A molding resin for an IPM module, a preparation method thereof, an IPM module preparation method, and an IPM module

Abstract

The application provides a molding resin for an IPM module, a preparation method of the molding resin, an IPM module preparation method and the IPM module, the molding resin is prepared by melting extrusion and solidification of mixed raw materials including modified epoxy resin, latent curing agent and modified fused silica; the weight ratio of the modified epoxy resin, the latent curing agent and the modified fused silica is 1:0.2-0.5:5-10; the modified epoxy resin contains grafted siloxane side chains; the latent curing agent includes a first curing agent and a second curing agent, the first curing agent is selected from microencapsulated dicyandiamide and / or modified imidazole, and the second curing agent is selected from polyimide; the molding resin of the application has high interfacial bonding strength, the IPM module prepared by using the molding resin has excellent electrical properties and mechanical properties, and has strong environmental adaptability.

Description

Technical Field

[0001] This invention relates to the field of IPM module molding resin technology, specifically to a molding resin for IPM modules, a method for preparing the same, a method for preparing IPM modules, and an IPM module. Background Technology

[0002] IPM modules are widely used in new energy, industrial frequency conversion and other fields. Their internal semiconductor components need to be encapsulated with epoxy resin to achieve insulation, heat dissipation and mechanical protection. However, existing resin materials have the following problems: 1) Thermal stress cracking: The mismatch of the coefficient of thermal expansion (CTE) between the resin and the metal substrate leads to interface delamination; 2) Moisture absorption failure: Moisture penetration reduces insulation and causes ion migration; 3) Process defects: Traditional curing process leads to internal stress accumulation, reducing long-term reliability.

[0003] Existing technologies mostly use single fillers (such as silica) or general coupling agents to improve performance, but they have not systematically solved comprehensive problems such as CTE gradient matching, interfacial bonding optimization and moisture barrier. Summary of the Invention

[0004] In view of the problems existing in the prior art, the present invention provides a molding resin for IPM modules and a method for preparing the same, an IPM module preparation method, and an IPM module. The molding resin of the present invention has high interfacial bonding strength, and the IPM module prepared with it has excellent electrical and mechanical properties and strong environmental adaptability.

[0005] In a first aspect, the present invention provides a molding resin for an IPM module, the molding resin comprising a modified epoxy resin, a latent curing agent, and, for example, a... Figure 1 The modified molten silica mixture shown is obtained by melt extrusion and then curing. The weight ratio of the modified epoxy resin, the latent curing agent, and the modified molten silica is 1:0.2-0.5:5-10; The modified epoxy resin contains grafted siloxane side chains; The latent curing agent includes a first curing agent and a second curing agent, wherein the first curing agent is selected from at least one of microencapsulated dicyandiamide and / or modified imidazole, and the second curing agent is polyimide.

[0006] In a preferred embodiment of the present invention, the weight ratio of the modified epoxy resin to the latent curing agent is 1:0.25-0.45 (for example, it can be any value among 1:0.25, 1:0.3, 1:0.35, 1:0.36, 1:0.4 and 1:0.45, or any value between any two values).

[0007] In a preferred embodiment of the present invention, the weight ratio of the modified epoxy resin to the modified molten silica is 1:6-9 (for example, it can be any value among 1:6, 1:6.5, 1:7, 1:7.5, 1:7.6, 1:7.8, 1:8, 1:8.5 and 1:9, or any value between any two values).

[0008] In a preferred embodiment of the present invention, the temperature of the melt extrusion is 80-90°C.

[0009] In a preferred embodiment of the present invention, the curing method includes sequentially performing medium-temperature pre-curing and high-temperature post-curing. The conditions for medium-temperature pre-curing include: a temperature of 120-140℃, preferably 130±2℃; and a time of 1-5 hours, preferably 1-3 hours. The conditions for high-temperature post-curing include: a temperature of 150-170℃, preferably 160±5℃ (for example, any value among 155℃, 157℃, 159℃, 160℃, 161℃, 163℃, and 165℃, or any value between any two values); and a time of 1-5 hours, preferably 3-5 hours (for example, any value among 3 hours, 3.2 hours, 3.4 hours, 3.6 hours, 3.8 hours, 4 hours, 4.2 hours, 4.4 hours, 4.6 hours, 4.8 hours, and 5 hours, or any value between any two values).

[0010] In a preferred embodiment of the present invention, the grafting degree of siloxane in the modified epoxy resin is 10wt%-15wt%, preferably 12±0.5wt%.

[0011] In a preferred embodiment of the present invention, the method for preparing the modified epoxy resin includes: mixing epoxy resin with siloxane grafting monomers under grafting reaction conditions to obtain a modified epoxy resin with grafted siloxane side chains.

[0012] In a preferred embodiment of the present invention, the molar ratio of the epoxy resin to the siloxane graft monomer is 2-8:1, preferably 3-5:1 (for example, it can be any value among 3:1, 3.5:1, 4:1, 4.5:1 and 5:1, or any value between any two values).

[0013] In a preferred embodiment of the present invention, the epoxy resin has a molecular weight distribution (PDI) < 1.5.

[0014] In a preferred embodiment of the present invention, the water content of the epoxy resin is <0.05%.

[0015] In a preferred embodiment of the present invention, the epoxy resin is selected from at least one of bisphenol A epoxy resin, bisphenol F epoxy resin and phenolic epoxy resin, preferably bisphenol A epoxy resin.

[0016] In a preferred embodiment of the present invention, in step S1, the siloxane grafting monomer is selected from at least one of 3-isocyanopropyltriethoxysilane, 3-isocyanopropyltrimethoxysilane, and 3-isocyanopropyldimethoxysilane, preferably 3-isocyanopropyltriethoxysilane.

[0017] In a preferred embodiment of the present invention, in step S1, the grafting reaction conditions include: a reaction temperature of 70-90℃, preferably 75-85℃ (for example, any value among 75℃, 77℃, 79℃, 80℃, 81℃, 83℃, and 85℃, or any value between any two values); and a reaction time of 3-10 hours, preferably 4-8 hours (for example, any value among 4 hours, 5 hours, 6 hours, 7 hours, and 8 hours, or any value between any two values).

[0018] In a preferred embodiment of the present invention, the weight ratio of the first curing agent and the second curing agent is 1:5-15, preferably 1:8-10 (for example, it can be any value among 1:8, 1:8.5, 1:9, 1:9.5 and 1:10, or any value between any two values).

[0019] In a preferred embodiment of the present invention, the first curing agent is microencapsulated dicyandiamide.

[0020] In a preferred embodiment of the present invention, the microencapsulated dicyandiamide comprises 60wt%-80wt% of core material dicyandiamide and 20wt%-40wt% of shell material polyurethane.

[0021] In a preferred embodiment of the present invention, the microencapsulated dicyandiamide has a particle size of 3-10 μm, preferably 4-6 μm.

[0022] In a preferred embodiment of the present invention, the polyimide has a softening point of <25°C and a viscosity of <20000 cP at 80°C.

