LED package of flip chip

Abstract

The utility model relates to the technical field of LED (light-emitting diode) chip packaging, in particular to an LED package of a flip chip, which comprises a PCB (printed circuit board) substrate, a connecting seat is fixedly connected onto the PCB substrate, the PCB substrate is positioned in the connecting seat and is connected with a blue light-emitting chip, a green light-emitting chip and a red light-emitting chip, and the blue light-emitting chip, the green light-emitting chip and the red light-emitting chip are arranged in the connecting seat. The blue light-emitting chip and the green light-emitting chip are arranged in an inverted mode, a sealing cover is detachably connected to the connecting base, a light-transmitting mirror is connected to the inner bottom of the connecting base, protective covers are connected to the outer sides of the blue light-emitting chip, the green light-emitting chip and the red light-emitting chip, and the protective covers are located in the light-transmitting mirror. An arc-shaped groove is formed in the top of the protective cover, and triangular clamping blocks are slidably connected to the two sides of the sealing cover; according to the utility model, the use cost can be reduced, the situation that one part is damaged and the whole LED needs to be replaced is avoided, meanwhile, the light source utilization rate is improved, and water vapor and dust are prevented from invading and influencing the service life of a chip.

Description

Technical Field

[0001] The utility model relates to the technical field of LED chip packaging, in particular to a flip chip LED packaging. Background Art

[0002] LED chip, or light-emitting diode chip, is the core component of LED. LED emits light by releasing energy through the recombination of electrons and holes. Common LED chips include red light, green light, blue light and other types. The combination of different chips or their individual use can meet various lighting, display and other application needs. It has a wide range of uses in modern society, such as lighting, flat panel displays, medical devices, etc.

[0003] At present, most LED chips on the market are upright and integrated in package. However, the heat dissipation performance of upright LED chips is poor. The heat generated at the PN junction of the upright chip needs to pass through the sapphire substrate to be transferred to the heat sink. The thermal conductivity of the sapphire substrate is poor, resulting in poor heat dissipation performance of the chip, which affects the luminous efficiency and reliability of the chip. In addition, the stability and reliability of the upright chip under high-power conditions are relatively low. At the same time, if one of the LED chips or the integrated packaging structure is damaged, the entire LED usually needs to be replaced, which easily increases the cost of use.

[0004] Therefore, those skilled in the art provide a flip-chip LED package to solve the problems raised in the above background technology. Utility Model Content

[0005] The purpose of the utility model is to provide a flip chip LED package to solve the following technical problems:

[0006] How to reduce the cost of use and avoid damage in one place? The entire LED should be replaced, while improving the utilization rate of the light source and avoiding the intrusion of water vapor and dust that affects the service life of the chip.

[0007] The purpose of the utility model can be achieved through the following technical solutions:

[0008] A flip chip LED package, comprising a PCB substrate, a connection seat fixedly connected to the PCB substrate, a blue light emitting chip, a green light emitting chip and a red light emitting chip connected to the PCB substrate in the connection seat, wherein the blue light emitting chip and the green light emitting chip are flip-chip arranged;

[0009] A sealing cover is detachably connected to the connection seat, a light-transmitting mirror is connected to the bottom of the connection seat, and protective covers are connected to the outer sides of the blue light-emitting chip, the green light-emitting chip and the red light-emitting chip. The plurality of protective covers are located inside the light-transmitting mirror, and an arc-shaped groove is formed on the top of the protective cover;

[0010] Both sides of the sealing cover are slidably connected with triangular clamping blocks, a plurality of heat dissipation openings are provided on the outer side of the connecting seat, and the triangular clamping block is cooperatively connected with a heat dissipation opening on the upper side.

[0011] Furthermore, a power-on board is fixedly connected to the PCB substrate, and a plurality of slots are provided on the power-on board. The plurality of slots are respectively connected to the light-transmitting mirror and the plurality of protective covers in cooperation with each other.

[0012] Furthermore, a pressing block is fixedly connected to the inner top of the sealing cover, and the pressing block fits the light-transmitting mirror and presses the light-transmitting mirror.

