Refrigerating capacity measuring device of semiconductor cooler

Abstract

The utility model relates to a refrigerating capacity measuring device of a semiconductor refrigerator, which comprises a shell, an electric heater and a sensing component, a refrigerating chamber is arranged in the shell, and the semiconductor refrigerator is used for reducing the temperature of gas in the refrigerating chamber; the electric heater is arranged on the inner side wall of the shell and used for increasing the temperature of gas in the refrigeration cavity. The sensing assembly comprises at least one first sensor, and the first sensor is arranged on the inner side wall of the shell and used for detecting the gas temperature of the refrigeration cavity. The semiconductor cooler needing to be measured is arranged in the first mounting groove, power is supplied to the semiconductor cooler and the electric heater at the same time, and the temperature of gas in the refrigeration chamber is detected in real time by means of a first sensor of the sensing assembly until the temperature in the refrigeration chamber is kept consistent with the outdoor temperature; the input electric power of the electric heater is the refrigeration power of the semiconductor refrigerator, and the whole device is simple in structure and convenient to use.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor refrigerators, in particular to a refrigeration capacity measuring device for semiconductor refrigerators. Background Art

[0002] The working principle of semiconductor coolers is based on the thermoelectric effect, that is, when current passes through the junction of two semiconductor materials with different conductive properties, a temperature difference will be generated. This effect is called the Peltier effect. Semiconductor coolers are usually composed of several pairs of P-type and N-type semiconductor materials, which are connected into a circuit. When current passes through the semiconductor material, the thermocouple composed of P-type and N-type absorbs heat on one side and releases heat on the other side, thus forming a temperature difference.

[0003] In order to reasonably design temperature control products related to semiconductor refrigerators, it is necessary to test the cooling capacity of semiconductor refrigerators. The existing publication number CN 115060515 A, "A device and method for testing the refrigeration performance of semiconductor refrigeration modules", provides a test method for semiconductor refrigeration modules, but the entire device needs to be equipped with a module performance test insulation box and an ambient temperature insulation box, and the semiconductor refrigeration module to be tested needs to be placed between the module performance test box and the environmental insulation box for testing. This test device has a complex structure and the test operation steps are also cumbersome, which is inconvenient to use in the testing of some small semiconductor refrigerators. Utility Model Content

[0004] In view of the above problems, the utility model provides a cooling capacity measuring device for a semiconductor refrigerator, which solves the problem of the complexity of the existing semiconductor refrigerator measuring devices.

[0005] To achieve the above-mentioned purpose, the present application provides a refrigeration capacity measuring device for a semiconductor refrigerator, including a shell, an electric heater and a sensor assembly. The shell is provided with a first mounting groove, the first mounting groove is used to fix the semiconductor refrigerator, the shell has a refrigeration chamber, the semiconductor refrigerator is used to reduce the gas temperature in the refrigeration chamber; the electric heater is arranged on the inner wall of the shell, the electric heater is used to increase the gas temperature in the refrigeration chamber; the sensor assembly includes at least one first sensor, the first sensor is arranged on the inner wall of the shell, and is used to detect the gas temperature in the refrigeration chamber.

[0006] In some embodiments, the electric heater and the semiconductor refrigerator are arranged opposite to each other, and the first sensor is arranged between the electric heater and the semiconductor refrigerator.

[0007] In some embodiments, the sensing assembly further includes a second sensor, which is disposed outside the housing and is used to collect room temperature.

[0008] In some embodiments, the shell includes a first side plate group, a second side plate group and a third side plate group, the first side plate group includes two first side plates, and the two first side plates are spaced apart along a first direction; the second side plate group includes two second side plates, and the two second side plates are spaced apart along a second direction; the third side plate group includes two third side plates, and the two third side plates are spaced apart along a third direction; the first direction, the second direction and the third direction are perpendicular to each other, and the first side plate group, the second side plate group and the third side plate group are enclosed to form the shell.

[0009] In some embodiments, the first mounting groove is disposed on one first side plate, and the electric heater is disposed on another first side plate.

[0010] In some embodiments, the number of the first sensors is two, and one first sensor is centrally disposed on one second side plate.

[0011] In some embodiments, the sensing assembly further includes a third sensor; the number of the third sensors is two, and one third sensor is centrally disposed on a third side plate.

