High-temperature heating buffer feeding device of semiconductor device sorting machine
By designing the high-temperature heating buffer feeding device of semiconductor device sorter, the reciprocating and translational movement of the movable seat body and the heating chamber is used to solve the problem that existing equipment cannot realize continuous feeding of feed tracks and discharge tracks, and improve the high-temperature environment. Semiconductor device cache and feed efficiency.
Patent Information
- Application Number
- CN202323163381.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-11-23
- Publication Date
- 2025-01-07
- Estimated Expiration
- 2033-11-23
AI Technical Summary
Existing high-temperature detection equipment for semiconductor devices cannot realize continuous feeding between feed tracks and discharge tracks, resulting in inefficiency.
A high-temperature heating buffer feeding device of semiconductor device sorter is designed, including a movable seat body and a heating bin arranged in a transverse direction. The blanking slide has an inlet and an outlet, and the reciprocating translation movement is achieved through the switch gate and the drive assembly to ensure that Semiconductor devices can be cached into the heating chamber and output to the discharge track under high temperature environment.
Through the reciprocating and translating movement of the movable seat body, the buffering and feeding of semiconductor devices in a high-temperature environment is achieved, and the amount of high-temperature heating materials and feeding efficiency are improved.
Smart Images
Figure CN222306511U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to a high-temperature heating buffer feeding device for a semiconductor device sorting machine. Background Art
[0002] The reliability of semiconductor devices in high temperature environments is a matter of great concern to manufacturers and users. In the prior art, the commonly used test temperature range for high temperature testing is 100°C to 300°C. Usually, a constant temperature furnace or oven is used to place the components in it and set a certain high temperature. After the set time is reached, the electrical performance of the components is tested. This test is of great significance to the research and development, production and use of semiconductor components.
[0003] The prior art has the following shortcomings: the equipment used for high-temperature storage of semiconductor devices is relatively independent and does not have the function of "connecting the upper and lower parts", that is, it cannot be connected to the feed track of the semiconductor devices, nor can it be connected to the discharge track of the semiconductor devices, resulting in difficulty in feeding the semiconductor devices between the feed track and the discharge track and low efficiency. Utility Model Content
[0004] In view of the deficiencies in the prior art, the technical problem to be solved by the utility model is to provide a high-temperature heating buffer feeding device for a semiconductor device sorting machine.
[0005] In order to solve the above technical problems, the technical solution of the utility model is: a high-temperature heating buffer feeding device for a semiconductor device sorting machine, comprising a frame, on which is provided a movable seat body driven by a driving mechanism to perform lateral reciprocating translational motion, on which is fixedly connected a plurality of laterally arranged heating bins, inside of which are provided vertical blanking chutes, the blanking chutes have an inlet at the top and an outlet at the bottom, and switch gates are provided on the inlet and outlet.
[0006] Preferably, the cross-sectional shape of the drop slide is adapted to the outer contour shape of the semiconductor device in a falling posture.
[0007] Preferably, heating pipes are embedded in the heating bin on the back side of the blanking chute, and the heating pipes are vertically arranged along the length direction of the blanking chute.
[0008] Preferably, the switch gates include horizontally arranged gate plates, and gate holes are provided at the top and bottom of the heating bin. The top gate plates are horizontally passed through the gate holes and enter the blanking chute to open and close the entrance, and the bottom gate plates are horizontally passed through the gate holes and enter the blanking chute to open and close the exit.
[0009] Preferably, an upper driving assembly for driving the opening and closing gate of the entrance and a lower driving assembly for driving the opening and closing gate of the exit are fixedly connected to the frame beside the movable seat body. The upper driving assembly and the lower driving assembly are laterally staggered to correspond to two adjacent heating chambers at the same time.
[0010] Preferably, the upper drive assembly and the lower drive assembly both include a gate cylinder fixedly connected to the frame, the piston rod ends of the gate cylinder are fixedly connected to an adapter frame, and an axially vertical roller is installed on the adapter frame; the gate plate is fixedly connected to an adapter block, and the adapter block passes through a guide rod fixedly connected to the side of the gate hole, and the front end of the guide rod is fixedly connected to a limit block, and a spring is sleeved on the guide rod between the limit block and the adapter block, and the adapter block is fixed with a top connection block for translation with the movable seat body to the corresponding roller, and the top connection block is located on the front side of the roller.
