Ultrasonic touch controller and ultrasonic touch controller layout board

Abstract

This application relates to the field of touch technology, and in particular to an ultrasonic touch controller and an ultrasonic touch controller layout board. The ultrasonic touch controller includes a transmitting conductive layer, a receiving conductive layer, and a piezoelectric layer, wherein the piezoelectric layer is located between the transmitting and receiving conductive layers. In active mode, the transmitting conductive layer emits ultrasonic waves, and the receiving conductive layer provides multiple sensing signals based on the echoes of the ultrasonic waves to determine the user's touch position and gesture. In passive mode, the transmitting conductive layer stops emitting ultrasonic waves, and the piezoelectric layer senses the vibration characteristics of the contact surface to distinguish between active finger pressing and inactive interference, thereby achieving low power consumption and anti-mistouch functionality.

Description

Technical Field

[0001] This application relates to the field of touch technology, and in particular to an ultrasonic touch controller and an ultrasonic touch controller layout board. Background Technology

[0002] Mobile devices (such as augmented reality (AR) glasses, smartphones, and smart rings) have become an indispensable part of daily life. Most current mobile devices are equipped with capacitive touchscreens for gesture control, such as those located on the temples of AR glasses, shoulder buttons on smartphones, and the outer surface of smart rings. However, capacitive touchscreens suffer from problems such as being prone to accidental touches, limited gesture recognition capabilities, and incompatibility with metal substrates. Specifically, capacitive touchscreens on AR glasses, smartphones, and smart rings are easily triggered by contact with objects such as hair, collars, cheeks, sweaty fingers, and rain; in other words, they are highly susceptible to accidental touches from external objects. Furthermore, capacitive touchscreens only support clicks and swipes, and cannot support complex gestures such as force sensing and rotation, resulting in limited gesture recognition capabilities. Moreover, capacitive touchscreens tend to generate significant noise when bonded to a metal substrate, making them unsuitable for use with metal substrates.

[0003] To address the issue of accidental touches, existing technologies use ultrasonic fingerprint recognition structures to replace capacitive touchscreens. However, current ultrasonic fingerprint recognition structures operate on a single mode, only actively emitting ultrasonic waves to detect fingerprints or liveness, and cannot passively sense environmental vibrations. Therefore, without user-initiated contact, the ultrasonic fingerprint recognition structure is frequently activated by external objects, resulting in high power consumption. Furthermore, ultrasonic fingerprint recognition structures are currently primarily used for fingerprint imaging, not for finger position tracking or gesture recognition such as finger rotation. This limits the functionality of ultrasonic fingerprint recognition structures and makes expansion difficult. Moreover, the piezoelectric layer of existing ultrasonic fingerprint recognition structures is mostly made of lead zirconate titanate (PZT) ceramic. This piezoelectric layer is hard and brittle, making it unsuitable for bonding to curved structures, such as the temples of augmented reality glasses, shoulder buttons on smartphones, and the outer surface of smart rings. Additionally, lead zirconate titanate ceramic is expensive. To be installed on mobile devices, ultrasonic fingerprint recognition structures need to be very small, requiring the lead zirconate titanate ceramic to be thinned. However, after thinning, lead zirconate titanate ceramic is prone to breakage during manufacturing, leading to poor yield rates. Furthermore, the electrode layer in the ultrasonic fingerprint recognition structure uses pure silver paste, which results in higher costs. Summary of the Invention

[0004] One of the objectives of this invention is to provide an ultrasonic touch controller suitable for mobile devices.

[0005] One of the objectives of this invention is to provide a low-power ultrasonic touch controller that prevents accidental touches.

[0006] One of the objectives of this invention is to provide an ultrasonic touchscreen layout board that improves layout efficiency and reduces costs.

[0007] According to the present invention, an ultrasonic touch controller includes a substrate, a receiving conductive layer, a piezoelectric layer, a transmitting conductive layer, and an acoustic matching layer. The receiving conductive layer is located above the substrate and has multiple receiving electrodes. The piezoelectric layer is located above the receiving conductive layer and is used to convert pressure into voltage. The transmitting conductive layer is located above the piezoelectric layer and is used to emit ultrasonic waves. The acoustic matching layer is located above the transmitting conductive layer and is used to protect the transmitting conductive layer and filter the sound waves. The multiple receiving electrodes of the receiving conductive layer generate multiple sensing signals based on the echo of the ultrasonic waves and the voltage generated by the piezoelectric layer.

[0008] In one embodiment, the substrate includes a flexible substrate.

[0009] In one embodiment, the piezoelectric layer is made of polyvinylidene fluoride or a polyvinylidene fluoride-trifluoroethylene copolymer.

[0010] In one embodiment, the materials of the plurality of receiving electrodes receiving the conductive layer include silver, silver-plated copper, copper paste, molybdenum, aluminum, nickel, or titanium.

[0011] In one embodiment, the material of the emitter electrode of the emitter conductive layer includes silver, silver-plated copper, copper paste, molybdenum, aluminum, nickel, or titanium.

[0012] In one embodiment, the ultrasonic touch controller further includes a processor electrically connected to a receiving conductive layer and an emitting conductive layer, wherein the processor determines whether a user touches the ultrasonic touch controller and the user's gesture based on multiple sensing signals, and controls the emitting conductive layer to emit ultrasonic waves.

[0013] In one embodiment, the receiving conductive layer further includes multiple traces on the substrate and located on at least one side of multiple receiving electrodes, wherein the multiple traces respectively connect the multiple receiving electrodes to the processor.