[0023] In a preferred embodiment of the present invention, the raw materials for the modified fused silica include small-particle-size fused silica with a particle size of 1-5 μm, medium-particle-size fused silica with a particle size of 5-10 μm, and large-particle-size fused silica with a particle size of 10-20 μm.

[0024] In a preferred embodiment of the present invention, the weight ratio of the small-particle-size fused silica, the medium-particle-size fused silica, and the large-particle-size fused silica is 1-2:2-3:1.

[0025] In a preferred embodiment of the present invention, the method for preparing the modified molten silica includes: under stirring conditions, coating small-particle-size molten silica, medium-particle-size molten silica and large-particle-size molten silica independently with a coupling agent, and then modifying them independently under condensation reaction conditions.

[0026] In a preferred embodiment of the present invention, the coupling agent is used in the form of an alcohol-water solution, wherein the volume ratio of the coupling agent, alcohol and water is 1:2-4:1-3.

[0027] In a preferred embodiment of the present invention, the coupling agent used for the small-particle-size molten silica is selected from aminosilanes and / or vinylsilanes, preferably aminosilanes.

[0028] In a preferred embodiment of the present invention, the aminosilane is selected from at least one of γ-aminopropyltriethoxysilane, γ-aminopropyltrimethoxysilane, γ-aminopropyldimethoxysilane, N-n-butyl-3-aminopropyltrimethoxysilane and 3-phenylaminopropyltrimethoxysilane, more preferably γ-aminopropyltriethoxysilane.

[0029] In a preferred embodiment of the present invention, the weight ratio of the small-particle-size molten silica to aminosilane is 100:0.1-3.

[0030] In a preferred embodiment of the present invention, the coupling agent used for the medium-particle-size molten silica is selected from epoxy silanes and / or phenyl silanes, preferably epoxy silanes.

[0031] In a preferred embodiment of the present invention, the epoxy silane is selected from at least one of 3-glycidyl etheroxypropyltrimethoxysilane, 3-glycidyl etheroxypropyltriethoxysilane and β-(3,4-epoxyethylene)ethyltrimethoxysilane, preferably 3-glycidyl etheroxypropyltrimethoxysilane.

[0032] In a preferred embodiment of the present invention, the weight ratio of the medium-particle-size molten silica to the epoxy silane is 100:0.1-3.

[0033] In a preferred embodiment of the present invention, the coupling agent used for the large-particle-size molten silica is selected from at least two of aminosilane, epoxysilane and vinylsilane, preferably aminosilane and epoxysilane.

[0034] In a preferred embodiment of the present invention, the weight ratio of the large-particle-size molten silica to the total amount of aminosilane and epoxysilane is 100:0.1-3.

[0035] In a preferred embodiment of the present invention, the weight ratio of the aminosilane and the epoxysilane is 1:0.5-1.

[0036] In a preferred embodiment of the present invention, the modification method for large-particle-size molten silica includes: under condensation conditions, first treating the large-particle-size molten silica with an aminosilane coating for a first modification, and then treating it with an epoxysilane coating for a second modification. Alternatively, under condensation conditions, first treating the large-particle-size molten silica with an epoxysilane coating for a first modification, and then treating it with an aminosilane coating for a second modification.

[0037] In a preferred embodiment of the present invention, the condensation conditions include: a condensation temperature of 70-90°C, preferably 75-85°C; and a condensation time of 40-80 min, preferably 50-70 min.

[0038] In a second aspect, the present invention provides a method for preparing the molding resin for an IPM module as described in the first aspect, the method comprising the following steps: Step S1: Under grafting reaction conditions, epoxy resin is mixed with siloxane grafting monomers and reacted to obtain modified epoxy resin with grafted siloxane side chains. Step S2: After mixing the modified epoxy resin, latent curing agent, modified molten silica and additives, the mixture is melt-extruded and then cured to obtain the molded resin; In step S2, the latent curing agent includes a first curing agent and a second curing agent, wherein the first curing agent is selected from microencapsulated dicyandiamide and / or modified imidazole, and the second curing agent is polyimide.

[0039] In a preferred embodiment of the present invention, in step S1, the molar ratio of the epoxy resin to the siloxane graft monomer is 2-8:1, preferably 3-5:1.

[0040] In a preferred embodiment of the present invention, the epoxy resin has a molecular weight distribution (PDI) < 1.5.

[0041] In a preferred embodiment of the present invention, the water content of the epoxy resin is <0.05%.

[0042] In a preferred embodiment of the present invention, the epoxy resin is selected from at least one of bisphenol A epoxy resin, bisphenol F epoxy resin and phenolic epoxy resin, preferably bisphenol A epoxy resin.

[0043] In a preferred embodiment of the present invention, in step S1, the siloxane grafting monomer is selected from at least one of 3-isocyanopropyltriethoxysilane, 3-isocyanopropyltrimethoxysilane, and 3-isocyanopropyldimethoxysilane, preferably 3-isocyanopropyltriethoxysilane.

[0044] In a preferred embodiment of the present invention, the grafting reaction conditions in step S1 include: a reaction temperature of 70-90℃, preferably 75-85℃; and a reaction time of 3-10 hours, preferably 4-8 hours.

[0045] In a preferred embodiment of the present invention, in step S2, the temperature of the melt extrusion is 80-90°C.

[0046] In a preferred embodiment of the present invention, the curing method includes sequentially performing medium-temperature pre-curing and high-temperature post-curing; the conditions for medium-temperature pre-curing include: a temperature of 120-140℃, preferably 130±2℃; and a time of 1-5 hours, preferably 1-3 hours. The conditions for high-temperature post-curing include: a temperature of 150-170℃, preferably 160±5℃; and a time of 1-5 hours, preferably 3-5 hours.

[0047] In a preferred embodiment of the present invention, the density difference between the modified epoxy resin and the modified fused silica is <0.2 g / cm³. 3 .

[0048] In a preferred embodiment of the present invention, the viscosity change time of the mixed raw materials in the medium-temperature pre-curing stage is less than the settling time of the modified molten silica in the modified epoxy resin.

[0049] In a preferred embodiment of the present invention, the weight ratio of the modified epoxy resin, the latent curing agent and the modified molten silica is 1:0.2-0.5:5-10.

[0050] In a preferred embodiment of the present invention, the weight ratio of the modified epoxy resin to the latent curing agent is 1:0.25-0.45.

[0051] In a preferred embodiment of the present invention, the weight ratio of the modified epoxy resin to the modified molten silica is 1:6-9.

[0052] In a preferred embodiment of the present invention, the weight ratio of the first curing agent and the second curing agent is 1:5-15, preferably 1:8-10.

[0053] In a preferred embodiment of the present invention, the first curing agent is microencapsulated dicyandiamide.

[0054] In a preferred embodiment of the present invention, the microencapsulated dicyandiamide comprises 60wt%-80wt% of core material dicyandiamide and 20wt%-40wt% of shell material polyurethane.

[0055] In a preferred embodiment of the present invention, the microencapsulated dicyandiamide has a particle size of 3-10 μm, preferably 4-6 μm.

