A backflow prevention device for a cooling and heating mattress

By using a combination of annular seal, float ball and support in the anti-reflow device of the cooling and cooling mattress, the problem of water tank overflow is solved, the circuit of the mattress main unit is protected, and the service life is extended.

CN222693068UActive Publication Date: 2025-04-01GUANGDONG FUXIN ELECTRONICS TECH CO LTD
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Patent Information

Application Number
CN202421629339.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-07-10
Publication Date
2025-04-01
Estimated Expiration
2034-07-10

AI Technical Summary

Technical Problem

In the existing heating and cooling mattress design, the mattress main position is lower than the mattress position, causing water to flow back to the water tank. If the user forgets to cover the cover, the water will overflow, causing damage to the host circuit.

Method used

A anti-reflow device is designed, including an annular seal, a float ball and a support member, through which the float ball comes into contact with the annular seal when the water level changes to form a seal to prevent water from overflowing.

Benefits of technology

It effectively prevents water from overflowing in the water tank, protects the circuit of the mattress main machine, and extends the service life.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a backflow prevention device for a cold and warm mattress, which is used to be connected with a mattress body, including a mattress main unit, the position of the mattress main unit is lower than the position of the mattress body, the mattress main unit includes a main housing, a first water tank arranged inside the main housing, a semiconductor component for cooling or heating, and a first water pump, one end of the first water pump is connected to a first outflow port of the first water tank, the other end of the first water pump is connected to a cold end inlet of the semiconductor component, the cold end outlet of the semiconductor component is connected to a water bed water inlet, the water bed outlet is connected to a first inflow port of the first water tank, the first water tank is provided with a water injection port and a cover body, an annular seal is provided on the inner wall of the lower end of the water injection port, the annular seal is connected to a support member, the support member has a cavity and a through hole connected to the cavity, a float is provided in the cavity, and the float can selectively form a blockage with the inner ring of the annular seal. The problem that water flowing back to the first water tank will overflow from the water injection port, causing damage to the circuit of the mattress main unit, is solved.
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Description

Technical Field

[0001] The utility model relates to the technical field of cooling and heating mattresses, in particular to a backflow prevention device for cooling and heating mattresses. Background Art

[0002] With the improvement of living standards, people pursue a green life and are no longer keen on the warmth provided by electric heating plates or electric blankets. This has brought water beds into everyone's attention, which can heat or cool water to meet people's needs for hot and cold.

[0003] However, the current cooling and heating mattresses have the following design defects: the main unit of most mattresses is set lower than the mattress. When the main unit is working, the water pump can pump the water in the water tank to the mattress and form a cycle. When the main unit stops working, the water pump no longer provides power. Since the mattress is higher than the main unit (water tank), the water in the mattress will flow back to the water tank. If the user forgets to cover the water tank cap, the water flowing back to the water tank will overflow from the water inlet, causing damage to the main unit circuit and affecting the use of the mattress. Utility Model Content

[0004] In view of the defects of the above prior art, the utility model provides a backflow prevention device for a cooling and heating mattress to solve the problem that when a user forgets to cover the water tank cover, the water flowing back into the water tank overflows from the water filling port, causing damage to the host circuit.

[0005] The utility model is implemented by the following technical solutions:

[0006] A backflow prevention device for a cooling and heating mattress, used to be connected to a mattress body, wherein a circulating water circuit is arranged inside the mattress body, and a water bed water inlet and a water bed water outlet connected to the circulating water circuit are arranged on the mattress body; the device comprises a mattress main unit, wherein the position of the mattress main unit is lower than the position of the mattress body, and the mattress main unit comprises a main unit housing, a first water tank arranged inside the main unit housing, a semiconductor component for cooling or heating, and a first water pump, wherein one end of the first water pump is connected to a first outflow port of the first water tank, and the other end of the first water pump is connected to the semiconductor component The cold end inlet of the semiconductor component is connected, the cold end outlet of the semiconductor component is connected to the water inlet of the water bed, the water outlet of the water bed is connected to the first inlet of the first water tank, the first water tank is provided with a water inlet and a cover body for movably sealing the water inlet, an annular seal is provided on the inner wall of the lower end of the water inlet, the annular seal is connected to a support, the support has a cavity and a through hole connected to the cavity, a float is provided in the cavity, the float can selectively form a seal with the inner ring of the annular seal to prevent the water of the first water tank from overflowing from the water inlet.

[0007] Furthermore, an annular flange is provided on the inner wall of the lower end of the water injection port, and an annular groove for engaging with the annular flange is provided on the outer ring of the annular seal.

