Air conditioner
By setting up multiple air outlets and temperature adjustment components in the air conditioner, and adjusting the airflow temperature using semiconductor refrigeration components and heat transfer parts, the problem that existing air conditioners cannot meet the temperature needs of different users is solved, and user experience and production efficiency are improved.
Patent Information
- Application Number
- CN202421577662.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-04
- Publication Date
- 2025-04-22
- Estimated Expiration
- 2034-07-04
AI Technical Summary
When the existing air conditioners adjust the space temperature uniformly, they cannot meet the personalized temperature needs of different users, which affects the user experience.
An air conditioner is designed, by providing the first and second air outlets on the air conditioner body and equipped with a temperature adjustment component, the temperature of the air flow discharged through each air outlet is respectively adjusted using a semiconductor refrigeration assembly and a heat transfer member.
It realizes the function of meeting the temperature needs of different users at the same time, improves the user experience, and simplifies the air conditioner structure and improves production and assembly efficiency.
Smart Images

Figure CN222783596U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of air conditioning, in particular to an air conditioner. Background Art
[0002] In the related art, air conditioners usually uniformly adjust the temperature in a space. However, since different users in the same space may have different temperature requirements, uniformly adjusting the temperature may not meet the usage requirements of different users in the same space, affecting the usage experience of some users. Utility Model Content
[0003] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, the utility model provides an air conditioner, wherein a first air outlet and a second air outlet of the air conditioner can discharge airflows of different temperatures.
[0004] An air conditioner comprises: an air conditioner body, the air conditioner body having a first air outlet and a second air outlet, the air conditioner body comprising a first diverter plate for directing air toward the first air outlet, and a second diverter plate for directing air toward the second air outlet, and the first diverter plate is provided with a first through hole, and the second diverter plate is provided with a second through hole; a temperature regulating component, the temperature regulating component comprising a semiconductor refrigeration component, the semiconductor refrigeration component is arranged on the leeward side of the first diverter plate and the leeward side of the second diverter plate, and comprises a first end and a second end as hot and cold ends, the first end comprising a first heat transfer element arranged at the first through hole, and the second end comprising a second heat transfer element arranged at the second through hole.
[0005] According to the air conditioner of the embodiment of the utility model, by setting a temperature regulating component, the two ends of the temperature regulating component can respectively generate heat and cool, so as to respectively adjust the temperature of the air flow discharged through the first air outlet and the second air outlet, so that the temperature of the air flow discharged from the first air outlet and the second air outlet can be different, so as to simultaneously meet the temperature requirements of different users and improve the user experience. In addition, the temperature regulating component has a simple structure and is easy to assemble. There is no need to separately set different heat exchange devices on the air conditioner, which is beneficial to simplifying the structure of the air conditioner, thereby facilitating improving the production and assembly efficiency of the air conditioner.
[0006] According to some embodiments of the utility model, along the diversion direction from the first diverter plate to the first air outlet, the extension direction of the first heat transfer element matches the extension line of the first through-hole formed in the first diverter plate; along the diversion direction from the second diverter plate to the second air outlet, the extension direction of the second heat transfer element matches the extension line of the second through-hole formed in the second diverter plate.
[0007] According to some embodiments of the utility model, the first heat transfer element fills the first perforation, or the first perforation protrudes from the windward surface of the first diverter plate; the second heat transfer element fills the second perforation, or the second perforation protrudes from the windward surface of the second diverter plate.
[0008] According to some embodiments of the present invention, the temperature regulating component further includes a mounting bracket, and the semiconductor refrigeration assembly is mounted on the mounting bracket and is located on a side of the mounting bracket close to the first diverter plate and the second diverter plate.
[0009] According to some embodiments of the present invention, the first end further includes a first heat conductive block, which is supported between the mounting bracket and the first heat transfer member; the second end further includes a second heat conductive block, which is supported between the mounting bracket and the second heat transfer member.
[0010] According to some embodiments of the present invention, the first heat transfer element is in the form of a sheet and one side surface in the thickness direction faces the windward side of the first diverter plate; the second heat transfer element is in the form of a sheet and one side surface in the thickness direction faces the windward side of the second diverter plate.
[0011] According to some embodiments of the utility model, one of the first heat transfer element and the second heat transfer element is a ceramic sheet, and the other is a metal sheet, and the metal sheet is provided with heat dissipation fins; or, both the first heat transfer element and the second heat transfer element are ceramic sheets.
[0012] According to some embodiments of the utility model, the semiconductor core of the semiconductor refrigeration assembly is arranged between the first heat-conducting block and the second heat-conducting block, and the mounting bracket has a limiting structure, and the limiting structure is limited on a side of the first heat-conducting block away from the semiconductor core, and a side of the second heat-conducting block away from the semiconductor core.
[0013] According to some embodiments of the utility model, the air conditioner body includes a cross-flow fan, and the first diverter plate and the second diverter plate are both constructed as long strips extending along the axial direction of the cross-flow fan; the mounting bracket includes a first frame extending along the axial direction of the cross-flow fan, and the first frame is two and is respectively arranged on the leeward side of the first diverter plate and the leeward side of the second diverter plate, and the limiting structure protrudes from each of the first frames, and the limiting structure extends along the length direction of the first frame.
[0014] According to some embodiments of the present invention, the mounting bracket includes a second frame connected between two of the first frames, the second frame is multiple and is arranged at intervals along the extension direction of the first frames, and the second frame supports the semiconductor core.
[0015] According to some embodiments of the present invention, the mounting bracket is mounted on the first splitter plate and the second splitter plate.
[0016] According to some embodiments of the present invention, the mounting bracket has a connecting hole, and the mounting bracket is mounted on the first diverter plate and the second diverter plate by fasteners passing through the connecting hole.