[0013] Furthermore, a blue light protection layer is fixedly connected to the top of the sealing cover, and a fluorescent film is fixedly connected below the blue light protection layer.

[0014] Furthermore, the outer side of the connection seat is cylindrical, the inner wall of the connection seat is inclined and fixedly connected with a reflective layer, and the diameter gradually increases from bottom to top.

[0015] Furthermore, the lengths of the plurality of heat dissipation openings gradually become shorter from bottom to top, a transparent bonding adhesive is fixedly connected to the connection between the connection seat and the PCB substrate, and green paint is fixedly connected to both sides of the PCB substrate.

[0016] Furthermore, both sides of the lower side of the sealing cover are fixedly connected with connecting grooves, the triangular clamping block is slidably connected with the connecting grooves, and a supporting spring is fixedly connected between the triangular clamping block and the connecting grooves.

[0017] Furthermore, a connecting rod is fixedly connected to one side of the triangular clamping block, one end of the connecting rod extends out of the connecting groove and is fixedly connected to a protrusion, and the supporting spring is connected to the outside of the connecting rod.

[0018] Beneficial effects of the utility model:

[0019] (1) The utility model is provided with a sealing cover and a triangular clamping block. When the anti-blue light layer and the fluorescent film of the sealing cover are damaged or the internal light-emitting chip is damaged, the sealing cover can be disassembled and replaced, and the installation and disassembly are convenient. At the same time, the internal light-emitting chip can be repaired to avoid the need to replace the entire device if one part is damaged, thereby reducing the cost of use.

[0020] (2) The utility model is provided with a sealing cover, a protective cover, a semicircular light-transmitting mirror and an inclined reflective layer, and an arc-shaped groove is opened on the top of the protective cover to improve the softness of the light. The semicircular light-transmitting mirror is convenient for focusing light and reflecting light to the outside. The inclined reflective layer effectively reduces light loss and improves the utilization rate of the light source. At the same time, the sealing cover, the light-transmitting mirror and the protective cover can isolate water vapor and dust layer by layer, which can effectively protect the light-emitting chip and help to extend the service life of the light-emitting chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The utility model is further described below in conjunction with the accompanying drawings.

[0022] Figure 1 It is a schematic diagram of the connection positions of multiple light-emitting chips of the utility model;

[0023] Figure 2 This is a schematic diagram of the internal connection structure of the utility model. Figure 1 ;

[0024] Figure 3 This is a schematic diagram of the internal connection structure of the utility model. Figure 2 ;

[0025] Figure 4 yes Figure 3 Enlarged view of point A in the middle.

[0026] Reference numerals:

[0027] 1. PCB substrate; 2. Blue light-emitting chip; 3. Green light-emitting chip; 4. Green paint; 5. Red light-emitting chip; 6. Power board; 7. Connector; 8. Anti-blue light layer; 9. Fluorescent film; 10. Pressing block; 11. Transparent mirror; 12. Sealing cover; 13. Reflective layer; 14. Protective cover; 15. Groove;

[0028] 16. Heat dissipation port; 17. Transparent solid crystal glue; 18. Triangular clamp block; 19. Connecting rod; 20. Bump;

[0029] 21. Support spring; 22. Connecting slot; 23. Card slot. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0031] Please see attached Figure 1-4In the embodiment of the utility model, a flip chip LED package includes a PCB substrate 1, a connection seat 7 is fixedly connected to the PCB substrate 1, and a blue light emitting chip 2, a green light emitting chip 3 and a red light emitting chip 5 are connected to the PCB substrate 1 in the connection seat 7, wherein the blue light emitting chip 2 and the green light emitting chip 3 are flip-chip arranged, and the color balance can be better adjusted according to the characteristics of the blue light emitting chip 2 and the green light emitting chip 3, and the characteristics of the red light emitting chip 5 are relatively more stable, so only the blue light emitting chip 2 and the green light emitting chip 3 are flip-chipped, and the red light emitting chip 5 is not flip-chipped. , the additional process step of flipping the red light-emitting chip 5 can be reduced, which is beneficial to reducing production costs. At the same time, it can reduce the risk of the wire being easily damaged due to its weak resistance to the internal stress of the colloid, and the flip chip is less likely to have a cold solder joint, and has stronger resistance to external forces than the wire. The active layer of the flip chip is close to the PCB substrate 1, the heat flow path is shortened, the thermal resistance is low, and the performance from light to thermal stability is almost not reduced. The flip chip has a high luminous efficiency under high current drive, and has good current expansion performance and ohmic contact performance. Its voltage drop is generally lower than that of traditional chips and vertical chips, and the flip chip is safer and more reliable than the upright chip under high power conditions;

