Display device

Abstract

A display device according to an embodiment includes: a display panel; and a cover window disposed on a front side of the display panel and including a front portion and a side portion surrounding the front portion and at least partially curved, the cover window including a first portion including the front portion and a second portion including at least a portion of the side portion, and the first portion and the second portion are directly joined, and the first portion has a higher hardness than the second portion.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2023-0055430 filed in the Korean Intellectual Property Office on April 27, 2023, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present disclosure relates to a display device, and to a display device including a high-hardness cover window. Background Art

[0004] Display devices are used to display images in various electronic devices such as mobile phones, tablet computers, wearable devices, portable computers, televisions, and monitors.

[0005] Such a display device may include a display panel that displays an image and a cover window that protects the display panel.

[0006] Wearable devices require a cover window made of a material with high hardness, and watches (eg, smart watches) as representative wearable devices are formed in more diverse designs.

[0007] Accordingly, there is a need for a cover window that implements various form factors while using a high hardness material.

[0008] It will be understood that this background technology section is intended to provide a useful background for understanding the technology. However, this background technology section may also include ideas, concepts or understandings that are not part of the concepts, concepts or understandings of the subject matter disclosed herein before the corresponding effective application date of the related art. Utility Model Content

[0009] Embodiments provide a display device including a cover window with high hardness in a wearable device. Embodiments also provide a display device including a cover window that implements various form factors while using a high hardness material.

[0010] A display device according to an embodiment may include: a display panel; and a cover window disposed on a front side of the display panel and including a front portion and a side portion surrounding the front portion and at least partially bent.

[0011] The cover window may include a first portion including the front portion and a second portion including at least a portion of the side portion, the first portion and the second portion are directly joined, and the first portion has a higher hardness than the second portion.

[0012] A thickness of a bonding interface between the first portion and the second portion of the cover window may be less than or equal to about 100 nm.

[0013] After activating bonding surfaces of the first portion and the second portion by plasma, the first portion and the second portion may be directly bonded.

[0014] The side of the cover window may include a first side protruding from the front and having at least a portion substantially including a curved surface, and a second side extending downward from the first side and having at least a portion substantially including a curved surface.

[0015] The first portion of the cover window may include the front portion and the first side portion, and the second portion of the cover window may include the second side portion.

[0016] The first portion of the cover window may include sapphire.

[0017] A depth from an edge of the side portion of the cover window to an inner surface of the front portion may be about 3 mm or more.

[0018] The side portion of the cover window may further include a third side portion extending downward from the second side portion, and the third side portion has at least a portion substantially including a curved surface.

[0019] The cover window may further include a third portion extending from the second portion.

[0020] The third portion of the cover window may include the third side portion, and the first portion may have a higher hardness than the third portion.

[0021] The third side portion of the cover window may include a black material.

[0022] A thickness of a bonding interface between the second portion and the third portion may be about 100 nm or less.

[0023] After the bonding surfaces of the second portion and the third portion are activated by plasma, the second portion and the third portion may be directly bonded.

[0024] The first portion of the cover window may include sapphire.

[0025] According to an embodiment, a display device may include: a display panel; and a cover window, which is arranged on the front side of the display panel, the cover window includes a flat front portion, and a side portion that is at least partially bent around the flat front portion, and the flat front portion and the side portion are directly joined, and the flat front portion has a higher hardness than the side portion.

[0026] The side portion may further include a first side portion protruding and extending from the flat front portion, and a second side portion extending downward from the first side portion.

[0027] The second side portion may include a black material.

[0028] The flat front portion may comprise sapphire.

[0029] A thickness of a bonding interface between the flat front portion and the side portion may be about 100 nm or less.

[0030] The flat front portion and the side portion may be directly bonded after activating the bonding surface by plasma.

[0031] The first side portion and the second side portion may be directly bonded, and a thickness of a bonding interface between the first side portion and the second side portion may be about 100 nm or less.

[0032] According to the embodiment, a display device including a high-hardness cover window may be provided.

[0033] A cover window having various outer dimensions can be provided while using a high-hardness material. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] The above and other aspects and features of the present disclosure will become more apparent by describing in detail embodiments of the present disclosure with reference to the attached drawings.

[0035] Figure 1 is a schematic perspective view of a display device according to an embodiment.

[0036] Figure 2 It is along Figure 1 Schematic cross-sectional view of the display device taken along line AA′ in FIG.

[0037] Figure 3 is a schematic cross-sectional view of a cover window according to an embodiment.

[0038] Figure 4 2 is a diagram illustrating a manufacturing process of a cover window according to an embodiment.

[0039] Figure 5 is a schematic diagram illustrating a direct bonding process according to an embodiment.

[0040] Figure 6 is a picture of an overlay window according to an embodiment.

[0041] Figure 7 It is along Figure 6 A cross-sectional photograph of the cover window taken along line BB' in FIG.

[0042] Figures 8 to 10 is a schematic cross-sectional view of a cover window according to an embodiment.

