Electronic equipment heat dissipation assembly

Abstract

The utility model discloses a heat dissipation assembly of electronic equipment, which comprises an internal circulation heat dissipation assembly and an external forced cooling assembly, the internal circulation heat dissipation assembly is at least composed of a water cooling head assembled on a power heating source of a mainboard and a water heat dissipation plate connected with the water cooling head through a pipe; the inner circulation heat dissipation assembly is further connected with the outer forced cooling assembly circulation heat dissipation module through a pipe, so that working fluid can be utilized in the water cooling head through the heat dissipation module to quickly absorb working heat generated by the power heating source during working and flow to the water heat dissipation plate to conduct front-section heat dissipation in the case. And then the external forced cooling assembly is connected to the external forced cooling assembly to carry out rear-section forced heat dissipation, so that the overall cooling effect is improved by combining multi-stage heat dissipation, and the generation of heat accumulation in a power heating source and a host is avoided.

Description

Technical Field

[0001] The utility model relates to a heat dissipation module for electronic equipment, in particular to a heat dissipation module which can improve heat dissipation efficiency and prevent heat accumulation in a power heat source or a host. Background Art

[0002] Currently, due to the advancement of integrated circuits, multiple electronic equipment hosts (servers, chassis) can be integrated into a cabinet, which can effectively save the working space occupied by the host or cabinet when constructing electronic equipment. However, the space set for each host in each cabinet and the space inside each host are extremely limited, which directly affects the heat dissipation efficiency of the working heat generated by each power heat source during operation.

[0003] In the prior art, the main body is mainly cooled by air cooling or water cooling circulation. The air cooling conducts the working heat of the power heat source out of the chassis through a heat sink, a heat pipe or a heat sink fin, and then the fan pushes the hot air out of the chassis and pushes the cold air into the chassis to form a gas heat dissipation circulation system; the other water cooling circulation has a position of the power heat source inside the chassis, and at least one water cooling head is correspondingly arranged, and then connected to an external forced cooling device arranged on the outside of the chassis or on the combined cabinet through a pipeline, so as to circulate and provide working fluid to the water cooling head to cool the power heat source. Circulation heat dissipation cooling effect, and recently it has also been seen that an appropriate number of fans are set on the side of the chassis respectively, and heat convection is generated in the internal space of the chassis through an intake and an exhaust method to assist the insufficiency of water cooling; such as Taiwan Invention Patent Publication No. 202415203A (hereinafter referred to as the previous case), which directly contacts the power heat source with a water cooling head, and brings the working heat generated by the power heat source to the outside forced cooling device through the working fluid for heat exchange and heat dissipation cooling. The working heat of other heat sources in the chassis is sent out of the chassis by fan cooling to produce a cooling effect on the inside of the chassis.

[0004] Among them, the traditional pure air-cooled radiator uses air as the medium, which can generate convection with the cold air of the external environment to dissipate heat. However, the efficiency of air in transferring heat is very poor. Although a three-dimensional heat dissipation module composed of heat pipes, radiators or temperature-averaging plates has been developed to improve its heat dissipation effect, its critical heat dissipation efficiency cannot be significantly improved due to the limited heat dissipation space in the general host body. When faced with an environment where a higher power heat source is required to work, traditional air cooling has reached its development limit and cannot bear the load. The current development of heat dissipation devices is to provide better heat dissipation efficiency for integrated electronic equipment (server cabinets, communication chassis) to dissipate heat (please refer to Figure 1 and Figure 2) Currently, there are already: a simple water cooling circulation heat dissipation system or a composite cooling circulation system such as air cooling combined with water cooling or water cooling combined with water cooling as described in the previous case. Compared with the traditional air cooling module, the water cooling module in each of the above systems has a water cooling head 10, a cooling liquid distribution unit (CDU) 11, and an air heat exchange cooler 12 or a liquid heat exchange cooler 13 and other external forced cooling components to form a heat dissipation system.

[0005] Generally, the fan 15 used for air cooling is arranged at the front or rear side of the main body or outside of the electronic device, and the hot air in the internal space of the server chassis is discharged out of the electronic device by forced suction and exhaust. Therefore, air cooling is to provide convection circulation between the hot air inside the electronic device and the external cold gas through the fan.

