Atomizing element and atomizer

Abstract

The utility model discloses an atomizing element and an atomizer. The atomizing element comprises a first base body, a heating piece, an electrode piece and a second base body. A first through hole is formed in the first base body, a second through hole is formed in the second base body, and the first through hole is in fluid communication with the second through hole; the first base body and the second base body are arranged in a stacked mode, the heating piece and the electrode piece are embedded between the first base body and the second base body, and the heating piece is used for heating the atomization base body into aerosol; a slot is further formed between the first base body and the second base body, at least part of the structure of the slot is communicated with the electrode piece, and the conductive electrode is inserted into the slot so as to be electrically connected with the electrode piece. Therefore, the conductive electrode supplies power to the heating piece through the electrode piece, so that the heating piece can heat the atomization substrate flowing through the first through hole and the second through hole into aerosol, direct contact between the heating piece and the atomization substrate is avoided, the heating piece is not prone to oxidation or metal migration, and the heating efficiency of the heating piece on the atomization substrate is improved.

Description

Technical Field

[0001] The present application relates to the field of electronic atomization technology, and in particular to an atomization element and an atomizer. Background Art

[0002] The atomizing element is the core component of the nebulizer. The atomizing element is used to heat the atomizing matrix in the nebulizer to turn it into a mist aerosol.

[0003] In the related art, a metal heating element is used in the atomizing element to directly heat and atomize the atomizing matrix, and the metal heating element is in direct contact with the atomizing matrix. Due to the high temperature during the heating process and the complexity of the atomizing matrix components, the metal heating element is prone to oxidation or metal migration, resulting in a decrease in heating efficiency. Utility Model Content

[0004] The present application provides an atomizing element and an atomizer, which are used to solve the problem that metal heating elements are prone to oxidation or metal migration, resulting in reduced heating efficiency.

[0005] In order to solve the above technical problems, this application is implemented as follows:

[0006] In one embodiment, the embodiment of the present application proposes an atomization element, comprising: a first substrate, a heating element, an electrode element and a second substrate; a first through hole is provided on the first substrate, a second through hole is provided on the second substrate, and the first through hole is fluidically connected to the second through hole; the first substrate and the second substrate are stacked, the heating element and the electrode element are embedded between the first substrate and the second substrate, and the heating element is used to heat the atomization matrix into an aerosol; a slot is also provided between the first substrate and the second substrate, at least part of the structure of the slot is connected to the electrode element, and the slot is used for inserting a conductive electrode to be electrically connected to the electrode element.

[0007] In one embodiment, a first groove and two second grooves are provided on a side of the first substrate close to the second substrate; the two second grooves are arranged at intervals, the first groove is provided between the two second grooves, and the first groove is respectively connected to the two second grooves; the heat generating element is provided in the first groove, and the electrode element is provided in the two second grooves.

[0008] In one embodiment, the heat generating element is a metal layer deposited in the first groove, and the electrode element is a metal layer deposited in the second groove.

[0009] In one embodiment, the heating element includes at least two sub-heating segments, the first through holes are arranged in a plurality of rows, and the first through holes in each row are arranged side by side with at least one of the sub-heating segments.

[0010] In one embodiment, a protective layer is provided on a side of the heating element close to the second substrate, and the protective layer is used to isolate the heating element from the atomizing substrate.

[0011] In one embodiment, the first substrate is a silicon-based substrate, the second substrate is a glass substrate, and the first substrate and the second substrate are fixedly connected together by anodic bonding.

[0012] In one embodiment, the present application also provides a nebulizer, comprising the atomizing element described in any one of the above embodiments, and further comprising a shell and a accommodating chamber and an atomizing chamber arranged in the shell; the accommodating chamber is used to store the atomizing matrix; the atomizing element connects the atomizing chamber and the accommodating chamber through the first through hole and the second through hole.

[0013] In one embodiment, in the atomizing element, the first substrate is a silicon-based substrate, the second substrate is a glass substrate, the second substrate is arranged toward the accommodating cavity, and the first substrate is arranged toward the atomizing cavity.

[0014] In one embodiment, the atomizer further includes a conductive electrode, which is at least partially inserted into the slot and electrically connected to the electrode member.

[0015] In one embodiment, the shell is provided with an air inlet and an air outlet, the air inlet is connected to the atomization chamber and is used for air intake of the atomization chamber, and the shell is also provided with an air guide, one end of the air guide is connected to the atomization chamber, and the other end of the air guide is connected to the air outlet.

[0016] According to the atomizing element of the above embodiment, a first substrate and a second substrate are stacked, a first through hole is provided on the first substrate, a second through hole is provided on the second substrate, the first through hole is fluidly connected to the second through hole, a heating element and an electrode element are embedded between the first substrate and the second substrate, the electrode element and the heating element are connected, and a slot is provided for the conductive electrode to be inserted to communicate with the electrode element. In this way, the conductive electrode supplies power to the heating element through the electrode element, so that the heating element heats the atomized substrate flowing through the first through hole and the second through hole into an aerosol, avoiding direct contact between the heating element and the atomized substrate. Therefore, the heating element is not prone to oxidation or metal migration, which is conducive to improving the heating efficiency of the heating element on the atomized substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A schematic diagram of the structure of an atomizing element in an embodiment;

[0018] Figure 2 is a schematic structural diagram of a first substrate in an embodiment;

[0019] Figure 3 This is a schematic diagram of the structure of a heating element in an embodiment;

[0020] Figure 4 is a schematic diagram of the structure of an electrode component in an embodiment;

[0021] Figure 5 This is a schematic diagram of the structure of a protective layer in an embodiment;

[0022] Figure 6 A schematic diagram of the structure of an atomizer in an embodiment;

[0023] Figure 7 A cross-sectional view of an atomizer in one embodiment;

[0024] Figure 8 is another cross-sectional view of an atomizer in one embodiment;

