LED packaging device

Abstract

The utility model discloses an LED packaging device, and relates to the technical field of LED packaging devices, the LED packaging device comprises a substrate, and two supports, two fluorescent glue and a flip light emitting chip which are arranged on the substrate; one ends of the two fluorescent glues are respectively clamped on two sides of the flip light-emitting chip, and the other ends of the two fluorescent glues are respectively attached to the two brackets; the flip light-emitting chip is provided with a transparent light guide layer, two sides of the transparent light guide layer are respectively provided with two fluorescent glue, the transparent light guide layer comprises two light guide sub-layers which are symmetrically arranged along the length center line of the flip light-emitting chip, and the fluorescent glue is attached to one side, away from the other light guide sub-layer, of one light guide sub-layer. The heights of the two light guide sub-layers are gradually reduced from one side close to the fluorescent glue to one side far away from the fluorescent glue so as to form an outward concave groove, and a light reflecting layer is arranged on the transparent light guide layer. According to the utility model, the technical problem of uneven light mixing caused by strong light intensity at the center and small light intensity at the edge of the LED packaging device in the prior art can be solved.

Description

Technical Field

[0001] The utility model relates to the technical field of LED packaging devices, in particular to an LED packaging device. Background Art

[0002] As a light source device, LED package devices have many advantages such as low energy consumption, less heat generation and long service life. They have been increasingly widely used in lighting and decorative lamps. Among them, the emergence of white light LED package devices has enabled the high-brightness LED application field to expand into the high-efficiency lighting source market.

[0003] Currently common LED packaging devices usually have good directionality, but the light intensity in the center is strong, while the light intensity around is low. The weaker the light intensity at the edge, the alternating light and dark, that is, uneven light mixing. On the one hand, it is necessary to reduce the spacing between LED packaging devices so that the light-emitting edges of two LED packaging devices overlap to achieve the same light-emitting intensity as directly above the LED packaging device. When the spacing between LED packaging devices is reduced, more LED packaging devices are required. On the other hand, without reducing the spacing between LEDs, it is necessary to increase the distance between the LED and the diffuser so that the light emitted from the edge of the LED can overlap at a farther distance. At this time, the thickness of the backlight module will increase. Utility Model Content

[0004] In view of the deficiencies of the prior art, the purpose of the present invention is to provide an LED packaging device, aiming to solve the technical problem in the prior art that the LED packaging device has strong light intensity at the center and weak light intensity at the edge, resulting in uneven light mixing.

[0005] The utility model provides an LED packaging device, the LED packaging device comprising:

[0006] A substrate, and two brackets, two fluorescent glues and a flip-chip light-emitting chip arranged on the substrate;

[0007] One end of the two fluorescent glues is respectively clamped on two sides of the flip-chip light-emitting chip, and the other end of the two fluorescent glues is respectively attached to the two brackets;

[0008] A transparent light-guiding layer is provided on the flip-chip light-emitting chip, and two fluorescent glues are provided on both sides of the transparent light-guiding layer. The transparent light-guiding layer includes two light-guiding sublayers symmetrically arranged along the midline of the length of the flip-chip light-emitting chip, and one light-guiding sublayer is adhered to the fluorescent glue from the side away from the other light-guiding sublayer. The height of the two light-guiding sublayers gradually decreases from the side close to the fluorescent glue to the side away from the fluorescent glue to form an outward-facing recessed groove, and a reflective layer is provided on the transparent light-guiding layer.

[0009] Compared with the prior art, the beneficial effect of the present invention is that the LED packaging device provided by the present invention can effectively enhance the edge light intensity, specifically, a transparent light guide layer is provided on the flip-chip light-emitting chip, two fluorescent glues are provided on both sides of the transparent light guide layer, the transparent light guide layer includes two light guide sublayers symmetrically arranged along the length midline of the flip-chip light-emitting chip, one light guide sublayer is adhered to the fluorescent glue from the side away from the other light guide sublayer, and the height of the two light guide layers gradually decreases from the side close to the fluorescent glue to the side away from the fluorescent glue to form an outward-facing recessed groove, a reflective layer is provided on the transparent light guide layer, and the light emitted from the flip-chip light-emitting chip from directly above is refracted by the transparent light guide layer and reflected by the reflective layer, and then emitted from the side, thereby increasing the light emission angle, reducing the central light intensity of the flip-chip light-emitting chip, increasing the edge light intensity, improving the light mixing effect of the LED packaging device, and reducing the occurrence of uneven brightness, thereby solving the technical problem in the prior art that the central light intensity of the LED packaging device is strong and the edge light intensity is small, resulting in uneven light mixing.

