Display panel, method for manufacturing display panel, and display device

Abstract

The application relates to a display panel, a preparation method of the display panel and a display device. The display panel comprises a substrate, a plurality of pixel islands, a light-emitting functional unit, a bridge line, a first inorganic layer, at least one buffer structure and an inorganic encapsulation layer; the plurality of pixel islands are located on one side of the substrate, the pixel islands comprise a light-emitting functional area and a peripheral encapsulation area, the at least one buffer structure is located on the side of the first inorganic layer close to the substrate, the at least one buffer structure is arranged around the light-emitting functional area, the inorganic encapsulation layer covers the light-emitting unit and each buffer structure, is at least partially formed on the sidewall of each buffer structure, and the inorganic encapsulation layer is in contact with the first inorganic layer from the side of each buffer structure away from the light-emitting unit. When the display panel is stretched, the buffer structure can effectively provide a buffering effect for the stacked film layer, the risk of cracks, fractures or delamination between the stacked film layer and the lower film layer is avoided, and therefore the display effect of the display panel can be improved.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display panel, a method for manufacturing the display panel, and a display device. Background Technology

[0002] With the technological development of display devices, display panels have gradually evolved from fixed, bendable, rollable, and flexible forms to three-dimensional conformal / fitting forms, enabling them to change according to the shape of objects. This requires display panels to have multi-directional stretching characteristics.

[0003] In related technologies, the stretchability of the display panel is mainly achieved by using an encapsulation layer and an inorganic layer. However, in these technologies, the encapsulation layer and the inorganic layer are prone to breakage when the display panel is stretched, resulting in poor display quality. Summary of the Invention

[0004] Therefore, it is necessary to provide a display panel, a method for manufacturing the display panel, and a display device to address the aforementioned technical problems, which can improve the tensile strength of the display panel and thus enhance its display effect.

[0005] In a first aspect, embodiments of this application provide a display panel, including:

[0006] The substrate includes multiple pixel islands, each pixel island comprising a light-emitting functional area and a peripheral encapsulation area;

[0007] The circuit structure is located on the pixel island;

[0008] The light-emitting functional unit, located in the light-emitting functional area, includes the light-emitting unit and the circuit structure;

[0009] A bridging wire, located on one side of the substrate, is a circuit structure that connects the light-emitting units in adjacent pixel islands.

[0010] At least one buffer structure is located in the peripheral encapsulation area and arranged around the light-emitting functional area. The buffer structure includes a stepped structure formed by stacking at least two buffer parts.

[0011] The first inorganic layer is located on one side of the substrate, at least partially located in the peripheral packaging area and covering at least one buffer structure;

[0012] An inorganic encapsulation layer covers the light-emitting unit and each buffer structure, and is at least partially formed on the sidewall of each buffer structure. The inorganic encapsulation layer contacts the first inorganic layer from the side of each buffer structure away from the light-emitting unit.

[0013] In one embodiment, a first inorganic layer is located on the side of each buffer structure away from the substrate and covers at least one buffer structure; the first inorganic layer has a plurality of first tensile buffer portions corresponding to each step side surface in each buffer structure.

[0014] In one embodiment, the width of each buffer layer in each buffer structure decreases sequentially along the direction from near the substrate to far from the substrate.

[0015] In one embodiment, the inorganic encapsulation layer includes a plurality of second stretching buffer portions having respectively corresponding to each step side surface in each buffer structure.

[0016] In one embodiment, the width difference between any two adjacent buffer layers in each buffer structure is a preset difference threshold, and the width of the buffer layer closest to the substrate in each buffer structure is a preset width threshold.

[0017] In one embodiment, a groove is formed between any two adjacent buffer structures in each buffer structure.

[0018] In one embodiment, the display panel further includes a second inorganic layer, with each buffer structure disposed on the side of the second inorganic layer away from the substrate, and at least a portion of the second inorganic layer being separately disposed from at least a portion of the first inorganic layer.

[0019] In one embodiment, a cathode layer corresponding to a light-emitting unit is disposed on the pixel island, and the cathode layer is disposed on the side of the inorganic encapsulation layer close to the substrate.

[0020] In one embodiment, the material of each buffer structure includes positive photoresist, and the longitudinal cross-sectional profile of the buffer portion in the buffer structure is a positive trapezoidal structure.

[0021] In one embodiment, a cathode layer corresponding to a light-emitting unit is disposed on the pixel island, and the edge of the buffer structure is spaced apart from the cathode layer in the corresponding pixel island, with the cathode layer located in the light-emitting functional area.

[0022] In one embodiment, the material of each buffer structure includes negative photoresist, and the longitudinal cross-sectional profile of the buffer portion in the buffer structure is an inverted trapezoidal structure.

[0023] In one embodiment, a groove is formed between two adjacent buffer structures, and a cathode layer corresponding to the light-emitting unit is disposed on the pixel island; a film layer identical to the cathode layer is disposed at the bottom of the groove.

[0024] Secondly, embodiments of this application provide a method for manufacturing a display panel, comprising:

[0025] At least one buffer structure is formed in the peripheral packaging area of ​​the substrate using negative photoresist; the buffer structure is arranged around the light-emitting functional area of ​​the substrate, and the buffer structure includes a stepped structure formed by stacking at least two buffer parts;

[0026] A first inorganic layer is formed by chemical vapor deposition; at least a portion of the first inorganic layer is located in the peripheral encapsulation region and covers at least one buffer structure.

[0027] An inorganic encapsulation layer is formed by chemical vapor deposition; the inorganic encapsulation layer covers the light-emitting unit and each buffer structure, and is at least partially formed on the sidewall of each buffer structure.

[0028] Thirdly, embodiments of this application provide a display device, including a display panel as described in any of the embodiments of the first aspect.

