Shoe mold heated by heating wire
By using heating wire heating technology in shoe molds, the problems of low heat conduction efficiency and uneven heating in rubber vulcanization machines are solved, rapid and accurate heating is achieved, equipment maintenance costs are reduced, and the quality and production of finished soles are improved. efficiency.
Patent Information
- Application Number
- CN202422800448.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-18
- Publication Date
- 2024-12-27
- Estimated Expiration
- 2034-11-18
AI Technical Summary
During the heating process of existing rubber vulcanization machines, there are problems such as low heat conduction efficiency, uneven heating, safety hazards and high maintenance costs, especially the risks of heat dissipation and leakage of hot plates.
The shoe mold design is designed with heating wire heating. By setting up a wire groove on the mold main body, the heating wire is arranged, and combining the sealing layer and the thermocouple to achieve efficient heating and precise temperature control, reducing heat loss and reducing equipment maintenance costs.
It improves heating efficiency, shortens heating time, reduces electricity consumption and waste of water resources, ensures the accuracy and safety of heating, and reduces product defect rate and equipment maintenance costs.
Smart Images
Figure CN222245650U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of shoe production and processing, in particular to a shoe mold heated by a heating wire. Background Art
[0002] Existing soles are manufactured using rubber vulcanizers, which provide pressure and heat to vulcanize the soles. The three elements of vulcanization are temperature, time, and pressure. The rubber vulcanizer has huge defects in heating the shoe mold and the sole. The rubber vulcanizer uses a heating rod to heat, and transfers the heat to the hot plate through heat conduction. The hot plate then conducts heat to the shoe mold, so that the shoe mold reaches the temperature for vulcanization of the sole, and the shoe mold then heats the material in the mold cavity. This method has the following defects:
[0003] 1. The heat conduction link is too long. The heat needs to pass through the heating rod, hot plate, shoe mold, and sole in sequence, which increases the heat conduction time. Each heat conduction link will produce heat loss, especially the heating of the hot plate. The hot plate has a large area and a large amount of heat from the hot plate is dissipated in the air. The heat loss during heat conduction is huge. Therefore, the heating rod needs to be set at a higher temperature to ensure the temperature of the sole, which not only increases the production cost, but also takes a long time to heat up and has low production efficiency.
[0004] 2. The heating rods are set on the top and bottom of the shoe mold. The heat conduction is only transmitted through the upper and lower surfaces of the shoe mold. There is no hot plate on the side of the shoe mold. The temperature of the side of the shoe mold is lower than that of the upper and lower surfaces of the shoe mold. The side molding force of the formed sole is poor. If the vulcanization time is too long, the sole may crack and become uneven.
[0005] 3. The heating of each position of the sole is uneven. Even for a single surface, the closer the position is to the heating rod, the higher the temperature. The temperature of different positions of the shoe mold is different. For example, the inner core and the bottom surface of the sole are at different distances from the hot plate, resulting in uneven heating and cooling, poor molding ability, and the softness and elasticity of the local part of the sole cannot meet the requirements. The defective rate of the sole is high. Even for the soles of the same batch, the heat conduction is different each time the sole is formed, resulting in different performance of different soles;
[0006] 4. For some special high-end shoes, different parts such as the heel, middle and tip of the shoe need to achieve different performance indicators such as softness and elasticity, which cannot be achieved by controlling the temperature;
[0007] 5. The hot plate on the rubber vulcanizer dissipates heat around, making the temperature around the equipment high, affecting the working environment. If the staff accidentally touches the hot plate, they will get burned, which poses a safety hazard;
[0008] 6. The rubber vulcanizer usually has multiple installation slots on the hot plate, and the heating tube is inserted into the installation slot. The hot plate is thick, and the heating tube needs to be regularly maintained and replaced, which increases the cost;
[0009] 7. The heating tube may leak electricity, which may be a safety hazard;
[0010] 8. After some soles are formed, the molds and hot plates need to be sprayed with water to cool them down. The spraying area is large, which wastes water resources.
