Crucible, evaporation source device, and vapor deposition apparatus

Abstract

The application provides a kind of crucible, evaporation source device and evaporation equipment, belongs to the technical field of evaporation coating film.Crucible includes container body, shielding structure, first cover and second cover;Container body has accommodating cavity, and container body includes first accommodating part, second accommodating part and third accommodating part arranged in turn from bottom to top, exhaust hole is opened in the side of second accommodating part;Shielding structure is protruding in the inner wall surface of second accommodating part, and is shielded below exhaust hole;First cover is covered in the top of third accommodating part, and buffer chamber is formed with the first cover, and first spout is opened;Second cover is covered above first cover, and second spout is opened, the projection of first spout and second spout on horizontal plane is staggered or partially overlapping arrangement.By extending the vapor discharge path to reduce the splashing phenomenon of evaporation material, and not prone to the problem of internal pressure being too high, ensure the uniformity of evaporation process, improve the evaporation quality.

Description

Technical Field

[0001] This application belongs to the technical field of vapor deposition coating, and more specifically, relates to a crucible, an evaporation source device, and vapor deposition equipment. Background Technology

[0002] Evaporation equipment is used to heat and evaporate materials in a vacuum environment, depositing them onto the surface of a substrate to form a thin film. In evaporation equipment, a crucible is used to hold the evaporation material. The crucible has an opening at the top. During operation, a heater heats the crucible, causing the evaporation material inside to evaporate and exit through the opening at the top.

[0003] However, during the high-temperature heating process of the crucible, the incompletely vaporized vaporized material may fly out of the crucible in the form of liquid or solid particles due to boiling and other factors, and directly adhere to the surface of the substrate, resulting in uneven film formation or film defects on the substrate surface, which affects the quality of the final product. Summary of the Invention

[0004] The purpose of this application is to provide a crucible, an evaporation source device, and a vapor deposition equipment to solve the problem of uneven film formation or film defects caused by splashing of vapor deposition materials in the prior art.

[0005] To achieve the above objectives, in a first aspect, this application provides a crucible comprising:

[0006] The container body has a receiving cavity with a top opening. The container body includes a first receiving part, a second receiving part, and a third receiving part arranged sequentially from bottom to top. The inner side of the first receiving part is used to store evaporation material, and the periphery of the second receiving part is provided with an exhaust hole.

[0007] A shielding structure protrudes from the inner wall of the second receiving portion and shields the area below the exhaust port;

[0008] A first cover is provided on the top of the third receiving part and has a first nozzle communicating with the receiving cavity;

[0009] The second cover is placed above the first cover and together with the first cover forms a buffer chamber. The first cover has a second nozzle that connects the buffer chamber to the external space. The projections of the first nozzle and the second nozzle on the horizontal plane are staggered or partially overlapped.

[0010] In some embodiments of the first aspect, the number of exhaust holes is multiple, and the multiple exhaust holes are arranged along the circumferential direction of the second receiving portion; the shielding structure is an annular boss and is disposed around the lower side of the multiple exhaust holes.

[0011] In some embodiments of the first aspect, the number of exhaust holes is multiple, the multiple exhaust holes are arranged along a spiral path, and the shielding structure is a spiral protrusion that matches the spiral path, the extension path of the spiral protrusion corresponding to the area below the exhaust hole.

[0012] In some embodiments of the first aspect, the inner wall surface of the second receiving portion is an upwardly expanding conical surface; the peripheral wall surface of the shielding structure is also configured as a conical surface and abuts against the inner wall surface of the second receiving portion.

[0013] In some embodiments of the first aspect, the first cover includes:

[0014] A first guide section is disposed inside the third receiving section. The first guide section has an upwardly expanding conical structure, and the first nozzle is opened in the first guide section.

[0015] The first connecting part is connected in a ring shape to the top end of the first guide part, and the first connecting part overlaps the top opening edge of the third receiving part.

[0016] In some embodiments of the first aspect, the second cover includes:

[0017] The second guide section is located above the first guide section. The second guide section has a downwardly expanding conical structure, and the second nozzle is opened in the second guide section.

[0018] The second connecting part is connected in a ring shape to the bottom end of the second guide part and abuts against the upper surface of the first connecting part;

[0019] An annular flange protrudes from the bottom surface of the second connecting part and is fitted around the first connecting part and the container body.

[0020] In some embodiments of the first aspect, the number of the first nozzles is multiple, and the multiple first nozzles are arranged at intervals along the circumferential direction of the second nozzle.

[0021] In some embodiments of the first aspect, the inner bottom surface of the container body is provided with a flow guide boss protruding upwards, and the peripheral side surface of the flow guide boss is a cone surface that gradually expands from top to bottom.

