Light conversion plate, mini-led display device and related preparation method

Abstract

The present application relates to a kind of light conversion plate, Mini-LED display device and related preparation method, it is related to semiconductor display technical field.In the preparation method of the light conversion module for Mini-LED display device in the present application, by forming the first surface and the second surface of glass substrate first light conversion block, first light scattering block, second light conversion block and second light scattering block are alternately distributed, wherein the density of light conversion particle in the first light conversion block is greater than the density of light conversion particle in the second light conversion block, the density of light scattering particle in the second light scattering block is greater than the density of light scattering particle in the first light scattering block, by optimizing the structure of each light conversion block and each scattering block and the density relationship of light conversion particle, light scattering particle, light conversion efficiency and light uniformity are greatly improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor display technology, specifically to a light conversion plate, a Mini-LED display device, and related manufacturing methods. Background Technology

[0002] In the existing fabrication process of Mini-LED display devices, light-emitting epitaxial wafers are cut into Mini-LED chips with a size of 100-300μm. Then, the Mini-LED chips are transferred in batches onto a driving circuit substrate. A protective encapsulation layer is then fabricated on the surface of the Mini-LED chip array, and a light conversion layer is fabricated on the protective encapsulation layer. Since there are a large number of Mini-LED chips on the driving substrate, the fabrication cost of the light conversion layer is greatly increased. How to simplify the fabrication method of the light conversion layer is a technical hotspot that the industry continues to focus on. Summary of the Invention

[0003] The purpose of this invention is to overcome the shortcomings of the prior art and provide a light conversion plate, a Mini-LED display device, and related preparation methods.

[0004] To achieve the above objectives, the present invention proposes a method for fabricating a light conversion module for a Mini-LED display device, comprising the following steps: A glass substrate is provided, the glass substrate including a first surface and a second surface disposed opposite to each other.

[0005] A plurality of first blind holes and a plurality of second blind holes are formed alternately on the first surface of the glass substrate, wherein the diameter of each first blind hole is larger than the diameter of each second blind hole.

[0006] A first light conversion block is formed in each of the first blind holes, and a first light scattering block is formed in each of the second blind holes.

[0007] Next, a plurality of third blind holes and a plurality of fourth blind holes are formed alternately on the second surface of the glass substrate. The third blind holes expose the first light conversion block, and the fourth blind holes expose the first light scattering block. The aperture of each third blind hole is smaller than the aperture of each fourth blind hole, the aperture of the third blind hole is smaller than the aperture of the first blind hole, and the aperture of the second blind hole is smaller than the aperture of the fourth blind hole.

[0008] A second light conversion block is formed in each of the third blind holes, and a second light scattering block is formed in each of the fourth blind holes, wherein the density of light conversion particles in the first light conversion block is greater than the density of light conversion particles in the second light conversion block, and the density of light scattering particles in the second light scattering block is greater than the density of light scattering particles in the first light scattering block.

[0009] The glass substrate is cut to form multiple light conversion modules, each of which includes multiple first light conversion blocks, multiple first light scattering blocks, multiple second light conversion blocks, and multiple second light scattering blocks.

[0010] As a preferred technical solution, the glass substrate is modified before forming a plurality of alternating first blind holes and a plurality of second blind holes.

[0011] As a preferred technical solution, the first light conversion block and the second light conversion block include a resin matrix and light conversion particles distributed in the resin matrix. The first light conversion block and the second light conversion block are formed by slit coating, scraping, printing, spraying or spin coating processes.

[0012] As a preferred technical solution, the ratio of the density of light conversion particles in the first light conversion block to the density of light conversion particles in the second light conversion block is 1.5-4.

[0013] As a preferred technical solution, the first light scattering block and the second light scattering block include a resin matrix and light scattering particles distributed in the resin matrix. The first light scattering block and the second light scattering block are formed by slit coating, scraping, printing, spraying or spin coating processes.

[0014] As a preferred technical solution, the ratio of the density of light scattering particles in the second light scattering block to the density of light scattering particles in the first light scattering block is 1.5-4.

[0015] As a preferred technical solution, the glass substrate is divided into a first region, a second region, and a third region. The first light conversion block and the second light conversion block in the first region are both first color conversion blocks, the first light conversion block and the second light conversion block in the second region are both second color conversion blocks, and the first light conversion block and the second light conversion block in the third region are both third color conversion blocks. In the process of cutting the glass substrate to form multiple light conversion modules, multiple first color light conversion modules, multiple second color light conversion modules, and multiple third color light conversion modules are formed respectively, wherein the first color, the second color, and the third color are all different.

