Substrate assembly manufacturing method

Abstract

A substrate assembly manufacturing method includes a circuit board, an image sensor disposed on one side of the circuit board, a connecting member for electrically connecting the circuit board and the image sensor, and an injection-molded portion that houses the connecting member and is bonded to the circuit board and the image sensor. The injection-molded portion is formed of a thermosetting material that is in a liquid state at room temperature, and is heated and solidified after being injected into a molding die portion in the liquid state, thereby being fastened to the circuit board and the image sensor.

Description

Technical Field

[0001] This invention relates to a method for manufacturing a substrate assembly, and more specifically, to a method for manufacturing a substrate assembly including a circuit board and an image sensor. Background Technology

[0002] The content described in this section is merely to provide background information on the present invention and does not constitute prior art.

[0003] Mobile phones or smartphones are being developed that are equipped with a camera device capable of capturing images or videos of a subject and storing them as such. Typically, a camera device may include a lens, an image sensor module, and a lens drive mechanism for adjusting the distance between the lens and the image sensor module.

[0004] Miniature camera devices are built into portable devices such as mobile phones, smartphones, tablets, and laptops. The lens drive mechanism can perform autofocus (AF) by adjusting the distance between the image sensor and the lens to correct the lens's focal length.

[0005] Furthermore, during the filming process, the camera device may shake slightly due to the user's hand tremors. In order to correct the image or video distortion caused by the user's hand tremors, a camera device with additional optical image stabilizing (OIS) function has been developed.

[0006] The camera device may include an image sensor that detects an image of an object being photographed and a substrate assembly including a circuit board that controls the operation of the image sensor.

[0007] The image sensor and the circuit board are electrically connected to each other and mounted on the substrate assembly. Furthermore, methods to reduce defects and costs during the manufacturing process of the substrate assembly need to be developed. Summary of the Invention

[0008] The technical issues to be solved The purpose of this invention is to provide a method for manufacturing a substrate assembly having an image sensor and a circuit board electrically connected to each other.

[0009] Furthermore, the object of the present invention is to provide a substrate assembly manufacturing method that can reduce defects and save costs during the manufacturing process of substrate assemblies.

[0010] The purpose of this invention is not limited to the purposes mentioned above. Other purposes and advantages of this invention not mentioned can be understood through the following description and will become more apparent through embodiments of this invention. Furthermore, it is readily understood that the purposes and advantages of this invention can be achieved through solutions and combinations thereof within the scope of the claims.

[0011] Technical solutions to technical problems One embodiment of the substrate assembly manufacturing method may be a substrate assembly manufacturing method including the following components: a circuit board; an image sensor disposed on one side of the circuit board; a connecting component for electrically connecting the circuit board and the image sensor; and an injection molding part for housing the connecting component and combining it with the circuit board and the image sensor.

[0012] The injection molding part is formed from a thermosetting material that is liquid at room temperature. After being injected into the molding die, it is heated and cured, thereby securing it to the circuit board and image sensor.

[0013] The molding die may include: a first molding die supporting one side of the circuit board; a second molding die combined with the first molding die to form an internal space; and an internal molding die disposed in the space formed by the first molding die and the second molding die, into which the injection part is injected.

[0014] The internal molding die can be made of silicon.

[0015] Before injecting the injection part into the internal mold, a release agent can be sprayed into the internal mold to separate the injection part from the internal mold.

[0016] The second molding die may include a first injection port for injecting liquid to form the injection part, and the inner molding die includes a second injection port, which is located at a position corresponding to the first injection port, for injecting liquid to form the injection part.

[0017] The first molding die includes a first magnet that can be detachably combined with a second molding die, and the second molding die includes a second magnet disposed at a position corresponding to the first magnet and detachably combined with the first molding die.

[0018] An embodiment of the substrate assembly manufacturing method may include the following steps: spraying a release agent into an internal molding die; assembling the substrate assembly in the molding die section; injecting a substance that is liquid at room temperature into the molding die section; heating the liquid substance to solidify it to form an injection molded part as a solid; and separating the injection molded part from the molding die section.

[0019] The steps of assembling the substrate assembly in the molding die section may include the following steps: assembling the substrate assembly without the injection part in the first molding die; assembling the second molding die and the inner molding die; and combining the first molding die and the second molding die.

