Positive photosensitive resin composition, insulating resin film, method for forming insulating resin film, and semiconductor device
CN122374705APending Publication Date: 2026-07-10RESONAC CORP
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- RESONAC CORP
- Filing Date
- 2023-12-22
- Publication Date
- 2026-07-10
AI Technical Summary
Technical Problem
Existing positive photosensitive resin compositions, when forming insulating resin films, often fail to simultaneously possess excellent chemical resistance and sufficiently high elongation at break.
Method used
An insulating resin film with an open pattern is formed by using a composition comprising an alkali-soluble resin, an oxazoline compound, a photoacid generator, and an alkoxy compound, through photoexposure and development, and then curing through a thermal crosslinking reaction.
Benefits of technology
This achieves excellent chemical resistance and sufficiently high elongation at break of the insulating resin film, thereby improving its mechanical strength and sensitivity.
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Smart Images
Figure CN122374705A_ABST
Abstract
The present invention provides a positive photosensitive resin composition comprising: (A) an alkali-soluble resin having a phenolic hydroxyl group; (B) an oxazoline compound having a plurality of oxazoline groups; (C) a photo-acid generator comprising a compound that generates an acid by light; and (D) an alkoxy compound having a plurality of alkoxy groups.
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