A headset

Abstract

The present application relates to a headset, and specifically to the technical field of electronic equipment. The first speaker includes a first diaphragm, and the first diaphragm cooperates with a movement housing to form a first front cavity and a first rear cavity located on both sides of the first diaphragm. The second speaker includes a second diaphragm and a speaker housing, and the second diaphragm cooperates with the speaker housing and the movement housing to form a second front cavity and a second rear cavity located on both sides of the second diaphragm; the movement housing is provided with a first sound outlet hole for transmitting the sound in the first front cavity to the outside of the movement housing, and a second sound outlet hole for transmitting the sound in the second front cavity to the outside of the movement housing; the second speaker is further provided with a connecting hole connecting the second rear cavity with the outside of the second speaker. In the present application, the second speaker is provided with a connecting hole connecting the first rear cavity with the outside of the second speaker to improve the sound distortion phenomenon of the second speaker.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to a headset. Background Art

[0002] With the development of acoustic technology, headphones have been widely used in people's daily lives. Headphones may use a combination of multiple speakers to output sound in order to provide users with an auditory feast. When using headphones, different speakers may be responsible for outputting sounds of different frequency bands. Generally speaking, multiple speakers that emit sounds of different frequency bands can be driven by a single electrical signal or multiple electrical signals. When driven by a single electrical signal, since the diaphragm of the speaker responsible for the output of higher-frequency sounds is usually thinner, the diaphragm will produce distortion due to excessive amplitude when receiving low-frequency signals, affecting the listening quality and the user experience. Utility Model Content

[0003] The present application provides an earphone, the earphone comprising a core housing, a first speaker, a second speaker and a driving circuit, the core housing is used to accommodate the first speaker and the second speaker, the driving circuit is used to drive the first speaker and the second speaker, and the frequency band of the sound output by the first speaker is at least partially lower than the frequency band of the sound output by the second speaker;

[0004] The first speaker comprises a first diaphragm, the first diaphragm cooperates with the movement housing to form a first front cavity and a first rear cavity located on both sides of the first diaphragm, and the second speaker comprises a second diaphragm and a speaker housing, the second diaphragm cooperates with the speaker housing and the movement housing to form a second front cavity and a second rear cavity located on both sides of the second diaphragm;

[0005] The movement housing is provided with a first sound outlet hole for transmitting the sound in the first front cavity to the outside of the movement housing, and a second sound outlet hole for transmitting the sound in the second front cavity to the outside of the movement housing;

[0006] The second speaker is further provided with a connecting hole connecting the second rear cavity with the outside of the second speaker.

[0007] In some implementations, when the driving circuit drives the second speaker, an operating frequency of the driving circuit includes a frequency band not higher than 200 Hz.

[0008] In some embodiments, the driving circuit is configured to simultaneously drive the first speaker and the second speaker through the same digital-to-analog conversion circuit.

[0009] In some embodiments, the resonant frequency of the second speaker is not less than 6 kHz.

[0010] In some embodiments, the acoustic resistance at the connecting hole is 5×108 Pa·s / m-1.3×109 Pa·s / m, and / or an acoustic resistance net is provided at the connecting hole.

[0011] In some embodiments, the second speaker is further provided with a second magnetic circuit system, the connecting hole runs through the second magnetic circuit system, and the hole diameter of the connecting hole is 0.8 mm-1.2 mm.

[0012] In some embodiments, in the radial direction of the second diaphragm, the communication hole is centered relative to the second diaphragm.

[0013] In some embodiments, on a reference plane perpendicular to the axial direction of the first speaker, the orthographic projection of the second speaker on the reference plane at least partially overlaps with the orthographic projection of the first speaker on the reference plane, and the axial direction of the second speaker points to the first speaker, and the connecting hole is arranged toward the interior of the movement housing.

[0014] In some embodiments, the earphone further includes a connecting tube disposed in the movement housing, one end of the connecting tube is connected to the connecting hole, and the other end of the connecting tube is connected to the outside of the movement housing.

[0015] In some embodiments, the second speaker is located in the first front cavity, and the connecting hole connects the second rear cavity and the first front cavity.

[0016] In some implementations, the audio driving signal output by the driving circuit is configured to be directly input to the second speaker without undergoing a frequency division process.

[0017] In the present application, the second speaker is provided with a connecting hole connecting the first rear cavity with the outside of the second speaker, so as to improve the distortion phenomenon of the second speaker. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0019] Figure 1 is a schematic diagram of the structure of headphones in some embodiments of the present application;

[0020] Figure 2 yes Figure 1 A schematic diagram of the structure of the middle earphone from another perspective;

[0021] Figure 3 yes Figure 1 Schematic diagram of the structure of the middle earphone from another perspective;

[0022] Figure 4 is a schematic diagram of the front profile of an ear of a user or a simulator in some embodiments;

[0023] Figure 5 yes Figure 1 A schematic diagram of the middle earphone in some embodiments when it is in a wearing state;

[0024] Figure 6 yes Figure 1 A cross-sectional view of the middle earphone along line VI-VI in some embodiments;

[0025] Figure 7 yes Figure 1 A cross-sectional view of the middle earphone along line VII-VII in some embodiments;

[0026] Figure 8 yes Figure 6 A schematic diagram of the structure of the first housing in some embodiments;

[0027] Fig. 9 A circuit diagram of a speaker assembly in some embodiments of the present application;

[0028] Fig.10 Schematic diagram of the frequency division effect of the second speaker 122 under different frequency division processing conditions when adjusting the high-pass frequency divider 1304 in some embodiments of the present application;

[0029] Fig.11 for Figure 7 A schematic diagram of the structure of the second speaker in some other embodiments;

[0030] Fig.12 for Fig.11 Schematic diagram of some structures of the central movement module in other embodiments. DETAILED DESCRIPTION

[0031] The present application is further described in detail below in conjunction with the accompanying drawings and examples. It is particularly noted that the following examples are only used to illustrate the present application, but are not intended to limit the scope of the present application. Similarly, the following examples are only some embodiments of the present application rather than all embodiments, and all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of this application.

[0032] Reference to "embodiment" in this application means that a particular feature, structure or characteristic described in conjunction with the embodiment may be included in at least one embodiment of this application. It is explicitly and implicitly understood by those skilled in the art that the embodiments described in this application may be combined with other embodiments.

[0033] This application describes a headset. Figure 1 , Figure 2 and Figure 3 , Figure 1 is a schematic diagram of the structure of headphones in some embodiments of the present application, Figure 2 yes Figure 1 Schematic diagram of the structure of the middle earphone from another perspective. Figure 3 yes Figure 1 The headphone 100 may include a core module 10 and a hook structure 20 connected to the core module 10. The core module 10 may provide sound and realize an auditory experience. Of course, it may also have other functions such as a sound pickup function, a touch function, a press function, and a light function to realize a different experience. The core module 10 may cooperate with the hook structure 20 to realize wearing.

[0034] See also Figure 4 , Figure 4 2 is a schematic diagram of the front profile of the ear of the user or simulator in some embodiments. The ear 200 may include physiological parts such as the external auditory canal 2001, the concha cavity 2002, the cymba concha 2003, the triangular fossa 2004, the antihelix 2005, the scaphoid 2006, the helix 2007 and the antitragus 2008. Among them, the external auditory canal 2001 has a certain depth and can extend to the tympanic membrane, but for the convenience of description, the external auditory canal 2001 may refer to the ear hole of the ear 200 without special instructions in this application. In addition, the concha cavity 2002, the cymba concha 2003, the triangular fossa 2004 and other physiological parts may also have a certain volume and depth. The concha cavity 2002 may be directly connected to the external auditory canal 2001, that is, it can be regarded as the ear hole is located at the bottom of the concha cavity 2002.

