A matrix switch with good heat dissipation effect

Abstract

The utility model discloses a matrix switch with good heat dissipation effect, including a main body shell, wherein a group of mounting frames are fixedly installed at the left and right parts of the lower end of the main body shell, and the two groups of mounting frames are symmetrically distributed and each group is set to two. The matrix switch with good heat dissipation effect described in the utility model can strengthen the protection function of the matrix switch body by setting the main body shell, and can effectively avoid the matrix switch body from being damaged by external factors; by setting the heat dissipation component, firstly, the rotating column and the fan blade are driven by the motor to rotate, and under the rotation of the fan blade, the wind force is sucked into the fixed frame from the air inlet, and at the same time, under the rotation of the fan blade, the wind force is transported downward, and the heat generated by the matrix switch body is easy to handle through the mutual cooperation of the wind force and the semiconductor refrigeration sheet, and the semiconductor refrigeration sheet can emit cold air, and under the cooperation of the cold air and the wind force, the heat dissipation effect can be enhanced.

Description

Technical Field

[0001] The utility model relates to the technical field of matrix switches, in particular to a matrix switch with good heat dissipation effect. Background Art

[0002] The switch network is an important part of the automatic test system. It is responsible for controlling the flow of signals and is the key to the interface design for automatic testing. Among them, the matrix switch is an important automatic test equipment for completing signal switching between multiple objects under test and multiple test instruments. With the increase in the number and complexity of the objects under test, the density requirements for the matrix switch are getting higher and higher.

[0003] The prior art (patent number: CN218276655U) discloses a P-band matrix switch, including a matrix switch module and a power supply module. The matrix switch module includes a 1-to-16 input power splitter module, an 8-to-1 output switch amplifier module and a monitoring module. The 8 1-to-16 input power splitter module interfaces and the 16 8-to-1 switch amplifier module interfaces are connected one-to-one; the monitoring module is respectively connected to the 8 1-to-16 input power splitters and the 16 8-to-1 output switch amplifier modules; the power supply module supplies power to the 8-to-1 output switch amplifier module and the monitoring module. The beneficial effects of the utility model are: it realizes arbitrary conversion between 8-way input and 16-way output signals of the P-band matrix switch, the system gain can be adjusted, and it is convenient for users to use. The monitoring module is used to monitor the path status in the matrix switch module, and the working status of the device can be output through the display module. All key indicators meet customer requirements. In addition, the utility model has a simple structure.

[0004] The existing matrix switch with good heat dissipation effect has the following disadvantages. When in use, the existing matrix switch is easily heated up due to the action of electronic devices, and the heat dissipation function of the matrix switch is general, so that the matrix switch is easily damaged due to excessive temperature. Therefore, we propose a new matrix switch with good heat dissipation effect. Utility Model Content

[0005] The main purpose of the utility model is to provide a matrix switch with good heat dissipation effect, which can effectively solve the problem that the matrix switch is not convenient for heat dissipation.

[0006] In order to achieve the above purpose, the technical solution adopted by the utility model is:

[0007] A matrix switch with good heat dissipation effect comprises a main body shell, wherein a group of mounting frames are fixedly mounted on the left and right parts of the lower end of the main body shell, the two groups of mounting frames are symmetrically distributed and each group is provided with two, the upper ends of the two groups of mounting frames are provided with mounting holes passing through from top to bottom, the front end of the main body shell is provided with a cover plate, the front end of the cover plate is fixedly mounted with a matrix switch body, the upper end of the main body shell is fixedly mounted with a connecting frame, and the upper end of the connecting frame is fixedly mounted with a heat dissipation component.

[0008] Preferably, a mounting groove extending vertically through the upper end of the main body shell is provided, a group of No. 1 heat dissipation holes are provided at the left and right ends of the main body shell, brackets are fixedly connected to the front and rear sides of the main body shell, and a plurality of No. 2 heat dissipation holes extending vertically through the lower end of the main body shell are provided.

[0009] Preferably, the two groups of the No. 1 heat dissipation holes are distributed symmetrically on the left and right, and each group is provided with a plurality of the No. 2 heat dissipation holes, and the plurality of the No. 2 heat dissipation holes are distributed at equal distances.

[0010] Preferably, a through groove which passes through from top to bottom is provided at the upper end of the connecting frame, a connecting groove is provided on the upper side inside the through groove, a semiconductor cooling plate is clamped inside the connecting groove, and a box cover is clamped at the upper end of the connecting frame.

[0011] Preferably, the heat dissipation assembly includes a fixed frame, a plurality of air inlet holes passing through the upper and lower ends of the fixed frame are opened, a motor is fixedly connected to the inside of the fixed frame, a rotating column is fixedly connected to the output end of the motor, a plurality of fan blades are fixedly connected to the lower end of the rotating column, and the fixed frame is fixed to the upper end of the box cover.

[0012] Preferably, the plurality of air inlet holes are distributed in a ring array, and the plurality of fan blades are distributed in a ring array.

