Light emitting display device

Abstract

A light-emitting display device according to one embodiment of the present disclosure may include: a substrate including a display area and a pad area; a pixel circuit layer including pixel circuits disposed in the display area; an outer coating layer disposed in the display area to cover the pixel circuit layer; a light-emitting device layer disposed on the outer coating layer and electrically connected to the pixel circuit; an encapsulation portion disposed on the outer coating layer to cover the light-emitting device layer; and a pad portion disposed in the pad area and electrically connected to the pixel circuit. The outer coating layer may include an extension extending into a wiring area between the display area and the pad area, and at least a portion of the extension of the outer coating layer may have the same thickness as the central portion of the outer coating layer.

Description

[0001] Cross-references to related applications

[0002] This application claims the benefit and priority of Korean Patent Application No. 10-2024-0202143, filed on December 31, 2024, the entire contents of which are incorporated herein by reference for all purposes as if fully set forth herein. Technical Field

[0003] This disclosure relates to light-emitting display devices. Background Technology

[0004] Unlike liquid crystal displays (LCDs), light-emitting displays (LEDs) are self-emissive devices that do not require a separate light source. Therefore, LEDs can be manufactured in a lightweight and thin manner. Furthermore, LEDs are attracting significant attention as a next-generation display device because they are advantageous in terms of power consumption due to their low-voltage operation, and offer excellent color alignment, response speed, viewing angle, and contrast.

[0005] A light-emitting display device displays an image by emitting light through a light-emitting layer containing light-emitting devices inserted between two electrodes. In this case, the light generated based on the emission of the light-emitting devices is emitted to the outside through a substrate or the like. Summary of the Invention

[0006] In light-emitting display devices, an encapsulation portion is provided on the light-emitting device layer to protect it from hydrogen and moisture. The encapsulation portion includes an inorganic layer and an organic layer. The inorganic layer is formed by depositing inorganic materials using a metal mask method. For example, during the process of forming the inorganic layer, mask sagging (or flexing) occurs, and because the weight (or load) of the mask is concentrated in the sagging area, defects such as cracking, extrusion, or dents (or indentations) may appear in the lower layer of the encapsulation portion. Due to such defects, the step cover formed on the upper layer after mask removal may become a weak (or defective) step cover. Hydrogen and moisture can penetrate through such weak points, potentially leading to device (or light-emitting device layer) degradation and reliability problems.

[0007] To address the aforementioned problems, the inventors of this disclosure conducted a variety of continuous experiments and, through these experiments, invented a light-emitting display device with a novel structure that prevents defects such as cracks and / or dents (or indentations) from occurring in the mask contact area where it contacts the drooping portion of the mask.

[0008] One or more aspects of this disclosure aim to provide a light-emitting display device capable of preventing defects such as cracks and / or dents (or indentations) from occurring in the mask contact area that contacts the drooping portion of the mask.

[0009] One or more aspects of this disclosure are intended to provide a light-emitting display device with improved reliability.

[0010] Further features, advantages, and aspects of this disclosure are set forth in part in this disclosure and will also be apparent from it, or may be learned by practicing the inventive concept provided herein. Other features, advantages, and aspects of this disclosure may be realized and obtained from the description provided in or derived therefrom, the claims, and the accompanying drawings.

[0011] To achieve these and other advantages and aspects of this disclosure, as embodied and broadly described herein, in one or more aspects, a light-emitting display device may include: a substrate including a display area and a pad area; a pixel circuit layer including pixel circuitry disposed in the display area; an outer coating layer disposed in the display area to cover the pixel circuit layer; a light-emitting device layer disposed on the outer coating layer and electrically connected to the pixel circuitry; an encapsulation portion disposed on the outer coating layer to cover the light-emitting device layer; and a pad portion disposed in the pad area and electrically connected to the pixel circuitry. The outer coating layer may include an extension extending into a wiring area between the display area and the pad area, and at least a portion of the extension of the outer coating layer may have the same thickness as the central portion of the outer coating layer.

[0012] Details of other exemplary embodiments will be included in the detailed description and accompanying drawings of this disclosure.

[0013] According to one or more embodiments of the present disclosure, the light-emitting display device, by including an extension in which an outer coating extends into a wiring area and is configured such that at least a portion of the extension has the same thickness as the central portion of the outer coating, can support a mask for forming an encapsulation portion without additional processing and can prevent defects such as cracks, extrusions and / or dents (or indentations) from occurring in the contact area between the mask and the extension.

[0014] According to one or more embodiments of this disclosure, the light-emitting display device can uniformly maintain the weight (or load) applied to the extension in the contact area between the mask and the extension by uniformly distributing the thickness of the extension in the wiring area. Therefore, defects such as cracking, compression, and / or dents (or indentations) can be prevented in the wiring area.

[0015] According to one or more embodiments of this disclosure, since defects can be prevented in the contact area between the mask and the extension, weakening (or defects) of the upper step cover subsequently formed after mask removal can be prevented, thereby avoiding weak (or defective) step cover. Therefore, since the moisture permeation path of the light-emitting display device is blocked, the permeation of hydrogen and moisture can be prevented, and the degradation of the light-emitting display device can be prevented.

[0016] According to one or more embodiments of this disclosure, a light-emitting display device with improved reliability can be provided, which can achieve a long lifespan and low-power driving is possible.

[0017] Further systems, methods, features, and advantages will be apparent or will become apparent to those skilled in the art upon review of the following figures and detailed description. All such further systems, methods, features, and advantages are intended to be included within the scope of this description and disclosure, and are protected by the appended claims. Nothing in this section should be construed as limiting these claims. Further aspects and advantages are discussed below in conjunction with various aspects of this disclosure. Attached Figure Description

[0018] The accompanying drawings are included to provide a further understanding of this disclosure, are incorporated in and constitute a part of this disclosure, and illustrate various aspects and embodiments of this disclosure and, together with the description, serve to illustrate the principles of this disclosure. However, the technical features of this embodiment are not limited to those shown in the specific drawings, and the features disclosed in the various drawings may be combined to form new embodiments.

[0019] Figure 1 This is a plan view showing a light-emitting display device according to one embodiment of the present disclosure.

[0020] Figure 2 This is a cross-sectional view showing a light-emitting display device according to one embodiment of the present disclosure.

[0021] Figure 3 It is shown schematically. Figure 2 An enlarged view of part 'A' shown in the image.

[0022] Figure 4 It is shown schematically. Figure 1 An enlarged view of section 'B' shown in the image.

[0023] Figure 5 It is along Figure 4 The cross-sectional view taken from line I-I'.

[0024] Figure 6 It is based on an implementation plan. Figure 4The cross-sectional view taken from line II-II'.

[0025] Figure 7 It is based on another implementation plan. Figure 4 The cross-sectional view taken from line II-II'.

[0026] Figures 8A to 8D This is a diagram showing a defect in the wiring area of ​​a light-emitting display device according to an experimental example.

[0027] Figure 9A and Figure 9B This is a diagram showing the wiring area of ​​a light-emitting display device according to one embodiment of the present disclosure.

[0028] Throughout the accompanying drawings and detailed description, unless otherwise described, the same reference numerals should be understood to refer to the same elements, features, and structures. For clarity, illustration, and convenience, the dimensions, lengths, and thicknesses of layers, regions, and elements, and their depictions, may be enlarged. Detailed Implementation

[0029] The advantages and features of this disclosure, as well as its implementation methods, have been illustrated by referring to the accompanying drawings. However, this disclosure may be embodied in different forms and should not be construed as limited to the exemplary aspects set forth herein. Rather, these exemplary aspects are examples, and their provision enables this disclosure to be detailed and complete to aid those skilled in the art in understanding the inventive concept, without limiting the scope of protection of this disclosure.

