Headset

Abstract

The application discloses a headphone, the headphone comprises a headband and two earphone units respectively connected to two ends of the headband, and each earphone unit comprises an earphone shell, a loudspeaker assembly, an earmuff assembly and a battery; the at least one earphone unit further comprises a circuit board; the loudspeaker assembly is arranged in the earphone shell and comprises a loudspeaker body and a loudspeaker shell, and the loudspeaker body is connected to the loudspeaker shell; the surface, opposite to the earcap assembly, of the loudspeaker shell is matched with the inner wall surface of the earphone shell to define a mounting cavity, a first mounting surface and a second mounting surface are formed on the surface of the loudspeaker shell, the first mounting surface is connected with the battery, and the second mounting surface is connected with the circuit board; the first mounting surface and the second mounting surface are arranged in the direction perpendicular to the thickness direction of the earphone unit, at least one of the first mounting surface and the second mounting surface exists, and the distance between the first mounting surface and the earcap assembly is reduced in the direction away from the other mounting surface. According to the invention, the headphone can be lighter and thinner.

Description

Technical Field

[0001] The present application relates to the field of earphone technology, and in particular to a headset. Background Art

[0002] In the related art, headphones often install a battery in a single headphone unit. In order to ensure that the headphones have a relatively long battery life, the battery is often larger in size to obtain sufficient battery capacity. Therefore, the larger battery will occupy more internal space in the headphone unit, and other electronic components inside the headphone unit need to be stacked with the battery in the shell of the headphone unit. This form causes the overall structure of the headphone unit of the headphones to be larger in thickness, which is not conducive to wearing and use. Utility Model Content

[0003] The embodiment of the present application provides a headset that can make the headset thinner and lighter.

[0004] The embodiment of the present application provides a headset, which includes a headband and two earphone units respectively connected to the two ends of the headband, each of the earphone units includes an earphone housing, a speaker assembly, an earmuff assembly and a battery; wherein at least one of the earphone units also includes a circuit board; the earphone housing is connected to the headband; the earmuff assembly is connected to the earphone housing and is used to cover the outside of the user's ear; the speaker assembly is arranged in the earphone housing, the speaker assembly includes a speaker body and a speaker shell, the speaker shell is connected to the earphone housing, and the speaker body is connected to the speaker shell; the surface of the speaker shell facing away from the earmuff assembly cooperates with the inner wall surface of the earphone housing to form a mounting cavity, and the surface of the speaker shell is formed with a first mounting surface and a second mounting surface, the first mounting surface is connected to the battery, and the second mounting surface is connected to the circuit board; wherein the first mounting surface and the second mounting surface are arranged in a direction perpendicular to the thickness direction of the earphone unit, and at least one of the first mounting surface and the second mounting surface is arranged to be spaced from the earmuff assembly in a direction away from the other.

[0005] Based on the headset of the embodiment of the present application, the headset unit protects various components inside it by providing a headset shell, and prevents impurities such as dust and water stains from entering the headset unit to cause damage to the components, and the surface of the speaker shell facing away from the earmuff assembly cooperates with the inner wall surface of the headset shell to form an installation cavity for placing components such as batteries and circuit boards. The earmuff assembly is connected to the headset shell to contact the wearer's ear and cover the outside of the user's ear, thereby reducing the pressure of the headset unit on the wearer's auricle and improving the wearer's comfort when wearing the headset.