[0043] Fig.11 is a schematic cross-sectional view of a display panel according to an embodiment. DETAILED DESCRIPTION

[0044] The present disclosure will now be described more fully below with reference to the accompanying drawings, in which embodiments are shown. However, the present disclosure may be embodied in different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that the present disclosure will be thorough and complete and will fully convey the scope of the present disclosure to those skilled in the art.

[0045] The present disclosure may be embodied in many different forms and is not limited to the embodiments set forth herein.

[0046] In order to clearly describe the present disclosure, parts irrelevant to the description may be omitted, and the same reference numerals are assigned to the same or similar constituent elements throughout the specification.

[0047] Additionally, for convenience of description, the size and thickness of each component shown in the drawings are arbitrarily depicted, and thus, the present disclosure is not necessarily limited to what is shown.

[0048] In the drawings, the thickness is shown exaggeratedly in order to clearly express each layer and region.

[0049] In the drawings, the thicknesses of some layers and regions are exaggerated for convenience of explanation.

[0050] As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

[0051] In the specification and claims, the term "and / or" is intended to include any combination of the terms "and" and "or" for the purpose of its meaning and interpretation. For example, "A and / or B" may be understood to mean "A, B, or A and B". The terms "and" and "or" may be used in conjunction or disjunction and may be understood to be equivalent to "and / or".

[0052] In the specification and claims, the phrase "at least one of..." is intended to include the meaning of "at least one selected from the group of..." for the purpose of its meaning and interpretation. For example, "at least one of A and B" can be understood to mean "A, B, or A and B".

[0053] It will be understood that although the terms first, second, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. For example, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element without departing from the scope of the present disclosure.

[0054] In addition, when a component such as a layer, film, region, or panel is referred to as being “on” or “over” another component, this includes not only the case where the component is “directly on” the other component but also includes the case where another component or components are located in between.

[0055] In contrast, when an element is referred to as being “directly on” another element, it means that there are no intervening elements.

[0056] Furthermore, “above” or “on” a reference component means being located above or below the reference component, and does not necessarily mean being located “above” or “on” in a direction opposite to the direction of gravity.

[0057] The term "overlap" or "overlapping" means that a first object can be above or below a second object or to one side of the second object, and vice versa. Additionally, the term "overlap" may include layer, stack, facing or facing, extending across, covering or partially covering, or any other suitable term that will be appreciated and understood by those of ordinary skill in the art.

[0058] When an element is described as “not “overlapping” or “not overlapping” another element, this may include the elements being spaced apart, offset, or separated from each other, or any other suitable terminology that will be appreciated and understood by one of ordinary skill in the art.

[0059] The terms "facing" and "facing" mean that the first element can be directly or indirectly opposite to the second element. In the case where a third element is interposed between the first element and the second element, although still facing each other, the first element and the second element can be understood as indirectly opposite to each other.

[0060] When used in this specification, the terms “comprises, comprising,” “includes and / or including,” “has, have and / or having” and variations thereof indicate the presence of stated features, integers, steps, operations, elements, components and / or groups thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or groups thereof.

[0061] In addition, throughout the specification, when a “planar image” is mentioned, it means when a target component is observed from above, and when a “cross-sectional image” is mentioned, it means when a vertically cut cross section of the target component is observed from the side.

[0062] In the drawings, symbols “x”, “y” and “z” are used to indicate directions, where “x” is a first direction, “y” is a second direction perpendicular to the first direction, and “z” is a third direction perpendicular to the first and second directions.

[0063] The first direction x, the second direction y, and the third direction z may correspond to a horizontal direction, a vertical direction, and a thickness direction of the display device, respectively.

[0064] As used herein, "about" or "approximately" includes the stated value and refers to within an acceptable range of deviation for the particular value as determined by one of ordinary skill in the art, taking into account the measurement in question and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "about" can mean within one or more standard deviations, or within ±30%, ±20%, ±10%, or ±5% of the stated value.

[0065] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which the present disclosure belongs. It will also be understood that, unless explicitly defined as such herein, terms (such as those defined in commonly used dictionaries) should be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and will not be interpreted in an idealized or overly formal sense.

[0066] Figure 1 is a schematic perspective view of a display device according to an embodiment. Figure 2 It is along Figure 1 Schematic cross-sectional view of the display device taken along line AA′ in FIG.

[0067] Reference Figure 1 and Figure 2 , the display device 100 may include a cover window CW, a display panel DP on a back side of the cover window CW, a cover panel CP on a back side of the display panel DP, and a flexible printed circuit board FB connected to the display panel DP.

[0068] The display device 100 may be used to display images in electronic devices such as mobile devices and wearable devices (such as watches, for example, smart watches).

[0069] The display device 100 may include a front area FA and a side area SA as a whole.

[0070] The side area SA may extend from the front area FA and may surround the front area FA.

[0071] The front area FA may be a flat surface, or at least a portion of the front area FA may be a curved surface.

[0072] The side area SA may have a ring shape, or may have a curved surface.

[0073] The entire front area FA of the display device 100 may constitute a screen.

[0074] The side area SA may not constitute a screen, or at least a portion of the side area SA may constitute a screen.