[0016] The present invention also proposes a light conversion module, which is prepared by the above-described method for preparing a light conversion module for a Mini-LED display device.

[0017] The present invention also proposes a method for manufacturing a Mini-LED display device, comprising the following steps: A driving substrate is provided to transfer multiple Mini-LED chips to the driving substrate.

[0018] An encapsulation layer is formed on the driving substrate, and the encapsulation layer is patterned to form multiple grooves.

[0019] A plurality of the above-mentioned optical conversion modules are provided, and each of the optical conversion modules is disposed in a corresponding groove.

[0020] The present invention also proposes a Mini-LED display device, which is prepared by the above-described method for preparing a Mini-LED display device.

[0021] The beneficial effects of this invention are as follows: In the method for fabricating a light conversion module for a Mini-LED display device according to the present invention, a plurality of alternating first blind holes and a plurality of second blind holes are formed on the first surface of a glass substrate, a first light conversion block is formed in each first blind hole, a first light scattering block is formed in each second blind hole, and a plurality of alternating third blind holes and a plurality of fourth blind holes are formed on the second surface of the glass substrate. The third blind holes expose the first light conversion blocks, the fourth blind holes expose the first light scattering blocks, a second light conversion block is formed in each third blind hole, and a second light scattering block is formed in each fourth blind hole. The density of light conversion particles in the first light conversion blocks is greater than the density of light conversion particles in the second light conversion blocks, and the density of light scattering particles in the second light scattering blocks is greater than the density of light scattering particles in the first light scattering blocks. By optimizing the structure of each light conversion block and each scattering block, as well as the density relationship between light conversion particles and light scattering particles, the light conversion efficiency and light emission uniformity are greatly improved. Attached Figure Description

[0022] Figure 1 The diagram shows a structure in which a plurality of first blind holes and a plurality of second blind holes are alternately distributed on the first surface of a glass substrate, as shown in an embodiment of the present invention.

[0023] Figure 2 The diagram shows a structure in which a first light conversion block is formed in each of the first blind holes and a first light scattering block is formed in each of the second blind holes, according to an embodiment of the present invention.

[0024] Figure 3 The diagram shows a structure in which multiple third blind holes and multiple fourth blind holes are formed alternately on the second surface of a glass substrate in an embodiment of the present invention.

[0025] Figure 4The diagram shows a structure in which a second light conversion block is formed in each of the third blind holes and a second light scattering block is formed in each of the fourth blind holes, according to an embodiment of the present invention.

[0026] Figure 5 The diagram shown is a structural schematic of multiple optical conversion modules in an embodiment of the present invention.

[0027] Figure 6 The diagram shows a structure in which multiple Mini-LED chips are transferred to a driving substrate in an embodiment of the present invention.

[0028] Figure 7 The diagram shows a structural schematic of forming an encapsulation layer on a driving substrate and patterning the encapsulation layer in an embodiment of the present invention.

[0029] Figure 8 The diagram shows a structural schematic of each optical conversion module being placed in a corresponding groove in an embodiment of the present invention. Detailed Implementation

[0030] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings. Preferred embodiments of this application are shown in the drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this application.

[0031] like Figures 1 to 8 As shown, the present invention proposes a method for fabricating a light conversion module for a Mini-LED display device, comprising the following steps: like Figure 1 As shown, a glass substrate 100 is provided, the glass substrate 100 including a first surface and a second surface disposed opposite to each other. A plurality of first blind holes 101 and a plurality of second blind holes 102 are formed alternately on the first surface of the glass substrate 100, wherein the diameter of each first blind hole 101 is larger than the diameter of each second blind hole 102.

[0032] In a specific embodiment, before forming a plurality of alternating first blind holes 101 and a plurality of second blind holes 102, the glass substrate 100 is modified. More specifically, the first surface of the glass substrate 100 is laser modified, and then the glass substrate 100 is etched by a wet etching process to form a plurality of first blind holes 101 and a plurality of second blind holes 102.

[0033] In a specific embodiment, the ratio of the aperture of each first blind hole 101 to the aperture of each second blind hole 102 is 1.5-2. Preferably, the aperture of the second blind hole 102 can be 20-40 micrometers. More specifically, the aperture of the second blind hole 102 can be 20 micrometers, 25 micrometers, 30 micrometers, 35 micrometers or 40 micrometers.