[0010] According to one aspect of the above technical solution, the outer surfaces of the two photoconducting layers at the recessed grooves are evenly covered by the reflective layer, and the two ends of the reflective layer are respectively connected to the fluorescent glue.

[0011] According to one aspect of the above technical solution, the reflective layer and the fluorescent glue are flush at their intersection.

[0012] According to one aspect of the above technical solution, the outer surface of the fluorescent glue on the side away from the substrate is set in a plane, a slope or an arc, and the heights of the slope and the arc gradually increase from the side close to the bracket to the side away from the bracket, and the arc is set as a convex structure facing outward.

[0013] According to one aspect of the above technical solution, the structure of the photoconductive layer includes a first arc-shaped structure or a second arc-shaped structure, the first arc-shaped structure is a convex arc-shaped structure facing outward; the second arc-shaped structure is a concave arc-shaped structure facing outward, and the formed recessed groove is a circular arc structure.

[0014] According to one aspect of the above technical solution, the structure of the photoconductor layer includes an inclined surface structure, and the formed concave groove is a V-shaped structure.

[0015] According to one aspect of the above technical solution, the bracket includes a planar portion and an inclined portion connected to the planar portion, and the other side of the inclined portion is connected to the fluorescent glue.

[0016] According to one aspect of the above technical solution, the height of the inclined portion gradually increases from a side close to the fluorescent glue to a side far away from the fluorescent glue.

[0017] According to one aspect of the above technical solution, the height of the fluorescent glue on the side close to the bracket is consistent with the height of the bracket.

[0018] According to one aspect of the above technical solution, the flip-chip light-emitting chip is fixed on the substrate by adhesive. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0020] Figure 1 This is a schematic diagram of the structure of an LED packaging device in the first embodiment of the utility model;

[0021] Figure 2 This is a schematic diagram of the structure of an LED packaging device in the second embodiment of the present utility model;

[0022] Figure 3 This is a schematic diagram of the structure of an LED packaging device in the third embodiment of the present utility model;

[0023] Figure 4 This is a schematic diagram of the structure of an LED packaging device in a fourth embodiment of the present utility model;

[0024] Figure 5 This is a schematic diagram of the structure of an LED packaging device in the fifth embodiment of the present utility model;

[0025] Component symbol description:

[0026] Substrate 10 , flip-chip light emitting chip 20 , bracket 30 , fluorescent glue 40 , transparent light guide layer 50 , and reflective layer 60 . DETAILED DESCRIPTION

[0027] In order to make the purpose, features and advantages of the utility model more obvious and easy to understand, the specific implementation methods of the utility model are described in detail below in conjunction with the accompanying drawings. Several embodiments of the utility model are given in the accompanying drawings. However, the utility model can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the utility model more thorough and comprehensive.

[0028] It should be noted that when an element is referred to as being "fixed on" another element, it may be directly on the other element or there may also be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right", "upper", "lower" and similar expressions used herein are for illustrative purposes only and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model.

[0029] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be internal communication between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0030] See also Figure 1 , which shows an LED packaging device provided by the first embodiment of the utility model, the LED packaging device comprises a substrate 10, and two brackets 30, two fluorescent glues 40 and a flip-chip light-emitting chip 20 arranged on the substrate 10;

[0031] One end of the two fluorescent glues 40 is respectively clamped on both sides of the flip-chip light-emitting chip 20, and the other end of the two fluorescent glues 40 is respectively attached to the two brackets 30;

[0032] A transparent light-guiding layer 50 is provided on the flip-chip light-emitting chip 20, and two fluorescent glues 40 are respectively provided on both sides of the transparent light-guiding layer 50. The transparent light-guiding layer 50 includes two light-guiding sublayers symmetrically arranged along the length midline of the flip-chip light-emitting chip 20, and one light-guiding sublayer is adhered to the fluorescent glue 40 from the side away from the other light-guiding sublayer. The height of the two light-guiding sublayers gradually decreases from the side close to the fluorescent glue 40 to the side away from the fluorescent glue 40 to form an outward-facing recessed groove. A reflective layer 60 is provided on the transparent light-guiding layer 50.

[0033] In this embodiment, the outer surface of the fluorescent glue 40 at a side away from the substrate 10 is arranged in a flat surface.

[0034] It should be noted that the transparent light-guiding layer 50 forms an outward-facing recessed groove above the flip-chip light-emitting chip 20 , and the outer surfaces of the two light-guiding sublayers at the recessed groove are evenly covered by the reflective layer 60 , and the two ends of the reflective layer 60 are respectively connected to the fluorescent glue 40 .

