A spraying etching device for PCB production

Abstract

The present application relates to a kind of spray etching equipment for PCB circuit board production, including spray chamber, the top of spray chamber is provided with liquid storage cylinder, the bottom of liquid storage cylinder is provided with shunt delivery pipe, the bottom of shunt delivery pipe is fixedly installed with etching spray head, etching spray head includes driving element, shunt piece and pressure accumulator, driving element includes butt joint pipe, butt joint pipe top is installed in the bottom of shunt delivery pipe, the bottom of butt joint pipe is rotatably connected with butt joint ring, fixedly connected with leakage prevention side wall between the upper and lower two butt joint rings, the inside of butt joint ring is fixedly connected with fixed slide bar, fixed slide bar is fixedly connected with butt joint ring.The present application realizes the self-stabilization of main road continuous injection flow and the self-adaptive regulation of pulse cycle, to suppress inlet flow fluctuation, guarantee the injection pressure stability of continuous etching stage, simultaneously, through surplus liquid volume automatic adjustment pulse injection frequency, make etching process always be in stable controllable state, effectively improve the etching uniformity of whole board and line width precision.

Description

Technical Field

[0001] This invention relates to the field of printed circuit board manufacturing technology, specifically to a spray etching device for PCB production. Background Technology

[0002] Spray etching equipment is the core equipment in the wet etching process of PCB circuit boards. It is widely used in the copper layer patterning process after copper-clad laminate development. By continuously supplying etching solution to the board surface, it dissolves and removes the copper layer in non-circuit areas. The stability of its spray flow rate and pressure directly determines the consistency of etching rate and line width tolerance, which are key factors affecting PCB product yield and process accuracy.

[0003] Most existing spray etching equipment adopts a structure in which the circulating pipeline is directly connected to the nozzle. The etching solution is delivered by the pump and then sprayed continuously through the nozzle. Some equipment with pulse function relies on the on and off of the electronic control valve according to preset parameters to achieve pulse spraying.

[0004] However, such equipment cannot smooth out flow fluctuations at the inlet. Changes in pump pressure and flow differences caused by multi-station diversion will be directly transmitted to the nozzle, resulting in unstable spray pressure. The controllability of the etching process is poor, making it difficult to ensure the uniformity of etching across the entire board during mass production. Summary of the Invention

[0005] The purpose of this invention is to provide a spray etching device for PCB circuit board production, which aims to improve the problem that some existing devices cannot suppress the flow fluctuations at the inlet end, resulting in unstable spray pressure.