[0014] In one embodiment, the ultrasonic touch controller further includes a wiring layer and an insulating layer. The wiring layer is on the substrate and directly below the receiving conductive layer, wherein the wiring layer has multiple traces that respectively connect multiple receiving electrodes of the receiving conductive layer to the processor. The insulating layer is located between the wiring layer and the receiving conductive layer, wherein the insulating layer has multiple openings for the multiple traces to connect to the multiple receiving electrodes.

[0015] In one embodiment, in the passive mode of the ultrasonic touch controller, the transmitting conductive layer stops emitting ultrasonic waves, and the receiving conductive layer provides multiple sensing signals based on the voltage generated by the piezoelectric layer to determine whether the user has touched the ultrasonic touch controller.

[0016] In one embodiment, in the active mode of the ultrasonic touch controller, the transmitting conductive layer emits ultrasonic waves, and the receiving conductive layer provides multiple sensing signals based on the echo of the ultrasonic waves to determine the user's touch position and the user's gesture.

[0017] According to the present invention, an ultrasonic touchpad layout board includes multiple ultrasonic touchpads arranged in an array. Each ultrasonic touchpad includes a substrate, a receiving conductive layer, a piezoelectric layer, a transmitting conductive layer, and an acoustic matching layer. The receiving conductive layer is located above the substrate and has multiple receiving electrodes. The piezoelectric layer is located above the receiving conductive layer and is used to convert pressure into voltage. The transmitting conductive layer is located above the piezoelectric layer and is used to emit ultrasonic waves. The acoustic matching layer is located above the transmitting conductive layer and is used to protect the transmitting conductive layer and filter the sound waves. The multiple receiving electrodes of the receiving conductive layer generate multiple sensing signals based on the echo of the ultrasonic waves and the voltage generated by the piezoelectric layer. The ultrasonic touchpad layout board is cut to form multiple independent ultrasonic touchpads.

[0018] In one embodiment, multiple ultrasonic touch controllers are arranged back-to-back.

[0019] In one embodiment, the acoustic matching layers of the multiple ultrasonic touch controllers are independent of each other.

[0020] In one embodiment, ultrasonic touchpads in the same row of multiple ultrasonic touchpads share the same acoustic matching layer.

[0021] In one embodiment, the piezoelectric layer is made of polyvinylidene fluoride or a polyvinylidene fluoride-trifluoroethylene copolymer.

[0022] In one embodiment, the materials of the plurality of receiving electrodes receiving the conductive layer include silver, silver-plated copper, copper paste, molybdenum, aluminum, nickel, or titanium.

[0023] In one embodiment, the material of the emitter electrode of the emitter conductive layer includes silver, silver-plated copper, copper paste, molybdenum, aluminum, nickel, or titanium.

[0024] In one embodiment, the receiving conductive layer further includes multiple traces on the substrate and located on at least one side of a plurality of receiving electrodes.

[0025] In one embodiment, each ultrasonic touch controller further includes a wiring layer and an insulating layer. The wiring layer is on the substrate and directly below the receiving conductive layer, and has multiple traces. The insulating layer is located between the wiring layer and the receiving conductive layer, and has multiple openings for the multiple traces to connect to multiple receiving electrodes.

[0026] In one embodiment, in the passive mode of the ultrasonic touch controller, the transmitting conductive layer stops emitting ultrasonic waves, and the receiving conductive layer provides multiple sensing signals based on the voltage generated by the piezoelectric layer to determine whether the user has touched the ultrasonic touch controller.

[0027] In active mode, the aforementioned ultrasonic touch controller emits ultrasonic waves through its emitting conductive layer, while its receiving conductive layer provides multiple sensing signals based on the echoes of the ultrasonic waves to determine the user's touch location and gesture. In passive mode, the emitting conductive layer stops emitting ultrasonic waves, and the piezoelectric layer senses the vibration characteristics of the contact surface to distinguish between active finger pressure and inactive interference, thereby achieving low power consumption and preventing accidental touches.

[0028] The ultrasonic touch controllers on the aforementioned ultrasonic touch controller layout board are arranged back-to-back to improve layout efficiency and reduce costs. Attached Figure Description

[0029] Figure 1 This invention shows a first embodiment of the ultrasonic touch controller.

[0030] Figures 2 to 6 show Figure 1 The manufacturing process of ultrasonic touch controllers.

[0031] Figure 7 This invention shows a second embodiment of the ultrasonic touch controller.

[0032] Figure 8 This invention shows a third embodiment of the ultrasonic touch controller.

[0033] Figures 9 to 15 show Figure 8 The manufacturing method of an ultrasonic touch controller.

[0034] Figure 16 This invention shows a fourth embodiment of the ultrasonic touch controller.

[0035] Figure 17 This invention illustrates an ultrasonic touch controller layout board.

[0036] Figure 18 This invention shows another ultrasonic touch controller layout board.

