An 800G SR8 optical module

Abstract

The utility model relates to an 800G SR8 optical module, including: a PCB board and a T-shaped copper block, a first through groove is provided on the copper sheet of the PCB board on the side of the optical chip away from the electrical chip, a second through groove with the same size as the first through groove is provided on the PCB board directly below the copper sheet, the lower end of the T-shaped copper block enters the first through groove and the second through groove in turn, and the T-shaped end of the T-shaped copper block contacts the copper sheet. The beneficial effect is that the heat of the optical chip can be transferred to the T-shaped copper block through the copper sheet, and then the heat is dissipated by the T-shaped copper block. Since the thickness of the T-shaped copper block can be much larger than the copper plating thickness of the inner wall of the heat dissipation hole, the heat dissipation effect of the optical chip is very large, and the use of this additional heat dissipation channel can greatly reduce the temperature of the optical chip and improve its high temperature performance.

Description

Technical Field

[0001] The utility model relates to the technical field of optical modules, and in particular to an 800G SR8 optical module. Background Art

[0002] Traditional 800G SR8 optical modules have 8-channel transmission and 8-channel reception, which are usually divided into two groups, each with a 4-channel transmission and a 4-channel reception. To solve the heat dissipation problem, traditional mainstream solutions such as Figure 1 As shown, it includes: opening a plurality of heat dissipation holes on a PCB board to form a heat dissipation hole array, first copper-plating the heat dissipation holes and then filling the holes with resin, then grinding and copper-plating the area where the heat dissipation holes are opened on the PCB board, the copper-plated thickness of the inner wall of the heat dissipation hole is 35um to 70um (due to the spacing requirements of the heat dissipation holes, and the thicker the copper on the inner wall of the hole, the higher the copper plating cost, so this range is usually selected), the copper-plated thickness on the PCB board is 35um, because the copper skin will be uneven after the holes are opened, and the optical chip must ensure the flatness of the optical path, so the optical chip is fixed on the copper skin in the area not corresponding to the heat dissipation hole, and the electric chip is fixed on the copper skin in the area facing the heat dissipation hole. This method can only effectively dissipate the heat of the electric chip, but cannot effectively dissipate the heat of the optical chip, so the heat dissipation effect of the optical chip is poor, the high temperature performance is reduced, and the yield is low. Utility Model Content

[0003] The technical problem to be solved by the present invention is to provide an 800G SR8 optical module to overcome the deficiencies in the above-mentioned prior art.

[0004] The utility model provides a technical solution to the above technical problems as follows: an 800G SR8 optical module, comprising: a PCB board and a T-shaped copper block, a first through groove is provided on the copper sheet of the PCB board on the side of the optical chip away from the electrical chip, a second through groove with the same size as the first through groove is provided on the PCB board directly below the copper sheet, the lower end of the T-shaped copper block enters the first through groove and the second through groove in turn, and the T-shaped end of the T-shaped copper block contacts the copper sheet.

[0005] The beneficial effect of the utility model is that the heat of the optical chip can be transferred to the T-shaped copper block through the copper sheet, and then the heat is dissipated by the T-shaped copper block. Since the thickness of the T-shaped copper block can be relatively much larger than the copper plating thickness of the inner wall of the heat dissipation hole, the heat dissipation effect of the optical chip is very large, and the use of this additional heat dissipation channel can greatly reduce the temperature of the optical chip and improve its high-temperature performance.

[0006] On the basis of the above technical solution, the present invention can also be improved as follows.

[0007] Furthermore, the thickness of the T-shaped copper block in the first through slot or the second through slot is greater than 1.5 mm, and the T-shaped copper block is in the shape of a long strip and is arranged along the width direction of the PCB board.

[0008] The above further beneficial effect is that the cross-sectional area of ​​a single T-shaped copper block is larger than the copper plated on the inner walls of multiple heat dissipation holes, and the heat dissipation cross-sectional area is large, which can effectively reduce the temperature of the optical chip.

[0009] Furthermore, the end surface of the lower end of the T-shaped copper block is in contact with the housing through the thermal conductive paste.

[0010] A further beneficial effect of the above is that the heat of the optical chip is transferred to the T-shaped copper block, and then the T-shaped copper block transfers the heat to the housing through the thermal conductive paste to improve the heat dissipation capacity.

[0011] Furthermore, the lower end surface of the T-shaped copper block is bonded and fixed to the copper sheet by using silver glue with high thermal conductivity.

[0012] A further beneficial effect of the above method is that the heat of the copper sheet can be transferred to the T-shaped copper block through the silver glue, and then the heat is dissipated by the T-shaped copper block, thereby further improving the heat dissipation performance.

[0013] Furthermore, the thickness of the silver paste between the lower end surface of the T-shaped copper block and the copper sheet is 5um to 10um.

[0014] Furthermore, the thermal conductivity of the silver paste is greater than 2.5 W / mk. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a structural diagram of an 800G SR8 optical module in the prior art;

[0016] Figure 2 This is a structural diagram of the 800G SR8 optical module in the present invention.

[0017] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0018] 1. PCB board, 110. Copper sheet, 111. First through slot, 120. Second through slot, 130. Heat dissipation hole, 2. T-shaped copper block, 3. Optical chip, 4. Electrical chip. DETAILED DESCRIPTION

[0019] The principles and features of the present invention are described below in conjunction with the accompanying drawings. The examples given are only used to explain the present invention and are not used to limit the scope of the present invention.