[0035] It is understandable that there may be individual differences between different users, which may lead to different shapes, sizes and other size differences of the ear 200. For the convenience of description and to reduce (or even eliminate) the individual differences of different users, a simulator including a head and its ear (generally a left ear and a right ear, one of the ears is taken as an example here) 200 may be made based on standards such as ANS: S3.36, S3.25 and IEC: 60318-7, such as GRAS 45BC KEMAR, HEADAcoustics, B&K 4128 series or B&K 5128 series, etc., so as to present the scene of most users wearing the earphone 100 through the simulator. Taking GRAS KEMAR as an example, the simulator of the ear 200 may be any one of GRAS 45AC, GRAS 45BC, GRAS45CC or GRAS 43AG, etc. Taking HEAD Acoustics as an example, the simulator of the ear 200 may be any one of HMS II.3, HMS II.3LN or HMS II.3LN HEC.

[0036] It should be noted that in the fields of medicine and anatomy, three basic planes of the human body or human body simulator can be defined: the sagittal plane, the coronal plane, and the horizontal plane, as well as three basic axes: the sagittal axis, the coronal axis, and the vertical axis. Among them, the sagittal plane refers to a plane perpendicular to the ground along the front-back direction of the body, which divides the human body or human body simulator into left and right parts; the coronal plane refers to a plane perpendicular to the ground along the left-right direction of the body, which divides the human body or human body simulator into front and back parts; the horizontal plane refers to a plane parallel to the ground along the up-down direction of the body, which divides the human body or human body simulator into upper and lower parts. Correspondingly, the sagittal axis refers to an axis along the front-back direction of the body and perpendicular to the coronal plane, the coronal axis refers to an axis along the left-right direction of the body and perpendicular to the sagittal plane, and the vertical axis refers to an axis along the up-down direction of the body and perpendicular to the horizontal plane. Furthermore, the “front side of the ear” described in the present application is a concept relative to the “back side of the ear”. The former refers to the side of the ear facing away from the head, and the latter refers to the side of the ear facing the head. They are both for the ear 200 of the user or the simulator. When observing the ear 200 of the human body or the human body simulator along the direction of the coronal axis, it can be seen as follows: Figure 4 shown.

[0037] See also Figure 5 , Figure 5 yes Figure 1Schematic diagram of the earphone 100 in some embodiments in a wearing state. The movement module 10 is located in front of the ear 200 in the wearing state. At least part of the hook structure 20 is located in the back of the ear 200 in the wearing state, so that the earphone 100 is hung on the ear 200 in the wearing state.

[0038] In the present application, when describing the process or action of wearing the headset 100, such as "wearing the headset 100", "the headset 100 is in a wearing state" and "in a wearing state", it can refer to the headset 100 being worn on the ear 200. Of course, precisely because of individual differences between different users, there may be some differences between the headset 100 worn by different users and the headset 100 worn on the ear 200 of the simulator, but such differences should be tolerated.

[0039] The core module 10 can be configured to not block the external auditory canal 2001 when worn, so that the earphone 100 is an "open earphone". It is understandable that the earphone 100 can be in different wearing states so that the core module 10 may partially block the external auditory canal 2001, but the external auditory canal 2001 is still not blocked.

[0040] See also Figure 1 , Figure 2 and Figure 3 , the core module 10 may have a connection end CE connected to the hook structure 20 and a free end FE not connected to the hook structure 20. In the wearing state, the free end FE of the core module 10 may extend into the concha cavity 2002, or may only cover at least a portion of the concha cavity 2002. The core module 10 and the hook structure 20 may be configured to clamp the ear 200 from the front and back sides of the ear 200 region corresponding to the concha cavity 2002, thereby increasing the resistance of the earphone 100 to fall off the ear 200, thereby improving the stability of the earphone 100 in the wearing state.

[0041] The movement module 10 may have a thickness direction X and a length direction Y and a width direction Z that are perpendicular to the thickness direction X and orthogonal to each other. In some embodiments, the length direction Y may be defined as the direction in which the movement module 10 approaches or moves away from the back of the head in the wearing state, the width direction Z may be defined as the direction in which the movement module 10 approaches or moves away from the top of the head in the wearing state, and the thickness direction X may be defined as the direction in which the movement module 10 faces or moves away from the user's ear in the wearing state. In some embodiments, the length direction Y may be defined as the direction from the connection end of the movement module 10 to the free end of the movement module 10, and the thickness direction X may be defined as the direction in which the movement module 10 faces or moves away from the user's ear in the wearing state. In some embodiments, the free end FE is pressed against the concha cavity 2002 in the thickness direction X. For another example, the free end FE abuts against the concha cavity 2002 in the length direction Y and the width direction Z.

[0042] It should be noted that: in the wearing state, the free end FE of the movement module 10 not only extends into the concha cavity 2002, but also can be projected onto the antihelix 2005, and can also be projected onto the left and right sides of the head and located in front of the ear 200 on the sagittal axis.

[0043] Of course, in other scenarios, at least part of the movement module 10 can also be projected onto the antihelix 2005, or onto the left and right sides of the head and located in front of the ear 200 on the sagittal axis.

[0044] In other words, the hook structure 20 can support the movement module 10 to be worn at the concha cavity 2002 , the antihelix 2005 , the front side of the ear 200 , and other wearing positions.

[0045] See also Figure 1 , Figure 2 and Figure 5 In the wearing state and observed along the direction of the coronal axis, the movement module 10 can be set to a circular, oval, rounded square, rounded rectangle, etc. Therefore, for the convenience of description, this embodiment takes the movement module 10 set to a rounded rectangle as an example for exemplary description. In some embodiments, the length of the movement module 10 in the length direction Y can be greater than the width of the movement module 10 in the width direction Z.

[0046] The core module 10 may have an inner side IS facing the ear 200 along the thickness direction X in the wearing state, an outer side OS away from the ear 200, and a connecting surface (such as the lower side LS, the upper side US, and the rear side RS, etc.) connecting the inner side IS and the outer side OS. Among them, when the core module 10 is in the wearing state, the upper side US connects the inner side IS and the outer side OS, the lower side LS connects the inner side IS and the outer side OS, the upper side US is closer to the top of the user's head along the width direction Z, the lower side LS is farther away from the top of the user's head along the width direction Z, and the rear side RS connects the upper side US and the lower side LS, and may also connect the inner side IS and the outer side OS. The thickness direction X can also be defined as the direction in which the core module 10 approaches or moves away from the ear 200 in the wearing state. At least part of the connecting surface, such as the rear side RS, is located in the concha cavity 2002 in the wearing state, and forms a first contact area with the front side of the ear 200 area. That is, the rear side RS can be located at one end of the length direction Y facing the back of the head in the wearing state, and at least partially located in the concha cavity 2002. In some embodiments, the hook-shaped structure 20 forms a second contact area with the rear side of the ear 200 region in the wearing state. The second contact area and the first contact area at least partially overlap in the ear thickness direction of the ear 200 region. Furthermore, the movement module 10 and the hook-shaped structure 20 can jointly clamp the ear 200 from the front and back sides of the ear 200, and the clamping force formed is mainly manifested as compressive stress, which is beneficial to improve the stability and comfort of the earphone 100 in the wearing state. In some embodiments, when the movement module 10 is set to a circular, elliptical or other shape, the connecting surface may also refer to the arc-shaped side of the movement module 10.