[0075] The screen may correspond to a display area of ​​the display device 100 or the display panel DP.

[0076] When the display device 100 is viewed from the front, a circular screen provided by the front area FA or at least a portion of the front area FA and the side area SA may be recognized.

[0077] In the display device 100 , the cover window CW, the display panel DP, and the cover panel CP may be attached to each other.

[0078] An adhesive film such as an optically clear adhesive (OCA) film may be used for lamination of the cover window CW and the display panel DP, and an adhesive layer AH formed of such an adhesive may be located between the cover window CW and the display panel DP.

[0079] An adhesive film such as a pressure sensitive adhesive (PSA) film may be used to attach the cover panel CP and the display panel DP, and an adhesive layer AH formed of such an adhesive is provided between the cover panel CP and the display panel DP.

[0080] The cover window CW may protect the display panel DP from influence or impact of the external environment.

[0081] The cover window CW may serve as a support for maintaining the display panel DP in a given state.

[0082] At least one region of the cover window CW corresponding to the screen may be optically transparent.

[0083] The cover window CW may be formed of a transparent and hard material such as glass or plastic so that an image displayed by the display panel DP may be transmitted through the cover window CW.

[0084] In an embodiment, the cover window CW may be formed of a high hardness material such as sapphire.

[0085] Sapphire offers superior optical and surface hardness properties compared to other materials.

[0086] In some cases, sapphire material can have a hardness of approximately 9 on the Mohs scale.

[0087] Due to the excellent hardness of sapphire, the surface strength and scratch resistance of the cover window CW including sapphire may be improved.

[0088] The cover window CW may form the overall appearance of the display device 100 .

[0089] In an electronic device to which the display device 100 is applied, a cover window CW may be exposed to the outside, and the display panel DP, the cover panel CP, and the flexible printed circuit board FB are connected to the cover window CW. It may be located within a housing defined by a set cover.

[0090] The cover window CW may define a front area FA and a side area SA of the display device 100 .

[0091] The cover window CW may include a front portion FP and a side portion SP corresponding to the front area FA and the side area SA of the display device 100 , respectively.

[0092] The side portion SP may protrude from the front portion FP.

[0093] The side portion SP may extend from the front portion FP, and may surround the front portion FP.

[0094] The side portion SP may include a portion bent from the front portion FP to a preset curvature radius.

[0095] The cover window CW may have a shape in which the front FP is recessed from the side SP.

[0096] The depth D of the concave portion, for example, the depth D in the third direction z from the edge of the side portion SP to the inner surface of the front portion FP, may be about 3 mm or more, or about 4 mm or more.

[0097] For example, the depth D of the concave portion may be about 3.5 mm.

[0098] According to embodiments, the cover window CW may consist of one or more parts, and may include one or more materials.

[0099] For example, the cover window CW may be divided into two portions, a front portion FP and a side portion SP, and may be formed of different materials.

[0100] The side portion SP may be further divided into one or more portions.

[0101] For example, the side portion SP may be further divided into a first side portion SP1 extending from the front portion FP in a horizontal direction and including a curved surface (see Figure 3 ) and the second side portion SP2 (see Figure 3 ).

[0102] Each part constituting the cover window CW may be formed of a different material.

[0103] A portion of the cover window CW including the front portion FP may be formed of a material having higher hardness than materials of other portions.

[0104] The display panel DP may be a light emitting display panel including light emitting devices such as light emitting diodes.

[0105] The display panel DP may be a touch screen panel including a touch sensing function.

[0106] At least a portion of the display panel DP may be flexible.

[0107] The display panel DP may include a display area corresponding to a screen in which an image is displayed, and a non-display area in which an image is not displayed.

[0108] The pixels are arranged or disposed in the display area, and an image can be displayed by a combination of the pixels.

[0109] The non-display area may be located at an edge of the display panel DP, and may be located around the display area.

[0110] The non-display area is an area where circuits and / or wirings for generating and / or transmitting various signals applied to the display area are disposed.

[0111] A pad unit including pads for receiving or outputting signals from or to the outside of the display panel DP may be located in the non-display area. The flexible printed circuit board FB may be connected or bonded to the pad portion.

[0112] The cover panel CP may protect the display panel DP from the influence or impact of the rear environment (eg, electromagnetic waves and noise) of the display panel DP.

[0113] The cover panel CP may diffuse heat generated from the display panel DP and may prevent heat generated from a processor, a battery, a memory, etc., which may be located on a rear surface of the display panel DP in the electronic device, from being transferred to the display panel DP.

[0114] The flexible printed circuit board FB may be connected to the pad portion of the display panel DP to transmit a signal for driving the display panel DP to the display panel DP.

[0115] A driving integrated circuit chip (not shown) that generates and / or processes a signal for driving the display panel DP may be mounted on the flexible printed circuit board FB.

[0116] At least a portion of the flexible printed circuit board FB may be bent to be located on the rear surface of the cover panel CP.