[0020] An embodiment of the substrate assembly manufacturing method may further include the step of cleaning the exposed surface of the image sensor.

[0021] The step of separating the molding die from the injection molding part may include the following steps: separating the second molding die; separating the inner molding die; providing a screen part for preventing foreign objects from being exposed at the location of the image sensor; cutting the protrusions protruding from the injection molding part; and separating the screen part and the first molding die.

[0022] The screen can be made of Poron material.

[0023] Release agents can be made of soybean oil or silicone.

[0024] Another embodiment of the substrate assembly manufacturing method is a substrate assembly manufacturing method including the following components: a circuit board; an image sensor disposed on one side of the circuit board; a connecting member for electrically connecting the circuit board and the image sensor; and an injection molding portion formed by a molding die portion, which houses the connecting member and is combined with the circuit board and the image sensor. The molding die portion may include: a first molding die supporting one side of the circuit board; a second molding die combined with the first molding die and forming a space therein; and an inner molding die disposed in the space formed by the first and second molding dies. The injection molding portion is injected into the inner molding die, and before injecting the injection molding portion into the inner molding die, a release agent is sprayed into the inner molding die to separate the injection molding portion from the inner molding die.

[0025] Another embodiment of the substrate assembly manufacturing method may include the following steps: spraying a release agent into an internal molding die; assembling the substrate assembly in the molding die section; injecting a substance that is liquid at room temperature into the molding die section; heating the liquid substance to solidify it to form an injection molded part as a solid; separating the injection molded part from the molding die section; and cleaning the exposed surfaces of the image sensor.

[0026] The step of separating the molding die from the injection molding part may include the following steps: separating the second molding die; providing a screen part for preventing foreign objects from being exposed at the location of the image sensor; separating the inner molding die; cutting the protrusion protruding from the injection molding part; and separating the screen part and the first molding die.

[0027] The steps of assembling the substrate assembly in the molding die section may include the following steps: assembling the substrate assembly without the injection part in the first molding die; assembling the second molding die and the inner molding die; and combining the first molding die and the second molding die.

[0028] Invention Effects In the substrate assembly manufacturing method of the present invention, compared with the case of heating solid raw materials to form a high-temperature liquid and molding, the amount of heat energy consumed in the whole process can be significantly reduced, and thus the energy consumption can be significantly reduced in the whole process.

[0029] Furthermore, in the substrate assembly manufacturing method of the present invention, the injection molding part has good fluidity in a room temperature liquid state before heat is applied, so it is smoothly distributed in the design space of the molding die part. Therefore, compared with the case of high temperature liquid flow, the formation deformation and porosity of the injection molding part can be significantly reduced.

[0030] Furthermore, in the substrate assembly manufacturing method of the present invention, when the injection molding part is solidified by heating, the injection molding part and the inner molding die can adhere to each other. In this case, if the inner molding die is separated, the injection molding part is attached to the inner molding die, and thus, the injection molding part may separate from the image sensor or circuit board, potentially resulting in product defects.

[0031] To prevent this from happening, a release agent is sprayed into the inner mold before injection molding begins, allowing the injection part to easily separate from the inner mold, thereby preventing product defects.

[0032] Furthermore, in the substrate assembly manufacturing method of the present invention, the internal molding die can be formed of a material that is prone to elastic deformation, has good adhesion, and high heat resistance, such as silicone. Therefore, during the heating process, the internal molding die effectively withstands high temperatures and effectively prevents liquid injection molding raw materials from leaking into the gaps.

[0033] In addition to the effects described above, the specific effects of the present invention are also described in the process of explaining the specific matters for carrying out the following invention. Attached Figure Description

[0034] Figure 1 A diagram illustrating a substrate assembly according to one embodiment.

[0035] Figure 2 This diagram illustrates the assembly state of the substrate assembly and the molding die in one embodiment.

[0036] Figure 3 A flowchart illustrating a method for manufacturing a substrate assembly according to an embodiment.

[0037] Figure 4 A flowchart illustrating the steps of assembling the substrate assembly in the molding die section.

[0038] Figure 5 This diagram illustrates the steps of assembling a substrate assembly in the molding die section.

