Food processor

Abstract

The utility model relates to a food processor. The food processor comprises a bowl body, a bowl base and a semiconductor chilling plate. The bowl body is provided with a stirring cavity used for stirring food materials. The bowl seat is provided with a water storage tank capable of containing water and a heat conducting sheet capable of conducting heat, the bowl body is assembled in the water storage tank, and the heat conducting sheet comprises an inner side part located in the water storage tank and an outer side part located outside the water storage tank. The semiconductor chilling plate comprises a cold end and a hot end, and the cold end is in contact with the outer side part. The food processor can solve the problem that the temperature of food materials is too high in the stirring process.

Description

Technical Field

[0001] The present application relates to the technical field of small household appliances, and more specifically, to a food processor. Background Art

[0002] Food processors are used to process food materials, such as beating and kneading dough. For example, a chef machine or dough mixer is a multifunctional kitchen appliance that can knead dough, beat eggs, and stir dough, mainly used in the field of Chinese and Western pastries. It is loved by operators for its advantages of saving trouble and labor, being convenient and fast, and greatly reducing the difficulty of cooking for operators.

[0003] However, the above-mentioned food processor also has some defects. For example, the heat generated during the dough beating process can easily cause the dough temperature to rise, thereby causing the dough to ferment prematurely. Summary of the invention

[0004] The present application provides a food processor, which can solve the problem of excessive temperature of food during mixing.

[0005] A food processor, comprising:

[0006] The bowl body is provided with a stirring chamber for stirring ingredients;

[0007] A bowl seat, wherein the bowl seat is provided with a water storage tank for containing water and a heat conducting sheet for conducting heat, wherein the bowl body is assembled in the water storage tank, and the heat conducting sheet comprises an inner portion located in the water storage tank and an outer portion located outside the water storage tank;

[0008] The semiconductor cooling sheet comprises a cold end and a hot end, wherein the cold end contacts the outer portion.

[0009] In this solution, the semiconductor refrigeration chip can generate cold energy at the cold end after being energized. The cold energy is transferred to the food in the mixing chamber through the heat conductive plate, the water in the water storage tank and the bowl body, thereby preventing the food from overheating during the mixing process.

[0010] Optionally, the bowl seat further comprises a receiving cavity disposed below the water tank, the outer portion is disposed in the receiving cavity, and the food processor further comprises a heat sink contained in the receiving cavity, the heat sink is in contact with the hot end, and the heat of the hot end can be transferred to the heat sink and then transferred out by the heat sink.

[0011] Optionally, the heat sink comprises a substrate and a plurality of heat sinks extending from the substrate and isolated from each other, and the substrate contacts the hot end. The heat of the hot end can be transferred to the plurality of heat sinks through the substrate, the substrate can increase the heat conduction area, and the plurality of heat sinks are separated to form heat dissipation gaps, which can increase the heat conduction rate and ensure a better heat dissipation effect.

[0012] Optionally, the outer portion is also in contact with the substrate. Heat can also be directly transferred from the outer portion to the heat sink, increasing the heat dissipation path, which is conducive to further improving the heat dissipation effect.

[0013] Optionally, a groove is provided in the middle of the outer part, the semiconductor cooling sheet is arranged in the groove, and the edge of the outer part contacts the substrate. The groove provides installation space for the semiconductor cooling sheet, and the edge realizes thermal conduction with the substrate.

[0014] Optionally, the substrate includes a central area in contact with the hot end and an edge area not in contact with the hot end, and the plurality of heat dissipation units include a plurality of first heat dissipation units arranged in the central area and a plurality of second heat dissipation units arranged in the edge area, and the number of the first heat dissipation units is greater than the number of the second heat dissipation units. The central area is in contact with the hot end, and the temperature rise is large. A large number of first heat dissipation units is more conducive to achieving rapid heat dissipation. The heat of the edge area is transferred from the central area, and a smaller number of second heat dissipation units can also assist in heat dissipation, and the heat dissipation effect is better.

[0015] Optionally, a volume of the first heat dissipation unit is smaller than a volume of the second heat dissipation unit.

[0016] The first heat dissipation unit with a smaller volume is more conducive to achieving rapid heat dissipation. The heat in the edge area is transferred from the central area. The second heat dissipation unit with a larger volume can also assist in heat dissipation, resulting in a better heat dissipation effect.

[0017] Optionally, the first heat dissipation unit and the second heat dissipation unit have different shapes. According to different regions, the first heat dissipation unit and the second heat dissipation unit are set to have different shapes, which makes the heat dissipation of the first heat dissipation unit and the second heat dissipation unit more reasonable.