[0011] Chinese patent application number: 202220332819.8, discloses a sole forming heating mechanism, which is used in conjunction with a sole forming mold, including an upper heating component arranged at the top of the sole mold and a lower heating component arranged at the bottom of the sole mold, the upper heating component includes a first fixing plate, a lamp tube mounting plate and a mounting frame, a temperature sensor and a lamp tube, the lamp tube mounting plate is provided with a lamp tube mounting groove, the lamp tube is arranged on the lamp tube mounting groove, the first temperature sensor is arranged at the top of the first fixing plate and runs through the top of the mounting frame, the lower heating component includes a driver fixing plate, a wrapping cover, a cover base, an infrared lamp tube and a first lifting driver, the wrapping cover is arranged at the top of the driver fixing plate, the infrared lamp tube is arranged inside the wrapping cover, and the first lifting driver is arranged at the bottom of the driver fixing plate and connected to the cover base. The heating mechanism adopts lamp tube heating, and the heat loss is huge during heat conduction. The lamp tube needs to be set at a higher temperature to ensure the temperature of the sole, which not only increases the production cost, but also takes a long time to heat and has low production efficiency. Utility Model Content
[0012] Therefore, in view of the above problems, the utility model proposes a shoe mold heated by a heating wire, which solves the technical problems of large heat loss and low heating efficiency during the production of the sole.
[0013] In order to achieve the above purpose, the utility model adopts the following technical solutions:
[0014] A shoe mold heated by a heating wire comprises a mold body, wherein the mold body comprises a bottom mold and a top mold, wherein a mold cavity is formed inside the bottom mold and the top mold when the bottom mold and the top mold are combined, wherein the mold body is provided with at least one wire groove, wherein the wire groove is arranged on the outer wall and / or the inner wall of the mold body, wherein a heating wire is arranged in the wire groove, wherein the heating wire is arranged at three locations of the top, side wall and bottom of the mold body or at two of the locations thereof, wherein the heating wire can heat the sole in the mold cavity.
[0015] Further:
[0016] A sealing layer is provided on the wire slot, and the sealing layer seals the heating wire into the wire slot.
[0017] The sealing layer is made of heat-conducting material.
[0018] Each heating wire is connected with a thermocouple, and the thermocouple is completely or partially arranged in the wire slot.
[0019] The minimum distance between each part of the heating wire and the sole is no more than 10 mm.
[0020] The wire trough includes one or two first trough bodies arranged on the bottom mold and / or the top mold, the first trough bodies are arranged in a circuitous manner along the width direction, and the first trough bodies are arranged at the front end, the middle part and the rear end.
[0021] The first slot body comprises a plurality of first detour slots arranged along the width direction, and the distance between the heating wires in two adjacent first detour slots is 5 mm to 20 mm.
[0022] The number of the first trough bodies is two, and the two first trough bodies are respectively arranged at the upper part and the lower part. The first trough bodies form a closed loop structure or the two ends of the first trough bodies extend to the middle part.
[0023] The two first slots are connected, and a heating wire is arranged in the two first slots.
[0024] The wire groove comprises at least one second groove body arranged on the side wall of the mold body, and the second groove body is distributed along the position of the mold cavity and arranged at the front, middle and rear parts of the side wall of the mold body.
[0025] There are at least two second grooves, which extend from the heel along the toe direction and then detour to the heel. At least one second groove extends to the toe, and the length of the upper second groove extending toward the toe direction is greater than the length of the lower second groove extending toward the toe direction.
[0026] The second slot body includes at least two second detour slots, and the distance between the heating wires in two adjacent second detour slots is 5 mm to 20 mm.
[0027] The number of the second grooves is at least two, at least one of the second grooves extends from the heel to the toe and then extends from the other side to the heel, and at least one of the second grooves extends from the heel along the toe direction and then detours to the heel.