[0039] Figure 6 A flowchart illustrating the steps of separating the injection molding part from the mold part.

[0040] Figure 7 This diagram illustrates the state after the internal molding die has been separated following the molding of the injection section.

[0041] Figure 8 A diagram illustrating the steps of cleaning the exposed surface of an image sensor. Detailed Implementation

[0042] The objectives, features, and advantages described herein will be referenced in the appendix. Figure 1 As will be described in detail below, those skilled in the art to which this invention pertains can readily implement the technical concept of this invention. In describing this invention, detailed descriptions of well-known technologies related to this invention will be omitted if it is determined that such detailed descriptions would obscure the main idea of ​​the invention. Hereinafter, preferred embodiments of the invention will be described in detail with reference to the accompanying drawings. In the drawings, the same reference numerals denote the same or similar structural elements.

[0043] Although terms like "first," "second," etc., are used to describe various structural elements, these structural elements are not limited to these terms. These terms are only used to distinguish between two structural elements, and unless specifically contradicted, the first structural element may also be the second structural element.

[0044] Throughout the specification, unless otherwise stated, each structural element may be a single element or a plurality of elements.

[0045] Unless otherwise expressly indicated in the context, the singular expressions used in this specification include the plural expressions. In this application, terms such as “constituting” or “comprising” should not be construed as necessarily including all structural elements or steps described in the specification, but should be interpreted as possibly excluding some of the structural elements or steps, or possibly including additional structural elements or steps.

[0046] Throughout the instruction manual, when “A and / or B” is mentioned, it means A, B, or A and B unless otherwise stated. When “C to D” is mentioned, it means C and below unless otherwise stated.

[0047] Figure 1 The figure illustrates a substrate assembly 100 according to one embodiment. The substrate assembly 100 of the embodiment may be part of a component mounted on a small camera device such as a smartphone.

[0048] The substrate assembly 100 may include a circuit board 110. The circuit board 110 may control the operation of the image sensor 120 and the camera device including therein.

[0049] The circuit board 110 can receive images of the captured object detected by the image sensor 120 from the image sensor 120, and can be equipped with various active devices, passive devices and circuits for the operation of the image sensor 120 and the camera device, and can be implemented by the control unit.

[0050] The substrate assembly 100 may include an image sensor 120 disposed on one side of the circuit board 110. One side of the image sensor 120 faces the lens, thereby enabling it to detect an image of the subject included in the light passing through the lens. The image sensor 120 may be electrically connected to the circuit board 110.

[0051] The substrate assembly 100 may include: a flexible substrate 150 electrically connected to the circuit board 110; and a socket 160 coupled to an end of the flexible substrate 150 for electrically connecting an external device to a camera device including the substrate assembly 100.

[0052] The substrate assembly 100 may include a connection member 130 that electrically connects the circuit board 110 to the image sensor 120. For example, the connection member 130 may be a metal wire or an electrical component. One side of the connection member 130 may be connected to the edge of the image sensor 120, and the other side may be connected to the edge of the circuit board 110.

[0053] Viewed from a planar perspective, the image sensor 120 can be roughly formed as a rectangular plate. Multiple connecting components 130 can be spaced apart from each other along the edges of the image sensor 120.

[0054] If the connecting component 130 is formed in an exposed state at the edge of the image sensor 120 and the circuit board 110, the connecting component 130 may come into contact with other components of the substrate assembly 100, which may result in an electrical short circuit. Furthermore, there is a concern that the connecting component 130 may be damaged by colliding with other components.

[0055] In this configuration, to prevent the connecting component 130 from contacting or colliding with other components, the space volume of the connecting component 130 should be relatively large. In this structure, the overall volume or height of the camera device, including the substrate assembly 100, will increase, making it difficult to miniaturize or thin the camera device. Furthermore, it is difficult to stably suppress electrical short circuits in this structure.

[0056] Therefore, in order to suppress electrical short circuits in the connecting member 130 and collisions with other components, and to miniaturize and thin the camera device, it is necessary to stably house the connecting member 130. For this purpose, the substrate assembly 100 of the embodiment may include an injection-molded portion 140.

