A constant temperature infrared temperature measuring device

Abstract

The utility model discloses a constant-temperature infrared temperature measuring device, comprising an infrared temperature measuring module, a temperature measuring element and a heating component. The infrared temperature measuring module comprises a heat-conducting and insulating substrate, an outer cover body and an infrared detection element. The outer cover body is arranged on the substrate to enclose an inner cavity. The infrared detection element is arranged on the substrate and is located in the inner cavity. The outer cover body is provided with a light-transmitting portion to allow light to enter the inner cavity. The temperature measuring element is arranged on the back of the substrate to detect the temperature. The heating component is arranged on the back of the substrate to heat the substrate. When the ambient temperature is too low, the heating component heats the substrate, and the substrate conducts heat to the infrared detection element, thereby ensuring that the infrared detection element is in a relatively stable temperature environment, and improving the temperature measurement stability and accuracy of the infrared detection element.

Description

Technical Field

[0001] The utility model relates to the technical field of infrared temperature measuring equipment, in particular to a constant-temperature infrared temperature measuring device. Background Art

[0002] Infrared temperature measuring devices have become one of the conventional means of detecting temperature. Objects radiate infrared rays. The infrared detection elements in the infrared temperature measuring devices obtain infrared rays to generate electrical signals, which can reflect the temperature of the object's surface. However, when the infrared temperature measuring device is used in a situation where the ambient temperature is low, the ambient temperature will cause the temperature of the infrared temperature measuring device itself to drop, thereby affecting the detection temperature of the infrared detection element and reducing the accuracy of the detection. Utility Model Content

[0003] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, the utility model proposes a constant temperature infrared temperature measuring device, which can adjust the temperature of the environment where the infrared detection element is located according to its own temperature, thereby improving the temperature measurement stability and accuracy of the infrared detection element.

[0004] According to a first aspect of the present invention, a constant-temperature infrared temperature measuring device includes: an infrared temperature measuring module, including a heat-conducting and insulating substrate, an outer cover body and an infrared detection element, the outer cover body is covered on the substrate to enclose an inner cavity, the infrared detection element is arranged on the substrate and located in the inner cavity, and the outer cover body is provided with a light-transmitting portion to allow light to enter the inner cavity; a temperature measuring element, which is arranged on the back of the substrate to detect temperature; and a heating component, which is arranged on the back of the substrate to be able to heat the substrate.

[0005] A constant temperature infrared temperature measuring device according to an embodiment of the utility model has at least the following beneficial effects:

[0006] In the constant-temperature infrared temperature measuring device of the utility model, the infrared rays radiated by the object can enter the inner cavity through the light-transmitting part to be acquired by the infrared detection element in the inner cavity, and the infrared detection element processes the infrared rays into electrical signals, thereby obtaining the temperature of the surface of the object; and when the infrared temperature measuring device is used in an environment with a relatively low temperature, the temperature measuring element can detect the temperature of the substrate, thereby reflecting the temperature of the environment where the infrared detection element is located at this time; when the ambient temperature is too low, the heating component heats the substrate, and the substrate conducts the heat to the infrared detection element, thereby ensuring that the infrared detection element is in a relatively stable temperature environment, thereby improving the temperature measurement stability and accuracy of the infrared detection element.

[0007] According to some embodiments of the present invention, in the vertical direction in which the infrared detection component is arranged on the substrate, the heating component is arranged around the infrared detection component.

[0008] According to some embodiments of the utility model, the constant temperature infrared temperature measuring device also includes a circuit board, the substrate is arranged on the circuit board, the temperature measuring component and the heating component are located between the circuit board and the substrate, and the infrared detection component has a first pin group, which is passed through the substrate and the circuit board.

[0009] According to some embodiments of the present invention, the temperature measuring component has a second pin group, the heating component has a third pin group, and the second pin group and the third pin group are both inserted into the circuit board.

[0010] According to some embodiments of the utility model, the constant temperature infrared temperature measuring device also includes a ring, which is arranged between the circuit board and the substrate, and the ring, the circuit board and the substrate enclose an accommodation cavity, and the temperature measuring component and the heating assembly are located in the accommodation cavity.

[0011] According to some embodiments of the present utility model, the infrared temperature measurement module also includes an inner cover body arranged in the inner cavity, the inner cover body is covered on the substrate to enclose a detection cavity, and the infrared detection element is located in the detection cavity.

[0012] According to some embodiments of the utility model, the outer cover is provided with an aperture member, and the aperture member is provided with a first light-through hole in front of the infrared detection member to form the light-transmitting portion.

[0013] According to some embodiments of the present utility model, the inner cover is provided with a filter in front of the infrared detection element, and the filter allows infrared rays to pass through.

