A copper-chromium contact and a method for its infiltration preparation
Copper-chromium contacts were prepared by processes such as cold pressing, liquid phase sintering, and magnetic grinding, which solved the problem of uneven porosity in the chromium skeleton, achieved high contact density and excellent electrical contact performance, and extended service life.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SHAANXI SIRUI ADVANCED MATERIALS CO LTD
- Filing Date
- 2026-04-22
- Publication Date
- 2026-07-17
AI Technical Summary
In existing copper-chromium contact manufacturing processes, the uneven particle size, loose packing, and tapped density of chromium powder lead to uneven pore size and connectivity of the chromium skeleton, affecting the stability of the CuCr contact composition.
Using alloy powder as raw material, copper-chromium contacts are prepared through cold pressing, liquid phase sintering, milling and turning, and magnetic grinding. The initial shape and dimensional accuracy of the alloy blank are controlled to ensure that the copper liquid phase is uniformly penetrated into the pores of the chromium skeleton, forming a dense copper-chromium composite structure.
This improves the density and electrical contact performance of the copper-chromium contacts, ensuring high electrical and thermal conductivity and excellent electrical contact performance, thus extending their service life.
Smart Images
Figure CN122406016A_ABST