[0028] By adopting the above technical solution, the beneficial effects of the utility model are:
[0029] The utility model provides a wire groove on the mold body, and a heating wire is provided in the wire groove. One of the advantages of heating with the heating wire is that it can heat up quickly and can quickly heat up, so that the heating requirement can be achieved in a short time, which can shorten the time by half. The heating wire can directly conduct heat to the shoe mold without passing through a hot plate, and the heat loss is small. The heating temperature of the heating wire is lower than that of the traditional heating temperature, which saves electric energy, and the heating wire has little effect on the temperature of the surrounding air. When part of the sole is formed and taken out, it is only necessary to spray water on the mold body to cool it down. The water spraying area is small, which can save water resources and thus reduce costs. At the same time, during the heating process, the heating wire heating can accurately control the temperature as required to ensure the accuracy of heating and reduce The defective rate of the product is reduced. For special high-end soles, the heating wire can heat different positions at different temperatures, so that different positions of the sole can achieve different performance indicators such as softness and elasticity, thereby improving the quality of the sole; the heating wire is light and not easy to damage, and the equipment does not need to use a heating rod, which not only reduces the weight and volume of the equipment, but also reduces the maintenance cost; further, the sealing layer can seal the heating wire, reduce heat loss, improve the efficiency of heat conduction, and also has a dust-proof effect; further, the sealing layer is a heat-conducting material, and when water is sprayed to cool down, the heating wire can be cooled through the sealing layer; further, the thermocouple can monitor the temperature of each heating wire in real time, and the control system can The temperature is automatically adjusted, and the thermocouple is completely or partially arranged in the wire groove. The temperature measurement is not affected by the outside air, and the measurement is more accurate; further, the minimum distance between each part of the heating wire and the sole is not more than 10mm, which can improve the heating effect; further, the first trough body is arranged at the front end, the middle and the rear end, and the first trough body is arranged in a circuitous manner, which can reduce the number of heating wires. At the same time, the heating wires can be evenly arranged on the bottom mold to improve the heating effect; further, the heating wire distance of the first circuitous groove is set in the range of 5mm to 20mm, which can better accurately control the temperature; further, the two first trough bodies are respectively arranged at the upper and lower parts, and the connection terminals of the two heating wires or one heating wire can be concentrated in the middle or its An external power supply is connected to another position for easy installation and maintenance; further, the second trough body is distributed along the position of the mold cavity, which can reduce the length of the heating wire, reduce the manufacturing cost and heating cost of the mold body, and improve the heating and cooling efficiency. The second trough body is arranged at the front, middle and rear parts, and can accurately heat the circumference of the entire sole; further, since the heel of the sole is often higher than the toe, the height of the mold cavity is also changed, and the second trough body is arranged in a circuitous manner. This arrangement method can be arranged according to the mold cavity, thereby minimizing the length of the heating wire; further, the heating wire distance of the second detour groove is set in the range of 5mm to 20mm, which can better and more accurately control the temperature. BRIEF DESCRIPTION OF THE DRAWINGS
[0030] Figure 1 It is a structural diagram of the mold body.
[0031] Figure 2 It is a structural diagram of the mold body from another angle.
[0032] Figure 3 It is the main view of the mold body.
[0033] Figure 4 It is a partial cross-sectional view of the heating wire.
[0034] Figure 5 It is a partial cross-sectional view of a thermocouple.
[0035] Figure 6 It is a top view of the top mold.
[0036] Figure 7 This is the bottom view of the base mold.
[0037] Figure 8 It is a structural diagram of the bottom mold.
[0038] Fig. 9 It is a side view of the base mold.
[0039] Fig.10 It is a structural schematic diagram of an embodiment of the second wire trough.
[0040] Fig.11 It is a structural schematic diagram of another embodiment of the second wire trough.
[0041] Fig.12 yes Fig.11 A schematic diagram of the structure from another angle.
[0042] Fig.13 It is a schematic diagram of the structure in which two first line slots are connected.
[0043] Fig.14 It is a schematic diagram of the structure in which the first wire groove is spiral.
[0044] Fig.15 It is a structural schematic diagram of another embodiment of the first wire trough.
[0045] Reference numerals:
[0046] 1. Mold body; 10. Mold cavity; 11. Bottom mold; 12. Top mold; 13. Wire groove; 131. First groove body; 1310. First detour groove; 132. Second groove body; 1320. Second detour groove; 14. Heating wire; 15. Sealing layer; 16. Thermocouple; 17. Top; 18. Side wall; 19. Bottom. DETAILED DESCRIPTION
[0047] The utility model is now further described in conjunction with the accompanying drawings and specific implementation methods.
