Ball falling detection device of wire welding machine

Abstract

The utility model provides a ball-off detection device for a wire bonder, which relates to the technical field of wire bonders and comprises a welding shooting assembly, the welding shooting assembly comprises a welding head, a first CCD camera is arranged on one side of the welding head, a second CCD camera is arranged on the other side of the welding head, a lens side lamp is arranged on the front side of each CCD camera, and a lens side lamp is arranged on the front side of each lens side lamp. A lens coaxial lamp is arranged above each CCD camera, a threading tensioner is arranged on the rear side of each lens coaxial lamp, more than one compressed air pipe is connected to the rear side of each threading tensioner, the welding head comprises a welding nozzle, a transduction rod is connected to the welding nozzle, and a wire clamp is arranged on the transduction rod; according to the device, the position of the chip support in the feeding and conveying process can be uniquely limited, position deviation does not occur, meanwhile, after the unqualified chip support is shot and detected, adsorption and transfer are directly and automatically achieved, manual processing is not needed, and the labor intensity of workers and the probability of omission in the manual picking process are reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of wire bonding machines, in particular to a ball-off detection device for a wire bonding machine. Background Art

[0002] At present, the ASM wire bonding equipment in the semiconductor packaging industry first uses a welding head to weld and connect the chip holder. After the welding head completes the welding of the chip holder, a CCD camera is used to take pictures and detect whether the chip holder has any ball loss. Since the CCD camera needs to scan the chip holders one by one after welding, and can only scan one chip holder at a time, and rescans after the wire bonding, it has the disadvantages of low work efficiency and long production cycle. The production efficiency needs to be further improved.

[0003] Announcement No. CN208537436U proposes an automatic detection device for ball debonding of a wire bonding machine. In the device, when the welding head is bonding the second chip holder, the first CCD camera will automatically scan and photograph the chip holder that has completed the previous bonding. At the same time, the second CCD camera will automatically scan the chip holder that is bonding. It can scan two chip holders at the same time to determine whether there is a ball debonding phenomenon. It solves the problem that the current wire bonding equipment can only scan and photograph one chip holder at a time, resulting in low production efficiency and long production cycle; however, the device cannot ensure that the spacing between two adjacent chip holders is equal, and the chip holder may be offset during the transmission process, thereby affecting the subsequent wire bonding effect. In addition, if the CCD camera detects the appearance of defective products, the device cannot automatically pick up and transfer the defective products, and waiting for manual processing is prone to omissions and time-consuming, and the degree of automation needs to be improved. Utility Model Content

[0004] The purpose of the utility model is to solve the problems raised in the above background technology, and then propose a wire bonding machine ball drop detection device.

[0005] The technical solution adopted by the utility model to solve its technical problems is:

[0006] A wire welding machine ball drop detection device comprises a welding shooting component, the welding shooting component comprises a welding head, a first CCD camera is arranged on one side of the welding head, a second CCD camera is arranged on the other side of the welding head, a lens side light is arranged on the front side of each CCD camera, a lens coaxial light is arranged above each CCD camera, a threading tensioner is arranged on the rear side of the lens coaxial light, and one or more compressed air pipes are connected to the rear side of the threading tensioner, the welding head comprises a welding nozzle, a transducer rod is arranged on the welding nozzle, a wire clamp is arranged on the transducer rod, and a chain is also included. Plate conveyor belt, chain plate conveyor belt includes several chain plates, each chain plate is provided with a placing plate, the placing plate is provided with a placing groove which is adapted to the size of the chip holder and the chip holder is flush with the surface of the placing plate after being placed, the chain plate conveyor belt is provided with an L-shaped mounting frame, the mounting frame is provided with a moving component, the moving component is provided with a welding shooting component and a lifting and adsorption component which is located on one side of the welding shooting component and is used for automatically transferring defective chip holders, and a defective transfer belt is provided under the mounting frame on one side of the chain plate conveyor belt.

[0007] The device can uniquely define the position of the chip holder during the feeding and conveying process without positional deviation. At the same time, after detecting an unqualified chip holder through photography, it can directly and automatically realize adsorption and transportation without the need for manual processing, thereby reducing the labor intensity of manual labor and the probability of omissions during manual picking.