[0032] A sealing cover 12 is detachably connected to the connection base 7, a light-transmitting mirror 11 is connected to the bottom of the connection base 7, and protective covers 14 are connected to the outer sides of the blue light-emitting chip 2, the green light-emitting chip 3, and the red light-emitting chip 5, and the light-transmitting mirror 11 and the protective cover 14 are detachably arranged, and the plurality of protective covers 14 are all located inside the light-transmitting mirror 11, and an arc-shaped groove 15 is provided on the top of the protective cover 14, and the arc-shaped groove 15 can soften the light, and the bottom of the arc-shaped groove 15 is close to the internal chip, so as to assist the internal chip in heat dissipation;

[0033] Both sides of the sealing cover 12 are slidably connected with triangular clamping blocks 18, so that when installing, the sealing cover 12 can be directly clamped on the outside of the connecting seat 7. The outside of the connecting seat 7 is provided with multiple heat dissipation ports 16, and the triangular clamping block 18 is connected with a heat dissipation port 16 on the top.

[0034] A power-on board 6 is fixedly connected to the PCB substrate 1, and a plurality of slots 23 are provided on the power-on board 6. The plurality of slots 23 are respectively connected to the light-transmitting mirror 11 and the plurality of protective covers 14 to facilitate disassembly of the interior of the packaging structure, thereby facilitating repair of damaged chips.

[0035] A pressing block 10 is fixedly connected to the inner top of the sealing cover 12. The pressing block 10 fits the light-transmitting mirror 11 and presses the light-transmitting mirror 11. When the sealing cover 12 is connected to the connecting seat 7, the pressing block 10 presses the light-transmitting mirror 11 and connects with the card slot 23, thereby fixing the light-transmitting mirror 11 to prevent the light-transmitting mirror 11 from shaking inside.

[0036] An anti-blue light layer 8 is fixedly connected to the top of the sealing cover 12, and a fluorescent film 9 is fixedly connected below the anti-blue light layer 8. The anti-blue light layer 8 adopts blue light blocking technology to absorb and convert blue light, thereby effectively blocking blue light. It can effectively block ultraviolet light rays, short-wave blue light rays, and soft glare light source stimulation. The fluorescent film 9 has a fluorescent effect and can convert ultraviolet light or blue light into visible light, thereby improving the luminous efficiency and color uniformity of LED lamp beads.

[0037] The outer side of the connection seat 7 is cylindrical, and the inner wall of the connection seat 7 is inclined and fixedly connected with a reflective layer 13, and the diameter gradually increases from bottom to top.

[0038] The lengths of the multiple heat dissipation openings 16 gradually become shorter from bottom to top. A transparent solid crystal adhesive 17 is fixedly connected to the connection between the connection seat 7 and the PCB substrate 1. The transparent solid crystal adhesive 17 is used to fix the connection seat 7. Green paint 4 is fixedly connected to both sides of the PCB substrate 1. The green paint 4 is made of fluorescent powder, and its function is to absorb invisible light, i.e. ultraviolet light or blue light, and stimulate visible light, i.e. green light.