[0012] In some embodiments, the shell is a polyurethane foam insulation box.

[0013] In some embodiments, a fixing plate is further included, which is disposed on the outer side of the shell where the first mounting groove is located, and the semiconductor refrigerator is detachably connected to the first mounting groove via the fixing plate.

[0014] Different from the prior art, in the above technical scheme, the measuring device includes a shell, an electric heater and a sensor assembly. The shell is provided with a first mounting groove, the first mounting groove is used to fix the semiconductor refrigerator, the shell has a refrigeration chamber, the semiconductor refrigerator is used to reduce the gas temperature in the refrigeration chamber; the electric heater is arranged on the inner wall of the shell, the electric heater is used to increase the gas temperature in the refrigeration chamber; the sensor assembly includes at least one first sensor, the first sensor is arranged on the inner wall of the shell, and is used to detect the gas temperature in the refrigeration chamber. This technical scheme arranges the semiconductor refrigerator to be measured in the first mounting groove, so that the refrigeration end of the semiconductor refrigerator is placed in the refrigeration chamber, and by simultaneously supplying power to the semiconductor refrigerator and the electric heater, the gas temperature in the refrigeration chamber is detected in real time by means of the first sensor of the sensor assembly, until the temperature in the refrigeration chamber is consistent with the outdoor temperature, then the input electric power of the electric heater is the refrigeration power of the semiconductor refrigerator, and the whole device has a simple structure and is easy to use.

[0015] The above-mentioned records related to the content of the utility model are only an overview of the technical solution of the utility model. In order to enable ordinary technicians in the field to more clearly understand the technical solution of the utility model, and then implement it according to the text of the specification and the contents recorded in the drawings, and in order to make the above-mentioned purpose and other purposes, features and advantages of the utility model easier to understand, the specific implementation method and drawings of the utility model are explained below. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The accompanying drawings are only used to illustrate the principles, implementation methods, applications, characteristics and effects of the specific embodiments of the present invention and other related contents, and shall not be considered as limitations of the present invention.

[0017] In the drawings of the specification:

[0018] Figure 1 is a schematic diagram of a measuring device according to a specific embodiment;

[0019] Figure 2 It is a front view of the measuring device described in the specific embodiment;

[0020] Figure 3 It is a cross-sectional view of the measuring device described in the specific implementation manner.

[0021] The reference numerals in the above drawings are described as follows:

[0022] 1. Shell;

[0023] 11. First side panel;

[0024] 12. Second side panel;

[0025] 13. The third side panel;

[0026] 14. First mounting slot;

[0027] 2. Electric heater;

[0028] 3. Fixed plate;

[0029] 4. The first sensor;

[0030] 5. Second sensor;

[0031] 6. The third sensor;

[0032] a. First direction;

[0033] b. Second direction;

[0034] c. Third direction. DETAILED DESCRIPTION

[0035] In order to explain in detail the possible application scenarios, technical principles, specific solutions that can be implemented, and the purposes and effects that can be achieved of the present invention, the following is a detailed description of the specific embodiments listed in conjunction with the accompanying drawings. The embodiments described herein are only used to more clearly illustrate the technical solutions of the present invention, and are therefore only used as examples, and cannot be used to limit the scope of protection of the present invention.

[0036] Reference to "embodiment" in this document means that the specific features, structures or characteristics described in conjunction with the embodiment may be included in at least one embodiment of the present invention. The word "embodiment" appearing in various places in the specification does not necessarily refer to the same embodiment, nor does it particularly limit its independence or association with other embodiments. In principle, in the present invention, as long as there is no technical contradiction or conflict, the various technical features mentioned in each embodiment can be combined in any way to form a corresponding implementable technical solution.

[0037] Unless otherwise defined, the technical terms used in this document have the same meanings as those generally understood by those skilled in the art to which the present invention belongs; the use of relevant terms in this document is only for describing specific embodiments and is not intended to limit the present invention.

[0038] In the description of the present invention, the term "and / or" is an expression used to describe the logical relationship between objects, indicating that three relationships may exist, for example, A and / or B, which means: A exists, B exists, and A and B exist at the same time. In addition, the character " / " in this article generally indicates that the objects before and after are in a logical relationship of "or".

[0039] In the present invention, terms such as “first” and “second” are merely used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship of quantity, priority or sequence between these entities or operations.