[0006] Since the electronic device originally has a fan that provides air cooling, it can only provide convection circulation of airflow inside and outside the electronic device. The fan cannot directly provide cooling effect for the water cooling system, and it is of no help to cool down the working fluid used for cooling. Therefore, after the water cooling head 10 absorbs the working heat generated by the power heat source 14 using the working fluid inside the electronic device, the high-heat working fluid will first be collected in the cooling liquid distribution unit 11 and then sent to the air heat exchange cooler 12. The radiator 120 and the fan 121 of the air heat exchange cooler 12 cool the working fluid flowing through the inside of the air heat exchange cooler 12. The cooled working fluid is then sent back to the inside of the electronic device by the cooling liquid distribution unit (CDU) 11 to circulate and cool each of the power heat sources 14.

[0007] The water-cooled circulating heat dissipation method mainly arranges a water cooling head 10 at the position where a power heat source 14 is inside the electronic device, and then connects it to an external forced cooling component arranged outside the electronic device through a pipeline 101. The cooling working fluid performs circulating heat exchange in the water-cooled circulating heat dissipation system, and the heat from the power heat source is brought out of the outside of the electronic device. The cooling working fluid is then cooled by a gas heat exchange cooler 12 or a liquid heat exchange cooler 13, and finally pumped into the electronic device again through a cooling liquid distribution unit (CDU) 11 to perform circulating cooling operations on each of the power heat sources.

[0008] However, the problem that the heat dissipation components in the current prior art encounter and have not been able to solve is that, since the number of power heat sources 14 inside the electronic device has increased significantly in order to meet the demand for increased computing power, the high-temperature working fluid that is circulated and discharged under normal operation often cannot be cooled down to a level equal to or lower than the expected working temperature before being sent back to the electronic device again to provide circulating heat dissipation to the power heat source. Moreover, when this working fluid that has not been completely cooled to the expected low temperature continues to return to the electronic device with unexpected medium and high temperatures for circulating heat dissipation, due to the insufficient temperature difference (thermal gradient) between the working fluid and the power heat source, not only the heat dissipation efficiency is greatly reduced, but also the power heat source cannot be provided with sufficient cooling and heat dissipation, and heat will continue to accumulate due to the insufficient working heat dissipation generated by the power heat source, which will eventually cause thermal shutdown or burning of the power heat source. Although the industry has long developed designs such as the above-mentioned previous case, no significant improvement has been seen.

[0009] Therefore, how to solve the disadvantage of the water cooling system in the prior art that the working fluid cannot be sufficiently cooled down is one of the important lessons that practitioners in this field need to actively improve.

[0010] In response to the above needs, if we further explore the current water cooling method as an effective heat dissipation method, it is only necessary to absorb the working heat generated by the power heat source with the working fluid through the water cooling head, and then flow it to the external forced cooling system arranged outside the chassis to circulate and cool the working fluid to the expected working temperature, and then guide the cooled working fluid back into the chassis to perform heat exchange and heat dissipation on the power heat source. In addition, the current chassis heat dissipation solution has simultaneously applied both air cooling and water cooling methods, but the air cooling part only provides heat convection between the hot air inside the chassis and the cold air outside the chassis, but cannot provide additional cooling effect for the heat directly generated by the power heat source. The water cooling part directly cools the power heat source and provides heat exchange. When the heat generated by the power heat source increases significantly, it can only further enhance the circulation cooling efficiency of the forced cooling system arranged inside or outside the overall main body to provide sufficient cooling performance for each chassis.

[0011] Although the heat dissipation method in the prior art can still provide sufficient heat dissipation effect for the main body, in view of the increasing working power required by all power heat sources inside a single chassis of today's electronic equipment and the increasing number of chassis installed inside a single main body, the heat dissipation method that simply provides more air-cooling fans and increases external forced cooling equipment will inevitably encounter the problem of insufficient heat dissipation efficiency in the near future, and will therefore invisibly increase the cost of the heat dissipation operation of the overall external forced cooling equipment, which is obviously still not an ideal solution.

[0012] Therefore, how to integrate air cooling and water cooling solutions to enhance the heat dissipation effect to avoid the shortcoming of insufficient heat dissipation of the main body or the cabinet as a whole is indeed an issue that needs to be urgently resolved in the industry. Utility Model Content

[0013] In order to effectively solve the above-mentioned traditional shortcomings, the main purpose of the present invention is to provide an electronic device heat dissipation assembly that can improve the heat dissipation performance of the above-mentioned high-power host.