[0006] The objective of this invention is achieved through the following technical solution: a spray etching device for PCB circuit board production, comprising a spray chamber, wherein a liquid storage tank is provided at the top of the spray chamber, a branch delivery pipe is provided at the bottom of the liquid storage tank, and an etching spray head is fixedly installed at the bottom of the branch delivery pipe. The etching spray head includes a drive unit, a branch unit, and a accumulator. The drive unit includes a connecting pipe. The top of the connecting pipe is installed at the bottom of the branch delivery pipe. A docking ring is rotatably connected to the bottom of the connecting pipe. A leak-proof sidewall is fixedly connected between the upper and lower docking rings. A fixed sliding rod is fixedly connected to the inner side of the docking ring. A docking ring is fixedly connected between the fixed sliding rods. A rotating shaft is fixedly connected to the center of the docking ring. A turbine is provided on the outer side of the rotating shaft. The circuit divider includes a slider that is slidably connected to the outside of the slide bar, and an elastic reinforcing rope is fixedly connected between the upper and lower sliders. A counterweight ball is fixedly connected to the middle of the elastic reinforcing rope. As a further description of the above technical solution: A protective sleeve is provided between the docking rings, and the inner diameter of the center of the protective sleeve is larger than the length of the outer blade of the turbine. A main pipe is fixedly connected to the bottom of the lower docking ring, and a nozzle is fixedly connected to the bottom of the main pipe. As a further description of the above technical solution: The nozzle has a fan-shaped nozzle structure, and the liquid outlet at the lower end of the nozzle is a flat slit. After the etching liquid is sprayed out by the nozzle, it forms a fan-shaped mist spray surface, covering the board surface area of ​​the PCB circuit board. As a further description of the above technical solution: The diverter also includes a tension spring disposed between the slider and the docking ring. A foldable baffle is fixedly disposed on the top surface of the slider. The height of the inner side of the foldable baffle gradually decreases from the outside to the center to prevent liquid from accumulating on the top of the baffle. A baffle is disposed on the rear side of the slider to prevent the elastic reinforcing rope from swinging backward and hitting the protective sleeve. As a further description of the above technical solution: The accumulator includes a sealing tube rotatably connected to the bottom of the rotating ring, an accumulator chamber at the upper end of the sealing tube, and multiple secondary tubes fixedly connected inside the sealing tube. The top of the secondary tubes communicates with the accumulator chamber, a central shaft is fixedly connected to the center of the secondary tubes, an isolation ring is fixedly connected to the middle of the secondary tubes, and a sealing plug is slidably connected to the outside of the central shaft. As a further description of the above technical solution: The shape of the sealing plug is adapted to the shape of the bottom inner side of the isolation ring. A pre-tightening spring is fixedly installed at the bottom of the sealing plug. An inclined tube is installed between the secondary tube and the main tube. One end of the inclined tube is installed in the cavity below the sealing plug and is inserted into the outside of the main tube at an angle downward. As a further description of the above technical solution: The inner wall of the spray chamber is rotatably connected to a transmission roller, and a conveyor belt is sleeved on the outer side of the transmission roller. A motor is fixedly connected to the outer wall of the spray chamber, and the output end of the motor passes through the side wall of the spray chamber and is connected to the end of the transmission roller for transmission. As a further description of the above technical solution: The conveyor belt is tensioned and fitted on the outside of all the drive rollers. The side of the conveyor belt has evenly distributed tiny perforations to prevent excessive corrosion caused by liquid accumulation on the plate edge and to avoid excessive etching caused by rapid loss of liquid film.

[0007] Compared with the prior art, the advantages of the present invention are as follows: 1. The etching solution is delivered to the connecting pipes of each group of etching spray heads through the storage tank and the branch delivery pipe. The solution impacts the turbine from top to bottom, driving the rotating shaft to rotate continuously in a circumferential direction. The rotating shaft synchronously drives the circumferentially arranged fixed slide rod, slider and folded baffle to perform a circular motion. When the inlet solution flow rate increases, the turbine speed increases synchronously. Under the action of centrifugal force, the counterweight ball shifts outward to tighten the elastic reinforcement rope, which drives the slider to move outward along the fixed slide rod and stretch the tension spring. This causes the folded baffle to contract outward to increase the cross-sectional area of ​​the secondary flow channel, and diverts the excess solution to the outer pressure storage chamber and secondary pipeline. This achieves self-stabilization of the main continuous spray flow rate and adaptive adjustment of the pulse period, thereby smoothing the inlet flow fluctuation and ensuring the stability of the spray pressure during the continuous etching stage. At the same time, the pulse spray frequency is automatically adjusted by the amount of excess solution, so that the etching process is always in a stable and controllable state, effectively improving the etching uniformity and line width accuracy of the whole board.

[0008] 2. The etching solution is diverted through the connecting pipe into the accumulator chamber and the upper cavity of each auxiliary pipe. The chemical pressure continuously acts on the upper surface of the sealing plug. When the pressure exceeds the supporting force of the pre-tightening spring, the sealing plug moves down along the central axis to open the passage. The high-pressure chemical solution flows obliquely into the lower part of the main pipe through the inclined pipe and overlaps with the mainstream chemical solution. With the uniformly distributed perforated holes on the surface of the conveyor belt, the etching solution on the lower surface is guided and the chemical solution retained on the edge of the board is cleared, realizing periodic pulse pressure enhancement etching. The pulse jet can periodically break the diffusion liquid film on the board surface, improve the etching reaction rate and the accuracy of the line edge, and improve the overall processing yield of the PCB circuit board. Attached Figure Description