[0025] Fig. 9 An explosion diagram of an atomizer in one embodiment;

[0026] Fig.10 A flowchart of a method for preparing an atomizing element provided in an embodiment;

[0027] Fig.11 One of the schematic diagrams of a preparation process of an atomizing element provided in an embodiment;

[0028] Fig.12 The second schematic diagram of a preparation process of an atomizing element provided in an embodiment;

[0029] Fig.13 The third schematic diagram of a preparation process of an atomizing element provided in an embodiment;

[0030] Fig.14 The fourth schematic diagram of a preparation process of an atomizing element provided in an embodiment;

[0031] Fig.15 FIG5 is a fifth schematic diagram of a preparation process of an atomizing element provided in an embodiment;

[0032] Fig.16 The sixth schematic diagram of a preparation process of an atomizing element provided in an embodiment;

[0033] Fig.17 FIG7 is a seventh schematic diagram of a preparation process of an atomizing element provided in an embodiment;

[0034] Fig.18 FIG8 is a schematic diagram of a preparation process of an atomizing element provided in an embodiment;

[0035] Fig.19The ninth schematic diagram is a process for preparing an atomizing element provided in an embodiment.

[0036] The reference numerals are as follows:

[0037] 1-atomizing element; 2-first substrate; 3-second substrate; 4-through hole; 5-first groove; 6-second groove; 7-heating element; 8-electrode element; 9-protective layer; 10-electrode hole; 11-slot; 12-shell; 13-first shell; 14-second shell; 15-accommodating chamber; 16-bracket; 17-atomizing chamber; 18-sealing element; 19-conductive electrode; 20-air inlet; 21-liquid storage tank; 22-air outlet; 23-air guide; 24-first surface; 41-first through hole; 42-second through hole; 71-sub-heating section; 81-first electrode element; 82-second electrode element. DETAILED DESCRIPTION

[0038] The present application is further described in detail below by specific embodiments in conjunction with the accompanying drawings. Wherein similar elements in different embodiments adopt associated similar element numbers. In the following embodiments, many detailed descriptions are intended to enable the present application to be better understood. However, those skilled in the art can easily recognize that some of the features can be omitted in different situations, or can be replaced by other elements, materials, and methods. In some cases, some operations related to the present application are not shown or described in the specification, in order to avoid the core part of the present application being overwhelmed by too much description, and for those skilled in the art, it is not necessary to describe these related operations in detail, and they can fully understand the related operations based on the description in the specification and the general technical knowledge in the art.

[0039] In addition, the features, operations or characteristics described in the specification can be combined in any appropriate manner to form various implementations. At the same time, the steps or actions in the method description can also be interchanged or adjusted in a manner that is obvious to those skilled in the art. Therefore, the various sequences in the specification and the drawings are only for the purpose of clearly describing a certain embodiment and are not meant to be a required sequence, unless otherwise specified that a certain sequence must be followed.

[0040] The serial numbers of the components in this document, such as "first", "second", etc., are only used to distinguish the objects described and do not have any order or technical meaning. The "connection" and "coupling" mentioned in this application, unless otherwise specified, include direct and indirect connections (couplings).

[0041] The embodiment of the present application provides an atomizing element that can be used to convert an atomized matrix into an aerosol. The atomizing element provided in the embodiment of the present application can be a heater based on a microelectromechanical system (MEMS). MEMS is based on microelectronics, micromechanics and materials science to study, design and manufacture micro devices with specific functions, including microstructure devices, microsensors, microactuators, micromechanical optical devices and microsystems. The MEMS processing technology was developed on the basis of traditional microelectronics processing technology (also known as integrated circuit IC technology). Later, some unique technologies for making micromachines were developed. These unique technologies are combined with conventional integrated circuit processes to realize MEMS. These technologies are collectively referred to as micromachining technology.

[0042] In one embodiment, the present application proposes an atomization element 1, comprising: a first substrate 2, a heating element 7, an electrode element 8 and a second substrate 3; a first through hole 41 is provided on the first substrate 2, and a second through hole 42 is provided on the second substrate 3, and the first through hole 41 is fluidically connected to the second through hole 42; the first substrate 2 and the second substrate 3 are stacked, the heating element 7 and the electrode element 8 are embedded between the first substrate 2 and the second substrate 3, and the heating element 7 is used to heat the atomization matrix into an aerosol; a slot 11 is also provided between the first substrate 2 and the second substrate 3, and at least part of the structure of the slot 11 is connected to the electrode element 8, and the slot 11 is used for inserting a conductive electrode 19 to electrically connect with the electrode element 8.

[0043] In the embodiments of the present application, Figures 1 to 4 As shown, by stacking the first substrate 2 and the second substrate 3, a first through hole 41 is provided on the first substrate 2, and a second through hole 42 is provided on the second substrate 3, the first through hole 41 is fluidically connected with the second through hole 42, the heating element 7 and the electrode element 8 are embedded between the first substrate 2 and the second substrate 3, the electrode element 8 is connected to the heating element 7, and the slot 11 is for the conductive electrode 19 to be inserted to communicate with the electrode element 8. In this way, the conductive electrode 19 supplies power to the heating element 7 through the electrode element 8, so that the heating element 7 heats the atomized substrate flowing through the first through hole 41 and the second through hole 42 into an aerosol, avoiding direct contact between the heating element 7 and the atomized substrate, so that the heating element 7 is not prone to oxidation or metal migration, which is conducive to improving the heating efficiency of the heating element 7 on the atomized substrate and improving the reliability and service life of the atomizing element 1.