[0047] It should be noted that the terms "first", "second", "third", etc. in this application are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined by the terms "first", "second", "third", etc. may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0048] It is understandable that the movement module 10 can also be worn directly or by other means, and can even be worn by connecting with other structures in cooperation with the hook structure 20. Furthermore, the functions of the movement module 10 are not limited to the embodiments listed in the present application. In some embodiments, the hook structure 20 can be omitted or replaced by other structures.

[0049] In addition, when the wearing mode of the core module 10 changes, the matching mode of the core module 10 and the ear 200 may also change, but in some embodiments, the internal structure, overall structure, and external structure of the core module 10 do not necessarily change. Even in some embodiments, words related to the orientation, such as the lower side surface LS, the upper side surface US, and the rear side surface RS, do not necessarily form a corresponding relationship with the ear 200. Of course, in some embodiments, words such as the connection end CE can be made into only a word related to the orientation, which does not necessarily mean that a certain function is necessarily included.

[0050] Furthermore, when the wearing method of the core module 10 changes, the core module 10 may not cooperate with the hook structure 20 or other structures at the connection end CE to achieve wearing.

[0051] See also Figure 6 and Figure 7 , Figure 6 yes Figure 1 A cross-sectional view of the middle earphone 100 along line VI-VI in some embodiments, Figure 7 yes Figure 1 The middle earphone 100 is a cross-sectional view along line VII-VII in some embodiments. The movement module 10 includes a movement housing 11, a speaker assembly 12 and a main control circuit board 13. Among them, the movement housing 11 can be connected to the hook structure 20. The movement housing 11 can have an installation space 101 for installing the speaker assembly 12 and the main control circuit board 13. Of course, other electronic components can also be installed, which will not be repeated here. The speaker assembly 12 and the main control circuit board 13 can be arranged in the movement housing 11, such as the installation space 101. The main control circuit board 13 can be electrically connected to the speaker assembly 12 to control the operation of the speaker assembly 12. It can be understood that the movement housing 11 serves as the outer housing of the movement module 10, and then the inner side IS, the outer side OS and the connecting surface connecting the inner side IS and the outer side OS of the aforementioned movement module 10 (such as the lower side LS, the upper side US and the rear side RS, etc.) are all formed on the movement housing 11 as the outer surface of the movement housing 11. The aforementioned length direction Y can be defined as the direction in which the movement housing 11 approaches or moves away from the back of the head when worn, the width direction Z can be defined as the direction in which the movement housing 11 approaches or moves away from the top of the head when worn, and the thickness direction X can be defined as the direction in which the movement housing 11 faces or moves away from the user's ears when worn. In some embodiments, the length direction Y can be defined as the direction from the connection end of the movement housing 11 to the free end of the movement module 10, and the thickness direction X can be defined as the direction in which the movement housing 11 faces or moves away from the user's ears when worn.

[0052] The movement housing 11 may include a first housing 111 and a second housing 112 that are buckled together to form an installation space 101 along the thickness direction X. The first housing 111 is closer to the ear 200 than the second housing 112 when worn. A parting surface 102 is provided between the first housing 111 and the second housing 112 to simplify the structure of the movement housing 11 and reduce processing costs. Of course, the movement housing 11 may also be in other structural forms and is not limited to the embodiments listed in this application.

[0053] In some embodiments, the movement housing 11 may be provided with a first sound outlet hole 1101 and a second sound outlet hole 1102 that are connected to the installation space 101. The first sound outlet hole 1101 and the second sound outlet hole 1102 may cooperate with the speaker assembly 12 respectively, so that the sound waves generated by the speaker assembly 12 may be propagated through the first sound outlet hole 1101 and the second sound outlet hole 1102 respectively. The first sound outlet hole 1101 and the second sound outlet hole 1102 may not be connected, and the provision of two sound outlet holes may improve the auditory experience of the speaker assembly 12 and avoid sound wave interference between multiple speakers.

[0054] See also Figure 8 , Figure 8 yes Figure 6 Schematic diagram of the structure of the first shell 111 in some embodiments. In some embodiments, the first sound outlet hole 1101 and / or the second sound outlet hole 1102 can be set on the first shell 111. For example, the first sound outlet hole 1101 and the second sound outlet hole 1102 can be set on the bottom wall 1111 of the first shell 111. In some embodiments, the bottom wall 1111 can be set corresponding to the inner side surface IS of the movement module 10. When the movement module 10 is inserted into the concha cavity 2002, since the concha cavity 2002 has a certain volume and depth, after the free end FE is inserted into the concha cavity 2002, the part of the inner side surface IS corresponding to the bottom wall 1111 of the movement shell 11 can have a certain distance from the concha cavity 2002. Furthermore, the movement shell 11 can cooperate with the concha cavity 2002 to form an auxiliary cavity connected to the external auditory canal 2001 in the wearing state, and the first sound outlet hole 1101 and the second sound outlet hole 1102 will be at least partially located in the auxiliary cavity. Furthermore, when worn, the sound waves generated by the speaker assembly 12 and propagated through the first sound outlet 1101 and the second sound outlet 1102 will be restricted by the auxiliary cavity, that is, the auxiliary cavity can gather the sound waves so that the sound waves can be propagated more into the external auditory canal 2001, thereby increasing the volume and sound quality of the sound heard by the user in the near field, which is beneficial to improving the acoustic effect of the earphone 100.

[0055] In some embodiments, the first sound outlet hole 1101 and the second sound outlet hole 1102 are closer to the free end FE than to the connection end CE, so that the first sound outlet hole 1101 and the second sound outlet hole 1102 are closer to the external auditory canal 2001 when worn. In some embodiments, since the movement module 10 can be configured not to block the external auditory canal 2001 when worn, the auxiliary cavity can be configured in a semi-open state.

[0056] In some embodiments, the first shell 111 includes a first side wall 1112 extending from the edge of the bottom wall 1111 to a side close to the second shell 112. The first sound hole 1101 and / or the second sound hole 1102 may not be set on the bottom wall 1111, but may be set on a side of the first side wall 1112 corresponding to the lower side surface LS, or may be set at the corner between the first side wall 1112 and the bottom wall 1111, or may even be set on other parts of the movement shell 11, such as the inner side surface IS, the lower side surface LS, or the corner between the inner side surface IS and the lower side surface LS.

[0057] See also Figure 7 and Figure 8 The first shell 111 may be a plastic part, or a structure composed of or composited from a variety of materials, or a shell structure made of other materials. In some embodiments, a pressure relief hole 1103 and / or a tuning hole 1104 may be provided on the first side wall 1112, that is, a pressure relief hole 1103 and / or a tuning hole 1104 may be provided on the upper side US or the lower side LS corresponding to the movement shell 11. Furthermore, an acoustic resistance net and / or a protective steel net may be provided at the pressure relief hole 1103 and / or the tuning hole 1104.

[0058] It can be understood that the acoustic holes such as the pressure relief hole 1103 and the tuning hole 1104 can be adjusted according to the needs of those skilled in the art and arranged on the movement housing 11, such as the first housing 111. For example, the pressure relief hole 1103 and the tuning hole 1104 can be arranged at a position on the first housing 111 that cooperates with the speaker assembly 12, and are not limited to the positions listed here. For example, the pressure relief hole 1103 and the tuning hole 1104 can be arranged at a position on the first side wall 1112 that cooperates with the speaker assembly 12, and are not limited to the positions listed here. For example, the pressure relief hole 1103 and the tuning hole 1104 can be respectively arranged on opposite sides of the first side wall 1112 along the width direction Z.