[0008] Furthermore, the moving component includes a multi-stage electric cylinder, a slide rail and a slider. The mounting frame is provided with the multi-stage electric cylinder and the slide rail. The slide rail is provided with a slider connected to the multi-stage electric cylinder. The slider is provided with a welding shooting component and a lifting and adsorption component.

[0009] The above scheme realizes the position change of the lifting and adsorption component and the welding and shooting component through the mobile component, and then automatically transfers the unqualified chip holder to the defective product transfer belt for secondary rework, without the need for manual intervention to pick up.

[0010] Furthermore, the lifting and adsorption assembly includes an electric push rod, a mounting plate and an electromagnetic plate. The slider is provided with an electric push rod, the electric push rod is connected to the mounting plate, and the mounting plate is provided with an electromagnetic plate.

[0011] The above scheme can automatically separate the unqualified chip holder from the placement slot for transportation through the lifting and adsorption component.

[0012] Furthermore, an infrared receiver is arranged on the mounting frame, and an infrared transmitter is arranged on each placement plate, and the infrared transmitter and the infrared receiver are electrically connected.

[0013] The above scheme can accurately define the transmission position of each chip holder through the cooperation of the infrared transmitter and the infrared receiver, thereby ensuring the stable and accurate effect of the wire bonding process and the subsequent CCD camera shooting and detection.

[0014] Furthermore, a distance sensor is arranged on the mounting plate.

[0015] The above solution can detect the distance between the electromagnetic plate and other objects in real time through the distance sensor, so as to avoid damage caused by violent collision between the electromagnetic plate and other objects.

[0016] Furthermore, a six-degree-of-freedom robotic arm is provided at the end of the chain conveyor belt, and the six-degree-of-freedom robotic arm is connected to an electromagnet for automatically discharging and transporting chip brackets that have passed quality inspection after wire bonding is completed.

[0017] The above scheme can realize the automatic discharge of qualified chip brackets from the slot at the end of the chain conveyor belt after processing and inspection through a six-degree-of-freedom robotic arm in conjunction with an electromagnet, further reducing labor intensity.

[0018] Compared with the prior art, the beneficial effects of the utility model are:

[0019] Compared with the existing technology, the present device can uniquely define the position of the chip holder during the loading and conveying process without positional displacement. At the same time, after detecting unqualified chip holders through photography, it can directly and automatically realize adsorption and transportation without the need for manual processing, thus reducing the labor intensity of manual labor and the probability of omissions during manual picking. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0021] Figure 2 This is a schematic diagram of the electric push rod installation;

[0022] Reference numerals:

[0023] 1. Chain conveyor belt; 11. Chain plate; 12. Placement plate; 13. Placement trough; 14. Defective product transfer belt; 2. Mounting frame; 21. Multi-stage electric cylinder; 22. Slide rail; 23. Slider; 3. Welding camera assembly; 41. Electric push rod; 42. Mounting plate; 43. Electromagnetic plate; 44. Distance sensor; 51. Infrared receiver; 52. Infrared transmitter. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model. The utility model is further described in combination with the drawings and embodiments:

[0025] like Figure 1 and Figure 2 As shown, a wire welding machine ball drop detection device includes a welding shooting component 3, the welding shooting component 3 includes a welding head, a first CCD camera is arranged on one side of the welding head, a second CCD camera is arranged on the other side of the welding head, a lens side light is arranged on the front side of each CCD camera, a lens coaxial light is arranged above each CCD camera, a threading tensioner is arranged on the rear side of the lens coaxial light, and one or more compressed air pipes are connected to the rear side of the threading tensioner, the welding head includes a welding nozzle, a transducer rod is arranged in connection with the welding nozzle, a wire clamp is arranged on the transducer rod, and a chain plate conveyor belt 1 is also included, and the chain plate conveyor belt 1 is provided. The conveyor belt 1 includes a plurality of chain plates 11, each of which is provided with a placement plate 12, a placement groove 13 adapted to the size of the chip holder is opened on the placement plate 12, and the chip holder is flush with the surface of the placement plate 12 after being placed, a mounting frame 2 with an L-shaped main body is mounted on the chain plate conveyor belt 1, a moving component is arranged on the mounting frame 2, a welding shooting component 3 and a lifting and adsorption component for automatically transferring a defective chip holder on one side of the welding shooting component 3 are arranged on the moving component, and a defective transfer belt 14 is arranged under the mounting frame 2 on one side of the chain plate conveyor belt 1.