[0044] In some embodiments, the first through hole 41 is provided in a plurality, and the plurality of first through holes 41 are arranged in rows at intervals. Thus, by arranging the plurality of first through holes 41 in rows at intervals, the first through holes 41 arranged in rows at intervals can achieve dispersion of the atomized matrix and improve the uniformity of heated atomization. Similarly, the second through holes 42 are also provided in a plurality, and the plurality of second through holes 42 are arranged in rows at intervals, and the plurality of second through holes 42 are connected to the plurality of first through holes 41 in a one-to-one correspondence to form a through hole 4.

[0045] In some embodiments, the first through hole 41 and the second through hole 42 can serve as a guide structure and a storage structure for the atomized matrix, and are used to introduce the atomized matrix. Since the apertures of the first through hole 41 and the second through hole 42 are very small, part of the atomized matrix can be locked in the first through hole 41 and the second through hole 42 by means of capillary force, while the other part of the atomized matrix is ​​atomized into an aerosol under the heating of the heating element 7, and the aerosol is discharged out of the atomizing element 1 through the first through hole 41 and the second through hole 42.

[0046] In some embodiments, the first through hole 41 and the second through hole 42 can be designed to be circular, elliptical, polygonal, etc. The aperture size of the first through hole 41 and the second through hole 42 can be selected according to the heating power of the heating element 7. Of course, the first through hole 41 and the second through hole 42 can also be arranged in other ways besides being spaced in rows, such as being arranged radially.

[0047] In some embodiments, Fig.13 and Fig.19 As shown, if the heating element 7 does not include a structure located in the second groove 6, the depth of the second groove 6 is greater than the thickness of the first electrode member 81 or the second electrode member 82; if at least part of the structure of the heating element 7 is located in the second groove 6, and the part is located on the side of the first electrode member 81 or the second electrode member 82 close to the first substrate, the depth of the second groove 6 is greater than the sum of the thicknesses of the heating element 7 and the first electrode member 81 or the depth of the second groove 6 is greater than the sum of the thicknesses of the heating element 7 and the second electrode member 82. In this way, a gap is also formed between the second groove 6 and the second substrate 3, and the gap is a slot 11. In this way, the conductive electrode 19 is inserted into the space between the second groove 6 and the second substrate 3, which is conducive to simplifying the preparation process of the atomizing element 1.

[0048] In some embodiments, if the heating element 7 does not include a structure located in the second groove 6, the depth of the second groove 6 is equal to the thickness of the first electrode member 81 or the second electrode member 82; if at least part of the structure of the heating element 7 is located in the second groove 6, and the part is located on the side of the first electrode member 81 or the second electrode member 82 close to the first substrate, the depth of the second groove 6 is equal to the sum of the thicknesses of the heating element 7 and the first electrode member 81 or the depth of the second groove 6 is equal to the sum of the thicknesses of the heating element 7 and the second electrode member 82. In this way, a slot 11 can be provided in the second substrate 3 at a position corresponding to the first electrode member 81 or the second electrode member 82, and the depth and thickness of the slot 11 can be selected according to the length and thickness of the conductive electrode 19, and the present application does not limit this.

[0049] An embodiment, such as Figures 2 to 4As shown, a first groove 5 and two second grooves 6 are provided on one side of the first substrate 2 close to the second substrate 3; the two second grooves 6 are arranged at intervals, the first groove 5 is arranged between the two second grooves 6, and the first groove 5 is connected to the two second grooves 6 respectively; the heating element 7 is arranged in the first groove 5, and the electrode element 8 is arranged in the two second grooves 6.

[0050] In the embodiment of the present application, the heating element 7 is arranged in the first groove 5, the first groove 5 is arranged opposite to the first through hole 41, and the electrode element 8 is arranged in the two second grooves 6. In this way, by setting the first groove 5, the heating element 7 is embedded in the first groove 5 of the first substrate 2, reducing the direct contact between the heating element 7 and the atomizing matrix, so that the heating element 7 is not easily oxidized or metal migrated.

[0051] In some embodiments, Figure 2 As shown, the two second grooves 6 are arranged in a strip shape, the two second grooves 6 are arranged in parallel and spaced apart, and the two ends of the first groove 5 are respectively connected to the two second grooves 6. Of course, the two second grooves 6 can also be arranged in other shapes such as a circle or a trapezoid, and the two second grooves 6 can also be arranged non-parallel, which is not limited in the embodiment of the present application.

[0052] In some embodiments, Figures 2 to 4 As shown, when the heating element 7 is energized with an external power source through the electrode element 8, the heating element 7 can heat the atomized matrix flowing through the first through hole 41, and the hole wall of the first through hole 41 can heat the atomized matrix in the hole to convert it into an aerosol, thereby avoiding the problem of reduced heating efficiency and contamination of the smoke oil components caused by the atomized matrix contacting the heating element 7 or the electrode element 8 during the atomization process.

[0053] In some embodiments, the design of the first groove 5 can facilitate the positioning of the heat generating element 7 during preparation, which is beneficial to improving the stability of the heat generating element 7 , and can also be applied to the deposition process of the heat generating element 7 .

[0054] In some embodiments, the design of the two second grooves 6 can facilitate the positioning of the first electrode member 81 and the second electrode member 82 during preparation, which is beneficial to improving the stability of the first electrode member 81 and the second electrode member 82 , and can also be applied to the deposition process of the electrode member 8 .

[0055] It should be noted that the depth and shape of the first groove 5 can be designed according to the shape and thickness of the heating element 7; the depth and shape of the two second grooves 6 can be designed according to the shape and thickness of the first electrode member 81 and the second electrode member 82, and the embodiment of the present application does not limit this.

[0056] In one embodiment, the heating element 7 is a metal layer deposited in the first groove 5 , and the electrode element 8 is a metal layer deposited in the second groove 6 .

[0057] In the embodiment of the present application, the heating element 7 is set as a metal layer deposited in the first groove 5, and the electrode element 8 is set as a metal layer deposited in the second groove 6. In this way, the heating element 7 and the electrode element 8 have good conductivity when electrically connected, thereby ensuring uniform heating of the atomized substrate.