[0013] Compared with the prior art, the utility model has the following beneficial effects:

[0014] 1. In the present invention, by providing a main body shell, the protection function of the matrix switch body can be enhanced. When in use, firstly, the two brackets are fixed inside the main body shell, and the cover plate is sleeved on the matrix switch body, so that the matrix switch is clamped on the two brackets and wrapped by the main body shell and the cover plate, the protection function of the matrix switch body can be enhanced, and the matrix switch body can be effectively prevented from being damaged by external factors;

[0015] 2. In the utility model, by setting a heat dissipation component, the heat dissipation function of the matrix switch body can be enhanced. When in use, when the device needs to dissipate heat, the motor is first used to drive the rotating column and the fan blades to rotate, and the wind is sucked into the fixed frame from the air inlet under the rotation of the fan blades. At the same time, the wind is transported downward under the rotation of the fan blades. Through the mutual cooperation of the wind and the semiconductor refrigeration sheet, the heat generated by the matrix switch body is easy to handle, and the semiconductor refrigeration sheet can emit cold air. With the cooperation of cold air and wind, the heat dissipation effect can be enhanced. The model of the semiconductor refrigeration sheet is: TEC1-12705. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the overall structure of a matrix switch with good heat dissipation effect according to the utility model;

[0017] Figure 2 This is a schematic diagram of the overall structure of a main body shell of a matrix switch with good heat dissipation effect according to the utility model;

[0018] Figure 3 This is a schematic diagram of the overall structure of a connection frame of a matrix switch with good heat dissipation effect according to the utility model;

[0019] Figure 4 The utility model is a schematic diagram of the overall structure of a heat dissipation component of a matrix switch with good heat dissipation effect.

[0020] In the figure: 1. Main body shell; 2. Mounting frame; 3. Mounting hole; 4. Cover plate; 5. Connecting frame; 6. Heat dissipation assembly; 7. Matrix switch body; 8. Bracket; 9. Mounting slot; 10. Heat dissipation hole No. 1; 11. Heat dissipation hole No. 2; 51. Through slot; 52. Connecting slot; 53. Semiconductor cooling plate; 54. Box cover; 61. Fixing frame; 62. Air inlet; 63. Motor; 64. Rotating column; 65. Fan blade. DETAILED DESCRIPTION

[0021] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further described below in conjunction with specific implementation methods.

[0022] In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "two ends", "one end", "the other end" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0023] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0024] like Figure 1-4 As shown, a matrix switch with good heat dissipation effect comprises a main body shell 1, a group of mounting frames 2 are fixedly installed at the left and right parts of the lower end of the main body shell 1, the two groups of mounting frames 2 are symmetrically distributed and each group is provided with two, the upper ends of the two groups of mounting frames 2 are provided with mounting holes 3 that pass through from top to bottom, a cover plate 4 is provided at the front end of the main body shell 1, a matrix switch body 7 is fixedly installed at the front end of the cover plate 4, a connecting frame 5 is fixedly installed at the upper end of the main body shell 1, and a heat dissipation component 6 is fixedly installed at the upper end of the connecting frame 5; a mounting groove 9 that passes through from top to bottom is provided at the upper end of the main body shell 1, a group of first heat dissipation holes 10 are provided at the left and right ends of the main body shell 1, and the front side and the rear side of the interior of the main body shell 1 are fixed A bracket 8 is fixedly connected, and a plurality of No. 2 heat dissipation holes 11 are opened at the lower end of the main shell 1; the two groups of No. 1 heat dissipation holes 10 are symmetrically distributed on the left and right, and each group is provided with a plurality of No. 2 heat dissipation holes 11, and the plurality of No. 2 heat dissipation holes 11 are distributed at equal distances; by setting the main shell 1, the protection function of the matrix switch body 7 can be enhanced. When in use, the two brackets 8 are first fixed inside the main shell 1, and the cover plate 4 is sleeved on the matrix switch body 7, so that the matrix switch body 7 is clamped on the two brackets 8, and is wrapped by the main shell 1 and the cover plate 4, the protection function of the matrix switch body 7 can be enhanced, and the matrix switch body 7 can be effectively prevented from being damaged by external factors.

