A robot IO board fault maintenance method

Abstract

The application relates to the technical field of robots, in particular to a robot IO board fault maintenance method, which comprises the following steps: checking the IO board, determining a damaged signal, checking a backup point, replacing an actual wiring output point, modifying a signal address and the like; through the method, the damaged IO board can be replaced with a backup point, the utilization rate of the IO module is improved; meanwhile, when the number of damaged IO points is too large, the following operation method can be used to check, replace a chip and repair an integrated circuit board fault, and the cost of spare parts is saved.

Description

Technical Field

[0001] This invention relates to the field of robotics, and more specifically to a method for repairing faults in a robot's I / O board. Background Technology

[0002] ABB robots are widely used in industrial production, but their DSQC652IO boards may experience damage, burnout, or short circuits during use, causing the robot to malfunction. Currently, ABB robot IO boards are relatively expensive, and repair outcomes are often unsatisfactory, increasing costs for companies.

[0003] Therefore, by replacing spare parts and repairing the IO module circuit boards, the utilization rate of the IO boards can be improved and the cost of spare parts can be reduced. Summary of the Invention

[0004] In view of the problems existing in the prior art, the purpose of this invention is to provide a method for repairing robot I / O board faults.

[0005] The technical solution adopted by this invention to solve its technical problem is: a method for repairing robot I / O board faults, comprising the following steps:

[0006] S1: Open the control box to observe, and enter the teach pendant input / output window. Select the IO unit in the view.

[0007] S2: By forcing input and output, check whether the fixture action output and the corresponding indicator point on the corresponding IO board are flashing. If the point is burned, force the rear light to turn off. If the point is forced by a signal, the two adjacent lights will light up.

[0008] S3: Determine the signal name of the burn-in point, the corresponding address on the teach pendant and the address on the actual I / O board;

[0009] S4: Prepare for the rollback. Check if the I / O board has a spare I / O point, and force the I / O point through the teach pendant to confirm that the spare I / O point is normal.

[0010] S5: Complete the replacement of the actual wiring output point;

[0011] S6: The teach pendant enters the main interface, selects the configuration of the control panel, and configures the signal of the FlexPendant system;

[0012] S7: After entering the Signal interface, find the name of the damaged output point, select Edit, select UnitMapping2 address number, double-click, and change it to the address number of the spare point.

[0013] Preferably, in step S2, a multimeter is used to measure the diode. If both LED indicators are lit, it indicates a faulty connection; if the LED indicators are not lit, the corresponding output point is damaged.

[0014] Preferably, after confirming that there are no errors in step S7, the teach pendant prompts for a restart.

[0015] The present invention has the following beneficial effects:

[0016] 1) This method enables the replacement of damaged I / O boards with spare points, thereby improving the utilization rate of I / O modules.

[0017] 2) If too many IO points are damaged, this method can be used to check and replace the chip to repair the integrated circuit board fault, saving spare parts costs. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the I / O board.

[0019] In the diagram: 1-Output indicator light; 2-Output interface; 3-8-channel output chip; 4-DeviceNet communication interface; 5-Main control CPU; 6-Input optocoupler chip; 7-Communication indicator light; 8-Power indicator light; 9-Input interface; 10-Input indicator light. Detailed Implementation

[0020] The technical solutions of the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0021] A method for troubleshooting robot I / O boards, such as Figure 1 As shown, it mainly consists of the following components: output indicator light 1, output interface 2, 8-channel output chip 3, Devicenet communication interface 4, main control CPU 5, input optocoupler chip 6, communication indicator light 7, power indicator light 8, input interface 9, and input indicator light 10.

[0022] The ABB Robotics DSQC652 IO board is an I / O signal board with 16 digital inputs and 16 digital outputs.

[0023] The five interface functions are as follows:

[0024] ●X1 and X2 are digital output terminals. Each terminal has 10 terminals, of which 1-8 are output channels, 9 is 0V, and 10 is 24V+.

[0025] ●X3 and X4 are digital input terminals. Each terminal has 10 terminals, of which 1-8 are input channels, 9 is 0V, and 10 is unused.

[0026] ●X5 is used to connect to the DeviceNet bus and set the address of the IO signal board on the bus.

[0027] The robot's I / O board frequently experiences the following malfunctions during use.