[0014] To achieve the above-mentioned purpose, the utility model provides an electronic equipment heat dissipation module, comprising an internal circulation heat dissipation component and an external forced cooling component, wherein the internal circulation heat dissipation component is at least composed of a water cooling head assembled on the power heat source of the mainboard, and a water heat dissipation plate connected to the water cooling head by pipeline, and the internal circulation heat dissipation component is further connected to the external forced cooling component by pipeline, so that the working heat of the heat source can be quickly absorbed by the working fluid in the water cooling head through the heat dissipation module, and circulate to the water heat dissipation plate for a front-end heat dissipation, and then recirculate and connect to the external forced cooling component for a rear-end forced heat dissipation, forming a heat dissipation cooling system with at least two stages of heat dissipation, so as to greatly improve the overall heat dissipation efficiency.

[0015] According to the above-mentioned heat dissipation module design, by utilizing the small material volume and large heat dissipation area of ​​the water heat dissipation plate, at least one large-scale front-end heat dissipation operation can be performed in advance in the narrow space between the inside of the chassis and the motherboard before the rear-end forced heat dissipation is performed, so that the cooling efficiency of the working fluid is further improved, so that when the working fluid is recycled back to the water cooling head on the motherboard, it can be cooled to below the expected operating temperature value, so as to avoid the disadvantage of heat accumulation caused by the power heat source or the inside of the chassis being unable to fully dissipate heat during operation.

[0016] According to the heat dissipation module structure of the utility model, a reinforced push fan is particularly provided between the middle section and / or the rear section of the internal space of the chassis to increase the push and update speed between the air inside the main body and the outside air, so that the large amount of heat dissipated through the above-mentioned water heat dissipation plate can be effectively discharged to the outside of the chassis to avoid heat accumulation in the chassis. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the traditional first type of composite heat dissipation circulation system that combines air cooling with water cooling;

[0018] Figure 2 This is a schematic diagram of the traditional first type of composite heat dissipation circulation system that combines air cooling with water cooling;

[0019] Figure 3 It is a schematic diagram of the heat dissipation assembly of the utility model;

[0020] Figure 4It is a top view schematic diagram of an embodiment of the utility model applied to an electronic device having multiple heat sources installed in a single mainboard;

[0021] Figure 5 This utility model Figure 4 a schematic side view of the illustrated embodiment;

[0022] Figure 6 It is a three-dimensional schematic diagram of an embodiment of the utility model applied to an electronic device in which only a single heat source is installed in a single motherboard;

[0023] Figure 7 This utility model Figure 6 A schematic top view of the illustrated embodiment;

[0024] Figure 8 This utility model Figure 6 a schematic side view of the illustrated embodiment;

[0025] Fig. 9 This utility model Figure 6 Another schematic top view of the illustrated embodiment;

[0026] in,

[0027] 10: Water cooling head

[0028] 101: Pipeline

[0029] 11: Coolant Distribution Unit (CDU)

[0030] 12: Air heat exchange cooler

[0031] 120: Radiator

[0032] 121: Fan

[0033] 13: Liquid heat exchange cooler

[0034] 14: Heat Source

[0035] 15: Fan

[0036] 2: Internal circulation heat dissipation components

[0037] 21: Water cooling head

[0038] 210: Series pipe

[0039] 211: Water Inlet

[0040] 212: Water outlet

[0041] 213: Hot exchange space

[0042] 22: Water radiator

[0043] 220: Series pipe

[0044] 221: Entrance

[0045] 222:Exit

[0046] 223: Runner

[0047] 3: External forced cooling components

[0048] 30: Coolant distribution unit group

[0049] 31: Input allocation unit

[0050] 32: Output distribution unit

[0051] 33: Air heat exchange cooler

[0052] 34: Liquid heat exchange cooler

[0053] 4: Chassis

[0054] 5: Motherboard

[0055] 50: Power heating source

[0056] 60: Inline pipe

[0057] 70: Cooling water manifold assembly

[0058] 71:First tube body

[0059] 72:Second tube body

[0060] 90: Strengthen the push fan. DETAILED DESCRIPTION

[0061] The above-mentioned purpose and the structural and functional characteristics of the utility model will be described in detail with reference to the preferred embodiments of the accompanying drawings.