[0030] The shapes, dimensions, ratios, angles, and quantities disclosed in the accompanying drawings to describe embodiments of this disclosure are merely examples, and therefore, this disclosure is not limited to the details shown. Throughout the text, similar reference numerals refer to similar elements. In the following description, detailed descriptions of relevant known functions or configurations will be omitted where it is determined that such detailed descriptions would unnecessarily obscure the essence of this disclosure. Furthermore, in the use of the terms "comprising," "having," and "including" as described in this disclosure, additional parts may be added unless "only" is used. Unless otherwise stated, singular terms may include plural forms.

[0031] When interpreting components, they are interpreted as including a range of error, even though no explicit description is provided.

[0032] When describing positional relationships, for example, when the positional relationship between two parts is described as “on top of”, “above”, “below”, “next to”, and “adjacent to”, unless more restrictive terms such as “immediately”, “directly”, or “near” are used, one or more other parts may be located between the two parts.

[0033] When describing temporal relationships, such as when time sequence is described as “after,” “following,” “next,” and “before,” discontinuous situations may be included unless more restrictive terms such as “exactly,” “immediately,” or “directly” are used.

[0034] It should be understood that although the terms “first,” “second,” etc., may be used herein to describe a wide variety of elements, these elements should not be limited by these terms. These terms are used only to distinguish one element from another. For example, without departing from the scope of this disclosure, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element.

[0035] In describing the elements of this disclosure, the terms “first,” “second,” “A,” “B,” “(a),” “(b),” etc., may be used. These terms are intended to distinguish the corresponding element from other elements, and the basis, order, or number of the corresponding elements shall not be limited by these terms. Unless otherwise stated, the expression “connected,” “joined,” or “adhered” to another element or layer means that the element or layer may be directly connected or adhered to another element or layer, or indirectly connected or adhered to another element or layer, with one or more intermediate elements or layers “set” or “inserted” between the elements or layers.

[0036] The term "at least one" should be understood to include any one of the related listed items as well as all combinations of one or more of them. For example, "at least one of the first, second, and third items" means all combinations of items derived from two or more of the first, second, and third items, as well as the first, second, or third item.

[0037] As will be fully understood by those skilled in the art, the features of the various aspects of this disclosure may be combined or integrated with each other in part or in whole, and may interact and be technically driven by each other in a variety of ways. The various aspects of this disclosure may be implemented independently of each other, or may be implemented together in an interdependent relationship.

[0038] In the following, exemplary embodiments of the light-emitting display device according to the present disclosure will be described in detail with reference to the accompanying drawings. For ease of description, the various elements shown in the drawings are at scales different from actual scales, and are therefore not limited to the scales shown in the drawings.

[0039] The light-emitting display device according to one embodiment of this disclosure may be a flexible light-emitting display device, a light-emitting display panel, or a flexible light-emitting display panel, but the embodiments of this disclosure are not limited thereto. For example, the light-emitting display device according to one embodiment of this disclosure may include a complete set of electronic equipment or a complete set of equipment (or a complete set of devices), such as a laptop computer, a television, a computer monitor, an equipment device including a light-emitting display device for a vehicle (or automobile) or another type of device for a vehicle, or a mobile electronic device such as a smartphone or an electronic tablet computer, which are complete products (or end products) including a light-emitting display panel.

[0040] Figure 1 This is a plan view showing a light-emitting display device according to one embodiment of the present disclosure. Figure 2 This is a cross-sectional view showing a light-emitting display device according to one embodiment of the present disclosure.

[0041] Reference Figure 1 and Figure 2 According to one embodiment of the present disclosure, a light-emitting display device (or light-emitting display panel) 10 may include a substrate 100 having a display area DA, a non-display area NDA, a wiring area RA, and a pad area PA.

[0042] The display area DA can be an area for displaying images, and can be a pixel array area, an active area, a pixel array section, a display section, or a screen. For example, the display area DA can be set in the center of a light-emitting display device (or a light-emitting display panel).

[0043] The non-display area NDA can be a region where no image is displayed. The non-display area NDA can be a peripheral region of the display area DA. For example, the non-display area NDA can be implemented to surround the display area DA. For example, the non-display area NDA can include an edge portion of the substrate 100. For example, the non-display area NDA can be a non-display portion, a non-active region, a non-active portion, a peripheral portion, or a peripheral region.

[0044] The wiring area RA can be an extension area extending from one side of the non-display area NDA. The wiring area RA can be an area extending from at least a portion of the long side of one side of the non-display area NDA, thus having a predetermined length along the second direction Y. The wiring area RA can include a plurality of data connection lines. Each of the plurality of data connection lines can electrically connect a plurality of display data pads to the plurality of data lines in a one-to-one correspondence. For example, the wiring area RA can be an extension portion, an amplification portion, a wiring portion, a signal transmission portion, an amplification area, or a signal transmission area.

[0045] The pad area PA can extend from the wiring area RA along the second direction Y. The pad area PA can correspond to a circuit connection portion, circuit connection area, circuit connection segment, or signal input / output area. The pad area PA can include a plurality of display data pads, at least one pixel drive power pad, and a plurality of common power pads.

[0046] According to one embodiment of the present disclosure, the light-emitting display device (or light-emitting display panel) 10 may further include a pixel portion 110, a gate driving circuit 120, and a plurality of pad portions 130.

[0047] The pixel unit 110 can be implemented at the display area DA of the substrate 100, and can display black and white images or color images. For example, the pixel unit 110 can be a pixel layer, a pixel array, a pixel array layer, or a pixel array unit.

[0048] The pixel unit 110 may include a plurality of pixels UP disposed at the display area DA. Each of the plurality of pixels UP may be configured in a separate pixel region provided by a pixel driving line. For example, each of the plurality of pixels UP may be implemented in a separate pixel region provided by a plurality of gate lines GL and a plurality of data lines DL.

[0049] The pixel unit 110 can be configured to include a light-emitting device having a light-emitting structure. For example, the light-emitting structure may include a light-emitting layer (or an organic light-emitting layer), but embodiments of this disclosure are not limited thereto, and the light-emitting structure may include an inorganic light-emitting layer (or an inorganic light-emitting diode).

[0050] Each of the plurality of pixels UP can be configured to implement a black-and-white image or a color image. A pixel UP can be a unit pixel. Each of the plurality of pixels UP can include a plurality of sub-pixels SP. For example, each of the plurality of sub-pixels SP can be implemented in a respective sub-pixel region provided by a pixel driving line. For example, each of the plurality of sub-pixels SP can be implemented in a respective sub-pixel region provided by a plurality of gate lines GL and a plurality of data lines DL. For example, each of the plurality of sub-pixels SP can be configured to implement any one of a plurality of colors (or lights), which implement a color image (or colored light). For example, each of the plurality of sub-pixels SP can be configured to include a light-emitting device implementing any one of red light, green light, blue light, and white light.

[0051] The gate driving circuit 120 can be implemented in a non-display area NDA adjacent to the display area DA and electrically connected to a plurality of gate lines GL. The gate driving circuit 120 can be implemented in a short-side region of the non-display area NDA and electrically connected to a plurality of gate lines GL. For example, the gate driving circuit 120 can be implemented in one or more of a pair of short-side regions of the non-display area NDA and electrically connected to a plurality of gate lines GL.

[0052] According to one embodiment of this disclosure, the gate driving circuit 120 can be directly formed or implemented on the substrate 100 using a thin-film transistor fabrication process based on a GIP (gate in panel) scheme for pixels. For example, the gate driving circuit 120 can be a gate-in-the-panel circuit (or embedded gate circuit) or a gate shift register circuit, but embodiments of this disclosure are not limited thereto.

