A method and system for deformation suppression in vertical transfer of PCB thick boards

Abstract

The application relates to the technical field of automatic conveying equipment, in particular to a deformation inhibition method and system in vertical conveying of a PCB thick plate. The method is applied to an equipment comprising a vertical conveying mechanism, a flexible support chain system and a control system, and comprises the following steps: initializing the flexible support chain system according to the specifications of the PCB thick plate; in the vertical conveying process, acquiring a tension feedback signal of the support chain and a deformation displacement feedback signal of the plate body in real time; taking the displacement signal as a main controlled variable and the tension signal as a secondary controlled variable, and generating a control instruction through a cascade control algorithm; and dynamically adjusting the tension of the support chain and an effective support contour according to the instruction, so that the support force distribution is self-adaptive to the real-time deformation state of the plate, thereby inhibiting the middle sag and edge warping of the plate. The system corresponds to the vertical conveying mechanism, the flexible support chain system and the control system for execution.

Description

Technical Field

[0001] This application relates to the field of automated conveying equipment technology, and more specifically, to a method and system for suppressing deformation during the vertical conveying of thick PCB boards. Background Technology

[0002] In the PCB manufacturing industry, as electronic products develop towards high performance and high integration, PCB boards are showing a trend of more layers (e.g., more than 8 layers), larger area (often greater than 0.5㎡), and increased thickness. During the manufacturing process, such thick boards often need to be vertically transported to save clean space. However, due to the heavy weight of the thick boards and their relatively insufficient structural rigidity, they are very prone to elastic deformation under the action of gravity when vertically suspended and transported, mainly manifested as sagging in the middle and / or edge warping.

[0003] Existing conveying equipment mainly relies on edge clamping or roller friction drive, which lacks effective support for the middle of the plate. When the plate deforms, it will cause uneven contact pressure between the plate and the conveying wheel, resulting in slippage, plate jamming, and even serious quality problems such as scratches on the plate surface and micro-cracks in the internal circuit, which significantly affects the production yield.

[0004] Currently, although some technologies attempt to add bottom support in horizontal transport, how to dynamically and adaptively provide support to counteract gravitational deformation without contacting the effective circuit area of ​​the PCB for the special condition of vertical transport remains a technical problem that urgently needs to be solved.

[0005] Therefore, there is an urgent need to provide a deformation prevention system and method for vertical conveying of thick PCB boards, so as to suppress the elastic deformation of the PCB board during the conveying process, ensure smooth conveying, and protect the quality of the board surface. Summary of the Invention

[0006] In view of this, in order to solve the above-mentioned problems in the prior art, this application provides a method and system for suppressing deformation during vertical transport of thick PCB boards.

[0007] The embodiments of this application are implemented as follows: In a first aspect, this application provides a method for suppressing deformation during the vertical transport of a thick PCB board, applied in a device comprising a vertical transport mechanism, a flexible support chain system, and a control system, including: Based on the specifications of the PCB board to be transmitted, the pre-stored initial parameter set is called to initialize the flexible support chain system. The initial parameter set includes at least the initial tension force and PID control parameters. The vertical conveying mechanism is controlled to clamp the PCB thick board and convey it vertically, while the flexible support chain system is activated so that its support chain contacts the back of the board and provides basic support. The tension feedback signal from the flexible support chain system and the plate deformation displacement feedback signal from the displacement sensor are acquired in real time. The tension feedback signal and the deformation displacement feedback signal are input into the tension-displacement dual feedback control loop, wherein the deformation displacement feedback signal is the main controlled variable and the tension feedback signal is the secondary controlled variable. The loop is calculated in real time by a cascade control algorithm to generate control commands for adjusting the drive module. According to the control command, the tension and effective support profile of the flexible support chain system are dynamically adjusted so that the distribution of the support force acting on the back of the board adapts to the real-time deformation state of the PCB thick board, thereby suppressing elastic deformation.