[0009] Figure 1 This is a schematic diagram of the main body of an embodiment of a spray etching equipment for PCB circuit board production proposed in this invention; Figure 2 This is a plan view of an embodiment of a spray etching equipment for PCB circuit board production proposed in this invention. Figure 3 This is a schematic diagram of the etching spray head of a spray etching device for PCB circuit board production proposed in this invention. Figure 4 This is a schematic diagram of the main structure of a spray etching device for PCB circuit board production proposed in this invention. Figure 5 This is a schematic diagram of the structure of a folded baffle plate in a spray etching device for PCB circuit board production proposed in this invention. Figure 6 This is a schematic diagram of the turbine structure of a spray etching device for PCB circuit board production proposed in this invention. Figure 7 This is a schematic diagram of the counterweight ball in a spray etching device for PCB production proposed in this invention. Figure 8This is a schematic diagram of the sub-pipe of a spray etching device for PCB circuit board production proposed in this invention.

[0010] Labeling Explanation: 1. Sprayer Booth; 2. Liquid Storage Tank; 3. Branch Delivery Pipe; 4. Etched Spray Head; 401. Connecting Pipe; 402. Rotating Ring; 403. Leak-proof Sidewall; 404. Fixed Slide Rod; 405. Connecting Ring; 406. Rotating Shaft; 407. Turbine; 408. Protective Sleeve; 409. Main Pipe; 410. Spray Head; 411. Slider; 412. Elastic Reinforcing Rope; 413. Counterweight Ball; 414. Tension Spring; 415. Folding Baffle Plate; 416. Sealing Pipe; 417. Accumulator Chamber; 418. Secondary Pipe; 419. Central Shaft; 420. Isolation Ring; 421. Sealing Plug; 422. Pre-tension Spring; 423. Inclined Pipe; 5. Motor; 6. Drive Roller; 7. Conveyor Belt. Detailed Implementation

[0011] The present invention will now be described in detail with reference to the accompanying drawings and embodiments: like Figures 1 to 8 The diagram shows an embodiment of a spray etching device for PCB manufacturing provided by the present invention. The device includes a spray chamber 1, which provides a closed etching workspace, isolating the etching solution from the external environment to prevent splashing and acid mist. A storage tank 2 is installed at the top of the spray chamber 1 to store the etching solution, providing a stable supply for the downstream spraying system. A branch delivery pipe 3 is installed at the bottom of the storage tank 2, which distributes the etching solution output from the storage tank 2 to each group of etching spray heads 4, ensuring a balanced supply of solution to each workstation. An etching spray head 4 is fixedly installed at the bottom of the branch delivery pipe 3, integrating spray drive, flow regulation, and pressure accumulator pulse functions to evenly spray the etching solution onto the PCB surface to complete the etching operation. A drive roller 6 is rotatably connected to the inner wall of the spray chamber 1, receiving the driving force of a motor 5 and transmitting it to a conveyor belt 7, supporting the smooth circulation of the conveyor belt 7. A conveyor belt 7 is fitted around the outer side of the drive roller 6. The conveyor belt 7 carries the PCB circuit board to be processed through the etching area at a constant speed, realizing continuous conveying operation. A motor 5 is fixedly connected to the outer wall of the spray chamber 1. The motor 5 provides rotational driving force for the conveying system and controls the etching conveying speed of the PCB circuit board. The output end of the motor 5 passes through the side wall of the spray chamber 1 and is connected to the end of the drive roller 6. The conveyor belt 7 is tensioned and fitted around the outer side of all the drive rollers 6. The side of the conveyor belt 7 has evenly distributed tiny perforations, which can conduct the etching solution on the upper and lower sides and drain the solution stuck on the edge of the board, thereby preventing excessive etching due to liquid accumulation on the edge of the board and avoiding excessive etching caused by rapid loss of liquid film.