[0006] The present application also provides batteries in both earphone units. It can be understood that, under the condition that the headphone has the same endurance as in the previous design, the provision of two batteries will inevitably reduce the volume and weight of each battery. The present application further forms a first mounting surface and a second mounting surface on the above-mentioned surface of the speaker shell, and the first mounting surface and the second mounting surface are arranged in a direction perpendicular to the thickness direction of the earphone unit, and at least one of the first mounting surface and the second mounting surface is arranged to have a smaller distance from the earmuff assembly in a direction away from the other, so that the back side of the speaker shell is closer to the earmuff assembly than the back side of the earphone unit. A gradient installation space is formed in the thickness direction, and since the battery has been reduced in volume, it can be arranged side by side with the circuit board in the radial direction of the earphone unit. It can be seen that the structural layout of the present application is different from the previous design in which the battery and the circuit board are simply stacked in the thickness direction of the earphone unit. Since the battery is installed in an offset manner and arranged side by side with the circuit board in the radial direction of the earphone unit, the space in the installation cavity can be fully utilized, the thickness and overall volume of the earphone unit can be reduced, the headset is made thinner, and the product shape is avoided to be bloated, which is more convenient to wear and use. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0008] Figure 1 A schematic diagram of an earphone unit of an embodiment of the headphone of the present application;

[0009] Figure 2 for Figure 1 An exploded view of one of the earphone units of the headset shown in FIG.

[0010] Figure 3 for Figure 2 A cross-sectional view of an earphone unit shown in FIG.

[0011] Figure 4 for Figure 2 Another cross-sectional view of the earphone unit shown in FIG.

[0012] Figure 5 for Figure 2 An exploded view of a speaker assembly of an earphone unit is shown in FIG.

[0013] Figure 6 for Figure 2A schematic structural diagram of an earmuff assembly of an earphone unit shown in FIG.

[0014] Description of Figure Numbers:

[0015] 1. Headphones; 10. Headphone unit; 20. Headphone housing; 20a. Mounting cavity; 21. Cover; 22. Headphone back cover; 30. Speaker assembly; 31. Speaker body; 311. Sound outlet surface; 32. Speaker housing; 321. Speaker back cover; 3211. First mounting surface; 3212. Second mounting surface; 322. Stopper; 3221. Mounting groove; 323. Speaker bracket; 3231. Stopper groove; 3232. Sound outlet hole; 324. Accommodating cavity; 40. Earmuff assembly; 41. Earmuff bracket; 411. Connecting surface; 42. Earmuff body; 50. Battery; 60. Circuit board

[0016] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0017] In order to make the objectives, technical solutions and advantages of the present application clearer, the following part will further describe the embodiments of the present application in detail in conjunction with the accompanying drawings.

[0018] When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Instead, they are only examples of devices and methods consistent with some aspects of the present application as detailed in the attached claims.

[0019] In the description of the present application, it should be understood that the terms "first", "second", etc. are used for descriptive purposes only and should not be understood as indicating or implying relative importance. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances. In addition, in the description of the present application, unless otherwise specified, "multiple" refers to two or more. "And / or" describes the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. The character " / " generally indicates that the objects associated before and after are in an "or" relationship.

[0020] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used in this specification are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0021] At present, earphones, as a commonly used electronic product, play an important role in people's lives. When earphones are distinguished by their sound generation mechanism, they include air conduction earphones, bone conduction earphones, etc. When distinguished by the wearing method, they include headphones, ear-hanging earphones, etc. Headphones have a headband and two earphone units. When worn, the headband provides a certain clamping force to cover the two earphone units on the user's ears. During use, they have good sound insulation effect, can keep warm in winter, and have a cool appearance. Therefore, they are loved by many users.

[0022] The conventional design of headphones is to install a battery in one of the two earphone units, and the two earphone units are powered by the battery, and the two earphone units can be electrically connected through the wiring in the headband. In order to ensure a longer battery life, the battery is usually larger in size and has a larger capacity, so the battery occupies a lot of space inside the earphone unit, making it difficult to arrange other components inside the earphone unit, so that other electronic components such as circuit boards are often stacked with the battery, which will cause the thickness of the earphone unit to be larger, which is not convenient to wear or carry.