[0035] Preferably, the structure of the light-guiding sublayer includes a first arc-shaped structure, which is a convex arc-shaped structure facing outward. Therefore, the light emitted from the flip-chip light-emitting chip 20 from directly above is refracted by the transparent light-guiding layer 50 and reflected by the reflective layer 60, and then emitted from the side, thereby increasing the light-emitting angle to 157°, reducing the central light intensity of the flip-chip light-emitting chip 20, increasing the edge light intensity, improving the mixing light effect of the LED packaging device, and reducing the occurrence of uneven brightness.

[0036] Furthermore, the reflective layer 60 and the fluorescent glue 40 are flush at their intersection to reduce the light reflected from the reflective layer 60 from being emitted without passing through the fluorescent glue 40, thereby improving the light output intensity.

[0037] Furthermore, the bracket 30 includes a plane portion and an inclined portion connected to the plane portion, the other side of the inclined portion is connected to the fluorescent glue 40, and the height of the inclined portion gradually increases from the side close to the fluorescent glue 40 to the side away from the fluorescent glue 40. The inclined setting of the inclined portion will increase the light output angle and light output intensity.

[0038] Furthermore, the height of the fluorescent glue 40 on the side close to the bracket 30 is consistent with the height of the bracket 30 .

[0039] In addition, the flip-chip light-emitting chip 20 is fixed on the substrate 10 by adhesive.

[0040] Accordingly, the manufacturing method of the LED packaging device is as follows:

[0041] Cover the mold with a wafer formed by a number of flip-chip light-emitting chips 20, and fill the cavity between the mold and the wafer with transparent conductive glue;

[0042] The transparent conductive adhesive is heated and cured to form a transparent conductive layer, and then bonded to the wafer;

[0043] The mold is removed, and the wafer and the transparent conductive layer on the wafer are cut into single flip-chip light-emitting chips 20. Meanwhile, the transparent conductive layer forms an outwardly facing recessed groove on the flip-chip light-emitting chip 20;

[0044] The flip-chip light-emitting chip 20 with a transparent conductive layer is fixed on the substrate 10 by adhesive, and brackets 30 are respectively arranged on both sides of the substrate 10;

[0045] Reflective liquid is coated in the recessed grooves of the transparent conductive layer and baked to evaporate the liquid in the luminescent liquid so that the solid in the reflective liquid is uniformly adhered to the upper surface of the transparent conductive layer to form a reflective layer 60 .

[0046] The fluorescent glue 40 is filled between the bracket 30 and the flip-chip light-emitting chip 20, and then baked and cured to obtain an LED package device.

[0047] Compared with the prior art, the LED packaging device provided in this embodiment has the beneficial effect that: the LED packaging device provided by the utility model can effectively enhance the edge light intensity, specifically, a transparent light guide layer is provided on the flip-chip light-emitting chip, two fluorescent glues are provided on both sides of the transparent light guide layer, the transparent light guide layer includes two light guide sublayers symmetrically arranged along the length midline of the flip-chip light-emitting chip, one light guide sublayer is adhered to the fluorescent glue from the side away from the other light guide sublayer, and the height of the two light guide layers gradually decreases from the side close to the fluorescent glue to the side away from the fluorescent glue to form an outward-facing recessed groove, and a reflective layer is provided on the transparent light guide layer. The light emitted from the flip-chip light-emitting chip from directly above is refracted by the transparent light guide layer and reflected by the reflective layer, and then emitted from the side, thereby increasing the light emission angle, reducing the central light intensity of the flip-chip light-emitting chip, increasing the edge light intensity, improving the light mixing effect of the LED packaging device, and reducing the occurrence of uneven brightness, thereby solving the technical problem in the prior art that the central light intensity of the LED packaging device is strong and the edge light intensity is small, resulting in uneven light mixing.

[0048] See also Figure 2 , which shows an LED packaging device provided by the second embodiment of the utility model. The LED packaging device in this embodiment is different from the LED packaging device in the first embodiment in that:

[0049] The structure of the light guide layer is a second arc structure, and the recessed groove formed is an arc structure. Similarly, after being refracted by the transparent light guide layer 50 and reflected by the reflective layer 60, the light is emitted from the side, thereby increasing the light-emitting angle, reducing the central light intensity of the flip-chip light-emitting chip 20, increasing the edge light intensity, improving the light mixing effect of the LED package device, and reducing the occurrence of uneven brightness.