[0008] Furthermore, the cover body is threadedly connected to the water injection port.

[0009] Furthermore, the mattress host also includes a second water pump arranged in the host housing, one end of the second water pump is connected to the second outflow outlet of the first water tank, the other end of the second water pump is connected to the hot end inlet of the semiconductor component, and the hot end outlet of the semiconductor component is connected to the reflux port of the first water tank.

[0010] Furthermore, it also includes a controller, which is electrically connected to the semiconductor component, the first water pump, and the second water pump respectively.

[0011] Furthermore, the mattress host also includes a second water tank, one end of the second water pump is connected to the outflow outlet of the second water tank, the other end of the second water pump is connected to the hot end inlet of the semiconductor component, and the hot end outlet of the semiconductor component is connected to the reflux port of the second water tank.

[0012] Furthermore, the second water tank is arranged outside the main housing.

[0013] Compared with the prior art, the beneficial effects of the present invention include at least:

[0014] In order to prevent the water in the first water tank from overflowing, the utility model sets an annular seal, a float and a support to cooperate to prevent the water from overflowing. When the water in the first water tank is not full, the float will not block the water injection port, and will not affect the addition of water to the first water tank from the water injection port; when the water in the mattress body flows back to the first water tank, the water level in the first water tank rises, so that the float rises to contact with the annular seal and forms a seal under the buoyancy of water, so that the water in the first water tank cannot overflow from the water injection port, thereby protecting the mattress host circuit and extending the service life of the mattress host. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is an exploded view of the anti-backflow device for a cooling and heating mattress according to an embodiment of the utility model;

[0016] Figure 2 It is a schematic diagram of the water filling port and the cover of the first water tank of the embodiment of the utility model;

[0017] Figure 3 for Figure 2 Cross-sectional view of the structure;

[0018] In the figure: 1. mattress main unit; 11. main unit housing; 12. first water tank; 121. water inlet; 1210. annular flange; 122. cover body; 123. annular seal; 124. support member; 1240. through hole; 125. float; 13. semiconductor component; 14. first water pump; 15. second water pump. DETAILED DESCRIPTION

[0019] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided to make the present invention more comprehensive and complete and to fully convey the concepts of example embodiments to those skilled in the art. The same reference numerals in the figures represent the same or similar structures, and thus their repeated description will be omitted.

[0020] The words expressing positions and directions described in the present utility model are all explained by taking the drawings as examples, but they can be changed as needed, and all the changes are included in the protection scope of the present utility model.

[0021] Embodiment 1

[0022] like Figure 1-3 As shown, the utility model provides a backflow prevention device for a cooling and heating mattress, which is used to be connected to a mattress body (not shown in the figure), wherein a circulating water circuit is arranged inside the mattress body, and a water bed water inlet and a water bed water outlet connected to the circulating water circuit are arranged on the mattress body; the mattress host 1 comprises a main body shell 11, a first water tank 12 arranged inside the main body shell 11, and a first water pump 14 for cooling or heating, wherein one end of the first water pump 14 is connected to a first outflow port of the first water tank 12, and the other end of the first water pump 14 is connected to a cold end inlet of the semiconductor component 13, and the cold end of the semiconductor component 13 is connected to the cold end inlet of the semiconductor component 13. The end outlet is connected to the water inlet of the water bed, and the water outlet of the water bed is connected to the first inlet of the first water tank 12. The first water tank 12 is provided with a water filling port 121 and a cover body 122 for movably covering the water filling port 121. The inner wall of the lower end of the water filling port 121 is provided with an annular seal 123, and the annular seal 123 is connected to a support member 124. The support member 124 has a cavity and a through hole 1240 connected to the cavity. A float 125 is provided in the cavity, and the float 125 can selectively form a seal with the inner circle of the annular seal 123 to prevent the water of the first water tank 12 from overflowing from the water filling port 121.

[0023] In this embodiment, the semiconductor component 13 is used to heat or cool the medium water. When the main unit is working, the first water pump 14 pumps the water in the first water tank 12 to the semiconductor component 13, and the semiconductor component 13 heats or cools the water. The heated or cooled water is transported to the circulating water path of the mattress body to cool or heat the mattress body. After that, the water in the mattress body flows back to the first water tank 12, thereby forming a water flow circulation of the mattress body. The semiconductor component 13 cools and heats the mattress body, effectively improving the temperature control effect of the mattress body, so that the mattress body is cooled / heated more evenly.