[0011] Compared with the prior art, the utility model has the following beneficial effects: the high-temperature heating buffer feeding device of the semiconductor device sorting machine is provided with a movable seat body, and a plurality of laterally arranged heating bins are fixedly connected to the movable seat body, and vertical blanking slides are provided inside the heating bins, and the blanking slides have an inlet at the top and an outlet at the bottom, and switch gates are provided on the inlet and the outlet.
[0012] When the movable seat is located between the feed track and the discharge track of the semiconductor device, the top entrance of the heating bin can be aligned with the feed track in turn through the reciprocating translational motion control of the movable seat, and the semiconductor devices can be cached in all the heating bins to achieve caching in a high temperature environment; when the semiconductor devices inside the heating bin reach the set heating temperature for the set time, the bottom exit of the heating bin can be aligned with the discharge track in turn through the reciprocating translational motion control of the movable seat, and the semiconductor devices can be output to the discharge track for subsequent electrical performance testing, which can greatly improve the cached heating material amount and feeding efficiency.
[0013] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific implementation methods. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 It is a schematic diagram of the structure of an embodiment of the utility model.
[0015] Figure 2 Schematic diagram of the structure of the feed track.
[0016] Figure 3 Schematic diagram of the structure of several heating chambers.
[0017] Figure 4 for Figure 3 Schematic diagram of the local structure.
[0018] Figure 5Schematic diagram of the structure of the entrance switch gate.
[0019] Figure 6 This is a schematic diagram of the structure of the exit switch gate. DETAILED DESCRIPTION
[0020] The utility model is further described below in conjunction with the accompanying drawings and embodiments.
[0021] It should be noted that the following detailed descriptions are exemplary and are intended to provide further explanation of the present application. Unless otherwise specified, all technical and scientific terms used herein have the same meanings as those commonly understood by those skilled in the art to which the present application belongs.
[0022] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.
[0023] like Figures 1 to 6 As shown, this embodiment provides a high-temperature heating buffer feeding device for a semiconductor device sorting machine, including a frame A1, on which is disposed a movable seat body A2 which is driven by a driving mechanism to perform lateral reciprocating translational motion, on which is fixedly connected a plurality of laterally arranged heating bins A3, inside of which are disposed vertical blanking chutes A4, the top of which are provided with an inlet A5, the bottom of which are provided with an outlet A6, and both the inlet and the outlet are provided with a switch gate A7.
[0024] In the embodiment of the present invention, the cross-sectional shape of the drop slide is adapted to the outer contour shape of the semiconductor device A8 in a falling posture.
[0025] In the embodiment of the utility model, heating pipes A9 are embedded in the back of the blanking chute inside the heating bin, and the heating pipes are vertically arranged along the length direction of the blanking chute.
[0026] In the embodiment of the utility model, the switch gate includes a horizontally arranged gate plate A10, and the top and bottom of the heating bin are provided with gate holes A11. The top gate plates are horizontally passed through the gate holes and enter the blanking chute to open and close the entrance, and the bottom gate plates are horizontally passed through the gate holes and enter the blanking chute to open and close the exit.
[0027] In an embodiment of the utility model, an upper driving component A12 for driving the opening and closing gate of the entrance and a lower driving component A13 for driving the opening and closing gate of the exit are fixedly connected to the frame beside the movable seat body. The upper driving component and the lower driving component are laterally staggered to correspond to two adjacent heating chambers at the same time.
[0028] In the embodiment of the utility model, the upper driving assembly and the lower driving assembly both include a gate cylinder A14 fixedly connected to the frame, the piston rod end of the gate cylinder is fixedly connected to an adapter frame A15, and an axially vertical roller A16 is installed on the adapter frame; an adapter block A17 is fixedly connected to the gate plate, and the adapter block passes through a guide rod A18 fixedly connected to the side of the gate hole, and the front end of the guide rod is fixedly connected to a limit block A19, and a spring A20 is sleeved on the guide rod between the limit block and the adapter block, and the adapter block is fixed with a top connection block A21 for translation with the movable seat body to the corresponding roller, and the top connection block is located on the front side of the roller.