[0117] Since the cover window CW according to the embodiment has a sufficient depth D, the display panel DP and the cover panel CP may be located within the space defined by the cover window CW.

[0118] The display panel DP and the cover panel CP may be completely received in the concave portion of the cover window CW without protruding from the side SP of the cover window CW.

[0119] Figure 3 is a schematic cross-sectional view of a cover window according to an embodiment.

[0120] Reference Figure 3 , the cover window CW may include a front portion FP and a side portion SP protruding from the front portion FP.

[0121] The side portion SP may include a portion bent from the front portion FP to a preset curvature radius.

[0122] The side portion SP may extend from the front portion FP, and may surround the front portion FP.

[0123] The cover window CW may have a shape in which the front FP is recessed from the side SP.

[0124] The depth D of the concave portion (eg, the depth D in the third direction z from the edge of the side portion SP to the inner surface of the front portion FP) may be about 3 mm or more, or about 4 mm or more.

[0125] For example, the depth D of the concave portion may be about 3.5 mm.

[0126] The cover window CW according to the embodiment may include a first part CW1 and a second part CW2 .

[0127] The first portion CW1 of the cover window may include a front portion FP and a portion of the side portion SP having a curved surface extending from the front portion FP.

[0128] For example, the first portion CW1 of the cover window may include a flat front portion FP (or a flat front portion FP) and a curved first side portion SP1 extending in parallel from the front portion FP in a horizontal direction.

[0129] A lower surface of the front portion FP and a lower surface of the first side portion SP1 may be located on the same plane.

[0130] The first portion CW1 of the cover window may be formed of a material that is transparent and has high hardness.

[0131] For example, the first portion CW1 of the cover window may include sapphire.

[0132] The second portion CW2 of the cover window may include a second side portion SP2 extending downward from the first side portion SP1.

[0133] The second portion CW2 of the cover window may have a ring shape, and may include a curved surface.

[0134] The second portion CW2 of the cover window may be formed of a material that is transparent and has high hardness.

[0135] For example, the second portion CW2 of the cover window may be formed of tempered glass or ceramic glass.

[0136] The first portion CW1 of the cover window and the second portion CW2 of the cover window may be formed of different materials.

[0137] The second portion CW2 of the cover window may be formed of a material having a lower hardness than that of the first portion CW1 of the cover window.

[0138] According to an embodiment, the first portion CW1 of the cover window and the second portion CW2 of the cover window may be formed of the same material or similar materials.

[0139] In an embodiment, the first portion CW1 of the cover window may include sapphire, and the second portion CW2 of the cover window may be formed of tempered glass or ceramic glass.

[0140] Sapphire is a material having excellent hardness and is suitable for use in wearable materials, but has a disadvantage in that it is difficult to mold.

[0141] Therefore, it may be difficult to use the cover window CW having a concave portion having a sufficient depth D.

[0142] However, since the embodiment uses sapphire, a high-hardness material, to mold a portion of the front FP and the side SP1, and uses a material with good processability (such as tempered glass or ceramic glass), the processability is improved while using the high-hardness material. Therefore, an excellent cover window can be produced.

[0143] The first portion CW1 of the cover window and the second portion CW2 of the cover window may be connected or coupled by direct bonding.

[0144] For example, a separate adhesive layer is not located between the first and second portions CW1 and CW2 of the cover window, and a lower surface of the first side SP1 constituting the first portion CW1 of the cover window and an upper surface of the second side SP2 constituting the second portion CW2 of the cover window may be in direct contact.

[0145] Since the first portion CW1 of the cover window and the second portion CW2 of the cover window are connected or coupled by direct bonding, it may be difficult to visually recognize a boundary portion.

[0146] For example, the thickness of the bonding interface formed by direct bonding is about 100 nm or less, and may be formed at a level of several nanometers (nm) to several tens of nanometers depending on the embodiment.

[0147] Since the cover window according to the embodiment is divided into two parts and processed, it is possible to mold a front part with sufficient hardness and a side part for achieving various external dimensions. Accordingly, an external dimension with sufficient depth can be formed while using a high hardness material. A cover window that achieves these can be provided.

[0148] Figure 4 is a diagram showing a manufacturing process of a cover window according to an embodiment. Figure 4 A manufacturing process of a cover window according to an embodiment is described.

[0149] Reference Figure 4 , a first cover window portion CW1 and a second cover window portion CW2 are provided.

[0150] The first portion CW1 of the cover window may include a front portion corresponding to a front area of ​​the display device and a portion of a side portion extending from the front portion.

[0151] The upper surface of the first part CW1 of the cover window may include a flat portion corresponding to the front and a curved portion protruding from the front.

[0152] The lower surface of the first cover window portion CW1 may form a flat surface.

[0153] The first portion CW1 of the cover window may be formed of a transparent material, and a material having high hardness may be used.

[0154] For example, sapphire having excellent optical properties and excellent surface hardness may be used.

[0155] The second portion CW2 of the cover window may include a side portion corresponding to a side area of ​​the display device.

[0156] The second portion CW2 of the cover window may be located below the first portion CW1 of the cover window.