[0017] According to some embodiments of the utility model, the air conditioner body includes a cross-flow fan, and the first diverter plate and the second diverter plate are both constructed as long strip plates extending along the axial direction of the cross-flow fan; the first perforation is formed as a long strip hole extending along the length direction of the first diverter plate, and the first heat transfer element extends from one end of the length of the first perforation to the other end of the length of the first perforation, and the second perforation is formed as a long strip hole extending along the length direction of the second diverter plate, and the second heat transfer element extends from one end of the length of the second perforation to the other end of the length of the first perforation.
[0018] According to some embodiments of the utility model, the air conditioner body includes a cross-flow fan, and the first diverter plate and the second diverter plate are both constructed as long strip plates extending along the axial direction of the cross-flow fan; there are multiple temperature adjustment components and they are arranged in sequence along the axial direction of the cross-flow fan, and the first ends of two adjacent temperature adjustment components are opposite in hot and cold, and the second ends of two adjacent temperature adjustment components are opposite in hot and cold.
[0019] According to some embodiments of the utility model, the air conditioner is an air-conditioning cabinet, the first air outlet and the second air outlet extend in the up and down directions respectively, and the first air outlet and the second air outlet are located on the left and right sides of the front panel of the air conditioner, the first diverter plate and the second diverter plate are both constructed as long strip plates extending in the up and down directions, and the first diverter plate and the second diverter plate are arranged in sequence in the left and right directions.
[0020] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:
[0022] Figure 1 A cross-sectional view of an air conditioner according to an embodiment of the utility model;
[0023] Figure 2 This is a schematic diagram of the cooperation between the air conditioner body and the temperature adjustment component according to an embodiment of the utility model;
[0024] Figure 3 This is a schematic diagram of the structure of the temperature adjustment component according to an embodiment of the utility model;
[0025] Figure 4 This is a schematic structural diagram of the second heat transfer element according to an embodiment of the utility model;
[0026] Figure 5 for Figure 4 The enlarged view of point A in the middle;
[0027] Figure 6 This is a working principle diagram of the semiconductor refrigeration assembly described in an embodiment of the utility model;
[0028] Figure 7 This is a schematic diagram of the structure of the mounting bracket according to an embodiment of the utility model;
[0029] Figure 8 It is an exploded view of the air conditioner body according to the embodiment of the utility model;
[0030] Fig. 9 It is a structural schematic diagram of the air conditioner described in the embodiment of the utility model.
[0031] Reference numerals:
[0032] Air conditioner 100,
[0033] Air conditioner body 10, face frame component 101, air outlet frame assembly 102,
[0034] Rear box component 103, rear box 1031, evaporator 1032, air duct component 1033, top cover 1034, base 1035, first air guide plate 104, second air guide plate 105, shutter component 106, shutter driving structure 107,
[0035] front panel 108, upper panel 1081, lower panel 1082,
[0036] Upper air outlet 109, lower air outlet 1010, upper air outlet component 10101,
[0037] The first air outlet 11, the second air outlet 12,
[0038] The first splitter plate 13, the leeward side 13a of the first splitter plate, the windward side 13b of the first splitter plate, the windward surface 13c of the first splitter plate, the first through hole 131,
[0039] The second splitter plate 14, the leeward side 14a of the second splitter plate, the windward side 14b of the second splitter plate, the windward surface 14c of the second splitter plate, the second through hole 141,
[0040] Crossflow fan 15, installation space 16,
[0041] Temperature regulating component 20, semiconductor refrigeration component 21,
[0042] first end 211, first heat transfer member 2111, first heat conduction block 2112,
[0043] The second end 212, the second heat transfer member 2121, the heat dissipation fins 21211, the second heat conduction block 2122,
[0044] Cold end substrate 213, hot end substrate 214, flow guide 215,
[0045] Semiconductor core 216, P-type semiconductor 2161, N-type semiconductor 2162,
[0046] The mounting bracket 22 , the limiting structure 221 , the first frame 222 , the second frame 223 , the connecting hole 224 , and the power supply 24 . DETAILED DESCRIPTION
[0047] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.
[0048] In the description of the present utility model, it is necessary to understand that the terms "length", "upper", "lower", "front", "rear", "top", "bottom", "inside", "outside", "axial", "circumferential" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, unless otherwise specified, "multiple" means two or more.
[0049] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0050] Reference below Figure 1-Figure 9 An air conditioner 100 according to an embodiment of the present invention is described.
[0051] like Figure 1 As shown, the air conditioner 100 according to the embodiment of the utility model includes an air conditioner body 10, and the air conditioner body 10 has a first air outlet 11 and a second air outlet 12. The air conditioner body 10 includes a first diverter plate 13 and a second diverter plate 14. The first diverter plate 13 is arranged on a side of the second diverter plate 14 close to the first air outlet 11, and the first diverter plate 13 extends toward the first air outlet 11 relative to the second diverter plate 14 to guide air toward the first air outlet 11, and the second diverter plate 14 extends toward the second air outlet 12 relative to the first diverter plate 13 to guide air toward the second air outlet 12.
[0052] Reference Figure 1 The first air outlet 11 and the second air outlet 12 are spaced apart on the air conditioner body 10. The airflow discharged from the air conditioner 100 can be delivered to different directions through the first air outlet 11 and the second air outlet 12 respectively. The first diverter plate 13 and the second diverter plate 14 are arranged between the first air outlet 11 and the second air outlet 12. During the flow of the airflow, the airflow passes through the first diverter plate 13 and the second diverter plate 14.
