Earphone
By designing the speaker slot and resonance cavity in the headphones and assembling a specific type of microphone in the sealing kit, the amplification characteristics and structural adjustment of the resonance cavity are used to solve the problem of the headphones screaming, significantly improving the user experience and signal quality.
Patent Information
- Application Number
- CN202421636601.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-10
- Publication Date
- 2025-04-25
- Estimated Expiration
- 2034-07-10
AI Technical Summary
In the design of existing headphones, the sound pressure level is too high due to the close distance between the microphone and the speaker and the cavity resonance, which can easily cause signal distortion and howling, affecting the user experience.
A headset is designed to amplify the sound signal in a specific frequency range by setting the speaker slot and resonance cavity in the front case of the headset, and assembling a single feed back microphone and a single feed forward microphone in the sealing kit. By adjusting the structure of the sound pipeline and resonance cavity, the sound signal is attenuated to eliminate howling.
It effectively eliminates the whistling of the headphones, avoids damage to the user's hearing, improves the user experience, and significantly reduces the sound pressure level and reduces signal distortion through independent space design and structural adjustment.
Smart Images

Figure CN222802997U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of earphones, in particular to an earphone. Background Art
[0002] In order to achieve perfect sound and functions (for example, to achieve ANC, ENC, self-correction and debugging of assisted listening, etc.), the in-ear and semi-in-ear headphones, hearing aids, and hearing assistive devices currently on the market all have a microphone in front of the speaker responsible for feedback of the sound signal. The sound signal recorded by the microphone is converted into an electrical signal and then used by the algorithm to achieve the above functions. The most basic requirement for the electrical and sound signals in the algorithm is that they cannot be distorted. However, since the microphone is very close to the speaker, and the resonance caused by the cavity formed by the machine and the ear canal, it is very easy for the sound pressure level received by the microphone to reach more than 130DB. Currently, the AOP (maximum receivable sound pressure level) of almost all microphones is below 130DB, which makes the recorded signal distorted. In order to reduce the distortion, the output of the speaker has to be reduced, which greatly reduces the sound and the functions achieved by the algorithm.
[0003] In addition, the signal recorded by the microphone will be amplified with a certain gain and output to the speaker due to the needs of the algorithm. The microphone will then receive the sound signal emitted by the speaker, thus forming a loop. Although there will be losses in this loop, in general the gain will be greater than the loss, causing the speaker to howl. Once the earphones howl, it may cause damage to the user's hearing. This must be avoided when designing earphones. The generation of howling seriously affects the user's experience. Utility Model Content
[0004] The technical problem to be solved by the utility model is: to provide an earphone and to effectively solve the problem that earphone howling affects user experience.
[0005] In order to solve the above technical problems, the utility model adopts the following technical solutions:
[0006] The utility model proposes an earphone, comprising an earphone front shell and an earphone back cover which are detachably connected, and a speaker, a first microphone and a sealing kit arranged in the earphone front shell, wherein the earphone front shell is provided with a sound outlet channel and a sound collection pipe; the inner cavity of the earphone front shell is provided with a speaker groove and a resonance cavity, the speaker groove is provided with a first through hole, the first through hole is communicated with the sound outlet channel, the speaker is arranged in the speaker groove, and the sound outlet pipe of the speaker is located in the sound outlet channel; the resonance cavity is provided with a second through hole, the second through hole is communicated with the sound collection pipe; the sealing kit is arranged in the inner cavity of the earphone front shell, so that the speaker groove and the resonance cavity form two independent spaces; the sealing kit is provided with a mounting groove, the first microphone is arranged in the mounting groove, the mounting groove is provided with a third through hole, and the third through hole is communicated with the resonance cavity.
[0007] A PCB mainboard and a second microphone are arranged in the back cover of the earphone, and the speaker, the first microphone and the second microphone are respectively connected to the PCB mainboard.
[0008] Wherein, a step is provided in the resonance cavity, and one end of the sound collecting pipe extends into the resonance cavity and is located above the step.
[0009] Wherein, the step located in the resonance cavity and one end of the sound collecting pipe are provided with a beveled surface.
[0010] The first microphone is a single feed-back microphone, and the second microphone is a single feed-forward microphone.
[0011] Wherein, the diameter of the sound collecting pipe is 0.3-3mm.
[0012] Wherein, the beveled surface is circular or elliptical.
[0013] Wherein, the sealing kit is provided with a wire hole, and the speaker is connected to the PCB mainboard by a wire passing through the wire hole.