[0062] Please refer to FIG. 3, which is a schematic diagram of a feasible embodiment of the heat dissipation assembly of the utility model. As shown in the figure, the heat dissipation assembly of the utility model includes an internal circulation heat dissipation component 2 and an external forced cooling component 3; wherein the internal circulation heat dissipation component 2 is composed of at least one water cooling head 21 assembled on a power heat source 50 of a main board 5 and at least one water cooling plate 22 connected to the water cooling head 21 by a pipeline;

[0063] The water cooling head 21 is arranged correspondingly and in thermal contact with the power heating source 50 to provide heat conduction for the working heat generated by the power heating source 50. The water cooling head 21 has a water inlet 211 and a water outlet 212 and has at least one heat exchange space 213 inside. The water outlet 212 is then connected by a pipe to the water heat sink 22 or another water cooling head 21.

[0064] Please also see Figures 4 to 9 , as shown in the figure, Figure 4 and Figure 5 Indicates an implementation mode in which multiple power heat sources are simultaneously arranged on a single mainboard; Figures 6 to 9 Indicates that a plurality of motherboards are installed in a single cabinet; and each single motherboard is only equipped with a single power heat source; the water radiator 22 is connected to the aforementioned water cooling head 21 by an inner tube 60, the water radiator 22 has an inlet 221 and an outlet 222, and has at least one flow channel 223 inside, the water outlet 212 of the water cooling head 21 can be connected in series with the water inlet 211 of another water cooling head 21 by a series tube 210, or connected to the inlet 221 of a water radiator 22 by an inner tube 60, so that the heat exchange space 213 and the flow channel 223 are interconnected, and the working fluid therein can flow therebetween, and the water radiator 22 can also be connected in series with multiple plates by the series tube 220 (such as Figure 4 and Figure 5 ).

[0065] The water radiator 22 is formed in a thin plate shape, so it has the conditions of small volume and large surface area, and can be conveniently arranged between the motherboard 5 and the chassis 4, and in a space with a small height but a large area parallel to the motherboard 5, for example Figure 4 and Figure 5 As shown, the water cooling head 21 is arranged on the bottom side of the motherboard 5 where no (or less) related electronic components or water cooling head 21 are installed (in contact with or not in contact with the motherboard 5), or is arranged on the upper side or adjacent left and right sides of the water cooling head 21 in a space parallel to the motherboard 5. Therefore, the narrow available space in the vertical spacing (height) between the chassis 4 and the motherboard 5 can be fully utilized, and the effective heat dissipation area that can be accommodated in the space can be greatly increased; the number of the water cooling plates 22 can also be set to be multiple, and they are arranged at intervals from each other (such as Figure 4 and Figure 5 As shown), or arranged in an adjacent and spaced pattern at the same level, the overall heat dissipation area of ​​the chassis 4 is greatly increased.

[0066] The internal circulation heat dissipation component 2 described above, in particular Figures 4 to 9As shown, if implemented in an integrated electronic device composed of multiple hosts, it is connected to the external forced cooling component 3 through a cooling water manifold group 70, and the external forced cooling component 3 includes: a coolant distribution unit group 30 (CDU) and a heat exchange cooler connected to each other by pipes. The heat exchange cooler can be at least one of a gas heat exchange cooler 33 or a liquid heat exchange cooler 34. The coolant distribution unit group 30 can also have an input distribution unit 31 and an output distribution unit 32 respectively; the external forced cooling component 3 can perform forced cooling and cooling operations on the working fluid entering it, and the cooled working fluid is pumped back into the chassis 4 to cool the power heat source 50.

[0067] The cooling water manifold assembly 70 has a first tube body 71 and a second tube body 72. One end of the first and second tube bodies 71 and 72 are respectively connected to the water inlet 211 of the water cooling head 21 and the outlet 222 of the water cooling plate 22, and the other end is respectively connected to the pipeline of the cooling liquid distribution unit assembly 30. The working fluid flowing inside the entire internal circulation heat dissipation component 2 and the external forced cooling component 3 is responsible for carrying heat circulation in the overall system.