[0037] Explanation of reference numerals in the attached figures:

[0038] 10. Ultrasonic touch controller; 11. Substrate; 12. Receiving conductive layer; 121. Receiving electrode; 122. Receiving electrode; 123. Receiving electrode; 131. Trace; 132. Trace; 133. Trace; 134. Connecting electrode; 14. Piezoelectric layer; 15. Emitting conductive layer; 16. Acoustic matching layer; 17. Flexible printed circuit board; 18. Processor; 20. Ultrasonic touch controller; 21. Circuit layer; 22. Insulating layer; 221. Opening; 222. Opening; 223. Opening; 30. Ultrasonic touch controller layout board; 31. Head; 32. Tail; 40. Ultrasonic touch controller layout board; W1. Width; W2. Width. Detailed Implementation

[0039] Figure 1 This invention shows a first embodiment of the ultrasonic touch controller. Figure 1 The ultrasonic touch controller 10 includes a substrate 11, a receiving conductive layer 12, a circuit layer, a piezoelectric layer 14, a transmitting conductive layer 15, an acoustic matching layer 16, a flexible circuit board 17, and a processor 18. A first side of the receiving conductive layer 12 contacts the substrate 11. A second side of the receiving conductive layer 12 contacts a first side of the piezoelectric layer 14. A second side of the piezoelectric layer 14 contacts a first side of the transmitting conductive layer 15. A second side of the transmitting conductive layer 15 contacts a first side of the acoustic matching layer 16. A first side of the flexible circuit board 17 contacts the substrate 11 and the circuit layer. A second side of the flexible circuit board 17 contacts the processor 18.

[0040] Specifically, the receiving conductive layer 12 and the circuit layer are located above the substrate 11. The receiving conductive layer 12 includes a plurality of receiving electrodes (e.g., receiving electrode 121, receiving electrode 122, and receiving electrode 123), which are disposed on the upper surface of the substrate 11. Figure 1 In one embodiment, the receiving conductive layer 12 has three receiving electrodes, but the invention is not limited thereto. The circuit layer includes multiple traces (e.g., traces 131, 132, and 133) and connecting electrodes 134. Figure 2As shown, multiple traces (trace 131, trace 132, and trace 133) and connecting electrodes 134 are disposed on the upper surface of the substrate 11, wherein the multiple traces (trace 131, trace 132, and trace 133) are located on at least one side of multiple receiving electrodes (receiving electrodes 121, receiving electrodes 122, and receiving electrodes 123). A piezoelectric layer 14 is located above the receiving conductive layer 12 and is used to convert pressure into voltage. A transmitting conductive layer 15 is located above the piezoelectric layer 14 and is used to emit ultrasonic waves. The transmitting conductive layer 15 includes at least one transmitting electrode (not shown). An acoustic matching layer 16 is located above the transmitting conductive layer 15 and is used to protect the transmitting conductive layer 15 and filter acoustic waves. A flexible circuit board 17 is attached to the substrate 11, electrically connecting the multiple traces (trace 131, trace 132, and trace 133) of the circuit layer and the connecting electrodes 134. A processor 18 is disposed on the flexible circuit board 17. The processor 18 is electrically connected to multiple receiving electrodes (receiving electrodes 121, 122, and 123) of the receiving conductive layer 12 via a flexible circuit board 17 and multiple traces (traces 131, 132, and 133). The processor 18 is also electrically connected to at least one emitting electrode of the emitting conductive layer 15 via the flexible circuit board 17 and a connecting electrode 134. The processor 18 controls at least one emitting electrode of the emitting conductive layer 15 to emit ultrasonic waves. The multiple receiving electrodes (receiving electrodes 121, 122, and 123) of the receiving conductive layer 12 generate multiple sensing signals based on the echo of the ultrasonic waves and the voltage generated by the piezoelectric layer 14. The processor 18 determines whether the user has touched the ultrasonic touchpad 10 and judges the user's gesture based on the multiple sensing signals generated by the multiple receiving electrodes (receiving electrodes 121, 122, and 123) of the receiving conductive layer 12.

[0041] Figures 2 to 6 show Figure 1 The manufacturing method of an ultrasonic touch controller. Figure 1 The manufacturing method of the ultrasonic touch controller 10 includes first providing a substrate 11, and forming a receiving conductive layer 12 and a circuit layer on the substrate 11, such as... Figure 2 As shown. In Figure 2In this embodiment, the receiving conductive layer 12 includes multiple receiving electrodes (receiving electrode 121, receiving electrode 122, and receiving electrode 123), and the circuit layer includes multiple traces (trace 131, trace 132, and trace 133) and connecting electrodes 134. The substrate 11 can be a flexible substrate or a rigid substrate. In one embodiment, the method of forming the receiving conductive layer 12 and the circuit layer includes, but is not limited to, coating, printing, sputtering, or photolithography. In one embodiment, the material of the substrate 11 can be, but is not limited to, glass, polyimide (PI), polyethylene terephthalate (PET), or polycarbonate (PC). In one embodiment, the materials of the receiving electrodes (receiving electrode 121, receiving electrode 122, and receiving electrode 123), the traces (trace 131, trace 132, and trace 133), and the connecting electrodes 134 can be, but are not limited to, silver, silver-clad copper, copper paste, molybdenum, aluminum, nickel, or titanium.

[0042] After forming a receiving conductive layer 12 and a circuit layer on the substrate 11, a piezoelectric layer 14 is formed to cover the receiving conductive layer 12, such as... Figure 1 and Figure 3 As shown. The piezoelectric layer 14 is used to convert electrical energy into mechanical energy. Specifically, when the piezoelectric layer 14 is subjected to external force (such as vibration, pressure, or friction) and undergoes mechanical deformation, a charge will be generated on the surface of the piezoelectric layer 14, thereby creating a potential difference between the receiving conductive layer 12 and the transmitting conductive layer 15. In other words, when the piezoelectric layer 14 is subjected to external force, the piezoelectric layer 14 provides a voltage to the multiple receiving electrodes (receiving electrode 121, receiving electrode 122, and receiving electrode 123) of the receiving conductive layer 12, thereby generating multiple sensing signals. In one embodiment, the piezoelectric layer 14 is formed by means including but not limited to coating or bonding. In one embodiment, the material of the piezoelectric layer 14 may be, but is not limited to, polyvinylidene fluoride (PVDF) or PVDF-TrFE copolymer.