[0014] Among them, the earphone back cover is provided with a placement groove, the second microphone is arranged in the placement groove, and the placement groove is provided with a fourth through hole; the earphone back cover is provided with a wire hole for the earphone wire to pass through, and the earphone wire is connected to the PCB main board.
[0015] Wherein, the front shell of the earphone is provided with a silicone earmuff.
[0016] The beneficial effects of the utility model are:
[0017] The earphone provided by the utility model is provided with a speaker groove and a resonance cavity through the inner cavity of the front shell of the earphone, the speaker groove is provided with a first through hole, the first through hole is connected with the sound output channel, the speaker is arranged in the speaker groove, and the sound output tube of the speaker is located in the sound output channel; the resonance cavity is provided with a second through hole, and the second through hole is connected with the sound collection pipe; the sealing kit is arranged in the inner cavity of the front shell of the earphone, so that the speaker groove and the resonance cavity form two independent spaces; the sealing kit is provided with an installation groove, the first microphone is arranged in the installation groove, the installation groove is provided with a third through hole, and the third through hole is connected with the resonance cavity. Therefore, the first microphone is installed in the installation groove of the sealing kit, and the sound signal emitted by the speaker is radiated outward through the sound output channel. The first microphone can collect the sound signal emitted by the speaker through the sound collection pipe. The feedback sound signal enters the sound collection pipe and reaches the first microphone through the resonance cavity. Since the resonance cavity will amplify the sound signal within a certain frequency range, the amplified part of the sound signal will be in opposite phase with the original reflected sound signal (equivalent to one positive and one negative), the sound pressure level of this part of the sound signal will be significantly reduced, and the sound signal can be attenuated during the transmission process by adjusting the size of the sound collection pipe (diameter, length, and or the fillet and bevel at both ends, etc.) and the size of the resonance cavity. It can be adjusted to the frequency range that the user needs to reduce to eliminate the howling of the corresponding frequency, thereby effectively eliminating the howling of the headphones, avoiding damage to the hearing of the headphone users, and improving the user experience. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 It is an overall structural diagram of the earphone according to an embodiment of the utility model.
[0019] Figure 2 It is an exploded view of the overall structure of the earphone according to an embodiment of the present utility model.
[0020] Figure 3 It is a cross-sectional view of the earphone according to the embodiment of the utility model.
[0021] Figure 4 It is a front view of the earphone front shell of the earphone according to an embodiment of the utility model. DETAILED DESCRIPTION
[0022] The exemplary embodiments of the present application will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present application are shown in the accompanying drawings, it should be understood that the present application can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present application and to fully convey the scope of the present application to those skilled in the art.
[0023] It should be understood that the terms used in the text are only for the purpose of describing specific example embodiments, and are not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms "one", "an" and "said" as used in the text may also be meant to include plural forms. The terms "include", "comprise", "contain", and "have" are inclusive, and therefore specify the existence of stated features, steps, operations, elements and / or parts, but do not exclude the existence or addition of one or more other features, steps, operations, elements, parts, and / or combinations thereof. The method steps, processes, and operations described herein are not interpreted as necessarily requiring them to be performed in the specific order described or illustrated, unless the execution order is clearly indicated. It should also be understood that additional or alternative steps may be used.
[0024] Although the terms first, second, etc. can be used in the text to describe multiple elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms can only be used to distinguish an element, component, region, layer or section from another region, layer or section. Unless the context clearly indicates, terms such as "first", "second" and other numerical terms do not imply order or sequence when used in the text. Therefore, the elements, components, regions, layers or sections discussed below can be referred to as second elements, components, regions, layers or sections without departing from the teachings of the example embodiments.
[0025] For ease of description, spatial relative terms may be used herein to describe the relationship of one element or feature relative to another element or feature as shown in the figure, such as "inside", "outside", "inner side", "outer side", "below", "below", "above", "above", "front end", "rear side", etc. Such spatial relative terms are intended to include different orientations of the device in use or operation in addition to the orientation depicted in the figure. For example, if the device in the figure is turned over, the element described as "below other elements or features" or "below other elements or features" will then be oriented as "above other elements or features" or "above other elements or features". Therefore, the example term "below..." can include both upper and lower orientations. The device can be oriented otherwise (rotated 90 degrees or in other directions) and the spatial relative descriptors used in the text are interpreted accordingly.
[0026] In order to illustrate the technical solution of the present invention, specific embodiments are provided below for illustration.
