module according to an embodiment of the present invention. The method includes the following steps: Step S100: Provide a packaging substrate and a microdisplay chip, wherein the packaging substrate includes opposing front and back sides; The packaging substrate has chip contact points electrically connected to the microdisplay chip on its front side; an array of three-dimensional electrical connection structures is provided on the back side of the packaging substrate; a redistribution layer is provided between the front and back sides of the packaging substrate, and the three-dimensional electrical connection structures are electrically connected to the chip contact points based on the redistribution layer, serving as external electrodes for electrical connection between the display packaging module and external structures.

[0072] The packaging substrate is used to encapsulate the microdisplay chip 20, thereby providing support and protection for the microdisplay chip 20 while connecting the microdisplay chip 20 to the external electrodes of the external circuit board. The structural features of the packaging substrate can be referred to the foregoing description.

[0073] The microdisplay chip can be, for example, a Micro-LED chip. In a specific example, the microdisplay chip wafer can be sorted to select qualified microdisplay chips and cut, and then the cut microdisplay chips can be transported based on the blue film.

[0074] In a specific implementation, the three-dimensional electrical connection structure in the packaging substrate can be formed independently. Specifically, this step may include the following process: Step S101: Provide an initial packaging substrate, the initial packaging substrate including a front side and a back side; wherein, the micro display chip and chip contact points electrically connected to the micro display chip are disposed on the front side of the initial packaging substrate; The initial packaging substrate provides the basis for forming the packaging substrate. Specifically, in this embodiment of the invention, the front side of the initial packaging substrate has chip contact points electrically connected to the microdisplay chip, and the back side has an array of electrical connection points, which provide the basis for forming a three-dimensional electrical connection structure. Specifically, the electrical connection points can be, for example, pads, so that the three-dimensional electrical connection structure can be formed based on these pads in subsequent steps.

[0075] In a specific implementation, the initial packaging substrate may include a core board, an insulating dielectric layer and a conductive circuit layer stacked on the core board, and a surface treatment layer located on the surface of the packaging substrate. In an optional implementation, the conductive circuit layer may be used as a redistribution layer for corresponding circuit arrangement.

[0076] The initial packaging substrate may include a chip region and an interconnect region. The chip region is used to house the microdisplay chip, and the interconnect region is used to house the interconnect structure. It is understood that, given that the interconnect structure needs to electrically connect the microdisplay chip (specifically, for example, the electrical contact points of the microdisplay chip), the interconnect region also covers the area in the chip used to achieve the electrical connection. That is, the interconnect region and the chip region partially overlap.

[0077] In some optional examples, to enhance the heat dissipation performance of the packaging substrate, a heat dissipation enhancement structure embedded in or penetrating the initial packaging substrate may be further provided within the chip region of the initial packaging substrate. The projection of the heat dissipation enhancement structure onto the initial packaging substrate can at least cover a portion of the chip region of the packaging substrate, thereby providing better heat dissipation performance for the microdisplay chip. The material of the heat dissipation enhancement structure can be, for example, aluminum, copper, or an alloy of aluminum or copper, or a metal-based composite material such as aluminum silicon carbide (AlSiC), copper / molybdenum (Cu / Mo) composite material, copper / tungsten (Cu / W) composite material, etc.

[0078] In a further alternative implementation, this step may also provide the initial packaging substrate based on providing a substrate array unit, wherein, reference Figure 12 Example front view of the substrate array unit shown and Figure 13 The diagram shows an example of the back side of a substrate array unit, which may include multiple initial packaging substrates arranged in an array, thereby enabling batch processing of the packaging process and improving packaging efficiency.

[0079] In optional implementations, when the packaging substrate is a ceramic substrate or an organic substrate, a panelization method can be used for the operation. In other examples, a matrix lead frame or a multi-substrate method can also be used. Furthermore, to prevent displacement or scattering during the cutting process, the packaging substrate can be fixed by attaching a UV film, or by using a dedicated cutting fixture for vacuum adsorption.

[0080] Step S102: A three-dimensional electrical connection structure is formed on the electrical connection point of the initial packaging substrate, and the initial packaging substrate on which the three-dimensional electrical connection structure is formed is used as the packaging substrate.

[0081] The three-dimensional electrical connection structure is used to electrically connect to the chip contact points on the front side of the packaging substrate. In specific implementations, the three-dimensional electrical connection structure can be electrically connected to the chip contact points on the front side of the packaging substrate based on the redistribution layer, or it can be directly connected to the chip contact points, thereby achieving electrical connection with the chip contact points.