[0028] There are three types of faults:

[0029] 1) The program outputs the I / O point but it does not actually output the I / O point, indicating that the I / O point is damaged;

[0030] 2) The program fails to output the actual I / O point output, a phenomenon known as "burning out the I / O point."

[0031] 3) A program outputs one IO point but actually outputs multiple IO points, referred to as continuous output.

[0032] For the aforementioned faults, the robot manufacturer does not have a complete solution. When a fault affects on-site use, the only solution is to replace the I / O board with a brand new one. Since this model of I / O board is widely used in on-site arc welding workstations, the repair cost of replacing it after damage is too high. We can consider the on-site damage and I / O board occupancy. If it has 16 I / O outputs, because the robot arc welding station has a 30% interface margin in its design options, it can continue to be used by replacing the I / O points.

[0033] If the I / O board has too many damaged points and can no longer meet the requirements for field use, it can be repaired through maintenance.

[0034] ●Methods for measuring the I / O module using a multimeter.

[0035] ● Use a hot air gun to replace the damaged chip.

[0036] ●Inspect the chip soldering condition and address any poorly soldered or shorted pins.

[0037] A method for troubleshooting robot I / O boards: When the gripper of an arc welding station robot is moving, if the gripper's movements are erratic, or if two grippers move in one step when clamping and releasing, or if the movements are chaotic or nonexistent, it is suspected that the I / O points are damaged. The DSQC652 I / O board needs to be inspected. If damaged, burned, or short-circuited, and if spare output points are available, the input / output points can be replaced.

[0038] 1) Open the control box and observe, and enter the teach pendant input / output window. Select the IO unit in the view. Generally, the 652 board is BORAD12 or BORAD13. Select the signal or double-click to view.

[0039] 2) By forcing input / output (01 change assignment), check whether the fixture action output and the corresponding indicator point on the corresponding IO board are flashing. If the point is burned, force the back light to turn off. If a signal is forced through the serial point, the two adjacent lights will light up.

[0040] 3) Determine the signal name of the burn-in point, and its corresponding address on the teach pendant and the actual address on the I / O board. Taking the output signal DO13_LeftOpenOn as an example, the address DO is 13, and the actual connection on the I / O board is point 14.

[0041] 4) Prepare for the failover. Check if the I / O board has any spare I / O points, and force the I / O points to function correctly using the teach pendant. For example, if point 16 on the I / O board is empty, the teach pendant address is 15.

[0042] 5) Complete the replacement of the actual wiring output point, and connect the wire from 14 to 16.

[0043] 6) Once the teach pendant enters the main interface, select Control Panel—Configure FlexPendant System—Signal

[0044] 7) After entering the Signal interface, scroll down to find the name of the signal whose output point is faulty. In this example, find the DO13_LeftOpenOn signal, select Edit, select Unit Mapping2 address number, double-click, and change the address number of the spare point from the original 13 to 15.

[0045] 8) After confirming that everything is correct, the teach pendant will prompt you to restart.

[0046] 9) Through the above 8 steps, complete the identification of IO burn-out points or damage and replace the damaged points.

[0047] Precautions:

[0048] Because there are 16 output points, some output points may be idle or unused during field use. By resetting and replacing the address of the damaged I / O point, the I / O module can continue to function. Alternatively, a multimeter can be used to measure the diode settings. Measure the negative terminal of the power supply and the positive terminal of the output connector. Connect the black probe to the second pin from the left of output connector 9 (0V). Connect the red probe to the third pin of the first row and the last pin, and then to the third pin of the second row and the last pin. If both LEDs light up simultaneously, it indicates a faulty I / O point. If the corresponding LED does not light up, the corresponding output point is damaged. Properly label these points; they can be used in robot workstations where output points are used less frequently.

[0049] However, when there are no spare points available, a new IO module must be used. To reduce the failure rate, the initial analysis indicated that the frequent output failures of the IO modules were due to the output point controlling the solenoid valve coil, which draws a large current during operation, easily causing damage to the output point. By adding intermediate relays, a small current is used to control a large current, reducing the output point current. After installing intermediate relays on all IO modules of the arc welding stations on site, the number of IO point failures decreased significantly.