[0012] The etching spray head 4 includes a drive unit, a branching unit, and a accumulator. The drive unit includes a connecting pipe 401, which receives the chemical input from the branching delivery pipe 3 and provides a mounting carrier and chemical inlet for the internal drive and branching structure. The top of the connecting pipe 401 is mounted on the bottom of the branching delivery pipe 3, and a docking ring 405 is rotatably connected to the bottom of the connecting pipe 401. The docking ring 405 provides mounting support for the rotating shaft 406, the fixed slide rod 404, and the protective sleeve 408, and also forms a transition channel for chemical flow. A leak-proof sidewall 403 is fixedly connected between the upper and lower docking rings 405. The leak-proof sidewall 403 surrounds the outer periphery of the spray area, collects splashed etching chemical, and guides the chemical back to the spray area, reducing chemical loss. A fixed slide rod 404 is fixedly connected to the inner side of the docking ring 405. The fixed slide rod 404 provides a sliding guide track for the slider 411, limiting the radial movement path of the slider 411. A docking ring 405 is fixedly connected between the fixed sliding rods 404. A rotating shaft 406 is fixedly connected to the center of the docking ring 405. The rotating shaft 406 receives the rotational driving force of the turbine 407, driving the circumferential flow distribution structure to rotate synchronously in the circumferential direction. The turbine 407 is located on the outer side of the rotating shaft 406. The turbine 407 generates rotational torque due to the impact of the liquid from above, converting the kinetic energy of the liquid into the rotational mechanical energy of the rotating shaft 406. A protective sleeve 408 is provided between the docking rings 405, and the inner diameter of the center of the protective sleeve 408 is larger than the length of the outer blades of the turbine 407. The protective sleeve 408 surrounds the outer circumference of the turbine 407, regulates the flow of the liquid, and protects the internal turbine 407 structure from damage caused by impurities. A main pipe 409 is fixedly connected to the bottom of the lower docking ring 405. The main pipe 409 guides the mainstream etching liquid downward to the nozzle 410, forming the mainstream channel for continuous spraying. The bottom of the main pipe 409 is fixedly connected to a nozzle 410. The nozzle 410 transforms the etching solution delivered by the main pipe 409 into a uniform spray pattern. The nozzle 410 has a fan-shaped nozzle structure, and the liquid outlet at the lower end of the nozzle 410 is a flat slit. After the etching solution is sprayed out by the nozzle 410, it forms a fan-shaped mist spray surface that covers the board surface area of ​​the PCB circuit board.

[0013] The diverter includes a slider 411 slidably connected to the outside of a slide rod. The slider 411 slides radially along the fixed slide rod 404, causing the folded baffle 415 to open and close synchronously, adjusting the flow cross-sectional area of ​​the main and secondary flow channels. An elastic reinforcing rope 412 is fixedly connected between the upper and lower sliders 411. The elastic reinforcing rope 412 connects the upper and lower sliders 411, bears the centrifugal pull of the counterweight ball 413, and synchronously drives the upper and lower sliders 411 to move in linkage. The counterweight ball 413 is fixedly connected to the middle of the elastic reinforcing rope 412. The counterweight ball 413 generates centrifugal force as the rotating shaft 406 rotates, which pulls the slider 411 radially through the elastic reinforcing rope 412 to achieve adaptive flow adjustment. The diverter also includes a tension spring 414 disposed between the slider 411 and the docking ring 405. The tension spring 414 provides a reset elastic force. When the rotation speed of the rotating shaft 406 decreases, it pulls the slider 411 to reset inward, causing the folded baffle 415 to unfold synchronously. A foldable baffle 415 is fixedly installed on the top surface of the slider 411. The foldable baffle 415 changes its radial obstruction range as the slider 411 opens and closes, adjusting the flow area of ​​the main channel, diverting excess liquid to the secondary channel, and stabilizing the main channel injection flow rate. The height of the inner side of the foldable baffle 415 gradually decreases from the outside to the center to prevent liquid from accumulating on the top of the baffle. A baffle is provided on the rear side of the slider 411. The baffle limits the radial swing amplitude of the elastic reinforcing rope 412 to prevent the elastic reinforcing rope 412 from swinging backward and hitting the protective sleeve 408.

