Low-stress metallized plastic current collector

Abstract

The utility model relates to the technical field of batteries, in particular to a low-stress metallized plastic current collector, which comprises a base material layer and a metal layer, the base material layer is provided with an upper surface and a lower surface, and at least one of the upper surface and the lower surface is provided with a laminated metal layer; wherein an infrared radiation layer is arranged between the adjacent metal layers, and the metal layers are not easy to separate through the infrared radiation layer; an infrared radiation layer is arranged on the outermost side of the metal layer; in the infrared heat radiation treatment process, atoms in the infrared radiation layer exchange energy through lattice vibration, some dislocations are healed, and internal stress is reduced; at the same time, when atoms in the infrared radiation layer are diffused on the surface, vacancies, gaps and other defects can be eliminated, the volume can be contracted to release residual internal stress, the binding force between the infrared radiation layer and the adjacent conductive layer is increased, and the problem of metal layer separation caused by stress is overcome.

Description

Technical Field

[0001] The utility model relates to the technical field of batteries, in particular to a low-stress metallized plastic current collector. Background Art

[0002] Metallized plastic current collectors are usually prepared by magnetron sputtering, evaporation plating, water electroplating and other processes when preparing the metal conductive layer, and the generation of film stress is a common phenomenon in the process of film deposition. The existence of film stress will affect the microstructure and properties of the film, such as the electrical and mechanical physical properties of the film, and also affect the bonding degree between the film and the base material and the basic properties of the base material.

[0003] The metallized plastic current collector obtained by setting a conductive layer on the surface of a low-density polymer film can effectively reduce the density of the lithium-ion battery current collector and improve the weight energy density of the lithium-ion battery. However, the adhesion between the conductive layer and the polymer film is low, and the surface conductive layer of the metallized plastic current collector may fall off during the processing of the pole piece and the life cycle of the lithium-ion battery, which seriously affects the cycle life and high-temperature storage performance of the lithium-ion battery.

[0004] Therefore, how to reduce the stress between metal layers is a technical problem that needs to be solved urgently in this field. Utility Model Content

[0005] In order to solve the technical problems mentioned in the background technology, the utility model provides a low-stress metallized plastic current collector to solve the problem that the metal layer in the existing current collector is easy to separate.

[0006] In the first aspect, the utility model provides a low-stress metallized plastic current collector, comprising a substrate layer and a metal layer, wherein the substrate layer has an upper surface and a lower surface, and at least one of the upper surface and the lower surface is provided with a laminated metal layer; wherein an infrared radiation layer is provided between adjacent metal layers, and the infrared radiation layer makes the metal layers difficult to separate; and an infrared radiation layer is provided on the outermost side of the metal layer.

[0007] Furthermore, the substrate layer is any one of a biaxially oriented polypropylene film, a cast polypropylene film, a polyethylene terephthalate film, a polyimide film, and a polyethylene naphthalate film.

[0008] Furthermore, the thickness of the substrate layer is 3-20 μm.

[0009] Furthermore, the metal layer is any one or more combinations of aluminum, copper, nickel, titanium, silver, gold, cobalt, chromium, molybdenum, tungsten, and stainless steel.

[0010] Furthermore, the thickness of the metal layer is 50 nm to 1 μm.

[0011] Furthermore, the metal layer is formed by evaporation or magnetron sputtering.

[0012] Furthermore, the infrared radiation layer is any one or more combinations of aluminum, copper, nickel, titanium, silver, gold, cobalt, chromium, molybdenum, tungsten, and stainless steel.

[0013] Furthermore, the infrared radiation layer has a thickness of 50 nm to 1 μm.

[0014] Furthermore, the infrared radiation layer is attached to the metal layer by evaporation or magnetron sputtering and then formed by infrared radiation.

[0015] The beneficial effect of the utility model is that the low-stress metallized plastic current collector of the utility model utilizes infrared thermal radiation technology to convert infrared light energy into thermal energy, thereby realizing heat treatment of the infrared radiation layer. During the infrared thermal radiation treatment process, atoms in the infrared radiation layer exchange energy through lattice vibration, heal some dislocations, and reduce internal stress; at the same time, when atoms in the infrared radiation layer diffuse on the surface, defects such as vacancies and gaps therein are eliminated, and the volume can be contracted to release residual internal stress, thereby increasing the bonding force with the adjacent conductive layer and overcoming the problem of metal layer separation caused by stress.

[0016] Other features and advantages of the utility model will be described in the following description, and partly become apparent from the description, or understood by practicing the utility model. The purpose and other advantages of the utility model are realized and obtained by the structures particularly pointed out in the description and the drawings.

[0017] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 A schematic structural diagram of a low-stress metallized plastic current collector according to some embodiments is shown.