[0024] After the power is turned off, the first water pump 14 no longer provides power. Since the position of the mattress host 1 is lower than that of the mattress body, the water in the mattress body will flow back into the first water tank 12, causing the water level in the first water tank 12 to rise. If the user forgets to cover the water inlet 121 with the cover 122 or the cover 122 is not covered properly, the water flowing back into the first water tank 12 will overflow from the water inlet 121, thereby damaging the circuit of the mattress host 1 and affecting the service life of the mattress host 1. Therefore, in order to prevent the water in the first water tank 12 from overflowing, the annular seal 123, the float 125 and the support 124 are provided. To prevent overflow, the specific principle is: when the water in the first water tank 12 is not full, the float 125 will not block the water inlet 121, and the support member 124 is provided with a through hole 1240 for water to flow out, so it will not affect the addition of water from the water inlet 121 to the first water tank 12; when the water in the mattress body flows back to the first water tank 12, the water level in the first water tank 12 rises, so that the float 125 rises to contact with the annular seal 123 and forms a seal under the buoyancy of water, so that the water in the first water tank 12 cannot overflow from the water inlet 121, thereby protecting the circuit of the mattress host 1 and extending the service life of the mattress host 1.

[0025] It should be noted that the semiconductor component 13 of this embodiment is a prior art. The semiconductor component 13 is also called a semiconductor refrigeration system, a semiconductor refrigeration module or a semiconductor thermoelectric module. The semiconductor component 13 includes a semiconductor thermoelectric device (i.e., TEC). One side of the TEC is a cold-conducting surface, and the other side is a heat-conducting surface. The cold-conducting surface and the heat-conducting surface are respectively provided with fins. The TEC includes two substrates (such as ceramic substrates), and a number of pairs of P-type and D-type thermocouples are arranged between the two substrates. By passing a forward current through the TEC, the first side of the TEC is cooled and the second side is heated; if a reverse current is passed through the TEC, the first side of the TEC is heated and the second side is cooled. The specific structure of the semiconductor component 13 can refer to the relevant description of the Chinese patent application number CN202210504722.5, and the invention name is a semiconductor thermoelectric device.

[0026] As a preferred embodiment, the inner wall of the lower end of the water injection port 121 is provided with an annular flange 1210, and the outer ring of the annular seal 123 is provided with an annular groove for engaging with the annular flange 1210. The annular seal 123 of this embodiment is installed by engaging with the annular flange 1210 of the water injection port 121 through the annular groove, which has a simple structure and is easy to install, while further improving the sealing effect between the annular seal 123 and the water injection port 121.

[0027] As a preferred embodiment, the cover 122 is threadedly connected to the water injection port 121. The cover 122 is installed by threaded connection, which is easy to operate and convenient for filling water into the first water tank 12, while enhancing the sealing effect between the cover 122 and the water injection port 121. Furthermore, the inner wall of the upper end of the water injection port 121 of this embodiment is provided with an internal thread, and the outer side of the cover 122 is provided with an external thread that matches the internal thread.

[0028] As a preferred embodiment, the mattress host 1 also includes a second water pump 15 arranged in the host housing 11, one end of the second water pump 15 is connected to the second flow outlet of the first water tank 12, the other end of the second water pump 15 is connected to the hot end inlet of the semiconductor component 13, and the hot end outlet of the semiconductor component 13 is connected to the reflux port of the first water tank 12.

[0029] In this embodiment, the first water tank 12 and the second water pump 15 are connected through a heat dissipation pipe, and the first water tank 12 and the semiconductor component 13 are connected through a return pipe. The water in the first water tank 12 is pressurized by the second water pump 15, flows from the second flow outlet of the first water tank 12 through the hot end of the semiconductor component 13, and then flows into the first water tank 12 through the return pipe, forming a heat dissipation water circulation, which can dissipate the heat generated by the semiconductor component 13. The heat dissipation water circulation not only improves the heat dissipation efficiency, but also improves the cooling effect.

[0030] It should be noted that two circulation loops are formed in the mattress main unit 1 of this embodiment, one circulation loop is used for water circulation of the mattress main unit, and the other circulation loop is used for heat dissipation circulation of the semiconductor component 13. The two circulation loops can simplify the structure and reduce the volume of the mattress main unit 1 by sharing a first water tank 12.

[0031] As a preferred embodiment, a controller is further included, and the controller is electrically connected to the semiconductor component 13, the first water pump 14, and the second water pump 15. By setting up the controller, the semiconductor component 13, the first water pump 14, and the second water pump 15 can be intelligently controlled to achieve intelligent operation.