[0023] To solve the above problems, please refer to Figures 1 to 3 The present application proposes a headset 1. In the embodiment of the present application, the headset 1 includes a headband (not shown) and two earphone units 10 respectively connected to the two ends of the headband. During wearing, the headband spans across the user's head and provides a certain elastic clamping force to cover one earphone unit 10 on one ear of the user. For ease of description, the following content defines the side of the components in the earphone unit 10 facing the user's ear as the front side, and the side facing away from the ear as the back side.

[0024] The headband is of an overall curved arc structure to adapt to the user's head contour, wherein the headband can be of a retractable and adjustable design, and the headband can include a frame and a jacket covering the frame, the frame can be made of plastic or metal, and the jacket can be made of soft materials such as leather or cloth, so that when the jacket contacts the user, the user feels more comfortable. The frame can have multiple splicing units, and the two splicing units can be connected in a sliding manner, so that by sliding and pulling between the two splicing units, the length of the headband can be adjusted to adapt to users with different head circumferences, thereby improving the convenience and comfort of use. The earphone units 10 are respectively connected to the two ends of the headband in the length direction, and each earphone unit 10 includes an earphone housing 20, a speaker assembly 30, an earmuff assembly 40, and a battery 50.

[0025] The earphone housing 20 is connected to the headband, and the earmuff assembly 40 is connected to the earphone housing 20, and is used to cover the outside of the user's ear. The speaker assembly 30 is located in the earphone housing 20, and the speaker assembly 30 is arranged in the earphone housing 20. The speaker assembly 30 includes a speaker body 31 and a speaker shell 32. The speaker shell 32 is connected to the earphone housing 20, and the speaker body 31 is connected to the speaker shell 32. The surface of the speaker shell 32 facing away from the earmuff assembly 40 cooperates with the inner wall surface of the earphone housing 20 to form an installation cavity 20a.

[0026] Among them, the earphone housing 20 includes a cover shell 21 and an earphone back cover 22 connected to the rear side of the cover shell 21, and the earphone back cover 22 is connected to the cover shell 21 by gluing or screw fixing, and the speaker assembly 30 is arranged in the cover shell 21, so that the inner wall surface of the cover shell 21 and the earphone back cover 22 cooperates with the surface of the speaker housing 32 facing away from the earmuff assembly 40 to form an installation cavity 20a. It can be understood that the above structural form of the earphone housing 20 realizes the isolation of various components inside the earphone unit 10 from the external environment, achieving the effect of dustproof and waterproof. Moreover, in the case where the earphone housing 20 includes the cover shell 21 and the earphone back cover 22, the earphone unit 10 also has the advantage of being easy to disassemble and maintain. Of course, the cover shell 21 and the earphone back cover 22 of the earphone housing 20 can also be an integrated structure.

[0027] The earphone housing 20 may be made of metal (such as aluminum or other metals), which can improve the overall rigidity of the earphone housing 20 and avoid increasing the impact resistance of the earphone housing 20. At the same time, it can provide better protection for the components inside the earphone housing 20. It is understandable that the earphone housing 20 may also be made of other materials (such as plastic, etc.), which are easy to shape and low in cost. In addition, the cover 21 and the earphone back cover 22 in the earphone housing 20 may be made of the same material, such as metal or plastic, or they may be made of different materials, such as the cover 21 is made of metal, and the earphone back cover 22 is made of plastic.

[0028] like Figure 2 As shown, the speaker assembly 30 includes a speaker body 31 and a speaker shell 32. The speaker shell 32 is connected to the earphone housing 20. The speaker body 31 is connected to the speaker shell 32. To ensure its supporting strength, the speaker shell 32 can be made of a material with high strength, such as polyethylene (PE), polyvinyl chloride (PVC), polypropylene (PP) and ABS resin. Among them, the above-mentioned surface of the speaker shell 32 is formed with a first mounting surface 3211 and a second mounting surface 3212. The first mounting surface 3211 and the second mounting surface 3212 are arranged in a direction perpendicular to the thickness direction of the earphone unit 10, and at least one of the first mounting surface 3211 and the second mounting surface 3212 is arranged in a direction away from the other, and the distance between the earmuff assembly 40 is set to be smaller.