[0034] like Figure 2 As shown, a first light conversion block 201 is formed in each of the first blind holes 101, and a first light scattering block 202 is formed in each of the second blind holes 102.

[0035] In a specific embodiment, the first light conversion block 201 includes a resin matrix and light conversion particles distributed in the resin matrix. The first light conversion block 201 is formed by slit coating, scraping, printing, spraying or spin coating processes.

[0036] In a specific embodiment, the resin matrix can be any suitable material such as photoresist, silicone, or epoxy resin, and the light conversion particles can be quantum dots or phosphors. The quantum dots can be any suitable material such as cadmium-based quantum dots, cadmium-free InP quantum dots, or perovskite quantum dots. The phosphors can be green phosphors, red phosphors, or blue phosphors. The light conversion particles in the first light conversion block 201 are selected according to the actual needs.

[0037] In a specific embodiment, the first light scattering block 202 includes a resin matrix and light scattering particles distributed in the resin matrix. The first light scattering block 202 is formed by slit coating, scraping, printing, spraying or spin coating processes. The resin matrix can be any suitable material such as photoresist, silicone, epoxy resin, etc., and the light scattering particles can be any suitable material such as titanium dioxide particles, barium sulfate particles, zinc oxide particles, zinc sulfide particles, silicon dioxide particles or nano silver particles.

[0038] like Figure 3 As shown, a plurality of alternately distributed third blind holes 103 and a plurality of fourth blind holes 104 are then formed on the second surface of the glass substrate 100. The third blind holes 103 expose the first light conversion block 201, and the fourth blind holes 104 expose the first light scattering block 202. The aperture of each third blind hole 103 is smaller than the aperture of each fourth blind hole 104, the aperture of the third blind hole 103 is smaller than the aperture of the first blind hole 101, and the aperture of the second blind hole 102 is smaller than the aperture of the fourth blind hole 104.

[0039] In a specific embodiment, before forming a plurality of alternately distributed third blind holes 103 and a plurality of fourth blind holes 104, the glass substrate 100 is modified. More specifically, the second surface of the glass substrate 100 is laser modified, and then the glass substrate 100 is etched by a wet etching process to form a plurality of third blind holes 103 and a plurality of fourth blind holes 104.

[0040] In a specific embodiment, the ratio of the diameter of each fourth blind hole 104 to the diameter of each third blind hole 103 is 1.5-2. The diameter of the third blind hole 103 can be 20-40 micrometers. More specifically, the diameter of the third blind hole 103 can be 20 micrometers, 25 micrometers, 30 micrometers, 35 micrometers or 40 micrometers.

[0041] In a specific embodiment, the diameter of the first blind hole 101 is the same as the diameter of the fourth blind hole 104, and the diameter of the second blind hole 102 is the same as the diameter of the third blind hole 103; in other embodiments, the diameter of the first blind hole 101 is larger than the diameter of the fourth blind hole 104, and the diameter of the second blind hole 102 is smaller than the diameter of the third blind hole 103.

[0042] like Figure 4 As shown, a second light conversion block 203 is formed in each of the third blind holes 103, and a second light scattering block 204 is formed in each of the fourth blind holes 104. The density of light conversion particles in the first light conversion block 201 is greater than the density of light conversion particles in the second light conversion block 203, and the density of light scattering particles in the second light scattering block 204 is greater than the density of light scattering particles in the first light scattering block 202.

[0043] In a specific embodiment, the second light conversion block 203 includes a resin matrix and light conversion particles distributed in the resin matrix. The second light conversion block 203 is formed by slit coating, scraping, printing, spraying or spin coating processes.

[0044] In a specific embodiment, the resin matrix can be any suitable material such as photoresist, silicone, or epoxy resin, and the light conversion particles can be quantum dots or phosphors. The quantum dots can be any suitable material such as cadmium-based quantum dots, cadmium-free InP quantum dots, or perovskite quantum dots. The phosphors can be green phosphors, red phosphors, or blue phosphors. The light conversion particles in the second light conversion block 203 are selected according to the actual needs.

[0045] In a specific embodiment, the second light scattering block 204 includes a resin matrix and light scattering particles distributed in the resin matrix. The second light scattering block 204 is formed by slit coating, scraping, printing, spraying or spin coating processes. The resin matrix can be any suitable material such as photoresist, silicone, epoxy resin, etc., and the light scattering particles can be any suitable material such as titanium dioxide particles, barium sulfate particles, zinc oxide particles, zinc sulfide particles, silicon dioxide particles or nano silver particles.