[0056] The method for preparing the microencapsulated dicyandiamide includes: Step 1: Disperse the latent curing agent in water under ultrasonic conditions to obtain a suspension; Step 2: Under ultrasonic conditions, an emulsifier is added to the obtained suspension to obtain a first mixture containing surface-hydrophilized dichlorocyanobenzoquinone; Step 3: In a nitrogen atmosphere, hexamethylene diisocyanate solution is added to a mixed solution of trimethylolpropane and dibutyltin dilaurate to carry out a prepolymerization reaction, thereby obtaining a second mixture containing polyurethane prepolymer; Step 4: Under stirring conditions, add the first mixture obtained in Step 2 to the second mixture containing polyurethane prepolymer and react to obtain the third mixture; Step 5: Under curing conditions, the third mixture obtained in Step 4 is cured to obtain the main curing agent.

[0057] In a preferred embodiment of the present invention, the conditions for ultrasound in step one include: an ultrasound frequency of 20-60 kHz, preferably 30-50 kHz; an ultrasound time of 10-30 min, preferably 10-20 min; and an ultrasound temperature of 25-55°C, preferably 35-45°C.

[0058] In step one, the particle size of the suspended matter in the obtained suspension is ≤30μm, preferably 15-25μm.

[0059] In a preferred embodiment of the present invention, the conditions for ultrasound in step two include: an ultrasound frequency of 20-60 kHz, preferably 30-50 kHz; an ultrasound time of 10-30 min, preferably 10-20 min; and an ultrasound temperature of 25-55°C, preferably 35-45°C.

[0060] In a preferred embodiment of the present invention, in step three, the conditions for the prepolymerization reaction include: reaction temperature < 60°C, preferably 30-50°C; and reaction time of 40-80 min, preferably 50-70 min.

[0061] In a preferred embodiment of the present invention, in step three, the content of isocyanate groups in the obtained polyurethane prepolymer is <13%.

[0062] In a preferred embodiment of the present invention, in step three, the solvent in the hexamethylene diisocyanate solution is ethanol.

[0063] In a preferred embodiment of the present invention, in step three, the volume ratio of hexamethylene diisocyanate to solvent in the hexamethylene diisocyanate solution is 1:2-8, preferably 1:3-5.

[0064] In a preferred embodiment of the present invention, in step three, the mass ratio of hexamethylene diisocyanate, trimethylolpropane and dibutyltin dilaurate is 1:0.2-0.8:0.01-0.05, preferably 1:0.5-0.7:0.01-0.02.

[0065] In a preferred embodiment of the present invention, the reaction conditions in step four include: a reaction temperature of 35-60°C, preferably 30-50°C; and a reaction time of 60-120 min, preferably 80-100 min.

[0066] In a preferred embodiment of the present invention, in step four, the stirring speed is 200-800 rpm, preferably 300-500 rpm.

[0067] In a preferred embodiment of the present invention, in step five, the curing conditions include: a curing temperature of 40-80℃, preferably 50-70℃; and a curing time of 100-180 min, preferably 100-150 min.

[0068] In a preferred embodiment of the present invention, the polyimide has a softening point of <25°C and a viscosity of <20000 cP at 80°C.

[0069] In a preferred embodiment of the present invention, the raw materials for the modified fused silica include small-particle-size fused silica with a particle size of 1-5 μm, medium-particle-size fused silica with a particle size of 5-10 μm, and large-particle-size fused silica with a particle size of 10-20 μm.

[0070] In a preferred embodiment of the present invention, the weight ratio of the small-particle-size fused silica, the medium-particle-size fused silica, and the large-particle-size fused silica is 1-2:2-3:1.

[0071] In a preferred embodiment of the present invention, the method for preparing the modified molten silica includes: under stirring conditions, coating small-particle-size molten silica, medium-particle-size molten silica and large-particle-size molten silica independently with a coupling agent, and then modifying them independently under condensation reaction conditions.

[0072] In a preferred embodiment of the present invention, the coupling agent is coated in the form of an alcohol-water solution, wherein the volume ratio of the coupling agent, alcohol and water is 1:2-4:1-3.

[0073] In a preferred embodiment of the present invention, the coupling agent used for the small-particle-size molten silica is selected from aminosilanes and / or vinylsilanes, preferably aminosilanes.

[0074] In a preferred embodiment of the present invention, the aminosilane is selected from at least one of γ-aminopropyltriethoxysilane, γ-aminopropyltrimethoxysilane, γ-aminopropyldimethoxysilane, N-n-butyl-3-aminopropyltrimethoxysilane and 3-phenylaminopropyltrimethoxysilane, more preferably γ-aminopropyltriethoxysilane.

[0075] In a preferred embodiment of the present invention, the weight ratio of the small-particle-size molten silica to aminosilane is 100:0.1-3.

[0076] In a preferred embodiment of the present invention, the coupling agent used for the medium-particle-size molten silica is selected from epoxy silanes and / or phenyl silanes, preferably epoxy silanes.

[0077] In a preferred embodiment of the present invention, the epoxy silane is selected from at least one of 3-glycidyl etheroxypropyltrimethoxysilane, 3-glycidyl etheroxypropyltriethoxysilane and β-(3,4-epoxyethylene)ethyltrimethoxysilane, preferably 3-glycidyl etheroxypropyltrimethoxysilane.

[0078] In a preferred embodiment of the present invention, the weight ratio of the medium-particle-size molten silica to the epoxy silane is 100:0.1-3.

[0079] In a preferred embodiment of the present invention, the coupling agent used for the large-particle-size molten silica is selected from at least two of aminosilane, epoxysilane and vinylsilane, preferably aminosilane and epoxysilane.

[0080] In a preferred embodiment of the present invention, the weight ratio of the large-particle-size molten silica to the total amount of aminosilane and epoxysilane is 100:0.1-3.

[0081] In a preferred embodiment of the present invention, the weight ratio of the aminosilane and the epoxysilane is 1:0.5-1.

[0082] In a preferred embodiment of the present invention, the modification method of the large-particle-size molten silica includes: under stirring conditions, first coating the large-particle-size molten silica with an aminosilane, performing a first modification under condensation reaction conditions, then coating it with an epoxysilane, and performing a second modification under condensation reaction conditions; or, under stirring conditions, first coating the large-particle-size molten silica with an epoxysilane, performing a first modification under condensation reaction conditions, then coating it with an aminosilane, and performing a second modification under condensation reaction conditions.

[0083] In a preferred embodiment of the present invention, the condensation reaction conditions include: a condensation temperature of 70-90°C, preferably 75-85°C; and a condensation time of 40-80 min, preferably 50-70 min.

[0084] In a preferred embodiment of the present invention, the weight ratio of the modified epoxy resin to the additives is 100:0.1-0.5.

[0085] In a preferred embodiment of the present invention, the additives include leveling agents and release agents.

[0086] In a preferred embodiment of the present invention, the weight ratio of the leveling agent to the release agent is 1:0.5-1.5.

[0087] Thirdly, the present invention provides a method for preparing an IPM module, the method comprising: Step (1): Preheat the molding resin described in the first aspect or the molding resin prepared by the preparation method described in the second aspect; Step (2): Under injection molding conditions, the preheated molding resin is injected into the IPM module mold for injection molding to obtain the IPM module semi-finished product; Step (3): The obtained IPM module semi-finished product is cured to obtain the IPM module.