[0157] The second portion CW2 of the cover window may have a ring shape surrounding a boundary of the first portion CW1 of the cover window.

[0158] The second portion CW2 of the cover window may be formed of a transparent material, has high hardness, and may be processed using various materials required for an outer size.

[0159] For example, tempered glass, ceramic glass, and the like can be used.

[0160] The first portion CW1 of the cover window and the second portion CW2 of the cover window may be connected or coupled by direct bonding.

[0161] A lower surface of the first portion CW1 of the cover window may be disposed to face an upper surface of the second portion CW2 of the cover window.

[0162] At a boundary defining the first portion CW1 of the cover window, the first portion CW1 and the second portion CW2 of the cover window may be attached by direct bonding.

[0163] The second portion CW2 of the cover window may be coupled under the first portion CW1 of the cover window in a ring shape surrounding and exposing the front portion of the first portion CW1.

[0164] The bonding between the first portion CW1 and the second portion CW2 of the cover window does not require a separate material, and the thickness of the bonding interface is less than about 100 nm and is invisible to the naked eye.

[0165] According to an embodiment, the thickness of the bonding interface may be formed to be in the range of several nanometers to several tens of nanometers.

[0166] Figure 5 is a schematic diagram illustrating a direct bonding process according to an embodiment.

[0167] Reference Figure 5 , direct bonding will be briefly explained.

[0168] Figure 5 (a) shows the steps of preparing the upper substrate GLS1 and the lower substrate GLS2, and Figure 5 (b) shows the surface treatment steps of the substrates GLS1 and GLS2 performed inside the chamber CB. Figure 5 (c) shows the preliminary bonding step of the surface-treated substrates GLS1 and GLS2, and Figure 5 (d) shows a pressurizing step of pressurizing the pre-bonded substrates GLS1 and GLS2.

[0169] For example, Figure 5 (a) is a step of preparing the upper substrate GLS1 and the lower substrate GLS2 for bonding, and the upper substrate GLS1 and the lower substrate GLS2 may be of different types or may be of the same type.

[0170] For example, the upper substrate GLS1 may be formed of high-hardness sapphire, and the lower substrate GLS2 may be formed of tempered glass or ceramic glass that is convenient for molding.

[0171] The upper substrate GLS1 and the lower substrate GLS2 may be pre-formed according to desired outer dimensions after being joined.

[0172] For example, Figure 4 As shown in FIG. 1 , the upper substrate GLS1 is a first portion CW1 of the cover window according to the embodiment, and the lower substrate GLS2 is a second portion CW2 of the cover window according to the embodiment.

[0173] Here, the first part CW1 is molded to include a front portion covering the window, and the second part CW2 may include a side portion covering the window and be formed in a ring shape surrounding a boundary of the first part CW1.

[0174] Figure 5 (b) shows a surface treatment step of a substrate performed inside the chamber CB, and the upper substrate GLS1 and the lower substrate GLS2 may be located on the stage ST inside the chamber CB.

[0175] The chamber CB is a plasma chamber CB that forms plasma by injecting oxygen gas, nitrogen gas, argon gas, or the like in a vacuum state.

[0176] The upper substrate GLS1 and the lower substrate GLS2 located inside the chamber CB may be exposed to plasma for surface treatment.

[0177] The upper substrate GLS1 and the lower substrate GLS2 may be exposed to plasma simultaneously or successively, and in the case of the consecutive exposure, the surface treatment conditions applied thereto may be the same or different.

[0178] In an embodiment, the upper substrate GLS1 and the lower substrate GLS2 may be simultaneously exposed to plasma inside the chamber CB.

[0179] Accordingly, the surface treatment conditions of the substrates may be the same.

[0180] The upper substrate GLS1 and the lower substrate GLS2 subjected to the plasma treatment may include an activated surface on one surface or one surface.

[0181] Through the plasma surface treatment, the upper substrate GLS1 and the lower substrate GLS2 may be in a surface state where direct bonding is possible.

[0182] For example, according to the plasma surface treatment, oxygen particles are adsorbed on the surface of the substrate to be treated, and the surface can be modified to be hydrophilic, and the adhesiveness can be improved.

[0183] In the embodiments, refer to Figure 4 , a lower surface of the first portion CW1 of the cover window and an upper surface of the second portion CW2 of the cover window may be activated surfaces in which plasma surface treatment has been performed for direct bonding.

[0184] Then, Figure 5(c) is the pre-bonding subjected to Figure 5 (b) A step of surface treating the upper substrate GLS1 and the lower substrate GLS2.

[0185] Reference Figure 5 (c), the activated surfaces of the upper substrate GLS1 and the lower substrate GLS2 can be positioned to face each other and engage with each other.

[0186] exist Figure 5 (c) in the initial bonding state, such as Figure 5 As shown in (d) of FIG. 1 , a pressing process by an external force F is performed, and thus, the upper substrate GLS1 and the lower substrate GLS2 become a directly bonded state.