[0014] The accumulator includes a sealing tube 416 rotatably connected to the bottom of the rotating ring 402. The rotating ring 402 supports the fixed structure of the connecting tube 401, adapts to the circumferential rotation of the internal rotating components, and ensures the rotational fit between the internal and external structures. The sealing tube 416 forms the external enclosed shell of the accumulator, accommodating the accumulator chamber 417 and the secondary tube 418 structure, ensuring the sealing of the accumulator stage. The upper end of the sealing tube 416 is provided with the accumulator chamber 417, which temporarily stores excess etching solution diverted from the accumulator, accumulating liquid pressure to provide pressure reserve for pulse jetting. Furthermore, multiple secondary tubes 418 are fixedly connected inside the sealing tube 416. The secondary tubes 418 provide installation space for the sealing plug 421 and the preload spring 422, forming independent chambers for pressure accumulation and depressurization. The top of the secondary tube 418 is connected to the accumulator chamber 417. A central shaft 419 is fixedly connected to the center of the secondary tube 418. The central shaft 419 provides a sliding guide for the sealing plug 421, limiting the axial movement path of the sealing plug 421 and ensuring sealing alignment accuracy. An isolation ring 420 is fixedly connected to the middle of the secondary tube 418. The isolation ring 420 and the sealing plug 421 cooperate to achieve a sealed isolation between the upper and lower chambers of the secondary tube 418, controlling the on / off state of pressure accumulation and release. The sealing plug 421 is slidably connected to the outside of the central shaft 419. Under the combined action of the liquid pressure and the force of the pre-tightening spring 422, the sealing plug 421 slides along the central shaft 419, realizing the automatic opening and closing of the passage of the secondary tube 418. The shape of the sealing plug 421 is adapted to the shape of the bottom inner side of the isolation ring 420. A pre-tightening spring 422 is fixedly installed at the bottom of the sealing plug 421. The pre-tightening spring 422 provides an upward pre-tightening support force, sets the pressure threshold for pulse triggering, and pushes the sealing plug 421 to reset after pressure release. An inclined tube 423 is installed between the secondary tube 418 and the main tube 409. The inclined tube 423 diverts the high-pressure liquid in the secondary tube 418 into the lower part of the main tube 409, where it overlaps with the mainstream liquid to create instantaneous pressure and achieve a pulse jet effect. One end of the inclined tube 423 is located in the cavity below the sealing plug 421 and is inserted into the outside of the main tube 409 at an angle downwards.

[0015] Working principle: Motor 5 is started, and its output drives the transmission roller 6 to rotate around its own axis. The transmission roller 6 drives the outer conveyor belt 7 to rotate in a cycle. The PCB circuit board to be processed is placed on the feed end of the conveyor belt 7, and the conveyor belt 7 carries the PCB circuit board and moves it uniformly into the spray chamber 1. The evenly distributed perforated holes on the surface of the conveyor belt 7 move synchronously with the conveyor belt 7, corresponding to the lower surface area of ​​the PCB circuit board throughout the entire process.

[0016] The etching solution stored inside the reservoir 2 flows downward under the pressure of the conveying system and enters the branch conveying pipe 3. After being divided by the branch conveying pipe 3, it enters the connecting pipe 401 of each group of etching spray heads 4. The etching solution flows downward along the internal cavity of the connecting pipe 401, passes through the upper connecting ring 405 and enters the internal space of the protective sleeve 408. It impacts the curved blades of the turbine 407 from top to bottom, causing the turbine 407 to drive the central rotating shaft 406 to rotate continuously around its own axis. The etching solution continues to flow downward through the channel between the blade gap of the turbine 407 and the inner wall of the protective sleeve 408, passes through the lower connecting ring 405 and enters the main pipe 409, and finally is sprayed outward from the nozzle 410 at the bottom of the main pipe 409. The flat slit-shaped liquid outlet at the lower end of the nozzle 410 spreads the etching solution into a fan-shaped mist spray surface, which is evenly applied to the upper surface of the PCB circuit board below.

