High-density distribution frame

Abstract

The utility model discloses a high density distribution frame, which comprises a frame body and a plurality of supporting plates, a plurality of groups of interface units are arranged on the frame body, each interface unit comprises a plurality of interfaces, module seats are assembled in the interfaces, a plurality of data modules are assembled on the module seats, and the supporting plates are in one-to-one correspondence with the interface units. The supporting plate comprises a first part and a second part which are arranged in parallel, the first part is close to the frame body, the second part is far away from the frame body, the second part is located above the first part, the data module is erected on a circuit board, the circuit board is erected on the first part through a supporting plate, and the supporting plate is arranged on the first part. And one end, far away from the frame body, of the circuit board is erected on the second part. Through the arrangement of the supporting plate, the circuit board can be effectively prevented from deforming, the PINs are prevented from abutting against the supporting plate, and the problem of short circuit of the circuit board is effectively solved.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated wiring, in particular to a high-density distribution frame. Background Art

[0002] The patch panel is a modular device used to assemble data modules to manage the front-end information points at the local end and manage the wiring. With the increase of front-end information points, a large number of data modules are needed, so multi-layer high-density patch panels have emerged. However, the circuit boards in the multi-layer high-density patch panels currently in use often short-circuit. The reason is that the circuit boards are prone to deformation, causing the PIN pins on the data module to abut against the pallet. Summary of the invention

[0003] In order to solve the above-mentioned deficiencies in the prior art, the purpose of the utility model is to provide a high-density distribution frame that prevents short circuits.

[0004] In order to achieve the above-mentioned purpose, the utility model is designed to provide a high-density distribution frame, including a frame and a plurality of pallets, the frame is provided with a plurality of groups of interface units, the interface unit includes a plurality of interfaces, the interface is equipped with a module seat, the module seat is equipped with a plurality of data modules, the pallet corresponds to the interface unit one by one, the pallet includes a first part and a second part which are arranged in parallel, the first part is close to the frame, the second part is far away from the frame, the second part is located above the first part, the data module is mounted on a circuit board, the circuit board is mounted on the first part through a support plate, and the circuit board is mounted on the second part at one end away from the frame.

[0005] Furthermore, a plurality of support columns are provided between adjacent support plates.

[0006] Furthermore, the circuit boards correspond to the interfaces one by one, and the support columns are arranged between adjacent circuit boards.

[0007] Furthermore, the support plate is made of non-conductive material.

[0008] Furthermore, the circuit board is fixedly connected to the second part by screws.

[0009] Furthermore, a wire clip is provided between the screw and the circuit board.

[0010] Furthermore, the wire clamp is electroplated with shielding material or the wire clamp is made of stainless steel.

[0011] Furthermore, the support plate is connected with a ground wire.

[0012] Furthermore, a winding portion is provided at one end of the support plate away from the frame.

[0013] Furthermore, the support plate is also provided with a cover plate.

[0014] Compared with the prior art, the beneficial effect of the utility model is that through the setting of the support plate, the circuit board can be effectively prevented from being deformed, the PIN needles can be prevented from abutting against the support plate, and the short circuit problem of the circuit board can be effectively solved. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the structure of a high-density distribution frame according to an embodiment of the present application.

[0016] Figure 2 yes Figure 1 A schematic diagram of the structure from another angle.

[0017] Figure 3 yes Figure 2 Schematic diagram of the structure after removing the cover.

[0018] Figure 4 yes Figure 3 Schematic diagram of the structure after removing the frame and the support plate connected to the frame.

[0019] Figure 5 yes Figure 4 A schematic diagram of the structure from another angle.

[0020] Figure 6 It is a schematic diagram of the partial structure of a high-density distribution frame according to an embodiment of the present application.

[0021] Figure 7 It is a structural schematic diagram of a frame and a support plate connected to the frame. DETAILED DESCRIPTION

[0022] The utility model is further described below in conjunction with the accompanying drawings and embodiments.

[0023] like Figures 1 to 7 As shown, a high-density distribution frame includes a frame body 1 and a plurality of trays 2, the frame body 1 is provided with a plurality of groups of interface units 3, the interface units include a plurality of interfaces 4, the interfaces 4 are equipped with module seats 5, the module seats 5 are equipped with a plurality of data modules 6, the trays 2 correspond to the interface units 3 one by one, the trays 2 and the interface units 3 are distributed in the vertical direction, and the tray 2 located at the bottom is connected to the frame body 1.