[0043] After forming the piezoelectric layer 14, an emission conductive layer 15 is formed on the piezoelectric layer 14, such as... Figure 1 and Figure 4 As shown. The transmitting conductive layer 15 is used to emit ultrasonic waves. The echo of the ultrasonic waves can cause multiple receiving electrodes (receiving electrode 121, receiving electrode 122, and receiving electrode 123) of the receiving conductive layer 12 to generate multiple sensing signals for determining the user's finger position and the user's posture. Figure 1 and Figure 4 In one embodiment, the emitting conductive layer 15 is composed of an emitting electrode, that is, the emitting conductive layer 15 can be regarded as an emitting electrode. In one embodiment, the emitting conductive layer 15 is formed by means including but not limited to coating, printing, sputtering, or photolithography. In one embodiment, the material of the emitting electrode of the emitting conductive layer 15 may be, but is not limited to, silver, silver-clad copper, copper paste, molybdenum, aluminum, nickel, or titanium.

[0044] After forming the emitting conductive layer 15, a sound wave matching layer 16 is formed to cover the emitting conductive layer 15, such as... Figure 1 and Figure 5 As shown. The acoustic matching layer 16 is used to protect the emitting conductive layer 15, preventing oxidation or damage to the emitting electrode of the emitting conductive layer 15 that would affect its function. In addition, the acoustic matching layer 16 can also filter sound waves, allowing sound waves of specific frequencies to pass through. In one embodiment, the acoustic matching layer 16 is formed by methods including but not limited to coating, laminating, or printing. In one embodiment, the material of the acoustic matching layer 16 can be, but is not limited to, ink or die-attach film (DAF).

[0045] After forming the acoustic matching layer 16, the flexible circuit board 17 and the processor 18 are bonded to the substrate 11 to form the ultrasonic touch controller 10. Since the emitting conductive layer 15 does not extend below the flexible circuit board 17, no step difference is formed after the flexible circuit board 17 is bonded to the substrate 11, thus improving the reliability of the ultrasonic touch controller 10. The processor 18 is disposed on the flexible circuit board 17, and the processor 18 is electrically connected to the receiving conductive layer 12 and the emitting conductive layer 15 through the flexible circuit board 17, such as... Figure 1 and Figure 6 As shown. The processor 18 controls at least one emitting electrode of the emitting conductive layer 15 to emit ultrasonic waves, and determines whether the user touches the ultrasonic touch controller 10 and the user's gesture based on multiple sensing signals generated by multiple receiving electrodes (receiving electrode 121, receiving electrode 122, and receiving electrode 123) of the receiving conductive layer 12. In one embodiment, the flexible circuit board 17 can be omitted, and the processor 18 can be disposed on the substrate 11, connected to multiple receiving electrodes (receiving electrode 121, receiving electrode 122, and receiving electrode 123) of the receiving conductive layer 12 through multiple traces (trace 131, trace 132, and trace 133), and connected to at least one emitting electrode of the emitting conductive layer 15 through a connecting electrode 134, as shown. Figure 7 As shown.

[0046] Figure 8 This invention shows a second embodiment of the ultrasonic touch controller. Figure 8 ultrasonic touch controller 20 and Figure 1The ultrasonic touch controller 10 also includes a substrate 11, a receiving conductive layer 12, a piezoelectric layer 14, a transmitting conductive layer 15, an acoustic matching layer 16, a flexible circuit board 17, and a processor 18. Furthermore, the ultrasonic touch controller 20 also includes a circuit layer 21 and an insulating layer 22. A first side of the circuit layer 21 contacts the substrate 11. A second side of the circuit layer 21 contacts the first side of the insulating layer 22. A second side of the insulating layer 22 contacts the first side of the receiving conductive layer 12. A second side of the receiving conductive layer 12 contacts the first side of the piezoelectric layer 14. A second side of the piezoelectric layer 14 contacts the first side of the transmitting conductive layer 15. A second side of the transmitting conductive layer 15 contacts the first side of the acoustic matching layer 16. A first side of the flexible circuit board 17 contacts the substrate 11 and the circuit layer 21. A second side of the flexible circuit board 17 contacts the processor 18.