[0022] Secondly, this application provides an evaporation source device, including at least one crucible as described in the first aspect and any embodiment thereof, and a heating assembly for heating the crucible.

[0023] Thirdly, this application provides a vapor deposition apparatus, including an apparatus body and an evaporation source device as described in the second aspect, wherein the apparatus body has a vapor deposition chamber and the evaporation source device is disposed in the vapor deposition chamber.

[0024] The beneficial effects of the crucible, evaporation source device, and vapor deposition equipment provided in this application are as follows: Compared with the prior art, after the evaporation material is heated and vaporized, it is discharged upwards sequentially through the first nozzle and the second nozzle. Because the first nozzle and the second nozzle are staggered, the steam discharge path is extended, reducing the possibility of material splashing. Furthermore, vent holes are provided around the container body to allow a small amount of steam to escape, avoiding excessive internal pressure in the containment cavity due to the extended steam discharge path. Simultaneously, the shielding structure located below the vent holes can also shield splashed vapor deposition material, preventing it from being directly discharged through the vent holes. This ensures the uniformity of the vapor deposition process and improves the vapor deposition quality. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 This is a schematic diagram of the vapor deposition equipment in the embodiments of this application;

[0027] Figure 2 This is a schematic diagram of the evaporation source device in the embodiments of this application;

[0028] Figure 3 This is a cross-sectional view of the crucible in the first embodiment of this application;

[0029] Figure 4 This is an exploded view of the crucible in the first embodiment of this application;

[0030] Figure 5 This is a cross-sectional view of the crucible in the second embodiment of this application;

[0031] Figure 6 This is an exploded view of the crucible in the second embodiment of this application;

[0032] Figure 7 This is a schematic diagram of the structure of the first cover in the embodiments of this application;

[0033] Figure 8 This is a schematic diagram of the structure of the second cover in an embodiment of this application;

[0034] Figure 9 for Figure 3 Enlarged view of section A.

[0035] The following are the labeling elements in the figure:

[0036] 10-Equipment body; 101-Evaporation chamber; 20-Evaporation source device; 30-Vacuum pump; 40-Substrate; 100-Crucible; 110-Container body; 110a-First receiving part; 110b-Second receiving part; 110c-Third receiving part; 1101-Receiving cavity; 1102-Exhaust port; 120-First cover; 121-First flow guide; 122-First connecting part; 1201-First nozzle; 130-Second cover; 131-Second flow guide; 132-Second connecting part; 133-Annular flange; 1301-Second nozzle; 140-Shielding structure; 150-Flow guide boss; 200-Heater. Detailed Implementation

[0037] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0038] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0039] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0040] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0041] Reference Figure 1This application provides a vapor deposition apparatus, which includes an apparatus body 10, an evaporation source device 20, and a vacuum pump 30. The apparatus body 10 has a vapor deposition chamber 101, the evaporation source device 20 is disposed in the vapor deposition chamber 101, and the vacuum pump 30 is mounted on the apparatus body 10. When the vapor deposition apparatus is running, the vacuum pump 30 creates a vacuum environment in the vapor deposition chamber 101. The evaporation source device 20 holds vapor deposition material and heats the vapor deposition material, causing it to evaporate or sublimate and adhere to the surface of a substrate 40 in the vapor deposition chamber 101, forming a thin film on the substrate 40.

[0042] Reference Figure 2 The evaporation source device 20 includes a crucible 100 and a heater 200 for heating the crucible 100. The crucible 100 is used to hold the vapor deposition material to be heated, and the heater 200 is used to heat the crucible 100, causing the vapor deposition material inside the crucible 100 to evaporate or sublimate. The heater 200 can be resistance heating, induction heating, or radiation heating, and the number, shape, and arrangement of the heaters 200 can be adaptively adjusted according to the shape of the crucible 100. For example, the heater 200 is cylindrical and arranged around the periphery of the crucible 100. When the heater 200 is operating, it heats the periphery of the crucible 100, ensuring that the vapor deposition material inside the crucible 100 is heated uniformly.

[0043] In addition, the heater 200 may also include a cooler (not shown in the figure), which is disposed on the outer periphery of the heater 200 to cool the heater 200 and the crucible 100, preventing the heater 200 from overheating after prolonged operation and affecting the stable operation of the vapor deposition equipment. The cooler can be air-cooled or water-cooled, using a circulating cooling medium to remove the heat generated by the heater 200 and maintain the operating temperature of the heater 200 within a suitable range.