[0058] In some embodiments, the heating element 7 is made of a metal material, specifically, it can be made of iron-chromium alloy, nickel-chromium alloy, 316L, 304, tungsten, molybdenum or other metal materials with high temperature resistance, corrosion resistance and good thermal conductivity. The electrode element 8 is made of a metal material, specifically, it can be made of gold, platinum, titanium or other metal materials with excellent electrical conductivity.

[0059] In some embodiments, the heating element 7, which is made of a metal material that is resistant to high temperature, corrosion, and has good thermal conductivity, generates heat evenly when energized by the electrode element 8, so as to evenly and stably convert the atomized matrix passing through the through hole 4 into an aerosol, so that the atomizing element 1 can have good atomization performance.

[0060] In one embodiment, Figures 2 to 4 As shown, a heating element 7 is further provided in the second groove 6 , and the heating element 7 is provided on a side of the electrode element 8 facing away from the second substrate 3 .

[0061] In the embodiment of the present application, a heating element 7 is arranged in the second groove 6, and the heating element 7 is arranged on the side of the electrode element 8 away from the second substrate 3. In this way, the heating element 7 arranged in the second groove 6 is in direct contact with the electrode element 8 to form an electrical connection, making the electrical connection more stable.

[0062] In some embodiments, Figures 2 to 4 , Fig.15 As shown, the width of the heating element 7 and the width of the electrode element 8 in the second groove 6 may be the same or different.

[0063] In one embodiment, the heating element 7 includes at least two sub-heating segments 71 , and the first through holes 41 are arranged in a plurality of rows, and each row of the first through holes 41 is arranged side by side with at least one sub-heating segment 71 .

[0064] In the embodiment of the present application, each row of first through holes 41 is arranged side by side with at least one sub-heating segment 71, so that each row of sub-heating segments 71 can heat each row of first through holes 41, so as to evenly heat the atomized matrix passing through the first through holes 41, thereby improving the heating efficiency.

[0065] Specifically, one end of each sub-heating segment 71 is electrically connected to the first electrode member 81, and the other end is electrically connected to the second electrode member 82. In this way, the multiple sub-heating segments 71 are connected in parallel to each other, so that when one or several sub-heating segments 71 fail, the remaining sub-heating segments 71 can still continue to heat the atomization matrix, thereby improving the stability of the atomization element 1 during heating.

[0066] In some embodiments, two adjacent sub-heating segments 71 among the multiple sub-heating segments 71 are connected in series to form a first heating segment, and the first heating segment is then connected in parallel with other sub-heating segments 71; or every two adjacent sub-heating segments 71 are connected in series to form multiple first heating segments, and the multiple first heating segments are connected in parallel to each other. This embodiment of the application does not limit this.

[0067] It should be noted that the plurality of sub-heating segments 71 may be directly electrically connected to the first electrode member 81 and the second electrode member 82 , or may be indirectly electrically connected to the first electrode member 81 and the second electrode member 82 .

[0068] In one embodiment, Figure 2 and Figure 3 As shown, at least one sub-heating segment 71 is provided between two adjacent rows of first through holes 41 .

[0069] In the embodiment of the present application, at least one sub-heating segment 71 is provided between two adjacent rows of first through holes 41 , so that the corresponding sub-heating segment 71 can be matched according to the number of first through holes 41 , making the setting of the sub-heating segment 71 more flexible.

[0070] In some embodiments, Figure 2 and Figure 3 As shown, the first through holes 41 are arranged in four rows, a sub-heating segment 71 is provided on both sides of the first row, and a sub-heating segment 71 is provided between the second row and the third row, so that both sides of the first through holes 41 can be heated and the sub-heating segments 71 can heat the first through holes 41 evenly.

[0071] In one embodiment, Figures 2 to 3 As shown, a plurality of sub-heating segments 71 are connected end to end in sequence to form a heating element 7. Along the arrangement direction of the sub-heating segments 71, the two outermost sub-heating segments 71 at both ends are electrically connected to the first electrode element 81 and the second electrode element 82 respectively.

[0072] In the embodiment of the present application, a plurality of sub-heating segments 71 are connected end to end in sequence to form a heating element 7. Along the arrangement direction of the sub-heating segments 71, the two outermost sub-heating segments 71 at both ends are electrically connected to the first electrode member 81 and the second electrode member 82, respectively. In this way, a plurality of sub-heating segments 71 are connected end to end in sequence to form a serpentine heating element 7, so that each first through hole 41 can be uniformly heated.

[0073] In some embodiments, the two outermost sub-heating segments 71 at both ends can be electrically connected to the first electrode member 81 and the second electrode member 82 through a metal medium. The material of the specific metal medium can be the same as that of the first electrode member 81 and the second electrode member 82 to improve the conductivity between the metal medium and the first electrode member 81 and the second electrode member 82.

[0074] In one embodiment, a protective layer 9 is provided on one side of the heating element 7 close to the second substrate 3 , and the protective layer 9 is used to isolate the heating element 7 from the atomizing matrix.

[0075] In the embodiment of the present application, a protective layer 9 is provided on the side of the heating element 7 close to the second substrate 3. In this way, the heating element 7 is covered with the protective layer 9 to isolate the heating element 7 from the atomizing matrix, so as to avoid the atomizing matrix entering the second groove 6 from contacting the heating element 7, thereby further preventing the heating element 7 from oxidation and metal transformation.

[0076] In some embodiments, the protective layer 9 is disposed in the first groove 5 , and the structure of the protective layer 9 is the same as the structure of the heating element 7 in the first groove 5 , so that the protective layer 9 can better cover the surface of the heating element 7 .

[0077] In one embodiment, the first substrate 2 is a silicon-based substrate, the second substrate 3 is a glass substrate, and the first substrate 2 and the second substrate 3 are fixedly connected together by anodic bonding.