[0008] In one possible implementation, the cascade control algorithm further includes: The real-time deformation displacement value is compared with the deformation target set value to obtain the first deviation value. After calculation by the main loop PID controller, the first intermediate control quantity is output. The first intermediate control quantity is used as the tension setpoint and compared with the real-time tension feedback value to obtain the second deviation value. After calculation by the secondary loop PID controller, the second intermediate control quantity is output. The second intermediate control quantity is fed forward for compensation. The feedforward compensation quantity is calculated in real time based on the specification information of the PCB thick board and the transmission speed. The compensated result is output to the drive module as the final control command.

[0009] One possible implementation also includes: The deformation rate is calculated based on the deformation displacement data acquired by the displacement sensor within a continuous sampling period. If the deformation rate continuously exceeds a preset rate threshold, feedforward adjustment is initiated. Based on the control command output by the cascade control algorithm, an additional adjustment amount proportional to the deformation rate is superimposed. The direction of this additional adjustment amount is set to suppress the deformation trend.

[0010] In one possible implementation, the initialization configuration further includes: Based on the number of layers and area information of the PCB thick board, one of the pre-stored support strategies is selected. The support strategy defines the initial tension ratio of different groups of support chains in the flexible support chain system and the key monitoring area of ​​the displacement sensor.

[0011] One possible implementation also includes: After completing the transfer of a single PCB board, record the peak value of deformation displacement, average tension value and final control parameters during the transfer process. The peak value of the deformation displacement is compared with the upper limit of the deformation allowed by the process; If the peak value of the deformation displacement is significantly lower than the upper limit value of the deformation, then based on the stable control data transmitted this time, the initial parameter set bound to the board specification is finely adjusted for subsequent transmission of boards of the same specification.

[0012] In one possible implementation, acquiring the plate deformation displacement feedback signal from the displacement sensor in real time further includes: By using multiple displacement sensors arranged along the width direction of the board, real-time height data of multiple monitoring points on the PCB board in the width direction are acquired synchronously. Based on the real-time height data of the multiple monitoring points, a real-time deformation surface model of the PCB thick plate is generated by fitting. The sag at the center and the warping at the edges are extracted from the real-time deformable surface model as the deformation displacement feedback signal.

[0013] In one possible implementation, dynamically adjusting the tension and effective support profile of the flexible support chain system according to the control command further includes: When the extracted edge warping exceeds the threshold, the lateral location where the warping occurs is identified. Reduce the tension setting value of one or more sets of support chains corresponding to the lateral position in the flexible support chain system, or control the drive module to make that part of the support chain produce a preset micro-displacement opposite to the warping direction, so as to change the local support profile.

[0014] One possible implementation also includes: Receive process instructions from the production execution system, the process instructions containing allowable deformation requirements for the PCB thick board in subsequent precision processes; Based on the allowable deformation requirements, the deformation target setting value is dynamically adjusted to achieve graded deformation control based on process accuracy.

[0015] Secondly, this application provides a deformation suppression system for vertical conveying of thick PCB boards, including a vertical conveying mechanism, a flexible support chain system, and a control system. The vertical conveying mechanism is used to clamp and convey thick PCB boards. The flexible support chain system is located in the middle of the transmission path of the vertical transmission mechanism, and includes at least one set of support chains made of polymer wear-resistant chains, a drive module for driving and adjusting the support chains, a tension sensor for detecting chain tension, and a displacement sensor for detecting PCB thick plate deformation. The control system, which is communicatively connected to the tension sensor, displacement sensor and drive module, is configured to execute the tension-displacement dual feedback control loop and generate control signals to operate the drive module.

[0016] In one possible implementation, the working surface of the support chain in the flexible support chain system is embedded with several freely rotatable micro rollers, the axis of which is perpendicular to the conveying direction, forming a rolling contact support surface.

[0017] The technical solution provided in this application can achieve at least the following beneficial effects: This application provides a method and system for suppressing deformation during the vertical transport of thick PCB boards. By constructing a closed-loop control circuit with dual feedback coupling of tension and displacement, it achieves adaptive dynamic suppression of deformation during the vertical transport of thick PCB boards. This solves the problems of elastic deformation such as sagging in the middle and warping at the edges caused by the weight of the board itself, as well as problems such as board jamming and surface scratches caused by poor contact with the transport wheels. It changes the traditional approach of relying on fixed mechanisms for passive and rigid support and establishes a new "dynamic support" method based on real-time state perception and intelligent decision-making.