[0044] Reference Figure 3 and Figure 4 The crucible 100 provided in this embodiment includes a container body 110, a first cover 120, and a second cover 130. The container body 110 has a receiving cavity 1101 with a top opening for receiving vapor-deposited material. The first cover 120 is connected to the top of the container body 110 and covers the opening of the receiving cavity 1101, and a first nozzle 1201 communicating with the receiving cavity 1101 is provided on the first cover 120. The second cover 130 is provided on the top of the first cover 120, forming a buffer chamber between the second cover 130 and the first cover 120, and a second nozzle 1301 communicating with the buffer chamber is provided on the second cover 130. The projections of the first nozzle 1201 and the second nozzle 1301 on the horizontal plane are staggered or partially overlapped.

[0045] Specifically, the container body 110 is a shell structure of any shape. The container body 110 can be cylindrical, cuboid, or other shapes. The container body 110 is hollow inside and open at the top to form a receiving cavity 1101 for accommodating the vapor deposition material. The container body 110 can be made of metallic materials (such as molybdenum alloy, tungsten alloy, or platinum-rhodium alloy) or ceramic materials (such as alumina, silicon nitride, or silicon carbide) to have good high-temperature resistance and high strength, meeting the requirements of vapor deposition equipment for crucibles.

[0046] The first cover 120 is a component that covers the top of the container body 110 and is used to cover the opening of the receiving cavity 1101. The second cover 130 is a component that covers the top of the first cover 120, and the portion between the second cover 130 and the first cover 120 is spaced apart to form a buffer chamber. The materials of the first cover 120 and the second cover 130 can be the same as the material of the container body 110. Both the first cover 120 and the second cover 130 are detachably connected to the container body 110, facilitating quick disassembly and installation when changing the vapor deposition material or performing equipment maintenance, thereby improving operational efficiency.

[0047] Both the first nozzle 1201 and the second nozzle 1301 are through-hole structures, and their projections on the horizontal plane are staggered or partially overlapping. For example, the first nozzle 1201 is located at the edge of the first cover 120, and the second nozzle 1301 is located at the center of the second cover 130; or, the first nozzle 1201 is located at the center of the first cover 120, and the second nozzle 1301 is located at the edge of the second cover 130, so that the first nozzle 1201 and the second nozzle 1301 do not completely coincide in the horizontal direction.

[0048] The first nozzle 1201 connects the receiving cavity 1101 and the buffer chamber, and the second nozzle 1301 connects the buffer chamber and the external space. During the heating of the crucible 100 by the heater 200, the vapor-deposited material evaporates or sublimates. The resulting vapor, guided by the first cover 120, passes through the first nozzle 1201 and enters the buffer chamber formed between the first cover 120 and the second cover 130. Because the first nozzle 1201 and the second nozzle 1301 are staggered, the vapor changes its flow path within the buffer chamber before exiting from the first nozzle 1201.

[0049] By setting up staggered first nozzles 1201 and second nozzles 1301, the flow path of steam during the discharge process is increased. This can block incompletely vaporized vaporized material from splashing outwards, reducing the possibility of incompletely vaporized material splashing onto the substrate surface. At the same time, the extended flow path of steam in the buffer chamber helps to achieve uniform steam distribution, allowing steam to be discharged more evenly and improving the uniformity and quality of the vapor-deposited film.

[0050] Understandably, during the operation of the evaporation source device 20, the heater 200 continuously heats the crucible 100, causing the vapor deposition material inside the crucible 100 to generate a large amount of steam under high temperature. The steam can be discharged upwards through the first nozzle 1201 and the second nozzle 1301 in sequence. The staggered arrangement of the first nozzle 1201 and the second nozzle 1301 prolongs the steam discharge path, making it less likely for the vapor deposition material in the receiving cavity 1101 to splash. However, prolonging the steam discharge path also slows down the steam discharge rate, and the internal pressure of the receiving cavity 1101 will gradually increase after prolonged heating. The high-pressure environment will cause the incompletely vaporized liquid or solid vapor deposition material to splash secondary. When the pressure rises to a certain level, it will also force the first cover 120 and the second cover 130 to separate from the container body 110.

[0051] In this embodiment, a vent 1102 is also provided on the periphery of the container body 110. The vent 1102 extends radially along the container body 110 and connects the receiving cavity 1101 with the external space. The vent 1102 allows a small portion of the vapor in the receiving cavity 1101 to be discharged, thereby balancing the pressure inside the receiving cavity 1101 and preventing excessive pressure inside the receiving cavity 1101.