[0048] refer to Figures 1 to 9The present embodiment provides a shoe mold heated by a heating wire 14, including a mold body 1, the mold body 1 including a bottom mold 11 and a top mold 12, the bottom mold 11 and the top mold 12 are molded together to form a mold cavity 10, the bottom mold 11 opens upward, the side wall 18 of the mold body 1 is arranged on the bottom mold 11, the mold body 1 is provided with a plurality of wire grooves 13, the wire grooves 13 are arranged on the outer wall of the mold body 1, and heating wires 14 are arranged in the wire grooves 13, the heating wires 14 are arranged on the top 17, the side wall 18, and the bottom 19 of the mold body 1, and the plurality of heating wires 14 can be set to the same or different temperatures to accurately heat the sole in the mold cavity 10. A sealing layer 15 is provided on the wire groove 13, and the sealing layer 15 seals the heating wire 14 into the wire groove 13, and the sealing layer 15 is a heat-conducting material. A thermocouple 16 is connected to each heating wire 14, and all the thermocouples 16 are arranged in the wire groove 13.
[0049] refer to Figure 6 and Figure 7 The wire slot 13 includes a first slot body 131 provided in the bottom mold 11 and the top mold 12. The bottom mold 11 and the top mold 12 are respectively provided with two first slot bodies 131, and the two first slot bodies 131 are respectively provided in the upper part and the lower part. The first slot body 131 is arranged in a circuitous manner along the width direction, and the two ends of the first slot body 131 extend to the middle part. The first slot body 131 is arranged at the front end, the middle part and the rear end. The first slot body 131 includes a plurality of first circuitous slots 1310 arranged in the width direction, and the distance between the heating wires 14 in two adjacent first circuitous slots 1310 is 5 mm to 20 mm.
[0050] refer to Figure 8 and Fig. 9 The wire groove 13 includes a plurality of second groove bodies 132 arranged on the side wall 18 of the mold body 1. The second groove bodies 132 are arranged at the front, middle and rear of the side wall 18 of the mold body 1 along the position of the mold cavity 10. The second groove bodies 132 extend from the heel of the shoe along the direction of the toe and then detour to the heel of the shoe. At least one second groove body 132 extends to the toe. The length of the upper second groove body 132 extending in the direction of the toe is greater than the length of the lower second groove body 132 extending in the direction of the toe. The second groove body 132 includes at least two second detour grooves 1320. The distance between the heating wires 14 in two adjacent second detour grooves 1320 is 5 mm to 20 mm.
[0051] The number of the wire slots 13 may be one, and all the wire slots 13 are connected; the number of the wire slots 13 may be two, three or even more, depending on the specific situation.
[0052] The thermocouple 16 can be replaced by a thermistor or other temperature detection device, which is a well-known device and will not be described in detail here. Figure 5The above-mentioned thermocouple 16 is usually arranged at the end of the wire slot 13, which is convenient for wiring. In one embodiment, the above-mentioned thermocouple 16 may not be arranged in the wire slot 13. In this structure, the accuracy of detecting temperature is relatively low. In another embodiment, the above-mentioned thermocouple 16 may not be arranged.
[0053] In one embodiment, the heating wire 14 is only arranged on the top 17 and the bottom 19 of the mold body 1, and is not arranged on the side wall 18 of the mold body 1; in another embodiment, the heating wire 14 is arranged on the top 17 and the side wall 18 of the mold body 1, and is not arranged on the bottom 19 of the mold body 1; in another embodiment, the heating wire 14 is arranged on the bottom 19 and the side wall 18 of the mold body 1, and is not arranged on the top 17 of the mold body 1.
[0054] The sealing layer 15 is made of aluminum, iron, heat-conducting plastic or other heat-conducting materials, and can be sealed in the wire groove 13 by high-temperature melting; in another embodiment, the sealing layer 15 can also be made of wood material or other non-heat-conducting materials. This structure of the sealing layer 15 is not heat-conducting and is usually used for soles that do not need to be cooled with water, such as soles made of RB materials; in another embodiment, the sealing layer 15 can also be set with one, two or more materials, and some of the sealing layers 15 can conduct heat, while some of the sealing layers 15 cannot conduct heat. In another embodiment, the sealing layer 15 may not be set.
[0055] The above-mentioned wire groove 13 can also be arranged on the inner wall of the mold body 1. This structure has higher requirements for sealing the heating wire 14. The sealing layer 15 may have to be made into a pattern corresponding to the pattern of the sole. The production cost of the mold body 1 is high. At the same time, for some soles that need to be cooled, such as EVA soles, it is not conducive to water cooling, and it is also inconvenient to replace and maintain the wire groove 13. In another embodiment, a part of the wire groove 13 is arranged on the inner wall of the mold body 1, and the other part of the wire groove 13 is arranged on the outer wall of the mold body 1.