[0020] In the figure:

[0021] Base material layer 1, metal layer 2, infrared radiation layer 3. DETAILED DESCRIPTION

[0022] In order to make the purpose, technical solution and advantages of the embodiments of the utility model clearer, the technical solution of the utility model will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0023] like Figure 1 As shown, at least one embodiment provides a low-stress metallized plastic current collector, including a substrate layer and a metal layer, wherein the substrate layer has an upper surface and a lower surface, and at least one of the upper surface and the lower surface is provided with a laminated metal layer; wherein an infrared radiation layer is provided between adjacent metal layers, and the infrared radiation layer makes the metal layers difficult to separate; and an infrared radiation layer is provided on the outermost side of the metal layer.

[0024] Specifically, the number of metal layers and infrared radiation layers is 1 to 20, preferably 1, 2, 3, 5, 7, 9, 15, or 20. When the number of layers is 1, the infrared radiation layer is disposed outside the metal layer.

[0025] Specifically, the substrate layer is any one of a biaxially oriented polypropylene film, a cast polypropylene film, a polyethylene terephthalate film, a polyimide film, and a polyethylene naphthalate film.

[0026] Specifically, the thickness of the substrate layer is 3-20 μm, preferably 3, 5, 7, 10, 15, or 20 μm.

[0027] Specifically, the metal layer is any one or more combinations of aluminum, copper, nickel, titanium, silver, gold, cobalt, chromium, molybdenum, tungsten, and stainless steel.

[0028] Specifically, the thickness of the metal layer is 50 nm to 1 μm, preferably 50 nm, 100 nm, 200 nm, 500 nm, 800 nm, or 1 μm.

[0029] Specifically, the metal layer is formed by evaporation or magnetron sputtering.

[0030] Specifically, the infrared radiation layer is any one or more combinations of aluminum, copper, nickel, titanium, silver, gold, cobalt, chromium, molybdenum, tungsten, and stainless steel.

[0031] Specifically, the infrared radiation layer has a thickness of 50 nm to 1 μm, preferably 50 nm, 100 nm, 200 nm, 500 nm, 800 nm, and 1 μm. In order to improve the bonding strength, the infrared radiation layer may be thicker than the metal layer.

[0032] Specifically, the infrared radiation layer is attached to the metal layer by evaporation or magnetron sputtering and then formed by infrared radiation.

[0033] In summary, the low-stress metallized plastic current collector of the utility model utilizes infrared thermal radiation technology to convert infrared light energy into thermal energy, thereby realizing heat treatment of the infrared radiation layer. During the infrared thermal radiation treatment process, the atoms in the infrared radiation layer exchange energy through lattice vibration, heal some dislocations, and reduce internal stress; at the same time, when the atoms in the infrared radiation layer diffuse on the surface, defects such as vacancies and gaps will be eliminated, and the volume can be shrunk to release the residual internal stress, thereby increasing the bonding force with the adjacent conductive layer and overcoming the problem of metal layer separation caused by stress.

[0034] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0035] Based on the above ideal embodiments of the utility model, the relevant staff can make various changes and modifications without deviating from the technical concept of the utility model through the above description. The technical scope of the utility model is not limited to the content of the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A low stress metallized plastic current collector, characterized in that: The invention comprises a substrate layer and a metal layer, wherein the substrate layer has an upper surface and a lower surface, and at least one of the upper surface and the lower surface is provided with a laminated metal layer; An infrared radiation layer is provided between the adjacent metal layers, so that the metal layers are not easily separated by the infrared radiation layer; and An infrared radiation layer is disposed on the outermost side of the metal layer; The infrared radiation layer is attached to the metal layer by evaporation or magnetron sputtering and then formed by infrared radiation.

2. The low stress metallized plastic current collector according to claim 1, characterized in that: The substrate layer is any one of a biaxially oriented polypropylene film, a cast polypropylene film, a polyethylene terephthalate film, a polyimide film, and a polyethylene naphthalate film.

3. The low stress metallized plastic current collector according to claim 1, characterized in that: The thickness of the substrate layer is 3-20 μm.

4. The low stress metallized plastic current collector according to claim 1, characterized in that: The metal layer is any one of aluminum, copper, nickel, titanium, silver, gold, cobalt, chromium, molybdenum, tungsten and stainless steel.

5. The low stress metallized plastic current collector according to claim 1, characterized in that: The thickness of the metal layer is 50 nm to 1 μm.

6. The low stress metallized plastic current collector according to claim 1, characterized in that: The metal layer is formed by evaporation or magnetron sputtering.

7. The low stress metallized plastic current collector according to claim 1, characterized in that: The infrared radiation layer is any one of aluminum, copper, nickel, titanium, silver, gold, cobalt, chromium, molybdenum, tungsten and stainless steel.

8. The low stress metallized plastic current collector according to claim 1, characterized in that: The infrared radiation layer has a thickness of 50 nm to 1 μm.

Images