[0052] Specifically, the container body 110 may include a first receiving portion 110a, a second receiving portion 110b, and a third receiving portion 110c arranged sequentially from bottom to top. The inner side of the first receiving portion 110a is used to store evaporation material, the vent 1102 is opened on the periphery of the second receiving portion 110b, and the third receiving portion 110c is used to install the first cover 120 and the second cover 130.

[0053] The first receiving portion 110a, the second receiving portion 110b, and the third receiving portion 110c can all have the same shape and size, or they can be set differently according to actual needs. Furthermore, the first receiving portion 110a, the second receiving portion 110b, and the third receiving portion 110c can be integrally formed, or they can be separately set and assembled by welding, threaded connection, or snap-fit ​​connection. The bottom and periphery of the first receiving portion 110a are closed to accommodate the vapor-deposited material. The second receiving portion 110b is located above the first receiving portion 110a, and its periphery is used to form vent holes 1102, which allow vapor to be discharged and depressurized when the internal pressure of the receiving cavity 1101 is too high. The third receiving portion 110c is disposed on the upper side of the second receiving portion 110b and has an opening on the top side, providing an installation position for the first cover 120 and the second cover 130, and ensuring that the first cover 120 and the second cover 130 do not interfere with the position of the exhaust hole 1102 on the periphery of the second receiving portion 110b.

[0054] Furthermore, the crucible 100 also includes a shielding structure 140, which protrudes from the inner wall of the second receiving portion 110b and shields the area below the vent hole 1102. Specifically, the shielding structure 140 extends from the inner wall of the second receiving portion 110b toward the inner side of the receiving cavity 1101 and shields the area below the vent hole 1102. During the vapor deposition process, even if some vapor deposition material splashes upward due to boiling or other factors, the shielding structure 140 can block the linear movement path of liquid or solid splash particles, making it difficult for the vapor deposition material to be directly discharged through the vent hole 1102.

[0055] The shape, size, and extension length of the shielding structure 140 can be adjusted according to actual needs to ensure that the shielding structure 140 can effectively shield the area below the exhaust port 1102, avoiding excessive obstruction to the flow of steam toward the first nozzle 1201. For example, the shielding structure 140 can be configured as annular, arc-shaped, or other shapes to minimize obstruction to steam flow while shielding the exhaust port 1102. The material of the shielding structure 140 can be the same as that of the container body 110, or it can be other high-temperature resistant and corrosion-resistant materials to ensure the stability and durability of the shielding structure 140 during the vapor deposition process.

[0056] In some embodiments, the second receiving portion 110b may have a plurality of vent holes 1102, which are arranged along a certain path around the periphery of the second receiving portion 110b. The plurality of vent holes 1102 allow for more uniform discharge of steam from the receiving cavity 1101, slowing down the steam discharge rate from the vent holes 1102 and preventing excessive local pressure or poor steam discharge. The number, shape, size, and distribution of the plurality of vent holes 1102 can be configured according to actual needs to achieve optimal steam discharge performance.

[0057] When the second receiving portion 110b is provided with multiple exhaust holes 1102, a blocking structure 140 corresponding to the number of exhaust holes can be protruded on the inner wall. This design ensures that there is a corresponding blocking structure 140 below each exhaust hole 1102, thereby effectively controlling and guiding the direction of the exhaust flow. In addition, the blocking structure 140 can be designed to extend around the arrangement direction of the exhaust holes 1102, so that the blocking structure 140 is not limited to blocking a single exhaust hole, but can also cover and block multiple exhaust holes 1102 located on the same arrangement path. This allows for more flexible response to the exhaust needs of different areas, while reducing mutual interference between exhaust flows and improving overall exhaust efficiency and performance.

[0058] Reference Figure 3In one embodiment, a plurality of vent holes 1102 are arranged along the circumferential direction of the second receiving portion 110b; the shielding structure 140 is an annular boss and is disposed around the lower side of the plurality of vent holes 1102.

[0059] Specifically, multiple vent holes 1102 arranged in a circumferential direction are evenly distributed around the periphery of the second receiving portion 110b. This layout helps the vapor to be discharged more evenly from the receiving cavity 1101, preventing local vapor accumulation that could lead to excessive pressure. The shielding structure 140, shaped like an annular boss, is continuously distributed circumferentially along the inner wall of the crucible 100, surrounding the lower side of the multiple vent holes 1102. This not only effectively prevents the vapor-deposited material from being discharged directly through the vent holes 1102, but also reduces the impact of vapor discharge on the shielding structure 140, improving the stability and durability of the structure.

[0060] In practical applications, multiple exhaust holes 1102 arranged along a circular path can be opened at multiple height positions of the second receiving part 110b. Similarly, multiple shielding structures 140 in the form of annular protrusions can be provided on the inner side of the second receiving part 110b and placed below the exhaust holes 1102 at the corresponding positions to shield the exhaust holes 1102 at different heights.