[0046] In a specific embodiment, the ratio of the density of light conversion particles in the first light conversion block 201 to the density of light conversion particles in the second light conversion block 203 is 1.5-4, and the ratio of the density of light scattering particles in the second light scattering block 204 to the density of light scattering particles in the first light scattering block 202 is 1.5-4. More specifically, the density of light conversion particles in each light conversion block can be adjusted by adjusting the mass ratio of light conversion particles forming the first light conversion block 201 and the second light conversion block 203. For example, the mass ratio of light conversion particles in the second light conversion block 203 is 2-6 wt%; the density of light scattering particles in each light scattering block can be adjusted by adjusting the mass ratio of light scattering particles forming the first light scattering block 202 and the second light scattering block 204. For example, the mass ratio of light scattering particles in the first light scattering block 202 is 0.5-1 wt%.

[0047] like Figure 5 As shown, the glass substrate 100 is cut to form a plurality of light conversion modules 300. Each light conversion module 300 includes a plurality of first light conversion blocks 201, a plurality of first light scattering blocks 202, a plurality of second light conversion blocks 203, and a plurality of second light scattering blocks 204.

[0048] In a specific embodiment, the glass substrate 100 is cut using a laser cutting process to form multiple light conversion modules 300.

[0049] In a specific embodiment, the plurality of light conversion modules 300 are used to convert the light emitted by the Mini-LED chip into one of red, green or blue, that is, the light conversion module 300 is a monochromatic light conversion structure.

[0050] In other embodiments, the glass substrate can be divided into a first region, a second region, and a third region. The first light conversion block and the second light conversion block in the first region are both first color conversion blocks, the first light conversion block and the second light conversion block in the second region are both second color conversion blocks, and the first light conversion block and the second light conversion block in the third region are both third color conversion blocks. During the process of cutting the glass substrate to form multiple light conversion modules, multiple first color light conversion modules, multiple second color light conversion modules, and multiple third color light conversion modules are formed respectively. The first color, the second color, and the third color are all different. Optionally, the first color is red, the second color is green, and the third color is blue. This allows the fabrication of first color light conversion modules, second color light conversion modules, and third color light conversion modules that convert the light emitted by the Mini-LED chip into red, green, and blue respectively on the same glass substrate.

[0051] like Figure 5 As shown, the present invention also proposes a light conversion module, which is prepared by the above-described method for preparing a light conversion module for a Mini-LED display device.

[0052] The present invention also proposes a method for manufacturing a Mini-LED display device, comprising the following steps: like Figure 6 As shown, a driving substrate 400 is provided, and multiple Mini-LED chips 500 are transferred to the driving substrate 400.

[0053] In a specific embodiment, during the process of transferring multiple Mini-LED chips 500 to the driving substrate 400, each Mini-LED chip 500 is electrically connected to the driving substrate 400.

[0054] like Figure 7 As shown, an encapsulation layer 600 is formed on the driving substrate 400, and the encapsulation layer 600 is patterned to form a plurality of grooves 601.

[0055] In a specific embodiment, silicone or epoxy resin is formed by spin coating, spraying, slot coating, printing or transfer molding, and then cured to form the encapsulation layer 600. The encapsulation layer 600 is then patterned using a dry etching process or a wet etching process to form a plurality of grooves 601.

[0056] like Figure 8 As shown, a plurality of the above-mentioned light conversion modules 300 are provided, and each of the light conversion modules 300 is disposed in a corresponding groove 601.

[0057] In a specific embodiment, after each of the light conversion modules 300 is disposed in a corresponding groove 601, a protective layer 700 is formed on the encapsulation layer 600. The protective layer 700 can be an inorganic or organic material, and is formed by PVD, CVD, coating or printing processes.

[0058] In a specific embodiment, all of the above-mentioned light conversion modules 300 are monochromatic light conversion structures.

[0059] In other embodiments, a first color light conversion module, a second color light conversion module, and a third color light conversion module may be respectively provided in three adjacent grooves 601, wherein the first color light conversion module, the second color light conversion module, and the third color light conversion module convert the light emitted by the Mini-LED chip into red, green, and blue, respectively.

[0060] like Figure 8 As shown, the present invention also proposes a Mini-LED display device, which is prepared by the above-described method for preparing a Mini-LED display device.