[0057] The substrate assembly 100 may include an injection molding portion 140 that houses connecting members 130 and is coupled to the circuit board 110 and the image sensor 120. The injection molding portion 140 may be formed of an electrically insulating material. Each injection molding portion 140 may house multiple connecting members 130. The injection molding portion 140 may be molded using the molding die portion 200 described later.

[0058] In this specification, the accompanying drawings are sectional views, thus only disclosing the cross-section of the injection molding portion 140. However, the injection molding portion 140 may surround the edge of the four-sided plate-shaped image sensor 120, and may accommodate the connecting member 130 disposed on the edge of the image sensor 120.

[0059] All connecting parts 130 are housed inside the injection molding portion 140, which serves as an electrical insulator. Therefore, compared to connecting parts 130 exposed without the injection molding portion 140, contact or collision with other parts is prevented, thereby effectively suppressing electrical short circuits or damage to the connecting parts 130.

[0060] Therefore, from a planar perspective, the injection molding part 140 can be formed as a quadrilateral shape with a hollow quadrilateral inside. The internal molding die 230, described later, can also be formed as a quadrilateral shape with a hollow quadrilateral inside, so as to correspond to the shape of the injection molding part 140.

[0061] The injection-molded part 140 can be manufactured by injection molding to house the connecting parts 130 internally. Once the injection-molded part 140 has been injection molded and solidified, it is attached to and fixed to the image sensor 120 and the circuit board 110.

[0062] In the substrate assembly 100 manufacturing method of the embodiment, the injection molding portion 140 may be formed of a thermosetting material that has electrical insulation properties and is liquid at room temperature. For example, the injection molding portion 140 may be formed of a thermosetting resin that is liquid at room temperature.

[0063] Specifically, for example, the injection-molded portion 140 may be formed of resin, more precisely, it may be formed of epoxy resin.

[0064] After the injection molding part 140 injects liquid into the molding mold part 200, it is heated and solidified, so that it can be attached to the circuit board 110 and the image sensor 120.

[0065] In general, injection molding of plastic materials involves heating solid raw materials to form a high-temperature liquid state, which is then placed into an injection mold. The liquid raw materials cool and solidify in the injection mold, thus completing the solid shape.

[0066] Furthermore, in this situation, excessive heat energy will be consumed during the heating of solid raw materials, potentially reducing energy efficiency. Also, over time, the high-temperature liquid raw materials will cool, either partially solidifying or experiencing a decrease in viscosity due to cooling, thus potentially reducing fluidity.

[0067] As a result, the flow of liquid raw materials is not smooth, and they are not evenly distributed in the internal space of the injection mold and do not fill part of the internal space of the injection mold. As a result, they have a shape that is different from the shape of the injection mold and form air bubbles, which may lead to defects.

[0068] In this embodiment, the injection molding section 140 can be injected into the molding die section 200 in a liquid state at room temperature. Therefore, compared to heating solid raw materials at room temperature to form a high-temperature liquid, no heat energy is required for liquefaction.

[0069] Of course, in this embodiment, heating is required to solidify the liquid injection molding portion 140 into a solid. However, while liquefaction requires heat, solidification is not required when heating a liquid to solidify it.

[0070] Therefore, considering the amount of heat energy consumed throughout the process, energy consumption can be significantly reduced in the substrate assembly 100 manufacturing method of the embodiment compared to the general case.

[0071] Furthermore, at room temperature in a liquid state, the injection part 140 has good fluidity before heat is applied, and thus it is smoothly distributed within the design space of the molding die part 200. Therefore, compared with the case of high temperature liquid flow, the formation deformation and porosity of the injection part 140 can be significantly reduced.

[0072] Figure 2 This diagram illustrates the state in which the substrate assembly 100 and the molding die 200 are combined according to one embodiment. The molding die 200 can be used to mold the injection molding part 140.

[0073] The molding die 200 may include a first molding die 210 that supports one side of the circuit board 110. A recessed portion may be provided in the first molding die 210 to accommodate the circuit board 110 and the substrate assembly 100 in order to contact and support the circuit board 110. The recessed portion may accommodate the circuit board 110, the image sensor 120, and the connecting component 130.