[0029] exist Figure 2 As shown in the example, the distance between the first mounting surface 3211 and the earmuff assembly 40 is set to be smaller in the direction away from the second mounting surface 3212, that is, the first mounting surface 3211 extends obliquely from the edge of the second mounting surface 3212 toward the earmuff assembly 40, that is, when the earphone unit 10 is regarded as a circular pancake, the first mounting surface 3211 and the second mounting surface 3212 are arranged in the radial direction of the entire earphone unit 10. It can be understood that the first mounting surface 3211 and the second mounting surface 3212 can also be spaced apart in the radial direction of the earphone unit 10, or the distance between the second mounting surface 3212 and the earmuff assembly 40 can be set to be smaller in the direction away from the first mounting surface 3211. Of course, when the first mounting surface 3211 extends obliquely from the edge of the second mounting surface 3212 toward the earmuff assembly 40, the structure of the earphone unit 10 is more compact and the volume is smaller.

[0030] Furthermore, the present application provides a battery 50 in each earphone unit 10. It is understandable that the capacity of the two batteries 50 can be comparable to the capacity of the single battery in the past. Undoubtedly, the present application provides two batteries 50 to maintain the original battery life, and the volume of each battery 50 is reduced accordingly compared to the previous single battery design. In an ideal state, each battery 50 in the present application will be half the volume of the battery in the previous design.

[0031] Please refer again Figure 2 , at least one earphone unit 10 is also provided with a circuit board 60. The circuit board 60 is electrically connected to the battery 50, and the circuit board 60 is connected to the second mounting surface 3212. The battery 50 and the circuit board 60 are jointly arranged in the mounting cavity 20a. The circuit board 60 can be one piece or two pieces. When the circuit board 60 is one piece, the circuit board 60 is the main control board. At this time, the circuit board 60 is arranged in one of the earphone units 10 and is electrically connected to the battery 50 in the earphone unit 10. The other earphone unit 10 and its built-in battery 50 are connected to the circuit board 60 through a wire and a headband cable. The circuit board 60 is one piece, which makes the overall cost of the earphone unit 10 lower. Of course, the circuit board 60 can also be two pieces, one of which is the main control board and the other is the adapter board. The two circuit boards 60 are respectively arranged in the two earphone units 10, and the two circuit boards 60 are also electrically connected through the wiring in the headband, and the signal control of the two earphone units 10 is realized through the circuit board 60 serving as the main control board. It can be understood that such a layout form makes the circuit design simpler and can also make the weight of the two earphone units 10 more balanced.

[0032] Since the first mounting surface 3211 extends obliquely from one side of the second mounting surface 3212 toward the earmuff assembly 40, and the battery 50 is connected to the first mounting surface 3211, and the circuit board 60 is mounted on the second mounting surface 3212, the back of the speaker housing 32 is obliquely extended toward the earmuff assembly 40 due to the first mounting surface 3211, so that the back of the speaker housing 32 forms a gradient mounting space in the thickness direction of the earphone unit 10, and the battery 50, because its volume is already small, can also be connected with the circuit board 60 to the diameter of the earphone unit 10. Arranged side by side upward, it can be seen that the structural layout of the earphone unit 10 of the present application is different from the previous design in which the battery and the circuit board are simply stacked in the thickness direction of the earphone unit. Since the battery 50 is installed in an offset manner and arranged side by side with the circuit board 60 in the radial direction of the earphone unit 10, the space in the installation cavity 20a can be fully utilized, so that the size of the earphone unit 10 in the thickness direction is relatively small, the thickness of the earphone housing 20 and the overall volume can be reduced, so that the headphone 1 is lighter and thinner, avoiding the bloated product shape, which is more convenient to wear and use.