[0056] The minimum distance between each part of the heating wire 14 and the sole is usually set to no more than 10mm, such as 5mm, 6mm, 8mm, 10mm, etc. This structure has a better heating effect; it can also be set to be greater than 10mm, such as 11mm, 12mm, etc. The farther the distance, the worse the heating effect.
[0057] The side wall 18 of the above-mentioned mold body 1 is usually only arranged on the bottom mold 11. In one embodiment, the side wall 18 of the above-mentioned mold body 1 can also be arranged on the bottom mold 11 and the top mold 12, that is, the second trough body 132 is arranged on the bottom mold 11 and also on the top mold 12; in another embodiment, the side wall 18 of the above-mentioned mold body 1 can also be only arranged on the top mold 12.
[0058] The number of the first slot 131 and the corresponding heating wire 14 can be one, two, three or even more. Fig.13 The first groove 131 of the bottom mold 11 or the top mold 12 and the heating wire 14 may each have only one. Figure 7 The two first slots 131 are connected, and only one first slot 131 is arranged in a circuitous manner along the width direction of the entire bottom mold 11 or the top mold 12; in another embodiment, the number of the above-mentioned first slots 131 is three, and the three first slots 131 are arranged in a circuitous manner at the front, middle, and top 17 respectively; in another embodiment, the above-mentioned first slot 131 can also be connected to the second slot 132, and a heating wire 14 extends from the first slot 131 to the second slot 132. In another embodiment, as Fig.14 The first slot body 131 can also be configured as one, wherein the first slot body 131 is configured in a spiral structure along the length direction. In this structure, the head and tail connection of the first slot body 131 is relatively inconvenient; in another embodiment, as Fig.15 The first groove body 131 may also be provided in a plurality, and the plurality of first groove bodies 131 are arranged in a spiral structure on the mold body 1; the first groove body 131 may also adopt a line segment, an arc, a spiral or other structures.
[0059] The structures of the first wire grooves 13 of the bottom mold 11 and the top mold 12 may also be set differently, depending on the specific situation.
[0060] The distance between two adjacent first detour grooves 1310 is usually set to 5mm to 10mm, such as 6mm, 8mm, etc.; it can also be greater than 5mm or less than 10mm, such as 3mm, 12mm, 15mm, 18mm, etc., depending on the specific situation.
[0061] The distance between two adjacent second detour grooves 1320 is usually set to 5mm to 10mm, such as 6mm, 8mm, etc.; it can also be greater than 5mm or less than 10mm, such as 3mm, 12mm, 15mm, 18mm, etc., depending on the specific situation.
[0062] The number of the second slot body 132 may also be one, and the plurality of second slot bodies 132 are connected end to end.
[0063] The above-mentioned second groove body 132 is usually set according to the position of the mold cavity 10, which can minimize the length of the heating wire 14 and the second groove body 132; in one embodiment, the second groove body 132 may not be distributed along the position of the mold cavity 10, that is, the second groove body 132 may be set on the side wall 18 where there is no mold cavity 10, or the second groove body 132 is not set on the side wall 18 corresponding to the mold cavity 10.
[0064] The second slot 132 may also be configured as a line segment, an arc, multiple circuitous configurations or other structures. Fig.10 The second grooves 132 may also be two, and the two second grooves 132 are respectively arranged on both sides of the mold body 1, and the second grooves 132 are arranged on the side wall 18 of the mold body 1 for multiple circuitous arrangements; in another embodiment, Fig.10 The two second slots 132 are connected, and only one heating wire 14 is used; in another embodiment, Fig.11 and Fig.12 The two second grooves 132 of the top 17 extend from the heel to the toe and then extend from the other side to the heel. The other two second grooves 132 are respectively arranged at the two side walls 18 in a circuitous manner; the above-mentioned second grooves 132 can also adopt line segments, arcs or other structures.