[0187] In an embodiment, Figure 4 As shown in , the lower surface of the first part CW1 of the cover window and the upper surface of the second part CW2 of the cover window may be disposed to face each other and pre-bonded. Hereinafter, a direct bonding state may be achieved through a pressing process.

[0188] Such direct bonding does not require a separate intermediate material for bonding between substrates to be bonded, and a bonding interface of substrates bonded by such direct bonding can be hardly visible.

[0189] For example, the thickness of the bonding interface formed by direct bonding is about 100 nm or less, and may be formed at a level of several nanometers to several tens of nanometers depending on the embodiment.

[0190] The thickness of the bonding interface may vary depending on the type of substrates to be bonded and the surface treatment conditions.

[0191] Reference Figure 6 and Figure 7 , a cover window connected or coupled by direct bonding according to an embodiment will be identified.

[0192] Figure 6 is a picture of an overlay window according to an embodiment, and Figure 7 It is along Figure 6 A cross-sectional photograph of the cover window taken along line BB' in FIG. Figure 7 It can be confirmed that the bonding interface C of the cover window bonded by the direct bonding process in the embodiment cannot be visually identified.

[0193] Figure 8 is a schematic cross-sectional view of a cover window according to an embodiment.

[0194] Figure 8 Examples and Figure 3 The embodiment may be different in that the cover window CW may further include a third part.

[0195] For example, in Figure 3 In the embodiment of the present invention, the cover window CW consists of two parts, but Figure 8 In the embodiment, the cover window CW may consist of three parts.

[0196] Each portion of the cover window CW is joined by direct joining.

[0197] Reference Figure 8 , the cover window CW according to the embodiment may include a first portion CW1 , a second portion CW2 , and a third portion CW3 , and the second portion CW2 may be larger than the third portion CW3 .

[0198] The first portion CW1 of the cover window CW and the second portion CW2 of the cover window CW are similar to Figure 3 Embodiment of the invention.

[0199] Detailed description of the same components as those in the previous embodiment will be omitted.

[0200] The third portion CW3 of the cover window CW may include an extension portion protruding and extending downward from the second portion CW2 of the cover window CW.

[0201] The third portion CW3 of the cover window CW may have a ring shape, and may include a curved surface.

[0202] The third portion CW3 of the cover window CW may be formed of a material that is transparent and has high hardness.

[0203] According to an embodiment, the third portion CW3 of the cover window CW may include a black material.

[0204] In case that the third portion CW3 of the cover window CW may include a black material, it may be used as a printing substitute material for a display device.

[0205] The second and third portions CW2 and CW3 constituting the side of the cover window CW may be formed of a material having a lower hardness than that of the first portion CW1 of the cover window CW but may be easily molded.

[0206] For example, the first portion CW1 of the cover window CW may be implemented with a sapphire material, and the second and third portions CW2 and CW3 of the cover window CW may be implemented with a tempered glass or ceramic glass material.

[0207] Each portion of the cover window CW is joined by direct joining so that a separate adhesive material layer is not included in between and the boundary is almost invisible.

[0208] Accordingly, it is possible to provide a cover window CW implementing various outer dimensions while using sapphire as a high-hardness material.

[0209] Fig. 9 is a schematic cross-sectional view of a cover window according to an embodiment.

[0210] Fig. 9 is where the bonding direction can be Figure 3 Embodiments of different embodiments.

[0211] Reference Fig. 9 , the cover window CW according to the embodiment may include a first part CW4 and a second part CW5.

[0212] exist Figure 3 In the embodiment of the present invention, the first portion CW1 of the cover window CW may include a flat front portion and a portion of a curved side portion, but in Fig. 9 In the embodiment of the present invention, the first portion CW4 of the cover window CW may include only a flat front portion.

[0213] Reference Fig. 9 In an embodiment, the first portion CW4 of the cover window CW may include a flat front portion.

[0214] The first portion CW4 of the cover window CW may be formed of a material that is transparent and has high hardness.

[0215] For example, the first portion CW4 of the cover window CW may include sapphire.

[0216] The second portion CW5 of the cover window CW may include a side portion extending from the front portion and including a curved surface.

[0217] The second portion CW5 of the cover window CW may extend from the first portion CW4 of the cover window CW, and may surround the first portion CW4 of the cover window CW.

[0218] The second portion CW5 of the cover window CW may have a ring shape, and may include a curved surface.

[0219] The second portion CW5 of the cover window CW may be formed of a material that is transparent and has high hardness.

[0220] For example, within the spirit and scope of the present disclosure, the second part CW5 of the cover window CW may be formed of tempered glass, ceramic glass, or the like.

[0221] The first portion CW4 of the cover window CW and the second portion CW5 of the cover window CW may be formed of different materials.

[0222] The second portion CW5 of the cover window CW may use a material having a lower hardness than that of the first portion CW4 of the cover window CW.

[0223] According to an embodiment, the first portion CW4 of the cover window CW and the second portion CW5 of the cover window CW may be formed of the same material or similar materials.

[0224] The first portion CW4 of the cover window CW and the second portion CW5 of the cover window CW may be connected or coupled by direct bonding.