[0053] Reference Figure 1 In the direction of air flow, the first diverter plate 13 extends toward the direction close to the first air outlet 11, so that the first diverter plate 13 can guide part of the air flow to the first air outlet 11 and discharge air through the first air outlet 11; in the direction of air flow, the second diverter plate 14 extends toward the direction close to the second air outlet 12, so that the second diverter plate 14 can guide part of the air flow to the second air outlet 12 and discharge air through the second air outlet 12.
[0054] Combination Figure 1 and Figure 2 The air conditioner 100 further includes a temperature regulating component 20 , which includes a semiconductor refrigeration assembly 21 , which is disposed on the leeward side 13 a of the first diverter plate 13 and the leeward side 14 a of the second diverter plate 14 .
[0055] It should be noted that the side of the first diverter plate 13 close to the airflow is defined as the windward side 13b of the first diverter plate 13, and the side of the first diverter plate 13 away from the airflow is defined as the leeward side 13a of the first diverter plate 13; similarly, the side of the second diverter plate 14 close to the airflow is defined as the windward side 14b of the second diverter plate 14, and the side of the second diverter plate 14 away from the airflow is defined as the leeward side 14a of the second diverter plate 14.
[0056] For example, refer to Figure 2In the flow direction of the airflow, the distance between the leeward side 13a of the first diverter plate 13 and the leeward side 14a of the second diverter plate 14 gradually increases, so that an installation space 16 can be defined between the leeward side 13a of the first diverter plate 13 and the leeward side 14a of the second diverter plate 14. The semiconductor refrigeration component 21 is arranged in the installation space 16, which is convenient for positioning and installing the semiconductor refrigeration component 21, and there is no need to design other assembly space for the semiconductor refrigeration component 21 on the air conditioner 100, which is beneficial to improving the space utilization rate of the air conditioner 100, thereby facilitating the miniaturization design of the air conditioner 100.
[0057] At the same time, since the semiconductor refrigeration component 21 is arranged on the leeward side 14a of the first splitter plate 13 and the second splitter plate 14, it is beneficial to prevent the semiconductor refrigeration component 21 from interfering with the flow of airflow, thereby ensuring the flow effect of the airflow.
[0058] like Figure 2 As shown, the semiconductor refrigeration component 21 includes a first end 211 and a second end 212 as hot and cold ends, the first end 211 includes a first heat transfer element 2111, the second end 212 includes a second heat transfer element 2121, the first diverter plate 13 is provided with a first through hole 131, the second diverter plate 14 is provided with a second through hole 141, the first heat transfer element 2111 is arranged at the first through hole 131, and the second heat transfer element 2121 is arranged at the second through hole 141.
[0059] Reference Figure 2 One of the first end 211 and the second end 212 can be used as the cold end of the semiconductor refrigeration component 21, and the other end can be used as the hot end. The first heat transfer element 2111 and the second heat transfer element 2121 can transfer the heat of the first end 211 and the second end 212 respectively. The first diverter plate 13 is provided with a first through hole 131 extending from its windward side to its leeward side. The first heat transfer element 2111 is arranged at the first through hole 131 so that the first heat transfer element 2111 can contact the airflow passing through the first diverter plate 13, thereby facilitating the first heat transfer element 2111 to transfer the heat of the first end 211 to the airflow discharged through the first air outlet 11, so as to adjust the temperature of the airflow discharged through the first air outlet 11.
[0060] like Figure 2 As shown, the second diverter plate 14 is provided with a second through hole 141 extending from its windward side to its leeward side, and the second heat transfer element 2121 is arranged at the second through hole 141 to facilitate the second heat transfer element 2121 to contact the airflow passing through the second diverter plate 14, thereby facilitating the second heat transfer element 2121 to transfer the heat of the second end 212 to the airflow discharged through the second air outlet 12, so as to adjust the temperature of the airflow discharged through the second air outlet 12.
[0061] Among them, when the first end 211 serves as the cold end, the second end 212 can serve as the hot end. At this time, the temperature of the airflow discharged through the first air outlet 11 is relatively low, and the temperature of the airflow discharged through the second air outlet 12 is relatively high; when the first end 211 serves as the hot end, the second end 212 can serve as the cold end. At this time, the temperature of the airflow discharged through the first air outlet 11 is relatively high, and the temperature of the airflow discharged through the second air outlet 12 is relatively low.
[0062] In the related art, air conditioners usually uniformly adjust the temperature in a space. However, since different users in the same space may have different temperature requirements, uniformly adjusting the temperature may not meet the usage requirements of different users in the same space, affecting the usage experience of some users.
[0063] The present application sets a temperature regulating component 20, and the two ends of the temperature regulating component 20 can respectively generate heat and cool, so as to respectively adjust the temperature of the air flow discharged through the first air outlet 11 and the second air outlet 12, so that the temperatures of the air flow discharged from the first air outlet 11 and the second air outlet 12 can be different, so as to simultaneously meet the temperature requirements of different users and improve the user experience. In addition, the temperature regulating component 20 has a simple structure and is easy to assemble. There is no need to respectively set different heat exchange devices on the air conditioner 100, which is beneficial to simplify the structure of the air conditioner 100, thereby facilitating the improvement of the production and assembly efficiency of the air conditioner 100.
[0064] Combination Figure 1 and Figure 2 In some embodiments of the utility model, along the flow direction from the first diverter plate 13 to the first air outlet 11, the extension direction of the first heat transfer member 2111 matches the extension profile of the first through hole 131 in the first diverter plate 13, that is, in the axial direction of the cross-flow fan 15 described below, the orthographic projection of the first heat transfer member 2111 matches the shape of the orthographic projection of the first through hole 131, which is beneficial to reducing the influence of setting the first through hole 131 on the first diverter plate 13 and setting the first heat transfer member 2111 at the first through hole 131 on the airflow, that is, it is beneficial to prevent the first through hole 131 and the first heat transfer member 2111 from interfering with the airflow, thereby facilitating improving the smoothness of the airflow.