[0050] See also Figure 3 , which shows an LED packaging device provided by the third embodiment of the utility model. The LED packaging device in this embodiment is different from the LED packaging device in the first embodiment in that:

[0051] The structure of the light guide layer is a slope structure, and the recessed groove formed is a V-shaped structure. Similarly, after being refracted by the transparent light guide layer 50 and reflected by the reflective layer 60, the light is emitted from the side, which increases the light-emitting angle, reduces the central light intensity of the flip-chip light-emitting chip 20, increases the edge light intensity, improves the light mixing effect of the LED packaging device, and reduces the occurrence of uneven brightness.

[0052] See also Figure 4 , which shows an LED packaging device provided by the fourth embodiment of the utility model. The LED packaging device in this embodiment is different from the LED packaging device in the first embodiment in that:

[0053] The outer surface of the fluorescent glue 40 on the side away from the substrate 10 is set as an inclined surface, and the height of the inclined surface is gradually increased from the side close to the bracket 30 to the side away from the bracket 30. Increasing the volume and height of the fluorescent glue 40 can effectively improve the light intensity, and by increasing the height of the fluorescent glue 40, the refraction and reflection angles of the transparent light guide layer 50 and the reflective layer 60 are increased, thereby increasing the edge light intensity, improving the light mixing effect of the LED package device, and reducing the occurrence of uneven brightness.

[0054] See also Figure 5 , which shows an LED packaging device provided by the fifth embodiment of the utility model. The LED packaging device in this embodiment is different from the LED packaging device in the first embodiment in that:

[0055] The outer surface of the fluorescent glue 40 on the side away from the substrate 10 is set as an arc, and the height of the arc is gradually increased from the side close to the bracket 30 to the side away from the bracket 30. The arc is set as a convex structure facing outward.

[0056] Similarly, increasing the volume and height of the fluorescent glue 40 can effectively improve the light intensity, and by increasing the height of the fluorescent glue 40, the refraction and reflection angles of the transparent light guide layer 50 and the reflective layer 60 are increased, thereby increasing the edge light intensity, improving the mixing light effect of the LED packaging device, and reducing the occurrence of uneven brightness.

[0057] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0058] The above-mentioned embodiments only express several implementation methods of the utility model, and the descriptions are relatively specific and detailed, but they cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. An LED packaging device, characterized in that: The LED packaging device comprises: A substrate, and two brackets, two fluorescent glues and a flip-chip light-emitting chip arranged on the substrate; One end of the two fluorescent glues is respectively clamped on two sides of the flip-chip light-emitting chip, and the other end of the two fluorescent glues is respectively attached to the two brackets; A transparent light-guiding layer is provided on the flip-chip light-emitting chip, and two fluorescent glues are provided on both sides of the transparent light-guiding layer. The transparent light-guiding layer includes two light-guiding sublayers symmetrically arranged along the midline of the length of the flip-chip light-emitting chip, and one light-guiding sublayer is adhered to the fluorescent glue from the side away from the other light-guiding sublayer. The height of the two light-guiding sublayers gradually decreases from the side close to the fluorescent glue to the side away from the fluorescent glue to form an outward-facing recessed groove, and a reflective layer is provided on the transparent light-guiding layer.

2. The LED package device according to claim 1, characterized in that: The outer surfaces of the two photoconductive layers at the recessed grooves are evenly covered by the reflective layer, and the two ends of the reflective layer are respectively connected to the fluorescent glue.

3. The LED package device according to claim 2, characterized in that: The reflective layer and the fluorescent glue are flush at their intersection.

4. The LED package device according to claim 3, characterized in that: The outer surface of the fluorescent glue on the side away from the substrate is set in a plane, a slope or an arc. The heights of the slope and the arc gradually increase from the side close to the bracket to the side away from the bracket. The arc is set as a convex structure facing outward.

5. The LED package device according to claim 4, characterized in that: The structure of the light guide layer includes a first arc-shaped structure or a second arc-shaped structure, wherein the first arc-shaped structure is a convex arc-shaped structure facing outward; The second arc-shaped structure is an outwardly concave arc-shaped structure, and the formed concave groove is an arc structure.

6. The LED package device according to claim 4, characterized in that: The structure of the light-guiding layer includes an inclined surface structure, and the formed concave groove is a V-shaped structure.

7. The LED package device according to claim 1, characterized in that: The bracket includes a plane portion and an inclined portion connected to the plane portion, and the other side of the inclined portion is connected to the fluorescent glue.

8. The LED package device according to claim 7, characterized in that: The height of the inclined portion gradually increases from a side close to the fluorescent glue to a side far away from the fluorescent glue.

9. The LED package device according to claim 8, characterized in that: The height of the fluorescent glue on one side close to the bracket is consistent with the height of the bracket.

10. The LED package device according to claim 1, characterized in that: The flip-chip light-emitting chip is fixed on the substrate by adhesive.

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