[0088] In a preferred embodiment of the present invention, the preheating conditions in step (1) include: a preheating temperature of 70-90°C and a preheating time of 1-5 min.

[0089] In a preferred embodiment of the present invention, in step (2), the injection molding conditions include: an injection speed of 1.4-3.6 mm / s and an IPM mold temperature of 165-175°C.

[0090] In a preferred embodiment of the present invention, step (2) further includes the following injection conditions: a first injection pressure of 15-25 MPa and a first injection pressure holding time of 8-12 s.

[0091] In a preferred embodiment of the present invention, in step (2), the injection molding conditions further include: reducing the first injection pressure to the second injection pressure at a rate of 0.15-0.5 MPa / s, and holding the second injection pressure for 50-70 seconds.

[0092] In a preferred embodiment of the present invention, the second injection pressure is 12-18 MPa.

[0093] In a preferred embodiment of the present invention, the IPM module mold contains a chip and a copper substrate.

[0094] In a preferred embodiment of the present invention, step (3) of the curing process includes a first curing and a second curing performed sequentially. The conditions for the first curing are: a temperature of 80-120°C and a time of 1-3 hours. The conditions for the second curing are: a temperature of 150-200°C and a time of 2-6 hours.

[0095] Fourthly, the present invention provides an IPM module prepared by the method for preparing the IPM module described in the third aspect.

[0096] Compared with the prior art, the beneficial effects of the present invention are as follows: (1) Improved electrical performance: By optimizing the molding resin formulation, the modified epoxy resin with specific functional groups, the specific curing agent combination and the modified molten silica are compounded to synergistically improve the electrical performance of the molding resin, which can reduce leakage current, improve the working stability of the IPM module under high voltage environment, and effectively avoid the occurrence of electrical faults.

[0097] (2) Enhanced mechanical properties: The specific combination of curing agent and modified epoxy resin synergistically achieves rapid and uniform curing, forming an ideal cross-linked structure. At the same time, the modified molten silica obtained through a specific surface treatment process is uniformly dispersed in the resin, enhancing the interfacial adhesion with the matrix resin. Under the synergistic effect, the mechanical strength, hardness and toughness of the molded resin are significantly improved, which enhances the ability of the IPM module to resist external impact and vibration, reduces internal structural damage caused by mechanical stress, and extends the service life of the IPM module.

[0098] (3) Improved environmental adaptability: The modified epoxy resin containing siloxane side chains gives the molding resin excellent resistance to damp heat and chemical stability, which can effectively resist the influence of harsh environments such as high temperature and high humidity and chemical corrosion on IPM modules, ensuring that IPM modules can work stably for a long time in complex environments. The optimized molding process further improves the adaptability of IPM wood blocks to harsh environments. Attached Figure Description

[0099] Figure 1 This is a SEM image of the modified fused silica of the present invention. Detailed Implementation

[0100] The present invention will be described in detail below through embodiments, but the scope of protection of the present invention is not limited to the following description.

[0101] Bisphenol A epoxy resin: grade NPES 901, molecular weight distribution PDI < 1.5, water content < 0.05%; Preparation Example 1 Preparation of modified fused silica Step 1: Under stirring conditions, small-particle-size molten silica with a particle size of 1-5 μm is coated with an alcohol-water solution of γ-aminopropyltriethoxysilane (the volume ratio of γ-aminopropyltriethoxysilane, alcohol, and water is 1:3:2), and then modified under condensation reaction conditions; wherein the weight ratio of molten silica to γ-aminopropyltriethoxysilane is 100:2; Under stirring conditions, medium-sized molten silica with a particle size of 5-10 μm was coated with an alcohol-water solution of 3-glycidoxypropyltrimethoxysilane (volume ratio of 3-glycidoxypropyltrimethoxysilane, alcohol, and water was 1:3:2), and then modified under condensation reaction conditions; wherein the weight ratio of molten silica to 3-glycidoxypropyltrimethoxysilane was 100:2. Under stirring conditions, large-particle-size molten silica with a particle size of 10-20 μm was first coated with an alcohol-water solution of γ-aminopropyltriethoxysilane, and then modified independently under condensation conditions. Then, it was coated with an alcohol-water solution of 3-glycidoxypropyltrimethoxysilane, and modified independently under condensation conditions. The weight ratio of molten silica to the total amount of aminosilane and epoxysilane was 100:2, and the weight ratio of aminosilane to epoxysilane was 1:1. The condensation reaction conditions are: condensation temperature of 80℃ and condensation time of 60min.

[0102] Step 2: Mix the modified small-particle-size molten silica, medium-particle-size molten silica, and large-particle-size molten silica in a weight ratio of 1.5:2.5:1 to obtain modified molten silica (e.g., Figure 1 (As shown).

[0103] Preparation Example 2 Preparation of modified fused silica Step 1: Under stirring conditions, small-particle-size molten silica with a particle size of 1-5 μm is coated with an alcohol-water solution of γ-aminopropyltriethoxysilane (the volume ratio of γ-aminopropyltriethoxysilane, alcohol, and water is 1:2:3), and then modified independently under condensation reaction conditions; wherein the weight ratio of molten silica to γ-aminopropyltriethoxysilane is 100:3; Under stirring conditions, medium-sized molten silica with a particle size of 5-10 μm was coated with an alcohol-water solution of 3-glycidoxypropyltrimethoxysilane (volume ratio of 3-glycidoxypropyltrimethoxysilane, alcohol, and water was 1:2:3), and then modified independently under condensation reaction conditions; wherein the weight ratio of molten silica to 3-glycidoxypropyltrimethoxysilane was 100:3. Under stirring conditions, large-particle-size molten silica with a particle size of 10-20 μm was first coated with an aqueous solution of γ-aminopropyltriethoxysilane (volume ratio of γ-aminopropyltriethoxysilane, alcohol, and water was 1:2:3), and then modified independently under condensation conditions. Next, it was coated with an aqueous solution of 3-glycidoxypropyltrimethoxysilane (volume ratio of 3-glycidoxypropyltrimethoxysilane, alcohol, and water was 1:2:3), and then modified independently under condensation conditions. The weight ratio of molten silica to the total amount of aminosilane and epoxysilane was 100:0.1, and the weight ratio of aminosilane to epoxysilane was 1:0.5. The condensation reaction conditions were: condensation temperature of 75℃ and condensation time of 70 min.

[0104] Step 2: Mix the modified small-particle-size molten silica, medium-particle-size molten silica and large-particle-size molten silica in a weight ratio of 1:2:1 to obtain modified molten silica.