[0082] It is understood that the three-dimensional electrical connection structure can improve the connection stability with the external structure through its three-dimensional shape, thereby reducing the probability of loose electrical connections and improving the yield of the device.

[0083] In an optional example, the three-dimensional electrical connection structure is a solder structure protruding from the back of the packaging substrate. Accordingly, this step may include the following process: forming solder balls on the electrical connection point based on a ball-mounting process; heating the solder balls based on a reflow process to fix the solder balls to the packaging substrate, and using the solder balls as the solder structure.

[0084] The size of the solder balls can be selected to match the opening size of the electrical connection point (e.g., the pad). For example, a pad with a diameter of 0.22 mm can be paired with a 0.30 mm solder ball. After the solder balls are attached, the initial package substrate can be placed in a reflow oven and heated using a precisely controlled thermal profile to melt the solder balls and form a strong alloy bond with the initial package substrate.

[0085] It should be noted that the process of forming a three-dimensional electrical connection structure on the electrical connection points of the initial packaging substrate can be performed after the step of forming a packaging layer that at least covers the interconnection area where the interconnection structure is located and exposes the display area of ​​the micro display chip, thereby simultaneously achieving annealing of the display packaging module and improving the overall performance of the display packaging module.

[0086] In an optional example, the three-dimensional electrical connection structure is an electrical plug-in structure protruding from the back of the packaging substrate. Accordingly, this step can specifically be as follows: forming a plug-in groove at the electrical connection point to expose the electrical connection point; fixing a pin in the plug-in groove and using the pin as the electrical plug-in structure; or, based on the injection molding process, fixing a pin on the electrical connection point of the initial packaging substrate and using the pin as the electrical plug-in structure.

[0087] In this process, a socket groove is formed at the electrical connection point. This can be achieved by forming a dielectric layer higher than the plane of the electrical connection point, and further forming the socket groove in the dielectric layer to expose the electrical connection point, thereby further fixing the pin based on the socket groove. This method of forming the socket groove is preferably applicable to ceramic substrates. The corresponding method of fixing the pin can be achieved by soldering or sealing glass to ensure the insulation and hermeticity of the device structure.

[0088] The method of fixing the pins in the injection molding process is preferably suitable for plastic substrates. For example, the insert injection molding process is used to pre-fix the metal pins in the mold and then inject molten resin to make the pins integral with the initial packaging substrate, so as to achieve a low-cost and reliable connection.

[0089] In a further alternative implementation, a protective layer can be formed on the pin surface using surface electroplating treatment (such as nickel-palladium-gold, pure tin, or silver) to prevent pin oxidation and ensure good contact reliability during subsequent PCB socket assembly.

[0090] When the three-dimensional electrical connection structure is a three-dimensional pad, the corresponding packaging substrate can be provided by the preceding process to conform to the structural characteristics.

[0091] Step S110: Electrically connect the microdisplay chip to the chip contact point based on the interconnect structure; The interconnect structure is used to achieve electrical connection between the microdisplay chip and the chip contact point. Specifically, the interconnect structure can be, for example, a lead, and the material of the lead can be one or a combination of gold, silver, and copper.

[0092] In an optional implementation, this step can be implemented based on the following process: Step S111: The microdisplay chip is fixedly mounted on the front side of the packaging substrate based on the fixing structure; The fixing structure is used to fix the microdisplay chip to the packaging substrate.

[0093] Specifically, the material of the fixing structure can be an adhesive, a metal bonding layer, or a combination thereof. For example, the fixing structure can be a die bond adhesive, thereby allowing the microdisplay chip to be bonded to the packaging substrate based on the die bond adhesive. In other examples, the material of the fixing structure can also be other colloids, thereby allowing the microdisplay chip to be bonded based on other colloids. The present invention does not make specific limitations here.

[0094] In a specific implementation, this step can be called die bonding. Specifically, the microdisplay chip is picked up from the blue film and further mounted onto the chip area of ​​the packaging substrate using die bond adhesive. Afterwards, it is baked and cured to secure the microdisplay chip. In an optional implementation, the chip area can be a die pad on the packaging substrate.