[0029] In an embodiment of the utility model, a vertical feed track A22 is fixedly connected to the top side of the movable seat body on the frame, and a vertical discharge track A23 is fixedly connected to the bottom side of the movable seat body on the frame. The cross-sectional shapes of the feed track and the internal drop slides of the discharge track are adapted to the outer contour shape of the semiconductor device in a falling posture, and the feed track vertically corresponds to the upper drive assembly, and the discharge track vertically corresponds to the lower drive assembly.
[0030] In the embodiment of the utility model, a pneumatic feed finger A24 is fixedly connected to the side frame at the bottom end of the feed track, and an adapter frame A25 is respectively fixedly connected to the two clamping jaws of the pneumatic feed finger, one of which is fixedly connected to a pressing handle A26 located at the top, and the other is fixedly connected to a stopper A27 located at the bottom. A vertical clearance groove A28 is provided on the front side wall of the bottom end of the feed track, and the pressing handle and the stopper are aligned with the clearance groove so as to enter the internal blanking slide through the clearance groove.
[0031] In the embodiment of the utility model, the driving mechanism can be driven by a ball screw pair, a synchronous belt, a pneumatic cylinder, an oil cylinder, an electric push rod, etc., which belongs to the prior art and will not be elaborated in detail here.
[0032] In the embodiment of the utility model, the working principle of the high temperature heating buffer feeding device of the semiconductor device sorting machine is:
[0033] S1: The semiconductor devices are stacked vertically inside the feed track, and the stopper passes through the clearance groove and blocks the bottom semiconductor device, and the pressing handle is not pressed down yet;
[0034] S2: The movable seat body moves horizontally toward the feeding track, so that the top entrance of the first heating chamber is aligned with the bottom of the feeding track. At the same time, the top connection block of the entrance of the first heating chamber reaches the front side of the roller;
[0035] S3: The piston rod of the upper driving assembly retracts, and the top block of the roller top-connecting entrance opens the gate of the first heating chamber entrance. The feeding pneumatic finger moves the block gradually outward, and the pressing handle gradually moves inward. The pressing handle presses the upper semiconductor device on the feeding track, and the semiconductor device at the bottom of the feeding track falls into the heating chamber without being blocked. During the falling process, the feeding pneumatic finger moves at the same time to move the block gradually inward, and the pressing handle gradually moves outward. The falling of the previously pressed semiconductor device is blocked by the block; the feeding pneumatic finger repeats the above actions until the first heating chamber is full, the piston rod of the upper driving assembly extends, and the gate of the first heating chamber entrance is closed under the action of the spring;
[0036] S4: the movable seat gradually moves toward the feeding track, and the second heating bin, the third heating bin, the fourth heating bin, ... the Nth heating bin are filled with the same action as in step S3;
[0037] S5: When the heating chamber is full, the movable seat body moves in the opposite direction until the heating time and heating temperature of the semiconductor device are reached;
[0038] S6: After the heating time and heating temperature of the semiconductor device in the first heating chamber are reached first, the movable seat body moves horizontally toward the discharge track, so that the bottom outlet of the first heating chamber is aligned with the top of the discharge track, and at the same time, the outlet top connection block of the first heating chamber reaches the front side of the roller;
[0039] S7: The piston rod of the lower driving assembly retracts, and the top block of the roller top-connecting outlet opens the gate of the first heating chamber outlet, and the semiconductor device falls into the discharge track and is sent to the inspection process;
[0040] S8: When the heating time and heating temperature of the semiconductor devices in the second heating chamber are reached, the movable seat body continues to move horizontally toward the feeding track, so that the bottom outlet of the second heating chamber is aligned with the top of the discharging track, and the discharging of the semiconductor devices in the second heating chamber is completed with reference to the above actions; at the same time, the emptied first heating chamber is just aligned with the feeding track, and when the second heating chamber is discharging, the first heating chamber can be fed synchronously, thereby improving work efficiency;
[0041] S9: Referring to step S8, the discharge of the third heating bin, the fourth heating bin, ... the Nth heating bin, and the synchronous feeding of the preceding heating bin are completed in sequence.