[0018] Optionally, one of the plurality of first heat dissipation units is arranged at the center of the central area, and the remaining first heat dissipation units are evenly arranged from inside to outside around the first heat dissipation unit at the center to form a plurality of circles. This allows the plurality of first heat dissipation units to be arranged more regularly in the central area, and more first heat dissipation units can be arranged to increase the heat dissipation area.

[0019] Optionally, a plurality of the second heat dissipation units are uniformly arranged in sequence along the circumferential direction in the edge region; and / or

[0020] The plurality of second heat dissipation units are evenly arranged in a circle around the center of the substrate. The plurality of second heat dissipation units are regularly arranged, and more second heat dissipation units can be provided, so that the heat dissipation effect is better.

[0021] Optionally, the food processor further comprises a fan housed in the housing chamber, the bowl seat further comprises a heat dissipation hole for connecting the housing chamber with the outside, and the fan faces the heat dissipation element and the heat dissipation hole. The fan can accelerate the flow of air and quickly discharge the hot air in the housing chamber.

[0022] Optionally, the bowl body includes a bowl body and a connecting portion disposed at the bottom of the bowl body, the connecting portion is detachably connected to the bowl seat in the water storage tank, the connecting portion is a hollow structure, and the bottom of the bowl body is exposed from the hollow of the connecting portion. The bottom of the bowl body can directly contact the water in the water storage tank to improve the heat transfer rate.

[0023] Optionally, the bottom wall of the water storage tank is provided with an opening, and the heat conductive sheet seals the opening. The heat conductive sheet is engaged with the bowl seat at the opening and serves as a part of the bottom wall of the water storage tank. The upper part of the heat conductive sheet is exposed on the inner side of the water storage tank to form an inner part located in the water storage tank, and the lower part of the heat conductive sheet is arranged on the outer side of the water storage tank to form an outer part located outside the water storage tank, so as not to occupy too much space inside the water storage tank. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 is a cross-sectional view of a food processor shown in an exemplary embodiment of the present application;

[0025] Figure 2 yes Figure 1 An exploded view of a food processor shown in FIG.

[0026] Figure 3 yes Figure 1 A cross-sectional view of the bowl seat shown in FIG.

[0027] Figure 4 yes Figure 3 Magnified view of site A in the middle;

[0028] Figure 5 is a schematic diagram of multiple heat dissipation units of a heat dissipation element;

[0029] Figure 6 is a schematic diagram of a base plate of a heat sink;

[0030] Figure 7 It is a schematic diagram of a bowl base provided with heat dissipation holes;

[0031] Figure 8 It is a cross-sectional view of the bowl. DETAILED DESCRIPTION

[0032] Please refer to Figure 1 , Figure 1 It is a cross-sectional view of a food processor 100 according to an exemplary embodiment of the present application.

[0033] The present application provides a food processor 100, which includes a machine base 10, a machine head 20, a bowl body 30 and a bowl base 40. The machine head 20 is assembled on the top of the machine base 10 and is located above the bowl body 30. A stirring assembly ( Figure 1 The mixing assembly is disposed in a mixing chamber 31 of the bowl body 30, and the mixing chamber 31 is used to contain the ingredients to be mixed. The food processor 100 includes but is not limited to a chef machine, a dough mixer, a bread machine, and the like.

[0034] The motor in the head 20 can drive the stirring assembly to rotate in the stirring chamber 31 of the bowl body 30, for example, to achieve dough kneading, egg beating, etc. The bowl seat 40 is arranged on the side of the base 10, and the bowl seat 40 and the base 10 can be integrated, but not limited to this. The bowl body 30 is supported and assembled on the bowl seat 40, and the assembly method includes but is not limited to a detachable method. Figure 1 In the illustrated embodiment, the bottom surface of the bowl seat 40 is flush with the bottom surface of the base 10 .

[0035] Please combine Figure 2 and Figure 3 , Figure 2 for Figure 1 An exploded view of blender 100 is shown in FIG. Figure 3 for Figure 1 A schematic diagram of a base 10 and a bowl base 40 is shown in FIG.

[0036] The bowl seat 40 is provided with a water storage tank 41 for containing water and a heat conducting sheet 42 for conducting heat, the bowl body 30 is assembled in the water storage tank 41, and the heat conducting sheet 42 includes an inner portion 420 located in the water storage tank 41 and an outer portion 421 located outside the water storage tank 41. The food processor 100 further includes a semiconductor cooling sheet 50, the semiconductor cooling sheet 50 includes a cold end 51 and a hot end 52, and the cold end 51 is in contact with the outer portion 421.