[0059] In addition, since the first sound outlet hole 1101, the pressure relief hole 1103 and the tuning hole 1104 can all be arranged on the first shell 111, the structure of the first shell 111 is simpler, which is conducive to reducing the processing cost. In addition, since the pressure relief hole 1103 and the tuning hole 1104 are respectively arranged on the opposite sides of the first side wall 1112 along the width direction Z, the above-mentioned parting surface 102 can be symmetrically arranged about a reference plane perpendicular to the width direction Z, which is conducive to improving the appearance quality of the movement module 10.

[0060] Furthermore, the acoustic holes may not be limited to the pressure relief hole 1103 and the tuning hole 1104, and may also include other acoustic holes that cooperate with the speaker assembly 12. In some embodiments, at least one of the pressure relief hole 1103 and the tuning hole 1104 may be omitted.

[0061] See also Figure 6 The second housing 112 may be a plastic part, or a structure composed of or composited from a variety of materials, or may be a housing structure made from other materials. The parting surface 102 between the second housing 112 and the first housing 111, such as the first side wall 1112, extends or bends toward the side where the first housing 111 is located in the direction close to the free end FE. The second housing 112 may include a top wall 1121 disposed opposite to the first housing 111, such as the bottom wall 1111, and a second side wall 1122 connected to the top wall 1121 and engaged with the first housing 111, such as the first side wall 1112.

[0062] It can be understood that, due to the arrangement of the second side wall 1122 , the free end FE is tapered in a direction away from the connection end CE, so as to facilitate coordination with the contour of the user's ear and enhance the wearing experience.

[0063] See also Figure 6 and Figure 7, the speaker assembly 12 can generate sound waves after being powered on, and can be propagated through the first sound outlet hole 1101 and / or the second sound outlet hole 1102, so as to be transmitted into the external auditory canal 2001. The speaker assembly 12 can be coupled to the main control circuit board 13 to allow operation under the control of the main control circuit board 13. The speaker assembly 12 may include a first speaker 121 and a second speaker 122 disposed in the movement housing 11, such as the installation space 101. The first speaker 121 and the second speaker 122 can be coupled to the main control circuit board 13, respectively, to allow operation under the control of the main control circuit board 13. The sound waves generated by the first speaker 121 can be propagated from the first sound outlet hole 1101. The sound waves generated by the second speaker 122 can be propagated from the second sound outlet hole 1102. In some embodiments, the sound waves generated by the first speaker 121 may also be transmitted through acoustic holes such as the pressure relief hole 1103 and the tuning hole 1104 . Of course, only one of the pressure relief hole 1103 or the tuning hole 1104 may cooperate with the first speaker 121 .

[0064] See also Figure 6 and Figure 7 The first speaker 121 can be fixed in the core housing 11, and the axial direction of the first speaker 121 can be arranged along the thickness direction X. In some embodiments, the first speaker 121 can be fixed on the first housing 111, such as the bottom wall 1111, and can also be fixed on the first side wall 1112 or other parts of the core housing 11.

[0065] In some embodiments, the first speaker 121 is in a strip-shaped structure to match the movement housing 11, such as the installation space 101, that is, the first speaker 121 can be extended in the direction from the connection end CE to the free end FE, so as to facilitate the arrangement of a sufficiently large first speaker 121 in the movement housing 11, such as the installation space 101, thereby enhancing the sound volume generated by the earphone 100, optimizing the arrangement method, and improving space utilization.

[0066] See also Figure 7 The first speaker 121 may include a first diaphragm 1211 for vibrating and making sounds, and may also include a first magnetic circuit system for driving the first diaphragm 1211 to vibrate and make sounds, and a support member that supports the first diaphragm 1211 and the first magnetic circuit system. Within the scope of understanding of those skilled in the art, the technical principle of the first magnetic circuit system driving the first diaphragm 1211 to vibrate and make sounds will not be repeated.

[0067] The first speaker 121 cooperates with the movement housing 11 in the movement housing 11 (for example, in the installation space 101), and can form a first front cavity 1201 on the front side of the first diaphragm 1211 of the first speaker 121, and form a first rear cavity 1202 on the rear side of the first diaphragm 1211. The front side of the first diaphragm 1211 refers to the side of the first diaphragm 1211 away from the first magnetic circuit system, and the rear side of the first diaphragm 1211 refers to the side of the first diaphragm 1211 facing the first magnetic circuit system. In some embodiments, the first front cavity 1201 is located on the side of the first speaker 121 facing the inner side IS of the movement housing 11, such as the side facing the bottom wall 1111 of the first housing 111, and the first rear cavity 1202 is located on the side of the first speaker 121 facing away from the inner side IS, such as the side facing away from the bottom wall 1111 of the first housing 111. In some embodiments, the first front cavity 1201 may be in communication with the first sound outlet 1101 , so that the sound waves generated by the first speaker 121 may propagate through the first sound outlet 1101 .

[0068] See also Fig. 9 , Fig. 9 1 is a circuit diagram of the speaker assembly 12 in some embodiments of the present application. The speaker assembly 12 may have a first terminal 1301 and a second terminal 1302 electrically connected to the main control circuit board 13, respectively. The first speaker 121 may be connected in series between the first terminal 1301 and the second terminal 1302, and then may make a sound under the control of the main control circuit board 13. In some embodiments, the speaker assembly 12 may also include a low-pass frequency divider 1303 connected in series with the first speaker 121 between the first terminal 1301 and the second terminal 1302, so as to achieve low-pass filtering through the low-pass frequency divider 1303, so that the first speaker 121 only receives an electrical signal in a lower frequency band (the low-pass frequency divider 1303 performs frequency division processing on the audio drive signal to generate an electrical signal input to the first speaker 121. Of course, when the low-pass frequency divider 1303 does not perform frequency division on the audio drive signal, the audio drive signal is the electrical signal input to the first speaker 121), and then the first speaker 121 outputs more sound in a lower frequency band. In some embodiments, the audio driving signal is provided by the main control circuit board 13, and the low-pass frequency divider 1303 can perform first-order frequency division on the audio driving signal provided by the main control circuit board 13 to the first speaker 121 to reduce circuit complexity. In some embodiments, the low-pass frequency divider 1303 may include a frequency division inductor L. The number of the frequency division inductor L may be at least one, and in this case, the low-pass frequency divider 1303 can divide the audio driving signal provided by the main control circuit board 13 to the first speaker 121.

[0069] In the present application, the low-pass frequency divider 1303 can be a first-order frequency divider or a multi-order frequency divider. In some embodiments of the present application, the low-pass frequency divider 1303 is a first-order frequency divider, that is, the low-pass frequency divider 1303 includes a frequency division inductor L. Therefore, the design of the low-pass frequency divider 1303 is simpler and the cost is lower. In addition, when selecting the number of frequency division inductors L, since the number of frequency division inductors L of the first-order frequency division is less, the occupation of the movement housing 11, such as the installation space 101, is reduced, making the movement module 10 smaller. When it cooperates with the main control circuit board 13, the requirements for the main control circuit board 13 can be reduced, making the main control circuit board 13 smaller.

[0070] In some embodiments, the audio driving signal provided by the main control circuit board 13 can be directly transmitted to the first speaker 121. That is, the audio driving signal can be directly input to the first speaker 121 without frequency division processing. In some embodiments, the frequency range of the audio driving signal can be the same as the operating frequency range of the first speaker 121.