[0014] According to some embodiments of the present invention, the constant temperature infrared temperature measuring device further includes a housing, and the housing is further provided with a focusing lens in front of the first light hole.

[0015] According to some embodiments of the present invention, the constant temperature infrared temperature measuring device further includes a control module, and the control module is electrically connected to the temperature measuring component and the heating component respectively.

[0016] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0018] Figure 1 This is a schematic diagram of the internal structure of one embodiment of the constant temperature infrared temperature measuring device of the utility model;

[0019] Figure 2 for Figure 1 An enlarged schematic diagram of a part A of one embodiment of the constant temperature infrared temperature measuring device of the utility model;

[0020] Figure 3 This is a principle structural block diagram of one embodiment of the constant temperature infrared temperature measuring device of the utility model.

[0021] Reference numerals:

[0022] Infrared temperature measurement module 100; substrate 110, outer cover 120; inner cavity 121; inner cover 130; detection cavity 131; aperture member 140; first light hole 141; filter 150; infrared detection member 160; temperature measurement member 200; heating assembly 300; control module 400; circuit board 500; first pin group 610; second pin group 620; third pin group 630; collar 700; placement cavity 710; housing 800; focusing lens 810. DETAILED DESCRIPTION

[0023] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0024] In the description of the present invention, it should be understood that descriptions involving orientation, such as the orientations or positional relationships indicated by terms such as "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside", etc., are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0025] In the description of the present utility model, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed" etc. are understood to exclude the number itself, and "above", "below", "within" etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used to distinguish the technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0026] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0027] like Figure 1-Figure 3 As shown, a constant temperature infrared temperature measuring device according to an embodiment of the first aspect of the utility model includes an infrared temperature measuring module 100, a temperature measuring element 200 and a heating assembly 300. The infrared temperature measuring module 100 includes a heat-conductive and insulating substrate 110, an outer cover body 120, an outer cover body and an infrared detection element 160. The outer cover body is covered on the substrate 110 and the outer cover body 120 to enclose an inner cavity 121. The infrared detection element 160 is arranged on the substrate 110 and the outer cover body 120 and is located in the inner cavity 121. The outer cover body is provided with a light-transmitting portion to allow light to enter the inner cavity 121. The temperature measuring element 200 is arranged on the back of the substrate 110 and the outer cover body 120 to detect the temperature. The heating assembly 300 is arranged on the back of the substrate 110 and the outer cover body 120 to be able to heat the substrate 110 and the outer cover body 120.

[0028] Among them, the substrate 110 and the outer cover body 120 can be made of ceramic materials with good thermal conductivity, and the ceramic materials also have good insulation ability. The infrared detection component 160 is arranged on the substrate 110 and the outer cover body 120, and the temperature measuring component 200 and the heating component 300 are both in contact with the substrate 110 and the outer cover body 120. The good insulation performance of the substrate 110 and the outer cover body 120 can prevent a short circuit between the infrared detection component 160, the temperature measuring component 200 and the heating component 300.

[0029] The temperature measuring element 200 can be selected from conventional NTC temperature measuring resistors. Changes in temperature can cause changes in the resistance value of the NTC temperature measuring resistor. By applying voltage to the NTC temperature measuring resistor and detecting the current flowing through the NTC temperature measuring resistor, the resistance value of the NTC temperature measuring resistor can be calculated, thereby analyzing the temperature of the location of the temperature measuring element 200. The temperature measuring element 200 is in contact with the substrate 110 and the outer cover body 120. Therefore, the temperature of the substrate 110 and the outer cover body 120 can be detected relatively accurately, and then the substrate 110 and the outer cover body 120 can be used to reflect the temperature of the infrared detection element 160 disposed on the substrate 110 and the outer cover body 120 and located in the inner cavity 121.

[0030] The heating component 300 can be an electric heating wire or a semiconductor heating sheet. For example, when a semiconductor heating sheet is used, the heating surface of the semiconductor heating sheet is attached to the back of the substrate 110 and the outer cover body 120, and a forward current is applied to the semiconductor heating sheet, and the heating surface heats the substrate 110 and the outer cover body 120. When a semiconductor heating sheet is used, when the temperature measuring component 200 detects that the ambient temperature is too high, a reverse current can also be applied to the semiconductor heating sheet, and the heating surface of the semiconductor heating sheet is cooled to reduce the temperature of the substrate 110 and the outer cover body 120, thereby cooling the position where the infrared detection component 160 is located.

[0031] In some embodiments of the present invention, the constant temperature infrared temperature measuring device further includes a control module 400 , and the control module 400 is electrically connected to the temperature measuring component 200 and the heating component 300 , respectively.