[0018] This method uses the real-time deformation and displacement of the PCB board as the primary control target and the tension of the support chain as the secondary control variable. Through a strategy combining cascade control and feedforward compensation, it achieves precise and rapid tracking of the board deformation by the support force. This effectively suppresses the unique deformation of ultra-large thick boards (8 layers or more, area greater than 0.5㎡) during vertical transport, ensuring the stability of transport and the integrity of the board surface, thereby directly improving product yield.

[0019] This method possesses high adaptability and intelligence. It achieves precise perception of the overall warping state of the board by fitting the deformed surface through multi-point monitoring; it continuously optimizes the control strategy based on historical data through a parameter self-learning mechanism; and it enables precision-level control based on subsequent process requirements by receiving process instructions from the production system. This allows the system to not only flexibly handle PCBs of different specifications, layers, and areas, but also to quickly adjust and optimize according to production cycle time and process changes. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic flowchart illustrating a deformation suppression method for vertical transport of a thick PCB board according to an exemplary embodiment of this application. Figure 2This is a schematic flowchart illustrating a deformation suppression method for vertical transport of a thick PCB board according to an exemplary embodiment of this application. Figure 3 This is a schematic diagram of a deformation suppression system for vertical transport of a thick PCB board, as illustrated in an exemplary embodiment of this application.

[0022] Figure label: 1. Vertical conveying mechanism; 2. Flexible support chain system; 3. Control system. Detailed Implementation

[0023] To make the objectives, implementation methods and advantages of this application clearer, the exemplary implementation methods of this application will be clearly and completely described below with reference to the accompanying drawings of the exemplary embodiments of this application. Obviously, the exemplary embodiments described are only some embodiments of this application, and not all embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0024] It should be noted that the brief descriptions of terms in this application are only for the convenience of understanding the embodiments described below, and are not intended to limit the embodiments of this application. Unless otherwise stated, these terms should be understood in their ordinary and common meaning.

[0025] The terms "first," "second," "third," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar or related objects or entities, and do not necessarily imply a specific order or sequence, unless otherwise specified. It should be understood that such terms are interchangeable where appropriate.

[0026] The terms “comprising” and “having”, and any variations thereof, are intended to cover but not exclude inclusion, for example, a product or device that includes a range of components is not necessarily limited to all of the components that are clearly listed, but may include other components that are not clearly listed or that are inherent to such product or device.

[0027] Next, the technical solutions of this application and how they solve the aforementioned technical problems will be described in detail through embodiments and in conjunction with the accompanying drawings. The embodiments can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments. Obviously, the described embodiments are only some, not all, of the embodiments of this application.

[0028] In one exemplary embodiment, such as Figure 1 As shown, a method for suppressing deformation during vertical conveying of thick PCB boards is provided. In this embodiment, the method is applied to a device including a vertical conveying mechanism, a flexible support chain system, and a control system, and may include the following steps: Step 100: Based on the specifications of the PCB board to be transmitted, call the pre-stored initial parameter set to initialize the flexible support chain system. The initial parameter set includes at least the initial tension force and PID control parameters.

[0029] Step 200: Control the vertical conveying mechanism to clamp the PCB thick board and convey it vertically, while activating the flexible support chain system so that the support chain contacts the back of the board and provides basic support.

[0030] Step 300: Acquire tension feedback signals from the flexible support chain system and plate deformation displacement feedback signals from the displacement sensor in real time.

[0031] Step 400: Input the tension feedback signal and the deformation displacement feedback signal into the tension-displacement dual feedback control loop, where the deformation displacement feedback signal is the main controlled variable and the tension feedback signal is the secondary controlled variable. The loop is calculated in real time through a cascade control algorithm to generate control commands for adjusting the drive module.

[0032] Step 500: According to the control command, dynamically adjust the tension and effective support profile of the flexible support chain system so that the distribution of the support force acting on the back of the board adapts to the real-time deformation state of the PCB thick board, so as to suppress elastic deformation.