[0071] In some embodiments, the main control circuit board 13 includes a driving circuit 132, and the driving circuit 132 is connected to the first speaker 121 and the second speaker 122 to drive the first speaker 121 and the second speaker 122 to work. In some embodiments, the driving circuit 132 may include a digital-to-analog conversion circuit 1321, and the first speaker 121 and the second speaker 122 are connected to the digital-to-analog conversion circuit 1321. The first speaker 121 and the second speaker 122 are driven simultaneously by the digital-to-analog conversion circuit 1321. That is, the driving circuit 132 can simultaneously input the same audio driving signal to the first speaker 121 and the second speaker 122 to drive the first speaker 121 and the second speaker 122 to work.

[0072] The second speaker 122 is disposed in the installation space 101 of the movement housing 11. Figure 6 and Figure 7 , the second speaker 122 can be fixed on the first housing 111, for example, the bottom wall 1111, and the axial direction of the second speaker 122 can be along the thickness direction X. In some implementations, the second speaker 122 can be located in the first front cavity 1201 of the first speaker 121, and the axial direction of the first speaker 121 is parallel to the axial direction of the second speaker 122. In other embodiments, the second speaker 122 can also be fixed on the first side wall 1112 or other parts of the movement housing 11, and the axial direction of the second speaker 122 can also be arranged to cross the thickness direction X.

[0073] In some embodiments, the second speaker 122 may be embedded in the inner wall of the core housing 11. For example, a groove may be provided on the inner wall of the core housing 11 to accommodate the second speaker 122, so as to realize the embedded setting of the second speaker 122. Figure 7 , the groove for accommodating the second speaker 122 can be opened on the bottom wall 1111 of the first shell 111. At this time, in the wearing state, the second speaker 122 is located on the inner wall of the corresponding inner side surface IS of the aforementioned movement module 10, and the second speaker 122 is closer to the user's ear. For another example, the groove for accommodating the second speaker 122 can be opened on the lower side surface of the aforementioned movement module 10 or the inner wall of each connecting surface to adapt to different wearing scenarios and bring better hearing experience to the user.

[0074] See also Figure 7 The second speaker 122 may include a second diaphragm 1221 for vibrating and producing sound, a second magnetic circuit system 1222 for driving the second diaphragm 1221 to produce sound, and a speaker housing 1223 for carrying and mounting the second diaphragm 1221 and the second magnetic circuit system 1222. Within the scope of understanding of those skilled in the art, the technical principle of the second magnetic circuit system 1222 driving the second diaphragm 1221 to vibrate and produce sound will not be described in detail.

[0075] The second speaker 122 is in the movement housing 11 (e.g., the installation space 101) and cooperates with the movement housing 11. The front side of the second diaphragm 1221 of the second speaker 122 cooperates with the movement housing 11 to form a second front cavity 1203, and the rear side of the second diaphragm 1221 cooperates with the speaker housing 1223 to form a second rear cavity 1204. The front side of the second diaphragm 1221 refers to the side of the second diaphragm 1221 away from the second magnetic circuit system 1222, and the rear side of the second diaphragm 1221 refers to the side of the second diaphragm 1221 facing the second magnetic circuit system 1222. When the second speaker 122 is located on the inner wall of the corresponding inner side IS of the movement module 10, the second front cavity 1203 is located on the side of the second speaker 122 facing the inner side IS, and the second rear cavity 1204 is located on the side of the second speaker 122 away from the inner side IS.

[0076] The second front cavity 1203 may be in communication with the second sound outlet 1102, so that the sound waves generated by the second speaker 122 may propagate through the second sound outlet 1102. In some embodiments, the movement housing 11 may include a structure such as an isolation plate disposed between the second speaker 122 and the first speaker 121 to isolate the cavity coupled to the first speaker 121 and the cavity coupled to the second speaker 122, so that the first sound outlet 1101 is only in communication with the first front cavity 1201, and the second sound outlet 1102 is only in communication with the second front cavity 1203. In some embodiments, the second speaker 122 may be farther from the connection end CE than from the free end FE to cooperate with the second sound outlet 1102.

[0077] In some embodiments, the speaker housing 1223 is a housing structure different from the movement housing 11, so that the second speaker 122 can be flexibly installed on the movement module 10. In some embodiments, the speaker housing 1223 includes a support member that carries the second diaphragm 1221 and the second magnetic circuit system 1222, and a cover body connected to the movement housing 11 to fix the second speaker 122, and a sound hole is opened on the cover body and communicates with the second sound outlet 1102. In some embodiments, the speaker housing 1223 only includes a support member that carries the second diaphragm 1221 and the second magnetic circuit system 1222, and is connected to the movement housing 11 through the support member to fix the second speaker 122.

[0078] The frequency range of the sound output by the first speaker 121 is at least partially lower than the frequency range of the sound output by the second speaker 122. In some embodiments, the frequency range of the sound output by the first speaker 121 may be smaller than the frequency range of the sound output by the second speaker 122 as a whole. In other embodiments, the frequency range of the sound output by the first speaker 121 partially overlaps with the frequency range of the sound output by the second speaker 122, and the maximum frequency of the sound output by the first speaker is lower than the maximum frequency of the sound output by the second speaker, so that the frequency band of the sound output by the second speaker 122 may be partially greater than the frequency band of the sound output by the first speaker 121.

[0079] In some embodiments, the frequency range of the sound output by the first speaker 121 may include 20 Hz-5 kHz, and the frequency range of the sound output by the second speaker 122 may include 5 kHz-20 kHz. In some embodiments, the frequency range of the sound output by the first speaker 121 and the frequency range of the sound output by the second speaker 122 may have different standards based on actual conditions. For example, the range of the sound output by the first speaker 121 may also refer to a frequency range not higher than 1 kHz, such as 1 Hz-1 kHz, 100 Hz-800 Hz, etc.

[0080] In some embodiments, the frequency range of the sound output by the first speaker 121 may be a low frequency band or a mid-low frequency band, and the frequency range of the sound output by the second speaker 122 may be a high frequency band or a mid-high frequency band. Furthermore, the first speaker 121 may be referred to as a low frequency speaker, and the second speaker 122 may be referred to as a high frequency speaker. The low frequency band may be at least a portion of a frequency band of substantially 20 Hz to 500 Hz, or at least a portion of a frequency band of substantially 20 Hz to 3 kHz, and the high frequency band may be at least a portion of a frequency band of substantially 5 kHz to 20 kHz, or at least a portion of a frequency band of 6 kHz to 16 kHz. The mid-frequency band may be between the low frequency band and the high frequency band, and may also partially overlap with the low frequency and / or high frequency. Furthermore, the mid-low frequency band may be a collection of the low frequency band and the mid-frequency band, and the mid-high frequency band may be a collection of the mid-frequency band and the high frequency band.

[0081] It is understandable that the distinction of the above frequency bands is just an example to give a rough range. The definition of the above frequency bands can change with different industries, different application scenarios and different classification standards. For example, in some other application scenarios, the low frequency band refers to the frequency band of roughly 20Hz to 80Hz, the medium-low frequency band can refer to the frequency band of roughly 80Hz-160Hz, the medium frequency band can refer to the frequency band of roughly 160Hz to 1280Hz, the medium-high frequency band can refer to the frequency band of roughly 1280Hz-2560Hz, and the high frequency band can refer to the frequency band of roughly 2560Hz to 120kHz.