[0068] Therefore, when the working fluid entering through the first tube body 71 and the water inlet 211 of the water cooling head 21 absorbs the working heat generated by the power heat source 50 and outputs the high-temperature working fluid to the water cooling plate 22, when it is introduced into the water cooling plate 22, a front-end heat dissipation effect can be generated on the working fluid through its wide large heat dissipation area, so that the circulating working fluid has an obvious front-end cooling; then the working fluid that has been subjected to the front-end cooling is input into the external forced cooling component 3 through the second tube body 72, so that the working fluid is subjected to a rear-end heat dissipation cooling operation again, which will be able to more quickly and effectively reduce the temperature of the working fluid, so that the temperature difference (thermal step) between the working fluid and the power heat source 50 is increased; therefore, when the working fluid is input into the water cooling head 21 through the first tube body 71 again, a more efficient heat accumulation and heat output effect can be generated on the power heat source 50, effectively reducing the heat accumulation in the power heat source 50, and further enabling the working heat of the power heat source 50 to be effectively and quickly cooled without generating heat accumulation.

[0069] Please refer to Figure 7 and Fig. 9It is understandable that after the above-mentioned water heat sink 22 has performed a large amount of heat dissipation inside the chassis 4, if the accumulated heat inside the chassis 4 can no longer be removed, it will still cause the undesirable phenomenon of high temperature accumulation inside the chassis 4 (cabinet); therefore, in order to effectively achieve the purpose of this utility model, it is a further issue to be solved for the electronic equipment to which the utility model is applied. For this purpose, the utility model is further configured with a reinforced propulsion fan 90 for at least the middle section inside the chassis 4 of the electronic equipment, which can increase the flow of hot air inside the chassis 4 and the speed of its discharge to the outside, so as to avoid the disadvantage of heat accumulation inside the chassis 4 due to the high-speed heat dissipation effect of the water heat sink 22.

[0070] The number of the enhanced propulsion fans 90 can be one or more. When multiple enhanced propulsion fans 90 are used, they are respectively set in at least any part of the middle space or the rear space inside the chassis 4, so as to provide the hot air inside the chassis 4 (or cabinet) to fully dissipate the heat and avoid heat accumulation to generate high temperature.

[0071] And as long as the internal space of the chassis 4 allows, the aforementioned enhanced propulsion fan 90 can be appropriately added to enhance the circulation and discharge of the air inside the chassis 4. This can not only effectively discharge the internal heat accumulation of the chassis 4, but also reduce the air temperature around the water heat sink 22, directly and effectively improve the heat dissipation effect of the water heat sink 22, and relatively improve the effect of the above-mentioned front-end heat dissipation and cooling.

[0072] In summary, the utility model uses a water heat dissipation plate 22 that can be set up in a large area between the traditional internal circulation heat dissipation component 2 and the external forced cooling component 3, and pre-processes the heat absorbed by each power heat source 50 with the water cooling head 21, so that the working fluid can obtain a preliminary heat dissipation cooling and cooling, and then the working fluid that has obtained the preliminary cooling is circulated into the external forced cooling component 3 for a rear stage forced cooling, so that the temperature of the working fluid can be more easily reduced to the expected working temperature, so as to appropriately meet the industry demand for increasing heat dissipation. Furthermore, the enhanced driving fans 90 are used to force the hot air inside the chassis 4 to be discharged outwards, and the environment near the water heat sink 22 inside the chassis 4 is cooled down, which can further improve the heat dissipation effect of the water heat sink 22, making the front-end heat dissipation cooling effect more obvious, directly reducing the cost of adding or increasing the power of the external forced cooling components. In addition to significantly improving the heat exchange efficiency of the cooling system in a limited space, it can also save the energy consumed by adding or increasing the power of the circulating cooling equipment in the traditional way, thereby achieving the effect of energy saving.