[0026] Specifically, the moving assembly includes a multi-stage electric cylinder 21, a slide rail 22 and a slider 23. The mounting frame 2 is provided with the multi-stage electric cylinder 21 and the slide rail 22. The slide rail 22 is provided with a slider 23 connected to the multi-stage electric cylinder 21. The slider 23 is provided with a welding shooting assembly 3 and a lifting and adsorption assembly.

[0027] Furthermore, the lifting and adsorption assembly includes an electric push rod 41, a mounting plate 42 and an electromagnetic plate 43. The electric push rod 41 is arranged on the slider 23, the electric push rod 41 is connected to the mounting plate 42, and the electromagnetic plate 43 is arranged on the mounting plate 42. For further optimization of the scheme, a distance sensor 44 is arranged on the mounting plate 42. The distance sensor 44 can detect the distance between the electromagnetic plate 43 and other objects (chip holder or defective product transfer belt 14) in real time to avoid wear caused by violent collision between the electromagnetic plate 43 and other objects.

[0028] It should be noted that the welding camera assembly 3, the chain conveyor belt 1, the multi-stage electric cylinder 21, the electric push rod 41 and the electromagnetic plate 43 are all electrically connected to the PLC system, which is not shown in the figure.

[0029] The workflow of this utility model:

[0030] First, a chip holder is placed in each placement slot 13 in turn. The size of the chip holder is consistent with the size of the placement slot 13, so that the position of the chip holder in the feeding and conveying process is uniquely defined and will not be offset. Then, the chip holder is conveyed to the bottom of the mounting frame 2 along the chain plate conveyor belt 1 and stops. Then, the welding nozzle in the welding shooting component 3 realizes the automatic welding process between the welding wire and the chip holder, and the welding quality is detected during the processing. The working principle of the welding shooting component 3 has been fully disclosed in the announcement number CN208537436U, which proposes a wire welding machine ball removal automatic detection device, and belongs to the prior art and will not be described;

[0031] If the welding quality between the welding wire and the current chip holder is qualified, the chip holder in the placement slot 13 will continue to be conveyed forward to the end of the chain conveyor belt 1 for collection. If the welding quality between the welding wire and the current chip holder is unqualified, the CCD camera will feedback a signal to the PLC system. Then the PLC system first controls the chain conveyor belt 1 to stop working, and then controls the moving component to work so that the lifting and adsorption component moves to the top of the current chip holder. Then the PLC system controls the lifting and adsorption component to move down close to the chip holder and adsorb it. Then the chip holder can be separated from the placement slot 13. Then the PLC system controls the moving component to work again and transfer the chip holder to the top of the defective conveyor belt 14. Then the chip holder is unloaded from the defective conveyor belt 14, and then the unqualified chip holder is transported to a fixed area through the defective conveyor belt 14 for secondary rework. After unloading, the PLC system controls the moving component to work so that the welding and shooting component 3 moves back to the initial position, and then controls the chain conveyor belt 1 to resume work and restart a new round of chip holder assembly line welding processing and inspection process.

[0032] Compared with the existing technology, the present device can uniquely define the position of the chip holder during the loading and conveying process without positional displacement. At the same time, after detecting unqualified chip holders through photography, it can directly and automatically realize adsorption and transportation without the need for manual processing, thus reducing the labor intensity of manual labor and the probability of omissions during manual picking.

[0033] In some embodiments, Figure 1 and Figure 2As shown, an infrared receiver 51 is provided on the mounting frame 2, and an infrared transmitter 52 is provided on each placement plate 12, and the infrared transmitter 52 and the infrared receiver 51 are electrically connected; this embodiment can accurately define the transmission position of each chip bracket through the cooperation of the infrared transmitter 52 and the infrared receiver 51, thereby ensuring that the welding wire processing and subsequent CCD camera shooting and detection effects are stable and accurate.