[0053] According to one embodiment of the present disclosure, the gate drive circuit 120 may include one or more of a first gate drive circuit 120A and a second gate drive circuit 120B.

[0054] The first gate drive circuit 120A can be implemented in the first short side region of the non-display region NDA that is adjacent to the first side (or one side) of the display region DA.

[0055] The second gate drive circuit 120B can be implemented in the second short side region of the non-display region NDA, which is adjacent to the second side (or the other side) of the display region DA opposite to the first side.

[0056] According to one embodiment of the present disclosure, the first gate driving circuit 120A can be electrically connected to one end of each of the plurality of gate lines GL disposed in the pixel portion 110, and the second gate driving circuit 120B can be electrically connected to the other end of each of the plurality of gate lines GL disposed in the pixel portion 110.

[0057] According to another embodiment of this disclosure, the first gate driving circuit 120A can be electrically connected to one end of each odd (or even) gate line among the plurality of gate lines GL disposed in the pixel portion 110, and the second gate driving circuit 120B can be electrically connected to the other end of each even (or odd) gate line among the plurality of gate lines GL disposed in the pixel portion 110.

[0058] A plurality of pad portions 130 can be implemented in the non-display area NDA of the substrate 100. The plurality of pad portions 130 can be electrically connected to pixel circuits and can be electrically connected to gate drive circuits 120. For example, the plurality of pad portions 130 can be electrically connected to pixel drive lines for driving pixel circuits and can be electrically connected to gate drive circuits 120.

[0059] Each of the plurality of pad portions 130 may be configured to have a predetermined interval along a first direction X. Each of the plurality of pad portions 130 may include a plurality of pads 131. For example, each of the plurality of pad portions 130 may include a plurality of display data pads, a plurality of pixel drive voltage pads, a plurality of cathode voltage pads, and a plurality of touch data pads. For example, the first pad portion of the plurality of pad portions 130 connected to the first data line may also include a plurality of gate pads. In addition, the last pad portion of the plurality of pad portions 130 connected to the last data line may also include a plurality of gate pads.

[0060] Each of the plurality of gate pads can be electrically connected to the gate drive circuit 120 via a plurality of gate control signal lines disposed in the wiring region RA. For example, the plurality of gate pads disposed in the first pad portion can be electrically connected to the first gate drive circuit 120A via a plurality of gate control signal lines disposed in the wiring region RA, and the plurality of gate pads disposed in the last pad portion can be electrically connected to the second gate drive circuit 120B via a plurality of gate control signal lines disposed in the wiring region RA.

[0061] According to one embodiment of the present disclosure, the light-emitting display device (or light-emitting display panel) may further include a panel driving circuit section 300.

[0062] The panel driving circuit section 300 (or external panel circuit) can be connected to the pad section 130 of the light-emitting display panel 10. The panel driving circuit section 300 drives a plurality of pixels UP (or emits light) set in the display area DA based on image data supplied from the main driving system, thereby displaying an image corresponding to the image data on the display area DA.

[0063] According to one embodiment, the panel driving circuit section 300 may include a plurality of flexible circuit films 310, a plurality of data driving integrated circuits 330, a printed circuit board 350, a timing control section 370, and a power circuit section 390.

[0064] Each of the plurality of flexible circuit films 310 may have one side edge portion (or input bonding portion) attached to or electrically connected to a printed circuit board 350 using a film attachment process with an anisotropic conductive film. The other side edge portion (or output bonding portion) of each of the plurality of flexible circuit films 310 may be attached to or electrically connected to a plurality of pad portions 130 of the substrate 100 using a film attachment process with anisotropic conductive film. Each of the plurality of flexible circuit films 310 may be bent or folded toward the rear surface of the substrate 100 to surround a side surface (or side face) of the substrate 100. For example, one side edge portion of each of the plurality of flexible circuit films 310 may be disposed on the rear surface of the substrate 100.

[0065] Each of the plurality of data driver integrated circuits 330 can be mounted on each of the plurality of flexible circuit films 310. Each of these data driver integrated circuits 330 can receive pixel data and data control signals provided from the timing control unit 370, and convert the pixel data into analog pixel data signals for each pixel based on the data control signals, so as to supply them to the corresponding data lines. For example, the flexible circuit film 310 and the data driver integrated circuits 330 can be referred to as data driver circuits, etc., but are not limited thereto.

[0066] The printed circuit board 350 can support the timing control unit 370 and the power circuit unit 390, and can transmit signals and power between the components of the panel driving circuit unit 300. For example, the printed circuit board 350 can be attached to the rear surface of the substrate 100 using an adhesive member 360.

[0067] The timing control unit 370 can be mounted on the printed circuit board 350 and can receive image data and timing synchronization signals provided from the main drive system through a user connector provided on the printed circuit board 350. The timing control unit 370 can generate pixel data based on the timing synchronization signals by arranging the image data into a pixel arrangement structure matching the display area DA, and provide the generated pixel data to the corresponding data driver integrated circuit 330. Furthermore, the timing control unit 370 can generate data control signals and gate control signals based on the timing synchronization signals, controlling the driving timing of each of the plurality of data driver integrated circuits 330 through the data control signals, and controlling the driving timing of the first gate drive circuit 120A and the second gate drive circuit 120B through the gate control signals.

[0068] The power circuit section 390 can be mounted on the printed circuit board 350 and can generate various voltages required to display images on the light-emitting display device (or light-emitting display panel) 10 using input power supplied from the outside, and provide the generated voltages to the corresponding circuits.

[0069] According to one embodiment of the present disclosure, the light-emitting display device (or light-emitting display panel) 10 may further include a test circuit section 135 disposed at the pad area PA.

[0070] The test circuit section 135 may include a plurality of test thin-film transistors electrically connected to a plurality of data lines disposed in the pixel section 110, one or more enable signal pads, and one or more test signal pads. During testing performed before the panel driving circuit section 300 is mounted on the substrate 100, each of the plurality of test thin-film transistors can be turned on by an enable signal applied via the enable signal pad, and a test signal applied via the test signal pad can be supplied to each of the plurality of data lines.

[0071] According to one embodiment of the present disclosure, the light-emitting display device (or light-emitting display panel) 10 may further include an encapsulation portion 150 that covers or surrounds the pixel portion 110. The encapsulation portion 150 may be configured to protect the pixel portion 110. For example, the encapsulation portion 150 may be configured to prevent external oxygen or water from penetrating into the light-emitting structure of the pixel portion 110.

[0072] According to one embodiment of the present disclosure, the light-emitting display device (or light-emitting display panel) 10 may further include a touch sensing unit 160.

[0073] The touch sensing unit 160 may be disposed on or provided on the package portion 150. For example, the touch sensing unit 160 may be directly formed or provided at the package portion 150. The touch sensing unit 160 may include a touch sensor for sensing user touch. According to one embodiment of the present disclosure, the touch sensing unit 160 may include a plurality of touch driving electrodes and a plurality of touch sensing electrodes for sensing touch based on a mutual capacitance scheme. According to another embodiment of the present disclosure, the touch sensing unit 160 may include a plurality of touch electrodes (or touch sensing electrodes) for sensing touch based on a self-capacitance scheme.

[0074] According to one embodiment of the present disclosure, the light-emitting display device (or light-emitting display panel) 10 may include a counter substrate 170. According to one embodiment of the present disclosure, the counter substrate 170 may be disposed on the touch sensing unit 160.

[0075] Figure 3 It is shown schematically. Figure 2 An enlarged view of part 'A' shown in the image. Figure 3 It is shown schematically. Figure 1 and Figure 2 The image shows a cross-sectional view of a sub-pixel.