[0017] During the rotation of the shaft 406, the circumferentially distributed fixed sliding rods 404, sliders 411, and folded baffles 415 synchronously drive the fixed sliding rods 404, sliders 411, and folded baffles 415 to perform circular motion around the axis of the shaft 406. The centrifugal force generated by the circular motion acts on the counterweight ball 413, causing the counterweight ball 413 to shift away from the axis of the shaft 406. The counterweight ball 413 tensions the elastic reinforcing ropes 412 connected at the top and bottom, which in turn drives the two corresponding sets of sliders 411 to slide outward along the fixed sliding rods 404. During the sliding of the sliders 411, the tension springs 414 at their ends are stretched synchronously. As the sliders 411 move outward, they push the folded baffles 415 to retract outward synchronously, changing the radial coverage width of the sprayed liquid. When the rotational speed of the shaft 406 increases, the centrifugal force increases synchronously, the offset distance of the counterweight ball 413 increases, and the retraction amplitude of the folded baffles 415 increases accordingly. When the rotational speed of the shaft 406 decreases, the tension spring 414 rebounds and contracts, pulling the slider 411 inward along the fixed slide rod 404, and the folding baffle 415 unfolds inward simultaneously. The baffle on the rear side of the slider 411 moves synchronously with the slider 411, limiting the radial swing amplitude of the elastic reinforcing rope 412. The etching solution falling on the top surface of the folding baffle 415 flows from the center to the outside along its inclined surface.

[0018] A portion of the etching solution entering the connector 401 is diverted outwards and enters the internal space of the pressure accumulator 417. The etching solution in the pressure accumulator 417 is further diverted into the upper cavities of each secondary pipe 418, and the chemical pressure continuously acts on the upper end face of the sealing plug 421. In the initial state, the preload spring 422 supports the sealing plug 421 upwards, so that the upper end face of the sealing plug 421 is tightly fitted with the lower end face of the isolation ring 420, sealing the communication passage between the upper and lower cavities of the secondary pipe 418. As the etching solution continues to be injected into the pressure accumulator 417, the internal pressure gradually increases. When the downward force of the chemical solution on the sealing plug 421 exceeds the upward supporting force of the preload spring 422, the sealing plug 421 slides downwards along the central axis 419, simultaneously compressing the preload spring 422 below, and the upper and lower cavities of the secondary pipe 418 are connected. After the high-pressure etching solution in the secondary pipe 418 flows into the lower cavity, it flows obliquely into the lower area of ​​the main pipe 409 through the inclined pipe 423, merging with the mainstream etching solution in the main pipe 409, causing the spray pressure at the nozzle 410 to rise instantaneously. After the pressure in the accumulator 417 is released, the internal pressure gradually decreases, the preload spring 422 rebounds upward, pushing the sealing plug 421 to reset upward along the central axis 419, re-attaching to the isolation ring 420 to seal the passage, and the accumulator 417 re-enters the pressurized state, forming a periodic pulsed pressurized spray process. The rotating ring 402 on the outside of the connecting pipe 401 maintains a rotational engagement with the sealing pipe 416 below, adapting to the movement of the internal rotating components. The leak-proof sidewall 403 surrounds the outer perimeter of the spray area, collecting the splashed etching solution and causing the splashed solution to flow back downward along the inner wall of the sidewall.

[0019] Part of the etching solution sprayed from nozzle 410 passes downward through the perforations on the surface of conveyor belt 7 and contacts the lower surface of the PCB circuit board, etching the copper layer on the lower surface. Excess etching solution in the edge area of ​​the PCB circuit board flows along the board surface to the edge and then drips downward through the perforations of conveyor belt 7, detaching from the PCB circuit board surface.

[0020] The PCB circuit board moves continuously along the conveyor belt 7, passing through the spray etching area, and is then transported by the conveyor belt 7 to the discharge end of the spray room 1, completing the etching process for the entire board. After the equipment stops supplying etching solution, the turbine 407 loses the continuous impact driving force of the solution, the rotation speed of the shaft 406 gradually decreases until it stops rotating, the centrifugal force generated by the circular motion disappears simultaneously, the tension spring 414 rebounds and pulls the slider 411 back inward along the fixed slide rod 404, the folding baffle 415 simultaneously retracts to its initial state, and the counterweight ball 413 returns to its initial position. After the pressure accumulator 417 stops receiving liquid, the internal pressure gradually decreases, the sealing plug 421 remains in contact with the isolation ring 420 under the support of the pre-tightening spring 422, the inclined tube 423 remains in a sealed state, and the entire equipment returns to the initial standby state.