[0065] Combination Figure 1 and Figure 2Along the flow direction from the second splitter plate 14 to the second air outlet 12, the extension direction of the second heat transfer member 2121 matches the extension profile of the second through-hole 141 in the second splitter plate 14, that is, in the axial direction of the cross-flow fan 15 described below, the orthographic projection of the second heat transfer member 2121 matches the shape of the orthographic projection of the second through-hole 141, which is beneficial to reducing the influence of setting the second through-hole 141 on the second splitter plate 14 and setting the second heat transfer member 2121 at the second through-hole 141 on the airflow, that is, it is beneficial to prevent the second through-hole 141 and the second heat transfer member 2121 from interfering with the airflow, thereby helping to improve the smoothness of the airflow.
[0066] Reference Figure 2 In some embodiments of the utility model, the first heat transfer element 2111 fills the first through hole 131, that is, in the axial direction of the cross-flow fan 15 described below, the surface of the first heat transfer element 2111 located on the same side as the windward side 13b of the first splitter plate 13 is flush with the windward surface 13c of the first splitter plate 13, which is beneficial to improving the flow smoothness of the airflow when it flows through the first splitter plate 13, and at the same time, it is beneficial to improve the contact effect between the first heat transfer element 2111 and the airflow, thereby facilitating improving the efficiency of the first heat transfer element 2111 in transferring heat to the airflow.
[0067] It should be noted that the “windward surface 13c of the first splitter plate 13” refers to a surface of the first splitter plate 13 located on its windward side, and the “windward surface 14c of the second splitter plate 14” refers to a surface of the second splitter plate 14 located on its windward side.
[0068] Or the first heat transfer element 2111 protrudes from the windward surface 13c of the first diverter plate 13 through the first through hole 131, that is, the first heat transfer element 2111 extends from the first through hole 131 along the leeward side 13a of the first diverter plate 13 toward the windward side 13b of the first diverter plate 13, which is beneficial to further increase the contact area between the first heat transfer element 2111 and the airflow, thereby facilitating improving the efficiency of the first heat transfer element 2111 in transferring heat to the airflow.
[0069] The second heat transfer element 2121 fills up the second through-hole 141, i.e., in the axial direction of the cross-flow fan 15 described below, the surface of the second heat transfer element 2121 located on the same side as the windward side 14b of the second splitter plate 14 is flush with the windward surface 14c of the second splitter plate 14, which is beneficial to improving the flow smoothness of the airflow when it flows through the second splitter plate 14, and at the same time, is beneficial to improving the contact effect between the second heat transfer element 2121 and the airflow, thereby helping to improve the efficiency of the second heat transfer element 2121 in transferring heat to the airflow.
[0070] like Figure 2As shown, the second heat transfer element 2121 protrudes from the windward surface 14c of the second splitter plate 14 through the second through hole 141, that is, the second heat transfer element 2121 extends from the second through hole 141 along the leeward side 14a of the second splitter plate 14 to the windward side 14b of the second splitter plate 14, which is beneficial to further increase the contact area between the second heat transfer element 2121 and the airflow, thereby helping to improve the efficiency of the second heat transfer element 2121 in transferring heat to the airflow.
[0071] Reference Figure 2 In some embodiments of the present invention, the temperature regulating component 20 further includes a mounting bracket 22 , and the semiconductor refrigeration assembly 21 is mounted on the mounting bracket 22 and is located on a side of the mounting bracket 22 close to the first diverter plate 13 and the second diverter plate 14 .
[0072] The mounting bracket 22 serves as a mounting carrier of the semiconductor refrigeration component 21, which facilitates the positioning and installation of the semiconductor refrigeration component 21, and the semiconductor refrigeration component 21 is arranged on one side of the mounting bracket 22 close to the first diverter plate 13 and the second diverter plate 14, so as to facilitate the arrangement of the first heat transfer element 2111 at the first perforation 131, and at the same time facilitate the arrangement of the second heat transfer element 2121 at the second perforation 141, which is beneficial to improving the assembly convenience of the semiconductor refrigeration component 21.
[0073] Combination Figure 2 and Figure 3 In some embodiments of the utility model, the first end 211 also includes a first heat conductive block 2112, which is supported between the mounting bracket 22 and the first heat transfer member 2111; the second end 212 also includes a second heat conductive block 2122, which is supported between the mounting bracket 22 and the second heat transfer member 2121.
[0074] Combination Figure 2 and Figure 3 The first heat conductive block 2112 is used to support the first heat transfer element 2111, and the first heat conductive block 2112 can transfer the heat generated at the first end 211 of the semiconductor refrigeration component 21 to the first heat transfer element 2111, which is convenient for arranging the first heat transfer element 2111 at the first through hole 131, thereby ensuring the heat transfer effect of the first end 211 and helping to reduce the size of the first heat transfer element 2111, thereby helping to reduce the production cost of the semiconductor refrigeration component 21.
[0075] The second heat conductive block 2122 is used to support the second heat transfer element 2121, and the second heat conductive block 2122 can transfer the heat generated at the second end 212 of the semiconductor refrigeration component 21 to the second heat transfer element 2121, so as to arrange the second heat transfer element 2121 at the second perforation 141, thereby ensuring the heat transfer effect of the second end 212 and helping to reduce the size of the second heat transfer element 2121, thereby helping to reduce the production cost of the semiconductor refrigeration component 21.