[0020] Example 1

[0021] like Figure 2As shown, an 800G SR8 optical module includes: a PCB board 1, a plurality of heat dissipation holes 130 are opened on the PCB board 1 to form a heat dissipation hole array, the heat dissipation holes 130 are firstly copper plated and then filled with resin, and then the area where the heat dissipation holes 130 are opened on the PCB board 1 is flattened and copper plated 110 is plated, the copper plated thickness of the inner wall of the heat dissipation hole 130 is 35um-70um (because the heat dissipation holes have spacing requirements and the thicker the copper on the inner wall of the hole, the higher the copper plating cost, so this range is usually selected), the copper plated 110 on the PCB board 1 is 35um thick, because the copper plate 110 will be uneven after the hole is opened, and the optical chip 3 must ensure the flatness of the optical path, so the optical chip 3 is fixed on the copper plate 110 in the area not corresponding to the heat dissipation hole 130, and the electrical chip 4 is fixed on the copper plate 110 in the area directly opposite to the heat dissipation hole 130. The main improvements of this embodiment are as follows:

[0022] A first through groove 111 is provided on the copper sheet 110 of the PCB board 1 on the side of the optical chip 3 facing away from the electrical chip 4, and a second through groove 120 with the same size as the first through groove 111 is provided on the PCB board 1 directly below the copper sheet 110. Then the lower end (i.e., the non-T-shaped end) of the T-shaped copper block 2 enters the first through groove 111 and the second through groove 120 in sequence, and the lower surface of the T-shaped end of the T-shaped copper block 2 contacts the copper sheet 110. The heat of the optical chip 3 can be transferred to the T-shaped copper block 2 through the copper sheet 110, and then the T-shaped copper block 2 dissipates the heat. Since the thickness of the T-shaped copper block 2 can be relatively much larger than the copper plating thickness of the inner wall of the heat dissipation hole 130, it has a very large heat dissipation effect on the optical chip 3, and the use of this additional heat dissipation channel can greatly reduce the temperature of the optical chip 3 and improve its high temperature performance.

[0023] Example 2

[0024] like Figure 2 As shown, this embodiment is a further improvement on the basis of embodiment 1, and the details are as follows:

[0025] The thickness of the T-shaped copper block 2 in the first through groove 111 or the second through groove 120 (the thickness is based on the length direction of the PCB board 1) is above 1.5 mm. The T-shaped copper block 2 is in the shape of a long strip and is arranged along the width direction of the PCB board 1. The cross-sectional area of ​​a single T-shaped copper block 2 is larger than the copper plated on the inner walls of multiple heat dissipation holes 130. The heat dissipation cross-sectional area is large, which can effectively reduce the temperature of the optical chip 3.

[0026] In addition, the lower end surface of the T-shaped copper block 2 is in contact with the housing through the thermal paste, and the heat of the optical chip 3 is transferred to the T-shaped copper block 2, and then the T-shaped copper block 2 transfers the heat to the housing through the thermal paste to improve the heat dissipation capacity.

[0027] Example 3

[0028] like Figure 2As shown, this embodiment is a further improvement on the basis of Embodiment 1 or 2, and the details are as follows:

[0029] The lower end surface of the T-shaped copper block 2 is bonded and fixed to the copper sheet 110 using silver glue with high thermal conductivity, which can effectively improve the heat transfer capability, thereby further improving the heat dissipation performance. The thickness of the silver glue between the lower end surface of the T-shaped copper block 2 and the copper sheet 110 is 5um to 10um, and the thermal conductivity of the silver glue is greater than 2.5W / mk.

[0030] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations of the present invention. Ordinary technicians in the field can change, modify, replace and modify the above embodiments within the scope of the present invention.

Claims

1. An 800G SR8 optical module, characterized in that: include: A PCB (1) and a T-shaped copper block (2); a first through groove (111) is provided on the copper sheet (110) of the PCB (1) on the side of the optical chip (3) facing away from the electrical chip (4); a second through groove (120) having the same size as the first through groove (111) is provided on the PCB (1) directly below the copper sheet (110); the lower end of the T-shaped copper block (2) enters the first through groove (111) and the second through groove (120) in sequence, and the T-shaped end of the T-shaped copper block (2) contacts the copper sheet (110).

2. The 800G SR8 optical module according to claim 1, characterized in that: The thickness of the T-shaped copper block (2) in the first through slot (111) or the second through slot (120) is greater than 1.5 mm, and the T-shaped copper block (2) is in the shape of a long strip and is arranged along the width direction of the PCB board (1).

3. The 800G SR8 optical module according to claim 2, characterized in that: The lower end surface of the T-shaped copper block (2) is in contact with the outer shell through heat-conducting paste.

4. The 800G SR8 optical module according to claim 1, characterized in that: The lower end surface of the T-shaped copper block (2) is bonded and fixed to the copper sheet (110) using silver glue with high thermal conductivity.

5. The 800G SR8 optical module according to claim 4, characterized in that: The thickness of the silver glue between the lower end surface of the T-shaped copper block (2) and the copper skin (110) is 5um to 10um.

6. The 800G SR8 optical module according to claim 4, characterized in that: The thermal conductivity of the silver paste is greater than 2.5 W / mk.

Images