[0033] After the battery 50 and the circuit board 60 are assembled, the circuit board 60 is at least partially located on the rear side of the battery 50 facing away from the earmuff assembly 40. In this way, the rear space of the battery 50 can be fully utilized during the installation of the circuit board 60, and the circuit board 60 can also stop the battery 50 in the direction of movement toward the rear side to prevent the battery 50 from detaching toward the rear side. It can be understood that since the first mounting surface 3211 is inclined relative to the second mounting surface 3212, the circuit board 60 and the battery 50 are located on two different mounting surfaces. Even if the two overlap in the front-to-back direction of the earphone unit 10, it is different from the previous design in which the circuit board 60 and the battery 50 are stacked on the same plane, so the thickness of the earphone unit 10 will not be increased.

[0034] In order to facilitate the assembly of the battery 50, the speaker housing 32 is further connected to a limiting member 322 at its back (see Figure 3 and Figure 4), the limiting member 322 is arranged at the edge of the first mounting surface 3211 and is enclosed with the first mounting surface 3211 to form a mounting groove 3221, and the battery 50 is embedded in the mounting groove 3221, and the battery 50 is stably fixed on the first mounting surface 3211. Among them, the limiting member 322 is a convex block structure, and there can be multiple limiting members 322, which are arranged around the outer periphery of the battery 50. In order to stably clamp the battery 50, the limiting member 322 and the battery 50 are interference fit. Of course, in order to fix the battery 50 on the first mounting surface 3211, it is also possible to use a snap or add a screw fit, etc., and the present application does not limit the fixing form of the battery 50. In order to further ensure that the connection of the battery 50 set on the first mounting surface 3211 is reliable and prevent the battery 50 from loosening, an adhesive layer (not marked) is also provided between the battery 50 and the first mounting surface 3211. The material of the adhesive layer can be double-sided tape, resin, etc.

[0035] For details, please refer to Figures 3 to 5 The speaker housing 32 includes a detachably connected speaker rear cover 321 and a speaker bracket 323. The speaker bracket 323 is connected to the earphone housing 20. The speaker rear cover 321 covers the side of the speaker bracket 323 facing away from the earmuff assembly 40. The speaker rear cover 321 has the above-mentioned first mounting surface 3211 and the second mounting surface 3212, and is enclosed with the speaker bracket 323 to form a receiving cavity 324 (see Figure 3 ), the speaker body 31 is arranged in the accommodating cavity 324. The speaker bracket 323 encloses the accommodating cavity 324 to isolate the speaker body 31 from other components in the earphone unit 10, so that the speaker body 31 can be well protected. In order to facilitate the positioning and assembly of the speaker body 31, the part of the speaker bracket 323 in the accommodating cavity 324 forms a limiting groove 3231 (see Figure 5 ), the speaker body 31 is embedded in the limiting groove 3231. This arrangement can prevent the speaker body 31 from being displaced or loosened due to the vibration generated when transmitting audio, thereby ensuring the smoothness and stability of the sound quality output. In order to further ensure the stability of the speaker body 31 installed on the speaker bracket 323, the installation method between the speaker body 31 and the speaker bracket 323 can also include a screw connection structure, a snap connection structure, etc., which is not limited in this application. In addition, with regard to the specific form of the speaker housing 32, in addition to the case where the speaker housing 32 is divided into two parts, the speaker back cover 321 and the speaker bracket 323, as shown in the figure, it can also be an integral structure. In this way, the speaker body 31 and the speaker bracket 323 can be fixed by screw connection, snap connection, etc.