[0032] Embodiment 2

[0033] As a preferred embodiment, the mattress host 1 also includes a second water tank (not shown in the figure), one end of the second water pump 15 is connected to the outflow outlet of the second water tank, the other end of the second water pump 15 is connected to the hot end inlet of the semiconductor component 13, and the hot end outlet of the semiconductor component 13 is connected to the reflux port of the second water tank.

[0034] The difference from the first embodiment is that the mattress host 1 is provided with a first water tank 12 and a second water tank. When the power is turned on, the water in the first water tank 12 is pressurized by the first water pump 14, flows from the first outlet of the first water tank 12 through the cold end of the semiconductor component 13, and after being cooled by the semiconductor component 13, enters the circulating water circuit of the mattress body through the water inlet of the water bed, and then flows into the first water tank 12 through the water outlet of the water bed, forming a water cooling cycle. At the same time. The water in the second water tank is pressurized by the second water pump 15, flows from the outlet of the second water tank through the hot end of the semiconductor component 13, and then flows into the second water tank, forming a heat dissipation water cycle. By separately arranging the second water tank and the first water tank 12, two independent circulation loops can be formed, and the heat dissipation circulation loop will not affect the temperature regulation efficiency of the water circulation loop of the mattress body.

[0035] As a preferred embodiment, the second water tank is arranged outside the main housing 11. In this way, the second water tank does not occupy the space of the mattress main body 1, and it is convenient to change the water in the second water tank.

[0036] Although the embodiments of the utility model have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the utility model. Ordinary technicians in the field can change, modify, replace and modify the above embodiments within the scope of the utility model without departing from the principles and purpose of the utility model. All of these changes should fall within the scope of protection of the claims of the utility model.

Claims

1. A backflow prevention device for a cooling and heating mattress, used to be connected to a mattress body, wherein a circulating water circuit is arranged inside the mattress body, and a water bed water inlet and a water bed water outlet connected to the circulating water circuit are arranged on the mattress body; characterized in that: The mattress main unit (1) comprises a mattress main unit (1), the position of the mattress main unit (1) being lower than the position of the mattress body, the mattress main unit (1) comprising a main unit housing (11), a first water tank (12) arranged inside the main unit housing (11), a semiconductor component (13) for cooling or heating, and a first water pump (14), one end of the first water pump (14) being connected to a first outflow outlet of the first water tank (12), the other end of the first water pump (14) being connected to a cold end inlet of the semiconductor component (13), the cold end outlet of the semiconductor component (13) being connected to a water inlet of the water bed, and the water outlet of the water bed being connected to a first outlet of the first water tank (12). The first water tank (12) is connected to an inlet, the first water tank (12) is provided with a water inlet (121) and a cover (122) for movably covering the water inlet (121), an annular seal (123) is provided on the inner wall of the lower end of the water inlet (121), the annular seal (123) is connected to a support member (124), the support member (124) has a cavity and a through hole (1240) connected to the cavity, a float (125) is provided in the cavity, the float (125) can selectively form a seal with the inner circle of the annular seal (123) to prevent the water in the first water tank (12) from overflowing from the water inlet (121).

2. The backflow prevention device for a cooling and heating mattress according to claim 1, characterized in that: An annular flange (1210) is provided on the inner wall of the lower end of the water injection port (121), and an annular groove for clamping with the annular flange (1210) is provided on the outer ring of the annular sealing member (123).

3. The backflow prevention device for a cooling and heating mattress according to claim 1, characterized in that: The cover body (122) is threadedly connected to the water injection port (121).

4. The backflow prevention device for a cooling and heating mattress according to claim 1, characterized in that: The mattress host (1) further comprises a second water pump (15) arranged in the host housing (11); one end of the second water pump (15) is connected to the second outflow port of the first water tank (12); the other end of the second water pump (15) is connected to the hot end inlet of the semiconductor component (13); and the hot end outlet of the semiconductor component (13) is connected to the reflux port of the first water tank (12).

5. The backflow prevention device for a cooling and heating mattress according to any one of claims 1 to 4, characterized in that: It also includes a controller, which is electrically connected to the semiconductor component (13), the first water pump (14), and the second water pump (15) respectively.

6. The backflow prevention device for a cooling and heating mattress according to claim 5, characterized in that: The mattress host (1) also includes a second water tank, one end of the second water pump (15) is connected to the outflow port of the second water tank, the other end of the second water pump (15) is connected to the hot end inlet of the semiconductor component (13), and the hot end outlet of the semiconductor component (13) is connected to the reflux port of the second water tank.

7. The backflow prevention device for a cooling and heating mattress according to claim 6, characterized in that: The second water tank is arranged outside the main housing (11).

Citation Information

Patent Citations

  • Semiconductor thermoelectric device

    CN114899300A