High-temperature-resistant ceramic thermistor

Abstract

The utility model discloses a high-temperature-resistant ceramic thermistor which comprises a ceramic shell and a chip, the chip is fixed in an inner cavity of the ceramic shell, the ceramic shell is provided with a plurality of through holes, and a plurality of heat-conducting steel sheets are embedded and assembled in the through holes; the upper surface and the lower surface of the chip are provided with heat-conducting fin structures, each heat-conducting fin structure comprises a plurality of wavy heat-conducting fin units, and the heat-conducting fin structures are in touch connection with the ceramic shell and the heat-conducting steel sheets; and the inner cavity of the ceramic shell is filled with a ceramic solidified body, and the ceramic solidified body is tightly extruded on the chip and the heat-conducting fin structure. Compared with the prior art, the high-temperature resistance of the ceramic thermistor is improved, and meanwhile, the thermosensitive accuracy and the heat dissipation performance of the ceramic thermistor are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of thermistors, in particular to a high-temperature resistant ceramic thermistor. Background Art

[0002] Thermistors have been widely used in surge current suppression, temperature measurement, control, temperature compensation, etc. Thermistors are widely used in overcurrent protection and startup of circuits and electronic components, as well as related instruments and application fields for flow velocity, flow rate, and radiation measurement.

[0003] Existing ceramic thermistors generally include a ceramic shell and a thermistor body. The thermistor body is placed inside the ceramic shell and is fixedly assembled with the ceramic shell through high-temperature sintering and connected by thermal conduction. However, the thermistor is in a high-temperature environment when in use. After a long period of use, it is easy to cause chip aging, which affects the life of the thermistor device. In addition, the thermal conductivity of the commonly used ceramic thermistor structure is still low, resulting in delayed onset of the thermistor device and low sensitivity. Utility Model Content

[0004] In view of the deficiencies in the prior art, the purpose of the utility model is to provide a high temperature resistant ceramic thermistor, which retains the high temperature resistance characteristics of the ceramic thermistor and improves its thermal sensitivity, thereby improving the thermal sensitivity accuracy and heat dissipation performance of the thermistor.

[0005] In order to achieve the above-mentioned purpose, the technical solution adopted by the utility model is: a high-temperature resistant ceramic thermistor, including a ceramic shell and a chip, the chip is fixed in the inner cavity of the ceramic shell, the ceramic shell is provided with a plurality of through openings, and a plurality of heat-conducting steel sheets are embedded in the through openings; a heat-conducting sheet structure is provided on the upper and lower surfaces of the chip, the heat-conducting sheet structure includes a plurality of wavy heat-conducting sheet units, and the heat-conducting sheet structure is contact-connected to the ceramic shell and each heat-conducting steel sheet; the inner cavity of the ceramic shell is filled with a ceramic solid body, and the ceramic solid body is tightly pressed against the chip and the heat-conducting sheet structure.

[0006] In a further technical solution, the ceramic shell includes an upper half shell and a lower half shell, and the four corners of the upper half shell and the lower half shell are respectively provided with countersunk holes. The upper half shell and the lower half shell are aligned and covered, and steel nails are inserted between the two countersunk holes aligned up and down. The upper half shell and the lower half shell are connected and assembled by the steel nails.

[0007] In a further technical solution, the heat conducting plate units are stamped into a "V"-shaped bending structure, and the heat conducting plate units are arranged in an interval distribution.

[0008] In a further technical solution, the inner walls of the upper half shell and the lower half shell are formed with two groove structures, and the two groove structures are respectively arranged on the two corresponding inner walls of the upper half shell and the lower half shell. The groove structure includes a plurality of straight grooves, and between two opposite groove structures, the straight grooves are respectively aligned one by one, and the two ends of the heat conducting plate unit are respectively inserted into the corresponding straight grooves.

[0009] In a further technical solution, two through holes are provided on the side of the ceramic shell; the chip is provided with two pins, which are symmetrically arranged, and the pins pass through the through holes of the ceramic shell, and the protruding parts of the pins are stamped to form a bent portion, and the bent portion is arranged in an "S" shape.

[0010] In a further technical solution, the chip includes a glass inner shell, a titanium-tungsten layer, a silver electrode layer and a thermistor body from the outside to the inside.

[0011] In a further technical solution, the thickness of the silver electrode layer is 3 μm-6 μm.

[0012] In a further technical solution, the thickness of the titanium-tungsten layer is 0.1 μm-0.2 μm.

[0013] In a further technical solution, the specific gravity of titanium and tungsten in the titanium-tungsten layer meets the following mass ratio condition: 1:10.