[0029] The display panel, the method for fabricating the display panel, and the display device provided in this application embodiment include: a substrate, a light-emitting functional unit, a bridging wire, a first inorganic layer, at least one buffer structure, and an inorganic encapsulation layer. The substrate includes multiple pixel islands, each pixel island including a light-emitting functional area and a peripheral encapsulation area. The light-emitting functional unit is located in the light-emitting functional area and includes a light-emitting unit and a circuit structure. The bridging wire connects the circuit structures of the light-emitting units in adjacent pixel islands. At least one buffer structure is located in the peripheral encapsulation area and is disposed around the light-emitting functional area. The buffer structure includes a stepped structure formed by stacking at least two buffer portions. The first inorganic layer is located on one side of the substrate, at least partially located in the peripheral encapsulation area, and covers at least one buffer structure. The inorganic encapsulation layer covers the light-emitting unit and each buffer structure, and is at least partially formed on the sidewall of each buffer structure. The inorganic encapsulation layer contacts the first inorganic layer from the side of each buffer structure away from the light-emitting unit. In the aforementioned display panel, at least one buffer structure is provided in the peripheral encapsulation area, and the inorganic encapsulation layer and the first inorganic layer (i.e., stacked structure or stacked film layer) are covered on each buffer structure. This not only provides a buffering effect for the stacked film layer, but also, because the buffer structure is an independent structure, it can effectively reduce the area ratio of the peripheral encapsulation area and increase the area ratio of the inorganic layer, thereby improving the overall encapsulation stability, display effect, and tensile strength of the display panel. At the same time, when the aforementioned display panel is stretched, the buffer structure can effectively provide buffering for the stacked film layer, avoiding the risk of excessive stress between the first inorganic layer and the inorganic encapsulation layer during the stretching process, which could lead to cracks, breaks, or delamination between the stacked film layer and the lower film layer. This improves the tensile strength and display effect of the display panel. Attached Figure Description

[0030] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0031] Figure 1 This is a schematic cross-sectional view of the display panel in one embodiment of this application;

[0032] Figure 2 A schematic cross-sectional view of a display panel provided in one embodiment;

[0033] Figure 3 This is a partial cross-sectional enlarged structural diagram of the display panel in one embodiment;

[0034] Figure 4 This is a top view of a pixel island, light-emitting unit, and buffer structure in a display panel in one embodiment.

[0035] Figure 5 A schematic cross-sectional view of a display panel provided for another embodiment;

[0036] Figure 6 This is a schematic flowchart illustrating the steps of a method for manufacturing a display panel in one embodiment.

[0037] Explanation of reference numerals in the attached figures:

[0038] 1. Display area; 2. Conductor; 3. Substrate; 10. Display panel; 11. Substrate; 111. Light-emitting functional area; 112. Peripheral packaging area; 12. Light-emitting functional unit; 13. Bridging line; 14. First inorganic layer; 15. Buffer structure; 151. Buffer section; 152. Groove; 16. Inorganic packaging layer; 17. Passivation layer; 18. Barrier layer; 19. Buffer layer; 20. Gate insulating layer; 21. Planarization layer; 22. Pixel limiting layer; 23. Cathode layer; 24. Film layer. Detailed Implementation

[0039] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings, which illustrate embodiments of the present application. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this application will be thorough and complete.

[0040] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0041] When describing positional relationships, unless otherwise specified, when an element such as a layer, film, or substrate is referred to as being "on" another element, it may be directly on the other element or there may be intermediate elements present. Furthermore, when a layer is referred to as being "below" another layer, it may be directly below it or there may be one or more light-emitting units present. It is also understood that when a layer is referred to as being "between" two layers, it may be the only layer between the two layers, or there may be one or more light-emitting units present.

[0042] When using the terms “including,” “having,” and “comprising” as described herein, another component may be added unless explicitly qualifying terms such as “only,” “consisting of,” etc. are used. Unless otherwise stated, singular terms may include plural forms and should not be construed as having a quantity of one.

[0043] It should be understood that although the terms “first,” “second,” etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used only to distinguish one element from another. For example, without departing from the scope of this application, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element.

[0044] It should also be understood that, in interpreting an element, although not explicitly described, the element is interpreted as including a range of error, which should be within the acceptable deviation range of a particular value as determined by a person skilled in the art. For example, "approximately," "about," or "substantially" can mean within one or more standard deviations, without limitation herein.

[0045] Furthermore, in the instruction manual, the phrase "planar distribution diagram" refers to the diagram when the target part is viewed from above, and the phrase "cross-sectional diagram" refers to the diagram when the target part is viewed from the side as a cross-section taken by vertically cutting the target part.

[0046] Furthermore, the accompanying drawings are not drawn to a 1:1 scale, and the relative dimensions of the components are shown in the drawings only as examples and not necessarily to actual scale.

[0047] A display panel is a display component used to display images, text, and / or video. It is widely used in electronic devices such as televisions, computer monitors, mobile phones, and game consoles.

[0048] In related technologies, to achieve display panel stretching, the main approach is to improve film adhesion by ensuring contact between the encapsulation layer and the inter-layer dielectric (ILD) insulating layer in the display panel. For example... Figure 1 The image shows a top view of a display panel, which includes a display area 1, conductive lines 2, and a substrate 3. The display area 1 contains a circuit structure, and the conductive lines 2 are used to connect the circuit structures in two adjacent display areas 1. However, in related technologies, after the encapsulation layer and the ILD come into contact, this stacked structure is linear and without any protection. This can lead to a situation where the thickness of this stacked structure after the encapsulation layer and the ILD come into contact is too large, resulting in increased rigidity. When the display panel is stretched, there is a risk that the ILD and the underlying film layer may break or delaminate. Once the ILD and the underlying film layer break or delaminate, water and oxygen can immediately enter the light-emitting functional area through the gap, causing the display panel to fail, i.e., the display effect is poor.

[0049] The applicant discovered through research that the above-mentioned problems are caused by the contact design between the encapsulation layer and the ILD in the display panel, which results in a large thickness of the stacked structure. When the display panel is stretched, it will cause large stress between the encapsulation layer and the ILD. During the stretching process, there is a risk of cracks, breaks or delamination between the stacked film layer and the lower film layer (that is, the film layer between the stacked film layer and the substrate).