[0061] The shielding structure 140 of the annular boss can be tilted downwards. Specifically, the cross-sectional shape of the shielding structure 140 in the vertical plane gradually decreases from the edge of the container body 110 towards the center, forming a downwardly tilted shielding effect. This allows the vapor-deposited material splashed onto the annular boss to slide down along the inclined surface of the annular boss and fall back into the receiving cavity 1101, achieving a return flow effect of the vapor-deposited material and preventing the vapor-deposited material from accumulating on the annular boss.

[0062] Reference Figure 5 and Figure 6 In some embodiments, a plurality of exhaust holes 1102 may also be arranged along a spiral path on the periphery of the second receiving portion 110b, and the shielding structure 140 is a spiral protrusion that matches the spiral path, with the extension path of the spiral protrusion corresponding to the area below the exhaust holes 1102.

[0063] Specifically, the spiral protrusions extend spirally along the arrangement direction of the vent holes 1102, forming a continuous shielding path. Under the action of the spiral protrusions, when the vapor-deposited material boils and splashes in the receiving cavity 1101, the splashed vapor-deposited material will first impact the spiral protrusions and be guided by the spiral protrusions to slide back into the receiving cavity 1101 along its surface. In this way, the spiral protrusions can not only effectively prevent the vapor-deposited material from being directly discharged through the vent holes 1102, but also guide the splashed vapor-deposited material back to the evaporation area, improving the utilization rate of the vapor-deposited material and the vapor deposition efficiency.

[0064] Furthermore, the spiral protrusions enhance vapor turbulence within the cavity 1101, resulting in more uniform vapor distribution during discharge and further improving the uniformity of the vapor deposition and the quality of the film. Additionally, the spiral protrusions can be angled downwards in their vertical cross-section to better guide and shield splashed vapor deposition material during the deposition process.

[0065] The aforementioned shielding structure 140 can be integrally formed with the inner side of the second receiving portion 110b. Alternatively, it can be designed separately and detachably connected to the inner side of the second receiving portion 110b to facilitate maintenance of the entire crucible 100. In this embodiment, the inner wall surface of the second receiving portion 110b is an upwardly expanding conical surface; the peripheral wall surface of the shielding structure 140 is also set as a conical surface and abuts against the inner wall surface of the container body 110.

[0066] When the shielding structure 140 is an annular protrusion, the peripheral wall of the shielding structure 140 is tapered within the second receiving portion 110b to avoid a uniform tapering, and its shape is adapted to the inner diameter below the vent hole 1102, so that the shielding structure 140 can directly overlap with the corresponding height position of the second receiving portion 110b using the tapered surface fit. Furthermore, the peripheral side of the shielding structure 140 may be provided with an annular protrusion to increase the area of ​​the peripheral wall of the shielding structure 140, thereby improving the contact tightness and stability between the shielding structure 140 and the inner wall of the container body 110. When multiple annular boss-shaped shielding structures 140 are provided, the outer diameter of the multiple shielding structures 140 can gradually increase from bottom to top to adapt to the different inner wall surfaces of the second receiving part 110b. During installation, shielding structures 140 with different outer diameters are installed sequentially to the inside of the second receiving part 110b so that the shielding structures 140 shield the exhaust holes 1102 at the corresponding height.

[0067] When the shielding structure 140 is a spiral protrusion, the spiral protrusion can extend along a tapered spiral path. The taper of the tapered spiral path matches the taper of the inner wall surface of the second receiving portion 110b. This causes the outer peripheral side of the spiral protrusion to also have a tapered shape, allowing it to fit tightly against the inner wall surface of the second receiving portion 110b, thereby achieving the installation and fixation of the spiral protrusion. This structural design ensures that the shielding structure 140 is securely positioned in the second receiving portion 110b, preventing displacement or detachment during use. Furthermore, this tapered spiral path helps to disperse the stress that may be generated during installation, thereby improving the stability and durability of the overall structure.

[0068] In practical applications, the second receiving part 110b can be configured as an upwardly expanding frustum-shaped structure, the first receiving part 110c is cylindrical and its outer diameter matches the bottom inner diameter of the second receiving part 110b, and the third receiving part 1103c is cylindrical and its inner diameter matches the top outer diameter of the second receiving part 110b, so that the entire container body 110 has a stepped structure.