[0033] In one embodiment, the specific implementation of the deformation suppression method during the vertical transport of the thick PCB board is as follows: First, enter the specifications of the PCB board to be transmitted.

[0034] Then, the system calls the initial parameter set pre-stored in the database that matches the specification information. This set includes the initial tension of the flexible support chain system and the proportional, integral, and derivative parameters of the PID controller. Based on the initial parameter set, the control system controls the servo motor of the flexible support chain system to run, so that the support chain is tensioned to the initial tension.

[0035] Next, the control system activates the vertical conveyor mechanism to clamp the thick PCB board and begin conveying it. At the same time, the flexible support chain system continues to operate, with its support chain working surface gently contacting the back of the PCB board to provide basic support.

[0036] During the transmission process, the tension sensor samples in real time at a fixed frequency, converting the current signal into a digital tension feedback signal. At the same time, the displacement sensor scans the plate surface at a fixed frequency and outputs the plate deformation displacement feedback signal.

[0037] The tension feedback signal and the deformation displacement feedback signal are input into the control system in real time. Through the tension-displacement dual feedback control loop, the deformation displacement signal is the main controlled variable, and its control objective is to approach zero infinitely; the tension signal is the secondary controlled variable. The control core adopts a cascade control algorithm to calculate the adjustment command that should be applied to the drive module in real time.

[0038] Finally, the control system sends the adjustment command to the servo driver of the flexible support chain system. The driver adjusts the motor output torque accordingly, thereby dynamically adjusting the global tension of the support chain. In addition, if the system is configured with multiple independently controllable support chains, the effective support profile can be changed by adjusting the tension ratio of each chain.

[0039] For example, when a more severe sagging is detected on the right side of the board, the tension ratio of the right support chain can be slightly increased. Through this dynamic adjustment, the distribution of support force can adapt to the real-time deformation state of the PCB thick board, actively suppressing elastic deformations such as sagging in the middle or warping at the edges.

[0040] In one embodiment, such as Figure 2 As shown, the specific implementation process of the cascade control algorithm is as follows: Step 410: Main loop control: Read the real-time deformation displacement value, compare it with the deformation target setpoint, obtain the first deviation value, send the first deviation value to the main loop PID controller for calculation, and output the first intermediate control quantity after calculation.

[0041] Step 420: Secondary loop control. Add the first intermediate control value to the current real-time tension feedback value to obtain the current tension setpoint. Compare the current tension setpoint with the real-time tension feedback value to obtain the second deviation value. Input the second deviation value into the secondary loop PID controller for calculation and output the second intermediate control value.

[0042] Step 430: Feedforward compensation. To improve the system's response speed to known disturbances, the algorithm calculates a feedforward compensation amount in parallel, forms the final control command, and sends it to the drive module. This calculation is based on the specifications of the PCB board and the current transmission speed.

[0043] For example, based on the plate weight and acceleration, the inertial compensation force that the support chain needs to provide can be calculated. This compensation force is then directly superimposed on the second intermediate control variable. This "feedforward + feedback" structure significantly improves the dynamic performance of the system.

[0044] In one embodiment, a trend-based predictive adjustment is also provided, the specific implementation process of which is as follows: By continuously monitoring the deformation displacement data transmitted by the displacement sensor within a continuous sampling period, the difference between adjacent period data is calculated to obtain the real-time deformation rate.

[0045] A rate threshold is preset. When the deformation rate exceeds this threshold for three consecutive cycles, it is determined that the deformation has an accelerating deterioration trend, and feedforward adjustment is then initiated. The rate threshold can be pre-calibrated experimentally and stored in the database according to different plate thicknesses and materials, or it can be dynamically calculated based on the plate specification information during initialization.

[0046] At this point, the trend analysis module will calculate an additional adjustment amount based on the current rate of change and a predefined gain coefficient. The direction of this additional adjustment amount is always opposite to the deformation trend: if it is an acceleration of sagging, the additional adjustment amount is positive, indicating that additional support is needed. This additional adjustment amount will be directly superimposed on the control command calculated by the cascade control algorithm, thereby achieving a strong "predictive" intervention and curbing the trend before the deformation amplitude becomes very large.