[0082] In some embodiments, the main control circuit board 13 can provide the same audio driving signal to the first speaker 121 and the second speaker 122. In other words, the frequencies of the electrical signals received by the first speaker 121 and the second speaker 122 can be the same. At this time, the second diaphragm 1221 of the second speaker 122 can vibrate under the electrical signal of the frequency band not higher than 200 Hz. If the first speaker 121 is the aforementioned low-frequency speaker and the second speaker 122 is the aforementioned high-frequency speaker, the frequency range of the sound output by the first speaker 121 is at least partially lower than the frequency range of the sound output by the second speaker 122, that is, the sound output effect of the first speaker 121 is good when the frequency band of the sound output is in a lower frequency band, and the sound output effect of the second speaker 122 is better when the frequency band of the sound output is in a higher frequency band.

[0083] In some embodiments, on a reference plane perpendicular to the axial direction of the first speaker 121, the orthographic projection of the second speaker 122 on the reference plane at least partially overlaps with the orthographic projection of the first speaker 121 on the reference plane. In some embodiments, on a reference plane perpendicular to the axial direction of the first speaker 121, the orthographic projection of the second speaker 122 on the reference plane completely overlaps with the orthographic projection of the first speaker 121 on the reference plane, thereby optimizing the arrangement and improving space utilization. In some embodiments, the axial direction of the first speaker 121 may be the vibration direction of the first diaphragm 1211. In some embodiments, the axial direction of the second speaker 122 may point to the first speaker 121. In some embodiments, the axial direction of the second speaker 122 may be parallel to the axial direction of the first speaker 121, that is, the angle between the axial direction of the second speaker 122 and the axial direction of the first speaker 121 may be 0°.

[0084] It is understandable that the positional relationship and the matching relationship between the second speaker 122 and the first speaker 121, and the positional relationship and the matching relationship between the second speaker 122 and the movement housing 11 can also be adjusted and changed, and are not limited to the embodiments listed here.

[0085] See also Figure 7, the main control circuit board 13 can provide an audio driving signal to the second speaker 122, so that the second diaphragm 1221 of the second speaker 122 can vibrate under an electrical signal of a frequency band not higher than 200 Hz. When the second speaker 122 is the aforementioned high-frequency speaker, the second speaker 122 has a better sound output effect in a higher frequency band, but performs poorly in a lower frequency band, which will cause the second diaphragm 1221 of the second speaker 122 to vibrate under an electrical signal of a frequency band not higher than 200 Hz and cause a phenomenon of broken sound.

[0086] See also Fig. 9 , the second speaker 122 can be connected in series between the first terminal 1301 and the second terminal 1302, and can then make a sound under the control of the main control circuit board 13. In some embodiments, the speaker assembly 12 may also include a high-pass frequency divider 1304 connected in series with the second speaker 122 between the first terminal 1301 and the second terminal 1302, so as to achieve high-pass filtering through the high-pass frequency divider 1304. In some embodiments, the first terminal 1301 and the second terminal 1302 cooperate to receive the audio driving signal of the main control circuit board 13, and the high-pass frequency divider 1304 can divide the audio driving signal to generate an electrical signal received by the second speaker 122, and the electrical signal received by the second speaker 122 can be attenuated in the frequency band below the frequency division point, and the sound pressure level of the sound output by the second speaker 122 in the low frequency band can be attenuated, so as to improve the sound distortion phenomenon existing in the sound output by the second speaker 122 in the lower frequency band (e.g., below 200 Hz, such as 50-100 Hz).

[0087] In some embodiments, the frequency division point of the high-pass frequency divider 1304 for dividing the audio driving signal may be no less than 6kHz, so that the sound pressure level of the sound output by the second speaker 122 can be attenuated at least below 6kHz, and the second speaker 122 can obtain a good acoustic output effect in the frequency band above 6kHz. In some embodiments, the frequency division point of the high-pass frequency divider 1304 for dividing the audio driving signal may be no less than 8kHz. In some embodiments, the frequency division point may be 8kHz. Since the sound output effect of the first speaker 121 in the higher frequency band is poor, the second speaker 122 can compensate for the sound pressure level in the frequency band above 8kHz when the output sound is output. In some embodiments, the frequency division point of the high-pass frequency divider 1304 for dividing the audio driving signal may be no higher than 9kHz, so as to avoid affecting the output of the second speaker 122 in the higher frequency band, and then the sound output capability of the headset in the full frequency band can be guaranteed.

[0088] In some embodiments, the crossover point is set so that the sound pressure level of the sound output by the second speaker 122 is attenuated by no less than 20 dB in the low frequency (e.g., below 200 Hz, such as 50-100 Hz) segment, so as to alleviate the phenomenon of sound distortion when the output of the second speaker 122 is in the lower frequency segment. In some embodiments, the crossover point is set so that the sound pressure level of the sound output by the second speaker 122 is attenuated by no less than 30 dB in the low frequency (e.g., below 200 Hz, such as 50-100 Hz) segment, so as to alleviate the phenomenon of sound distortion when the output of the second speaker 122 is in the lower frequency segment.

[0089] In some embodiments, the crossover frequency point can be set near the resonant frequency of the second speaker 122, so that the electrical signal received by the second speaker 122 below the crossover frequency point can be attenuated, thereby improving the distortion phenomenon of the output of the second speaker 122 in the low frequency segment (e.g., below 200 Hz). In some embodiments, the ratio of the resonant frequency of the second speaker 122 to the crossover frequency point is between 0.75-1.25. In some embodiments, the ratio of the resonant frequency of the second speaker 122 to the crossover frequency point is between 0.9-1.1.

[0090] In some embodiments, the resonant frequency of the second speaker 122 may be not less than 6 kHz, and the second diaphragm 1221 may vibrate at least under an electrical signal in a frequency range of 1 kHz-20 kHz. In some embodiments, the resonant frequency of the second speaker 122 may be between 6 kHz and 9 kHz.

[0091] In some embodiments, the aforementioned high-pass frequency divider 1304 can be used to perform first-order frequency division processing on the audio driving signal of the main control circuit board 13 to reduce the circuit complexity and improve the distortion phenomenon of the output of the second speaker 122 in the low frequency band. At this time, the high-pass frequency divider 1304 may include a frequency division capacitor C, and the number of the frequency division capacitor C is one. Such a setting reduces the occupation of the movement housing 11, such as the installation space 101, so that the movement module 10 is smaller. When it cooperates with the main control circuit board 13, it can reduce the requirements for the main control circuit board 13, so that the main control circuit board 13 is smaller. It can be understood that in other embodiments of the present application, the high-pass frequency divider 1304 can also be a multi-order frequency divider, which can be used to perform multi-order frequency division processing on the audio driving signal of the main control circuit board 13, achieve better low-frequency filtering effect, and further improve the distortion phenomenon of the output of the second speaker 122 in the low frequency band.

[0092] See also Fig.10 , Fig.10Schematic diagram of the frequency division effect of the second speaker 122 under different frequency division processing conditions when adjusting the high-pass frequency divider 1304 in some embodiments of the present application. Among them, curve A is the electric signal curve received by the second speaker 122 when the high-pass frequency divider 1304 is not set, that is, the audio driving signal curve, curve B, curve C, curve D and curve E are the electric signal curves received by the second speaker 122 after the high-pass frequency divider 1304 is used for first-order frequency division, the capacitance of the frequency division capacitor C of the high-pass frequency divider 1304 in curve B is 2μF, the capacitance of the frequency division capacitor C of the high-pass frequency divider 1304 in curve C is 4.6μF, the capacitance of the frequency division capacitor C of the high-pass frequency divider 1304 in curve D is 10μF, the capacitance of the frequency division capacitor C of the high-pass frequency divider 1304 in curve E is 22μF, and curve F is the electric signal curve received by the second speaker 122 after the high-pass frequency divider 1304 is used for second-order frequency division.

