Tilt exposure apparatus, tilt exposure method, and semiconductor device
By combining the light source adjustment module and the carrier plate adjustment module of the tilt exposure machine, high-precision vertical sidewall patterning is achieved, solving the problems of insufficient adjustment accuracy and alignment accuracy in traditional equipment and improving the processing quality of semiconductor devices.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- DOGAIN LASER TECH (SUZHOU) CO LTD
- Filing Date
- 2026-06-08
- Publication Date
- 2026-07-17
AI Technical Summary
In existing semiconductor processing technologies, traditional tilting exposure equipment is difficult to achieve high-precision vertical sidewall patterning, and the adjustment and alignment accuracy are insufficient, resulting in complex alignment and poor repeatability.
A tilting exposure machine is used, including a light source adjustment module, a photolithography alignment module, a photomask placement module, and a carrier plate adjustment module. The angle of the tilting stage is adjusted by the light source adjustment unit, and combined with the multi-dimensional adjustment of the carrier plate, high-precision alignment and angle adjustment between the photomask and the sample are achieved.
It improves the stability of the exposure beam and the consistency of the pattern, reduces the alignment error, improves the accuracy and yield of the sidewall pattern, and simplifies the operation process.
Smart Images
Figure CN122410901A_ABST