[0047] In one embodiment, the initialization configuration also includes multiple support strategies, which are associated with a specific range of PCB layer counts and area.

[0048] For example: Strategy A: Targeting "large area medium-thick slabs", applicable to slabs with an area > 0.7㎡ and 8-12 layers.

[0049] The strategy is as follows: the initial tension ratio of the two sets of support chains is set to 50%:50%; the key monitoring areas of the displacement sensor are set to the center line of the plate and 100mm from both sides.

[0050] Strategy B: Targeting "small area ultra-thick plates", applicable to plates with more than 16 layers.

[0051] The strategy is as follows: the initial tension ratio of the two sets of support chains is set to 40%:60%; the key monitoring areas of the displacement sensor are set at 1 / 4 and 3 / 4 of the plate width.

[0052] When the specification "12 floors, 0.48㎡" is entered, the control system automatically matches and loads strategy B.

[0053] In one embodiment, a parameter self-learning function is also provided, the specific implementation process of which is triggered after the single-board transmission is completed: First, the system records the peak deformation displacement, average tension value, and final control parameters after the control reaches stability throughout the entire process of conveying this PCB thick board.

[0054] The system then compares the peak value of the deformation displacement with the upper limit of the deformation allowed by the process.

[0055] If the peak value of this control is significantly lower than the upper limit, the self-learning module will be activated and the initial parameter set of the stored board of this specification will be fine-tuned based on the control data of this stable transmission phase.

[0056] For example, by slightly reducing the initial tension from 130N to 125N, or by fine-tuning the integral coefficient I of the main loop PID from 0.05 to 0.04, the updated parameters will be stored and used for the subsequent transmission of all plates of the same specification, thereby enabling the system to continuously optimize itself and pursue more energy-efficient and gentler control while ensuring the suppression effect.

[0057] In one embodiment, the specific implementation process for obtaining the deformation displacement signal is as follows: Multiple laser displacement sensors are installed at equal intervals along the width of the PCB board. Under a synchronous trigger signal, the multiple sensors simultaneously acquire real-time height data of the board surface at multiple monitoring points.

[0058] After receiving this set of discrete point data, the control system calls the built-in curve fitting algorithm. The algorithm uses the data from these multiple monitoring points to fit and generate a continuous curve that reflects the shape of the current cross-section plate, i.e., a real-time deformable surface model.

[0059] Based on the real-time deformable surface model, two feature values ​​are extracted: Sag at midpoint: The difference between the lowest point of the curve and the ideal horizontal reference plane.

[0060] Edge warping: The difference between the two ends of the curve and the reference plane.

[0061] The sag in the middle and the warping at the edges are used as deformation displacement feedback signals input to the control system.

[0062] In one embodiment, based on a real-time deformable surface model, specific methods for contour adjustment are obtained, namely: When the right edge warpage is extracted from the fitted curve as +0.4mm and exceeds the threshold of 0.3mm, the system first performs position mapping to identify that the warpage occurs in the right end region of the plate width. Subsequently, the system performs contour adjustment. If the flexible support chain system consists of three independently driven chain segments arranged in parallel, the system can reduce the tension setting value of the rightmost support chain to release the plate edge stress.

[0063] In a preferred embodiment, the drive module includes an additional micro linear motor that the system can control to push the right-side chain segment support block, causing it to make a preset micro-displacement of 0.3mm inward toward the plate. This actively formed indentation changes the local support profile, causing the raised plate edge to lose support and naturally fall back.

[0064] In one embodiment, the control system communicates with the factory's production execution system in real time.

[0065] Before delivering a batch of PCBs, the MES issues a process instruction, which includes "Subsequent process: precision mounting, maximum allowable deformation requirement: <0.15mm".

[0066] After parsing the instruction, the control system dynamically adjusts the internal deformation target setpoint. It adjusts the setpoint of the main loop PID from the default 0mm to a more stringent -0.05mm to achieve graded deformation control based on the accuracy of downstream processes.