[0095] In specific implementations, the shape and size of the fixing structure 22 can be the same as the area of ​​the chip region, so that the fixing structure 22 has the effects of stable adhesion, good heat dissipation, and uniform force distribution. In other embodiments, the fixing structure 22 can also be formed by applying adhesive only in the middle and four corners of the chip region. Correspondingly, the projected area of ​​the fixing structure 22 is smaller than the area of ​​the chip region, so that the fixing structure 22 has the characteristics of less adhesive overflow, low cost, thinner thickness, and suitability for narrow bezels; or the fixing structure 22 can be a bezel die-bonding structure, that is, adhesive is applied only around the edge of the microdisplay chip 20, so that the fixing structure 22 has the effects of good heat dissipation in the middle and no adhesive overflow.

[0096] Step S112: Connect the electrical contact points of the microdisplay chip to the chip contact points based on the interconnect structure.

[0097] The interconnection structure can be a lead wire, and the material of the lead wire can be one or a combination of gold, silver, copper, and aluminum.

[0098] Understandably, in order to achieve electrical signal connection between the microdisplay chip and the packaging substrate, this step can specifically be a wire bonding process, which uses ceramic wedges and ultrasonic energy to interconnect the electrical contacts of the microdisplay chip with the chip contacts one by one.

[0099] In an optional implementation, a cleaning process can be performed after wire bonding to remove contaminants.

[0100] Step S120: Form an encapsulation layer that at least covers the interconnect region where the interconnect structure is located and exposes the display region of the microdisplay chip; The encapsulation layer at least covers the interconnect region where the interconnect structure is located and exposes the display region of the microdisplay chip to protect the interconnect structure. In a specific implementation, the encapsulation layer covers the interconnect region and exposes the display region of the microdisplay chip; or, the encapsulation layer covers the front side of the encapsulation substrate other than the display region of the microdisplay chip.

[0101] The encapsulation layer can be made of epoxy resin or acrylate; in specific implementations, the encapsulation layer is formed using either a dispensing process or an injection molding process. Specifically, the encapsulation layer is formed in the interconnect region using a dispensing process; or, the encapsulation layer is formed on the front side of the encapsulation substrate in areas other than the display area of ​​the microdisplay chip using a molding process.

[0102] Understandably, by completely covering the interconnect area with adhesive dispensing, a dense shell structure can be formed to provide reliable physical protection and electrical insulation. Curing can be performed using methods such as heating or ultraviolet irradiation to promote full cross-linking and curing of the material, ensuring the dimensional stability and long-term reliability of the encapsulation layer.

[0103] For molding processes, the completed packaging substrate is placed into a mold cavity. Resin (such as epoxy molding compound EMC) is injected into the cavity, and the resin is further allowed to fully fill and encapsulate the leads, packaging substrate, and non-display areas (i.e., areas other than the display area) of the microdisplay chip at high temperature. After the mold has cured, it undergoes demolding and then curing and baking to allow the resin to fully cross-link and cure, effectively releasing internal thermal stress and ensuring the stability and long-term reliability of the package.

[0104] It should be noted that, in some optional examples, the three-dimensional electrical connection structure is a welding structure protruding from the back of the packaging substrate. The corresponding welding structure can be formed after the packaging layer is formed, thereby simultaneously realizing the annealing of the display packaging module and improving the overall performance of the display packaging module.

[0105] Furthermore, in an example where an initial packaging substrate is provided using a substrate array substrate, the embodiments of the present invention further cut the substrate array units after forming the packaging layer or after forming the packaging layer and the welding structure to form an independent display packaging module.

[0106] Specifically, the panel can be separated into individual devices through laser cutting or mechanical cutting (such as a dicing machine). After cutting, the individual devices are separated by film expansion or ejector pin pickup to form independent display packaging modules.

[0107] This invention also provides a display device, including a display packaging module as described in any of the foregoing embodiments.

[0108] The display device may include a flexible circuit board assembly, including connection points that are adapted to each three-dimensional electrical connection structure of the display packaging module, for establishing an electrical connection with the display packaging module.

[0109] As can be seen, in the display device provided by the embodiments of the present invention, the display packaging module can be independently manufactured and used independently, possessing the capability to operate independently upon power-up; therefore, the display packaging module can be used separately from the flexible circuit board assembly. When a combined product of the display packaging module and the flexible circuit board assembly is required, the three-dimensional electrical connection structure of the display packaging module can be adapted to the connection points of the flexible circuit board assembly to achieve combined use of the two; when the flexible circuit board assembly is not required, the display packaging module can be provided directly, allowing for flexible design and application in different scenarios; this avoids the limitation of the application scenarios of the display packaging module caused by the integrated use of the two in related technologies.