[0076] Combination Figure 2 and Figure 3 The first heat transfer member 2111 and the second heat transfer member 2121 are in the form of sheets. Since some materials (such as ceramic materials, etc.) are not easy to be processed into other shapes, or it is difficult to play a good heat dissipation role when processed into other shapes, the first heat transfer member 2111 and the second heat transfer member 2121 can be processed into sheet forms, so as to facilitate the diversified selection of materials of the first heat transfer member 2111 and the second heat transfer member 2121. When the heat transfer members (including the first heat transfer member 2111 and the second heat transfer member 2121) are in the form of sheets, It is even more necessary to set up heat conductive blocks (including a first heat conductive block 2112 and a second heat conductive block 2122) so that the heat transfer element can adapt to manifolds of different shapes (that is, the first heat transfer element 2111 can adapt to first manifolds 13 of different shapes, and the second heat transfer element 2121 can adapt to second manifolds 14 of different shapes), and it is convenient to arrange the heat transfer element at the perforation (that is, it is convenient to arrange the first heat transfer element 2111 at the first perforation 131, and it is convenient to arrange the second heat transfer element 2121 at the second perforation 141).
[0077] Combination Figure 2 and Figure 3 The first heat conductive block 2112 is supported between the mounting bracket 22 and the first heat transfer element 2111, and one side surface of the first heat transfer element 2111 in the thickness direction faces the windward side 13b of the first diverter plate 13, so that the first heat transfer element 2111 can contact the airflow passing through the first diverter plate 13, thereby facilitating heat exchange between the first heat transfer element 2111 and the airflow.
[0078] Combination Figure 2 and Figure 3 The second heat conductive block 2122 is supported between the mounting bracket 22 and the second heat transfer element 2121, and one side surface of the second heat transfer element 2121 in the thickness direction faces the windward side 14b of the second diverter plate 14, so that the second heat transfer element 2121 can contact the airflow passing through the second diverter plate 14, thereby facilitating heat exchange between the second heat transfer element 2121 and the airflow.
[0079] In some embodiments of the utility model, since metal materials and ceramic materials are easy to obtain and have good heat transfer effects, one of the first heat transfer element 2111 and the second heat transfer element 2121 can be a ceramic sheet and the other can be a metal sheet, which is beneficial to improve the processing convenience of the first heat transfer element 2111 and the second heat transfer element 2121, and at the same time, the first heat transfer element 2111 and the second heat transfer element 2121 can have good heat transfer effects.
[0080] Combination Figure 4 and Figure 5 ,in, Figure 4 In the embodiment shown, the second heat transfer member 2121 is formed as a metal sheet, and a heat dissipation fin 21211 is provided on the metal sheet. By providing the heat dissipation fin 21211 on the metal sheet, it is beneficial to increase the heat dissipation area, thereby improving the heat exchange efficiency between the metal sheet and the airflow.
[0081] Alternatively, the first heat transfer element 2111 and the second heat transfer element 2121 are both ceramic sheets, so that the first heat transfer element 2111 and the second heat transfer element 2121 have good heat transfer effects and are conducive to improving the processing convenience of the first heat transfer element 2111 and the second heat transfer element 2121.
[0082] Of course, it is understandable that the materials forming the first heat transfer element 2111 and the second heat transfer element 2121 can be determined according to actual production requirements and are not specifically limited here, as long as the heat transfer effect of the first heat transfer element 2111 and the second heat transfer element 2121 is guaranteed.
[0083] Combination Figure 2 and Figure 3 The semiconductor core 216 of the semiconductor refrigeration component 21 is arranged between the first heat-conducting block 2112 and the second heat-conducting block 2122. The semiconductor core 216 can heat and cool at the same time, and the semiconductor core 216 can transfer heat to the first heat-conducting block 2112 and the second heat-conducting block 2122 respectively, and the first heat-conducting block 2112 and the second heat-conducting block 2122 can transfer heat to the first heat transfer element 2111 and the second heat transfer element 2121 respectively, thereby adjusting the temperature of the airflow flowing to the first air outlet 11 and the second air outlet 12 respectively.
[0084] Combination Figure 2 and Figure 3The mounting bracket 22 has a limiting structure 221, which is limited on a side of the first heat-conducting block 2112 away from the semiconductor core 216, and on a side of the second heat-conducting block 2122 away from the semiconductor core 216, that is, the limiting structure 221 is respectively arranged on a side of the first heat-conducting block 2112 and a side of the second heat-conducting block 2122 away from the semiconductor core 216, and the limiting structure 221 clamps the first heat-conducting block 2112 and the second heat-conducting block 2122, which is beneficial to improving the assembly stability of the first heat-conducting block 2112 and the second heat-conducting block 2122, thereby helping to improve the assembly stability of the semiconductor refrigeration component 21.
[0085] Reference Figure 6 In some embodiments of the utility model, the semiconductor refrigeration component 21 includes a cold end substrate 213 and a hot end substrate 214, and the cold end substrate 213 and the hot end substrate 214 are respectively provided with a flow guide 215, and the semiconductor core 216 includes a P-type semiconductor 2161 and an N-type semiconductor 2162, and the semiconductor refrigeration component 21 is electrically connected to the power supply 24. When the power supply 24 is turned on, the P-type semiconductor 2161 and the N-type semiconductor 2162 are energized and transfer cold through the cold end substrate 213 and transfer heat through the hot end substrate 214, thereby realizing the function of the semiconductor refrigeration component 21 to cool and heat at the same time. It can be understood that the working principle of the semiconductor refrigeration component 21 is well known to those skilled in the art and will not be repeated here. Among them, one of the cold end substrate 213 and the hot end substrate 214 can be used as the first heat conduction block 2112, and the other can be used as the second heat conduction block 2122. Alternatively, one of the cold end substrate 213 and the hot end substrate 214 may be in contact with the first heat conducting block 2112 for heat transfer, and the other may be in contact with the second heat conducting block 2122 for heat transfer.
