Sputtering equipment
By setting a flow channel in the cavity of the sputtering equipment and filling the fluid for heat exchange, the problem of accumulated temperature on the wafer surface in the sputtering machine is solved, and the quality of the metal film and product quality are improved.
CN222631535UActive Publication Date: 2025-03-18BEIJING YANDONG MICROELECTRONICS TECH CO LTD
0 Cites 0 Cited by
Patent Information
- Application Number
- CN202420608951.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-27
- Publication Date
- 2025-03-18
- Estimated Expiration
- 2034-03-27
AI Technical Summary
Technical Problem
In the sputtering machine platform, the heat generated by the bombardment of argon ions on the target causes a cumulative temperature on the wafer surface, which affects the quality of the metal film and product quality.
Method used
A sputtering device is designed to cool the storage space by setting a flow channel in the cavity and filling the flow channel with fluid, so as to exchange heat with gas in the storage space.
Benefits of technology
It effectively improves the temperature accumulation phenomenon on the wafer surface and improves the quality of metal films and product quality.
✦ Generated by Eureka AI based on patent content.
Abstract
The utility model discloses sputtering equipment which can improve the accumulated temperature phenomenon on the surface of a wafer and improve the product quality. The sputtering equipment comprises a sputtering chamber, and the sputtering chamber comprises a cavity with an upper opening and a top cover covering the upper opening; the cavity and the top cover can define an accommodating space for accommodating a wafer, the cavity is provided with a flow channel, and the flow channel is used for filling fluid so as to cool the accommodating space through the fluid; the first joint and the second joint are respectively connected with the cavity, and the first joint and the second joint are respectively communicated with the flow channel; the flow supply device is connected with the first connector through a pipeline so as to supply fluid to the flow channel; the flow supply device is further connected with the second connector through a pipeline so as to receive the fluid which exchanges heat with the containing space in the flow channel.
Need to check novelty before this filing date? Find Prior Art