Claims

1. A spray etching device for PCB circuit board production, comprising a spray booth (1), characterized in that: The top of the spray room (1) is provided with a liquid storage tank (2), the bottom of the liquid storage tank (2) is provided with a branch delivery pipe (3), and the bottom of the branch delivery pipe (3) is fixedly installed with an etching spray head (4). The etching spray head (4) includes a drive component, a branch component and a accumulator component. The drive component includes a connecting pipe (401). The top of the connecting pipe (401) is installed at the bottom of the branch delivery pipe (3). A docking ring (405) is rotatably connected to the bottom of the connecting pipe (401). A leak-proof sidewall (403) is fixedly connected between the upper and lower docking rings (405). A fixed slide rod (404) is fixedly connected to the inner side of the docking ring (405). A docking ring (405) is fixedly connected between the fixed slide rods (404). A rotating shaft (406) is fixedly connected to the center of the docking ring (405). A turbine (407) is provided on the outer side of the rotating shaft (406). The branching component includes a slider (411) slidably connected to the outside of the slider, an elastic reinforcing rope (412) fixedly connected between the upper and lower sliders (411), and a counterweight ball (413) fixedly connected to the middle of the elastic reinforcing rope (412).

2. The spray etching equipment for PCB circuit board production according to claim 1, characterized in that: A protective sleeve (408) is provided between the docking rings (405), and the inner diameter of the center of the protective sleeve (408) is greater than the length of the outer blade of the turbine (407). A main pipe (409) is fixedly connected to the bottom of the lower docking ring (405), and a nozzle (410) is fixedly connected to the bottom of the main pipe (409).

3. The spray etching equipment for PCB circuit board production according to claim 2, characterized in that: The nozzle (410) has a fan-shaped nozzle structure. The liquid outlet at the lower end of the nozzle (410) is a flat slit. After the etching liquid is sprayed out by the nozzle (410), it forms a fan-shaped mist spray surface, covering the board surface area of ​​the PCB circuit board.

4. The spray etching equipment for PCB circuit board production according to claim 1, characterized in that: The diverter also includes a tension spring (414) disposed between the slider (411) and the docking ring (405). A foldable baffle (415) is fixedly disposed on the top surface of the slider (411). The height of the inner side of the foldable baffle (415) gradually decreases from the outer side to the center to prevent liquid from accumulating on the top of the baffle. A baffle is disposed on the rear side of the slider (411) to prevent the elastic reinforcing rope (412) from swinging backward and hitting the protective sleeve (408).

5. The spray etching equipment for PCB circuit board production according to claim 1, characterized in that: The accumulator includes a sealing tube (416) rotatably connected to the bottom of the rotating ring (402). The upper end of the sealing tube (416) is provided with an accumulator chamber (417). Multiple secondary tubes (418) are fixedly connected inside the sealing tube (416). The top of the secondary tubes (418) communicates with the accumulator chamber (417). A central shaft (419) is fixedly connected to the center of the secondary tubes (418). An isolation ring (420) is fixedly connected to the middle of the secondary tubes (418). A sealing plug (421) is slidably connected to the outside of the central shaft (419).

6. The spray etching equipment for PCB circuit board production according to claim 5, characterized in that: The shape of the sealing plug (421) is adapted to the shape of the bottom inner side of the isolation ring (420). A pre-tightening spring (422) is fixedly installed at the bottom of the sealing plug (421). An inclined tube (423) is provided between the secondary tube (418) and the main tube (409). One end of the inclined tube (423) is located in the cavity below the sealing plug (421) and is inserted into the outside of the main tube (409) at an angle downward.

7. The spray etching equipment for PCB circuit board production according to claim 1, characterized in that: The inner wall of the spray chamber (1) is rotatably connected to a transmission roller (6), and a conveyor belt (7) is sleeved on the outer side of the transmission roller (6). A motor (5) is fixedly connected to the outer wall of the spray chamber (1), and the output end of the motor (5) passes through the side wall of the spray chamber (1) and is connected to the end of the transmission roller (6) for transmission.

8. The spray etching equipment for PCB circuit board production according to claim 7, characterized in that: The conveyor belt (7) is tensioned and sleeved on the outside of all the drive rollers (6). The side of the conveyor belt (7) is evenly distributed with tiny perforated holes to prevent excessive corrosion caused by liquid accumulation on the edge of the plate, and to avoid excessive etching caused by rapid loss of liquid film.

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