[0014] After adopting the above structure, the utility model has the following advantages compared with the prior art: the utility model provides a high-temperature resistant ceramic thermistor, and by arranging a heat-conducting sheet structure and a heat-conducting steel sheet in a ceramic shell structure, the thermal conductivity of the ceramic thermistor is improved, the high-temperature resistant characteristics of the ceramic thermistor are retained, and at the same time, the thermal sensitivity and thermal sensitivity accuracy of the thermistor are improved; the heat-conducting sheet structure composed of bent heat-conducting sheet units can increase its heat conduction area, thereby increasing the thermocouple sensitivity between the chip and the ceramic shell, thereby further improving the accuracy of the thermistor device; the ceramic shell with a heat-conducting structure can improve the heat dissipation performance of the ceramic thermistor and extend its service life; the chip shell structure composed of a glass inner shell and a titanium-tungsten layer further improves the heat resistance of the thermistor device. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The utility model is further described below in conjunction with the accompanying drawings and embodiments.

[0016] Figure 1 It is a structural schematic diagram of the utility model;

[0017] Figure 2 It is a cutaway schematic diagram of the utility model;

[0018] Figure 3 It is a cross-sectional view of the utility model;

[0019] Figure 4It is a structural schematic diagram of the chip unit of the utility model. DETAILED DESCRIPTION

[0020] The following are only preferred embodiments of the present invention, and do not limit the protection scope of the present invention.

[0021] like Figures 1 to 4 As shown, the utility model provides a high-temperature resistant ceramic thermistor, including a ceramic shell 1 and a chip 4, wherein the chip 4 is fixed in the inner cavity of the ceramic shell 1, and the ceramic shell 1 is provided with a plurality of through openings, wherein the through openings are embedded with a plurality of heat-conducting steel sheets 2; a heat-conducting sheet structure is provided on the upper and lower surfaces of the chip 4, wherein the heat-conducting sheet structure includes a plurality of wavy heat-conducting sheet units 3, and the heat-conducting sheet structure is contact-connected to the ceramic shell 1 and each heat-conducting steel sheet 2; the inner cavity of the ceramic shell 1 is filled with a ceramic solid body 5, and the ceramic solid body 5 is tightly pressed against the chip 4 and the heat-conducting sheet structure. By arranging the heat-conducting sheet structure and the heat-conducting steel sheet 2 in the ceramic shell 1 structure, its thermal conductivity is improved, the high-temperature resistant characteristics of the ceramic thermistor are retained, and at the same time, the thermal sensitivity and thermal sensitivity accuracy of the thermistor are improved; the ceramic shell 1 with a heat-conducting structure can improve the heat dissipation performance of the ceramic thermistor and extend its service life.

[0022] Specifically, the ceramic shell 1 includes an upper half shell 11 and a lower half shell 12. The four corners of the upper half shell 11 and the lower half shell 12 are respectively provided with countersunk holes 10. The upper half shell 11 and the lower half shell 12 are aligned and covered, and steel nails are inserted between the two countersunk holes 10 aligned up and down. The upper half shell 11 and the lower half shell 12 are connected and assembled by the steel nails; the steel nails are fastened and plugged into the countersunk holes 10.

[0023] Specifically, the heat conducting sheet unit 3 is stamped into a "V"-shaped bending structure, and each heat conducting sheet unit 3 is arranged in an interval distribution. The heat conducting sheet structure composed of the bent heat conducting sheet units 3 can increase its heat conduction area, thereby increasing the thermocouple sensitivity between the chip and the ceramic housing 1, thereby further improving the accuracy of the thermistor device. In addition, the upper half shell 11 and the lower half shell 12 have a better heat dissipation effect.

[0024] Specifically, the inner walls of the upper half shell 11 and the lower half shell 12 are formed with two groove structures, and the two groove structures are respectively arranged on the two corresponding inner walls of the upper half shell 11 and the lower half shell 12. The groove structure includes a plurality of linear grooves, and the linear grooves are respectively aligned one by one between two opposite groove structures, and the two ends of the heat conducting plate unit 3 are respectively inserted into the corresponding linear grooves.

[0025] Specifically, the side of the ceramic housing 1 is provided with two through holes; the chip 4 is provided with two pins 9, which are symmetrically arranged, and the pins 9 pass through the through holes of the ceramic housing 1, and the protruding part of the pins 9 is punched to form a bent portion 91, and the bent portion 91 is arranged in an "S" shape. The pins 9 arranged in an "S" shape can improve their plug-in locking effect and improve the assembly stability of the ceramic thermistor device.