[0034] In other embodiments, a six-degree-of-freedom robotic arm is provided at the end of the chain conveyor belt 1, and the six-degree-of-freedom robotic arm is connected to an electromagnet for automatic unloading and transportation of chip brackets that have passed quality inspection after wire welding is completed. The six-degree-of-freedom robotic arm and the electromagnet are not shown in the figure, and belong to the existing technology without improvement. This embodiment can realize the automatic unloading of qualified chip brackets from the placement slot 13 at the end of the chain conveyor belt 1 after processing and inspection are completed through the six-degree-of-freedom robotic arm in conjunction with the electromagnet, thereby further reducing labor intensity.

[0035] The above shows and describes the basic principles, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions in the specification are only to illustrate the principles of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the protection required by the utility model. The scope of protection required by the utility model is defined by the attached claims and their equivalents.

Claims

1. A wire welding machine ball drop detection device, comprising a welding camera assembly (3), the welding camera assembly (3) comprising a welding head, a first CCD camera is arranged on one side of the welding head, a second CCD camera is arranged on the other side of the welding head, a lens side light is arranged on the front side of each CCD camera, a lens coaxial light is arranged above each CCD camera, a threading tensioner is arranged on the rear side of the lens coaxial light, one or more compressed air pipes are connected to the rear side of the threading tensioner, the welding head comprises a welding nozzle, a transducer rod is arranged in connection with the welding nozzle, a wire clamp is arranged on the transducer rod, and the welding head comprises a welding nozzle, a transducer rod is arranged on the top of the transducer rod, and the welding head comprises a welding nozzle, a welding nozzle is connected to a transducer rod, and a wire clamp is arranged on the top of the transducer rod, wherein: The invention also comprises a chain conveyor belt (1), wherein the chain conveyor belt (1) comprises a plurality of chain plates (11), each of which is provided with a placement plate (12), the placement plate (12) being provided with a placement groove (13) matching the size of the chip holder and the chip holder being flush with the surface of the placement plate (12) after being placed, a mounting frame (2) having an L-shaped main body is mounted on the chain conveyor belt (1), a moving component is arranged on the mounting frame (2), a welding and shooting component (3) and a lifting and adsorption component for automatically transferring defective chip holders are arranged on the moving component, and a defective transfer belt (14) is arranged on one side of the chain conveyor belt (1) and is located below the mounting frame (2).

2. A wire bonding machine ball drop detection device according to claim 1, characterized in that: The moving assembly comprises a multi-stage electric cylinder (21), a slide rail (22) and a slider (23); the mounting frame (2) is provided with the multi-stage electric cylinder (21) and the slide rail (22); the slide rail (22) is provided with a slider (23) connected to the multi-stage electric cylinder (21); the slider (23) is provided with a welding shooting assembly (3) and a lifting adsorption assembly.

3. A wire bonding machine ball drop detection device according to claim 2, characterized in that: The lifting adsorption assembly comprises an electric push rod (41), a mounting plate (42) and an electromagnetic plate (43); the slider (23) is provided with the electric push rod (41); the electric push rod (41) is connected to the mounting plate (42); and the electromagnetic plate (43) is provided on the mounting plate (42).

4. A wire bonding machine ball drop detection device according to claim 1, characterized in that: An infrared receiver (51) is arranged on the mounting frame (2), and an infrared transmitter (52) is arranged on each placement plate (12). The infrared transmitter (52) and the infrared receiver (51) are electrically connected.

5. The wire bonding machine ball drop detection device according to claim 3, characterized in that: A distance sensor (44) is arranged on the mounting plate (42).

6. The wire bonding machine ball drop detection device according to claim 1, characterized in that: A six-degree-of-freedom mechanical arm is arranged at the end of the chain conveyor belt (1), and the six-degree-of-freedom mechanical arm is connected to an electromagnet for automatically discharging and transporting chip brackets that have passed quality inspection after wire bonding is completed.

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