Light-emitting module and atmosphere lamp

Abstract

The utility model is suitable for the technical field of lighting equipment, and provides a light-emitting module and an atmosphere lamp. The light-emitting module comprises an installation carrier provided with an installation groove, and the installation groove is provided with an opening and a groove bottom which are opposite to each other; the light-emitting diode chip is mounted on the groove bottom and used for emitting light, and the light-emitting diode chip is provided with a light-emitting surface facing the opening; the driving chip is positioned on one side of the light-emitting diode chip, is mounted on the groove bottom, is electrically connected with the light-emitting diode chip and is used for controlling the light-emitting diode chip to emit light; the first reflecting layer covers the groove bottom, and the surface, close to the opening, of the first reflecting layer is located on the side, close to the groove bottom, of the light-emitting surface; and the second reflecting layer is mounted and covered on the surface, close to the opening, of the driving chip. By using the first reflecting layer and the second reflecting layer in a matched mode, the light emitting brightness of the light emitting module is improved, and color mixing processing on light emitted by the light emitting diode chip is facilitated.

Description

Technical Field

[0001] The present application belongs to the technical field of lighting equipment, and more specifically, to a light-emitting module and an atmosphere lamp. Background Art

[0002] Ambient lighting is a decorative lighting device used to create a comfortable and warm atmosphere. Usually, ambient lighting uses a light-emitting module as the main light source element.

[0003] The light-emitting module in the related art is a product that integrates a light-emitting diode (LED) chip, a driving circuit, a heat dissipation mechanism and other auxiliary functional components, wherein the light-emitting diode chip is an optoelectronic device manufactured based on semiconductor principles, which can emit light by passing current through it; however, the light-emitting module in the related art has the problem of low light brightness. Utility Model Content

[0004] The purpose of the embodiments of the present application is to provide a light-emitting module and an atmosphere light, aiming to solve the technical problem of low light brightness of the light-emitting module in the related art.

[0005] To achieve the above-mentioned purpose, according to one aspect of the present application, a light-emitting module is provided, comprising: a mounting carrier, a mounting groove is provided on the mounting carrier, the mounting groove has an opening and a groove bottom, and the opening and the groove bottom face each other; at least one light-emitting diode chip is installed on the groove bottom for emitting light, and the light-emitting diode chip has a light-emitting surface arranged toward the opening; a driving chip is located on one side of the light-emitting diode chip, installed on the groove bottom, and is electrically connected to the light-emitting diode chip for controlling the light-emitting diode chip to emit light; a first reflecting layer is installed and covered on the groove bottom, and is used to reflect the light emitted by the light-emitting diode chip toward the opening, and the surface of the first reflecting layer close to the opening is located on the side of the light-emitting surface close to the groove bottom; a second reflecting layer is installed and covered on the surface of the driving chip close to the opening, and is used to reflect the light emitted by the light-emitting diode chip toward the opening.

[0006] Optionally, the material of the second reflective layer includes silica gel, a reflector and a magnetic substance.

[0007] Optionally, the material of the first reflective layer includes silica gel, a reflector and a magnetic substance.

[0008] Optionally, the light emitting module further comprises a transparent packaging part, which is fixedly filled in the mounting groove and is used to fix the light emitting diode chip and the driving chip in the mounting groove.

[0009] Optionally, a surface of the driving chip close to the opening is located on a side of the light emitting surface close to the opening.

[0010] Optionally, the light emitting surface is located on a side of the opening close to the bottom of the groove, and a surface of the driving chip close to the opening is located on a side of the opening close to the bottom of the groove.

[0011] Optionally, the installation groove has a groove wall, the groove wall is connected to the groove bottom, the groove wall is a plane, and there is a preset angle between the groove wall and the groove depth direction of the installation groove, and the preset angle is an acute angle.

[0012] Optionally, the mounting carrier has a back side arranged opposite to the bottom of the groove; the light-emitting module also includes an electrical connection portion, which is located on the back side; the electrical connection portion includes a program burning pin, which is electrically connected to the driver chip; the number of light-emitting diode chips is three, and the three light-emitting diode chips can emit red light, green light and blue light respectively.

[0013] Optionally, the electrical connection part also includes: a first power pin, which is electrically connected to the light-emitting diode chip; a first drive ground pin, which is located on one side of the first power pin and is electrically connected to the drive chip; a light-emitting diode pad, which is installed in the installation carrier and has a connection surface exposed at the bottom of the groove, the light-emitting diode chip is installed on the connection surface, and the first power pin is connected to the light-emitting diode pad; the back side has a straight edge, the light-emitting diode pad is close to the straight edge, and the first power pin and the first drive ground pin are both arranged adjacent to the straight edge.

[0014] According to another aspect of the present application, an atmosphere lamp is provided, which includes a capacitor and the above-mentioned light-emitting module, the capacitor is close to the straight edge, the first end of the capacitor is electrically connected to the first power pin, and the second end of the capacitor is electrically connected to the first drive ground pin.