[0086] Combination Figures 1 to 3 as well as Figure 7 and Figure 8 In some embodiments of the present invention, the air conditioner body 10 includes a cross-flow fan 15 , and the first splitter plate 13 and the second splitter plate 14 are both constructed as long strip plates extending along the axial direction of the cross-flow fan 15 .
[0087] The cross-flow fan 15 can draw air from outside the air conditioner 100 into the air conditioner 100, and the first diverter plate 13 and the second diverter plate 14 are arranged on the exhaust side of the cross-flow fan 15. The airflow discharged from the cross-flow fan 15 flows toward the first diverter plate 13 and the second diverter plate 14, and the first diverter plate 13 and the second diverter plate 14 extend along the axial direction of the cross-flow fan 15 to increase the area of the first diverter plate 13 and the second diverter plate 14, which is beneficial to improving the drainage effect of the first diverter plate 13 and the second diverter plate 14 on the airflow discharged from the cross-flow fan 15.
[0088] Combination Figure 2 , Figure 3 as well as Figure 7 The mounting bracket 22 includes a first frame 222 extending along the axial direction of the crossflow fan 15. There are two first frames 222, which are respectively arranged on the leeward side 13a of the first diverter plate 13 and the leeward side 14a of the second diverter plate 14. A limiting structure 221 protrudes from each first frame 222, and the limiting structure 221 extends along the length direction of the first frame 222.
[0089] It should be noted that “the length direction of the first frame 222 ” may be understood as a direction parallel to the axial direction of the cross flow blower 15 .
[0090] By respectively arranging the two first frames 222 on the leeward side 13a of the first diverter plate 13 and the leeward side 14a of the second diverter plate 14, so as to facilitate arranging the semiconductor refrigeration component 21 on the leeward side 13a of the first diverter plate 13 and the leeward side 14a of the second diverter plate 14, a limiting structure 221 protrudes from each first frame 222, so that the limiting structure 221 clamps and limits the semiconductor refrigeration component 21 on both sides of the semiconductor refrigeration component 21, which is beneficial to improving the assembly stability of the semiconductor refrigeration component 21, and there is no need to set additional limiting parts, which is beneficial to simplifying the assembly of the temperature adjustment component 20.
[0091] Combination Figure 7 and Figure 8 The first frame 222 extends along the axial direction of the cross-flow fan 15 to facilitate the arrangement of the semiconductor refrigeration component 21 in the axial direction of the cross-flow fan 15, thereby facilitating the semiconductor refrigeration component 21 to regulate the air flow temperature to meet the use requirements.
[0092] Combination Figure 3 and Figure 7 In some embodiments of the utility model, the mounting bracket 22 includes a second frame 223 connected between two first frames 222, and the second frame 223 is multiple and is arranged at intervals along the extension direction of the first frame 222. By setting multiple second frames 223 connected between the two first frames 222, it is beneficial to improve the stability between the two first frames 222, thereby helping to improve the limiting reliability of the limiting structure 221 on the semiconductor refrigeration component 21.
[0093] Furthermore, the second frame 223 can support the semiconductor core 216 , which is beneficial to improving the assembly stability of the semiconductor core 216 , thereby improving the reliability of the electrical connection of the semiconductor core 216 and ensuring the reliability of cooling and heating of the semiconductor core 216 .
[0094] Reference Figure 2In some embodiments of the utility model, the mounting bracket 22 is installed on the first diverter plate 13 and the second diverter plate 14. Since the mounting bracket 22 is used to install the semiconductor refrigeration component 21, and the first heat transfer element 2111 and the second heat transfer element 2121 of the semiconductor refrigeration component 21 need to be respectively arranged at the first perforation 131 and the second perforation 141, the mounting bracket 22 is installed on the first diverter plate 13 and the second diverter plate 14, so that the first heat transfer element 2111 and the second heat transfer element 2121 are respectively positioned and matched with the first perforation 131 and the second perforation 141, which is beneficial to improve the convenience of the first heat transfer element 2111 and the second heat transfer element 2121 matching with the first perforation 131 and the second perforation 141 respectively.
[0095] like Figure 7 As shown, in some embodiments of the present invention, the mounting bracket 22 has a connecting hole 224 , and the mounting bracket 22 is mounted on the first splitter plate 13 and the second splitter plate 14 via a fastener penetrating through the connecting hole 224 .
[0096] The connection hole 224 is set through the mounting bracket 22 along the thickness direction of the mounting bracket 22. The fastener can be passed through the connection hole 224 and connected to the first diverter plate 13 and the second diverter plate 14 respectively, so that the mounting bracket 22 can be installed on the first diverter plate 13 and the second diverter plate 14.
[0097] A plurality of connection holes 224 are provided, and the plurality of connection holes 224 are arranged at intervals along the circumferential direction of the mounting bracket 22 , which is beneficial to improving the connection reliability between the mounting bracket 22 and the first splitter plate 13 and the second splitter plate 14 .
[0098] Optionally, the fasteners may be configured as threaded members such as screws or bolts to facilitate assembly and disassembly of the mounting bracket 22 and the first splitter plate 13 and the second splitter plate 14 .
[0099] In some embodiments of the utility model, the air conditioner body 10 includes a cross-flow fan 15, and the first diverter plate 13 and the second diverter plate 14 are both constructed as long strip plates extending along the axial direction of the cross-flow fan 15, which is beneficial to increase the area of the first diverter plate 13 and the second diverter plate 14, thereby facilitating improving the guiding effect of the first diverter plate 13 and the second diverter plate 14 on the airflow.