[0065] The working mode of the utility model is:
[0066] When manufacturing the sole, the production device opens the top mold 12 and the bottom mold 11, applies the raw material into the mold cavity 10, and closes the top mold 12 and the bottom mold 11. The external power source heats the heating wire 14, and the heating wire 14 can heat up quickly. The heating wire 14 conducts heat to the mold body 1, and the mold body 1 heats the raw material in the mold cavity 10. During the heating process, the thermocouple 16 can detect the temperature of the heating wire 14 in real time and adjust the temperature of the heating wire 14 in real time. For example, when the temperature of the heating wire 14 is greater than 200 degrees, the heating wire 14 stops heating, and when the temperature of the heating wire 14 is less than 160 degrees, the heating wire 14 heats, which can achieve precise temperature control; after a period of time, the sole in the mold cavity 10 is formed, and the mold body 1 is cooled by cooling water. The production device opens the top mold 12 and the bottom mold 11, takes out the sole, and carries out the next round of sole production.
[0067] Although the present invention has been specifically demonstrated and described in conjunction with the preferred embodiments, those skilled in the art should understand that various changes may be made to the present invention in form and detail without departing from the spirit and scope of the present invention as defined in the appended claims, all of which are within the scope of protection of the present invention.
Claims
1. A shoe mold heated by a heating wire, characterized in that: The mold body comprises a mold body, wherein the mold body comprises a bottom mold and a top mold, wherein a mold cavity is formed inside the bottom mold and the top mold when the bottom mold and the top mold are combined, wherein at least one wire groove is provided on the mold body, wherein the wire groove is provided on the outer wall and / or the inner wall of the mold body, wherein a heating wire is arranged in the wire groove, wherein the heating wire is arranged at three locations of the top, side wall and bottom of the mold body or at two of the locations thereof, wherein the heating wire can heat the sole in the mold cavity.
2. A shoe mold heated by a heating wire according to claim 1, characterized in that: A sealing layer is provided on the wire slot, and the sealing layer seals the heating wire into the wire slot.
3. A shoe mold heated by a heating wire according to claim 2, characterized in that: The sealing layer is made of heat-conducting material.
4. The shoe mold heated by a heating wire according to claim 1, characterized in that: Each heating wire is connected with a thermocouple, and the thermocouple is completely or partially arranged in the wire slot.
5. The shoe mold heated by a heating wire according to claim 1, characterized in that: The minimum distance between each part of the heating wire and the sole is no more than 10 mm.
6. The shoe mold heated by a heating wire according to claim 1, characterized in that: The wire trough includes at least one first trough body arranged on the bottom mold and / or the top mold, the first trough body is arranged in a circuitous manner along the width direction, and the first trough body is arranged at the front end, the middle part and the rear end.
7. A shoe mold heated by a heating wire according to claim 6, characterized in that: The first slot body comprises a plurality of first detour slots arranged along the width direction, and the distance between the heating wires in two adjacent first detour slots is 5 mm to 20 mm.
8. The shoe mold heated by a heating wire according to claim 6, characterized in that: The number of the first trough bodies is two, and the two first trough bodies are respectively arranged at the upper part and the lower part. The first trough bodies form a closed loop structure or the two ends of the first trough bodies extend to the middle part.
9. The shoe mold heated by a heating wire according to claim 8, characterized in that: The two first slots are connected, and a heating wire is arranged in the two first slots.
10. A shoe mold heated by a heating wire according to any one of claims 1 to 9, characterized in that: The wire groove comprises at least one second groove body arranged on the side wall of the mold body, and the second groove body is distributed along the position of the mold cavity and arranged at the front, middle and rear parts of the side wall of the mold body.
11. The shoe mold heated by a heating wire according to claim 10, characterized in that: There are at least two second grooves, which extend from the heel along the toe direction and then detour to the heel. At least one second groove extends to the toe, and the length of the upper second groove extending toward the toe direction is greater than the length of the lower second groove extending toward the toe direction.
12. A shoe mold heated by a heating wire according to claim 11, characterized in that: The second slot body includes at least two second detour slots, and the distance between the heating wires in two adjacent second detour slots is 5 mm to 20 mm.
13. The shoe mold heated by a heating wire according to claim 10, characterized in that: The number of the second grooves is at least two, at least one of the second grooves extends from the heel to the toe and then extends from the other side to the heel, and at least one of the second grooves extends from the heel along the toe direction and then detours to the heel.