[0078] In the embodiment of the present application, the first substrate 2 is set to be a silicon-based substrate, and the second substrate 3 is set to be a glass substrate. The first substrate 2 and the second substrate 3 are fixedly connected together by anodic bonding. In this way, the two materials are firmly combined by anodic bonding to form a high-strength, high-sealing structure, thereby improving the mechanical strength of the atomizing element 1.

[0079] In some embodiments, the first substrate 2 is made of a semiconductor material, specifically, it can be made of high-purity single crystal silicon, doped single crystal silicon, polycrystalline silicon or other semiconductor materials with good thermal conductivity and mechanical strength. The second substrate 3 is made of a glass material, specifically, it can be made of borosilicate glass, silicate glass or other glass materials with high strength and low expansion coefficient.

[0080] An embodiment, such as Figures 6 to 9 As shown, the present application also provides a nebulizer, including the nebulizer element 1 of any one of the above embodiments, and also including a shell 12 and a accommodating chamber 15 and an atomizing chamber 17 arranged in the shell 12; the accommodating chamber 15 is used to store the atomizing matrix; the nebulizer element 1 connects the atomizing chamber 17 and the accommodating chamber 15 through the first through hole 41 and the second through hole 42.

[0081] In the embodiment of the present application, the atomized matrix is ​​stored in the accommodating chamber 15, and the atomizing element 1 connects the atomizing chamber 17 and the accommodating chamber 15 through the first through hole 41 and the second through hole 42, so that the atomizing element 1 can adsorb the atomized matrix in the accommodating chamber 15 to the first through hole 41 and the second through hole 42 in the atomizing element 1 for heating and atomization, and then transport it to the atomizing chamber 17. At the same time, through the reasonable layout of the atomizing chamber 17 and the accommodating chamber 15, the volume of the accommodating chamber 15 is increased, the number of atomization ports is increased, and the user experience is improved.

[0082] Specifically, Figures 6 to 9 As shown, the atomizer further includes a bracket 16 . The bottom of the accommodating chamber 15 is provided with the bracket 16 . The atomizing element 1 is installed in the bracket 16 . The bracket 16 , the atomizing element 1 and the housing 12 enclose an atomizing chamber 17 .

[0083] It can be understood that the number of atomization ports is the number of times the atomization matrix stored in the accommodating cavity 15 is heated and atomized for the user to inhale. For the same user, the larger the accommodating cavity 15 is, the more atomization matrix there is, and the more times the atomization matrix is ​​heated and atomized for the user to inhale.

[0084] In some embodiments, Figures 7 to 9 As shown, the housing 12 includes a first housing 13 and a second housing 14, which enclose a receiving cavity 15. A bracket 16 is provided at the bottom of the first housing 13, and a mounting groove is provided in the bracket 16. The atomizing element 1 is installed in the mounting groove to improve assembly efficiency.

[0085] In some embodiments, the first shell 13 and the second shell 14 are made of plastic material, specifically, polypropylene, polymethyl methacrylate or other plastic materials with high strength, good heat resistance and sealing performance.

[0086] It should be noted that the first shell 13 and the second shell 14 can be connected by an adhesive, or by laser welding, ultrasonic welding or other methods.

[0087] In one embodiment, Figures 7 and 8 As shown, the atomizer further includes a sealing member 18 ; the sealing member 18 is disposed between the bracket 16 and the atomizing element 1 , and is used for sealing connection between the bracket 16 and the atomizing element 1 .

[0088] In the embodiment of the present application, a seal 18 is provided between the bracket 16 and the atomizing element 1. Thus, the seal 18 is utilized to seal the bracket 16 and the atomizing element 1. This helps to improve the sealing of the atomizing chamber 17 and prevent the atomized matrix from leaking from the atomizing chamber 17 after atomization and heating.

[0089] It should be noted that the atomizing chamber 17 may also be formed by enclosing the sealing member 18 , the bracket 16 , the atomizing element 1 and the second shell 14 .

[0090] In one embodiment, Figures 1 to 6 As shown, the atomizer further includes a conductive electrode 19 ; a slot 11 is provided between the first substrate 2 and the second substrate 3 , the slot 11 is at least partially connected to the electrode member 8 , and the conductive electrode 19 is at least partially inserted into the slot 11 and electrically connected to the electrode member 8 .

[0091] In the embodiment of the present application, a slot 11 is provided between the first substrate 2 and the second substrate 3, and the slot 11 is at least partially connected to the electrode member 8, so that the conductive electrode 19 can be inserted into the slot 11 and electrically connected to the electrode member 8, so that the electrode member 8 can be electrically connected to the power supply, thereby enabling the heating layer to heat and atomize the atomization matrix.

[0092] In some embodiments, Figure 6 , Fig. 9 As shown, an electrode hole 10 is also provided at the bottom of the first shell 13, and one end of the conductive electrode 19 is arranged in a cylindrical shape, and the other end is arranged in a circular shape, so that one end of the conductive electrode 19 inserted into the slot 11 matches the shape of the slot 11, and the other end of the circular arrangement matches the electrode hole 10.

[0093] In one embodiment, Figures 7 and 8 As shown, the housing 12 is provided with an air inlet 20 , which is in communication with the atomizing chamber 17 and is used for air intake into the atomizing chamber 17 .

[0094] In the embodiment of the present application, an air inlet 20 is provided in the first shell 13, and the air inlet 20 is connected to the atomization chamber 17, so that the outside air can enter the atomization chamber 17 through the air inlet hole, ensuring that the atomized atomized matrix is ​​discharged through the atomization chamber 17.