[0076] Reference Figures 1 to 3 According to one embodiment of the present disclosure, a light-emitting display device (or light-emitting display panel) 10 may include a substrate 100, a pixel portion 110, a packaging portion 150, and a touch sensing portion 160.

[0077] The substrate 100 includes thin-film transistors and may be a transistor array substrate, a lower substrate, a base substrate, or a first substrate. For example, the substrate 100 may be a transparent glass substrate or a transparent plastic substrate.

[0078] The pixel unit 110 may include a buffer layer 111, a pixel circuit layer PCL, an outer coating layer 115, and a light-emitting device layer 118.

[0079] A buffer layer 111 may be disposed on the substrate 100. The buffer layer 111 may prevent material from the substrate 100 from diffusing into the transistor during high-temperature processes in the manufacturing process of the thin-film transistor, or it may prevent external water or moisture from penetrating into the light-emitting device layer 118. Optionally, depending on the type and material of the substrate 100, the buffer layer 111 may be omitted.

[0080] The pixel circuit layer PCL can be disposed on the substrate 100. The pixel circuit layer PCL may include pixel circuits PC disposed in the display area DA on the substrate 100. The pixel circuit PC may include driving thin-film transistors (TFTs) disposed in the pixel area on the substrate 100 or on the buffer layer 111.

[0081] A driving thin-film transistor (TFT) may include an active layer (ACT), a gate electrode (GE), a source electrode (SE), and a drain electrode (DE).

[0082] The active layer ACT can be disposed on the substrate 100 or the buffer layer 111. For example, the active layer ACT can contain a metal oxide-based semiconductor material, such as indium gallium zinc oxide (IGZO), but is not limited thereto, and can contain a silicon-based semiconductor material, such as amorphous silicon or polycrystalline silicon. For example, the active layer ACT can be formed in a patterned shape by depositing a semiconductor material on the buffer layer 111, performing a thermal stabilization process (or annealing process), and performing a patterning process of the semiconductor material.

[0083] The active layer ACT may include a source region, a drain region, and a channel region between the source and drain regions. The active layer ACT may be covered by a first insulating layer (or gate insulating layer) 112.

[0084] The first insulating layer 112 may be formed in an island shape only on the channel region of the active layer ACT, or it may be formed to cover the entire front surface of the substrate 100 or the buffer layer 111, including the active layer ACT. The first insulating layer 112 may be configured as an inorganic material, but is not limited thereto, and may also be configured as an organic material.

[0085] The gate electrode GE can be disposed on the first insulating layer 112 to overlap with the channel region of the active layer ACT. The gate electrode GE can be formed of a gate metal material. For example, the gate electrode GE can be formed together with the gate line.

[0086] The gate electrode GE can be covered by a second insulating layer (or interlayer insulating layer) 113. The second insulating layer 113 can be formed on the first insulating layer 112 to cover the gate electrode GE. The second insulating layer 113 can be configured as an inorganic material, but is not limited thereto, and can also be configured as an organic material.

[0087] The source electrode SE can be disposed on the second insulating layer 113 to be electrically connected to the source region of the active layer ACT. The source electrode SE can be electrically connected to the source region of the active layer ACT through contact holes formed in the first insulating layer 112 and the second insulating layer 113 that overlap with the source region of the active layer ACT.

[0088] The drain electrode DE can be disposed on the second insulating layer 113 to be electrically connected to the drain region of the active layer ACT. The drain electrode DE can be electrically connected to the drain region of the active layer ACT through contact holes formed in the first insulating layer 112 and the second insulating layer 113 that overlap with the drain region of the active layer ACT.

[0089] The source electrode SE and drain electrode DE can be formed of source / drain metal materials. For example, the source electrode SE and drain electrode DE can be configured to be the same as or different from the gate electrode GE. The source electrode SE and drain electrode DE can be referenced above. Figure 1 The data lines DL described are formed together.

[0090] The pixel circuit PC may also include at least one switching thin-film transistor and at least one capacitor disposed in the pixel region. The at least one switching thin-film transistor and at least one capacitor may be formed together with the driving thin-film transistor TFT.

[0091] A passivation layer 114 can be disposed above the pixel circuit layer PCL. The pixel circuit PC can be covered by the passivation layer 114. The passivation layer 114 can be configured as an inorganic material, but is not limited thereto, and can also be configured as an organic material. The passivation layer 114 can be omitted.

[0092] An outer coating 115 can be provided at the display area DA. The outer coating 115 can cover the pixel circuit layer PCL. The outer coating 115 can cover the pixel circuit PC or the passivation layer 114. For example, the outer coating 115 can planarize the upper surface of the pixel circuit PC or the passivation layer 114 and can be configured to protect the pixel circuit PC. The outer coating 115 can be configured as an organic material. For example, the outer coating 115 can be formed from organic materials including acrylic resins, epoxy resins, phenolic resins, polyamide resins, or polyimide resins.

[0093] A light-emitting device layer 118 can be disposed on the outer coating layer 115. The light-emitting device layer 118 can be electrically connected to a driving thin-film transistor (TFT) or a pixel circuit (PC) on the outer coating layer 115.

[0094] The light-emitting device layer 118 may include a first electrode 118a, a light-emitting device 118b, and a second electrode 118c.

[0095] The first electrode 118a can be disposed on the outer coating 115 in a patterned shape. The first electrode 118a can be electrically connected to the source electrode SE of the driving thin film transistor TFT through electrode contact holes formed in the outer coating 115.

[0096] The first electrode 118a can be an anode (or cathode). For example, when the light-emitting display device 10 according to one embodiment of the present disclosure has a top-emitting structure, the first electrode 118a can be a reflective electrode that reflects light. When the light-emitting display device 10 according to another embodiment of the present disclosure has a bottom-emitting structure, the first electrode 118a can be a transparent electrode that transmits light.

[0097] A light-emitting device 118b can be disposed on the first electrode 118a. The light-emitting device 118b may include one or more light-emitting structures stacked on the first electrode 118a in the order of hole layer, light-emitting layer, and electron layer, or in reverse order. For example, the light-emitting device 118b may be implemented to generate color light corresponding to the respective sub-pixel. For example, when a unit pixel includes a red sub-pixel, a green sub-pixel, and a blue sub-pixel, the light-emitting device 118b of the red sub-pixel can generate red light, the light-emitting device 118b of the green sub-pixel can generate green light, and the light-emitting device 118b of the blue sub-pixel can generate blue light.

[0098] A second electrode 118c can be disposed on the light-emitting device 118b. The second electrode 118c can be disposed on the light-emitting device 118b facing the first electrode 118a, wherein the light-emitting device 118b is located between the second electrode 118c and the first electrode 118a.

[0099] The second electrode 118c can be a cathode (or anode). For example, when the light-emitting display device 10 according to one embodiment of the present disclosure has a top-emitting structure, the second electrode 118c can be a transparent electrode that transmits light. When the light-emitting display device 10 according to another embodiment of the present disclosure has a bottom-emitting structure, the second electrode 118c can be a reflective electrode that reflects light.

[0100] According to one embodiment of the present disclosure, the light-emitting display device 10 may further include a dam 117.

[0101] The dam 117 can define the opening portion (or light-emitting area) of the sub-pixel SP and can be configured to cover the edge portion of the first electrode 118a. For example, the dam 117 can be disposed on the outer coating 115 to cover only the edge portion of the first electrode 118a except for the central portion. For example, the dam 117 can be formed of organic or inorganic materials and can contain a light-absorbing material containing black pigment.