[0110] This invention also provides a display device, including a display packaging module as described in any of the foregoing embodiments.

[0111] The display device is a device with image / video / information display functions. For example, it can be an AR / VR (Virtual Reality) near-eye display device, a smartwatch display device, a mobile phone display device, an in-vehicle display device, a television display device, a monitor, an industrial control display device, etc.

[0112] This invention also provides an optoelectronic device, including a display packaging module as described in any of the foregoing embodiments.

[0113] The display packaging module can be applied to optoelectronic devices in the optoelectronic field, such as vehicle lights, wearable devices, and lighting equipment.

[0114] This invention also provides a terminal, including a display packaging module as described in any of the foregoing embodiments.

[0115] The terminal is a complete device that is designed for end users and can be used independently, including but not limited to consumer electronics terminals, vehicle terminals, home display terminals, industrial control terminals, medical display terminals, and smart home terminals.

[0116] It should be noted that MicroLED microdisplay chips are devices designed for high-end displays in the future, with their core characteristics lying in chip size and light emission method. Specifically, their chip size can range from 1 to 100 micrometers, with a typical size usually less than 50 micrometers. They achieve self-illumination through the configuration of independent driving circuits, allowing them to display images by forming independent pixels (usually one pixel corresponds to one driving circuit), resulting in ultra-high precision and extremely high speed display characteristics.

[0117] The foregoing describes multiple embodiments of the present invention. The optional methods described in each embodiment can be combined and cross-referenced without conflict, thereby extending to a variety of possible embodiments. These can all be considered as embodiments disclosed or made public by the present invention.

[0118] While the embodiments of the present invention have been disclosed above, the present invention is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the present invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

Claims

1. A display packaging module, characterized in that, include: Micro display chip; The packaging substrate includes a front side and a back side. The front side of the packaging substrate is provided with the microdisplay chip and chip contact points electrically connected to the microdisplay chip. The back side of the packaging substrate is provided with an array of three-dimensional electrical connection structures. A redistribution layer is provided between the front side and the back side of the packaging substrate. The three-dimensional electrical connection structures are electrically connected to the chip contact points based on the redistribution layer, and are used as external electrodes for electrical connection between the display packaging module and external structures. An interconnection structure that electrically connects the microdisplay chip to the chip contact points on the front side of the packaging substrate; The encapsulation layer is located on the front side of the encapsulation substrate, and the encapsulation layer at least covers the interconnect area where the interconnect structure is located, and exposes the display area of ​​the microdisplay chip.

2. The display packaging module as described in claim 1, characterized in that, The three-dimensional electrical connection structure is a welding structure or an electrical plug-in structure protruding from the back of the packaging substrate, or the three-dimensional electrical connection structure is located at the edge of the back of the packaging substrate and extends to the sidewall of the packaging substrate.

3. The display packaging module as described in claim 1 or 2, characterized in that, The encapsulation layer covers the interconnect area and exposes the display area of ​​the microdisplay chip.

4. The display packaging module as described in claim 1 or 2, characterized in that, The encapsulation layer covers the front side of the encapsulation substrate, excluding the display area of ​​the microdisplay chip.

5. The display packaging module as described in claim 1, characterized in that, Also includes: A heat dissipation enhancement structure is embedded in or penetrates the packaging substrate, and the projection of the heat dissipation enhancement structure on the packaging substrate at least covers the display area of ​​the microdisplay chip.

6. The display packaging module as described in claim 1 or 2, characterized in that, The encapsulation layer is epoxy resin or acrylate; The encapsulation layer is formed based on a dispensing process or an injection molding process.

7. The display packaging module as described in claim 1 or 2, characterized in that, Also includes: The fixing structure between the packaging substrate and the microdisplay chip is made of adhesive, metal bonding layer or a combination thereof.

8. The display packaging module as described in claim 1 or 2, characterized in that, The chip area is defined as the area where the microdisplay chip is disposed on the packaging substrate. The three-dimensional electrical connection structure is a welding structure protruding from the back of the packaging substrate, and the welding structure is arranged around the periphery of the chip area; Alternatively, the three-dimensional electrical connection structure is a three-dimensional pad, which is located at the edge of the back side of the packaging substrate and extends to the sidewall of the packaging substrate, and the chip area is located in the area surrounded by the three-dimensional pad; Alternatively, the three-dimensional electrical connection structure is an electrical plug-in structure protruding from the back of the packaging substrate, wherein the back of the packaging substrate is also provided with an invalid electrical plug-in structure, the invalid electrical plug-in structure is located in the chip area, and the invalid electrical plug-in structure and the electrical plug-in structure are evenly arranged as plug-in structures on the back of the packaging substrate.