[0061] In other preferred technical solutions, the present invention provides a method for fabricating a light conversion module for a Mini-LED display device, comprising the following steps: A glass substrate is provided, the glass substrate including a first surface and a second surface disposed opposite to each other.

[0062] A plurality of first blind holes and a plurality of second blind holes are formed alternately on the first surface of the glass substrate, wherein the diameter of each first blind hole is larger than the diameter of each second blind hole.

[0063] A first light conversion block is formed in each of the first blind holes, and a first light scattering block is formed in each of the second blind holes.

[0064] Next, a plurality of third blind holes and a plurality of fourth blind holes are formed alternately on the second surface of the glass substrate. The third blind holes expose the first light conversion block, and the fourth blind holes expose the first light scattering block. The aperture of each third blind hole is smaller than the aperture of each fourth blind hole, the aperture of the third blind hole is smaller than the aperture of the first blind hole, and the aperture of the second blind hole is smaller than the aperture of the fourth blind hole.

[0065] A second light conversion block is formed in each of the third blind holes, and a second light scattering block is formed in each of the fourth blind holes, wherein the density of light conversion particles in the first light conversion block is greater than the density of light conversion particles in the second light conversion block, and the density of light scattering particles in the second light scattering block is greater than the density of light scattering particles in the first light scattering block.

[0066] The glass substrate is cut to form multiple light conversion modules, each of which includes multiple first light conversion blocks, multiple first light scattering blocks, multiple second light conversion blocks, and multiple second light scattering blocks.

[0067] In a better technical solution, the glass substrate is modified before forming a plurality of alternating first blind holes and a plurality of second blind holes.

[0068] In a more preferred technical solution, the first light conversion block and the second light conversion block include a resin matrix and light conversion particles distributed in the resin matrix, and the first light conversion block and the second light conversion block are formed by slit coating, scraping, printing, spraying or spin coating processes.

[0069] In a more preferred technical solution, the ratio of the density of light conversion particles in the first light conversion block to the density of light conversion particles in the second light conversion block is 1.5-4.

[0070] In a more preferred technical solution, the first light scattering block and the second light scattering block include a resin matrix and light scattering particles distributed in the resin matrix. The first light scattering block and the second light scattering block are formed by slit coating, scraping, printing, spraying or spin coating processes.

[0071] In a more preferred technical solution, the ratio of the density of light scattering particles in the second light scattering block to the density of light scattering particles in the first light scattering block is 1.5-4.

[0072] In a more preferred technical solution, the glass substrate is divided into a first region, a second region, and a third region. The first light conversion block and the second light conversion block in the first region are both first color conversion blocks, the first light conversion block and the second light conversion block in the second region are both second color conversion blocks, and the first light conversion block and the second light conversion block in the third region are both third color conversion blocks. In the process of cutting the glass substrate to form multiple light conversion modules, multiple first color light conversion modules, multiple second color light conversion modules, and multiple third color light conversion modules are formed respectively, wherein the first color, the second color, and the third color are all different.

[0073] In other preferred technical solutions, the present invention also proposes a light conversion module, which is prepared by the above-described method for preparing a light conversion module for a Mini-LED display device.

[0074] In other preferred technical solutions, the present invention also proposes a method for manufacturing a Mini-LED display device, comprising the following steps: A driving substrate is provided to transfer multiple Mini-LED chips to the driving substrate.

[0075] An encapsulation layer is formed on the driving substrate, and the encapsulation layer is patterned to form multiple grooves.

[0076] A plurality of the above-mentioned optical conversion modules are provided, and each of the optical conversion modules is disposed in a corresponding groove.

[0077] In other preferred technical solutions, the present invention also proposes a Mini-LED display device, which is prepared by the above-described method for preparing a Mini-LED display device.

[0078] In the method for fabricating a light conversion module for a Mini-LED display device according to the present invention, a plurality of alternating first blind holes and a plurality of second blind holes are formed on the first surface of a glass substrate, a first light conversion block is formed in each first blind hole, a first light scattering block is formed in each second blind hole, and a plurality of alternating third blind holes and a plurality of fourth blind holes are formed on the second surface of the glass substrate. The third blind holes expose the first light conversion blocks, the fourth blind holes expose the first light scattering blocks, a second light conversion block is formed in each third blind hole, and a second light scattering block is formed in each fourth blind hole. The density of light conversion particles in the first light conversion blocks is greater than the density of light conversion particles in the second light conversion blocks, and the density of light scattering particles in the second light scattering blocks is greater than the density of light scattering particles in the first light scattering blocks. By optimizing the structure of each light conversion block and each scattering block, as well as the density relationship between light conversion particles and light scattering particles, the light conversion efficiency and light emission uniformity are greatly improved.

