A substrate protection method for soft film soft coating adhesion test
By using a buffer layer to disperse the local pressure of the cross-cut adhesion tester in the soft film and soft coating adhesion test, the problem of soft substrates being easily scratched and deformed during the test is solved, achieving a low-cost and low-damage test effect.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SUZHOU CRYSTALENT CO LTD
- Filing Date
- 2026-05-20
- Publication Date
- 2026-07-17
AI Technical Summary
In existing technologies for testing the adhesion of soft film and soft coatings, the bottom of the soft film and soft coating is a hard testing platform, which makes it easy for the cross-cut test blades to penetrate the film or coating when scratching, causing scratches and deformation of the soft substrate and increasing testing costs.
During the testing process, a buffer layer is fixed to the surface of the testing platform, and the substrate body is attached to the buffer layer. The buffer layer disperses the local pressure when the cross-cutting tool is used to scratch the substrate, protecting the soft substrate from being scratched or deformed.
Under the same scribing pressure, the damage rate of the substrate is reduced, the integrity of the substrate is maintained, the test scrap rate is reduced, and the method does not require modification of existing equipment, is low in cost, and is easy to promote industrially.
Smart Images
Figure CN122409286A_ABST