[0015] The beneficial effect of the light-emitting module provided by the present application is that when the light-emitting module of the present application is used, the light-emitting surface of the light-emitting diode chip emits light toward the opening. During this process, the light directed toward the bottom of the groove will be reflected to the opening position by the first reflective layer, and the light directed toward the driver chip will also be reflected to the opening position by the second reflective layer, so that the light output brightness of the light-emitting module can be improved; by using the first reflective layer and the second reflective layer in the present application, not only the light output brightness of the light-emitting module is improved, but also it is beneficial to mix the light emitted by the light-emitting diode chip. The provided installation carrier plays a bearing role; the provided installation groove not only plays a role in mixing the light emitted by the light-emitting diode chip, but also plays a role in protecting the light-emitting diode chip and the driver chip. In addition, it also plays a role in reducing the volume of the light-emitting module. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0017] Figure 1 A schematic diagram of the structure of the light-emitting module provided in an embodiment of the present application;

[0018] Figure 2 An exploded schematic diagram of a light-emitting module provided in an embodiment of the present application;

[0019] Figure 3 A schematic diagram of the structure of the light-emitting module provided in an embodiment of the present application after the transparent packaging part is hidden;

[0020] Figure 4 A schematic diagram of the structure of the light-emitting module provided in an embodiment of the present application after the transparent packaging part and the first reflective layer are hidden;

[0021] Figure 5 A cross-sectional schematic diagram of the light-emitting module provided in an embodiment of the present application after hiding the first reflective layer, the second reflective layer and the packaging part;

[0022] Figure 6 A schematic top view of the light-emitting module provided in an embodiment of the present application after hiding the first reflective layer, the second reflective layer and the packaging part;

[0023] Figure 7 A bottom-up schematic diagram of a light-emitting module provided in an embodiment of the present application without a capacitor;

[0024] Figure 8 A bottom-up schematic diagram of a light-emitting module with a capacitor provided in an embodiment of the present application;

[0025] The reference numerals in the above drawings are as follows:

[0026] 100, light emitting diode chip; 110, light emitting surface; 200, driver chip;

[0027] 310, program burning pin; 320, light emitting diode pad; 330, first power supply pin; 340, second power supply pin; 350, driving pad; 360, first driving ground wire pin; 370, second driving ground wire pin; 380, third driving ground wire pin; 390, mounting pad; 3100, signal input pad; 3110, clock input pad; 3120, signal input pin; 3130, clock input pin; 3140, signal output pad; 3150, clock output pad; 3160, signal output pin; 3170, clock output pin; 3180, capacitor;

[0028] 400, mounting carrier; 410, mounting groove; 411, opening; 412, groove bottom; 413, groove wall; 414, back side; 500, first reflection layer; 600, second reflection layer; 700, transparent packaging part. DETAILED DESCRIPTION

[0029] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0030] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or indirectly connected to the other element. In the absence of conflict, the embodiments in this application and the features in the embodiments may be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0031] It should be understood that the orientation or position relationship indicated by terms such as "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0032] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0033] As described in the background art, the light emitting module in the related art has the problem of low light brightness.

[0034] Reference Figures 1 to 5In order to solve the above problems, according to one aspect of the present application, an embodiment of the present application provides a light-emitting module, which includes a mounting carrier 400, at least one light-emitting diode chip 100, a driver chip 200, a first reflective layer 500 and a second reflective layer 600, wherein the mounting carrier 400 is provided with a mounting groove 410, the mounting groove 410 has an opening 411 and a groove bottom 412, and the opening 411 and the groove bottom 412 face each other; the light-emitting diode chip 100 is mounted on the groove bottom 412 for emitting light, and the light-emitting diode chip 100 has a light-emitting surface 110 arranged toward the opening 411; the driver chip 200 The chip 200 is located on one side of the light-emitting diode chip 100 and is installed on the groove bottom 412 and is electrically connected to the light-emitting diode chip 100, and is used to control the light emission of the light-emitting diode chip 100; the first reflective layer 500 is installed and covers the groove bottom 412, and is used to reflect the light emitted by the light-emitting diode chip 100 toward the opening 411, and the surface of the first reflective layer 500 close to the opening 411 is located on the side of the light-emitting surface 110 close to the groove bottom 412; the second reflective layer 600 is installed and covers the surface of the driving chip 200 close to the opening 411, and is used to reflect the light emitted by the light-emitting diode chip 100 toward the opening 411.

[0035] In the embodiment of the present application, the mounting carrier 400 is generally made of epoxy resin, ceramic or other insulating and heat-conductive materials; the groove bottom 412 of the mounting groove 410 is generally flat, the light-emitting diode (English full name: light-emitting diode, English abbreviation: LED) chip 100 is generally fixedly attached to the groove bottom 412, and the driver chip 200 is generally fixedly attached to the groove bottom 412. The driver chip 200 is used to control the light-emitting state of the light-emitting diode chip 100.