[0036] like Figures 3 to 5As shown, in one embodiment of the present application, the speaker body 31 includes a sound outlet surface 311 facing the earmuff assembly 40. It can be understood that the speaker body 31 serves as a sound-emitting unit, and its basic components include an auxiliary system, a vibration system, and a magnetic circuit system. Among them. The auxiliary system is mainly a shell structure, the vibration system includes a diaphragm, a voice coil, etc., and the magnetic circuit system includes a magnetic yoke, a washer and other structures. In the auxiliary system, the front cover is pressed on the edge of the diaphragm of the vibration system. Here, the sound outlet surface 311 can be understood as the surface of the front cover facing the earmuff assembly 40, that is, the sound outlet surface 311 is as shown in FIG. Figure 4 The plane P shown. The first mounting surface 3211 is parallel to the sound outlet surface 311, so that when the first mounting surface 3211 of the speaker housing 32 is set to extend toward the earmuff assembly 40, it can be avoided that when the speaker body 31 is installed, the speaker body 31 is installed in an inclined posture to adapt to the layout of the battery 50.

[0037] Please refer to Figure 6 The earmuff assembly 40 includes an earmuff bracket 41 and an earmuff body 42, wherein the earmuff bracket 41 is connected to the speaker housing 32, specifically, the speaker bracket 323 is connected to the earmuff bracket 41, and the connection method can be through a snap connection or a screw connection. The earmuff bracket 41 is annular and the main body is a plate-like structure. The earmuff bracket 41 has a connection surface 411 facing the speaker housing 32, that is, the connection surface 411 is as follows Figure 4 In the plane S shown, the connecting surface 411 is arranged in parallel with the second mounting surface 3212, that is, the circuit board 60 installed on the second mounting surface 3212 is arranged in parallel with the connecting surface 411. In this way, the relative distance between the circuit board 60 and the connecting surface 411 in the front-to-back direction of the earphone unit 10 can be reduced, thereby reducing the thickness of the earphone housing 20 in the front-to-back direction of the earphone unit 10.

[0038] The earmuff body 42 is arranged on the side of the earmuff bracket 41 away from the connection surface 411, and is connected to the earmuff bracket 41. The connection method can be a fixed connection such as bonding, so as to prevent the earmuff body 42 from falling off. Of course, the connection can also be a detachable connection, such as a sleeve connection, a snap connection, etc. The user can replace the earmuff assembly 40 according to the maintenance needs or sound quality needs, meet the use needs of different users, have a wide range of applications, and good versatility. The earmuff body 42 is annular and surrounds the edge of the earmuff bracket 41. The earmuff assembly 40 is made of soft materials such as memory foam. When the user wears the headphone 1 of the present application, the earmuff body 42 can be in full and close contact with the wearer's auricle, so as to have a high noise resistance.

[0039] In one embodiment, the connecting surface 411 and the sound outlet surface 311 are arranged at an angle, that is, the plane S and the plane P are arranged at an angle as follows: Figure 4The angle α shown is set so that when the user wears the headphone 1 of the present application, the audio information transmitted by the headphone 1 maintains contact with the wearer's auricle through the earmuff assembly 40 and is output to the user's ear. At this time, the speaker shell 32 adaptively cooperates with the wearer's auricle to form a certain angle, so that it does not compress the wearer's auricle, reduces the discomfort caused by compressing the auricle when wearing, improves the wearer's comfort, and ensures the stable transmission of sound quality. The angle α between the connecting surface 411 and the sound output surface 311 should not be too small to ensure that the speaker housing 32 does not excessively squeeze the wearer's auricle. Of course, it should not be too large to avoid increasing the installation volume occupied by the speaker assembly 30 inside the earphone housing 20, thereby increasing the volume of the entire earphone unit 10. In addition, if the angle between the speaker body 31 and the user's auricle is too large, the audio will leak and reduce its sound output effect. Therefore, as shown in the example, the angle α should be greater than or equal to 5 degrees and less than or equal to 15 degrees, that is, the angle α can be 5 degrees, 6 degrees, 7 degrees...13 degrees, 14 degrees, 15 degrees or any value greater than or equal to 5 degrees and less than or equal to 15 degrees, and the present application does not impose any restrictions on this.