[0050] In view of the above, this application provides a display panel 10, a method for manufacturing the display panel 10, and a display device. The display panel 10 includes: a substrate 11, a circuit structure, a light-emitting functional unit 12, a bridging wire 13, a first inorganic layer 14, at least one buffer structure 15, and an inorganic encapsulation layer 16; the substrate 11 includes a plurality of pixel islands, each pixel island including a light-emitting functional area 111 and a peripheral encapsulation area 112; the circuit structure is located on the pixel island; the light-emitting functional unit 12 is located in the light-emitting functional area 111 and includes a light-emitting unit; the bridging wire 13 is located on one side of the substrate 11 and connects the circuit structure of the light-emitting unit in the adjacent pixel island; at least one buffer structure 15 is located in the peripheral encapsulation area 112 and is disposed around the light-emitting functional area 111; the buffer structure 15 includes a stepped structure formed by stacking at least two buffer portions 151; the first inorganic layer is located on one side of the substrate 11, at least partially located in the peripheral encapsulation area and covering at least one buffer structure 15; the inorganic encapsulation layer 16 covers the light-emitting unit and each buffer structure 15, is at least partially formed on the sidewall of each buffer structure 15, and the inorganic encapsulation layer 16 contacts the first inorganic layer 14 from the side of each buffer structure 15 away from the light-emitting unit. The display panel 10 provided in this application provides at least one buffer structure in the peripheral encapsulation area, and covers the inorganic encapsulation layer 16 and the first inorganic layer 14 (i.e., stacked structure or stacked film layer) on each buffer structure. This not only provides a buffering effect on the stacked film layer, but also, since the buffer structure is an independent structure, it can effectively reduce the area ratio of the peripheral encapsulation area and increase the area ratio of the inorganic layer, thereby improving the overall encapsulation stability, display effect, and tensile strength of the display panel 10. At the same time, when the display panel 10 is stretched, the buffer structure can effectively provide buffering for the stacked film layer, avoiding the risk of excessive stress between the first inorganic layer and the inorganic encapsulation layer during the stretching process, which could lead to cracks, breaks, or delamination between the stacked film layer and the lower film layer. This improves the tensile strength and display effect of the display panel 10.

[0051] Please see Figure 2 This application provides a display panel 10, which includes: a substrate 11, a circuit structure, a light-emitting functional unit 12, a bridging wire 13, a first inorganic layer 14, at least one buffer structure 15, and an inorganic encapsulation layer 16; wherein:

[0052] The substrate 11 includes multiple pixel islands, each pixel island including a light-emitting functional area 111 and a peripheral encapsulation area 112; a circuit structure is located on the pixel island; a light-emitting functional unit 12 is located in the light-emitting functional area 111 and includes a light-emitting unit; a bridging wire 13 connects the circuit structures of the light-emitting units in adjacent pixel islands; at least one buffer structure 15 is located in the peripheral encapsulation area 112 and is disposed around the light-emitting functional area 111, the buffer structure 15 includes a stepped structure formed by stacking at least two buffer portions 151; a first inorganic layer 14 is located on one side of the substrate 11, at least partially located in the peripheral encapsulation area 112 and covering at least one buffer structure 15; an inorganic encapsulation layer 16 covers the light-emitting unit and each buffer structure 15, is at least partially formed on the sidewall of each buffer structure 15, and the inorganic encapsulation layer 16 contacts the first inorganic layer 14 from the side of each buffer structure 15 away from the light-emitting unit.

[0053] In the embodiments of this application, the display panel 10 may be, but is not limited to, an organic light-emitting diode (OLED) display panel, an active-matrix organic light-emitting diode (AMOLED) display panel, or an active-matrix organic light-emitting diode (AMOLED) display panel.

[0054] In practical applications, the substrate 11 in the display panel 10 can be a flexible substrate PI, i.e., a rigid island region. This flexible substrate can be made of flexible materials, such as polyimide (PI), polyester film (PET), etc., or it can be made of nanocomposite materials, polydimethylsiloxane (PDMS), etc., to improve the bending stability of the display panel 10. Specifically, to improve the flexibility, toughness, expansion resistance, and stress resistance of the flexible substrate, and to enable the flexible substrate to be repeatedly bent and stretched, it is necessary to better support the bridging lines 13.

[0055] It should be noted here that... Figure 2 This is a partial cross-sectional view of the display panel. Figure 2 The diagram shows the structure of any pixel island in the display panel and the bridge cable 13 connected to it. In practical applications, Figure 2 The right side of the middle bridge connector 13 can be used to set the structure of another pixel island in the display panel (not shown in the figure). Figure 2 A bridging cable 13 (not shown in the figure) can be installed on the left side of the middle pixel island to connect with the pixel island.

[0056] Meanwhile, the substrate 11 in the display panel 10 includes multiple pixel islands. (Continue to see...) Figure 1As shown, any two adjacent pixel islands in the display panel 10 can be electrically connected via a stretchable bridging cable 13. It should be noted that each pixel island is used to emit visible light, and multiple pixel islands combined can display various graphic and textual information. These pixel islands can be made of semiconductor materials, transparent conductive materials, insulating materials, organic materials, etc.

[0057] Optionally, the pixel islands can be flexible islands, but in this embodiment, they can be rigid islands. This prevents the pixel islands from deforming when the display panel 10 is stretched, ensuring the accuracy and stability of the images output by the display panel 10, unaffected by external pressure, temperature changes, or mechanical stress. In this embodiment, the pixel islands may include a light-emitting functional area 111 and a peripheral encapsulation area 112 located around the light-emitting functional area 111. The light-emitting functional area 111 can be understood as the light-emitting unit integration area.

[0058] Meanwhile, the display panel 10 also includes a light-emitting functional unit 12, which is located in the light-emitting functional area 111. The light-emitting functional unit 12 may include a light-emitting unit and a circuit structure. Optionally, the light-emitting unit may be an organic light-emitting diode light-emitting unit, a quantum dot light-emitting unit, etc., and may include an electrode layer, a hole transport layer, a functional layer, a light-emitting material layer, an electron transport layer, and a charge transport layer, etc.