[0102] The light-emitting device 118b may be disposed only in the opening portion provided by the dike 117 in each sub-pixel SP, or it may be disposed on both the dike 117 and the opening portion of each sub-pixel SP.

[0103] The encapsulation portion (or encapsulation layer) 150 can be configured to cover or surround the pixel portion 110. For example, the encapsulation portion 150 can be disposed on the light-emitting device layer 118 and can cover or surround the light-emitting device layer 118.

[0104] The encapsulation portion 150 may include one or more encapsulation portions. For example, the encapsulation portion 150 may include one or more inorganic material layers and one or more organic material layers on the light-emitting device layer 118. For example, the encapsulation portion 150 may include a first encapsulation portion 151, a second encapsulation portion 152, and a third encapsulation portion 153.

[0105] A first encapsulation portion 151 may be disposed on the second electrode 118c. A second encapsulation portion 152 may be disposed on the second electrode 118c or on the first encapsulation portion 151. A third encapsulation portion 153 may be disposed on the second electrode 118c or on the second encapsulation portion 152. For example, an encapsulation portion 150 may include a first encapsulation portion 151 on the second electrode 118c, a second encapsulation portion 152 on the first encapsulation portion 151, and a third encapsulation portion 153 on the second encapsulation portion 152. For example, the first encapsulation portion 151 and the third encapsulation portion 153 may be inorganic material layers, and the second encapsulation portion 152 may be an organic material layer.

[0106] According to one embodiment of the present disclosure, the light-emitting display device (or light-emitting display panel) 10 may further include a touch sensing unit 160 disposed on the display area DA of the substrate 100.

[0107] The touch sensing unit 160 may be provided on the package portion 150. For example, the touch sensing unit 160 may be provided on the third package portion 153 of the package portion 150.

[0108] The touch sensing unit 160 may include a touch buffer layer 161, a first touch electrode layer 163, a touch insulating layer 165, a second touch electrode layer 167, and a touch protective layer 169.

[0109] The touch buffer layer 161 may be disposed on the third encapsulation portion 153 of the encapsulation portion 150. For example, the touch buffer layer 161 may be formed of an inorganic material, but is not limited thereto.

[0110] The first touch electrode layer 163 may include a plurality of first touch electrodes TE1 disposed on the touch buffer layer 161. The plurality of first touch electrodes TE1 may be made of transparent metal or opaque metal. For example, the plurality of first touch electrodes TE1 may be a plurality of bridging electrodes or a plurality of bridging wires, but are not limited thereto.

[0111] A touch insulating layer 165 may be disposed on the touch buffer layer 161 to cover the first touch electrode layer 163. The touch insulating layer 165 may be formed of an inorganic material, but is not limited thereto.

[0112] The second touch electrode layer 167 may include a plurality of second touch electrodes TE2 disposed on the touch insulating layer 165. The plurality of second touch electrodes TE2 may be made of transparent or opaque metal. For example, each of the plurality of second touch electrodes TE2 may include a mesh structure. For example, the plurality of second touch electrodes TE2 may be a plurality of touch sensing electrodes or a plurality of touch driving electrodes, but are not limited thereto.

[0113] In the second touch electrode layer 167, each of the plurality of second touch electrodes TE2 arranged adjacent to each other in the first direction X or the second direction Y can be connected to each of the plurality of first touch electrodes TE1 through a through-hole provided in the touch insulating layer 165. Therefore, each of the plurality of second touch electrodes TE2 arranged adjacent to each other in the first direction X or the second direction Y can be connected to each other through the plurality of first touch electrodes TE1. For example, the plurality of second touch electrodes TE2 arranged adjacent to each other in the second direction Y can be connected to each other through the plurality of first touch electrodes TE1.

[0114] A touch protective layer 169 may be disposed on the touch insulating layer 165 to cover the second touch electrode layer 167. The touch protective layer 169 may be configured to planarize the upper surface of the touch sensing unit 160 and protect the touch sensing unit 160. The touch protective layer 169 may be formed of an organic material, but is not limited thereto.

[0115] The light-emitting display device (or light-emitting display panel) 10 according to one embodiment of the present disclosure may further include a counter substrate 170. The counter substrate 170 according to one embodiment of the present disclosure may be disposed on the touch sensing unit 160.

[0116] Figure 4 It is shown schematically. Figure 1 An enlarged view of section 'B' shown in the image.

[0117] Reference Figure 1 and Figure 4 According to one embodiment of the present disclosure, a light-emitting display device (or light-emitting display panel) 10 may include a plurality of wiring portions RLP disposed between each of a plurality of pad portions 130 and a display area DA.

[0118] A plurality of wiring portions RLPs can be configured to electrically connect each of the pixel portion 110 and the touch sensing portion 160 to the pad portion 130. Each of the plurality of wiring portions RLPs can be disposed in the wiring area RA between the display area DA and the pad area PA of the substrate 100.

[0119] Each of the plurality of wiring sections RLP may include a plurality of display wiring RL and a plurality of touch wiring TRL.

[0120] Multiple display wirings RL can be disposed in wiring area RA to electrically connect to multiple data lines disposed in display area DA of substrate 100 and to multiple display data pads 131 disposed in pad portion 130. The first end of each of the multiple display wirings RL can be electrically connected to the end of each of the multiple data lines DL in the area outside display area NDA. The second end of each of the multiple display wirings RL can be electrically connected to each of the multiple display data pads 131 in pad area PA. For example, each of the multiple display wirings RL can be a data wiring or a first wiring.

[0121] Multiple touch wirings TRL can be electrically connected to touch lines TL extending from multiple second touch electrodes TE2 disposed in the touch sensing unit 160. The first end of each of the multiple touch wirings TRL can be electrically connected to the end of each of the multiple touch lines TL in the region on one side of the non-display area NDA. The second end of each of the multiple touch wirings TRL can be electrically connected to multiple touch data pads 131 in the pad area PA. For example, multiple display wirings RL and multiple touch wirings TRL can be disposed in different layers. For example, each of the multiple touch wirings TRL can be disposed between two or more adjacent display wirings in the multiple display wirings RL, but is not limited thereto. For example, each of the multiple touch wirings TRL can be a second wiring.

[0122] Figure 5 It is along Figure 4 The cross-sectional view taken from line I-I'. Figure 6 It is based on an implementation plan. Figure 4 The cross-sectional view taken from line II-II'. Figure 5 and Figure 6 Based on the above reference Figures 1 to 4 A cross-sectional view of one embodiment of this disclosure is described. Therefore, in the following description, the same components (or elements) are briefly described or omitted.

[0123] Reference Figure 1 and Figures 3 to 6 According to one embodiment of the present disclosure, a light-emitting display device (or light-emitting display panel) 10 may include a buffer layer 111, a first insulating layer 112, a second insulating layer 113, a data line DL, a display wiring RL, a pad 131, a passivation layer 114, an outer coating layer 115, a pad protection layer 195, a package portion 150, a touch wiring TRL, a touch protection layer 169, and a cover layer 180.

[0124] Buffer layer 111, first insulating layer 112, and second insulating layer 113 can be sequentially stacked on the entire surface of substrate 100. Because buffer layer 111, first insulating layer 112, and second insulating layer 113 are... Figure 3 The same applies, and therefore detailed descriptions will be omitted.

[0125] The data line DL can be configured in the same layer as the source electrode SE and the drain electrode DE, and can extend from the display area DA of the substrate to the non-display area NDA.

[0126] Display wiring RL can be provided in wiring area RA. For example, display wiring RL can be the first wiring. Display wiring RL can be electrically connected to pixel unit 110 provided in display area DA of substrate 100. Display wiring RL can be provided between data line DL and panel driving circuit unit 300. The first end of each of the display wiring RL can be electrically connected to the end of each of the plurality of data lines DL in the area on one side of non-display area NDA.