[0093] Please refer to Fig.10 , near 200Hz, the frequency response amplitude corresponding to curve A is about -62dB, the frequency response amplitude corresponding to curve B is about -101dB, the frequency response amplitude corresponding to curve C is about -98dB, the frequency response amplitude corresponding to curve D is about -92dB, and the frequency response amplitude corresponding to curve E is about -85dB. That is, compared with curve A which represents the signal without frequency division processing, the amplitude of the signal component below 200Hz in the electrical signal corresponding to curve B is attenuated by about 39dB, the amplitude of the signal component below 200Hz in the electrical signal corresponding to curve C is attenuated by about 36dB, the amplitude of the signal component below 200Hz in the electrical signal corresponding to curve D is attenuated by about 30dB, and the amplitude of the signal component below 200Hz in the electrical signal corresponding to curve E is attenuated by about 23dB. That is, compared with the audio driving signal which represents the signal without frequency division processing (corresponding to curve A), the amplitude attenuation of the signal component below 200Hz in the electrical signal (corresponding to curves B, C, D and E) after the excitation signal is divided by a capacitor element is larger. In this way, the low-frequency component in the electrical signal received by the second speaker 122 is effectively suppressed, and the electrical signal after the frequency division processing can effectively reduce the occurrence of distortion when the second speaker 122 outputs sound.

[0094] In some embodiments, the capacitance value of the frequency division capacitor C may correspond to a theoretical frequency division point:

[0095]

[0096] Wherein, f is the crossover frequency, z is the rated impedance of the second speaker 122, and C is the capacitance of the crossover capacitor C. It can be understood that when there are multiple crossover capacitors, the capacitance C calculated by formula (1) is the equivalent capacitance value of the multiple crossover capacitors.

[0097] Since the second speaker 122 has a magnetic circuit system and a coil in its structure, the coil acts as an inductor in the circuit and affects the crossover frequency, causing a deviation between the actual crossover frequency and the theoretical crossover frequency. Fig.10 As shown, the actual crossover point corresponding to curve B (i.e., the frequency corresponding to the maximum point Mb of curve B) is around 15kHz, the actual crossover point corresponding to curve C (i.e., the frequency corresponding to the maximum point Mc of curve C) is around 8kHz, the actual crossover point corresponding to curve D (i.e., the frequency corresponding to the maximum point Md of curve D) is around 3.4kHz, and the actual crossover point corresponding to curve E (i.e., the frequency corresponding to the maximum point Me of curve E) is around 1.5kHz. Combining formula (1) with curves C, D, and E, it can be seen that the actual crossover point is negatively correlated with the capacitance value of the crossover capacitor.

[0098] See also Fig.10 , the attenuation amplitude of the curve F in the higher frequency band (for example, above 8kHz) is also large, and the attenuation amplitude of the signal component in the higher frequency band in the electrical signal obtained by the corresponding second-order frequency division processing is also large, which affects the normal output of the second speaker 122 in the higher frequency band. And the use of two frequency division capacitors will make the structure of the main control circuit board 13 more complicated, thereby resulting in an increase in the manufacturing cost and volume of the final earphone 100. In summary, in order to simplify the circuit and reduce the complexity of the system, and in order to ensure the normal output of the second speaker 122 in the higher frequency band, the high-pass frequency divider 1304 can adopt a first-order frequency division, that is, the number of frequency division capacitors connected in series with the second speaker 122 can be one.

[0099] In some embodiments, if the number of the frequency division capacitors connected in series with the second speaker 122 is one, in order to improve the frequency division effect and ensure the normal output of the second speaker 122 in a higher frequency band, the capacitance value of the frequency division capacitor may range from 4.2 μF to 5.2 μF. In some embodiments, in order to further improve the frequency division effect and ensure the normal output of the second speaker 122 in a higher frequency band, the capacitance value of the frequency division capacitor may range from 4.4 μF to 5.0 μF. In some embodiments, in order to further improve the frequency division effect and ensure the normal output of the second speaker 122 in a higher frequency band, the capacitance value of the frequency division capacitor may range from 4.5 μF to 4.8 μF.

[0100] In some embodiments, the second rear cavity 1204 of the second speaker 122 is in a closed state and is not connected to the outside world. This will cause an imbalance in air pressure between the second front cavity 1203 and the second rear cavity 1204, and will further cause distortion of the sound output by the second speaker 122 in a lower frequency band (e.g., below 200 Hz, e.g., 50-100 Hz).

[0101] See also Fig.11 , Fig.11 for Figure 7 Schematic diagram of the structure of the second speaker 122 in other embodiments. A connecting hole 1205 connecting the second rear cavity 1204 and the outside of the second speaker 122 is provided on the speaker housing 1223 of the second speaker 122 to alleviate the phenomenon of air pressure imbalance between the second front cavity 1203 and the second rear cavity 1204 caused by the closure of the second rear cavity 1204, thereby improving the phenomenon of distortion caused by the air pressure imbalance when the sound output by the second speaker 122 is in a lower frequency band (e.g., below 200 Hz, such as 50-100 Hz).

[0102] In some embodiments, the communication hole 1205 passes through the speaker housing 1223 to communicate with the second rear cavity 1204. For example, the communication hole 1205 can pass through the support frame of the speaker housing 1223 and communicate with the second rear cavity 1204, and the support frame is located on the side of the speaker housing 1223 away from the second front cavity 1203. If the second speaker 122 is set in the first front cavity 1201 of the first speaker, the communication hole 1205 can make the first front cavity 1201 and the second rear cavity 1204 communicate. Since the frequency range of the sound output by the second speaker 122 is relatively high, the high-frequency sound wave has the characteristic of sharp directivity. When the first front cavity 1201 and the second rear cavity 1204 are connected, the sound waves radiated from the second rear cavity 1204 through the communication hole 1205 are rarely radiated to the second front cavity 1203. Therefore, the setting of the communication hole 1205 will not affect the sound waves output by the first speaker 121, and further improve the distortion phenomenon of the second speaker 122 without affecting the acoustic performance of the first speaker 121.

[0103] In some embodiments, see Fig.12 , Fig.12 for Fig.11 Schematic diagram of some structures of the middle movement module 10 in other embodiments. The connecting hole 1205 can also penetrate the second magnetic circuit system 1222 and extend to the second diaphragm 1221, so that the second magnetic circuit system 1222 is arranged around the connecting hole 1205, so that the connecting hole 1205 is connected with the second rear cavity 1204, which can more directly alleviate the phenomenon of air pressure imbalance between the second front cavity 1203 and the second rear cavity 1204, improve the function of the second rear cavity 1204, and further improve the phenomenon of distortion.

[0104] In some embodiments, the acoustic resistance at the connecting hole 1205 may be 5×10 8 Pa·s / m-1.3×10 9Pa·s / m, to avoid the increase of the radiated sound pressure of the second rear cavity 1204 due to too small acoustic resistance, so that the sound waves radiated from the first front cavity 1201 of the first speaker 121 are superimposed on the sound waves radiated from the second rear cavity 1204 of the second speaker 122, resulting in an extremely complex phase of the sound waves at the acoustic hole position, affecting the listening effect, and at the same time preventing the inability to balance the air pressure on the front and rear sides of the second diaphragm 1221 (i.e., the air pressure between the second front cavity 1203 and the second rear cavity 1204) when the acoustic resistance is too large, and the problem of distortion cannot be improved. In some embodiments, the second speaker 122 may be provided with an acoustic resistance net 1226 in the connecting hole 1205 to improve the acoustic resistance at the connecting hole 1205 through the acoustic resistance net 1226 to ensure the sensitivity of the second speaker 122.