[0037] According to the above description, the semiconductor refrigeration chip 50 can generate cold energy at the cold end 51 after being energized. The cold energy is transferred to the food in the mixing chamber through the heat conducting chip 42, the water in the water storage tank 41 and the bowl body 30, thereby preventing the food from being overheated during the mixing process.

[0038] In one embodiment, in order to prevent the yeast in the dough from being frozen, the minimum temperature of the cold end 51 of the semiconductor refrigeration chip 50 is set to be greater than or equal to 4°C. The semiconductor refrigeration chip 50 is formed by stacking P-type semiconductor materials and N-type semiconductor materials, and a PN junction can be formed inside. When direct current is passed through the semiconductor refrigeration chip 50, electrons flow, and the cold end 51 of the semiconductor refrigeration chip 50 can generate cold energy, and the hot end 52 generates heat.

[0039] In one embodiment, Figure 3As shown, the bottom wall 410 of the water tank 41 is provided with an opening 411, and the heat conductive sheet 42 seals the opening 411. In this way, the heat conductive sheet 42 is connected to the bowl seat 40 at the opening 411, and serves as a part of the bottom wall of the water tank 41. The upper part of the heat conductive sheet 42 is exposed on the inner side of the water tank 41, forming an inner part 420 located in the water tank 41, and the lower part of the heat conductive sheet 42 is arranged on the outer side of the water tank 41, forming an outer part 421 located outside the water tank 41, which will not occupy too much space inside the water tank 41. In addition, the heat conductive sheet 42 can be made of a material with a high thermal conductivity, such as aluminum, aluminum alloy and other metal materials. The rest of the bowl seat 40 can be made of plastic material, which can reduce material costs.

[0040] Please combine Figure 3 to Figure 4 , Figure 4 for Figure 3 Magnified view of site A.

[0041] In one embodiment, the bowl seat 40 also includes a receiving cavity 43 disposed below the water storage tank 41, and the outer portion 421 is located in the receiving cavity 43. The food processor 100 also includes a heat sink 60 received in the receiving cavity 43, and the heat sink 60 is in contact with the hot end 52. The heat sink 60 can absorb and transfer the heat of the hot end 52, and transfer the heat to the outside. That is, the heat generated by beating the food is conducted to the cold end 51 of the semiconductor refrigeration sheet 50 through the bowl body, the liquid in the water storage tank 41, and the heat conductive sheet 42, and then conducted to the hot end 52 of the semiconductor refrigeration sheet 50, and finally the heat is transferred to the outside.

[0042] In one embodiment, the heat sink 60 includes a substrate 61 and a plurality of heat sinks 62 extending from the substrate 61 and separated from each other, and the substrate 61 is in contact with the hot end 52. The heat absorbed by the cold end 51 is transferred to the hot end 52, and the heat of the hot end 52 can be transferred to the plurality of heat sinks 62 through the substrate 61. The substrate 61 can increase the heat conduction area, and the plurality of heat sinks 62 are separated to form heat dissipation gaps, which can increase the heat conduction rate and ensure better heat dissipation effect.

[0043] In one embodiment, the outer portion 421 is also in contact with the substrate 61. In this configuration, heat can also be directly transferred from the outer portion 421 to the heat sink 60, and the heat dissipation path is increased, which is conducive to further improving the heat dissipation effect.

[0044] In one embodiment, a groove 4211 is provided at the middle portion 4210 of the outer portion 421, the semiconductor cooling sheet 50 is disposed in the groove 4211, and the edge portion 4213 of the outer portion 421 contacts the substrate 61. In this configuration, the groove 4211 provides an installation space for the semiconductor cooling sheet 50, and the edge portion 4213 achieves thermal conduction with the substrate 61.

[0045] Please combine Figure 3 , Figure 5 and Figure 6 , Figure 5 FIG. 4 is a schematic diagram of multiple heat dissipation units on the heat dissipation element 60 . Figure 6 is a schematic diagram of a substrate of the heat sink 60 .