[0067] It should be understood that although the steps in the flowcharts of the above embodiments are shown sequentially as indicated, these steps are not necessarily executed in the indicated order. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the flowcharts of the above embodiments may include multiple steps or multiple stages. These steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these steps or stages is not necessarily sequential, but can be performed alternately or in turn with other steps or at least some of the steps or stages in other steps.

[0068] Corresponding to the aforementioned embodiments of the deformation suppression method in the vertical transport of thick PCB boards, this application also provides embodiments of the deformation suppression system in the vertical transport of thick PCB boards.

[0069] In one exemplary embodiment, such as Figure 3 As shown, the deformation suppression system in the vertical conveying of the PCB thick board includes a vertical conveying mechanism 1, a flexible support chain system 2, and a control system 3. Vertical conveyor 1 is used to clamp and convey thick PCB boards; The flexible support chain system 2 is located in the middle of the transmission path of the vertical transmission mechanism 1, and includes at least one set of support chains made of polymer wear-resistant chains, a drive module for driving and adjusting the support chains, a tension sensor for detecting the chain tension, and a displacement sensor for detecting the deformation of the PCB thick plate. Control system 3 is communicatively connected to tension sensor, displacement sensor and drive module, and is configured to execute tension-displacement dual feedback control loop to generate control signals to operate drive module.

[0070] In one embodiment, the PCB thick board vertical conveying deformation suppression system includes a vertical conveying mechanism 1, a flexible support chain system 2, and a control system 3.

[0071] The vertical conveying mechanism 1 typically consists of two servo motors and opposing friction wheel sets, used to reliably clamp the edge of the thick PCB board and drive it to move in the vertical plane.

[0072] The flexible support chain system 2 is installed in the vertical conveying mechanism 1, located in the middle section of the vertical conveying path. It is a ring support chain composed of polymer wear-resistant chains connected end to end. The chain is driven by a servo motor and its running trajectory and tension are maintained by a guide rail and tension wheel structure. High-precision strain gauge tension sensors are installed in the tension wheel bearing housing or on the straight section of the chain. One or more displacement sensors are installed above the support chain facing the PCB board. The control system 3 is based on an industrial PLC. Its digital / analog input modules are connected to each sensor, and its output modules are connected to the servo drivers of the vertical conveying mechanism and the flexible support chain system, thus forming a complete hardware closed loop.

[0073] In one embodiment, each link of the flexible support chain system 2 has a row of miniature rollers made of engineering plastics or ceramics embedded on its working surface. The axis of these miniature rollers is precisely installed perpendicular to the conveying direction of the PCB board. When the support chain contacts the back of the board, these rollers form rolling contact with the board surface, reducing friction and static electricity generation, achieving a true rolling contact support surface, and protecting the PCB board surface.

[0074] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0075] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A deformation suppression method in a PCB thick board vertical transfer, characterized by, Applied in equipment that includes a vertical conveying mechanism, a flexible support chain system, and a control system, including: Based on the specifications of the PCB board to be transmitted, the pre-stored initial parameter set is called to initialize the flexible support chain system. The initial parameter set includes at least the initial tension force and PID control parameters. The vertical conveying mechanism is controlled to clamp the PCB thick board and convey it vertically, while the flexible support chain system is activated so that its support chain contacts the back of the board and provides basic support. The tension feedback signal from the flexible support chain system and the plate deformation displacement feedback signal from the displacement sensor are acquired in real time. The tension feedback signal and the deformation displacement feedback signal are input into the tension-displacement dual feedback control loop, wherein the deformation displacement feedback signal is the main controlled variable and the tension feedback signal is the secondary controlled variable. The loop is calculated in real time by a cascade control algorithm to generate control commands for adjusting the drive module. According to the control command, the tension and effective support profile of the flexible support chain system are dynamically adjusted so that the distribution of the support force acting on the back of the board adapts to the real-time deformation state of the PCB thick board, thereby suppressing elastic deformation.