[0039] Both sides of the bottom of the sealing cover 12 are fixedly connected with connecting grooves 22, and the triangular clamping block 18 is slidably connected to the connecting grooves 22. A supporting spring 21 is fixedly connected between the triangular clamping block 18 and the connecting grooves 22. A connecting rod 19 is fixedly connected to one side of the triangular clamping block 18, and one end of the connecting rod 19 extends out of the connecting groove 22 and is fixedly connected with a protrusion 20. The supporting spring 21 is connected to the outside of the connecting rod 19. When the sealing cover 12 is damaged, the protrusion 20 can be pulled, and then the supporting spring 21 is compressed into the connecting groove 22, and the triangular clamping block 18 is separated from the connecting seat 7, and then the sealing cover 12 is replaced, and there is no need to replace the entire LED, which can reduce the cost of use, and the two groups of triangular clamping blocks 18 are more conducive to enhancing the stability of the seal.

[0040] The above is a detailed description of an embodiment of the utility model, but the content is only a preferred embodiment of the utility model and cannot be considered to limit the scope of implementation of the utility model. All equivalent changes and improvements made within the scope of application of the utility model should still fall within the scope of the patent coverage of the utility model.

Claims

1. A flip chip LED package, comprising a PCB substrate (1), characterized in that: The PCB substrate (1) is fixedly connected to a connection seat (7), and the PCB substrate (1) is located inside the connection seat (7) and is connected to a blue light-emitting chip (2), a green light-emitting chip (3) and a red light-emitting chip (5), wherein the blue light-emitting chip (2) and the green light-emitting chip (3) are flip-chip mounted; The connection seat (7) is detachably connected to a sealing cover (12); the bottom of the connection seat (7) is connected to a light-transmitting mirror (11); the outer sides of the blue light-emitting chip (2), the green light-emitting chip (3) and the red light-emitting chip (5) are all connected to protective covers (14); the plurality of protective covers (14) are all located inside the light-transmitting mirror (11); and the top of the protective covers (14) is provided with an arc-shaped groove (15); Both sides of the sealing cover (12) are slidably connected with triangular clamping blocks (18), a plurality of heat dissipation openings (16) are provided on the outer side of the connecting seat (7), and the triangular clamping block (18) is cooperatively connected with a heat dissipation opening (16) at the top.

2. A flip chip LED package according to claim 1, characterized in that: The PCB substrate (1) is fixedly connected to a power-carrying board (6), the power-carrying board (6) is provided with a plurality of card slots (23), and the plurality of card slots (23) are respectively connected in cooperation with the light-transmitting mirror (11) and the plurality of protective covers (14).

3. The flip chip LED package according to claim 1, characterized in that: A pressing block (10) is fixedly connected to the inner top of the sealing cover (12); the pressing block (10) fits the light-transmitting mirror (11) and presses the light-transmitting mirror (11).

4. The flip chip LED package according to claim 1, characterized in that: A blue light protection layer (8) is fixedly connected to the top of the sealing cover (12), and a fluorescent film (9) is fixedly connected below the blue light protection layer (8).

5. The flip chip LED package according to claim 1, characterized in that: The outer side of the connection seat (7) is cylindrical, the inner wall of the connection seat (7) is inclined and fixedly connected with a reflective layer (13), and the diameter gradually increases from bottom to top.

6. The flip chip LED package according to claim 1, characterized in that: The lengths of the plurality of heat dissipation openings (16) gradually decrease from bottom to top, a transparent solid crystal adhesive (17) is fixedly connected to the connection between the connection seat (7) and the PCB substrate (1), and green paint (4) is fixedly connected to both sides of the PCB substrate (1).

7. The flip chip LED package according to claim 1, characterized in that: Both sides of the lower side of the sealing cover (12) are fixedly connected with connection grooves (22), the triangular clamping block (18) is slidably connected to the connection grooves (22), and a support spring (21) is fixedly connected between the triangular clamping block (18) and the connection grooves (22).

8. The flip chip LED package according to claim 7, characterized in that: A connecting rod (19) is fixedly connected to one side of the triangular clamping block (18); one end of the connecting rod (19) extends out of the connecting groove (22) and is fixedly connected to a protrusion (20); and the supporting spring (21) is connected to the outside of the connecting rod (19).

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