Circuit board structure for improving welding yield of BGA (Ball Grid Array) packaging device
By controlling the sum of widths of the GND network disk lead-out traces on the circuit board, the problem of uneven heat dissipation of BGA pads is solved, and the solder cooling speed is uniformized, and the solder quality and the stability of the circuit board are improved.
CN222674562UActive Publication Date: 2025-03-25CHANGSHA QUANBO ELECTRONIC TECH CO LTD
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Patent Information
- Application Number
- CN202420907614.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-28
- Publication Date
- 2025-03-25
- Estimated Expiration
- 2034-04-28
AI Technical Summary
Technical Problem
When the existing circuit board design enhances the signal reflow effect, it leads to uneven heat dissipation of the BGA pad, affecting the cooling speed of the solder, thereby reducing the solder quality and product stability and reliability.
Method used
By controlling the trace width of each GND network disk, ensure that the sum of the widths of all GND network disks is a fixed value, thereby ensuring that all GND network disks have the same signal reflow and heat dissipation effects during the welding process.
Benefits of technology
The uniformity of solder cooling speed is achieved, the yield of soldering is improved, the stability and reliability of the circuit board are enhanced, and the production and maintenance costs are reduced.
✦ Generated by Eureka AI based on patent content.
Abstract
The utility model discloses a circuit board structure for improving the welding yield of a ball grid array (BGA) packaging device, which comprises the BGA packaging device, a plurality of GND network disks are arranged on the BGA packaging device, wires in at least one direction are led out from one GND network disk, and the sum of the widths of the wires led out from all the GND network disks is a fixed value. According to the utility model, by controlling the width of the wires led out of each GND network disk, the sum of the widths of the wires led out of all GND network disks is ensured to be a constant value, so that all GND network disks have the same signal backflow and heat dissipation effects in the welding process, the current can flow stably in the transmission process, the soldering tin cooling speed is ensured to be uniform, and the welding quality is improved. According to the circuit board welding method, the welding yield can be improved, the stability and the reliability of the circuit board are enhanced, convenience is provided for subsequent production and maintenance, and the production cost and the maintenance cost are reduced.
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