[0047] Specifically, the circuit layer 21 is on the substrate 11 and below the receiving conductive layer 12. The circuit layer 21 includes multiple traces (trace 131, trace 132, and trace 133) and connecting electrodes 134, such as... Figure 9 As shown. An insulating layer 22 is located between the circuit layer 21 and the receiving conductive layer 12. The insulating layer 22 has multiple openings (openings 221, 222, and 223) for the receiving conductive layer 12 to connect to the circuit layer 21, as shown. Figure 10As shown. A receiving conductive layer 12 is on an insulating layer 22. The receiving conductive layer 12 includes multiple receiving electrodes (receiving electrode 121, receiving electrode 122, and receiving electrode 123) disposed on the insulating layer 22. These multiple receiving electrodes (receiving electrode 121, receiving electrode 122, and receiving electrode 123) can be connected to multiple traces (trace 131, trace 132, and trace 133) of the circuit layer 21 through multiple openings (openings 221, openings 222, and openings 223) in the insulating layer 22. A piezoelectric layer 14 is located above the receiving conductive layer 12 and is used to convert pressure into voltage. A transmitting conductive layer 15 is located above the piezoelectric layer 14 and is used to emit ultrasonic waves. The transmitting conductive layer 15 includes at least one transmitting electrode (not shown). An acoustic matching layer 16 is located above the transmitting conductive layer 15 and is used to protect the transmitting conductive layer 15 and filter acoustic waves. A flexible printed circuit board 17 is attached to a substrate 11, electrically connecting multiple traces (trace 131, trace 132, and trace 133) of the circuit layer and connecting electrodes 134. A processor 18 is disposed on the flexible printed circuit board 17. The processor 18 is electrically connected to multiple receiving electrodes (receiving electrodes 121, 122, and 123) of the receiving conductive layer 12 via the flexible printed circuit board 17 and the multiple traces (trace 131, trace 132, and trace 133). The processor 18 is electrically connected to at least one emitting electrode of the emitting conductive layer 15 via the flexible printed circuit board 17 and connecting electrodes 134. The processor 18 controls at least one emitting electrode of the emitting conductive layer 15 to emit ultrasonic waves. The multiple receiving electrodes (receiving electrodes 121, 122, and 123) of the receiving conductive layer 12 generate multiple sensing signals based on the echo of the ultrasonic waves and the voltage generated by the piezoelectric layer 14. The processor 18 determines whether the user touches the ultrasonic touch controller 20 and the user's gesture based on multiple sensing signals generated by multiple receiving electrodes (receiving electrode 121, receiving electrode 122 and receiving electrode 123) of the receiving conductive layer 12.

[0048] Figures 9 to 15 show Figure 8 The manufacturing method of an ultrasonic touch controller. For example... Figure 9 As shown, the manufacturing method of the ultrasonic touch controller 20 includes first providing a substrate 11, and then forming a circuit layer 21 on the substrate 11. Figure 9 In this embodiment, the circuit layer 21 includes multiple traces (trace 131, trace 132, and trace 133) and connecting electrodes 134. The substrate 11 can be a flexible substrate or a rigid substrate. In one embodiment, the circuit layer 21 is formed by methods including but not limited to coating, printing, sputtering, or photolithography. In one embodiment, the material of the substrate 11 can be, but is not limited to, glass, polyimide (PI), polyethylene terephthalate (PET), or polycarbonate (PC). In one embodiment, the materials of the traces (trace 131, trace 132, and trace 133) and the connecting electrodes 134 can be, but are not limited to, silver, silver-clad copper, copper paste, molybdenum, aluminum, nickel, or titanium.

[0049] After forming the interconnect layer 21 on the substrate 11, an insulating layer 22 is formed to cover the interconnect layer 21, such as... Figure 8 and Figure 10 As shown, the insulating layer 22 has multiple openings (opening 221, opening 222, and opening 223) corresponding to multiple traces (trace 131, trace 132, and trace 133) of the underlying circuit layer 21. In one embodiment, the insulating layer 22 is formed by means including, but not limited to, coating or photolithography. In one embodiment, the material of the insulating layer 22 may be, but is not limited to, optocoupler (OC), bisphenol A type epoxy resin (BP), silicon dioxide (SiO2), or silicon nitride.

[0050] After the insulating layer 22 is formed, a receiving conductive layer 12 is formed on the insulating layer 22, such as Figure 8 and Figure 11 As shown, the receiving conductive layer 12 includes multiple receiving electrodes (receiving electrode 121, receiving electrode 122, and receiving electrode 123). The multiple receiving electrodes (receiving electrode 121, receiving electrode 122, and receiving electrode 123) are respectively connected to multiple traces (trace 131, trace 132, and trace 133) of the circuit layer 21 through multiple openings (openings 221, 222, and 223) of the insulating layer 22. In one embodiment, the receiving conductive layer 12 is formed by methods including but not limited to coating, printing, sputtering, or photolithography. In one embodiment, the material of the receiving electrodes (receiving electrode 121, receiving electrode 122, and receiving electrode 123) may be, but is not limited to, silver, silver-clad copper, copper paste, molybdenum, aluminum, nickel, or titanium.

[0051] After forming the receiving conductive layer 12, a piezoelectric layer 14 is formed to cover the receiving conductive layer 12, such as... Figure 8 and Figure 12 As shown. The piezoelectric layer 14 is used to convert electrical energy into mechanical energy. When the piezoelectric layer 14 is subjected to an external force, it provides a voltage to the multiple receiving electrodes (receiving electrode 121, receiving electrode 122, and receiving electrode 123) of the receiving conductive layer 12, thereby generating multiple sensing signals. In one embodiment, the piezoelectric layer 14 is formed by methods including but not limited to coating or bonding. In one embodiment, the material of the piezoelectric layer 14 may be, but is not limited to, polyvinylidene fluoride (PVDF) or vinylidene fluoride-trifluoroethylene copolymer (PVDF-TrFE). The piezoelectric coefficient of PVDF can detect weak signals such as those generated by a hair brushing across the surface or a gentle breeze, thus achieving excellent anti-accidental touch functionality.