[0027] Please refer to Figure 1-4As shown, the utility model relates to an earphone 100, comprising a detachably connected earphone front shell 10 and an earphone back cover 20, and a speaker 30, a first microphone 40 and a sealing kit 50 arranged in the earphone front shell, the earphone front shell 10 is provided with a sound outlet channel 11 and a sound collecting pipe 12; the inner cavity of the earphone front shell 10 is provided with a speaker groove 13 and a resonance cavity 14, the speaker groove 13 is provided with a first through hole 15, the first through hole 15 is connected to the sound outlet channel 11, the speaker 30 is arranged in the speaker groove 13, and the sound outlet pipe 31 of the speaker 30 is located in the sound outlet channel channel 11; the resonance cavity 14 is provided with a second through hole 16, and the second through hole 16 is communicated with the sound collecting duct 12; the sealing kit 50 is arranged in the inner cavity of the front shell 10 of the earphone, so that the speaker groove 13 and the resonance cavity 14 form two independent spaces; the sealing kit 50 is provided with a mounting groove 51, and the first microphone 40 is arranged in the mounting groove 51, without the interference of residual sound waves, so that the sound quality of the first microphone 40 is further improved; the mounting groove 51 is provided with a third through hole 52, and the third through hole 52 is communicated with the resonance cavity 14. Therefore, the first microphone 40 is assembled in the mounting groove 51 of the sealing kit 50, and the sound signal emitted by the speaker 30 is radiated outward through the sound output channel 11. The first microphone 40 can collect the sound signal emitted by the speaker 30 through the sound collecting pipe 12. The feedback sound signal enters the sound collecting pipe 12 and reaches the first microphone 40 through the resonance cavity 14. Since the resonance cavity 14 will amplify the sound signal within a certain frequency range, but the amplified part of the sound signal will be in opposite phase to the original reflected original sound signal (equivalent to one positive and one negative), the sound pressure level of this part of the sound signal will be significantly reduced, and the sound signal can be attenuated during the transmission process by adjusting the size of the sound collecting pipe 12 (diameter, length, and or the rounded corners and bevels at both ends, etc.) and the size of the resonance cavity, and can be adjusted to the frequency range that the user needs to reduce, thereby effectively eliminating the howling of the earphones, avoiding damage to the hearing of the earphone users, and improving the user experience.
[0028] In the embodiment of the utility model, a PCB mainboard 21 and a second microphone 22 are disposed in the earphone back cover 20 , and the speaker 30 , the first microphone 40 and the second microphone 22 are respectively connected to the PCB mainboard 21 .
[0029] In the embodiment of the utility model, a step 17 is provided in the resonance cavity 14 , and one end of the sound collecting pipe 12 extends into the resonance cavity 14 and is located above the step 17 .
[0030] In the embodiment of the utility model, the step 17 located in the resonance cavity 14 and one end of the sound collecting pipe 12 are provided with a bevel 18; the difference in cross-sectional area of the bevel 18 causes the sound signal to be attenuated during the transmission process, and different frequencies can be suppressed to eliminate the howling of the corresponding frequencies, which can effectively prevent the generation of howling.
[0031] In the embodiment of the utility model, the first microphone 40 is a single feed-back microphone, and the second microphone 22 is a single feed-forward microphone. The first microphone 40 is used to monitor environmental noise, and the speed of processing noise is faster, but it is difficult to process the missed noise; while the second microphone 22 detects noise and generates an anti-phase signal through a filter circuit, and the anti-phase signal and the noise signal are offset at the eardrum, thereby reducing the noise level heard by the human ear. The second microphone 22 processes noise more slowly, but can process the missed noise well.
[0032] In the embodiment of the utility model, the diameter of the sound collecting pipe 12 is 0.3-3mm. The sound signal can be attenuated during the transmission process by adjusting the size of the sound collecting pipe 12 (diameter, length, and / or rounded corners or bevels at both ends, etc.). Different frequencies can be suppressed to eliminate howling of corresponding frequencies, and the conducted energy can be weakened to prevent howling.
[0033] In the embodiment of the present invention, the chamfered surface 18 is circular or elliptical.
[0034] In the embodiment of the utility model, the sealing kit 50 is provided with a wire hole 53 , so that the speaker 30 can be connected to the PCB main board 21 by passing a wire through the wire hole 53 .