Claims

1. An electronic equipment heat dissipation assembly, characterized in that: The invention comprises an internal circulation heat dissipation component (2) and an external forced cooling component (3) which is cyclically connected to the working fluid inside the internal circulation heat dissipation component (2); wherein the internal circulation heat dissipation component (2) is composed of at least one water cooling head (21) assembled on a power heat source (50), and a water cooling plate (22) connected to the water cooling head (21) by a pipeline; and the power heat source (50) is arranged on a mainboard (5) in a chassis (4); The water cooling head (21) is arranged corresponding to and in thermal contact with the power heating source (50); The water radiator (22) and the water cooling head (21) are interconnected by pipes, and a working fluid circulates inside the water radiator (22). The water radiator (22) is arranged between the inside of the chassis (4) and the mainboard (5), and in the remaining space parallel to the mainboard (5); the internal working fluid of the water cooling head (21) can absorb the heat generated by the power heat source (50), and then when entering the water radiator (22), it can perform a front-end heat dissipation to produce a temperature drop, and then when circulating into the external forced cooling component (3), it can perform a rear-end forced heat exchange cooling, thereby improving the cooling efficiency of the working fluid and ensuring that the temperature of the working fluid returned to the water cooling head (21) can drop to the expected working low temperature.

2. The electronic equipment heat dissipation assembly according to claim 1, characterized in that: The water cooling head (21) has a heat exchange space (213) inside, and a water inlet (211) and a water outlet (212) in communication with the heat exchange space; the water cooling plate (22) has a flow channel (223) inside, and has an inlet (221) and an outlet (222) facing the outside; A cooling water manifold assembly (70) comprises a first tube body (71) and a second tube body (72), wherein the first tube body (71) is connected to the water inlet (211) of the water cooling head (21), and the second tube body (72) is connected to the outlet (222) of the water cooling plate (22), and the other ends of the first tube body (71) and the second tube body (72) are respectively connected to the pipeline of the external forced cooling component (3).

3. The electronic equipment heat dissipation assembly according to claim 2, characterized in that: The water outlet (212) of the water cooling head (21) can be connected to one of the water inlet (211) of another water cooling head (21) and the inlet (221) of the water radiating plate (22).

4. The electronic equipment heat dissipation assembly according to claim 2 or 3, characterized in that: The external forced cooling component (3) comprises at least one cooling liquid distribution unit group (30) and a heat exchange cooler connected thereto; and an input distribution unit (31) and an output distribution unit (32) of the cooling liquid distribution unit group (30) are respectively connected to the first pipe body (71) and the second pipe body (72) through pipelines.

5. The electronic equipment heat dissipation assembly according to claim 4, characterized in that: The heat exchange cooler is at least one of a gas-type heat exchange cooler (33) and a liquid-type heat exchange cooler (34).

6. The electronic equipment heat dissipation assembly according to claim 1, 2 or 3, characterized in that: There are a plurality of water radiating plates (22), and the plurality of water radiating plates (22) are arranged at intervals and in parallel on at least one of the upper and lower sides of the main board (5), and are interconnected.

7. The electronic equipment heat dissipation assembly according to claim 4, characterized in that: There are a plurality of water radiating plates (22), and the plurality of water radiating plates (22) are arranged at intervals and in parallel on at least one of the upper and lower sides of the main board (5), and are interconnected.

8. The electronic equipment heat dissipation assembly according to claim 5, characterized in that: There are a plurality of water radiating plates (22), and the plurality of water radiating plates (22) are arranged at intervals and in parallel on at least one of the upper and lower sides of the main board (5), and are interconnected.

9. The electronic equipment heat dissipation assembly according to claim 1, 2 or 3, characterized in that: At least the middle section of the interior of the chassis (4) is provided with a reinforced propulsion fan (90).

10. The electronic equipment heat dissipation assembly according to claim 4, characterized in that: At least the middle section of the interior of the chassis (4) is provided with a reinforced propulsion fan (90).

11. The electronic equipment heat dissipation assembly according to claim 5, characterized in that: At least the middle section of the interior of the chassis (4) is provided with a reinforced propulsion fan (90).

12. The electronic equipment heat dissipation assembly according to claim 6, characterized in that: At least the middle section of the interior of the chassis (4) is provided with a reinforced propulsion fan (90).

13. The electronic equipment heat dissipation assembly according to claim 7, characterized in that: At least the middle section of the interior of the chassis (4) is provided with a reinforced propulsion fan (90).

14. The electronic equipment heat dissipation assembly according to claim 8, characterized in that: At least the middle section of the interior of the chassis (4) is provided with a reinforced propulsion fan (90).

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