A method for testing the interfacial bond strength between a core sheet and a pp resin layer
By employing methods such as cutting, pressing, etching, and peel resistance testing, the technical gap in testing the bonding strength between copper-free core boards and PP resin layers has been filled, thereby improving the quality of PCB products.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- 九江德富新能源有限公司
- Filing Date
- 2026-04-08
- Publication Date
- 2026-07-17
AI Technical Summary
Existing technologies cannot accurately detect the bonding force between the copper-free core board and the PP resin layer, making it difficult to solve the PCB delamination failure problem. Furthermore, conventional testing methods cannot reflect the true bonding strength of this interface.
The bonding strength between the Core board and the outer PP resin is accurately tested through steps such as cutting, pressing, etching, and peel resistance testing. This includes cutting the PP resin prepreg, stacking and pressing copper foil, etching to remove the copper foil, cutting test strips, and performing peel resistance testing using standard equipment in the PCB industry.
It enables precise detection of the bonding force between the Core board and the PP resin layer, which can effectively reduce PCB failures caused by interface delamination and improve product quality.
Smart Images
Figure CN122409487A_ABST