[0032] like Figure 3 As shown, the control module 400 can be selected in the MCU or CPU and its affiliated circuits. The control module 400 can control the heating component 300 according to the temperature information fed back by the temperature measuring component 200. For example, a temperature threshold can be set in the control module 400, and the temperature threshold can be selected between 40-45°C, for example, 42°C. When the temperature measuring component 200 detects a temperature lower than 42°C, the control module 400 controls the heating component 300 to start heating to raise the temperature to approximately 42°C.

[0033] In the constant temperature infrared temperature measuring device of the present invention, the infrared rays radiated by the object can enter the inner cavity 121 through the light-transmitting part, so as to be acquired by the infrared detection element 160 in the inner cavity 121. The infrared detection element 160 processes the infrared rays into an electrical signal, thereby obtaining the temperature of the surface of the object. When the infrared temperature measuring device is used in an environment with a relatively low temperature, the temperature measuring element 200 can detect the temperature of the substrate 110 and the outer cover 120, thereby reflecting the temperature of the environment where the infrared detection element 160 is located at this time. When the ambient temperature is too low, the heating component 300 heats the substrate 110 and the outer cover 120, and the substrate 110 and the outer cover 120 transfer the heat to the infrared detection element 160, thereby ensuring that the infrared detection element 160 is in a relatively stable temperature environment, and improving the temperature measurement stability and accuracy of the infrared detection element 160.

[0034] In some embodiments of the present invention, Figure 1 , 2 As shown, the infrared detection component 160 is disposed in the vertical direction of the substrate 110 and the outer cover 120 , and the heating assembly 300 is disposed around the infrared detection component 160 .

[0035] It can be understood that the infrared detection element 160 is arranged on the front side of the substrate 110 and the outer cover body 120, and the heating component 300 is arranged on the back side of the substrate 110 and the outer cover body 120. In the vertical direction, the heating component 300 surrounds the infrared detection element 160. When the heating component 300 heats the substrate 110 and the outer cover body 120, the peripheral temperature of the infrared detection element 160 rises, thereby evenly increasing the temperature of the infrared detection element 160.

[0036] In some embodiments of the present invention, Figure 1 As shown, the constant temperature infrared temperature measuring device also includes a circuit board 500, the substrate 110 and the outer cover 120 are arranged on the circuit board 500, the temperature measuring component 200 and the heating component 300 are located between the circuit board 500 and the substrate 110 and the outer cover 120, and the infrared detection component 160 has a first pin group 610, and the first pin group 610 is penetrated by the substrate 110, the outer cover 120 and the circuit board 500.

[0037] The first pin group 610 may have two pins, both of which are inserted through the substrate 110, the outer cover body 120 and the circuit board 500. Sealant may be filled between the pins of the substrate 110, the outer cover body 120 and the first pin group 610. Specifically, the infrared detection element 160 may include a crystal source board and an infrared detection chip. The infrared detection chip is arranged on the crystal source board. The first pin group 610 is connected to the crystal source board to connect to the infrared detection chip. The first pin group 610 is connected to the circuit board 500. The control module 400 may be arranged on the circuit board 500. The control module 400 is connected to the infrared detection element 160 through the circuit board 500 and the first pin group 610, so as to obtain the temperature detected by the infrared detection element 160.

[0038] In some embodiments of the present invention, the temperature measuring component 200 has a second pin group 620 , and the heating component 300 has a third pin group 630 . Both the second pin group 620 and the third pin group 630 are penetrated on the circuit board 500 .

[0039] The second pin group 620 and the third pin group 630 may each include two pins. Similarly, the circuit board 500 can be connected to the temperature measuring component 200 through the second pin group 620, and can also be connected to the heating component 300 through the third pin group 630. The control module 400 is then connected to the temperature measuring component 200 and the heating component 300 respectively through the circuit board 500.

[0040] In some embodiments of the present invention, Figure 2As shown, the constant temperature infrared temperature measuring device also includes a ring 700, which is arranged between the circuit board 500 and the substrate 110 and the outer cover body 120. The ring 700 and the circuit board 500, the substrate 110, and the outer cover body 120 enclose a placement cavity 710, and the temperature measuring component 200 and the heating component 300 are located in the placement cavity 710.

[0041] The infrared temperature measurement module 100 can be supported on the circuit board 500 by the first pin group 610, and there will be a certain gap between the substrate 110, the outer cover 120 and the circuit board 500, and the temperature measuring element 200 and the heating component 300 can be located in the gap, and the collar 700 can be made of materials such as resin or rubber, and the collar 700 is respectively in contact with the substrate 110, the outer cover 120 and the circuit board 500, so as to prevent the substrate 110, the outer cover 120 and the circuit board from being damaged. In addition, the collar 700, the circuit board 500, the substrate 110 and the outer cover 120 enclose a placement cavity 710, so that the heat generated by the heating component 300 is not easily dissipated from the gap, but is transferred to the inner cavity 121 through the substrate 110 and the outer cover 120, thereby improving the heat conduction efficiency. At the same time, the temperature measuring component 200 can also detect the temperature of the substrate 110 and the outer cover 120 more accurately.

