Granular epoxy, its producing method and granular epoxy resin package
By preparing granular epoxy resin composed of oligomers and using low moisture permeability packaging, the problem of agglomeration of solid epoxy resin during storage and transportation is solved, excellent fluidity and handling convenience are achieved, and costs are reduced.
CN1537877AInactive Publication Date: 2004-10-20MITSUBISHI CHEM CORP
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Patent Information
- Application Number
- CN200410035211.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2003-04-08
- Filing Date
- 2004-04-08
- Publication Date
- 2004-10-20
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
Technical Problem
Solid epoxy resins tend to clump during storage and transportation, making handling difficult, and the clumping problem is exacerbated when molecular weight is reduced to improve flow, making existing solutions more expensive.
Method used
Develop a granular epoxy resin mainly composed of oligomers prepared by the reaction of phenolic compounds and epihalohydrins, refined and pulverized to control molecular weight, ensure low melt viscosity and prevent agglomeration, and adopt low moisture permeability The packaging prevents moisture absorption.
Benefits of technology
It achieves excellent fluidity during molding and resistance to caking during storage and transportation, reducing handling difficulty and cost, while preventing caking through appropriate packaging.
✦ Generated by Eureka AI based on patent content.
Abstract
A granular epoxy resin is made by pulverizing an epoxy resin which is solid at ordinary temperature and can exhibit excellent fluidity during molding because of its low melt viscosity in which the total content of components having a molecular weight of 500 or less among components of n<1>=0 in the following general formula (1) and / or components of n<2>=0 in the following general formula (2) is 50% by mass or more of the entire epoxy resin, or, the total content of components having a molecular weight 400 or less among components of n<1>=0 in the following general formula (1) and / or components of n<2>=0 in the following general formula (2) is 20% by mass or more of the entire epoxy resin. The content of low molecular weight compounds having a molecular weight 200 or less in the granular epoxy resin is 0.3% by mass or less. The granular epoxy resin allows easy handling because it hardly causes blocking during storage and transportation.
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