[0079] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in the present invention should still be covered by the claims of the present invention.

Claims

1. A method for fabricating a light conversion module for a Mini-LED display device, characterized in that: Includes the following steps: A glass substrate is provided, the glass substrate including a first surface and a second surface disposed opposite to each other; A plurality of first blind holes and a plurality of second blind holes are formed alternately on the first surface of the glass substrate, wherein the diameter of each first blind hole is larger than the diameter of each second blind hole; A first light conversion block is formed in each of the first blind holes, and a first light scattering block is formed in each of the second blind holes; Next, a plurality of third blind holes and a plurality of fourth blind holes are formed alternately on the second surface of the glass substrate. The third blind holes expose the first light conversion block, and the fourth blind holes expose the first light scattering block. The aperture of each third blind hole is smaller than the aperture of each fourth blind hole, the aperture of the third blind hole is smaller than the aperture of the first blind hole, and the aperture of the second blind hole is smaller than the aperture of the fourth blind hole. A second light conversion block is formed in each of the third blind holes, and a second light scattering block is formed in each of the fourth blind holes, wherein the density of light conversion particles in the first light conversion block is greater than the density of light conversion particles in the second light conversion block, and the density of light scattering particles in the second light scattering block is greater than the density of light scattering particles in the first light scattering block. The glass substrate is cut to form multiple light conversion modules, each of which includes multiple first light conversion blocks, multiple first light scattering blocks, multiple second light conversion blocks, and multiple second light scattering blocks.

2. The method for fabricating a light conversion module for a Mini-LED display device according to claim 1, characterized in that: Before forming a plurality of alternating first blind holes and a plurality of second blind holes, the glass substrate is modified.

3. The method for fabricating a light conversion module for a Mini-LED display device according to claim 1, characterized in that: The first light conversion block and the second light conversion block include a resin matrix and light conversion particles distributed in the resin matrix. The first light conversion block and the second light conversion block are formed by slit coating, scraping, printing, spraying or spin coating processes.

4. The method for fabricating a light conversion module for a Mini-LED display device according to claim 3, characterized in that: The ratio of the density of light conversion particles in the first light conversion block to the density of light conversion particles in the second light conversion block is 1.5-4.

5. The method for fabricating a light conversion module for a Mini-LED display device according to claim 1, characterized in that: The first light scattering block and the second light scattering block include a resin matrix and light scattering particles distributed in the resin matrix. The first light scattering block and the second light scattering block are formed by slit coating, scraping, printing, spraying or spin coating processes.

6. The method for fabricating a light conversion module for a Mini-LED display device according to claim 5, characterized in that: The ratio of the density of light scattering particles in the second light scattering block to the density of light scattering particles in the first light scattering block is 1.5-4.

7. The method for fabricating a light conversion module for a Mini-LED display device according to any one of claims 1-6, characterized in that: The glass substrate is divided into a first region, a second region, and a third region. The first light conversion block and the second light conversion block in the first region are both first color conversion blocks, the first light conversion block and the second light conversion block in the second region are both second color conversion blocks, and the first light conversion block and the second light conversion block in the third region are both third color conversion blocks. In the process of cutting the glass substrate to form multiple light conversion modules, multiple first color light conversion modules, multiple second color light conversion modules, and multiple third color light conversion modules are formed respectively, wherein the first color, the second color, and the third color are all different.

8. An optical conversion module, characterized in that: The light conversion module is prepared using the method for preparing a light conversion module for a Mini-LED display device as described in any one of claims 1-7.

9. A method for manufacturing a Mini-LED display device, characterized in that: Includes the following steps: A driving substrate is provided, and multiple Mini-LED chips are transferred to the driving substrate. An encapsulation layer is formed on the driving substrate, and the encapsulation layer is patterned to form multiple grooves; A plurality of optical conversion modules as described in claim 8 are provided, with each optical conversion module disposed in a corresponding recess.

10. A Mini-LED display device, characterized in that: The Mini-LED display device is prepared using the method for preparing a Mini-LED display device as described in claim 9.

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