[0225] For example, a separate adhesive material layer is not located between the first portion CW4 of the cover window CW and the second portion CW5 of the cover window CW.

[0226] Fig.10 is a schematic cross-sectional view of a cover window according to an embodiment.

[0227] Fig.10 Examples and Fig. 9 The embodiment of the present invention may be different in that the cover window CW may further include a third part CW6.

[0228] For example, in Fig. 9 In the embodiment of the present invention, the cover window CW consists of two parts, but Fig.10 In the embodiment, the cover window CW may consist of three parts.

[0229] Each portion of the cover window CW is made by direct bonding.

[0230] Reference Fig.10 , the cover window CW according to the embodiment may include a first portion CW4, a second portion CW5, and a third portion CW6, and the second portion CW5 may be larger than the third portion CW6.

[0231] The first part CW4 of the cover window CW and the second part CW5 of the cover window CW are similar to Fig. 9 Embodiment of the invention.

[0232] Detailed description of the same components as those in the previous embodiment will be omitted.

[0233] The third portion CW6 of the cover window CW may include an extending portion protruding and extending downward from the second portion CW5 of the cover window CW.

[0234] The third portion CW6 of the cover window CW may have a ring shape, and may include a curved surface.

[0235] The third portion CW6 of the cover window CW may be formed of a material that is transparent and has high hardness.

[0236] According to an embodiment, the third portion CW6 of the cover window CW may include a black material.

[0237] In case that the third portion CW6 of the cover window CW may include a black material, it may be used as a printing substitute material for a display device.

[0238] The second and third portions CW5 and CW6 constituting the side of the cover window CW may be formed of a material having a lower hardness than that of the first portion CW4 of the cover window CW but may be easily molded.

[0239] Each portion of the cover window CW is joined by direct joining and does not include a separate adhesive material layer, and the boundary is almost invisible.

[0240] Accordingly, it is possible to provide a cover window implementing various outer dimensions while using sapphire as a high-hardness material.

[0241] In the following, reference will be made to Fig.11 A configuration of a display panel DP that may be included in a display device according to an embodiment is described.

[0242] Fig.11 is a schematic cross-sectional view of a display panel according to an embodiment.

[0243] Fig.11 is a schematic cross-sectional view showing an example of a stack structure of a display panel DP according to the embodiment.

[0244] Fig.11 The cross section shown in may correspond to approximately one pixel area.

[0245] The display panel DP may basically include a substrate SB, a transistor TR formed on the substrate SB, and a light emitting diode LED connected to the transistor TR.

[0246] The substrate SB may be a flexible substrate including a polymer such as polyimide, polyamide, or polyethylene terephthalate.

[0247] Within the spirit and scope of the present disclosure, the substrate SB may include a barrier layer that prevents penetration of moisture, oxygen, and the like.

[0248] For example, the substrate SB may include one or more polymer layers and one or more barrier layers, and the polymer layers and the barrier layers may be alternately stacked on each other.

[0249] The substrate SB may be a glass substrate.

[0250] An insulating layer IN1 may be located on the substrate SB.

[0251] The insulating layer IN1 may be referred to as a buffer layer, and blocks impurities from the substrate SB to improve characteristics of the semiconductor layer A and flattens the surface of the substrate SB to form the semiconductor layer when forming the semiconductor layer A. Stress of the semiconductor layer A may be relieved.

[0252] The barrier layer and the first insulating layer IN1 may include silicon nitride (SiN x), silicon oxide (SiO x ) or silicon oxynitride (SiO x N y ) of inorganic insulating materials.

[0253] The semiconductor layer A of the transistor TR may be located on the insulating layer IN1 .

[0254] The semiconductor layer A may include a first region and a second region, and a channel region between the regions.

[0255] The semiconductor layer A may include a semiconductor material such as polycrystalline silicon, an oxide semiconductor, or amorphous silicon.

[0256] The insulating layer IN2 may be located on the semiconductor layer A.

[0257] The insulating layer IN2 may be referred to as a gate insulating layer, and may include an inorganic insulating material.

[0258] A gate conductive layer including a gate electrode G of the transistor TR may be located on the insulating layer IN2 .

[0259] The gate conductive layer may include a metal such as molybdenum (Mo), aluminum (Al), copper (Cu), or titanium (Ti).

[0260] An insulating layer IN3 may be located on the gate conductive layer.

[0261] The insulating layer IN3 may be referred to as an interlayer insulating layer, and may include an inorganic insulating material.

[0262] A data conductive layer including the first electrode SE and the second electrode DE of the transistor TR may be located on the insulating layer IN3 .

[0263] The first electrode SE and the second electrode DE may be connected to the first region and the second region of the semiconductor layer A, respectively, through contact holes formed in the insulating layers IN2 and IN3 .

[0264] The data conductive layer may include metals such as aluminum (Al), copper (Cu), silver (Ag), molybdenum (Mo), chromium (Cr), gold (Au), platinum (Pt), palladium (Pd), tantalum (Ta), tungsten (W), titanium (Ti), and nickel (Ni).