[0069] In other embodiments, the shielding structure 140 can also be configured as a mesh structure (not shown in the figure). The mesh structure can be composed of multiple intersecting ribs, with open areas formed between the ribs. The mesh shielding structure 140 can not only shield the splashed vapor deposition material, but also allow some vapor to escape through the open areas, thus achieving the effect of preventing splashing of vapor deposition material while ensuring smooth vapor escape. The number, shape, size, and distribution of the ribs in the mesh structure can be set according to actual needs to achieve the best shielding and vapor escape effect. The ribs can be configured as any shape, such as straight, curved, or zigzag, to adapt to different vapor deposition requirements and the structure of the container body 110. At the same time, the mesh shielding structure 140 and the container body 110 can be integrally formed, or they can be fixedly connected to the container body 110 by welding, bonding, or other methods to ensure the stability and reliability of the shielding structure 140. Thanks to the mesh structure, even if the vapor-deposited material splashes violently within the cavity 1101, it can be effectively blocked by the ribs of the mesh structure, thus preventing the vapor-deposited material from being discharged directly through the vent 1102.

[0070] Reference Figure 7 In this embodiment, the first cover 120 includes a first guide portion 121 and a first connecting portion 122. The first guide portion 121 has an upwardly expanding conical structure, and the first nozzle 1201 is opened in the first guide portion 121. The first connecting portion 122 is connected to the top of the first guide portion 121 in a ring shape.

[0071] The maximum outer diameter of the first flow guide 121 should not be greater than the inner diameter of the third receiving portion 110c in the container body 110. The first connecting portion 122 is arranged around the top outer side of the first flow guide 121. The outer diameter of the first connecting portion 122 is the same as the outer diameter of the third receiving portion 110c, so that it can overlap at the top opening edge of the third receiving portion 110c and stably support the first flow guide 121 inside the third receiving portion 110c.

[0072] The first nozzle 1201 can be formed on the conical portion of the first guide section 121. The conical structure of the first guide section 121 can guide the steam to be discharged evenly and smoothly from the first nozzle 1201, avoiding the accumulation of steam or the generation of eddies at the bottom of the first cover 120. In addition, the conical surface can also allow the vapor-deposited material splashed onto the surface to slide off its surface, reducing the deposition of vapor-deposited material on the first cover 120.

[0073] Furthermore, the design of the first connecting part 122 also fully considers sealing and stability. Its outer diameter matches the outer diameter of the third receiving part 110c, ensuring a tight connection between the first cover 120 and the container body 110, effectively preventing vapor leakage. At the same time, it also ensures the stable support of the first guide part 121 inside the third receiving part 110c, improving the operational reliability and safety of the entire vapor deposition equipment.

[0074] The shape of the first nozzle 1201 can be circular, elliptical, or other shapes suitable for steam discharge, and the number of first nozzles 1201 can also be arbitrary. In this embodiment, the number of first nozzles 1201 is multiple, arranged at intervals around the periphery of the first guide portion 121, to further improve the steam discharge efficiency and the uniformity of vapor deposition. The multiple first nozzles 1201 can be evenly distributed, allowing steam to enter the buffer chamber evenly from all directions, avoiding situations where the local steam concentration is too high or too low, thereby improving the uniformity of vapor deposition and the quality of the film layer. At the same time, the arrangement of multiple first nozzles 1201 can also increase the steam discharge channels, accelerate the steam discharge speed, and further avoid the problem of excessive internal pressure in the receiving cavity 1101.

[0075] Reference Figure 8 In this embodiment, the second cover 130 includes a second flow guide 131, a second connecting portion 132, and an annular flange 133. The second flow guide 131 has a downwardly expanding conical structure, and the second nozzle 1301 is opened in the second flow guide 131. The second connecting portion 132 is annularly connected to the bottom end of the second flow guide 131.

[0076] The maximum outer diameter of the second guide portion 131 should be smaller than the inner diameter of the first connecting portion 122 on the first cover 120. The second connecting portion 132 is arranged around the bottom outer side of the second guide portion 131, and the outer diameter of the second connecting portion 132 is the same as that of the first connecting portion 122, so that the second connecting portion 132 can be flush with the upper surface of the first connecting portion 122. An annular flange 133 protrudes from the bottom surface of the second connecting portion 132, and the inner diameter of the annular flange 133 can match the outer diameter of the first connecting portion 122 and the outer diameter of the third receiving portion 110c, so that both the first connecting portion 122 and the third receiving portion 110c can be placed inside the annular flange 133.