[0059] The electrode layer may include an anode layer and a cathode layer. The anode layer is responsible for injecting holes and may be, but is not limited to, being made of indium tin oxide (ITO). The cathode layer is responsible for injecting electrons and may be made of a low work function metal, such as aluminum or magnesium-silver alloys. Optionally, the hole transport layer facilitates the efficient transport of holes from the anode to the organic light-emitting layer, and the electron transport layer facilitates the smooth injection of electrons from the cathode to the organic light-emitting layer. Optionally, the functional layer may include a barrier layer and an encapsulation layer. The barrier layer prevents electrons or holes from recombining at undesirable locations, improving luminous efficiency. The encapsulation layer protects the light-emitting unit from external environmental factors (such as oxygen and water vapor), extending its lifespan. Optionally, the light-emitting material layer may be made of organic or inorganic light-emitting materials, the properties of which determine the color and efficiency of the light emitted by the light-emitting unit.

[0060] It should be noted that the above circuit structure is used to control the working state of the light-emitting unit and may include pixel circuits and driving circuits; the pixel circuit may include driving thin-film transistors (TFTs), switching TFTs and storage capacitors, etc., and the driving circuit may include shift registers, level converters, digital-to-analog converters, data buffers, etc.

[0061] In this embodiment, the bridging wire 13 in the display panel 10 can be understood as a wire; the bridging wire 13 and the light-emitting functional unit 12 are both located on the same side of the substrate 11. The bridging wire 13 is used to connect the circuit structures of the light-emitting units in each adjacent pixel island among multiple pixel islands.

[0062] Optionally, the first inorganic layer 14 in the display panel 10 is located on one side of the substrate 11, and the first inorganic layer 14 is located on the side of the light-emitting unit close to the substrate 11. At least a portion of the first inorganic layer 14 is located in the peripheral encapsulation area 112, and the other portion of the first inorganic layer 14 is located in the light-emitting functional area 111.

[0063] In one embodiment, a first inorganic layer 14 is located on the side of each buffer structure 15 away from the substrate 11 and covers at least one buffer structure 15; the first inorganic layer 14 has a plurality of first tensile buffer portions corresponding to each step side surface in each buffer structure 15.

[0064] It should be noted that the first stretching buffer part, which is the longitudinal film layer in the first inorganic layer 14, is used to cover the sidewall of each step structure in each buffer structure 15, and plays a good role in wrapping each buffer structure 15, which can prevent water and oxygen from entering from each buffer structure 15 and improve the packaging reliability of the display panel 10.

[0065] During the stretching process of the display panel 10, in order to avoid breakage or delamination between the first inorganic layer 14 and the inorganic encapsulation layer 16, at least one buffer structure 15 is provided in the display panel 10 in this embodiment. Each buffer structure 15 is located on the side of the first inorganic layer 14 near the substrate 11, and each buffer structure 15 is arranged around the light-emitting functional area 111.

[0066] In this embodiment, the material of the buffer structure 15 can be organic adhesive, which enables the display panel 10 to remain intact during the stretching and deformation process, thereby improving the flexibility of the buffer structure 15.

[0067] Meanwhile, each buffer structure 15 includes at least two buffer parts 151 stacked to form a stepped structure, that is, the buffer structure 15 is designed as a multi-layer stepped structure, which can buffer the stacked film layer formed after the first inorganic layer 14 and the inorganic encapsulation layer 16 come into contact during the stretching of the display panel 10, reducing the risk of cracks, breaks, delamination between the first inorganic layer 14 and the lower film layer due to the large thickness and rigidity of the stacked film layer, thereby improving the encapsulation stability of the display panel 10, isolating water and oxygen from entering the light-emitting functional area 111, and improving the display effect of the display panel 10.

[0068] Furthermore, each individual buffer structure 15 may include a stepped structure formed by stacking at least two buffer sections 151, wherein, Figure 3 This is a partial enlarged view of any buffer structure in the display panel. Optionally, each buffer portion 151 can be a trapezoidal structure. In the embodiments of this application, this multi-layered stacked buffer portion 151 of the buffer structure 15 can be referred to as a multi-layered cake structure.

[0069] Meanwhile, the inorganic encapsulation layer 16 in the aforementioned display panel 10 can be located in the peripheral encapsulation area 112 and arranged around the light-emitting functional area 111, and the inorganic encapsulation layer 16 contacts the first inorganic layer 14 from the side of each buffer structure 15 away from the light-emitting unit.

[0070] The inorganic encapsulation layer 16 can be encapsulated using atomic layer deposition (ALD) or molecular layer deposition (MLD) nanoscale film encapsulation technology. This makes the inorganic encapsulation layer 16 not only dense, but also releases tensile and curling stress, which can improve the light extraction effect.