[0042] The high-temperature heating buffer feeding device of the semiconductor device sorting machine is provided with a movable seat body, and a plurality of transversely arranged heating chambers are fixedly connected to the movable seat body. Vertical blanking slides are provided inside the heating chambers. The top of the blanking slides has an inlet, the bottom has an outlet, and switch gates are provided on the inlet and the outlet.
[0043] When the movable seat is located between the feed track and the discharge track of the semiconductor device, the top entrance of the heating bin can be aligned with the feed track in turn through the reciprocating translational motion control of the movable seat, and the semiconductor devices can be cached in all the heating bins to achieve caching in a high temperature environment; when the semiconductor devices inside the heating bin reach the set heating temperature for the set time, the bottom exit of the heating bin can be aligned with the discharge track in turn through the reciprocating translational motion control of the movable seat, and the semiconductor devices can be output to the discharge track for subsequent electrical performance testing, which can greatly improve the cached heating material amount and feeding efficiency.
[0044] The above is only the preferred embodiment of the utility model, and does not limit the utility model in other forms. Any technician familiar with the profession may use the technical content disclosed above to change or modify it into an equivalent embodiment with equivalent changes. However, any simple modification, equivalent change and modification made to the above embodiment based on the technical essence of the utility model without departing from the technical solution of the utility model still belongs to the protection scope of the technical solution of the utility model.
Claims
1. A high temperature heating buffer feeding device for a semiconductor device sorting machine, characterized in that: The machine comprises a frame on which is arranged a movable seat body which is driven by a driving mechanism to perform transverse reciprocating translational motion, the movable seat body being fixedly connected to a plurality of transversely arranged heating bins, the interiors of the heating bins are provided with vertical blanking slides, the tops of the blanking slides are provided with entrances, the bottoms of the blanking slides are provided with exits, and switch gates are provided on the entrances and exits.
2. The high temperature heating buffer feeding device for semiconductor device sorting machine according to claim 1, characterized in that: The cross-sectional shape of the drop slide is adapted to the outer contour shape of the semiconductor device in a falling posture.
3. The high temperature heating buffer feeding device for semiconductor device sorting machine according to claim 1, characterized in that: Heating pipes are embedded in the heating bin on the back of the blanking chute, and the heating pipes are vertically arranged along the length direction of the blanking chute.
4. The high temperature heating buffer feeding device for semiconductor device sorting machine according to claim 1, characterized in that: The switch gates all include horizontally arranged gate plates, and gate holes are opened at the top and bottom of the heating bin. The top gate plates all horizontally pass through the gate holes and enter the blanking chute to open and close the entrance, and the bottom gate plates all horizontally pass through the gate holes and enter the blanking chute to open and close the exit.
5. The high temperature heating buffer feeding device for semiconductor device sorting machine according to claim 4, characterized in that: An upper driving assembly for driving the opening and closing gate of the entrance and a lower driving assembly for driving the opening and closing gate of the exit are fixedly connected to the frame beside the movable seat body. The upper driving assembly and the lower driving assembly are laterally staggered to correspond to two adjacent heating chambers at the same time.
6. The high temperature heating buffer feeding device for semiconductor device sorting machine according to claim 5, characterized in that: The upper driving assembly and the lower driving assembly each include a gate cylinder fixedly connected to the frame, the piston rod end of the gate cylinder is fixedly connected to an adapter frame, and an axially vertical roller is installed on the adapter frame; the gate plate is fixedly connected to an adapter block, and the adapter block passes through a guide rod fixedly connected to the side of the gate hole, and the front end of the guide rod is fixedly connected to a limit block, and a spring is sleeved on the guide rod between the limit block and the adapter block, and the adapter block is fixed with a top connection block for translation with the movable seat body to the corresponding roller, and the top connection block is located on the front side of the roller.