[0095] In some embodiments, along the extension direction of the first shell 13, the air inlet 20 is disposed on one side of the first shell 13 close to the atomization chamber 17. Figures 6 to 8 As shown in the middle air inlet 20, the air inlet 20 extends from the side of the first shell 13 away from the atomizing chamber 17 to the atomizing chamber 17, and the air inlet 20 penetrates the first shell 13. In this way, by setting the air inlet 20 to be directly connected with the atomizing chamber 17, it is beneficial to reduce the path of the airway flow and improve the efficiency of air intake.

[0096] In some embodiments, a hollow member may be provided at the bottom of the first shell 13, with an air passage provided in the hollow member, one end of the hollow member being connected to the atomization chamber 17, and the other end of the hollow member extending out of the first shell 13 to be connected to the outside, so that air can flow into the atomization chamber 17 through the air passage.

[0097] In one embodiment, Figures 7 and 8 As shown, a liquid storage tank 21 is provided on one side of the housing 12 facing the atomization chamber 17 . The liquid storage tank 21 is at least partially arranged around the air inlet 20 . The liquid storage tank 21 is communicated with the atomization chamber 17 and is used to store overflowing atomized matrix.

[0098] In the embodiment of the present application, a liquid storage tank 21 is provided on the side of the shell 12 facing the atomization chamber 17, and the liquid storage tank 21 is connected to the atomization chamber 17. In this way, the liquid storage tank 21 can prevent the atomization matrix that overflows into the atomization chamber 17 from flowing out of the first shell 13 along the air inlet 20.

[0099] An embodiment, such as Figure 7 As shown, in the atomizing element 1 , the first substrate 2 is a silicon-based substrate, the second substrate 3 is a glass substrate, the second substrate 3 is arranged toward the accommodating cavity 15 , and the first substrate 2 is arranged toward the atomizing cavity 17 .

[0100] In the embodiment of the present application, the second substrate 3 in the atomizing element 1 is directed toward the accommodating chamber 15, and the first substrate 2 is directed toward the atomizing chamber 17. In this way, the atomizing matrix first passes through the second through hole 42 in the second substrate 3 to be preheated, and then passes through the first through hole 41 in the first substrate 2 to be heated and atomized, thereby improving the efficiency of atomization. At the same time, the first substrate 2 in the atomizing element 1 is set as a silicon-based substrate, and the second substrate 3 is set as a glass substrate. In this way, the two materials can be firmly combined by the anodic bonding method, and a high-strength, high-sealing structure can be formed to improve the mechanical strength of the atomizing element 1. In addition, the silicon-based substrate is arranged near the atomizing chamber 17, and the glass substrate is arranged near the accommodating chamber 15. Since the glass substrate has good thermal insulation performance, the heat generated by the silicon-based substrate and the heating element 7 under the action of the current is mainly used to heat and atomize the atomizing matrix into an aerosol, reduce heat loss, and improve the heating efficiency of the atomizing element 1. At the same time, the temperature of the atomizing matrix in the accommodating chamber 15 can also be avoided, and the storage stability of the atomizing matrix in the accommodating chamber 15 can be guaranteed.

[0101] In one embodiment, Figures 7 and 8 As shown, an air guide 23 is further provided in the housing 12 , and an air outlet 22 is provided in the housing 12 . One end of the air guide 23 is communicated with the atomization chamber 17 , and the other end of the air guide 23 is communicated with the air outlet 22 .

[0102] In the embodiment of the present application, one end of the air guide 23 is connected to the atomization chamber 17, and the other end of the air guide 23 is connected to the air outlet 22, so that the atomized atomized matrix in the atomization chamber 17 is transported to the air outlet 22 through the air guide 23, so that the atomized atomized matrix can be discharged out of the shell 12.

[0103] In some embodiments, Figures 7 and 8As shown, the air inlet 20, the atomizing chamber 17, the air guide 23 and the air outlet 22 are arranged on the same straight line to ensure smooth airflow and improve the air intake efficiency, so as to improve the atomization efficiency.

[0104] An embodiment, such as Fig.10 As shown, the present application also provides a method for preparing an atomizing element 1, which is used to prepare the atomizing element 1 of any one of the above embodiments, comprising:

[0105] Step 101: providing a first substrate 2, wherein the first substrate 2 has a first surface 24;

[0106] The first substrate 2 is made of semiconductor material, and can be specifically made of high-purity single crystal silicon, doped single crystal silicon, polycrystalline silicon or other semiconductor materials with good thermal conductivity and mechanical strength. Fig.11 and Fig.19 As shown, the first surface 24 is the surface where the first substrate 2 and the second substrate 3 are connected.

[0107] Step 102: forming a first groove 5 and two second grooves 6 on the first surface 24; the two second grooves 6 are arranged at intervals, the first groove 5 is arranged between the two second grooves 6, and the first groove 5 is connected to the two second grooves 6 respectively;

[0108] like Fig.12 As shown, in the embodiment of the present application, the first groove 5 and the two second grooves 6 can be etched on the first surface 24 of the substrate by dry etching or wet etching, so that the electrode member 8 can be arranged in the two second grooves 6, and the heating member 7 is arranged in the first groove 5. It can be understood that the embodiment of the present application can also form the first groove 5 and the second groove 6 by other methods, such as laser melting, etc.

[0109] In some embodiments, the present application can etch the first groove 5 and the two second grooves 6 by reactive ion etching technology, so that high-precision, high-aspect ratio microstructure etching can be achieved.

[0110] In some embodiments, Fig.12 As shown, the first through hole 41 may be partially etched by reactive ion etching to provide a basis for subsequent etching of the first through hole 41 .

[0111] Step 103: forming a first through hole 41 in the first surface 24 , wherein the first through hole 41 penetrates the first substrate 2 ;

[0112] like Fig.13 As shown, in the embodiment of the present application, the first through hole 41 can be formed by etching the first surface 24 of the first substrate 2 through dry etching or wet etching.

[0113] In some embodiments, the present application may etch the first through hole 41 by deep reactive ion etching technology, so that a deeper and vertical first through hole 41 may be realized, meeting the requirement that the atomized matrix passes through the first through hole 41 .