[0071] The technical solution in this application embodiment includes: a substrate 11, a circuit structure, a light-emitting functional unit 12, a bridging wire 13, a first inorganic layer 14, at least one buffer structure 15, and an inorganic encapsulation layer 16. The substrate 11 includes multiple pixel islands, each pixel island including a light-emitting functional area 111 and a peripheral encapsulation area 112. The circuit structure is located on the pixel island. The light-emitting functional unit 12 is located in the light-emitting functional area 111 and includes a light-emitting unit. The bridging wire 13 connects the circuit structures of the light-emitting units in adjacent pixel islands. At least one buffer structure 15 is located in the peripheral encapsulation area 112 and is disposed around the light-emitting functional area 111. The buffer structure 15 includes a stepped structure formed by stacking at least two buffer portions 151. The first inorganic layer... 14 is located on one side of substrate 11, at least partially located in peripheral encapsulation area 112 and covering at least one buffer structure 15. Inorganic encapsulation layer 16 covers the light-emitting unit and each buffer structure 15, and is at least partially formed on the sidewall of each buffer structure 15. The inorganic encapsulation layer 16 contacts the first inorganic layer 14 from the side of each buffer structure 15 away from the light-emitting unit. In the above-mentioned display panel 10, by providing at least one buffer structure 15 in peripheral encapsulation area 112 and covering each buffer structure 15 with inorganic encapsulation layer 16 and first inorganic layer 14 (i.e., stacked structure or stacked film layer), not only can the stacked film layer be buffered, but also, since the buffer structure 15 is an independent structure, it can effectively reduce the impact of the peripheral light-emitting unit. The area ratio of the encapsulation region 112 is increased, and the area ratio of the inorganic layer is also increased, thereby improving the overall encapsulation stability, display effect, and tensile strength of the display panel 10. Simultaneously, when the display panel 10 is stretched, the buffer structure 15 can effectively provide a buffering effect on the stacked film layers, avoiding the risk of excessive stress between the first inorganic layer 14 and the inorganic encapsulation layer 16 during stretching, which could lead to cracks, breaks, or delamination between the stacked film layers and the lower film layers. This improves the tensile strength and display effect of the display panel 10. Furthermore, in the above solution, the buffer structure 15 is designed as a multi-layer buffer section 151 structure, which reduces the impact of the buffer structure 15 on the outer encapsulation region 112. The area ratio is increased, the area of ​​the light-emitting functional area 111 in the display panel 10 is increased, and space is saved by increasing the wiring space in the display panel 10, so as to improve the stretchability of the display panel 10 and thus improve the display effect of the display panel 10. At the same time, this multi-layer buffer section 151 design structure can transmit the tensile force from the outside to the multi-layer step structure of each buffer structure 15 in sequence during the stretching process of the display panel 10, that is, when the stacked film layers in the display panel 10 are stretched. This multi-layer step structure can disperse stress to protect the stacked film layers, so that the stacked film layers have higher deformation capacity, thereby effectively preventing the stacked film layers from cracking, breaking or separation between functional layers due to stress concentration.

[0072] In one embodiment, reference Figure 2 and Figure 3As shown, along the direction from near the substrate 11 to away from the substrate 11, the width of each buffer layer 151 in each buffer structure 15 decreases sequentially.

[0073] Specifically, the widths of the buffer portions 151 in the same buffer structure 15 are different, with the buffer portion 151 closest to the substrate 11 having the largest width; the widths of the buffer portions 151 in the buffer structure 15 can decrease sequentially along the direction from closest to the substrate 11 to furthest from the substrate 11.

[0074] In this embodiment of the application, the buffer structure 15 includes three buffer portions 151, wherein the buffer portion 151 closest to the substrate 11 has the largest width, the buffer portion 151 furthest from the substrate 11 has the smallest width, and the width of the middle buffer portion 151 can be smaller than the width of the buffer portion 151 closest to the substrate 11 and larger than the width of the buffer portion 151 furthest from the substrate 11.

[0075] It should be noted that the width of the buffer portion 151 can be understood as the longitudinal cross-sectional length of the buffer portion 151, that is, the transverse direction of the substrate 11. In practical applications, in any buffer structure 15, along the direction from near to far from the substrate 11, the projected area of ​​each buffer portion 151 on the substrate 11 in the buffer structure 14 gradually decreases. That is, the projected area of ​​the buffer portion 151 closest to the substrate 11 is the largest, the projected area of ​​the buffer portion 151 farthest from the substrate 11 is the smallest, and the projected area of ​​the middle buffer portion 151 can be smaller than the projected area of ​​the buffer portion 151 closest to the substrate 11 but larger than the width of the buffer portion 151 farthest from the substrate 11.

[0076] Furthermore, in this embodiment, each buffer structure 15 in the display panel 10 is actually designed to cover the light-emitting unit in its corresponding pixel island. That is, from a top view, each buffer structure 15 surrounds the light-emitting unit in its corresponding pixel island. See [reference needed]. Figure 4 As shown.

[0077] In this embodiment, the number of trapezoidal groups in each buffer structure 15 can be greater than or equal to 6. This not only ensures the safe encapsulation quantity of the trapezoidal structure, but also the multi-layered and independently designed buffer structure 15 can disperse the rigidity between the first inorganic layer 14 and the inorganic encapsulation layer 16 when the display panel 10 is stretched due to excessively thick stacked film layers. This increases the buffering effect between the first inorganic layer 14 and the inorganic encapsulation layer 16, avoiding the risk of excessive stress between the first inorganic layer 14 and the inorganic encapsulation layer 16 during the stretching process of the display panel 10, which could lead to cracks, breaks, or delamination between the stacked film layers and the lower film layers. This improves the encapsulation stability of the display panel 10.

[0078] In this embodiment, multiple stacked buffer structures 15 can be simultaneously provided within the peripheral encapsulation area 112 of each pixel island. The buffer structures 15 can be designed as multi-level stepped structures. This allows the buffer structures 15 to stretch and deform the first inorganic layer 14 and the inorganic encapsulation layer 16 when the display panel 10 is stretched, thus buffering the first inorganic layer 14 and the inorganic encapsulation layer 16. This prevents excessive stress between the stacked film layers and the lower film layers during deformation, avoiding the risk of cracks, breaks, or delamination between the stacked film layers and the lower film layers. It should be noted that this stacked structure of the multi-layered buffer section 151 is equivalent to multiple independent trapezoids, reducing the area ratio of the buffer structures 15 in the peripheral encapsulation area 112.

[0079] In one embodiment, the inorganic encapsulation layer 16 includes a plurality of second stretch buffer portions having a plurality of side surfaces corresponding to each step in each buffer structure.

[0080] It should be noted that at least a portion of the inorganic encapsulation layer 16 is formed on the sidewall of each step structure or buffer portion 151 in each buffer structure 15, i.e., the second stretch buffer portion. The second stretch buffer portion can closely contact the first stretch buffer portion in the first inorganic layer 14 to improve the stretchability of the display panel 10.