[0074] The molding die 200 may include a second molding die 220 that is combined with the first molding die 210 and forms a space therein. A recessed portion may be formed in the second molding die 220 to form a space for receiving the substrate assembly 100.

[0075] If the first molding die 210 and the second molding die 220 are combined with each other, the recessed portions of the first molding die 210 and the second molding die 220 can become spaces for accommodating the inner molding die 230 and the substrate assembly 100.

[0076] The first molding die 210 and the second molding die 220 can be made by injection molding or machining of materials with good durability and formability, such as metal.

[0077] The molding die section 200 may include an internal molding die 230 disposed in the space where a first molding die 210 and a second molding die 220 are formed, and the injection part 140 is injected into the internal molding die 230. The ends of the internal molding die 230 contact the image sensor 120 and the circuit board 110 respectively, thereby forming a space filled with liquid injection molding material and forming the injection part 140.

[0078] As described above, the internal molding die 230 can be formed into a shape corresponding to the injection molding part 140. For example, from a planar perspective, it can be formed into a rectangular shape with a hollow interior.

[0079] The end of the internal molding die 230 needs to be tightly fitted to the image sensor 120 and the circuit board 110 to prevent liquid injection molding material from leaking out of the gap. For example, when the image sensor 120 is placed on one side of the circuit board 110 at a slight angle, the gap between the internal molding die 230 and the substrate assembly 100 can become more noticeable. The end of the internal molding die 230 needs to be tightly fitted to the image sensor 120 and / or the circuit board 110 to prevent such gaps from occurring.

[0080] Furthermore, since the injection molding raw materials are heated and cured, the internal molding die 230 needs to be made of a material with high heat resistance.

[0081] Therefore, the internal molding die 230 can be formed of a material that is easily elastically deformable, has good adhesion, and is highly heat-resistant, such as silicon. However, the material of the internal molding die 230 is not limited to this.

[0082] In this embodiment, the internal molding die 230 can be formed of a material that readily undergoes elastic deformation, has good adhesion, and high heat resistance, such as silicon. Therefore, the internal molding die 230 effectively withstands high temperatures during heating, effectively suppressing leakage of liquid injection molding raw materials into the gaps.

[0083] The second molding die 220 may include a first injection port 221 for injecting liquid to form the injection section 140.

[0084] The internal molding die 230 may include a second injection port 231 located at a position corresponding to the first injection port 221 for injecting liquid to form the injection part 140.

[0085] Multiple first injection ports 221 and second injection ports 231 can be spaced apart from each other along the length direction of the injection portion 140 surrounding the edge of the rectangular image sensor 120.

[0086] The first injection port 221 and the second injection port 231 are positioned in corresponding locations, therefore, as Figure 2 As shown by the arrow, liquid injection molding material for forming injection part 140 flows into the first injection port 221 and the second injection port 231 and fills the space formed by the internal molding die 230, thereby forming injection part 140.

[0087] In order to carry out the injection molding process 140, the first molding die 210 and the second molding die 220 need to be detachably combined. For this combination, magnets can be provided in the first molding die 210 and the second molding die 220.

[0088] The first molding die 210 may include a first magnet 211 that is detachably coupled to the second molding die 220. The second molding die 220 may include a second magnet 222 disposed at a position corresponding to the first magnet 211 and detachably coupled to the first molding die 210.

[0089] For example, the first magnet 211 and the second magnet 222 can be permanent magnets. The first molding die 210 and the second molding die 220 can be joined together by the first magnet 211 and the second magnet. On the other hand, when the first molding die 210 and the second molding die 220 are joined together, the first molding die 210 and the second molding die 220 can be separated from each other by applying an external force.

[0090] Before injecting the injection part 140 into the inner mold 230, a release agent that separates the injection part 140 from the inner mold 230 can be sprayed into the inner mold 230.

[0091] If the injection molding part 140 solidifies by heating, the injection molding part 140 and the inner molding die 230 can adhere to each other. In this case, if the inner molding die 230 is separated, the injection molding part 140 is attached to the inner molding die 230 and can be separated from the image sensor 120 or the circuit board 110, resulting in product defects.

[0092] To prevent this, a release agent is sprayed into the inner mold 230 before injection molding begins, so that the injection part 140 and the inner mold 230 can easily separate from each other.