[0105] Preparation Example 3 Preparation of modified fused silica Step 1: Under stirring conditions, small-particle-size molten silica with a particle size of 1-5 μm is coated with an alcohol-water solution of γ-aminopropyltriethoxysilane (the volume ratio of γ-aminopropyltriethoxysilane, alcohol, and water is 1:4:1), and then modified independently under condensation reaction conditions; wherein the weight ratio of molten silica to γ-aminopropyltriethoxysilane is 100:0.1. Under stirring conditions, medium-sized molten silica with a particle size of 5-10 μm was coated with an alcohol-water solution of 3-glycidoxypropyltrimethoxysilane (volume ratio of 3-glycidoxypropyltrimethoxysilane, alcohol, and water was 1:4:1), and then modified independently under condensation reaction conditions; wherein the weight ratio of molten silica to 3-glycidoxypropyltrimethoxysilane was 100:0.1. Under stirring conditions, large-particle-size molten silica with a particle size of 10-20 μm was first coated with an aqueous solution of γ-aminopropyltriethoxysilane (volume ratio of γ-aminopropyltriethoxysilane, alcohol, and water was 1:4:1), and then modified independently under condensation conditions. Next, it was coated with an aqueous solution of 3-glycidoxypropyltrimethoxysilane (volume ratio of 3-glycidoxypropyltrimethoxysilane, alcohol, and water was 1:4:1), and then modified independently under condensation conditions. The weight ratio of molten silica to the total amount of aminosilane and epoxysilane was 100:3, and the weight ratio of aminosilane to epoxysilane was 1:1.5. The condensation reaction conditions were: condensation temperature of 85℃ and condensation time of 50 min.

[0106] Step 2: Mix the modified small-particle-size molten silica, medium-particle-size molten silica and large-particle-size molten silica in a weight ratio of 2:3:1 to obtain modified molten silica.

[0107] Preparation Example 4 Modified fused silica was prepared according to the method of Preparation Example 1, except that in step 2, the modified small-particle-size fused silica was replaced with an equal amount of modified medium-particle-size fused silica.

[0108] Preparation Example 5 Modified molten silica was prepared according to the method of Preparation Example 1, except that in step 1, under stirring conditions, large-particle-size molten silica with a particle size of 10-20 μm was coated with an alcohol-water solution of γ-aminopropyltriethoxysilane and 3-glycidoxypropyltrimethoxysilane, and then modified under condensation conditions.

[0109] Example 1 This invention provides a molding resin for an IPM module and a method for preparing the IPM module, the method comprising the following steps: Step S1: Under grafting reaction conditions, 4 mol of bisphenol A epoxy resin (NPES 901) and 1 mol of 3-isocyanopropyltriethoxysilane were mixed and reacted to obtain a modified epoxy resin with grafted siloxane side chains (grafting degree of 12wt%); the reaction temperature of the grafting reaction was 80℃ and the reaction time was 6h. Step S2: 11 parts by weight of modified epoxy resin, 4 parts by weight of latent curing agent, 86 parts by weight of modified fused silica from Preparation Example 1, 0.1 parts by weight of leveling agent, and 0.1 parts by weight of release agent were mixed, melt-extruded, and then subjected to medium-temperature pre-curing and high-temperature post-curing to obtain the molded resin. The latent curing agent included 10 wt% microencapsulated dicyandiamide with a particle size of 5 μm (including 70 wt% core material dicyandiamide and 30 wt% shell material polyurethane) and 90 wt% polyimide (softening point <25℃, viscosity at 80℃ is 16000 cP). The melt extrusion temperature was 85℃. The medium-temperature pre-curing conditions included a temperature of 130℃ and a time of 2 h. The high-temperature post-curing conditions included a temperature of 160℃ and a time of 4 h. The interfacial bonding strength of the molded resin was tested, and the test results are shown in Table 1.

[0110] Step S3: Preheat the molding resin at 80°C for 3 minutes; Step S4: The preheated molding resin is injected into the IPM module mold containing the chip and copper substrate at a temperature of 170°C at an injection speed of 2.5 mm / s. First, the pressure is held at the first injection pressure of 20 MPa for 10 seconds, and then the pressure is reduced to the second injection pressure of 15 MPa at a speed of 0.3 MPa / s and held for 60 seconds to obtain the IPM module semi-finished product. Step S5: Cur the obtained IPM module semi-finished product at 100℃ for 2 hours to complete the first curing, and then cure it at 175℃ for 4 hours to complete the second curing, thus obtaining the IPM module.

[0111] The electrical performance, mechanical performance, and environmental adaptability of the IPM module were tested, and the results are shown in Table 2.

[0112] Example 2 This invention provides a molding resin for an IPM module and a method for preparing the IPM module, the method comprising the following steps: Step S1: Under grafting reaction conditions, 3 mol of bisphenol A epoxy resin (NPES 901) and 1 mol of 3-isocyanopropyltriethoxysilane were mixed and reacted to obtain a modified epoxy resin with grafted siloxane side chains (grafting degree of 15 wt%); the reaction temperature of the grafting reaction was 85℃ and the reaction time was 4 h. Step S2: 11 parts by weight of modified epoxy resin, 5.5 parts by weight of latent curing agent, 110 parts by weight of modified fused silica from Preparation Example 2, 0.22 parts by weight of leveling agent, and 0.33 parts by weight of release agent were mixed, melt-extruded, and then subjected to medium-temperature pre-curing and high-temperature post-curing to obtain the molded resin. The latent curing agent included 11 wt% microencapsulated dicyandiamide with a particle size of 6 μm (including 60 wt% core material dicyandiamide and 40 wt% shell material polyurethane) and 89 wt% polyimide (softening point <25℃, viscosity at 80℃ is 16000 cP). The melt extrusion temperature was 80℃. The medium-temperature pre-curing conditions included a temperature of 120℃ and a time of 3 h. The high-temperature post-curing conditions included a temperature of 150℃ and a time of 5 h. The interfacial bonding strength of the molded resin was tested, and the test results are shown in Table 1.

[0113] Step S3: Preheat the molding resin at 70°C for 5 minutes; Step S4: The preheated molding resin is injected into the IPM module mold containing the chip and copper substrate at a temperature of 175℃ at an injection speed of 1.4mm / s. First, the pressure is held at the first injection pressure of 15MPa for 12s, and then the pressure is reduced to the second injection pressure of 12MPa at a speed of 0.15MPa / s and held for 70s to obtain the IPM module semi-finished product. Step S5: Cur the obtained IPM module semi-finished product at 120℃ for 1 hour to complete the first curing, and then cure it at 200℃ for 2 hours to complete the second curing, thus obtaining the IPM module.

[0114] Example 3 This invention provides a molding resin for an IPM module and a method for preparing the IPM module, the method comprising the following steps: Step S1: Under grafting reaction conditions, 5 mol of bisphenol A epoxy resin (NPES 901) and 1 mol of 3-isocyanopropyltriethoxysilane were mixed and reacted to obtain a modified epoxy resin with grafted siloxane side chains (grafting degree of 10 wt%); the reaction temperature of the grafting reaction was 75℃ and the reaction time was 8 h. Step S2: 11 parts by weight of modified epoxy resin, 2.2 parts by weight of latent curing agent, 55 parts by weight of modified fused silica from Preparation Example 3, 0.07 parts by weight of leveling agent, and 0.04 parts by weight of release agent were mixed, melt-extruded, and then subjected to medium-temperature pre-curing and high-temperature post-curing to obtain the molded resin. The latent curing agent included 9 wt% microencapsulated dicyandiamide with a particle size of 4 μm (including 80 wt% core material dicyandiamide and 20 wt% shell material polyurethane) and 91 wt% polyimide (softening point <25℃, viscosity at 80℃ is 16000 cP). The melt extrusion temperature was 90℃. The medium-temperature pre-curing conditions included a temperature of 140℃ and a time of 1 h. The high-temperature post-curing conditions included a temperature of 170℃ and a time of 3 h. The interfacial bonding strength of the molded resin was tested, and the test results are shown in Table 1.