[0077] Reference Figure 9When the second cover 130 is placed on top of the first cover 120, the second connecting portion 132 abuts against the top surface of the first connecting portion 122. Simultaneously, the annular flange 133 surrounds the top of the third receiving portion 110c and the periphery of the first connecting portion 122 of the first cover 120, limiting the position of the first cover 120 and stably placing it at the opening of the receiving cavity 1101. This prevents the first cover 120 and the second cover 130 from loosening or falling off due to high temperature or steam pressure during the vapor deposition process. Furthermore, the first cover 120 and the second cover 130 can be fixed together by threaded connection, snap-fit ​​connection, or welding.

[0078] A buffer chamber is formed by a partially spaced second guide section 131 with a downwardly expanding conical structure and a first guide section 121 with an upwardly expanding conical structure, allowing vapor to be buffered and diffused within it. A second nozzle 1301 can be vertically positioned at the center of the second guide section 131, facing the substrate 40 within the vapor deposition chamber 101, allowing vapor to directly impact the surface of the substrate 40 and improving vapor deposition efficiency. The shape of the second nozzle 1301 can be circular, elliptical, or other shapes designed according to actual needs to optimize vapor diffusion and vapor deposition uniformity. Furthermore, the size and number of the second nozzles 1301 can be adjusted according to vapor deposition requirements and equipment specifications to achieve the best vapor deposition effect.

[0079] When multiple first nozzles 1201 are provided, their projections on the horizontal plane surround the periphery of the second nozzle 1301, so that the first nozzles 1201 and the second nozzles 1301 are arranged in an alternating manner, thereby extending the vapor discharge path and blocking splashed material. Alternatively, multiple second nozzles 1301 can be provided and arranged around the circumference of the second cover 130, with the diameter of the second nozzles 130 being larger or smaller than the diameter of the first nozzles 1201, so that the first nozzles 1201 and the second nozzles 1301 are arranged in an alternating manner. Through this design, the vapor can change direction multiple times during discharge, effectively reducing the contamination of the substrate by splashed material.

[0080] Reference Figure 3 and Figure 5 In some embodiments, the inner bottom surface of the container body 110 is provided with a flow guide protrusion 150 protruding upward, and the peripheral side surface of the flow guide protrusion 150 is a cone surface that gradually expands from top to bottom.

[0081] Specifically, the flow guide protrusion 150 can be made of the same high-temperature resistant material as the container body 110. The flow guide protrusion 150 can be formed by protruding upward from the inner bottom surface of the container body 110, or a cone-shaped flow guide protrusion 150 can be independently set and embedded in the inner bottom surface of the container body 110.

[0082] The conical sidewall of the guide boss 150 forces liquid or incompletely vaporized vaporized material to slide along the inclined surface towards the edge of the container, preventing accumulation in the bottom center area. Simultaneously, the expanding conical surface forms a narrowing channel with the inner wall of the container, accelerating the material's movement towards the exhaust port 1102 or nozzle. It also increases the contact area between the vaporized material and the bottom of the crucible 100, improving the heat conduction path and ensuring that the heat from the heating components is evenly transferred to the vaporized material.

[0083] The flow guide boss 150 can be configured as a solid structure, which offers better thermal conductivity, structural strength, and high-temperature resistance, making it suitable for high-evaporation-rate metal vapor deposition applications. Alternatively, the flow guide boss 150 can be configured as a hollow structure, which is lighter and better suited for high-speed rotating or mobile evaporation source devices. When the flow guide boss 150 is hollow, it can be filled with an inert gas, such as argon, helium, or nitrogen, to improve insulation, reduce heat loss, and further enhance vapor deposition efficiency.

[0084] In addition, the guide boss 150 can also be configured as a multi-level stepped structure, with the height of each step decreasing, forming multiple small slopes to further refine the flow path of the vapor-deposited material and enhance the guiding effect.

[0085] It should be noted that, in the evaporation source device 20 applied to the crucible 100 in the embodiments of this application, if the heater 200 adopts a structure surrounding the crucible 100, the inner diameter of the heater 200 should be larger than the maximum outer diameter of the crucible 100, so that there is a certain space between the outer periphery of the crucible 100 and the inner wall surface of the heater 200, allowing steam to be discharged from the exhaust port 1102. The gap between the heater 200 and the crucible 100 can also promote the uniform distribution of heat, ensuring that the vapor-deposited material in the crucible 100 can be heated uniformly, improving the vapor deposition efficiency and the uniformity of the vapor-deposited layer. Specifically, the inner wall surface of the heater 200 can be configured to match the outer periphery of the crucible 100. For example, the inner wall surface of the heater 200 can be configured to adapt to the peripheral shapes of the first receiving part 110a, the second receiving part 110b, and the third receiving part 110c from bottom to top, respectively, ensuring that heat is evenly distributed along the outer periphery of the crucible 100, avoiding local overheating or undercooling.

