Probes and probe cards
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- NIHON DENSHIZAIRYO
- Filing Date
- 2023-11-28
- Publication Date
- 2026-07-10
AI Technical Summary
The existing probes suffer from wear and overheating at the tip during repeated use, and the plating is easily peeled off and lacks adhesion after replacing palladium-cobalt with boron-nickel.
The probe employs a multi-layer structure, consisting of a low-resistance section made of copper and gold, a high-resistance section made of palladium-cobalt alloy, and a medium-resistance section made of boron-nickel alloy surrounding it. This multi-layer structure is achieved through MEMS technology, ensuring the probe's wear resistance and low heat generation.
This design achieves wear resistance, low heat generation, and high adhesion between components, thereby improving the probe's service life and current conduction capability.
Smart Images

Figure CN122374657A_ABST