[0114] Step 104: forming a heating element 7 in the first groove 5 and forming electrode elements 8 in the two second grooves 6, and the heating element 7 is connected to the electrode elements 8;

[0115] like Fig.14 As shown, in the embodiment of the present application, the heating element 7 is arranged in the first groove 5, the electrode element 8 is arranged in the two second grooves 6, and the heating element 7 is connected to the electrode element 8. In this way, by providing the first groove 5, the heating element 7 is embedded in the first groove 5 of the first substrate 2, and the direct contact between the heating element 7 and the atomizing substrate is reduced, so that the heating element 7 is not easily oxidized or metal migrated.

[0116] In some embodiments, the heat generating element 7 is formed in the first groove 5 by physical vapor deposition technology, and the physical vapor deposition technology can achieve uniform and dense thin film deposition to ensure the heat generating performance of the heat generating element 7 .

[0117] In some embodiments, the electrode member 8 is formed in the second groove 6 by chemical vapor deposition technology. The chemical vapor deposition technology can form a uniform metal layer on a surface with complex morphology to ensure good conductivity of the electrode.

[0118] Step 105: providing a second substrate 3, and forming a second through hole 42 in the second substrate 3, wherein the second through hole 42 penetrates the second substrate 3;

[0119] In some embodiments, the second substrate 3 is made of a glass material, specifically borosilicate glass, silicate glass or other glass materials with high strength and low expansion coefficient. Before providing the second substrate 3, the surface of the second substrate 3 may be cleaned, specifically using a plasma cleaning technique to clean and surface treat the second substrate 3 to improve the bonding strength between the second substrate 3 and the first substrate 2.

[0120] like Figure 17 to Figure 18 As shown, in the embodiment of the present application, the second through hole 42 can be formed by etching the second substrate 3 through dry etching or wet etching.

[0121] In some embodiments, the present application can form the second through hole 42 in the second substrate 3 by etching using laser etching technology. In this way, the etching position and depth can be controlled to form a smooth hole wall to meet the requirement that the atomized matrix passes through the second through hole 42.

[0122] Step 106 : The second substrate 3 is sealed on the first surface 24 of the first substrate 2 , the first through hole 41 is fluidically connected with the second through hole 42 , and a gap is provided between the electrode member 8 and the second substrate 3 to form a slot 11 .

[0123] In the embodiment of the present application, the first through hole 41 is fluidically connected with the second through hole 42 by sealing the second substrate 3 on the first surface 24 of the first substrate 2, so that the atomized substrate passes through the first through hole 41 and the second through hole 42. At the same time, a gap is provided between the electrode member 8 and the second substrate 3 to form a slot 11, so that the conductive electrode 19 is inserted into the slot 11 and connected with the electrode member 8 to supply power to the heating element 7.

[0124] In some embodiments, the thickness and setting position of the heating element 7 and the electrode element 8 can be referred to, and the depth of the second groove 6 can be set so that there is a gap between the second groove 6 and the second substrate 3. The gap is a slot 11. In this way, the conductive electrode 19 is inserted into the space between the second groove 6 and the second substrate 3, which is conducive to simplifying the preparation process of the atomizing element 1.

[0125] In some embodiments, the second groove 6 is arranged flush with the side of the electrode member 8 close to the second substrate 3, so that a slot 11 can be set at a position corresponding to the electrode member 8 in the second substrate 3, and the depth and thickness of the slot 11 can be selected according to the length and thickness of the conductive electrode 19, and the present application does not impose any restrictions thereon.

[0126] In the embodiment of the present application, a first substrate 2 is provided, the first substrate 2 has a first surface 24; a first groove 5 and two second grooves 6 are formed on the first surface 24; the two second grooves 6 are arranged at intervals, the first groove 5 is arranged between the two second grooves 6, and the first groove 5 is respectively connected with the two second grooves 6; a first through hole 41 is formed in the first surface 24, and the first through hole 41 passes through the first substrate 2; a heating element 7 is formed in the first groove 5, and an electrode element 8 is formed in the two second grooves 6, and the heating element 7 is connected to the electrode element 8; a second substrate 3 is provided, and a second through hole 42 is formed in the second substrate 3, and the second through hole 42 passes through the second substrate 3; the second substrate 3 is sealed on the first surface 24 of the first substrate 2, and the second through hole 42 and the first through hole 41 are connected to each other to form a through hole 4, and there is a gap between the electrode element 8 and the second substrate 3 to form a slot 11. In this way, by arranging the heating element 7 in the first groove 5 and surrounding the first through hole 41, the conductive electrode 19 supplies power to the heating element 7 through the electrode element 8, so that the heating element 7 heats the atomized substrate flowing through the first through hole 41 and the second through hole 42 into an aerosol, avoiding direct contact between the heating element 7 and the atomized substrate. Therefore, the heating element 7 is not prone to oxidation or metal migration, which is beneficial to improving the heating efficiency of the heating element 7 on the atomized substrate and improving the reliability and service life of the atomizing element 1.

[0127] An embodiment, such as Fig.16 As shown, after the heat generating element 7 is formed in the first groove 5 and the electrode elements 8 are formed in the two second grooves 6 , the method further includes: forming a protective layer 9 on the surface of the heat generating element 7 in the first groove 5 .

[0128] In the embodiment of the present application, a protective layer 9 is provided on the side of the heating element 7 close to the second substrate 3. In this way, the heating element 7 is covered with the protective layer 9 to isolate the heating element 7 from the atomizing matrix, so as to avoid the atomizing matrix entering the second groove 6 from contacting the heating element 7, thereby further preventing the heating element 7 from oxidation and metal transformation.