[0081] In the technical solution of this application embodiment, along the direction from near the substrate 11 to away from the substrate 11, the width of each buffer portion 151 in the buffer structure 15 decreases sequentially. In the above solution, the buffer structure 15 is designed as a multi-layer buffer portion 151 structure, which can reduce the area ratio of the buffer structure 15 in the peripheral encapsulation area 112, increase the area of ​​the light-emitting functional area 111 in the display panel 10, thereby improving the display effect of the display panel 10. At the same time, this design can save space and increase the wiring space in the display panel 10, thereby improving the stretchability of the display panel 10.

[0082] In one embodiment, the width difference between any two adjacent buffer layers 151 in each buffer structure 15 is a preset difference threshold, and the width of the buffer layer 151 closest to the substrate 11 in each buffer structure 15 is a preset width threshold.

[0083] In this embodiment, the space of the peripheral encapsulation area 112 in the display panel 10 is limited and cannot accommodate multiple protective barriers. Therefore, in this embodiment, a cake-like stacked buffer structure 15 that can solve the technical problem is set within a limited space. The size of the buffer structure 15 needs to be limited.

[0084] Typically, the spatial range of the peripheral encapsulation area 112 can be 23~30µm. In this embodiment, for any two adjacent buffer layers 151 in the same buffer structure 15, the width difference between any two adjacent buffer layers 151 can be a preset difference threshold; optionally, the preset difference threshold can be user-defined or determined based on historical experience; the preset difference threshold can be determined based on the spatial range of the peripheral encapsulation area 112 and the number of preset buffer structures 15 in the display panel 10, but is not limited to 1~5µm. In this embodiment, the preset difference threshold can be 2~3µm.

[0085] Meanwhile, the width of a buffer portion 151 near the substrate 11 in the buffer structure 15, i.e., the bottommost buffer portion 151, can be a preset width threshold. Optionally, the preset width threshold can be user-defined or determined based on device accuracy and empirical values, and the higher the device accuracy, the smaller the lower limit of the possible value; the preset width threshold can be, but is not limited to, 7~12um. However, in this embodiment, the preset width threshold can be 8~10um.

[0086] Based on the above design, the minimum space range of the peripheral encapsulation area 112 can be set to 19~25um, thereby making the space range of the peripheral encapsulation area 112 smaller and increasing the space of the light-emitting functional area 111, thereby improving the display effect when the display panel 10 is stretched.

[0087] In one embodiment, a groove 152 is formed between any two adjacent buffer structures 15 in each buffer structure 15.

[0088] Please continue reading Figure 3 As shown, in practical applications, a groove 152 is formed between any two adjacent buffer structures 15, that is, there is a certain gap between any two adjacent buffer structures 15, i.e., an interval. This interval distance can be user-defined or determined based on historical experience values; the interval distance can be, but is not limited to, 1~6um. However, in the embodiment of this application, the interval distance can be 3~5um.

[0089] In this embodiment, a groove 152 is formed between any two adjacent buffer structures 15 in each buffer structure 15, which can increase the three-dimensional spatial bonding force between the rigid island and the ALD / MLD encapsulation film layer, and prevent the risk of breakage, cracking, peeling or separation between the stacked film layer and the lower film layer when the first inorganic layer 14 and the inorganic encapsulation layer 16 in the display panel 10 are deformed during the three-dimensional stretching process.

[0090] In one embodiment, the display panel 10 further includes a second inorganic layer 17, each buffer structure 15 being disposed on the side of the second inorganic layer 17 away from the substrate 11, and at least a portion of the second inorganic layer 17 being separately disposed from at least a portion of the first inorganic layer 14.

[0091] The second inorganic layer 17 can be understood as the passivation layer (CI, made of silicon nitride) in the display panel 10. At least a portion of the second inorganic layer 17 is separated from at least a portion of the first inorganic layer 14, meaning that each buffer structure 15 is disposed between at least a portion of the second inorganic layer 17 and at least a portion of the first inorganic layer 14. This allows each buffer structure 15 to absorb and disperse the stress generated by bending or stretching of the display panel 10 between the first inorganic layer 14 and the second inorganic layer 17, thereby reducing the possibility of cracks or damage to the second inorganic layer 17.

[0092] Additionally, see also Figure 2 As shown, the display panel 10 may also include a barrier layer (BL, made of silicon oxide SiOx and amorphous silicon a-Si) 18, a buffer layer (Buffer, made of silicon nitride SiNx and silicon oxide SiOx) 19, a gate insulating layer (GI) 20, a planarization layer (PLN2) 21 and a pixel limiting layer (PDL) 22, wherein M1, M2 and M3 in the display panel all represent metal layers, and P-Si represents the channel region.

[0093] In one embodiment, a cathode layer 23 corresponding to a light-emitting unit is disposed on a pixel island in the display panel 10, and the cathode layer 23 is disposed on the side of the inorganic encapsulation layer 16 near the substrate 11.

[0094] In practical applications, a cathode layer 23 corresponding to the light-emitting unit is disposed on the pixel island. The cathode layer 23 is disposed on the side of the inorganic encapsulation layer 16 closest to the substrate 11. The cathode layer 23 is the electron emission source; when a suitable voltage is applied, electrons in the cathode layer 23 are injected into the organic light-emitting layer.

[0095] In one embodiment, please see [link to previous article]. Figure 2 and Figure 3 As shown, the material of each buffer structure 15 includes positive photoresist, and the longitudinal cross-sectional profile of the buffer portion 151 in the buffer structure 15 is a positive trapezoidal structure.

[0096] Specifically, an array substrate is also disposed on one side of the substrate 11 in the display panel 10. When fabricating the buffer structure 15, positive photoresist is first uniformly coated on the array substrate to form a photoresist film. Then, the designed buffer structure 15 pattern is projected onto the photoresist film using a photolithography process. Further, during exposure, the photosensitizer in the positive photoresist undergoes a photochemical reaction to produce an acid. This acid, during post-exposure heating, acts as a chemical catalyst to remove the protective groups on the positive photoresist, thus transforming the positive photoresist in the exposed area from being insoluble in water to being highly soluble in a water-based developer. Subsequently, the positive photoresist is developed using the developer to remove the positive photoresist in unexposed areas, thereby forming the desired buffer structure 15 pattern on the array substrate. Finally, through etching, deposition, and other processes, the buffer structure 15 pattern is transferred onto the array substrate to form the final buffer structure 15.