[0026] Specifically, the chip 4 includes a glass inner shell 44, a titanium-tungsten layer 43, a silver electrode layer 42 and a thermistor body 41. The chip shell structure composed of the glass inner shell and the titanium-tungsten layer further improves the heat resistance of the thermistor device. The thickness of the silver electrode layer 42 is 5 μm; the thickness of the titanium-tungsten layer 43 is 0.15 μm; the specific gravity of titanium and tungsten in the titanium-tungsten layer 43 meets the following mass ratio condition: 1:10.

[0027] The ceramic thermistor device in this embodiment is respectively inserted into the corresponding heat conducting plate unit 3 through the linear grooves on the inner walls of the upper half shell 11 and the lower half shell 12; then the ceramic solidified body 5 is filled; and the upper half shell 11 and the lower half shell 12 are closed and sintered to make the ceramic solidified body 5 fully fit with the heat conducting plate unit 3 and the chip 4, so that the heat of the chip 4 can be quickly transferred to the ceramic housing 1, achieving a better heat dissipation effect, so that the chip 4 has better heat dissipation and heat resistance, thereby improving the service life of the chip 4.

[0028] The above contents are only preferred embodiments of the present invention. For ordinary technicians in this field, according to the concept of the present invention, there will be changes in the specific implementation methods and application scopes. The contents of this specification should not be understood as limiting the present invention.

Claims

1. A high temperature resistant ceramic thermistor, comprising a ceramic housing (1) and a chip (4), Features: The chip (4) is fixed in the inner cavity of the ceramic shell (1), and the ceramic shell (1) is provided with a plurality of through openings, and a plurality of heat-conducting steel sheets (2) are embedded in the through openings; the upper and lower surfaces of the chip (4) are provided with a heat-conducting sheet structure, and the heat-conducting sheet structure includes a plurality of wavy heat-conducting sheet units (3), and the heat-conducting sheet structure is contact-connected to the ceramic shell (1) and each heat-conducting steel sheet (2); the inner cavity of the ceramic shell (1) is filled with a ceramic solid body (5), and the ceramic solid body (5) is tightly pressed against the chip (4) and the heat-conducting sheet structure.

2. A high temperature resistant ceramic thermistor according to claim 1, Features: The ceramic shell (1) comprises an upper half shell (11) and a lower half shell (12). The four corners of the upper half shell (11) and the lower half shell (12) are respectively provided with countersunk holes (10). The upper half shell (11) and the lower half shell (12) are aligned and covered with each other, and a steel nail is inserted between the two countersunk holes (10) aligned up and down. The upper half shell (11) and the lower half shell (12) are connected and assembled by the steel nails.

3. A high temperature resistant ceramic thermistor according to claim 2, Features: The heat conducting plate units (3) are punched into a "V"-shaped bending structure, and the heat conducting plate units (3) are arranged in an interval distribution.

4. A high temperature resistant ceramic thermistor according to claim 3, Features: The inner side walls of the upper half shell (11) and the lower half shell (12) are formed with two groove structures, which are respectively arranged on the two corresponding inner side walls of the upper half shell (11) and the lower half shell (12), and the groove structure includes a plurality of linear grooves, and the linear grooves are respectively arranged in alignment between two opposite groove structures, and the two ends of the heat conducting plate unit (3) are respectively inserted into the corresponding linear grooves.

5. A high temperature resistant ceramic thermistor according to claim 4, Features: The ceramic housing (1) is provided with two through holes on its side; the chip (4) is provided with two pins (9), the two pins (9) are symmetrically arranged, the pins (9) pass through the through holes of the ceramic housing (1), the protruding parts of the pins (9) are punched to form a bent portion (91), and the bent portion (91) is arranged in an "S" shape.

6. A high temperature resistant ceramic thermistor according to claim 1, Features: The chip (4) comprises, from the outside to the inside, a glass inner shell (44), a titanium-tungsten layer (43), a silver electrode layer (42) and a thermistor body (41).

7. A high temperature resistant ceramic thermistor according to claim 6, Features: The thickness of the silver electrode layer (42) is 3 μm-6 μm.

8. A high temperature resistant ceramic thermistor according to claim 7, Features: The thickness of the titanium-tungsten layer (43) is 0.1 μm-0.2 μm.

9. A high temperature resistant ceramic thermistor according to claim 8, Features: The specific gravity of titanium and tungsten in the titanium-tungsten layer (43) meets the following mass ratio condition: 1:10.

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