9. The display packaging module as described in claim 1 or 2, characterized in that, Also includes: A transparent overlay layer covering the display area; And / or, A color conversion layer covering the display area.

10. A method for forming a display packaging module, characterized in that, include: A packaging substrate and a microdisplay chip are provided. The packaging substrate includes a front side and a back side facing each other. The front side of the packaging substrate is provided with chip contact points that are electrically connected to the microdisplay chip. The back side of the packaging substrate is provided with an array of three-dimensional electrical connection structures. A redistribution layer is provided between the front side and the back side of the packaging substrate. The three-dimensional electrical connection structures are electrically connected to the chip contact points based on the redistribution layer, and are used as external electrodes for electrical connection between the display packaging module and an external structure. The microdisplay chip is electrically connected to the chip contact point based on the interconnect structure; An encapsulation layer is formed that at least covers the interconnect region where the interconnect structure is located and exposes the display region of the microdisplay chip.

11. The method for forming a display packaging module as described in claim 10, characterized in that, The provided packaging substrate includes: An initial packaging substrate is provided, the initial packaging substrate including a front side and a back side facing each other; wherein, the front side of the initial packaging substrate is provided with chip contact points electrically connected to the microdisplay chip, and the back side is provided with an array of electrically connected points. A three-dimensional electrical connection structure is formed on the electrical connection point of the initial packaging substrate, and the initial packaging substrate on which the three-dimensional electrical connection structure is formed is used as the packaging substrate.

12. The method for forming a display packaging module as described in claim 11, characterized in that, The three-dimensional electrical connection structure is a welded structure protruding from the back of the packaging substrate. The formation of the three-dimensional electrical connection structure at the electrical connection points of the initial packaging substrate includes: Solder balls are formed at the electrical connection points based on the ball-planting process; The solder balls are heated using a reflow process to fix them to the packaging substrate, and the solder balls serve as the welding structure. The step of forming a three-dimensional electrical connection structure on the electrical connection points of the initial packaging substrate is performed after the step of forming a packaging layer that at least covers the interconnect region where the interconnect structure is located and exposes the display region of the microdisplay chip.

13. The method for forming a display packaging module as described in claim 11, characterized in that, The three-dimensional electrical connection structure is an electrical plug-in structure protruding from the back of the packaging substrate. Specifically, the three-dimensional electrical connection structure is formed at the electrical connection point on the initial packaging substrate. A socket groove is formed at the electrical connection point to expose the electrical connection point; a pin is fixedly installed in the socket groove, and the pin serves as the electrical connection structure. or, Based on the injection molding process, pins are fixedly disposed on the electrical connection points of the initial packaging substrate, and the pins are used as the electrical connection structure.

14. The method for forming a display packaging module as described in claim 10, characterized in that, The encapsulation layer that at least covers the interconnect region where the interconnect structure is located and exposes the display region of the microdisplay chip is formed specifically by forming the encapsulation layer in the interconnect region based on a dispensing process; or by forming the encapsulation layer in other regions on the front side of the encapsulation substrate other than the display region of the microdisplay chip based on a molding process.

15. The method for forming a display packaging module as described in claim 10, characterized in that, The method of electrically connecting the microdisplay chip and the chip contact point based on the interconnect structure includes: The microdisplay chip is fixedly mounted on the front side of the packaging substrate based on a fixing structure; The electrical contacts of the microdisplay chip are connected to the chip contacts based on the interconnect structure.

16. The method for forming a display packaging module as described in claim 11, characterized in that, The step of providing the initial packaging substrate specifically involves providing a substrate array unit, wherein the substrate array unit includes multiple initial packaging substrates arranged in an array. After forming the encapsulation layer that at least covers the interconnect region where the interconnect structure is located and exposes the display region of the microdisplay chip, the method further includes: The substrate array units are cut to form independent display packaging modules.

17. A display device, characterized in that, include: The display packaging module as described in any one of claims 1-9.

18. A display device, characterized in that, Includes the display packaging module as described in any one of claims 1-9.

19. A photoelectric device, characterized in that, Includes the display packaging module as described in any one of claims 1-9.

20. A terminal, characterized in that, Includes the display packaging module as described in any one of claims 1-9.

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