[0115] Step S3: Preheat the molding resin at 90°C for 1 minute; Step S4: The preheated molding resin is injected into the IPM module mold containing the chip and copper substrate at a temperature of 165℃ at an injection speed of 3.6mm / s. First, the pressure is held at the first injection pressure of 25MPa for 8s, and then the pressure is reduced to the second injection pressure of 18MPa at a speed of 0.5MPa / s and held for 50s to obtain the IPM module semi-finished product. Step S5: Cur the obtained IPM module semi-finished product at 80℃ for 3 hours to complete the first curing, and then cure it at 150℃ for 6 hours to complete the second curing, thus obtaining the IPM module.

[0116] Example 4 The molding resin and IPM module for IPM module were prepared according to the preparation method of Example 1, except that in step S1, the amount of 3-isocyanopropyltriethoxysilane used was 1.8 mol, and a modified epoxy resin with grafted siloxane side chains (grafting degree of 20 wt%) was obtained.

[0117] Example 5 The molding resin and IPM module for IPM module were prepared according to the preparation method of Example 1. The difference is that in step S2, only medium-temperature pre-curing was performed. The conditions for medium-temperature pre-curing included a temperature of 130°C and a time of 6 hours.

[0118] Example 6 The molding resin and IPM module for IPM module were prepared according to the preparation method of Example 1. The difference is that in step S2, only high-temperature post-curing was performed. The conditions for high-temperature post-curing included a temperature of 160°C and a time of 6 hours.

[0119] Example 7 The molding resin and IPM module for IPM module were prepared according to the preparation method of Example 1, except that in step S2, the modified fused silica of Preparation Example 1 was replaced with the modified fused silica of Preparation Example 4.

[0120] Example 8 The molding resin and IPM module for IPM module were prepared according to the preparation method of Example 1, except that in step S2, the modified fused silica of Preparation Example 1 was replaced with the modified fused silica of Preparation Example 5.

[0121] Comparative Example 1 The molding resin and IPM module for the IPM module were prepared according to the preparation method of Example 1, except that in step S2, the amount of modified epoxy resin was 11 parts by weight, the amount of latent curing agent was 8 parts by weight, and the amount of modified fused silica of Preparation Example 1 was 121 parts by weight.

[0122] Comparative Example 2 The molding resin and IPM module for the IPM module were prepared according to the preparation method of Example 1, except that in step S2, the polyimide was replaced with an equal amount of microencapsulated dicyandiamide.

[0123] Comparative Example 3 The molding resin and IPM module for the IPM module were prepared according to the preparation method of Example 1, except that step S1 was omitted and the modified epoxy resin was replaced with an equal amount of bisphenol A epoxy resin in step S2.

[0124] Comparative Example 4 The molding resin and IPM module for the IPM module were prepared according to the preparation method of Example 1, except that step S1 was omitted, and in step S2 the modified epoxy resin was replaced with equal amounts of bisphenol A epoxy resin (NPES 901) and 3-isocyanopropyltriethoxysilane (the molar ratio of bisphenol A epoxy resin (NPES 901) and 3-isocyanopropyltriethoxysilane was 4:1).

[0125] Test case The electrical performance, mechanical performance, and environmental adaptability of the IPM modules of Examples 1-8 and Comparative Examples 1-4 were tested, and the test results are shown in Tables 2 and 3.

[0126] Water absorption (immersion in 100℃ water for 24h), water absorption (121℃ / 100%RH / 2atm for 168h), shear bond strength, glass transition temperature, curing internal stress, high temperature volume resistivity and CET (coefficient of thermal expansion) were tested in accordance with the national standard GB / T40564-2021.

[0127] The HAST test (130℃ / 85%RH) was performed according to JESD22-A110.

[0128] High-temperature storage (175℃) shall be tested in accordance with EIAJED-4701 / 100-202.

[0129] Mechanical impact (500G) shall be tested in accordance with JEDEC JESD22-B104.

[0130] Table 1

[0131] Table 2

[0132] Table 3

[0133] As can be seen from Table 1, the molding resin of the present invention has good interfacial bonding strength, which can reach more than 43 MPa. The molding resin of the preferred embodiments 1-3 of the present invention has even higher interfacial bonding strength, which can reach more than 49 MPa.

[0134] As shown in Tables 2-3, the IPM module prepared by injection molding using the molding resin of this invention can effectively improve the reliability of the IPM module. Specifically, the IPM module prepared by injection molding using the molding resin of this invention has a low water absorption rate (water absorption rate ≤0.18% after immersion in water at 100℃ for 24h, water absorption rate ≤0.38% after immersion at 121℃ / 100%RH / 2atm for 168h), and the glass transition temperature can be increased to above 217℃; the curing internal stress can reach below 8.32MPa, and there is no damage after more than 25 mechanical impacts under 500G conditions; the shear bond strength can reach 3.28MPa; and the high-temperature volume resistivity can reach 7.2×10⁻⁶. 13 The CET (coefficient of thermal expansion) can reach 16.7 × 10⁻⁶. -6The following results show that the HAST test (130℃ / 85%RH) can be passed for more than 800 hours, and the CTI will decrease by at most 4.5% after high-temperature storage (175℃) for 2000 hours.

[0135] The IPM modules of Examples 1-3 using the preferred method of this invention have higher reliability; specifically, the curing internal stress of the IPM module can be as low as 7.62 MPa, and it shows no damage after 30 mechanical impacts under 500G conditions; the high-temperature volume resistivity can reach 8.2 × 10⁻⁶. 13 The CET (coefficient of thermal expansion) can be reduced to 14.6 × 10⁻⁶. -6 It passes the HAST test (130℃ / 85%RH) for 1000h, and after high-temperature storage (175℃) for 2000h, the CTI decrease rate is as low as 3.7%; at the same time, it maintains a reduced water absorption rate and high shear bond strength and glass transition temperature.

[0136] Compared to Example 4, which uses a modified epoxy resin with a grafting degree of 20 wt%, Example 1 of the present invention uses a modified epoxy resin with a grafting degree of 12 wt% combined with a specific curing agent and a specific modified fused silica to prepare a molding resin with an improved interfacial bonding strength of 18.6%, a high-temperature volume resistivity of at least 5%, and a CET (coefficient of thermal expansion) of 4%, effectively improving the reliability of the IPM module.