[0024] In this embodiment, the support plates 2 are a pair, the support plate 2 located at the bottom is integrally formed with the frame 1, and side plates 7 are provided on both sides of the support plate 2. The support plates 2 are vertically arranged with the frame 1, and the side plates 7 are used to support the support plate 2 located at the top.

[0025] The support plate 2 includes a first part 8 and a second part 9 arranged in parallel, the first part 8 is close to the frame 1, the second part 9 is far away from the frame 1, and the second part 9 is located above the first part 8. The data module 6 is mounted on the circuit board 10, and most of the circuit board 10 is mounted on the first part 8 through a support plate 11, and the circuit board 10 is mounted on the second part 9 at one end away from the frame 1.

[0026] The support plate 2 is made of metal, preferably iron, and the support plate 11 is made of non-conductive material, preferably plastic.

[0027] The circuit board 10 is mounted on the support plate 11 made of plastic material. The circuit board 10 is not easily deformed, which can effectively prevent the PIN needle from contacting the support plate 2 and effectively solve the short circuit problem of the circuit board 10 .

[0028] The circuit boards 10 correspond to the interfaces 4 one by one, that is, the number of the circuit boards 10 mounted on the tray 2 is the same as the number of interfaces 4 corresponding to the tray 2 .

[0029] A plurality of support columns 12 are provided between adjacent support plates 2. In this embodiment, both ends of the support columns 12 are respectively perpendicular to the adjacent first portions 8, and the support columns 12 are provided between adjacent circuit boards 10. The support columns 12 provide support for the support plates 2.

[0030] In this embodiment, the circuit board 10 is fixedly connected to the second part 9 by screws 13 , and a wire clamp 14 is provided between the screws 13 and the circuit board 10 . The wire clamp 14 is used to pass a network cable connected to the data module 6 .

[0031] The wire clamp 14 is electroplated with shielding material or is made of stainless steel, so that the high-density distribution frame has a shielding effect and ensures the signal transmission effect of the high-density distribution.

[0032] The support plate 2 is connected with a grounding wire 15 and a shielding screw 16, and the grounding wire 15 is connected to the support plate 2 via the shielding screw 16. Such an arrangement further improves the shielding effect and signal transmission effect of the high-density distribution frame.

[0033] In this embodiment, a wire winding portion 17 is disposed at one end of the support plate 2 away from the frame 1 .

[0034] The support plate 2 is also covered with a cover plate 18, and the two sides of the cover plate 18 are in contact with the side plates 7, and fastening screws 19 are fixed between the cover plate 18 and the side plates 7, and the fastening screws 19 pass through the cover plate 18 and the support plate 2 located above accordingly. Through the arrangement of the cover plate 18, not only can the circuit board 10 have a certain dustproof and waterproof effect, but also the support plate 2 and the frame 1 can be effectively fixed.

[0035] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

Claims

1. A high-density patch panel, comprising a frame and a plurality of support plates, wherein the frame is provided with a plurality of groups of interface units, wherein the interface units include a plurality of interfaces, wherein module seats are installed in the interfaces, wherein a plurality of data modules are installed on the module seats, wherein the support plates correspond to the interface units one by one, and wherein: The support plate includes a first part and a second part which are arranged in parallel, wherein the first part is close to the frame, the second part is far away from the frame, and the second part is located above the first part. The data module is mounted on a circuit board, and the circuit board is mounted on the first part through a support plate, and one end of the circuit board away from the frame is mounted on the second part.

2. The high-density distribution frame according to claim 1, characterized in that: A plurality of support columns are arranged between adjacent support plates.

3. The high-density distribution frame according to claim 2, characterized in that: The circuit boards correspond to the interfaces one by one, and the support columns are arranged between adjacent circuit boards.

4. The high-density distribution frame according to claim 1, characterized in that: The support plate is made of non-conductive material.

5. The high-density distribution frame according to claim 1, characterized in that: The circuit board is fixedly connected to the second part by screws.

6. The high-density distribution frame according to claim 5, characterized in that: A wire clip is also provided between the screw and the circuit board.

7. The high-density distribution frame according to claim 6, characterized in that: The wire clamp is electroplated with shielding material or is made of stainless steel.

8. The high-density distribution frame according to claim 1, characterized in that: The supporting plate is connected with a grounding wire.

9. The high-density distribution frame according to claim 1, characterized in that: The support plate is provided with a winding portion at one end away from the frame body.

10. The high-density distribution frame according to claim 1, characterized in that: The support plate is also provided with a cover plate.

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