[0052] After forming the piezoelectric layer 14, an emission conductive layer 15 is formed on the piezoelectric layer 14, such as... Figure 8 and Figure 13As shown. The transmitting conductive layer 15 is used to emit ultrasonic waves. The echo of the ultrasonic waves can cause multiple receiving electrodes (receiving electrode 121, receiving electrode 122, and receiving electrode 123) of the receiving conductive layer 12 to generate multiple sensing signals for determining the user's finger position and the user's posture. Figure 8 and Figure 13 In one embodiment, the emitting conductive layer 15 is composed of an emitting electrode, that is, the emitting conductive layer 15 can be regarded as an emitting electrode. In one embodiment, the emitting conductive layer 15 is formed by means including but not limited to coating, printing, sputtering, or photolithography. In one embodiment, the material of the emitting electrode of the emitting conductive layer 15 may be, but is not limited to, silver, silver-clad copper, copper paste, molybdenum, aluminum, nickel, or titanium.

[0053] After forming the emitting conductive layer 15, a sound wave matching layer 16 is formed to cover the emitting conductive layer 15, such as... Figure 8 and Figure 14 As shown. The acoustic matching layer 16 is used to protect the emitting conductive layer 15, preventing oxidation or damage to the emitting electrode of the emitting conductive layer 15 that would affect its function. In addition, the acoustic matching layer 16 can also filter sound waves, allowing sound waves of specific frequencies to pass through. In one embodiment, the acoustic matching layer 16 is formed by methods including but not limited to coating, laminating, or printing. In one embodiment, the material of the acoustic matching layer 16 can be, but is not limited to, ink or die-attach film (DAF).

[0054] After forming the acoustic matching layer 16, the flexible circuit board 17 and the processor 18 are bonded to the substrate 11 to form the ultrasonic touch controller 20. Since the emitting conductive layer 15 does not extend below the flexible circuit board 17, no step difference is formed after the flexible circuit board 17 is bonded to the substrate 11, thus improving the reliability of the ultrasonic touch controller 20. The processor 18 is disposed on the flexible circuit board 17, and the processor 18 is electrically connected to the receiving conductive layer 12 and the emitting conductive layer 15 through the flexible circuit board 17, such as... Figure 8 and Figure 15 As shown. The processor 18 controls at least one emitting electrode of the emitting conductive layer 15 to emit ultrasonic waves, and determines whether the user touches the ultrasonic touch controller 20 and the user's gesture based on multiple sensing signals generated by multiple receiving electrodes (receiving electrode 121, receiving electrode 122, and receiving electrode 123) of the receiving conductive layer 12. In one embodiment, the flexible circuit board 17 can be omitted, and the processor 18 can be disposed on the substrate 11, connected to multiple receiving electrodes (receiving electrode 121, receiving electrode 122, and receiving electrode 123) of the receiving conductive layer 12 through multiple traces (trace 131, trace 132, and trace 133), and connected to at least one emitting electrode of the emitting conductive layer 15 through a connecting electrode 134, as shown. Figure 16 As shown.

[0055] Compared to the ultrasonic touch controller 10, because the circuit layer 21 of the ultrasonic touch controller 20 is directly below the receiving conductive layer 12, rather than on at least one side of the receiving conductive layer 12, the width W2 of the ultrasonic touch controller 20 is smaller than the width W1 of the ultrasonic touch controller 10. Figure 6 and Figure 15 As shown. In one embodiment, the width W1 of the ultrasonic touchpad 10 is approximately 2.99 mm, but the invention is not limited thereto. In one embodiment, the width W2 of the ultrasonic touchpad 20 is approximately 2.37 mm, but the invention is not limited thereto.

[0056] The ultrasonic touch controller 10 and ultrasonic touch controller 20 of the present invention have a passive mode and an active mode. In passive mode, the processor 18 controls the emitting conductive layer 15 to stop emitting ultrasonic waves, thereby reducing power consumption. When an object touches the ultrasonic touch controller 10 or ultrasonic touch controller 20, the piezoelectric layer 14 generates a corresponding voltage according to the force applied by the object, and the receiving conductive layer 12 provides multiple sensing signals based on the voltage generated by the piezoelectric layer 14. After acquiring the multiple sensing signals, the processor 18 analyzes the characteristics of the multiple sensing signals to determine whether the ultrasonic touch controller 10 or ultrasonic touch controller 20 was actively touched by the user or was an unexpected accidental touch, such as an accidental touch caused by hair, clothing, or a breeze. When the processor 18 determines that the ultrasonic touch controller 10 or ultrasonic touch controller 20 was actively touched by the user, the processor 18 controls the ultrasonic touch controller 10 or ultrasonic touch controller 20 to enter active mode. When the processor 18 determines that it was an accidental touch, the processor 18 controls the ultrasonic touch controller 10 or ultrasonic touch controller 20 to remain in passive mode. In summary, in passive mode, the ultrasonic touch controller 10 and ultrasonic touch controller 20 of the present invention utilize the piezoelectric layer 14 to sense the vibration characteristics of the contact surface, distinguish between active finger pressing and inactive interference such as hair, clothing, cheeks, and rain, and achieve low power consumption and anti-accidental touch function.