[0040] Without further restrictions, in the present invention, the words "include", "comprises", "has" or other similar expressions used in sentences are intended to cover non-exclusive inclusion. These expressions do not exclude the presence of additional elements in the process, method or product including the elements, so that the process, method or product including a series of elements may include not only those limited elements, but also other elements not explicitly listed, or also include elements inherent to such process, method or product.

[0041] Similar to the understanding in the Examination Guidelines, in the present invention, expressions such as "greater than", "less than", "exceed" and the like are understood to exclude the number itself; expressions such as "above", "below", "within" and the like are understood to include the number itself. In addition, in the description of the embodiments of the present invention, "multiple" means more than two (including two), and similar expressions related to "multiple" are also understood in this way, such as "multiple groups", "multiple times", etc., unless otherwise clearly and specifically limited.

[0042] In the description of the embodiments of the present invention, the space-related expressions used, such as "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "vertical", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicate the orientation or position relationship based on the orientation or position relationship shown in the specific embodiments or drawings, and are only for the convenience of describing the specific embodiments of the present invention or facilitating the reader's understanding, and do not indicate or imply that the referred device or component must have a specific position, a specific orientation, or be constructed or operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present invention.

[0043] Unless otherwise expressly specified or limited, in the description of the embodiments of the present utility model, the terms "install", "connect", "connect", "fix", "set" and the like used should be understood in a broad sense. For example, the "connection" can be a fixed connection, a detachable connection, or an integrated setting; it can be a mechanical connection, an electrical connection, or a communication connection; it can be a direct connection, or an indirect connection through an intermediate medium; it can be the internal connection of two elements or the interaction relationship between two elements. For those skilled in the technical field of the present utility model, the specific meanings of the above terms in the embodiments of the present utility model can be understood according to the specific circumstances.

[0044] See also Figures 1 to 3 The present embodiment provides a cooling capacity measuring device for a semiconductor refrigerator, comprising a shell 1, an electric heater 2 and a sensor assembly. The shell 1 is provided with a first mounting groove 14, and the first mounting groove 14 is used to fix the semiconductor refrigerator. The shell 1 has a refrigeration chamber, and the semiconductor refrigerator is used to reduce the gas temperature in the refrigeration chamber; the electric heater 2 is arranged on the inner wall of the shell 1, and the electric heater 2 is used to increase the gas temperature in the refrigeration chamber; the sensor assembly includes at least one first sensor 4, and the first sensor 4 is arranged on the inner wall of the shell 1, and is used to detect the gas temperature in the refrigeration chamber.

[0045] In this embodiment, the housing 1 can be of any shape, and has a well-sealed refrigeration chamber inside the housing 1, wherein the first mounting groove 14 is connected to the refrigeration chamber, so that when the semiconductor refrigerator is fixed on the first mounting groove 14, the refrigeration end of the semiconductor refrigerator can be placed in the refrigeration chamber. The electric heater 2 is placed in the refrigeration chamber, and preferably, the electric heater 2 and the refrigeration end of the semiconductor refrigerator are arranged on both sides of the refrigeration chamber relative to each other, so that the temperature change in the refrigeration chamber can be more uniform, and the measurement accuracy of the semiconductor refrigerator can also be improved.

[0046] This embodiment also includes a sensor assembly, which includes at least one first sensor 4, which is arranged on the inner wall of the housing 1. The first sensor 4 can be a common temperature sensor. When in use, by simultaneously supplying power to the semiconductor refrigerator and the electric heater 2, the gas temperature in the refrigeration chamber is detected in real time by means of the first sensor 4 of the sensor assembly, until the temperature in the refrigeration chamber is consistent with the outdoor temperature, the input electric power of the electric heater 2 is the refrigeration power of the semiconductor refrigerator, and the entire device has a simple structure and is easy to use.

[0047] See also Figure 3 In some embodiments, the electric heater 2 and the semiconductor refrigerator are arranged opposite to each other, and the first sensor 4 is arranged between the electric heater 2 and the semiconductor refrigerator. In this embodiment, the first sensor 4 is preferably arranged between the electric heater 2 and the semiconductor refrigerator. This method enables the gas in the refrigeration chamber to obtain sufficient heat exchange when the first sensor 4 is detecting, and the temperature change detected by the first sensor 4 is also more accurate.