[0050] However, occasional I / O point failures still occurred during later use. After consulting with the manufacturer and customers using similar products, the analysis concluded that the problem might be a design flaw. Initially, the spare I / O output points were replaced, but the existing I / O modules in the field could no longer meet the usage requirements.

[0051] The unit price of an ABB robot I / O board is 18,000 yuan. There are nearly 50 robot I / O boards in use on site, and an average of 1-2 I / O boards are consumed every year. In recent years, we have mainly relied on purchasing new spare parts to restore the system. At present, we have achieved a breakthrough in the repair of damaged I / O boards through independent research and development, thus saving on the cost of I / O board spare parts.

[0052] The main symptoms of I / O board damage are output point damage or short circuits. Using a multimeter to measure and check the functions of each chip on the circuit board, the short circuit was determined to be caused by two damaged integrated chips. Replacing the chips and resoldering them restored normal operation. However, the chip has solder on its bottom for heat dissipation and many pins, making it impossible to remove with a regular soldering iron. A soldering iron with a hot air gun and adjustable temperature is required.

[0053] This is a 2-in-1 hot air gun and soldering iron desoldering station with a digital display and adjustable temperature. After several attempts, the hot air gun temperature was controlled at around 350°C (the temperature may vary slightly depending on the hot air gun; too low a temperature will prevent the solder from melting, while too high a temperature will damage the circuit board). The airflow was adjusted to level 3 (too low a speed won't remove the chip, too high a speed will blow away surrounding inductors and resistors). When removing the chip, because the chip is close to the plastic connector, the hot air gun can damage the connector when heated. High-temperature resistant tape is needed to protect surrounding components. Apply solder paste evenly around the chip, hold the hot air gun nozzle about 8mm above the chip, and rotate it at a constant speed to heat the chip. Observe that the solder on the leads becomes bright. After heating for a few seconds, use tweezers to pick up the chip while it is still hot. After removing the chip, use desoldering tape to remove excess solder from the circuit board. When installing the chip, apply solder paste and solder paste evenly to the pins and heat sink, then place the new chip on top. Ensure that the chip's notched corner and origin position are consistent with the removal position; do not install it backwards. Then, using a disassembly method, heat the chip evenly above it. Once the solder paste melts, gently push the chip with tweezers; if it can be reset, the soldering is complete. After soldering, check the soldered pins for cold solder joints and short circuits. If cold solder joints are found, resolder them. If short circuits are found, use a soldering iron with solder flux to drag the solder through. If there are no abnormalities after completion, it can be installed on the robot for testing. By mastering the technology of replacing core components, a breakthrough in robot I / O board repair has been achieved.

[0054] This invention is not limited to the above-described embodiments. Anyone should know that any structural changes made under the guidance of this invention, and any technical solutions that are the same as or similar to this invention, fall within the protection scope of this invention.

[0055] The technologies, shapes, and structures not described in detail in this invention are all known technologies.

Claims

1. A method for repairing robot I / O board faults, characterized in that, Includes the following steps: S1: Open the control box to observe, and enter the teach pendant input / output window. Select the IO unit in the view. S2: By forcing input and output, check whether the fixture action output and the corresponding indicator point on the corresponding IO board are flashing. If the point is burned, force the rear light to turn off. If the point is forced by a signal, the two adjacent lights will light up. S3: Determine the signal name of the burn-in point, the corresponding address on the teach pendant and the address on the actual I / O board; S4: Prepare for the rollback. Check if the I / O board has a spare I / O point, and force the I / O point through the teach pendant to confirm that the spare I / O point is normal. S5: Complete the replacement of the actual wiring output point; S6: The teach pendant enters the main interface, selects the configuration of the control panel, and configures the signal of the FlexPendant system; S7: After entering the Signal interface, find the name of the damaged output point, select Edit, select UnitMapping2 address number, double-click, and change it to the address number of the spare point.

2. The method for repairing robot I / O board faults according to claim 1, characterized in that, In step S2, a multimeter is used to measure the diode. If both LED indicators are lit, it indicates a faulty connection; if the LED indicators are not lit, the corresponding output point is damaged.

3. The method for repairing robot I / O board faults according to claim 1, characterized in that, After confirming that everything is correct in step S7, the teach pendant prompts for a restart.

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