[0093] For example, the release agent can be made of soybean oil or silicone, but is not limited to these. The release agent can be sprayed into the internal molding mold 230 through the release agent spraying device 500.

[0094] The following uses flowcharts to describe in more detail the method for manufacturing the substrate assembly 100 according to an embodiment.

[0095] Figure 3 A flowchart illustrating a method for manufacturing a substrate assembly 100 according to an embodiment.

[0096] In the method for manufacturing substrate assembly 100, firstly, a release agent may be sprayed into the inner molding die 230 (step S110). As described above, this is used to smoothly separate the solidified injection part 140 from the inner molding die 230.

[0097] like Figure 5 As shown, the release agent spraying device 500 can spray the release agent into the internal molding die 230 by spraying.

[0098] Next, the substrate assembly 100 can be assembled in the molding die section 200 (step S120). The substrate assembly 100 is housed inside the molding die section 200. In particular, the inner molding die 230 contacts the image sensor 120 and the circuit board 110 of the substrate assembly 100 and forms a space for forming the injection molding section 140.

[0099] Next, a liquid substance at room temperature, namely, injection molding material, can be injected into the molding die 200 (step S130). The injection molding material flows into the formed space through the first injection port 221 and the second injection port 231 and fills the space. The shape of the space formed by the internal molding die 230 can form the shape of the injection part 140.

[0100] Next, the liquid substance is heated and solidified to form the injection molding part 140 as a solid (step S140). For example, the liquid substance can be heated by spraying heated fluid, such as air, into the molding die 200 or by placing the molding die 200 inside a heating device such as an oven and heating it by the heating device.

[0101] Next, the molding die 200 can be separated from the injection molding part 140 (step S150). In step S150, the protrusion 141 can be cut, which will be described in detail below.

[0102] Next, the exposed surface of the image sensor 120 can be cleaned (step S160). During the process of forming the injection molding part 140 and cutting the protrusion 141, foreign matter may adhere to the exposed surface of the image sensor 120, that is, the surface facing the lens. In order to remove the foreign matter, it can be cleaned.

[0103] Figure 4 A flowchart illustrating the steps of assembling the substrate assembly 100 in the molding die section 200. Figure 5This diagram illustrates the steps of assembling the substrate assembly 100 in the molding die section 200. The steps of assembling the substrate assembly 100 in the molding die section 200 can be performed through the following processes.

[0104] First, the substrate assembly 100 without the injection-molded portion 140 can be assembled in the first molding die 210 (step S121). The circuit board 110 of the substrate assembly 100 fits into the recessed portion formed in the first molding die 210, thereby allowing the substrate assembly 100 to be assembled in the first molding die 210. Of course, in step S121, the injection-molded portion 140 is not yet present in the substrate assembly 100, thus the connecting member 130 is exposed.

[0105] Next, the second molding die 220 and the inner molding die 230 can be assembled (step S122). The inner molding die 230 fits into the recessed portion formed in the second molding die 220, and the inner molding die 230 can be assembled into the second molding die 220. In this case, the first injection port 221 and the second injection port 231 are formed at corresponding positions, thereby serving as a flow path for the injection molding raw material to be injected into the inner molding die 230.

[0106] Next, the first molding die 210 and the second molding die 220 can be combined (step S123). The first molding die 210 and the second molding die 220 can be combined with each other by the magnetic force of the first magnet and the second magnet 222.

[0107] Then, as described above, liquid injection molding material can be injected into the space formed by the internal molding die 230 using the injection device. Next, the injection molding section 140 can be solidified by heating. Afterwards, the molding die section 200 can be separated from the injection molding section 140.

[0108] Figure 5 The steps of assembling the substrate assembly 100 in the molding die section 200 are shown in sequence.

[0109] Figure 6 This is a flowchart illustrating the steps of separating the molding die section 200 from the injection molding section 140. The steps of separating the molding die section 200 from the injection molding section 140 can be performed through the following processes.

[0110] First, the second molding die 220 can be separated (step S151). The second molding die 220 and the first molding die 210 can be joined together by a magnet, and the second molding die 220 can be easily separated from the first molding die 210 by applying external force.