[0127] Pad 131 can be disposed in pad area PA. Pad 131 can be a pad electrode disposed in pad section 130. Pad 131 can contain the same material as source electrode SE and drain electrode DE, and can be formed using the same process.

[0128] The passivation layer 114 can extend from the display area DA and can be disposed in the non-display area NDA and the wiring area RA. The passivation layer 114 can be configured on the data line DL and the display wiring RL. The passivation layer 114 can be configured to cover the data line DL and the display wiring RL. The passivation layer 114 can be configured to protect the data line DL and the display wiring RL.

[0129] The outer coating 115 can be disposed in the display area DA and the non-display area NDA of the substrate 100. The outer coating 115 can be disposed in the display area DA and the non-display area NDA between the display area DA and the wiring area RA. The outer coating 115 can be formed on the passivation layer 114 disposed in the display area DA and the non-display area NDA.

[0130] The outer coating 115 may include an extension 115E extending into a wiring region RA between the display region DA and the pad region PA. The extension 115E of the outer coating 115 may extend from the wiring region RA in a direction from the end of the package portion 150 toward the pad region PA. The extension 115E may extend past the end of the package portion 150 and into the wiring region RA. For example, the extension 115E of the outer coating 115 may extend from the end of the package portion 150 in a direction toward the pad region PA, pass past the end of the package portion 150, and enter the wiring region RA.

[0131] At least a portion of the extension 115E of the outer coating 115 may have the same thickness T2 as the central portion of the outer coating 115. For example, the thickness T1 (or the longest distance) between the upper surface of the central portion of the outer coating 115 and the substrate 100 may be the same as the thickness T2 (or the longest distance) between the upper surface of the extension 115E and the substrate 100.

[0132] The wiring region RA on the substrate 100 may include a first wiring region RA1 and a second wiring region RA2. The first wiring region RA1 may be a region adjacent to the display region DA. The first wiring region RA1 may be a region adjacent to the non-display region NDA. The second wiring region RA2 may be a region extending from the first wiring region RA1. The second wiring region RA2 may be a region between the first wiring region RA1 and the pad region PA.

[0133] like Figure 1 As shown, the substrate 100 may include a first side S1 and a second side S2 that are parallel to each other. The first side S1 and the second side S2 may be arranged parallel to each other along a first direction X. The first side S1 and the second side S2 may each be a first short side and a second short side of the non-display area NDA.

[0134] The extension 115E of the outer coating 115 can have a uniform thickness in the first wiring region RA1. For example, the extension 115E of the outer coating 115 can have the same thickness T1 throughout (or overall) the first wiring region RA1.

[0135] The extension portion 115E of the outer coating 115 can have a uniform thickness between the first side S1 and the second side S2 of the substrate 100. For example, the extension portion 115E of the outer coating 115 can have the same thickness throughout (or overall) the region between the first side S1 and the second side S2. For example, the extension portion 115E can have a linear shape corresponding to the entire region of the first wiring region RA1 between the first side S1 and the second side S2 of the substrate 100 and can have the same thickness throughout (or overall). The extension portion 115E can have a thickness that decreases from the boundary portion BP2 between the first wiring region RA1 and the second wiring region RA2 toward the pad region PA. For example, the extension portion 115E can have a thickness that gradually becomes thinner from the boundary portion BP2 toward the pad region PA.

[0136] The extension portion 115E of the outer coating 115 may include a first extension portion 115E1 disposed in the first wiring region RA1 and a second extension portion 115E2 disposed in the second wiring region RA2.

[0137] The first extension portion 115E1 may have a thickness T2 throughout (or in general) the first wiring region RA1.

[0138] The second extension 115E2 may have a thickness that decreases from the boundary portion BP2 between the first wiring region RA1 and the second wiring region RA2 toward the pad region PA. The second extension 115E2 may include a curved portion extending from the boundary portion BP2 between the first wiring region RA1 and the second wiring region RA2 to the upper surface 113f of the second insulating layer (or interlayer insulating layer) 113. For example, the second extension 115E2 may be configured to have a thickness that decreases from the first extension 115E1 toward the upper surface 113f of the second insulating layer (or interlayer insulating layer) 113.

[0139] Pad protector 195 may cover one side of pad 131. Pad protector 195 may cover one side of pad 131 adjacent to the routing area RA. Pad protector 195 may contain the same material as outer coating 115 and may be formed using the same process. Pad protector 195 may have the same thickness as outer coating 115 and extension 115E or a smaller thickness. Pad protector 195 may be configured to protect one side of pad 131 adjacent to the routing area RA.

[0140] The package portion 150 may be disposed on the outer coating 115. The package portion 150 may be disposed in the display area DA and the non-display area NDA. The end of the package portion 150 may be located at or aligned with the boundary portion BP1 between the display area DA and the wiring area RA. The package portion 150 may not be disposed in the wiring area RA. The end of the package portion 150 may not overlap with the wiring area RA. The extension portion 115E of the outer coating 115 may extend from the end of the package portion 150 along the direction Y toward the pad area PA, and enter the wiring area RA through the end of the package portion 150. For example, the extension portion 115E of the outer coating 115 may extend from the end of the package portion 150 along the short side length direction Y of the substrate 100, and enter the wiring area RA through the end of the package portion 150.

[0141] The encapsulation portion 150 may include a first encapsulation portion 151 and a third encapsulation portion 153. On the side of the display area DA adjacent to the non-display area NDA, the first encapsulation portion 151 may be disposed on the outer coating 115. On the side of the display area DA adjacent to the non-display area NDA, the third encapsulation portion 153 may be disposed on the first encapsulation portion 151. The first encapsulation portion 151 and the third encapsulation portion 153 may contain the same material. For example, the first encapsulation portion 151 and the third encapsulation portion 153 may contain an inorganic insulating material.

[0142] According to one embodiment of this disclosure, the first package portion 151 and the third package portion 153 can be formed using chemical vapor deposition (CVD). For example, the first package portion 151 and the third package portion 153 of the substrate 100 can be formed by positioning a mask that exposes one end of the display area DA and the non-display area NDA on the upper surface of the extension portion 115E of the outer coating 115 disposed in the first wiring region RA1, and depositing an inorganic insulating material.

[0143] According to one embodiment of this disclosure, the extension portion 115E of the outer coating 115 disposed in the first wiring region RA1 can have a uniform thickness in the first wiring region RA1 of the substrate 100 and between the first side S1 and the second side S2. Therefore, in the process of positioning the mask to form the first package portion 151 and the third package portion 153, the weight (or load) of the mask can be uniformly applied to the entire upper surface of the extension portion 115E of the outer coating 115. Therefore, in the light-emitting display device 10, defects such as cracking, squeezing, or dents (or indentations) caused by foreign particles can be prevented.

[0144] For example, when the extension 115E of the outer coating 115 does not have a uniform thickness, foreign particles may be present in the thicker portion, and when a mask is positioned on the thicker portion of the extension 115E of the outer coating 115, the weight (or load) of the mask may be concentrated on the portion with foreign particles, thereby causing defects such as dents (or indentations) caused by foreign particles on the upper surface of the extension 115E of the outer coating 115.

[0145] According to one embodiment of this disclosure, the light-emitting display device 10 can uniformly (or equally) maintain the thickness of the extension 115E of the outer coating 115 extending into the first wiring region RA1, thereby increasing the contact area between the extension 115E of the outer coating 115 and the mask and uniformly maintaining the weight (or load) of the mask. Therefore, during the formation process of the encapsulation portion of the light-emitting display device 10, defects such as cracking, extrusion, or dents (or indentations) caused by foreign particles or the weight (or load) of the mask on the upper surface of the extension 115E of the outer coating 115 can be prevented.