[0097] In one embodiment, a cathode layer 23 corresponding to a light-emitting unit is provided on the pixel island, and the edge of the buffer structure 15 is spaced apart from the cathode layer 23 in the corresponding pixel island. The cathode layer 23 is located in the light-emitting functional area 111.

[0098] In this embodiment, if each buffer structure 15 in the display panel 10 is made of positive photoresist, the cathode layer 23 in the display panel 10 can be patterned by fine metal mask (FMM) evaporation. This allows the light-emitting functional area 111 to the edge of the buffer structure 15, i.e. the peripheral encapsulation area 112, to be free of the cathode layer 23, thus preventing water and oxygen from invading from the cathode layer 23. This improves the encapsulation reliability of the display panel 10 and allows the first inorganic layer 14 above the buffer structure 15 to contact the inorganic encapsulation layer 16. This contact is a homogeneous film layer contact, which can improve the adhesion between the film layers.

[0099] In the case that each buffer structure 15 in the display panel 10 is a multi-level stepped structure, and the material of each buffer structure 15 is positive photoresist, the longitudinal cross-sectional profile of each level of buffer section 151 is a positive trapezoidal structure. When the display panel 10 is subjected to external force, i.e., stretched, this trapezoidal structure can disperse energy when the display panel 10 is subjected to external impact or vibration, reducing the direct impact on the internal structure and components of the display panel 10, thereby reducing the risk of damage to the internal structure and components of the display panel 10. At the same time, since the positive photoresist can fill tiny gaps and gaps to form a continuous sealing layer, it prevents external moisture, oxygen and dust from entering the encapsulation, protecting sensitive light-emitting materials and electronic components from environmental corrosion, thereby extending the service life of the display panel 10. In addition, since the positive photoresist has a certain thermal conductivity and coefficient of thermal expansion, it can assist in heat dissipation when the temperature changes and alleviate thermal stress, avoiding cracking or delamination between the first inorganic layer 14 and the inorganic encapsulation layer 16 due to thermal expansion and contraction. Furthermore, the buffer structure 15 made of positive photoresist can also enhance the stability and mechanical strength of the encapsulation structure, enabling it to withstand the stress in subsequent processing and assembly.

[0100] In one embodiment, such as Figure 5 As shown, the material of each buffer structure 15 includes negative photoresist, and the longitudinal cross-sectional profile of the buffer portion 151 in the buffer structure 15 is an inverted trapezoidal structure.

[0101] In addition, each buffer structure 15 in the display panel 10 can be made of negative photoresist, and the longitudinal cross-sectional profile of the multi-level buffer section 151 in the buffer structure 15 can be an inverted trapezoidal structure.

[0102] In one embodiment, a groove 152 is formed between two adjacent buffer structures 15, and a cathode layer 23 corresponding to the light-emitting unit is disposed on the pixel island; a film layer 24 identical to the cathode layer 23 is disposed at the bottom of the groove 152.

[0103] In practical applications, a groove 152 is formed between two adjacent buffer structures 15 in each buffer structure 15. A film layer 24 identical to that of the cathode layer 23 is provided at the bottom of the groove 152. The film layer 24 and the cathode layer 23 are disposed in the same layer and are made of the same material and with the same manufacturing process. In the embodiments of this application, a film layer 24 is also provided on the upper surface of each buffer part 15 in each buffer structure 15.

[0104] If each buffer structure 15 in the display panel 10 is made of negative photoresist, in this case, the cathode of each buffer structure 15 can be broken at this edge by the cathode deposited by the cathode mask module (CMM), and the cathode material is directly deposited in the recess of the stacked edge of each buffer structure 15, which can stabilize the first inorganic layer 14 and the inorganic encapsulation layer 16, i.e. the inorganic encapsulation film layer.

[0105] It should be noted that the cathode layer 23 in the pixel island where the buffer structure 15 is located covers the light-emitting unit, and the film layer 24 in the pixel island where the buffer structure 15 is located is located on the upper surface of the groove 152. The film layer 24 in the peripheral encapsulation area 112 and the cathode layer 23 in the light-emitting functional area 111 are disconnected at their respective edges.

[0106] In this embodiment, the negative photoresist has high hardness and good wear resistance, which can resist external mechanical impact and friction to a certain extent, thereby effectively reducing the potential damage to the pixel islands caused by frequent finger contact with the display panel 10. In addition, the negative photoresist has good chemical corrosion resistance and can resist the erosion of some chemicals, so that when the buffer structure 15 is made with negative photoresist, it can enhance the stability of the display panel 10 in complex environments. Furthermore, when the display panel 10 is used outdoors, it faces large temperature fluctuations, and the buffer structure 15 of the negative photoresist can also reduce the risk of the encapsulation layer in the display panel 10 failing due to temperature changes.

[0107] Please see Figure 6 One embodiment of this application provides a method for manufacturing a display panel 10, the method comprising:

[0108] S100. At least one buffer structure is formed in the peripheral packaging area of ​​the substrate using negative photoresist; the buffer structure is arranged around the light-emitting functional area of ​​the substrate, and the buffer structure includes a stepped structure formed by stacking at least two buffer parts;

[0109] S200, A first inorganic layer is formed by chemical vapor deposition; at least a portion of the first inorganic layer is located in the peripheral encapsulation region and covers at least one buffer structure;

[0110] S300, An inorganic encapsulation layer is formed by chemical vapor deposition; the inorganic encapsulation layer covers the light-emitting unit and each buffer structure, and is at least partially formed on the sidewall of each buffer structure.