[0048] See also Figure 2 and Figure 3 In some embodiments, the sensor assembly further includes a second sensor 5, which is disposed outside the housing 1 and is used to collect room temperature. In this embodiment, the second sensor 5 is disposed outside the housing 1, and the collection end of the second sensor 5 can detect the room temperature in real time. By comparing the collection temperature of the first sensor 4 and the collection temperature of the second sensor 5, the temperature change trend of the gas in the refrigeration chamber can be reflected. Since the housing 1 isolates the refrigeration chamber from the outside, there is no heat exchange between the refrigeration chamber and the indoor air. Therefore, when the temperature collected by the first sensor 4 is the same as the temperature collected by the second sensor 5, it means that the cooling capacity and heating capacity in the refrigeration chamber have reached a dynamic balance. At this time, the input electrical power of the electric heater 2 is equal to the refrigeration power of the semiconductor refrigerator.

[0049] See also Figures 1 to 3In some embodiments, the shell 1 includes a first side panel 11 group, a second side panel 12 group and a third side panel 13 group, the first side panel 11 group includes two first side panels 11, and the two first side panels 11 are spaced apart along a first direction a; the second side panel 12 group includes two second side panels 12, and the two second side panels 12 are spaced apart along a second direction b; the third side panel 13 group includes two third side panels 13, and the two third side panels 13 are spaced apart along a third direction c; the first direction a, the second direction b, and the third direction c are perpendicular to each other, and the first side panel 11 group, the second side panel 12 group and the third side panel 13 group enclose and form the shell 1.

[0050] In this embodiment, the first direction a, the second direction b and the third direction c can be understood as three directions of the Cartesian coordinate system, and the arrangement of the first side panel 11 group, the second side panel 12 group and the third side panel 13 group can be understood with reference to the structure of the rectangular box.

[0051] Further, in some embodiments, the first mounting groove 14 is arranged on one first side plate 11, and the electric heater 2 is arranged on the other first side plate 11. The relative arrangement of the electric heater 2 and the semiconductor refrigerator is realized. Optionally, the first mounting groove 14 is arranged in the center area of ​​the first side plate 11, and the electric heater 2 is arranged in the center area of ​​the other first side plate 11.

[0052] In some embodiments, the number of the first sensors 4 is two, and one first sensor 4 is centrally disposed on one second side plate 12. In this embodiment, the two first sensors 4 are disposed opposite to each other, which can increase the temperature collection points in the refrigeration chamber, and a more accurate gas temperature value in the refrigeration chamber can be obtained by taking the average of the temperatures collected by the two first sensors 4.

[0053] For further information, see Figure 3 In some embodiments, the sensor assembly further includes a third sensor 6; the number of the third sensors 6 is two, and one third sensor 6 is centrally disposed on a third side plate 13. By adding the third sensor 6, the circumferential gas temperature in the refrigeration chamber can be collected to improve the accuracy of the measured temperature in the refrigeration chamber, thereby improving the measurement accuracy of the refrigeration capacity of the semiconductor refrigerator.

[0054] In some embodiments, the housing 1 is a polyurethane foam insulation box. Polyurethane is an excellent thermal insulation material with a low thermal conductivity, which can effectively reduce heat conduction. The polyurethane foam insulation box can provide good thermal insulation effect, avoid heat loss or penetration, and thus keep the temperature of the object stable.

[0055] In some embodiments, a fixing plate 3 is further included, and the fixing plate 3 is arranged outside the housing 1 where the first mounting groove 14 is located, and the semiconductor refrigerator is detachably connected to the first mounting groove 14 through the fixing plate 3. The fixing plate 3 is a flat plate structure, see Figure 1 Specifically, a second mounting groove is provided on the fixing plate 3, and the second mounting groove is coaxially arranged with the first mounting groove 14. The difference is that the size of the second mounting groove is adapted to the semiconductor refrigerator. When the semiconductor refrigerator is arranged on the shell 1 through the second mounting groove and the first mounting groove 14, the fixing plate 3 can cover the first mounting groove 14 without affecting the structure of the semiconductor refrigerator, and is in airtight contact with the outer surface of the semiconductor refrigerator to ensure the sealing of the refrigeration chamber.