[0086] During the operation of the vapor deposition equipment, the heater 200 heats the crucible 100, and the vaporized material gradually vaporizes to form steam. The steam exits the crucible 100 sequentially through the first nozzle 1201 and the second nozzle 1301, and adheres to the surface of the substrate 40, forming a coating on the substrate 40 surface. The first nozzle 1201 and the second nozzle 1301 are arranged in a staggered or partially overlapping manner to extend the steam exit path, effectively shielding the splashed vaporized material, improving the uniformity of steam exit from the crucible 100, and preventing incompletely vaporized vaporized material from splashing onto the substrate 40 surface. Simultaneously, the vent 1102 on the periphery of the container body 110 allows a small amount of steam to escape, maintaining the pressure balance within the containment cavity 1101. The shielding structure 140 protruding below the vent 1102 provides secondary protection against splashed vaporized material, preventing it from escaping directly through the vent 1102. This improves the uneven film formation or film defects caused by splashing of vapor deposition materials in the vapor deposition equipment, enhances the uniformity of the vapor deposition process, and improves the coating quality on the surface of the substrate 40.

[0087] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A crucible, characterized in that, include: The container body (110) has a receiving cavity (1101) with a top opening. The container body (110) includes a first receiving part (110a), a second receiving part (110b) and a third receiving part (110c) arranged sequentially from bottom to top. The inner side of the first receiving part (110a) is used to store evaporation material, and the circumferential side of the second receiving part (110b) is provided with an exhaust hole (1102). A shielding structure (140) protrudes from the inner wall of the second receiving portion (110b) and shields the area below the exhaust port (1102); A first cover (120) is provided on the top of the third receiving part (110c) and has a first nozzle (1201) communicating with the receiving cavity (1101); The second cover (130) is placed above the first cover (120) and forms a buffer chamber with the first cover (120). The first cover (120) has a second nozzle (1301) that connects the buffer chamber and the external space. The projections of the first nozzle (1201) and the second nozzle (1301) on the horizontal plane are staggered or partially overlapped.

2. The crucible according to claim 1, characterized in that, The number of exhaust holes (1102) is multiple, and the multiple exhaust holes (1102) are arranged along the circumferential direction of the second receiving portion (110b); the shielding structure (140) is an annular boss and is arranged around the lower side of the multiple exhaust holes (1102).

3. The crucible according to claim 1, characterized in that, The number of exhaust holes (1102) is multiple, and the multiple exhaust holes (1102) are arranged along a spiral path. The shielding structure (140) is a spiral protrusion that matches the spiral path. The extension path of the spiral protrusion corresponds to the area below the exhaust hole (1102).

4. The crucible according to claim 2 or 3, characterized in that, The inner wall of the second receiving portion is an upwardly expanding conical surface; the peripheral wall of the shielding structure (140) is also set as a conical surface and abuts against the inner wall of the second receiving portion (110b).

5. The crucible according to any one of claims 1-3, characterized in that, The first cover (120) includes: The first guide section (121) is disposed inside the third receiving section (110c). The first guide section (121) has an upwardly expanding conical structure, and the first nozzle (1201) is opened in the first guide section (121). The first connecting part (122) is connected in a ring shape to the top end of the first guide part (121), and the first connecting part (122) overlaps the top opening edge of the third receiving part (110c).

6. The crucible according to claim 5, characterized in that, The second cover (130) includes: The second guide section (131) is located above the first guide section (121). The second guide section (131) has a downwardly expanding conical structure, and the second nozzle (1301) is opened in the second guide section (131). The second connecting part (132) is connected in a ring shape to the bottom end of the second guide part (131) and abuts against the upper surface of the first connecting part (122); An annular flange (133) protrudes from the bottom surface of the second connecting part (132) and is fitted around the first connecting part (122) and the container body (110).

7. The crucible according to claim 6, characterized in that, The number of the first nozzles (1201) is multiple, and the multiple first nozzles (1201) are arranged at intervals along the circumferential direction of the second nozzle (1301).

8. The crucible according to any one of claims 1-3, characterized in that, The inner bottom surface of the container body (110) is provided with a flow guide boss (150) protruding upwards, and the peripheral side surface of the flow guide boss (150) is a cone surface that gradually expands from top to bottom.

9. An evaporation source device (20), characterized in that, It includes at least one crucible (100) as claimed in any one of claims 1-8 and a heating assembly for heating the crucible (100).

10. A vapor deposition apparatus, characterized in that, The device includes a device body (10) and an evaporation source device (20) as described in claim 9, wherein the device body (10) has a vapor deposition chamber (101) and the evaporation source device (20) is disposed in the vapor deposition chamber (101).

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