[0025] The upper end of the connecting frame 5 is provided with a through slot 51 which passes through the upper and lower parts, and a connecting slot 52 is provided on the upper side of the through slot 51, a semiconductor cooling plate 53 is clamped inside the connecting slot 52, and a box cover 54 is clamped on the upper end of the connecting frame 5; the heat dissipation component 6 includes a fixing frame 61, and a plurality of air inlet holes 62 which pass through the upper and lower parts are provided on the upper end of the fixing frame 61, a motor 63 is fixedly connected to the inside of the fixing frame 61, a rotating column 64 is fixedly connected to the output end of the motor 63, and a plurality of fan blades 65 are fixedly connected to the lower end of the rotating column 64, and the fixing frame 61 is fixed to the upper end of the box cover 54; the plurality of air inlet holes 62 are distributed in a circular array, and the plurality of fan blades 65 are distributed in a circular array; by setting the heat dissipation component Component 6 can enhance the heat dissipation function of the matrix switch body 7. When in use, when the device needs to dissipate heat, the motor 63 is first used to drive the rotating column 64 and the fan blade 65 to rotate, and the wind is sucked into the fixed frame 61 from the air inlet 62 under the rotation of the fan blade 65. At the same time, the wind is transported downward under the rotation of the fan blade 65. Through the cooperation of the wind and the semiconductor refrigeration sheet 53, the heat generated by the matrix switch body 7 is easy to handle, and the semiconductor refrigeration sheet 53 can emit cold air. With the cooperation of cold air and wind, the heat dissipation effect can be enhanced. The model of the semiconductor refrigeration sheet 53 is: TEC1-12705.

[0026] It should be noted that the utility model is a matrix switch with good heat dissipation effect. By setting the main body shell 1, the protection function of the matrix switch body 7 can be strengthened. When in use, firstly, the two brackets 8 are fixed inside the main body shell 1, and the cover plate 4 is sleeved on the matrix switch body 7, so that the matrix switch body 7 is clamped on the two brackets 8 and wrapped by the main body shell 1 and the cover plate 4, the protection function of the matrix switch body 7 can be strengthened, and the matrix switch body 7 can be effectively prevented from being damaged by external factors; by setting the heat dissipation component 6, the heat dissipation function of the matrix switch body 7 can be strengthened. When the device needs to dissipate heat during use, the motor 63 is first used to drive the rotating column 64 and the fan blades 65 to rotate, and the wind is sucked into the fixed frame 61 from the air inlet 62 under the rotation of the fan blades 65. At the same time, the wind is transported downward under the rotation of the fan blades 65. Through the cooperation of the wind and the semiconductor refrigeration sheet 53, the heat generated by the matrix switch body 7 is easy to handle, and the semiconductor refrigeration sheet 53 can emit cold air. With the cooperation of cold air and wind, the heat dissipation effect can be enhanced. The model of the semiconductor refrigeration sheet 53 is: TEC1-12705.

[0027] The above shows and describes the basic principle and main features of the utility model and the advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only for explaining the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection claimed by the utility model is defined by the attached claims and their equivalents.

Claims

1. A matrix switch with good heat dissipation effect, comprising a main body shell (1), characterized in that: A group of mounting frames (2) are fixedly mounted on the left and right lower ends of the main body shell (1); the two groups of mounting frames (2) are symmetrically distributed and each group is provided with two mounting holes (3) that pass through the upper ends of the two groups of mounting frames (2); a cover plate (4) is provided at the front end of the main body shell (1); a matrix switch body (7) is fixedly mounted at the front end of the cover plate (4); a connecting frame (5) is fixedly mounted at the upper end of the main body shell (1); a heat dissipation component (6) is fixedly mounted at the upper end of the connecting frame (5).

2. A matrix switch with good heat dissipation effect according to claim 1, characterized in that: The upper end of the main body shell (1) is provided with a mounting groove (9) that passes through the upper and lower parts, the left end and the right end of the main body shell (1) are provided with a group of first heat dissipation holes (10), the front side and the rear side of the interior of the main body shell (1) are fixedly connected with a bracket (8), and the lower end of the main body shell (1) is provided with a plurality of second heat dissipation holes (11) that pass through the upper and lower parts.

3. A matrix switch with good heat dissipation effect according to claim 2, characterized in that: The two groups of the No. 1 heat dissipation holes (10) are distributed symmetrically on the left and right, and each group is provided with a plurality of the No. 2 heat dissipation holes (11), and the plurality of the No. 2 heat dissipation holes (11) are distributed at equal distances.

4. A matrix switch with good heat dissipation effect according to claim 3, characterized in that: The upper end of the connecting frame (5) is provided with a through slot (51) which passes through from top to bottom, the upper side of the through slot (51) is provided with a connecting slot (52), a semiconductor cooling plate (53) is clamped inside the connecting slot (52), and the upper end of the connecting frame (5) is clamped with a box cover (54).

5. A matrix switch with good heat dissipation effect according to claim 4, characterized in that: The heat dissipation assembly (6) comprises a fixing frame (61), a plurality of air inlet holes (62) passing through the fixing frame (61) are provided at the upper end thereof, a motor (63) is fixedly connected inside the fixing frame (61), a rotating column (64) is fixedly connected at the output end of the motor (63), a plurality of fan blades (65) are fixedly connected at the lower end of the rotating column (64), and the fixing frame (61) is fixed at the upper end of the box cover (54).

6. A matrix switch with good heat dissipation effect according to claim 5, characterized in that: The plurality of air inlet holes (62) are distributed in a ring array, and the plurality of fan blades (65) are distributed in a ring array.

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