[0111] Next, the inner molding die 230 can be separated (step S152). Since a release agent is present at the contact area between the inner molding die 230 and the solidified injection part 140, the inner molding die 230 and the injection part 140 do not adhere to each other, and the inner molding die 230 can be easily separated from the injection part 140.

[0112] Next, a screen portion 300 for preventing foreign objects can be provided at the part of the image sensor 120 that is exposed (step S153).

[0113] Figure 7 This diagram illustrates the state after the internal molding die 230 has been separated from the injection molding section 140. (See diagram below.) Figure 7 As shown, after separating the internal molding die 230, the surface of the image sensor 120 facing the lens can be exposed.

[0114] If the exposed portion of the image sensor 120 is left untouched and the protrusion 141 is cut (described later), fragments of the protrusion 141 or other foreign matter may adhere to the exposed surface of the image sensor 120. In this case, the image sensor 120 may malfunction.

[0115] Therefore, in the embodiment, before the protrusion 141 is cut, a screen portion 300 is provided on the exposed surface of the image sensor 120, thereby suppressing foreign matter from adhering to the image sensor 120.

[0116] From a plan view, the screen portion 300 is formed into a rectangular shape corresponding to the rectangular hollow of the injection molding portion 140, and its cross-section can be a "U" shape.

[0117] For example, the screen portion 300 can be made of polon material, but it is not limited to this.

[0118] Next, the protrusion 141 protruding from the injection part 140 can be cut (step S154). In the process of injecting liquid injection molding material into the internal molding die 230 and heating and solidifying it to form the injection part 140, the injection molding material is filled into the first injection port 221 and / or the second injection port 231, and the part formed by the solidification of these materials is the protrusion 141.

[0119] The protrusion 141 protruding from the injection molding part 140 should be removed. For example, the protrusion 141 can be cut by a laser cutting device, a blade, or the like. As described above, before cutting the protrusion 141, a screen part 300 is provided at the exposed part of the image sensor 120, thereby effectively suppressing the adhesion of fragments of the protrusion 141 and other foreign matter to the image sensor 120 during the cutting operation.

[0120] Next, the screen portion 300 and the first molding die 210 can be separated (step S155). As a result, the substrate assembly 100 with the injection molding portion 140 formed can be completely separated from the molding die portion 200, thereby obtaining the completed substrate assembly 100.

[0121] Figure 8 A diagram illustrating the steps of cleaning the exposed surface of the image sensor 120.

[0122] Although the screen portion 300 is used to suppress foreign matter from adhering to the exposed surface of the image sensor 120, foreign matter can still adhere to the image sensor 120 during the entire manufacturing process of the substrate assembly 100.

[0123] Therefore, in the embodiments, during the final process of manufacturing the substrate assembly 100, the exposed surfaces of the image sensor 120 are cleaned to more accurately remove foreign matter adhering to the image sensor 120.

[0124] Reference Figure 8 To clean the exposed surfaces of the image sensor 120, a cleaning agent spraying device 600 can be used to spray cleaning agent toward the exposed surfaces of the image sensor 120. In this case, the cleaning agent can be, for example, water, but is not limited to this.

[0125] As described above, the present invention has been illustrated with reference to the accompanying drawings. The present invention is not limited to the embodiments and drawings disclosed in this specification. Within the scope of the technical concept of the present invention, those skilled in the art can make various modifications. Furthermore, although the structural effects based on the present invention are not explicitly described or explained in the description of the embodiments of the present invention, the effects predicted through the corresponding structures should also be verified.

Claims

1. A method for manufacturing a substrate assembly, the substrate assembly comprising: Circuit board; An image sensor is disposed on one side of the circuit board; A connecting component for electrically connecting the circuit board to the image sensor; as well as The injection molding section houses the connecting component and is integrated with the circuit board and the image sensor. The method for manufacturing the substrate assembly is characterized in that… The injection-molded part is formed of a thermosetting material that is liquid at room temperature. After being injected into the molding die in liquid form, it is heated and cured, thereby securing it to the circuit board and the image sensor.

2. The method for manufacturing a substrate assembly according to claim 1, characterized in that, The molding die includes: The first molding die supports one side of the circuit board; A second molding die, combined with the first molding die, forms an internal space; and An internal molding die is disposed in the space formed by the first molding die and the second molding die, and the injection part is injected into the internal molding die.