[0056] In the above technical scheme, the measuring device includes a housing 1, an electric heater 2 and a sensor assembly. The housing 1 is provided with a first mounting groove 14, the first mounting groove 14 is used to fix the semiconductor refrigerator, the housing 1 has a refrigeration chamber, and the semiconductor refrigerator is used to reduce the gas temperature in the refrigeration chamber; the electric heater 2 is arranged on the inner side wall of the housing 1, and the electric heater 2 is used to increase the gas temperature in the refrigeration chamber; the sensor assembly includes at least one first sensor 4, the first sensor 4 is arranged on the inner side wall of the housing 1, and is used to detect the gas temperature in the refrigeration chamber. In this technical scheme, the semiconductor refrigerator to be measured is arranged in the first mounting groove 14, so that the refrigeration end of the semiconductor refrigerator is placed in the refrigeration chamber, and the semiconductor refrigerator and the electric heater 2 are powered at the same time, and the gas temperature in the refrigeration chamber is detected in real time by means of the first sensor 4 of the sensor assembly, until the temperature in the refrigeration chamber is consistent with the outdoor temperature, then the input electric power of the electric heater 2 is the refrigeration power of the semiconductor refrigerator, the whole device has a simple structure, is easy to use, can test the refrigeration capacity of semiconductor refrigerators of different models, and accelerate the design progress of semiconductor refrigerator related products.

[0057] Finally, it should be noted that although the above embodiments have been described in the specification and drawings of the utility model, this does not limit the scope of patent protection of the utility model. All technical solutions generated by replacing or modifying equivalent structures or equivalent processes based on the essential concept of the utility model using the contents recorded in the specification and drawings of the utility model, as well as directly or indirectly implementing the technical solutions of the above embodiments in other related technical fields, are included in the scope of patent protection of the utility model.

Claims

1. A device for measuring the cooling capacity of a semiconductor refrigerator, characterized in that: include: A shell, wherein the shell is provided with a first mounting groove, the first mounting groove is used to fix a semiconductor refrigerator, the shell has a refrigeration chamber, and the semiconductor refrigerator is used to reduce the gas temperature in the refrigeration chamber; An electric heater, disposed on the inner wall of the shell, and used to increase the temperature of the gas in the refrigeration chamber; The sensor assembly comprises at least one first sensor, wherein the first sensor is arranged on the inner wall of the shell and is used for detecting the gas temperature of the refrigeration chamber.

2. The cooling capacity measuring device of a semiconductor refrigerator according to claim 1, characterized in that: The electric heater is arranged opposite to the semiconductor refrigerator, and the first sensor is arranged between the electric heater and the semiconductor refrigerator.

3. The cooling capacity measuring device of a semiconductor refrigerator according to claim 2, characterized in that: The sensor assembly also includes: The second sensor is arranged outside the shell, and the second sensor is used to collect room temperature.

4. The cooling capacity measuring device of a semiconductor refrigerator according to claim 3, characterized in that: The housing comprises: A first side plate group, comprising two first side plates, wherein the two first side plates are spaced apart along a first direction; A second side plate group, comprising two second side plates, wherein the two second side plates are spaced apart along a second direction; A third side plate group, comprising two third side plates, the two third side plates being spaced apart along a third direction; The first direction, the second direction, and the third direction are perpendicular to each other, and the first side plate group, the second side plate group, and the third side plate group are enclosed to form the shell.

5. The cooling capacity measuring device of a semiconductor refrigerator according to claim 4, characterized in that: The first mounting groove is arranged on one of the first side plates, and the electric heater is arranged on the other of the first side plates.

6. The cooling capacity measuring device of a semiconductor refrigerator according to claim 5, characterized in that: The number of the first sensors is two, and one first sensor is centrally disposed on one of the second side plates.

7. The cooling capacity measuring device of a semiconductor refrigerator according to claim 6, characterized in that: The sensor assembly also includes: The third sensor, the number of the third sensors is two, and one of the third sensors is centrally arranged on one of the third side plates.

8. The cooling capacity measuring device of a semiconductor refrigerator according to claim 7, characterized in that: The shell is a polyurethane foam insulation box.

9. The cooling capacity measuring device of a semiconductor refrigerator according to claim 1, characterized in that: Also includes: A fixing plate is arranged on the outer side of the shell where the first mounting groove is located, and the semiconductor refrigerator is detachably connected to the first mounting groove through the fixing plate.

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