[0146] According to one embodiment of this disclosure, in the light-emitting display device 10, since defects such as cracking, extrusion, or dents (or indentations) caused by foreign particles or the weight (or load) of the mask on the upper surface of the extension portion 115E of the outer coating 115 can be prevented, weakening (or defects) of the upper layer step coverage formed after the encapsulation portion 150 can be prevented. Therefore, in the light-emitting display device 10, since moisture penetration paths from the outside can be blocked, hydrogen and moisture penetration into the display panel can be prevented, and deterioration of the light-emitting display device can be prevented. Therefore, the reliability of the light-emitting display device can be improved, a long lifespan can be achieved, and low-power driving is possible.

[0147] According to one embodiment of the present disclosure, the light-emitting display device 10, through an extension 115E extending from an outer coating 115 to a wiring region RA and configured such that at least a portion of the extension 115E has the same thickness as the central portion of the outer coating 115, can support a mask for forming an encapsulation portion 150 without additional processing and can prevent defects such as cracking, extrusion and / or dents (or indentations) from occurring in the contact area between the mask and the extension 115E.

[0148] According to one embodiment of the present disclosure, the light-emitting display device 10 may further include a plurality of touch electrodes TE.

[0149] Multiple touch electrodes TE can be referenced above. Figure 3 The second touch electrode layer 167 is described. A plurality of touch electrodes TE may be disposed in the display area DA of the substrate 100 and on one side of the non-display area NDA of the substrate 100 adjacent to the wiring area RA.

[0150] According to one embodiment of the present disclosure, the light-emitting display device 10 may further include a plurality of touch wiring lines (TRLs). The plurality of touch wiring lines (TRLs) may be disposed in the wiring region RA and the pad region PA of the substrate 100. The plurality of touch wiring lines (TRLs) may be disposed between the touch electrodes TE and the pad portion 130. The plurality of touch wiring lines (TRLs) can electrically connect the plurality of touch electrodes TE to the pad portion 130. A first end of each of the plurality of touch wiring lines (TRLs) may be connected to each of the plurality of touch electrodes TE. A second end may be connected to the upper surface of each of the plurality of pads 131 disposed in the pad portion 130.

[0151] Each of the plurality of touch wiring TRLs may pass through the upper surface of the extension 115E of the outer coating 115. For example, each of the plurality of touch wiring TRLs may pass through (or through) the upper surface of the extension 115E of the outer coating 115 and may be electrically connected to a corresponding touch data pad in a plurality of touch data pads 131. For example, the extension 115E of the outer coating 115 may support the plurality of touch wiring TRLs. A portion of each of the plurality of touch wiring TRLs may be in direct contact with the upper surface of the extension 115E of the outer coating 115. Each of the plurality of touch wiring TRLs may be in direct contact with the second insulating layer 113 in a portion of the wiring region RA. For example, each of the plurality of touch wiring TRLs may be in direct contact with the second insulating layer 113 in the second wiring region RA2.

[0152] Each of the plurality of touch wiring TRLs can be spaced apart from the plurality of display wiring RLs, wherein the extension 115E of the outer coating 115 is located between the plurality of touch wiring TRLs and the plurality of display wiring RLs. The extension 115E of the outer coating 115 can protect the display wiring RLs and electrically insulate the plurality of touch wiring TRLs from the display wiring RLs.

[0153] According to one embodiment of the present disclosure, the light-emitting display device 10 may further include a touch protective layer 169 and a cover layer 180.

[0154] The touch protection layer 169 may be disposed on at least a portion of the display area DA and the non-display area NDA adjacent to the wiring area RA. The touch protection layer 169 may cover a plurality of touch electrodes TE. The touch protection layer 169 may cover a second touch electrode layer 167.

[0155] Cover layer 180 can cover the wiring area RA and the pad area PA. Cover layer 180 can be disposed on a plurality of touch wiring TRLs. Cover layer 180 can protect the plurality of touch wiring TRLs. For example, cover layer 180 can contain the same material as touch protection layer 169 and can be formed using the same process.

[0156] Figure 7 It is based on another implementation plan. Figure 4 The cross-sectional view taken from line II-II'. Figure 7 The above reference is shown. Figure 6 The description describes a modified embodiment of the outer coating extension according to one embodiment of this disclosure. Therefore, in the following description, redundant descriptions of elements other than the outer coating extension and related elements will be omitted or briefly described.

[0157] Reference Figure 1 , Figures 3 to 5 and Figure 7 In another embodiment of the light-emitting display device 10 according to the present disclosure, the extension portion 115E of the outer coating 115 may include a plurality of protrusions 115Ea disposed in a first wiring region RA1 of the wiring region RA.

[0158] A plurality of protrusions 115Ea may be arranged parallel to each other along a first direction X of the substrate 100. Each of the plurality of protrusions 115Ea may be configured to have a predetermined first interval D1 along the first direction X of the substrate 100. Each of the plurality of protrusions 115Ea may be configured to have a predetermined first interval D1 along a direction from the first side S1 of the substrate 100 toward the second side S2.

[0159] Each of the plurality of protrusions 115Ea may have the same thickness T2 as the central portion of the outer coating 115 disposed in the display area DA. Each of the plurality of protrusions 115Ea may have the same thickness T2 as each other. For example, the thickness T2 from the substrate 100 to the upper surface of each of the plurality of protrusions 115Ea may be the same. For example, the distance (or longest distance) between the upper surface of each of the plurality of protrusions 115Ea and the substrate 100 may be the same.

[0160] According to one embodiment of the present disclosure, the light-emitting display device 10 may further include a plurality of touch wiring TRLs.

[0161] Each of the plurality of touch wiring TRLs may pass through the upper surface of the extension 115E of the outer coating 115. Each of the plurality of touch wiring TRLs may pass through the upper surface of the protrusion 115Ea. For example, the protrusion 115Ea may support the plurality of touch wiring TRLs. A portion of each of the plurality of touch wiring TRLs may be in direct contact with the protrusion 115Ea. Each of the plurality of touch wiring TRLs may pass through (or through) the upper surface of the protrusion 115Ea disposed at the extension 115E of the outer coating 115 and may be electrically connected to a corresponding touch data pad in a plurality of touch data pads. Each of the plurality of touch wiring TRLs may be in direct contact with the second insulating layer 113 at a portion of the wiring region RA. For example, each of the plurality of touch wiring TRLs may be in direct contact with the second insulating layer 113 at the second wiring region RA2.

[0162] Each of the plurality of touch wires TRL can be spaced apart from the plurality of display wires RL, wherein a plurality of protrusions 115Ea are located between the plurality of touch wires TRL and the plurality of display wires RL. The plurality of protrusions 115Ea can protect the display wires RL and electrically insulate the plurality of touch wires TRL from the display wires RL.

[0163] According to another embodiment of this disclosure, the light-emitting display device 10 may include a plurality of protrusions 115Ea disposed (or formed) on an extension 115E of the outer coating 115 with the same thickness (or identical thickness). Therefore, in the process of positioning the mask to form the first encapsulation portion 151 and the third encapsulation portion 153, the weight (or load) of the mask can be uniformly distributed or dispersed across the entire upper surface of each of the plurality of protrusions 115Ea. Thus, in the light-emitting display device 10, defects such as cracking, squeezing, or dents (or indentations) caused by foreign particles can be prevented.