[0057] In active mode, the processor 18 controls the transmitting conductive layer 15 to emit ultrasonic waves, and the receiving conductive layer 12 provides multiple sensing signals based on the echoes of the ultrasonic waves to determine the user's touch position and gesture. The processor 18 can determine which receiving electrode the user's finger is above or closer to based on the sensing signals generated by each receiving electrode (receiving electrode 121, receiving electrode 122, and receiving electrode 123), thereby determining whether the finger is on the left, middle, or right side. The processor 18 can determine the direction of finger movement based on changes in the sensing signals from multiple receiving electrodes (receiving electrode 121, receiving electrode 122, and receiving electrode 123). In summary, in active mode, the ultrasonic touchpad 10 and ultrasonic touchpad 20 of the present invention emit ultrasonic waves to continuously track finger positions to perform different functions.

[0058] Specifically, the multiple receiving electrodes of the receiving conductive layer 12 are arranged in a matrix. When a finger slides on the surface of the ultrasonic touchpad 10 or ultrasonic touchpad 20, ultrasonic waves are continuously emitted and received at a high frame rate. The signal intensity received by the receiving conductive layer 12 is not a simple "present / absent" state, but rather exhibits a spatial Gaussian distribution (position = ∑(coordinate i × intensity i) / ∑intensity i). The signal of the receiving electrode directly below the finger is the strongest, while the signal of the surrounding receiving electrodes decreases smoothly with increasing distance in a bell-shaped curve. Based on this principle, the ultrasonic touchpad 10 or ultrasonic touchpad 20 of this invention can accurately achieve two-dimensional positioning of the finger, determine the direction of finger sliding, and still perform accurate finger interaction when hands are wet or dirty. The piezoelectric layer 14 of this invention uses materials with excellent piezoelectric coefficients such as PVDF / PVDF-TrFE, which can clearly distinguish the mechanical pulses generated by finger tapping and output different voltage signals. The amplitude of the waveform is positively correlated with the pressure applied (heavier pressure produces higher spikes), and the number of waveforms corresponds to the number of presses. When two fingers touch the ultrasonic touch controller 10 or ultrasonic touch controller 20 at the same time, and the two fingers rotate clockwise or counterclockwise at the same time, the ultrasonic touch controller 10 or ultrasonic touch controller 20 will determine that the action is a rotation.

[0059] The ultrasonic touch controller 10 and ultrasonic touch controller 20 of the present invention can be mounted on metal and plastic materials, and their stacked structure includes piezoelectric materials, thus enabling both passive and active ultrasonic sensing functions. Furthermore, when using a flexible substrate, the ultrasonic touch controller 10 and ultrasonic touch controller 20 of the present invention can further reduce product space waste and also enable more complex gestures such as rotation.

[0060] Figure 17 This invention illustrates an ultrasonic touch controller layout board. Figure 17 The ultrasonic touchpad layout board 30 includes multiple ultrasonic touchpads 20 (excluding the flexible circuit board 17 and processor 18). Specifically, the multiple ultrasonic touchpads 20 are arranged in an array and a back-to-back configuration. A back-to-back arrangement means that the heads 31 (wiring areas) of two adjacent rows of ultrasonic touchpads 20 are opposite each other, or the tails 32 (non-wiring areas) of two adjacent rows of ultrasonic touchpads 20 are opposite each other. The back-to-back arrangement can improve layout efficiency. Figure 17 In the ultrasonic touchpad layout board 30, the acoustic matching layers 16 of the multiple ultrasonic touchpads 20 are independent. Figure 17 Multiple independent ultrasonic touch controllers 20 can be obtained by cutting the ultrasonic touch controller layout board 30.

[0061] Figure 18 This invention shows another ultrasonic touch controller layout board. Figure 18The ultrasonic touchpad layout board 40 includes multiple ultrasonic touchpads 20 (excluding the flexible circuit board 17 and processor 18). Specifically, the multiple ultrasonic touchpads 20 are arranged in an array and back-to-back configuration. Figure 18 In the ultrasonic touchpad layout board 40, ultrasonic touchpads 20 in the same row share a single sound matching layer 16. Figure 18 Multiple independent ultrasonic touch controllers 20 can be obtained by cutting the ultrasonic touch controller layout board 40.

[0062] exist Figure 17 The ultrasonic touch controller layout board 30 and Figure 18 In the ultrasonic touch layout board 40, a plurality of ultrasonic touchers 20 are formed, but the present invention is not limited thereto. For example, ultrasonic touchers 10 (excluding the flexible board 17 and the processor 18) can also be formed.

[0063] The above description is merely an embodiment of the present invention and is not intended to limit the present invention in any way. Although the present invention has been disclosed above by way of embodiments, it is not intended to limit the present invention. Any person skilled in the art can make minor modifications or adjustments based on the above-disclosed technical content without departing from the scope of the technical solution of the present invention to obtain other embodiments with equivalent substitution effects. Any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention shall still fall within the scope of the technical solution of the present invention.

Claims

1. An ultrasonic touch controller, characterized in that, The ultrasonic touch controller includes: substrate; A receiving conductive layer is provided above the substrate, having a plurality of receiving electrodes; A piezoelectric layer, located above the receiving conductive layer, is used to convert pressure into voltage; A conductive emission layer, located above the piezoelectric layer, is used to emit ultrasonic waves; and An acoustic matching layer, located above the transmitting conductive layer, is used to protect the transmitting conductive layer and filter acoustic waves. The plurality of receiving electrodes of the receiving conductive layer generate a plurality of sensing signals based on the echo of the ultrasonic wave and the voltage generated by the piezoelectric layer.

2. The ultrasonic touch controller as described in claim 1, characterized in that, The substrate includes a flexible substrate.