[0100] The first perforation 131 is formed as a long strip hole extending along the length direction of the first diverter plate 13, the first heat transfer element 2111 extends from one end of the length of the first perforation 131 to the other end of the length of the first perforation 131, the second perforation 141 is formed as a long strip hole extending along the length direction of the second diverter plate 14, and the second heat transfer element 2121 extends from one end of the length of the second perforation 141 to the other end of the length of the first perforation 131.
[0101] That is, the temperature regulating component 20 is provided with one, and the temperature regulating component 20 extends along the axial direction of the cross-flow fan 15, the first heat transfer element 2111 is arranged at the first through-hole 131, and the length of the first heat transfer element 2111 is adapted to the length of the first through-hole 131, the second heat transfer element 2121 is arranged at the second through-hole 141, and the length of the second heat transfer element 2121 is adapted to the length of the second through-hole 141, so as to increase the heat exchange area of the temperature regulating component 20 and improve the heat exchange efficiency of the temperature regulating component 20.
[0102] Since the first end 211 and the second end 212 of the semiconductor refrigeration component 21 are respectively formed as hot and cold ends, one of the first heat transfer element 2111 and the second heat transfer element 2121 can transfer cold to the airflow, and the other of the first heat transfer element 2111 and the second heat transfer element 2121 can transfer heat to the airflow, so that a temperature difference is formed between the airflow discharged through the first air outlet 11 and the airflow discharged through the second air outlet 12, so as to meet the different temperature requirements of different users in the same space and improve the user experience.
[0103] In some embodiments of the utility model, the air conditioner body 10 includes a cross-flow fan 15, and the first diverter plate 13 and the second diverter plate 14 are both constructed as long strip plates extending along the axial direction of the cross-flow fan 15; there are multiple temperature adjustment components 20 and they are arranged in sequence along the axial direction of the cross-flow fan 15, and the first ends 211 of two adjacent temperature adjustment components 20 are opposite in hot and cold, and the second ends 212 of two adjacent temperature adjustment components 20 are opposite in hot and cold.
[0104] The first heat transfer elements 2111 of the temperature adjustment components 20 are all disposed at the first through-holes 131 , and the second heat transfer elements 2121 of the temperature adjustment components 20 are all disposed at the second through-holes 141 , so as to facilitate heat exchange between the temperature adjustment components 20 and the airflow.
[0105] For example, 10 temperature regulating components can be provided, and the 10 temperature regulating components are arranged in sequence along the axial direction of the cross-flow fan 15, wherein the first end 211 of the 1st, 3rd, 5th, 7th, and 9th temperature regulating components 20 can be formed as a cold end, and the second end 212 can be formed as a hot end, and the first end 211 of the 2nd, 4th, 6th, 8th, and 10th temperature regulating components 20 can be formed as a hot end, and the second end 212 can be formed as a cold end. When the 1st, 3rd, 5th, 7th, and 9th temperature regulating components 20 are working, the temperature of the airflow discharged from the first air outlet 11 is lower than the temperature of the airflow discharged from the second air outlet 12. When the 2nd, 4th, 6th, 8th, and 10th temperature regulating components 20 are working, the temperature of the airflow discharged from the first air outlet 11 is higher than the temperature of the airflow discharged from the second air outlet 12.
[0106] Therefore, by controlling the operation of different temperature adjustment components 20 to switch the air outlet temperatures of the first air outlet 11 and the second air outlet 12, the functionality of the air conditioner 100 is improved, which is beneficial to improving the user experience.
[0107] Combination Figure 8 and Fig. 9 In some embodiments of the present invention, the air conditioner 100 is a cabinet air conditioner, and the first air outlet 11 and the second air outlet 12 extend in the up and down directions respectively to increase the areas of the first air outlet 11 and the second air outlet 12, which is beneficial to improving the efficiency of the air conditioner 100 in regulating the indoor temperature.
[0108] Combination Figure 8 and Fig. 9 The first air outlet 11 and the second air outlet 12 are located on the left and right sides of the front panel 108 of the air conditioner 100, so that the first air outlet 11 and the second air outlet 12 are arranged at intervals, and the first diverter plate 13 and the second diverter plate 14 are both constructed as long strips extending in the up and down directions, and the first diverter plate 13 and the second diverter plate 14 are arranged in sequence in the left and right directions, which is beneficial to increase the air supply range and make the temperatures of the airflow discharged from the first air outlet 11 and the airflow discharged from the second air outlet 12 not easily interfere with each other, so as to meet the usage needs of users in different directions in the same space.
[0109] In some embodiments, in combination Figure 8 and Fig. 9 The air conditioner body 10 may include a face frame component 101, an air outlet frame assembly 102 and a rear box component 103. A front panel 108 is arranged on the front side of the face frame component 101, wherein an air outlet channel connected to the first air outlet 11 and the second air outlet 12 is defined between the face frame component 101 and the air outlet frame assembly 102, respectively. The first splitter plate 13 and the second splitter plate 14 are integrated in the face frame component 101 and are used to guide the flow direction of the airflow. A first air guide plate 104 is arranged at the first air outlet 11, and a second air guide plate 105 is arranged at the second air outlet 12. A louver component 106 is also arranged in the air outlet channel. A louver driving structure 107 is arranged between the face frame component 101 and the front panel 108. The louver driving structure 107 is used to drive the louver component 106 to move. The front panel 108 includes an upper panel 1081 and a lower panel 1082.
[0110] like Figure 8 As shown, the rear box component 103 includes a rear box 1031, an evaporator 1032 and an air duct component 1033. The evaporator 1032 and the air duct component 1033 are both arranged in the rear box 1031, and a top cover 1034 is arranged above the rear box 1031, and a base 1035 is arranged below the rear box 1031. The air duct component 1033 includes a cross-flow fan 15.