[0046] In one embodiment, the substrate 61 includes a central area 610 in contact with the hot end 52 and an edge area 611 not in contact with the hot end 52. The plurality of heat dissipation units 62 include a plurality of first heat dissipation units 620 disposed in the central area 610 and a plurality of second heat dissipation units 621 disposed in the edge area 611. The number of the first heat dissipation units 620 is greater than the number of the second heat dissipation units 621, and / or the volume of the first heat dissipation units 620 is smaller than the volume of the second heat dissipation units 621. In this embodiment, the central area 610 is in contact with the hot end 52 and has a large temperature rise. The first heat dissipation units 620 with a smaller volume and a larger number are more conducive to achieving rapid heat dissipation. The heat of the edge area 611 is transferred from the central area 610. The second heat dissipation units 621 with a larger volume and a smaller number can also assist in heat dissipation, resulting in a better heat dissipation effect. Figure 6 In the illustrated embodiment, the central region 610 protrudes toward the semiconductor cooling sheet 50 relative to the edge region 611, the first heat dissipation unit 620 is configured as a columnar structure, the second heat dissipation unit 621 is configured as a plate structure, and a plurality of second heat dissipation units 621 are arranged around the first heat dissipation unit 620. The base plate 61 is further provided with a wire groove 612 for leading out the wires of the semiconductor cooling sheet 50.

[0047] In one embodiment, the first heat dissipation unit 620 and the second heat dissipation unit 621 have different shapes. That is, the first heat dissipation unit 620 and the second heat dissipation unit 621 are set in different shapes according to different regions, which makes the heat dissipation of the first heat dissipation unit 620 and the second heat dissipation unit 621 more reasonable.

[0048] In one embodiment, a plurality of the first heat dissipation units 620 are evenly distributed in the central area 610 , and a plurality of the second heat dissipation units 621 are evenly distributed in the edge area 611 , so that the heat dissipation in each area is more uniform.

[0049] exist Figure 5In the illustrated embodiment, one of the plurality of first heat dissipation units 620 is disposed at the center of the central region 610, and the remaining first heat dissipation units 620 are uniformly arranged from the inside to the outside in multiple circles around the first heat dissipation unit 620 at the center, for example, they can be arranged in annular circles or in square circles, and the specific number of circles can be determined by the area of ​​the central region 610 and the interval between each circle. In this way, the plurality of first heat dissipation units 620 can be arranged more regularly in the central region 610, and more first heat dissipation units 620 can be provided to increase the heat dissipation area. In this embodiment, the substrate 61 is annular, and the remaining first heat dissipation units 620 are uniformly arranged from the inside to the outside in multiple annular circles around the first heat dissipation unit 620 at the center, and the diameter of the annular circles increases from the inside to the outside.

[0050] In one embodiment, a plurality of the second heat dissipation units 621 are evenly arranged in a circle around the substrate 61. The plurality of the second heat dissipation units 621 may be arranged in a ring shape or in a square shape. The plurality of the second heat dissipation units 621 are regularly arranged, and more second heat dissipation units 621 may be provided, so that the heat dissipation effect is better. In this embodiment, the substrate 61 is annular, and the plurality of the second heat dissipation units 621 are evenly arranged in a circle around the center of the substrate 61, and the circle is an annular circle.

[0051] In one embodiment, the plurality of second heat dissipation units 621 are uniformly arranged in sequence along the circumferential direction in the edge region 611. The plurality of second heat dissipation units 621 surround the periphery of the plurality of first heat dissipation units 620 and can be arranged for at least one circle, which can increase the uniformity of heat dissipation.

[0052] Please combine Figure 2 and Figure 7 , Figure 7 It is a schematic diagram of the bottom of the bowl seat 40.

[0053] In one embodiment, the food processor 100 further includes a fan 70 accommodated in the receiving cavity 43, and the bowl seat 40 is further provided with a heat dissipation hole 44 for connecting the receiving cavity 43 with the outside, and the fan 70 is directly opposite to the heat sink 60 and the heat dissipation hole 44. The fan 70 can accelerate the flow of air and can quickly discharge the hot air in the receiving cavity 43. The bowl seat 40 may include an upper shell 401 and a base 402, wherein the upper shell 401 and the base 402 together enclose the receiving cavity 43, the water storage tank 41 and the heat conductive sheet 42 are arranged on the upper shell 401, and the heat dissipation hole 44 is arranged on the base 402. The heat dissipation hole 44 may be a plurality of small holes arranged in a centralized manner to prevent foreign matter from entering and to have fewer exposed internal components. The connection method between the upper shell 401 and the base 402 includes but is not limited to bolt connection.

[0054] Please refer to Figure 8 , Figure 8 for Figure 1 A cross-sectional view of the bowl body 30 is shown in FIG.