[0035] In the embodiment of the utility model, a placement groove 23 is provided in the earphone back cover 20, the second microphone 22 is arranged in the placement groove 23, and the placement groove 23 is provided with a fourth through hole 24; the earphone back cover 20 is provided with a wire hole 25 for the earphone wire 26 to pass through, and the earphone wire 26 is connected to the PCB main board 21.
[0036] In the embodiment of the utility model, the front shell 10 of the earphone is provided with a silicone earmuff (not shown in the figure). By providing the silicone earmuff, the comfort when inserting into the ear canal is improved, and the wearing comfort is further improved.
[0037] The earphone provided by the utility model is provided with a speaker groove and a resonance cavity through the inner cavity of the front shell of the earphone, the speaker groove is provided with a first through hole, the first through hole is connected with the sound output channel, the speaker is arranged in the speaker groove, and the sound output tube of the speaker is located in the sound output channel; the resonance cavity is provided with a second through hole, and the second through hole is connected with the sound collecting pipe; the sealing kit is arranged in the inner cavity of the front shell of the earphone, so that the speaker groove and the resonance cavity form two independent spaces; the sealing kit is provided with an installation groove, and the first microphone is arranged in the installation groove, without the interference of residual sound waves, so that the sound quality of the first microphone is greatly improved; the installation groove is provided with a third through hole, and the third through hole is connected with the resonance cavity. Therefore, the first microphone is installed in the installation groove of the sealing kit, and the sound signal emitted by the speaker is radiated outward through the sound output channel. The first microphone can collect the sound signal emitted by the speaker through the sound collection pipe. The feedback sound signal enters the sound collection pipe and reaches the first microphone through the resonance cavity. Since the resonance cavity will amplify the sound signal within a certain frequency range, the amplified part of the sound signal will be in opposite phase with the original reflected original sound signal (equivalent to one positive and one negative), so that the sound pressure level of this part of the sound signal will be significantly reduced, and the sound signal can be attenuated during the transmission process by adjusting the size of the sound collection pipe (diameter, length, and or the fillet and bevel at both ends, etc.) and the size of the resonance cavity, and can be adjusted to the frequency range that the user needs to reduce, thereby effectively eliminating the howling of the earphones, avoiding damage to the hearing of the earphone users, and improving the user experience.
[0038] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and the scope of protection of the present invention is defined by the appended claims and their equivalents.
Claims
1. A headset, characterized in that: It includes a detachably connected earphone front shell and an earphone back cover, and a speaker, a first microphone and a sealing kit arranged in the earphone front shell, the earphone front shell is provided with a sound output channel and a sound collection pipe; the inner cavity of the earphone front shell is provided with a speaker groove and a resonance cavity, the speaker groove is provided with a first through hole, the first through hole is connected with the sound output channel, the speaker is arranged in the speaker groove, and the sound output pipe of the speaker is located in the sound output channel; the resonance cavity is provided with a second through hole, and the second through hole is connected with the sound collection pipe; the sealing kit is arranged in the inner cavity of the earphone front shell, so that the speaker groove and the resonance cavity form two independent spaces; the sealing kit is provided with a mounting groove, the first microphone is arranged in the mounting groove, the mounting groove is provided with a third through hole, and the third through hole is connected with the resonance cavity.
2. The headset according to claim 1, characterized in that: A PCB mainboard and a second microphone are arranged in the earphone back cover, and the speaker, the first microphone and the second microphone are respectively connected to the PCB mainboard.
3. The earphone according to claim 1, wherein: A step is arranged in the resonance cavity, and one end of the sound collecting pipe extends into the resonance cavity and is located above the step.
4. The earphone according to claim 3, characterized in that: The step located in the resonance cavity and one end of the sound collecting pipe are provided with an inclined surface.
5. The earphone according to claim 2, characterized in that: The first microphone is a single feed-back microphone, and the second microphone is a single feed-forward microphone.
6. The earphone according to claim 1, wherein: The diameter of the sound collecting pipe is 0.3-3 mm.
7. The earphone according to claim 4, characterized in that: The beveled surface is circular or elliptical.
8. The earphone according to claim 2, characterized in that: The sealing kit is provided with a wire hole, and the speaker is connected to the PCB main board by a wire passing through the wire hole.
9. The earphone according to claim 2, characterized in that: A placement slot is provided in the earphone back cover, the second microphone is arranged in the placement slot, and the placement slot is provided with a fourth through hole; the earphone back cover is provided with a wire hole for the earphone wire to pass through, and the earphone wire is connected to the PCB main board.
10. The earphone according to claim 1, characterized in that: The front shell of the earphone is provided with a silicone earmuff.