[0265] An insulating layer IN4 may be located on the data conductive layer.

[0266] The insulating layer IN4 may be referred to as a planarization layer.

[0267] The insulating layer IN4 may include an organic insulating material such as a general polymer such as polystyrene, polymethyl methacrylate, a polymer derivative having a phenol group, an acrylic polymer, an imide polymer such as polyimide, or a siloxane polymer.

[0268] The pixel electrode E1 may be located on the insulating layer IN4 .

[0269] The pixel electrode E1 may be connected to the second electrode DE through a contact hole formed in the fourth insulating layer IN4 .

[0270] The insulating layer IN5 may be located on the insulating layer IN4 .

[0271] The insulating layer IN5 may be referred to as a pixel defining layer.

[0272] The insulating layer IN5 may have an opening overlapping the pixel electrode E1 .

[0273] The insulating layer IN5 may include an organic insulating material.

[0274] The emission layer EL may be located on the pixel electrode E1 , and the common electrode E2 may be located on the emission layer EL.

[0275] In addition to the emission layer EL, at least one of a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer may be located between the pixel electrode E1 and the common electrode E2.

[0276] The pixel electrode E1, the emission layer EL and the common electrode E2 may constitute a light emitting diode LED.

[0277] The pixel electrode E1 may be an anode of the light emitting diode LED, and the common electrode E2 may be a cathode of the light emitting diode LED.

[0278] The encapsulation layer EN may be located on the common electrode E2 .

[0279] The encapsulation layer EN may encapsulate the light emitting diode LED to prevent moisture or oxygen from penetrating from the outside.

[0280] The encapsulation layer EN may be a thin film encapsulation layer including one or more inorganic layers and one or more organic layers.

[0281] For example, the encapsulation layer EN may have a triple-layer structure of inorganic layer / organic layer / inorganic layer.

[0282] The touch sensor layer TS may be located on the encapsulation layer EN.

[0283] The touch sensor layer TS may include a touch electrode layer and an insulating layer, and the touch electrode layer may have a mesh shape.

[0284] The touch electrode layer may include a metal such as aluminum (Al), copper (Cu), titanium (Ti), molybdenum (Mo), silver (Ag), chromium (Cr), or nickel (Ni).

[0285] An anti-reflection layer AR may be located on the touch sensor layer TS to reduce reflection of external light.

[0286] The anti-reflection layer AR may include a combination of a light blocking layer and a color filter or a polarizing layer.

[0287] A protection film PF for protecting the display panel DP may be located under the substrate SB.

[0288] The protection film PF may include a polymer such as polyethylene terephthalate, polyethylene naphthalate, or polyimide.

[0289] Although the embodiments have been described in detail above, the scope of the present disclosure is not limited thereto, and various modifications and improvements that would be understood by a person of ordinary skill in the art using the contents disclosed herein and defined in the appended claims are also included in the scope of the present disclosure.

Claims

1. A display device, characterized in that: The display device comprises: display panel; and a cover window disposed on the front side of the display panel and comprising a front portion and a side portion surrounding the front portion and at least partially bent, wherein: The cover window includes a first portion and a second portion, the first portion includes the front portion, and the second portion includes at least a portion of the side portion. The first portion and the second portion are directly joined, and The first portion has a higher hardness than the second portion.

2. The display device according to claim 1, characterized in that A thickness of a bonding interface between the first portion and the second portion of the cover window is less than or equal to 100 nm.

3. The display device according to claim 1, characterized in that The side portion of the cover window includes: a first side portion protruding from the front portion and having at least a portion including a curved surface; and a second side portion extending downward from the first side portion and having at least a portion including a curved surface, in, The first portion of the cover window includes the front portion and the first side portion, and The second portion of the cover window includes the second side portion.

4. The display device according to claim 1, characterized in that A depth from an edge of the side portion of the cover window to an inner surface of the front portion is 3 mm or more.

5. The display device according to claim 3, characterized in that: The side portion of the cover window further includes a third side portion extending downward from the second side portion and having at least a portion including a curved surface, The cover window further includes a third portion extending from the second portion, The third portion of the cover window includes the third side portion, and The first portion has a higher hardness than the third portion.

6. The display device according to claim 5, characterized in that: A thickness of a bonding interface between the second portion and the third portion is 100 nm or less.

7. A display device, characterized in that: The display device comprises: display panel; and A cover window is provided on the front side of the display panel, wherein The cover window comprises a flat front portion and a side portion surrounding the flat front portion and at least partially curved, The flat front portion and the side portion are directly joined, and The flat front portion has a higher hardness than the side portions.

8. The display device according to claim 7, characterized in that: The side portion comprises: a first side portion protruding and extending from the flat front portion, and A second side portion extends downwardly from the first side portion.

9. The display device according to claim 7, characterized in that: A thickness of a bonding interface between the flat front portion and the side portion is 100 nm or less.

10. The display device according to claim 8, characterized in that: The first side portion is directly joined to the second side portion, and A thickness of a bonding interface between the first side portion and the second side portion is 100 nm or less.

Images