[0055] In one embodiment, the bowl body 30 includes a bowl body 32 and a connecting portion 33 disposed at the bottom of the bowl body 32, wherein the connecting portion 33 is detachably connected to the bowl seat 40 in the water storage tank 41, and the connecting portion 33 is a hollow structure, and the bottom of the bowl body 32 is exposed from the hollow of the connecting portion 33. With such a configuration, the bottom of the bowl body 32 can directly contact the water in the water storage tank 41, thereby improving the heat transfer rate. The detachable manner of the connecting portion 33 and the bowl seat 40 is not limited, including but not limited to a snap connection or a bolt connection.

[0056] By using the food processor 100 provided in the present application, the food ingredients can be cooled down simultaneously during the mixing process, thereby saving user time, improving product experience, and enhancing product competitiveness.

[0057] By using the food processor 100 provided in the present application, it is possible to avoid premature fermentation of the dough, and it is possible to more easily stir the dough required for making ingredients such as the glove film.

[0058] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

Claims

1. A food processor, characterized in that: include: The bowl body (30) is provided with a stirring chamber for stirring food materials; A bowl seat (40), wherein the bowl seat (40) is provided with a water storage tank (41) capable of containing water and a heat conducting sheet (42) capable of conducting heat, wherein the bowl body (30) is assembled in the water storage tank (41), and the heat conducting sheet (42) comprises an inner portion (420) located in the water storage tank and an outer portion (421) located outside the water storage tank; The semiconductor cooling sheet (50) comprises a cold end (51) and a hot end (52), wherein the cold end (51) is in contact with the outer portion (421).

2. The food processor according to claim 1, characterized in that: The bowl seat (40) further comprises a receiving cavity (43) arranged below the water storage tank (41), the outer portion (421) being arranged in the receiving cavity (43), and the food processor (100) further comprises a heat sink (60) received in the receiving cavity (43), the heat sink (60) being in contact with the hot end (52).

3. The food processor according to claim 2, characterized in that: The heat sink (60) comprises a base plate (61) and a plurality of heat sink units (62) extending from the base plate (61) and isolated from each other. The base plate (61) is in contact with the hot end (52).

4. The food processor according to claim 3, characterized in that: The outer portion (421) is also in contact with the substrate (61), a groove (4211) is provided at the middle portion (4210) of the outer portion (421), the semiconductor cooling plate (50) is arranged in the groove (4211), and the edge portion (4213) of the outer portion (421) is in contact with the substrate (61).

5. The food processor according to claim 3, characterized in that: The substrate (61) includes a central area (610) in contact with the hot end (52) and an edge area (611) not in contact with the hot end (52); the plurality of heat dissipation units (62) include a plurality of first heat dissipation units (620) arranged in the central area (610) and a plurality of second heat dissipation units (621) arranged in the edge area (611); the number of the first heat dissipation units (620) is greater than the number of the second heat dissipation units (621).

6. The food processor according to claim 5, characterized in that: The volume of the first heat dissipation unit (620) is smaller than the volume of the second heat dissipation unit (621); and / or The first heat dissipation unit (620) and the second heat dissipation unit (621) have different shapes.

7. The food processor according to claim 5, characterized in that: One of the plurality of first heat dissipation units (620) is disposed at the center of the central area (610), and the remaining first heat dissipation units (620) are evenly arranged from the inside to the outside into a plurality of circles around the first heat dissipation unit (620) at the center.

8. The food processor according to claim 5, characterized in that: A plurality of the second heat dissipation units (621) are uniformly arranged in sequence along the circumferential direction in the edge region (611); or A plurality of the second heat dissipation units (621) are evenly arranged in a circle around the center of the base plate (61).

9. The food processor according to any one of claims 2 to 7, characterized in that: The food processor (100) further comprises a fan (70) housed in the housing cavity (43); the bowl seat (40) is further provided with a heat dissipation hole (44) for connecting the housing cavity (43) with the outside; the fan (70) is directly opposite to the heat dissipation element (60) and the heat dissipation hole (44).

10. The food processor according to any one of claims 1 to 7, characterized in that: The bowl body (30) comprises a bowl body (32) and a connecting portion (33) arranged at the bottom of the bowl body (32); the connecting portion (33) is detachably connected to the bowl seat (40) in the water storage tank (41); the connecting portion (33) is a hollow structure, and the bottom of the bowl body (32) is exposed from the hollow portion of the connecting portion (33); and / or The bottom wall (410) of the water storage tank is provided with an opening (411), and the heat conducting sheet (42) seals the opening (411).

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