[0164] According to another embodiment of this disclosure, the light-emitting display device 10 may include a plurality of protrusions 115Ea having the same thickness, which can prevent weakening (or defects) of the upper step coverage formed after the encapsulation portion 150. Therefore, in the light-emitting display device 10, since the penetration path of moisture from the outside can be blocked, hydrogen and moisture can be prevented from penetrating into the display panel, and the degradation of the light-emitting display device can be prevented. Thus, the reliability of the light-emitting display device can be improved, a long lifespan can be achieved, and low-power driving is possible.

[0165] Figures 8A to 8D This is a diagram showing a defect in the wiring area of ​​a light-emitting display device according to an experimental example. Figures 8A to 8D This is a diagram showing defects appearing in the wiring area of ​​a light-emitting display device where the thickness of the extended portion of the outer coating is uneven. Figure 8A It is a plan view showing the wiring area, and Figures 8B to 8D This is a cross-sectional view showing the area where defects have already appeared. Figure 8A In the diagram, the circles indicated by dashed lines represent areas with existing dents (or indentations), while the areas marked in black represent areas containing foreign particles. Figures 8B to 8D In the diagram, the portion indicated by the dashed arrow is the part that serves as the penetration path.

[0166] Reference Figures 8A to 8DIt can be determined that mask-induced dent defects occur in the wiring area of ​​a light-emitting display device where the thickness of the extended portion of the outer coating is not uniformly distributed. For example, in the case of uneven thickness of the extended portion, the weight (or load) of the mask positioned above the thicker portion of the extended portion may be concentrated in the thicker portion compared to the thinner portion. In this case, foreign particles present on the mask may be concentrated in large quantities in the thicker region of the extended portion, making foreign particle defects possible, or mask dent defects (or indentation defects) may occur in the thicker portion where the weight (or load) of the mask is concentrated. Furthermore, when an upper layer (or upper film) is formed on the portion where dent defects (or indentation defects) occur, it can be determined that the step coverage of the upper layer is weakened (or defective). For example, it can be determined that cracks occur in the upper layer (or upper film) of the portion where dent defects (or indentation defects) occur. Such weak (or defective) portions or cracks may become pathways for moisture penetration and may cause degradation and reliability problems in the light-emitting display device.

[0167] Figure 9A and Figure 9B This is a diagram showing the wiring area of ​​a light-emitting display device according to one embodiment of the present disclosure. Figure 9A and Figure 9B The thickness of the extended portion of the outer coating is as shown in the reference above. Figures 1 to 6 A diagram of the wiring area of ​​the uniformly configured light-emitting display device. Figure 9A It is a plan view showing the wiring area, and Figure 9B This is a diagram showing a cross-section of the wiring area.

[0168] Reference Figure 9A and Figure 9B In the wiring area of ​​a light-emitting display device according to one embodiment of the present disclosure, where the thickness of the extended portion of the outer coating is uniformly configured, it can be determined that no dents (or indentations) caused by the mask are present. Therefore, it can be determined that the upper layer (or upper film) is uniformly formed. Therefore, in a light-emitting display device according to one embodiment of the present disclosure, a path that can block moisture penetration can be determined, and the degradation and reliability problems of the light-emitting display device can be improved.

[0169] The light-emitting display device according to one embodiment of this disclosure can be applied to or included in mobile devices, video phones, smartwatches, watch phones, wearable devices, foldable devices, rollable devices, bendable devices, flexible devices, bending devices, sliding devices, variable devices, electronic notebooks, e-books, portable multimedia players (PMPs), personal digital assistants (PDAs), MP3 players, mobile medical devices, desktop personal computers (PCs), laptops, netbooks, workstations, navigation devices, car navigation devices, car display devices, automotive equipment, theater equipment, theater display devices, televisions, wallpaper display devices, signage devices, game consoles, laptops, monitors, cameras, camcorders, and home appliances, etc.

[0170] It will be apparent to those skilled in the art that various modifications and variations can be made to this disclosure without departing from the spirit or scope thereof. Therefore, this disclosure is intended to cover such modifications and variations as long as they fall within the scope of the claims and their equivalents.

Claims

1. A light-emitting display device, comprising: The substrate includes the display area and the pad area; A pixel circuit layer, including pixel circuits, is configured in the display area; An outer coating layer is configured in the display area to cover the pixel circuit layer; A light-emitting device layer disposed on the outer coating and electrically connected to the pixel circuit; An encapsulation portion disposed on the outer coating layer to cover the light-emitting device layer; as well as The pad portion is configured in the pad area and electrically connected to the pixel circuit. The outer coating includes an extension that extends into the wiring area between the display area and the pad area, and At least a portion of the extended portion of the outer coating has the same thickness as the central portion of the outer coating.

2. The light-emitting display device according to claim 1, wherein the end of the encapsulation portion is located at the boundary between the display area and the wiring area.

3. The light-emitting display device according to claim 2, wherein the extended portion of the outer coating extends from the end of the package portion in a direction toward the pad area, passes through the end of the package portion and enters the wiring area.

4. The light-emitting display device according to claim 1, wherein: The wiring area includes: A first wiring area adjacent to the display area; and A second wiring region between the first wiring region and the pad region. The extended portion of the outer coating has the same thickness throughout the first wiring region.

5. The light-emitting display device according to claim 4, wherein the extended portion of the outer coating has a thickness that decreases from the boundary portion between the first wiring region and the second wiring region toward the pad region.

6. The light-emitting display device according to claim 4, wherein: The substrate includes a first side and a second side that are parallel to each other, and The extended portion of the outer coating has the same thickness overall between the first side and the second side.

7. The light-emitting display device according to any one of claims 1 to 6, further comprising: A touch sensing unit comprising a plurality of touch electrodes is disposed on the package portion; as well as A plurality of touch wirings connecting the plurality of touch electrodes and the pad portion. The extended portion of the outer coating is configured to support the plurality of touch wires.

8. The light-emitting display device according to claim 7, wherein: The pixel circuit layer includes: Gate lines disposed on the substrate and connected to the pixel circuit; An insulating layer covering the gate lines; Data lines disposed on the insulating layer and connected to the pixel circuit; and A passivation layer that covers the data line and is covered by the outer coating. Each of the plurality of touch wires is in direct contact with the insulating layer in at least a portion of the wiring area.

9. The light-emitting display device according to any one of claims 1 to 3, wherein: The wiring area includes: A first wiring area adjacent to the display area; and A second wiring region between the first wiring region and the pad region. The extended portion of the outer coating includes a plurality of protrusions disposed in the first wiring region, and Each of the plurality of protrusions has the same thickness as the central portion of the outer coating.

10. The light-emitting display device of claim 9, wherein the extended portion of the outer coating has a thickness that decreases from the boundary portion between the first wiring region and the second wiring region toward the pad region.

11. The light-emitting display device according to claim 9, wherein: The substrate includes a first side and a second side that are parallel to each other, and The plurality of protrusions are arranged at predetermined intervals along a direction from the first side toward the second side.

12. The light-emitting display device according to claim 9, wherein the distance between the upper surface of each of the plurality of protrusions and the substrate is the same.

13. The light-emitting display device according to claim 9, further comprising: A touch sensing unit comprising a plurality of touch electrodes is disposed on the package portion; as well as A plurality of touch wirings connecting the plurality of touch electrodes and the pad portion. The plurality of protrusions are configured to support the plurality of touch wires.

14. The light-emitting display device according to claim 13, wherein: The pixel circuit layer includes: Gate lines disposed on the substrate and connected to the pixel circuit; An insulating layer covering the gate lines; Data lines disposed on the insulating layer and connected to the pixel circuit; and A passivation layer that covers the data line and is covered by the outer coating. Each of the plurality of touch wires is in direct contact with the insulating layer in at least a portion of the wiring area.

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