2. The deformation suppression method in the PCB thick board vertical transfer according to claim 1, wherein, The cascade control algorithm further includes: The real-time deformation displacement value is compared with the deformation target set value to obtain the first deviation value. After calculation by the main loop PID controller, the first intermediate control quantity is output. The first intermediate control quantity is used as the tension setpoint and compared with the real-time tension feedback value to obtain the second deviation value. After calculation by the secondary loop PID controller, the second intermediate control quantity is output. The second intermediate control quantity is fed forward for compensation. The feedforward compensation quantity is calculated in real time based on the specification information of the PCB thick board and the transmission speed. The compensated result is output to the drive module as the final control command.

3. The deformation suppression method in the PCB thick board vertical transfer according to claim 2, wherein, Also includes: The deformation rate is calculated based on the deformation displacement data acquired by the displacement sensor within a continuous sampling period. If the deformation rate continuously exceeds a preset rate threshold, feedforward adjustment is initiated. Based on the control command output by the cascade control algorithm, an additional adjustment amount proportional to the deformation rate is superimposed. The direction of this additional adjustment amount is set to suppress the deformation trend.

4. The method of claim 1, wherein the PCB thick board vertical transfer deformation is inhibited by, The initialization configuration also includes: Based on the number of layers and area information of the PCB thick board, one of the pre-stored support strategies is selected. The support strategy defines the initial tension ratio of different groups of support chains in the flexible support chain system and the key monitoring area of ​​the displacement sensor.

5. The method of claim 1, wherein the PCB thick board vertical transfer deformation is inhibited by, Also includes: After completing the transfer of a single PCB board, record the peak value of deformation displacement, average tension value and final control parameters during the transfer process. The peak value of the deformation displacement is compared with the upper limit of the deformation allowed by the process; If the peak value of the deformation displacement is significantly lower than the upper limit value of the deformation, then based on the stable control data transmitted this time, the initial parameter set bound to the board specification is finely adjusted for subsequent transmission of boards of the same specification.

6. The method of claim 1, wherein the PCB thick board vertical transfer deformation is inhibited by, The real-time acquisition of plate deformation displacement feedback signals from displacement sensors further includes: By using multiple displacement sensors arranged along the width direction of the board, real-time height data of multiple monitoring points on the PCB board in the width direction are acquired synchronously. Based on the real-time height data of the multiple monitoring points, a real-time deformation surface model of the PCB thick plate is generated by fitting. The sag at the center and the warping at the edges are extracted from the real-time deformable surface model as the deformation displacement feedback signal.

7. The deformation suppression method in the PCB thick board vertical transfer according to claim 6, wherein, The step of dynamically adjusting the tension and effective support profile of the flexible support chain system according to the control command further includes: When the extracted edge warping exceeds the threshold, the lateral location where the warping occurs is identified. Reduce the tension setting value of one or more sets of support chains corresponding to the lateral position in the flexible support chain system, or control the drive module to make that part of the support chain produce a preset micro-displacement opposite to the warping direction, so as to change the local support profile.

8. The deformation suppression method for vertical transport of thick PCB boards as described in claim 2, characterized in that, Also includes: Receive process instructions from the production execution system, the process instructions containing allowable deformation requirements for the PCB thick board in subsequent precision processes; Based on the allowable deformation requirements, the deformation target setting value is dynamically adjusted to achieve graded deformation control based on process accuracy.

9. A deformation suppression system for vertical transport of thick PCB boards, characterized in that, Includes a vertical conveying mechanism, a flexible support chain system, and a control system; The vertical conveying mechanism is used to clamp and convey thick PCB boards. The flexible support chain system is located in the middle of the transmission path of the vertical transmission mechanism, and includes at least one set of support chains made of polymer wear-resistant chains, a drive module for driving and adjusting the support chains, a tension sensor for detecting chain tension, and a displacement sensor for detecting PCB thick plate deformation. The control system is communicatively connected to the tension sensor, displacement sensor, and drive module, and is configured to execute the tension-displacement dual feedback control loop to generate control signals to operate the drive module.

10. The deformation suppression system for vertical conveying of thick PCB boards as described in claim 9, characterized in that, The flexible support chain system has several freely rotatable micro rollers embedded in the working surface of the support chain. The axis of the micro rollers is perpendicular to the conveying direction, forming a rolling contact support surface.

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