[0105] In some embodiments, the aperture of the communication hole 1205 may range from 0.8 mm to 1.2 mm, reducing the effect of the communication hole 1205 being too small on air tightness, while reducing the effect of the communication hole 1205 being too large on the sensitivity of the second speaker 122. In some scenarios, limiting the aperture of the communication hole 1205 may also reduce the difficulty of processing.

[0106] In some embodiments, in the radial direction of the second speaker 122, such as the second diaphragm 1221, the communication hole 1205 may be centrally arranged relative to the second speaker 122, such as the second diaphragm 1221. Here, the radial direction may be perpendicular to the axial direction of the second speaker 122, that is, a direction perpendicular to the vibration direction of the second diaphragm 1221. Centrally arranged means that in the radial direction of the second speaker 122, such as the second diaphragm 1221, the distance between the axis of the communication hole 1205 and the axis of the second speaker 122, such as the second diaphragm 1221, is less than 10% of the length of the second speaker 122, such as the second diaphragm 1221.

[0107] In some embodiments, the connecting hole 1205 may not connect the second rear cavity 1204 and the first front cavity 1201, but may directly connect with the acoustic hole such as the pressure relief hole 1103 provided on the movement housing 11, and directly radiate high-frequency sound waves through the acoustic hole such as the pressure relief hole 1103, so as to further reduce the influence of the sound waves radiated from the second rear cavity 1204 on the sound waves radiated from the first front cavity 1201. In some embodiments, the acoustic hole connected to the connecting hole 1205 may be a part of the first sound outlet hole 1101, or a part of the acoustic hole connected to the first rear cavity 1202 such as the pressure relief hole 1103, or an independent acoustic hole distinguished from the existence of the other acoustic holes. At this time, please refer to Fig.12 The connecting hole 1205 can be connected to the aforementioned acoustic hole through the connecting tube 123 to increase the acoustic path difference of the sound wave transmission radiated by the second rear cavity 1204, attenuate the radiated sound wave, avoid sound leakage, and affect the user's auditory experience.

[0108] It can be understood that the setting of the connecting hole 1205 can improve the distortion phenomenon existing in the sound output of the second speaker 122 in the low frequency band (e.g., below 200 Hz, such as 50-100 Hz). Furthermore, the connecting hole 1205 can be used together with the high-pass crossover 1304 to improve the aforementioned distortion phenomenon. Of course, the high-pass crossover 1304 can also be omitted, and the aforementioned distortion phenomenon can be improved only by the connecting hole 1205. In addition, when the connecting hole 1205 is used together with the high-pass crossover 1304, the specific setting of the connecting hole 1205 and the specific setting of the high-pass crossover 1304 can be adjusted according to the specific situation.

[0109] See also Fig. 9 The main control circuit board 13 may be provided with a driving circuit 132 to realize driving the speaker assembly 12, such as the first speaker 121 and the second speaker 122. Further, the driving circuit 132 may be mainly composed of a digital-to-analog conversion circuit 1321, and of course may also include a power amplifier circuit, a processor, etc. How to use the digital-to-analog conversion circuit 1321 and other circuits to form the driving circuit 132 is not described in detail here.

[0110] The driving circuit 132 can be electrically connected to the terminals, such as the first terminal 1301 and the second terminal 1302, and other terminals, to achieve electrical connection with the speaker assembly 12, such as the first speaker 121 and the second speaker 122, so as to drive the speaker assembly 12, such as the first speaker 121 and the second speaker 122. That is, the low-pass crossover 1303, such as the crossover inductor L, can be arranged between the driving circuit 132 and the first speaker 121. The high-pass crossover 1304, such as the capacitor C, can be arranged between the driving circuit 132 and the second speaker 122.

[0111] In some embodiments, the driving circuit 132 can simultaneously drive the first speaker 121 and the second speaker 122 through only one digital-to-analog conversion circuit 1321. That is, the driving circuit 132 can input the same audio driving signal to the first speaker 121 and the second speaker 122.

[0112] It is understandable that the earphone 100 may also include electronic components such as batteries, sensors, antennas, etc. to ensure the normal operation of the earphone 100, and such electronic components may be arranged in the movement module 10 and / or the hook structure 20 as needed, which will not be elaborated herein.

[0113] In the several embodiments provided in this application, it should be understood that the disclosed methods and devices can be implemented in other ways. For example, the device implementation described above is only illustrative, for example, the division of modules or units is only a logical function division, and there may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed.

[0114] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the present embodiment.

[0115] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0116] The above description is only an implementation method of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A headset, characterized in that: The earphone comprises a core housing, a first speaker, a second speaker and a driving circuit, wherein the core housing is used to accommodate the first speaker and the second speaker, and the driving circuit is used to drive the first speaker and the second speaker, wherein the frequency band of the sound output by the first speaker is at least partially lower than the frequency band of the sound output by the second speaker; The first speaker comprises a first diaphragm, the first diaphragm cooperates with the movement housing to form a first front cavity and a first rear cavity located on both sides of the first diaphragm, and the second speaker comprises a second diaphragm and a speaker housing, the second diaphragm cooperates with the speaker housing and the movement housing to form a second front cavity and a second rear cavity located on both sides of the second diaphragm; The movement housing is provided with a first sound outlet hole for transmitting the sound in the first front cavity to the outside of the movement housing, and a second sound outlet hole for transmitting the sound in the second front cavity to the outside of the movement housing; The second speaker is further provided with a connecting hole connecting the second rear cavity with the outside of the second speaker.

2. The earphone according to claim 1, characterized in that When the driving circuit drives the second speaker, the operating frequency of the driving circuit includes a frequency band not higher than 200 Hz.

3. The earphone according to claim 1 or 2, characterized in that: The driving circuit is configured to simultaneously drive the first speaker and the second speaker through the same digital-to-analog conversion circuit.

4. The earphone according to claim 3, characterized in that: The resonant frequency of the second speaker is not less than 6 kHz.

5. The earphone according to claim 1, characterized in that The acoustic resistance at the connecting hole is 5×10 8 Pa·s / m-1.3×10 9 Pa·s / m, and / or, a sound resistance net is arranged at the communicating hole.

6. The earphone according to claim 1 or 5, characterized in that: The second speaker is also provided with a second magnetic circuit system, the connecting hole runs through the second magnetic circuit system, and the hole diameter of the connecting hole is 0.8mm-1.2mm.

7. The earphone according to claim 6, characterized in that In the radial direction of the second diaphragm, the communication hole is centrally arranged relative to the second diaphragm.

8. The earphone according to claim 1, characterized in that On a reference plane perpendicular to the axial direction of the first speaker, the orthographic projection of the second speaker on the reference plane at least partially overlaps with the orthographic projection of the first speaker on the reference plane, and the axial direction of the second speaker points to the first speaker, and the connecting hole is arranged toward the interior of the movement housing.

9. The earphone according to claim 8, characterized in that The earphone also includes a connecting tube arranged in the core housing, one end of the connecting tube is connected to the connecting hole, and the other end is connected to the outside of the core housing.

10. The earphone according to claim 8, characterized in that The second speaker is located in the first front cavity, and the connecting hole connects the second rear cavity and the first front cavity.

11. The earphone according to claim 1, characterized in that The audio driving signal output by the driving circuit is configured to be directly input to the second speaker without undergoing frequency division processing.

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