[0040] In order to match the shape of the speaker body 31, the speaker bracket 323 is circular in top view, and the speaker body 31 is embedded in the limiting groove 3231 of the speaker bracket 323. In order to adapt to the angle α between the connecting surface 411 of the earmuff bracket 41 and the sound outlet surface 311 of the speaker body 31, as shown in FIG. Figure 5 As shown, the front view of the speaker bracket 323 is in the shape of a hat, and the side of the speaker bracket 323 adjacent to the speaker body 31 also forms the above-mentioned angle α with the sound outlet surface 311. The speaker bracket 323 is also formed with a sound outlet hole 3232, which is connected to the accommodating cavity 324 and is arranged opposite to the sound outlet surface 311 of the speaker body. The audio emitted by the speaker body 31 can be transmitted to the outside of the earphone unit 10 through the sound outlet hole 3232.

[0041] The same or similar numbers in the drawings of this embodiment correspond to the same or similar parts; in the description of this application, it should be understood that if the terms "up", "down", "left", "right", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the drawings, it is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, the terms describing the positional relationship in the drawings are only used for illustrative purposes and cannot be understood as limitations on this application. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0042] The above are only preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A headset, characterized in that: include: Headband; and Two earphone units are respectively connected to the two ends of the headband, each of the earphone units comprises an earphone housing, a speaker assembly, an earmuff assembly and a battery; wherein at least one of the earphone units further comprises a circuit board; The earphone housing is connected to the headband; The earmuff assembly is connected to the earphone housing and is used to cover the outside of the ear of the user; The speaker assembly is arranged in the earphone housing, and the speaker assembly includes a speaker body and a speaker shell, the speaker shell is connected to the earphone housing, and the speaker body is connected to the speaker shell; The surface of the speaker housing facing away from the earmuff assembly cooperates with the inner wall surface of the earphone housing to form a mounting cavity, and the surface of the speaker housing is formed with a first mounting surface and a second mounting surface, the first mounting surface is connected to the battery, and the second mounting surface is connected to the circuit board; The first mounting surface and the second mounting surface are arranged in a direction perpendicular to the thickness direction of the earphone unit, and at least one of the first mounting surface and the second mounting surface is arranged to have a distance from the earmuff assembly that becomes smaller in a direction away from the other.

2. The headset according to claim 1, wherein: The first mounting surface is further connected to a limiting member, and the limiting member cooperates with the first mounting surface to enclose a mounting groove; The battery is embedded in the installation slot.

3. The headset according to claim 1, wherein: An adhesive layer is also provided between the battery and the first mounting surface.

4. The headset according to claim 1, wherein: The circuit board is at least partially located on a side of the battery facing away from the earmuff assembly.

5. The headset according to any one of claims 1 to 4, characterized in that: The speaker body includes a sound outlet surface facing the earmuff assembly; Wherein, the distance between the first mounting surface and the earmuff assembly is arranged to become smaller in a direction away from the second mounting surface, and the first mounting surface is parallel to the sound output surface.

6. The headset according to claim 5, characterized in that: The earmuff assembly comprises an earmuff bracket connected to the speaker housing, the earmuff bracket has a connection surface facing the speaker housing, and the connection surface is arranged at an angle to the sound output surface.

7. The headset according to claim 6, characterized in that: The included angle between the connecting surface and the sound output surface is greater than or equal to 5 degrees and less than or equal to 15 degrees.

8. The headset according to claim 6, wherein: The speaker housing comprises a detachably connected speaker back cover and a speaker bracket, wherein the speaker bracket is connected to the earphone housing, and the speaker back cover covers a side of the speaker bracket facing away from the earmuff assembly and encloses the speaker bracket to form a receiving cavity; The speaker body is disposed in the accommodating cavity, and the speaker back cover has the first mounting surface and the second mounting surface.

9. The headset according to claim 8, characterized in that The portion of the speaker bracket in the accommodating cavity forms a limiting groove, and the speaker body is embedded in the limiting groove.

10. The headset according to claim 6, wherein: The connecting surface is arranged parallel to the second mounting surface.

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