3. The method for manufacturing a substrate assembly according to claim 2, characterized in that, The internal molding die is made of silicon.

4. The method for manufacturing a substrate assembly according to claim 2, characterized in that, Before injecting the injection part into the internal molding die, a release agent is sprayed into the internal molding die to separate the injection part from the internal molding die.

5. The method for manufacturing a substrate assembly according to claim 2, characterized in that, The second molding die includes a first injection port for injecting the liquid that forms the injection part. The internal molding die includes a second injection port, which is located at a position corresponding to the first injection port, for injecting liquid to form the injection part.

6. The method for manufacturing a substrate assembly according to claim 2, characterized in that, The first molding die includes a first magnet that can be detachably coupled to the second molding die. The second molding die includes a second magnet, which is disposed at a position corresponding to the first magnet and is detachably coupled to the first molding die.

7. The method for manufacturing a substrate assembly according to claim 2, characterized in that, Includes the following steps: Release agent is sprayed into the internal molding die; The substrate assembly is assembled in the molding die section; A substance that is liquid at room temperature is injected into the molding die. The liquid substance is heated to solidify it to form the injection-molded part as a solid. as well as Separate from the molding die section from the injection molding section.

8. The method for manufacturing a substrate assembly according to claim 7, characterized in that, The step of assembling the substrate assembly in the molding die section includes the following steps: The substrate assembly in the first molding die is used to assemble the injection molded portion before it is formed. Assemble the second molding die and the inner molding die; and Combine the first molding die with the second molding die.

9. The method for manufacturing a substrate assembly according to claim 7, characterized in that, It also includes the step of cleaning the exposed surface of the image sensor.

10. The method for manufacturing a substrate assembly according to claim 7, characterized in that, The step of separating the injection molding portion from the molding die portion includes the following steps: Separate the second molding die; Separate the internal molding die; A screen portion is provided at the location where the image sensor is exposed to prevent foreign objects from entering; Cut the protrusions that protrude from the injection molding part; as well as Separate the screen portion and the first molding die.

11. The method for manufacturing a substrate assembly according to claim 10, characterized in that, The screen portion is made of poron material.

12. The method for manufacturing a substrate assembly according to claim 4, characterized in that, The release agent is made of soybean oil or silicone.

13. A method for manufacturing a substrate assembly, the substrate assembly comprising: Circuit board; An image sensor is disposed on one side of the circuit board; A connecting component for electrically connecting the circuit board to the image sensor; as well as The injection molding section, formed using a molding die, houses the connecting component and is attached to the circuit board and the image sensor. The method for manufacturing this substrate assembly is characterized by... The molding die includes: The first molding die supports one side of the circuit board; A second molding die, which is combined with the first molding die and forms a space inside it; and An internal molding die is disposed in the space formed by the first molding die and the second molding die, and the injection part is injected into the internal molding die. Before injecting the injection part into the internal molding die, a release agent is sprayed into the internal molding die to separate the injection part from the internal molding die.

14. The method for manufacturing a substrate assembly according to claim 13, characterized in that, Includes the following steps: Release agent is sprayed into the internal molding die; The substrate assembly is assembled in the molding die section; A substance that is liquid at room temperature is injected into the molding die. The liquid substance is heated to solidify it to form the injection-molded part as a solid. Separating from the injection molding portion from the molding die portion; and The exposed surfaces of the image sensor are cleaned.

15. The method for manufacturing a substrate assembly according to claim 14, characterized in that, The step of separating the injection molding portion from the molding die portion includes the following steps: The step of separating the second molding die; A screen portion is provided at the location where the image sensor is exposed to prevent foreign objects from entering; Separate the internal molding die; Cut the protrusions that protrude from the injection molding part; as well as Separate the screen portion and the first molding die.

16. The method for manufacturing a substrate assembly according to claim 14, characterized in that, The step of assembling the substrate assembly in the molding die section includes the following steps: The substrate assembly in the first molding die is used to assemble the injection molded portion before it is formed. Assemble the second molding die and the inner molding die; and Combine the first molding die with the second molding die.

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