[0111] The descriptions of the substrate 11, circuit structure, light-emitting functional unit 12, bridging wire 13, first inorganic layer 14, at least one buffer structure 15 and inorganic encapsulation layer 16 in the display panel 10 can be found in the specific descriptions in the above embodiments, and will not be repeated here.

[0112] The method for manufacturing the display panel 10 provided in this embodiment involves setting at least one buffer structure 15 in the peripheral encapsulation area 112 and covering each buffer structure 15 with an inorganic encapsulation layer 16 and a first inorganic layer 14 (i.e., a stacked structure or stacked film layer). This not only provides a buffering effect for the stacked film layer, but also, because the buffer structure 15 is an independent structure, effectively reduces the area ratio of the peripheral encapsulation area 112 and increases the area ratio of the inorganic layer, thereby improving the overall encapsulation stability, display effect, and tensile strength of the display panel 10. Simultaneously, the display panel 10 manufactured using the above method... When the display panel 10 is stretched, the buffer structure 15 can effectively buffer the stacked film layers, avoiding the risk of excessive stress between the first inorganic layer 14 and the inorganic encapsulation layer 16 during the stretching process, which could lead to cracks, breaks, or delamination between the stacked film layers and the lower film layers. This improves the stretchability of the display panel 10 and enhances its display effect. Meanwhile, during the fabrication of the display panel 10, each buffer structure 15 can be fabricated based on existing film layers and existing masks without introducing other complex processes. The encapsulation effect is obvious, the structure is simple, easy to implement, and the mask cost is low.

[0113] Based on the same inventive concept, this application also provides a display device (not shown), which includes the display panel 10 in any of the above embodiments.

[0114] It is understood that the display device in the embodiments of this application can be applied to electronic devices, such as mobile phones, tablets, televisions, monitors, laptops, digital photo frames, navigators, wearable devices, IoT devices, and other devices with display functions. Optionally, the above-mentioned display device can be, but is not limited to, an OLED display device or an AMOLED display device.

[0115] In the description of this specification, references to terms such as "some embodiments," "other embodiments," and "ideal embodiments" indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative descriptions of the above terms do not necessarily refer to the same embodiments or examples.

[0116] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0117] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A display panel, characterized in that, The display panel includes: The substrate includes multiple pixel islands, each pixel island comprising a light-emitting functional area and a peripheral encapsulation area; The circuit structure is located on the pixel island; A light-emitting functional unit, located in the light-emitting functional area, includes a light-emitting unit; A bridging wire connects the circuit structure of the light-emitting units in adjacent pixel islands; At least one buffer structure is located in the peripheral encapsulation area and arranged around the light-emitting functional area, the buffer structure comprising a stepped structure formed by stacking at least two buffer portions; A first inorganic layer is located on one side of the substrate, at least partially located in the peripheral packaging area, and covers at least one of the buffer structures; An inorganic encapsulation layer covers the light-emitting unit and each of the buffer structures, and is at least partially formed on the sidewall of each of the buffer structures. The inorganic encapsulation layer contacts the first inorganic layer from the side of each of the buffer structures away from the light-emitting unit.

2. The display panel according to claim 1, characterized in that, The first inorganic layer is located on the side of each buffer structure away from the substrate and covers at least one of the buffer structures; the first inorganic layer has a plurality of first tensile buffer portions corresponding to each step side surface of each of the buffer structures.

3. The display panel according to claim 1 or 2, characterized in that, Along the direction from near the substrate to far from the substrate, the width of each buffer layer in the buffer structure decreases sequentially; Optionally, the inorganic encapsulation layer includes a plurality of second stretching buffer portions having a plurality of side surfaces corresponding to each step in each of the buffer structures.

4. The display panel according to claim 3, characterized in that, The width difference between any two adjacent buffer layers in each buffer structure is a preset difference threshold, and the width of the buffer layer closest to the substrate in each buffer structure is a preset width threshold.

5. The display panel according to claim 1 or 2, characterized in that, A groove is formed between two adjacent buffer structures; Optionally, the display panel further includes a second inorganic layer, each of the buffer structures being disposed on the side of the second inorganic layer away from the substrate, and at least a portion of the second inorganic layer being separately disposed from at least a portion of the first inorganic layer.

6. The display panel according to claim 1 or 2, characterized in that, The pixel island is provided with a cathode layer corresponding to the light-emitting unit, and the cathode layer is disposed on the side of the inorganic encapsulation layer close to the substrate.

7. The display panel according to claim 1 or 2, characterized in that, The material of each buffer structure includes positive photoresist, and the longitudinal cross-sectional profile of the buffer portion in the buffer structure is a positive trapezoidal structure; Optionally, the pixel island is provided with a cathode layer corresponding to the light-emitting unit, and the edge of the buffer structure is spaced apart from the cathode layer in the corresponding pixel island, with the cathode layer located in the light-emitting functional area.

8. The display panel according to claim 1 or 2, characterized in that, The material of each buffer structure includes negative photoresist, and the longitudinal cross-sectional profile of the buffer portion in the buffer structure is an inverted trapezoidal structure; Optionally, a groove is formed between two adjacent buffer structures, and a cathode layer corresponding to the light-emitting unit is disposed on the pixel island; a film layer identical to the cathode layer is disposed at the bottom of the groove.

9. A method for manufacturing a display panel, characterized in that, include: At least one buffer structure is formed in the peripheral packaging area of ​​a substrate using negative photoresist; the buffer structure is disposed around the light-emitting functional area of ​​the substrate, and the buffer structure includes a stepped structure formed by stacking at least two buffer portions; A first inorganic layer is formed by chemical vapor deposition; at least a portion of the first inorganic layer is located in the peripheral encapsulation region and covers at least one of the buffer structures. Inorganic encapsulation layers are formed using chemical vapor deposition. The inorganic encapsulation layer covers the light-emitting unit and each of the buffer structures, and is at least partially formed on the sidewalls of each of the buffer structures.

10. A display device, characterized in that, Includes the display panel as described in any one of claims 1 to 8.

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