[0137] Compared to Example 7, which uses a combination of medium-sized and large-sized modified fused silica with modified epoxy resin and a specific combination of curing agents, Example 1 of the present invention uses a molding resin prepared by combining small-sized, medium-sized, and large-sized fused silica with modified epoxy resin and a specific combination of curing agents. The interfacial bonding strength of the resin can be synergistically improved to 51 MPa. The curing internal stress of the prepared IPM module can be reduced by 3.7%, and it shows no damage after 30 mechanical impacts under 500G conditions. The high-temperature volume resistivity is increased by at least 5%, the CET (coefficient of thermal expansion) is reduced by 4.6%, and the CTI decrease rate after 2000 hours of high-temperature storage (175°C) is as low as 3.7%. It also has a lower water absorption rate, effectively improving the reliability of the IPM module.

[0138] It should be noted that the embodiments described above are only for explaining the present invention and do not constitute any limitation on the present invention. The present invention has been described with reference to typical embodiments, but it should be understood that the words used therein are descriptive and explanatory terms, not limiting terms. Modifications can be made to the present invention within the scope of the claims, and revisions can be made to the present invention without departing from the scope and spirit of the present invention. Although the present invention described herein relates to specific methods, materials, and embodiments, it does not mean that the present invention is limited to the specific examples disclosed herein; on the contrary, the present invention can be extended to all other methods and applications with the same function.

Claims

1. A molding resin for IPM modules, characterized in that, The molding resin is prepared by melting and extruding a mixture of raw materials including modified epoxy resin, latent curing agent and modified molten silica and then curing it. The weight ratio of the modified epoxy resin, the latent curing agent, and the modified molten silica is 1:0.2-0.5:5-10; The modified epoxy resin contains grafted siloxane side chains; The latent curing agent includes a first curing agent and a second curing agent, wherein the first curing agent is selected from microencapsulated dicyandiamide and / or modified imidazole, and the second curing agent is selected from polyimide.

2. The molding resin according to claim 1, characterized in that, The temperature of the melt extrusion is 80-90℃; And / or, the curing method includes sequentially performing medium-temperature pre-curing and high-temperature post-curing; the conditions for medium-temperature pre-curing include: a temperature of 120-140℃, preferably 130±2℃; and a time of 1-5h, preferably 1-3h; the conditions for high-temperature post-curing include: a temperature of 150-170℃, preferably 160±5℃; and a time of 1-5h, preferably 3-5h. And / or, the grafting degree of siloxane in the modified epoxy resin is 10wt%-15wt%, preferably 12±0.5wt%; And / or, the method for preparing the modified epoxy resin includes: mixing epoxy resin with siloxane grafting monomers under grafting reaction conditions to obtain modified epoxy resin with grafted siloxane side chains. The molar ratio of the epoxy resin to the siloxane graft monomer is 2-8:1, preferably 3-5:1; And / or, the molecular weight distribution (PDI) of the epoxy resin is <1.5; And / or, the water content of the epoxy resin is <0.05%; And / or, the epoxy resin is selected from at least one of bisphenol A epoxy resin, bisphenol F epoxy resin and phenolic epoxy resin, preferably bisphenol A epoxy resin; And / or, in step S1, the siloxane grafting monomer is selected from at least one of 3-isocyanopropyltriethoxysilane, 3-isocyanopropyltrimethoxysilane and 3-isocyanopropyldimethoxysilane, preferably 3-isocyanopropyltriethoxysilane. And / or, in step S1, the conditions for the grafting reaction include: a reaction temperature of 70-90℃, preferably 75-85℃; and a reaction time of 3-10h, preferably 4-8h.

3. The molding resin according to claim 1 or 2, characterized in that, The weight ratio of the first curing agent to the second curing agent is 1:5-15, preferably 1:8-10; And / or, the first curing agent is microencapsulated dicyandiamide; Preferably, the microencapsulated dicyandiamide comprises 60wt%-80wt% of core material dicyandiamide and 20wt%-40wt% of shell material polyurethane; And / or, the particle size of the microencapsulated dicyandiamide is 3-10 μm, preferably 4-6 μm; And / or, the second curing agent is polyimide; Preferably, the polyimide has a softening point of <25°C and a viscosity of <20000 cP at 80°C; And / or, the raw materials for the modified fused silica include small-particle-size fused silica with a particle size of 1-5 μm, medium-particle-size fused silica with a particle size of 5-10 μm, and large-particle-size fused silica with a particle size of 10-20 μm; Preferably, the weight ratio of the small-particle-size fused silica, the medium-particle-size fused silica, and the large-particle-size fused silica is 1-2:2-3:1; And / or, the method for preparing the modified molten silica includes: under stirring conditions, coating small-particle-size molten silica, medium-particle-size molten silica and large-particle-size molten silica independently with a coupling agent, and then modifying them independently under condensation reaction conditions; Preferably, the coupling agent is used in the form of an aqueous alcohol-water solution, wherein the volume ratio of the coupling agent, alcohol, and water is 1:2-4:1-3; Preferably, the coupling agent used for the small-particle-size molten silica is selected from aminosilanes and / or vinylsilanes, and more preferably aminosilanes; Preferably, the aminosilane is selected from at least one of γ-aminopropyltriethoxysilane, γ-aminopropyltrimethoxysilane, γ-aminopropyldimethoxysilane, N-n-butyl-3-aminopropyltrimethoxysilane and 3-phenylaminopropyltrimethoxysilane, more preferably γ-aminopropyltriethoxysilane. Preferably, the weight ratio of the small-particle-size molten silica to aminosilane is 100:0.1-3; And / or, the coupling agent used for the medium-particle-size molten silica is selected from epoxy silanes and / or phenyl silanes, preferably epoxy silanes; Preferably, the epoxy silane is selected from at least one of 3-glycidyl etheroxypropyltrimethoxysilane, 3-glycidyl etheroxypropyltriethoxysilane and β-(3,4-epoxyethylene)ethyltrimethoxysilane, more preferably 3-glycidyl etheroxypropyltrimethoxysilane; Preferably, the weight ratio of the medium-sized molten silica to the epoxy silane is 100:0.1-3.

4. The molding resin according to claim 3, characterized in that, The coupling agent used for the large-particle-size molten silica is selected from at least two of aminosilane, epoxysilane and vinylsilane, preferably aminosilane and epoxysilane; Preferably, the weight ratio of the large-particle-size molten silica to the total amount of aminosilane and epoxysilane is 100:0.1-3; Preferably, the weight ratio of the aminosilane to the epoxysilane is 1:0.5-1.5; Preferably, the modification method for large-particle-size molten silica includes: under stirring conditions, first coating the large-particle-size molten silica with an aminosilane, performing a first modification under condensation reaction conditions, then coating it with an epoxysilane, and performing a second modification under condensation reaction conditions; or, under stirring conditions, first coating the large-particle-size molten silica with an epoxysilane, performing a first modification under condensation reaction conditions, then coating it with an aminosilane, and performing a second modification under condensation reaction conditions. And / or, the condensation conditions include: a condensation temperature of 70-90°C, preferably 75-85°C; and a condensation time of 40-80 min, preferably 50-70 min.