3. The ultrasonic touch controller as described in claim 1, characterized in that, The material of the piezoelectric layer includes polyvinylidene fluoride or a polyvinylidene fluoride-trifluoroethylene copolymer.

4. The ultrasonic touch controller as described in claim 1, characterized in that, The materials of the plurality of receiving electrodes of the receiving conductive layer include silver, silver-plated copper, copper paste, molybdenum, aluminum, nickel, or titanium.

5. The ultrasonic touch controller as described in claim 1, characterized in that, The material of the emitter electrode of the emitter conductive layer includes silver, silver-plated copper, copper paste, molybdenum, aluminum, nickel, or titanium.

6. The ultrasonic touch controller as described in claim 1, characterized in that, The ultrasonic touch controller also includes: Flexible printed circuit board, bonded to the substrate, electrically connecting the receiving conductive layer and the transmitting conductive layer; and A processor is disposed on the flexible circuit board and electrically connected to the receiving conductive layer and the transmitting conductive layer through the flexible circuit board. The processor determines whether the user touches the ultrasonic touch controller and the user's gesture based on the plurality of sensing signals, and controls the transmitting conductive layer to emit the ultrasonic waves.

7. The ultrasonic touch controller as described in claim 6, characterized in that, The receiving conductive layer further includes multiple traces on the substrate and located on at least one side of the plurality of receiving electrodes, wherein the plurality of traces respectively connect the plurality of receiving electrodes to the processor.

8. The ultrasonic touch controller as described in claim 6, characterized in that, The ultrasonic touch controller also includes: A circuit layer, located on the substrate and directly beneath the receiving conductive layer, wherein the circuit layer has multiple traces connecting multiple receiving electrodes of the receiving conductive layer to the processor; and An insulating layer is provided between the circuit layer and the receiving conductive layer, wherein the insulating layer has a plurality of openings for the plurality of traces to connect to the plurality of receiving electrodes.

9. The ultrasonic touch controller as described in claim 1, characterized in that, In the passive mode of the ultrasonic touch controller, the emitting conductive layer stops emitting the ultrasonic waves, and the receiving conductive layer provides the plurality of sensing signals based on the voltage generated by the piezoelectric layer to determine whether the user has touched the ultrasonic touch controller.

10. The ultrasonic touch controller as described in claim 1, characterized in that, In the active mode of the ultrasonic touch controller, the transmitting conductive layer emits the ultrasonic waves, and the receiving conductive layer provides the multiple sensing signals based on the echo of the ultrasonic waves to determine the user's touch position and gesture.

11. An ultrasonic touch controller layout board, characterized in that, The ultrasonic touch controller layout board includes: Multiple ultrasonic touch controllers are arranged in an array, wherein each of the ultrasonic touch controllers includes: substrate; A receiving conductive layer is provided above the substrate, having a plurality of receiving electrodes; A piezoelectric layer, located above the receiving conductive layer, is used to convert pressure into voltage; A conductive emission layer, located above the piezoelectric layer, is used to emit ultrasonic waves; and An acoustic matching layer, located above the transmitting conductive layer, is used to protect the transmitting conductive layer and filter acoustic waves. The plurality of receiving electrodes of the receiving conductive layer generate a plurality of sensing signals based on the echo of the ultrasonic wave and the voltage generated by the piezoelectric layer. The ultrasonic touch controller layout board is cut to form multiple independent ultrasonic touch controllers.

12. The ultrasonic touch controller layout board as described in claim 11, characterized in that, The multiple ultrasonic touch controllers are arranged back to back.

13. The ultrasonic touch controller layout board as described in claim 11, characterized in that, The acoustic matching layers of the multiple ultrasonic touch controllers are each independent.

14. The ultrasonic touch controller layout board as described in claim 11, characterized in that, The ultrasonic touchpads in the same row of the plurality of ultrasonic touchpads share the same acoustic matching layer.

15. The ultrasonic touch controller layout board as described in claim 11, characterized in that, The material of the piezoelectric layer includes polyvinylidene fluoride or a polyvinylidene fluoride-trifluoroethylene copolymer.

16. The ultrasonic touch controller layout board as described in claim 11, characterized in that, The materials of the plurality of receiving electrodes of the receiving conductive layer include silver, silver-plated copper, copper paste, molybdenum, aluminum, nickel, or titanium.

17. The ultrasonic touch controller layout board as described in claim 11, characterized in that, The material of the emitter electrode of the emitter conductive layer includes silver, silver-plated copper, copper paste, molybdenum, aluminum, nickel, or titanium.

18. The ultrasonic touch controller layout board as described in claim 11, characterized in that, The receiving conductive layer also includes multiple traces on the substrate and located on at least one side of the plurality of receiving electrodes.

19. The ultrasonic touch controller layout board as described in claim 11, characterized in that, Each of the ultrasonic touch controllers further includes: A circuit layer, on the substrate and directly below the receiving conductive layer, wherein the circuit layer has multiple traces; and An insulating layer is provided between the circuit layer and the receiving conductive layer, wherein the insulating layer has a plurality of openings for the plurality of traces to connect to the plurality of receiving electrodes.

20. The ultrasonic touch controller layout board as described in claim 11, characterized in that, In the passive mode of the ultrasonic touch controller, the emitting conductive layer stops emitting the ultrasonic waves, and the receiving conductive layer provides the plurality of sensing signals based on the voltage generated by the piezoelectric layer to determine whether the user has touched the ultrasonic touch controller.

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