[0111] Reference Fig. 9 The upper and lower sides of the air conditioner 100 are also respectively provided with an upper air outlet 109 and a lower air outlet 1010 located on the upper and lower sides of the front panel 108, so that the air conditioner 100 can achieve exhaust in multiple directions, which is beneficial to improving the heat exchange efficiency of the air conditioner 100.
[0112] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.
[0113] Although the embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.
Claims
1. An air conditioner, characterized in that: include: An air conditioner body, the air conditioner body having a first air outlet and a second air outlet, the air conditioner body comprising a first diverter plate for directing air toward the first air outlet, and a second diverter plate for directing air toward the second air outlet, wherein the first diverter plate is provided with a first through hole, and the second diverter plate is provided with a second through hole; A temperature regulating component, wherein the temperature regulating component includes a semiconductor refrigeration component, wherein the semiconductor refrigeration component is arranged on the leeward side of the first diverter plate and the leeward side of the second diverter plate, and includes a first end and a second end as hot and cold ends, wherein the first end includes a first heat transfer element arranged at the first through hole, and the second end includes a second heat transfer element arranged at the second through hole.
2. The air conditioner according to claim 1, characterized in that: Along the diversion direction from the first diverter plate to the first air outlet, the extension direction of the first heat transfer element matches the extension line of the first through-hole in the first diverter plate; along the diversion direction from the second diverter plate to the second air outlet, the extension direction of the second heat transfer element matches the extension line of the second through-hole in the second diverter plate.
3. The air conditioner according to claim 2, characterized in that: The first heat transfer element fills up the first through hole, or the first through hole protrudes out of the windward surface of the first splitter plate; the second heat transfer element fills up the second through hole, or the second through hole protrudes out of the windward surface of the second splitter plate.
4. The air conditioner according to claim 1, characterized in that: The temperature regulating component further comprises a mounting bracket, and the semiconductor refrigeration assembly is mounted on the mounting bracket and is located on a side of the mounting bracket close to the first diverter plate and the second diverter plate.
5. The air conditioner according to claim 4, characterized in that: The first end further includes a first heat conductive block, which is supported between the mounting bracket and the first heat transfer member; the second end further includes a second heat conductive block, which is supported between the mounting bracket and the second heat transfer member.
6. The air conditioner according to claim 5, characterized in that: The first heat transfer element is in the form of a sheet, and one side surface in the thickness direction faces the windward side of the first splitter plate; the second heat transfer element is in the form of a sheet, and one side surface in the thickness direction faces the windward side of the second splitter plate.
7. The air conditioner according to claim 6, characterized in that: One of the first heat transfer member and the second heat transfer member is a ceramic sheet, and the other is a metal sheet, and the metal sheet is provided with heat dissipation fins; or, both the first heat transfer member and the second heat transfer member are ceramic sheets.
8. The air conditioner according to claim 5, characterized in that: The semiconductor core of the semiconductor refrigeration assembly is arranged between the first heat-conducting block and the second heat-conducting block. The mounting bracket is provided with a limiting structure, and the limiting structure is limited on a side of the first heat-conducting block away from the semiconductor core and a side of the second heat-conducting block away from the semiconductor core.
9. The air conditioner according to claim 8, characterized in that: The air conditioner body includes a cross-flow fan, and the first diverter plate and the second diverter plate are both constructed as long strips extending along the axial direction of the cross-flow fan; the mounting bracket includes a first frame extending along the axial direction of the cross-flow fan, and the first frame is two and is respectively arranged on the leeward side of the first diverter plate and the leeward side of the second diverter plate, and each of the first frames has a protruding limit structure, and the limit structure extends along the length direction of the first frame.
10. The air conditioner according to claim 9, characterized in that: The mounting bracket includes a second frame connected between two of the first frames, the second frame is multiple and is arranged at intervals along the extension direction of the first frames, and the second frame supports the semiconductor core.
11. The air conditioner according to claim 4, characterized in that: The mounting bracket is mounted on the first splitter plate and the second splitter plate.
12. The air conditioner according to claim 11, characterized in that: The mounting bracket has a connecting hole, and the mounting bracket is mounted on the first splitter plate and the second splitter plate through a fastener penetrating through the connecting hole.
13. The air conditioner according to claim 1, characterized in that: The air conditioner body includes a cross-flow fan, and the first diverter plate and the second diverter plate are both constructed as long strip plates extending along the axial direction of the cross-flow fan; the first through-hole is formed as a long strip hole extending along the length direction of the first diverter plate, and the first heat transfer element extends from one end of the length of the first through-hole to the other end of the length of the first through-hole, and the second through-hole is formed as a long strip hole extending along the length direction of the second diverter plate, and the second heat transfer element extends from one end of the length of the second through-hole to the other end of the length of the first through-hole.
14. The air conditioner according to claim 1, characterized in that: The air conditioner body includes a cross-flow fan, and the first diverter plate and the second diverter plate are both constructed as long strip plates extending along the axial direction of the cross-flow fan; there are multiple temperature adjustment components and they are arranged in sequence along the axial direction of the cross-flow fan, and the first ends of two adjacent temperature adjustment components are opposite in hot and cold, and the second ends of two adjacent temperature adjustment components are opposite in hot and cold.
15. The air conditioner according to any one of claims 1 to 14, characterized in that: The air conditioner is a cabinet air conditioner, the first air outlet and the second air outlet extend in the up and down directions respectively, and the first air outlet and the second air outlet are located on the left and right sides of the front panel of the air conditioner, the first diverter plate and the second diverter plate are both constructed as long strips extending in the up and down directions, and the first diverter plate and the second diverter plate are arranged in sequence in the left and right directions.