[0129] In some embodiments, a layer of high insulating material is deposited on the surface of the heating element 7 by atomic layer deposition technology. The atomic layer deposition technology can achieve precise control at the atomic level to form a dense protective layer to effectively isolate the atomized matrix. Specifically, the high insulating material can be a layer of material such as silicon dioxide or silicon nitride.

[0130] In one embodiment, Fig.15 As shown, forming a heat generating element 7 in the first groove 5 and forming an electrode element 8 in the two second grooves 6 includes: forming a heat generating element 7 in the first groove 5 and the two second grooves 6 , and forming an electrode element 8 on the surface of the heat generating element 7 in the two second grooves 6 .

[0131] In the embodiment of the present application, the heating element 7 is arranged in the second groove 6, and the heating element 7 is arranged on the side of the electrode element 8 away from the second substrate 3, so that the heating element 7 arranged in the second groove 6 is in direct contact with the electrode element 8 to form an electrical connection, making the electrical connection more stable. At the same time, the heating element 7 is arranged in the second groove 6, which can save the subsequent process of additional electrical connection between the heating element 7 and the electrode element 8, which is conducive to simplifying the preparation process of the atomizing element 1.

[0132] In one embodiment, providing the first substrate 2 includes: cleaning the first substrate 2 ; and forming an oxidation protection layer on the surface of the first substrate 2 .

[0133] In the embodiment of the present application, by cleaning the first substrate 2 , an oxidation protection layer is formed on the surface of the first substrate 2 , thereby enhancing the effects of subsequent process steps and the stability of the first substrate 2 .

[0134] In some embodiments, when the first substrate 2 is a silicon substrate, the silicon substrate can be cleaned by a wet chemical cleaning method to remove surface contaminants, and then a thin silicon dioxide protective layer is formed in a high-temperature oxidation furnace.

[0135] In one embodiment, covering the second substrate 3 on the first surface 24 of the first substrate 2 includes: covering the second substrate 3 on the first surface 24 of the first substrate 2; and connecting the second substrate 3 to the first surface 24 of the first substrate 2 by anodic bonding.

[0136] In the embodiment of the present application, the second substrate 3 is connected to the first surface 24 of the first substrate 2 by anodic bonding, so that the second substrate 3 and the first substrate 2 are firmly combined to form a high-strength and high-sealing structure.

[0137] The above specific examples are used to illustrate the present application, which is only used to help understand the present application and is not intended to limit the present application. For technicians in the technical field to which the present application belongs, they can also make some simple deductions, deformations or substitutions based on the ideas of the present application.

Claims

1. An atomizing element (1), characterized in that: include: A first substrate (2), a heating element (7), an electrode element (8) and a second substrate (3); The first substrate (2) is provided with a first through hole (41), the second substrate (3) is provided with a second through hole (42), and the first through hole (41) is fluidically connected to the second through hole (42); The first substrate (2) and the second substrate (3) are stacked, the heating element (7) and the electrode element (8) are embedded between the first substrate (2) and the second substrate (3), and the heating element (7) is used to heat the atomized matrix into an aerosol; A slot (11) is also provided between the first substrate (2) and the second substrate (3); at least a portion of the slot (11) is in communication with the electrode member (8); the slot (11) is used for inserting a conductive electrode (19) to electrically connect to the electrode member (8).

2. The atomizing element (1) according to claim 1, characterized in that: A first groove (5) and two second grooves (6) are provided on a side of the first base body (2) close to the second base body (3); The two second grooves (6) are arranged at intervals, the first groove (5) is arranged between the two second grooves (6), and the first groove (5) is communicated with the two second grooves (6) respectively; The heating element (7) is arranged in the first groove (5), and the electrode element (8) is arranged in the two second grooves (6).

3. The atomizing element (1) according to claim 2, characterized in that: The heating element (7) is a metal layer deposited in the first groove (5), and the electrode element (8) is a metal layer deposited in the second groove (6).

4. The atomizing element (1) according to claim 1, characterized in that: The heating element (7) comprises at least two sub-heating segments (71); the first through holes (41) are arranged in a plurality of rows; and each row of the first through holes (41) is arranged side by side with at least one of the sub-heating segments (71).

5. The atomizing element (1) according to any one of claims 1 to 4, characterized in that: A protective layer (9) is provided on one side of the heating element (7) close to the second substrate (3), and the protective layer (9) is used to isolate the heating element (7) from the atomizing substrate.

6. The atomizing element (1) according to claim 1, characterized in that: The first substrate (2) is a silicon-based substrate, the second substrate (3) is a glass substrate, and the first substrate (2) and the second substrate (3) are fixedly connected together by anodic bonding.

7. An atomizer, characterized in that: The atomizing element (1) comprises the atomizing element (1) according to any one of claims 1 to 6, and further comprises a housing (12) and a containing chamber (15) and an atomizing chamber (17) arranged in the housing (12); The accommodating chamber (15) is used to store the atomized matrix; the atomizing element (1) communicates the atomizing chamber (17) with the accommodating chamber (15) via the first through hole (41) and the second through hole (42).

8. The atomizer according to claim 7, characterized in that In the atomizing element (1), the first substrate (2) is a silicon-based substrate, the second substrate (3) is a glass substrate, the second substrate (3) is arranged toward the accommodating cavity (15), and the first substrate (2) is arranged toward the atomizing cavity (17).

9. The atomizer according to claim 7, characterized in that The atomizer further comprises a conductive electrode (19), wherein the conductive electrode (19) is at least partially inserted into the slot (11) and is electrically connected to the electrode member (8).

10. The atomizer according to claim 7, characterized in that The housing (12) is provided with an air inlet (20) and an air outlet (22); the air inlet (20) is in communication with the atomizing chamber (17) and is used for air intake into the atomizing chamber (17); an air guide (23) is also provided in the housing (12); one end of the air guide (23) is in communication with the atomizing chamber (17), and the other end of the air guide (23) is in communication with the air outlet (22).

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