[0042] In some embodiments of the present invention, the infrared temperature measurement module 100 also includes an inner cover body 130 arranged in the inner cavity 121, and the inner cover body 130 is covered on the substrate 110 and the outer cover body 120 to enclose a detection cavity 131, and the infrared detection element 160 is located in the detection cavity 131.

[0043] The inner cover 130 can be connected to the substrate 110 and the outer cover 120 to seal the infrared detection element 160 in the detection cavity 131 , effectively preventing water, dust, etc. from entering the detection cavity 131 and affecting the performance of the infrared detection element 160 .

[0044] In some embodiments of the present invention, Figure 1 , 2 As shown, the outer cover is provided with an aperture member 140, and the aperture member 140 is provided with a first light-through hole 141 in front of the infrared detection member 160 to form the light-transmitting portion.

[0045] The aperture can limit the light beam through the first light hole 141, thereby limiting the size of the infrared light beam, thereby obtaining relatively accurate infrared radiation from the position point of the object that needs to be measured in temperature, thereby improving the accuracy of temperature measurement.

[0046] In some embodiments of the utility model, the inner cover body 130 is provided with a filter 150 in front of the infrared detection element 160, and the filter 150 allows infrared rays to pass through. The filter 150 can be selected to be a filter 150 that can filter out light other than infrared rays. The filtered light can include visible light, ultraviolet rays, etc., thereby improving the accuracy of temperature measurement.

[0047] In some embodiments of the present invention, the constant temperature infrared temperature measuring device further includes a housing 800 , and the housing 800 is further provided with a focusing lens 810 in front of the first light hole 141 .

[0048] Specifically, the constant temperature infrared temperature measuring device of the present design can be placed in a housing 800, which has a darkroom. The housing 800 is provided with a second light hole connected to the darkroom in front of the first light hole 141, and a focusing lens 810 is embedded in the second light hole. The focusing lens 810 can converge infrared rays, and the first light hole 141 or the filter 150 can be located at the focal position of the focusing lens 810 to effectively obtain infrared rays and improve the accuracy of temperature measurement.

[0049] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0050] Although the embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A constant temperature infrared temperature measuring device, characterized in that: include: The infrared temperature measurement module comprises a heat-conducting and insulating substrate, an outer cover, and an infrared detection element, wherein the outer cover is disposed on the substrate to enclose an inner cavity, the infrared detection element is disposed on the substrate and is located in the inner cavity, and a light-transmitting portion is disposed on the outer cover to allow light to enter the inner cavity; A temperature measuring element, arranged on the back of the substrate to detect the temperature; The heating component is arranged on the back of the substrate so as to heat the substrate.

2. A constant temperature infrared temperature measuring device according to claim 1, characterized in that: In the vertical direction in which the infrared detection component is arranged on the substrate, the heating component is arranged around the infrared detection component.

3. A constant temperature infrared temperature measuring device according to claim 1, characterized in that: It also includes a circuit board, the substrate is arranged on the circuit board, the temperature measuring component and the heating component are located between the circuit board and the substrate, and the infrared detection component has a first pin group, which passes through the substrate and the circuit board.

4. A constant temperature infrared temperature measuring device according to claim 3, characterized in that: The temperature measuring component has a second pin group, the heating component has a third pin group, and the second pin group and the third pin group are both arranged on the circuit board.

5. A constant temperature infrared temperature measuring device according to claim 3, characterized in that: It also includes a collar, which is arranged between the circuit board and the substrate. The collar, the circuit board and the substrate enclose a placement cavity, and the temperature measuring component and the heating component are located in the placement cavity.

6. A constant temperature infrared temperature measuring device according to claim 1, characterized in that: The infrared temperature measurement module also includes an inner cover body arranged in the inner cavity, the inner cover body is covered on the substrate to enclose a detection cavity, and the infrared detection element is located in the detection cavity.

7. A constant temperature infrared temperature measuring device according to claim 6, characterized in that: The outer cover is provided with an aperture member, and the aperture member is provided with a first light-through hole in front of the infrared detection member to form the light-transmitting portion.

8. A constant temperature infrared temperature measuring device according to claim 7, characterized in that: The inner cover is provided with a filter in front of the infrared detection element, and the filter allows infrared rays to pass through.

9. A constant temperature infrared temperature measuring device according to claim 7, characterized in that: The device also includes a shell, and a focusing lens is arranged in front of the first light hole.

10. A constant temperature infrared temperature measuring device according to claim 1, characterized in that: It also includes a control module, which is electrically connected to the temperature measuring component and the heating component respectively.

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