5. The method for preparing the molding resin for an IPM module according to any one of claims 1-4, characterized in that, The preparation method includes the following steps: Step S1: Under grafting reaction conditions, epoxy resin is mixed with siloxane grafting monomers and reacted to obtain modified epoxy resin with grafted siloxane side chains. Step S2: After mixing the modified epoxy resin, latent curing agent, modified molten silica and additives, the mixture is melt-extruded and then cured to obtain the molded resin; In step S2, the latent curing agent includes a first curing agent and a second curing agent, wherein the first curing agent is selected from microencapsulated dicyandiamide and / or modified imidazole, and the second curing agent is polyimide.

6. The preparation method according to claim 5, characterized in that, In step S1, the molar ratio of the epoxy resin to the siloxane graft monomer is 2-8:1, preferably 3-5:1; Preferably, the epoxy resin has a molecular weight distribution (PDI) < 1.5; And / or, the water content of the epoxy resin is <0.05%; Preferably, the epoxy resin is selected from at least one of bisphenol A epoxy resin, bisphenol F epoxy resin and phenolic epoxy resin, and is preferably bisphenol A epoxy resin; And / or, in step S1, the siloxane grafting monomer is selected from at least one of 3-isocyanopropyltriethoxysilane, 3-isocyanopropyltrimethoxysilane and 3-isocyanopropyldimethoxysilane, preferably 3-isocyanopropyltriethoxysilane. And / or, in step S1, the conditions for the grafting reaction include: a reaction temperature of 70-90℃, preferably 75-85℃; and a reaction time of 3-10h, preferably 4-8h. And / or, in step S2, the temperature of the melt extrusion is 80-90°C; And / or, the curing method includes sequentially performing medium-temperature pre-curing and high-temperature post-curing; the conditions for medium-temperature pre-curing include: a temperature of 120-140℃, preferably 130±2℃; and a time of 1-5h, preferably 1-3h; the conditions for high-temperature post-curing include: a temperature of 150-170℃, preferably 160±5℃; and a time of 1-5h, preferably 3-5h. And / or, the weight ratio of the modified epoxy resin, the latent curing agent and the modified molten silica is 1:0.2-0.5:5-10; And / or, the weight ratio of the first curing agent and the second curing agent is 1:5-15, preferably 1:8-10; And / or, the first curing agent is microencapsulated dicyandiamide; Preferably, the microencapsulated dicyandiamide comprises 60wt%-80wt% of core material dicyandiamide and 20wt%-40wt% of shell material polyurethane; And / or, the particle size of the microencapsulated dicyandiamide is 3-10 μm, preferably 4-6 μm; Preferably, the polyimide has a softening point of <25°C and a viscosity of <20000 cP at 80°C.

7. The preparation method according to claim 5 or 6, characterized in that, The raw materials for the modified fused silica include small-particle-size fused silica with a particle size of 1-5 μm, medium-particle-size fused silica with a particle size of 5-10 μm, and large-particle-size fused silica with a particle size of 10-20 μm. Preferably, the weight ratio of the small-particle-size fused silica, the medium-particle-size fused silica, and the large-particle-size fused silica is 1-2:2-3:1; And / or, the method for preparing the modified molten silica includes: under stirring conditions, coating small-particle-size molten silica, medium-particle-size molten silica and large-particle-size molten silica independently with a coupling agent, and then modifying them independently under condensation reaction conditions; Preferably, the coupling agent is coated in the form of an alcohol-water solution, and the volume ratio of the coupling agent, alcohol and water is 1:2-4:1-3. Preferably, the coupling agent used for the small-particle-size molten silica is selected from aminosilanes and / or vinylsilanes, and more preferably aminosilanes; Preferably, the aminosilane is selected from at least one of γ-aminopropyltriethoxysilane, γ-aminopropyltrimethoxysilane, γ-aminopropyldimethoxysilane, N-n-butyl-3-aminopropyltrimethoxysilane and 3-phenylaminopropyltrimethoxysilane, more preferably γ-aminopropyltriethoxysilane. Preferably, the weight ratio of the small-particle-size molten silica to aminosilane is 100:0.1-3; And / or, the coupling agent used for the medium-particle-size molten silica is selected from epoxy silanes and / or phenyl silanes, preferably epoxy silanes; Preferably, the epoxy silane is selected from at least one of 3-glycidyl etheroxypropyltrimethoxysilane, 3-glycidyl etheroxypropyltriethoxysilane and β-(3,4-epoxyethylene)ethyltrimethoxysilane, more preferably 3-glycidyl etheroxypropyltrimethoxysilane; Preferably, the weight ratio of the medium-sized molten silica to the epoxy silane is 100:0.1-3.

8. The preparation method according to claim 7, characterized in that, The coupling agent used for the large-particle-size molten silica is selected from at least two of aminosilane, epoxysilane and vinylsilane, preferably aminosilane and epoxysilane; Preferably, the weight ratio of the large-particle-size molten silica to the total amount of aminosilane and epoxysilane is 100:0.1-3; Preferably, the weight ratio of the aminosilane to the epoxysilane is 1:0.5-1; Preferably, the modification method of the large-particle-size molten silica includes: under condensation conditions, first treating the large-particle-size molten silica with an aminosilane coating for a first modification, and then treating it with an epoxysilane coating for a second modification; or, under condensation conditions, first treating the large-particle-size molten silica with an epoxysilane coating for a first modification, and then treating it with an aminosilane coating for a second modification. And / or, the condensation conditions include: a condensation temperature of 70-90°C, preferably 75-85°C; and a condensation time of 40-80 min, preferably 50-70 min. And / or, the weight ratio of the modified epoxy resin to the additives is 100:1-5; Preferably, the additives include leveling agents and release agents; Preferably, the weight ratio of the leveling agent to the release agent is 1:0.5-1.

5.

9. A method for preparing an IPM module, characterized in that, The method for preparing the IPM module includes: Step (1): Preheat the molding resin according to any one of claims 1-4 or the molding resin prepared by the preparation method according to any one of claims 5-8; Step (2): Under injection molding conditions, the preheated molding resin is injected into the IPM module mold for injection molding to obtain the IPM module semi-finished product; Step (3): The obtained IPM module semi-finished product is cured to obtain the IPM module; Preferably, in step (1), the preheating conditions include: a preheating temperature of 70-90℃ and a preheating time of 1-5 min; And / or, in step (2), the injection molding conditions include: an injection speed of 1.4-3.6 mm / s and an IPM mold temperature of 165-175°C; Preferably, the injection molding conditions further include: a first injection pressure of 15-25 MPa and a first injection pressure holding time of 8-12 seconds; And / or, the injection molding conditions further include: reducing the pressure from the first injection pressure to the second injection pressure at a rate of 0.15-0.5 MPa / s, and holding the second injection pressure for 50-70 seconds; Preferably, the second injection pressure is 12-18 MPa; And / or, the IPM module mold contains a chip and a copper substrate; And / or, in step (3), the curing includes a first curing and a second curing performed sequentially; the conditions for the first curing include: a temperature of 80-120℃ and a time of 1-3h; the conditions for the second curing include: a temperature of 150-200℃ and a time of 2-6h.

10. An IPM module prepared by the method of claim 9.

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