[0036] When the light-emitting module of the present application is used, the light-emitting surface 110 of the light-emitting diode chip 100 emits light toward the opening 411. During this process, the light directed toward the bottom of the groove 412 will be reflected by the first reflective layer 500 to the position of the opening 411, and the light directed toward the driver chip 200 will also be reflected by the second reflective layer 600 to the position of the opening 411, so that the light output brightness of the light-emitting module can be improved; by using the first reflective layer 500 and the second reflective layer 600 in the present application, not only the light output brightness of the light-emitting module is improved, but also it is beneficial to mix the light emitted by the light-emitting diode chip 100. The provided installation carrier 400 plays a bearing role; the provided installation groove 410 not only plays a role in mixing the light emitted by the light-emitting diode chip 100, but also plays a role in protecting the light-emitting diode chip 100 and the driver chip 200, and in addition, it also plays a role in reducing the volume of the light-emitting module.

[0037] Reference Figures 2 to 4In one embodiment, the material of the second reflective layer 600 includes silica gel, reflective material and magnetic material.

[0038] In this embodiment, the silica gel in the second reflective layer 600 is used as a base material, which has good light transmittance, insulation and chemical stability; the material of the reflector in the second reflective layer 600 is usually titanium dioxide, zinc oxide, silver or aluminum; the magnetic substance in the second reflective layer 600 is usually ferroferric oxide particles, cobalt iron oxide particles, neodymium iron boron magnet particles or iron cobalt alloy particles; the reflector and the magnetic substance in the second reflective layer 600 are mixed in the silica gel, and the second reflective layer 600 is generally fixed and attached to the surface of the driver chip 200 near the opening 411 by baking; the design of containing magnetic substances in the second reflective layer 600 reduces the influence of electromagnetic waves on the driver chip 200 and improves the anti-electromagnetic interference capability of the driver chip 200.

[0039] Reference Figure 2 and Figure 3 In one embodiment, the material of the first reflective layer 500 includes silica gel, reflective material and magnetic material.

[0040] In this embodiment, the silica gel in the first reflective layer 500 is used as a base material, which has good light transmittance, insulation and chemical stability; the material of the reflector in the first reflective layer 500 is usually titanium dioxide, zinc oxide, silver or aluminum; the magnetic material in the first reflective layer 500 is usually ferroferric oxide particles, cobalt iron oxide particles, neodymium iron boron magnet particles or iron cobalt alloy particles; the reflector and the magnetic material in the first reflective layer 500 are mixed in the silica gel, and the first reflective layer 500 is generally fixed and attached to the groove bottom 412 by baking; the design of containing magnetic material in the first reflective layer 500 reduces the influence of electromagnetic waves on the light-emitting diode chip 100 and the driver chip 200, and improves the anti-electromagnetic interference ability of the light-emitting diode chip 100 and the driver chip 200.

[0041] Reference Figure 1 and Figure 2 In one embodiment, the light emitting module further includes a transparent packaging portion 700 , which is fixedly filled in the mounting groove 410 , and is used to fix the light emitting diode chip 100 and the driving chip 200 in the mounting groove 410 .

[0042] In this embodiment, the transparent encapsulation part 700 is generally a transparent encapsulation glue, and the transparent encapsulation glue completely fills the gap in the installation groove 410; the transparent encapsulation part 700 is fixedly covered on the surface of the first reflective layer 500 close to the opening 411, the surface of the second reflective layer 600 close to the opening 411, and the light-emitting surface 110, and is fixedly connected to the groove wall 413, so that the light-emitting diode chip 100 and the driver chip 200 are fixedly installed in the installation groove 410. The transparent encapsulation part 700 not only plays the role of fixing the light-emitting diode chip 100 and the driver chip 200, but also plays a protective role for the light-emitting diode chip 100 and the driver chip 200. In addition, in order to ensure the aesthetics of the light-emitting module, the surface of the transparent encapsulation part 700 away from the groove bottom 412 is flush with the surface of the mounting carrier 400 with the opening 411.

[0043] Reference Figure 2 , Figure 3 as well as Figure 5 In one embodiment, the surface of the driver chip 200 close to the opening 411 is located on the side of the light-emitting surface 110 close to the opening 411. This design reduces the thickness of the first reflective layer 500 and simplifies the coating process of the first reflective layer 500, thereby ensuring the light output efficiency of the light-emitting surface 110 while ensuring that the light-emitting surface 110 is not blocked or covered by the first reflective layer 500.

[0044] Reference Figure 2 , Figure 4 as well as Figure 5 In one embodiment, the light emitting surface 110 is located on a side of the opening 411 close to the groove bottom 412, and the surface of the driver chip 200 close to the opening 411 is located on a side of the opening 411 close to the groove bottom 412. In this design, the groove depth of the mounting groove 410 is greater than or equal to 0.4 mm. The design in which the light emitting surface 110 and the surface of the driver chip 200 close to the opening 411 are both located inside the mounting groove 410 is conducive to color mixing of light emitted by the light emitting diode chip 100 inside the mounting groove 410.

[0045] Reference Figure 2 and Figure 5 In one embodiment, the mounting groove 410 has a groove wall 413, the groove wall 413 is connected to the groove bottom 412, the groove wall 413 is a plane, and there is a preset angle between the groove wall 413 and the groove depth direction of the mounting groove 410, and the preset angle is an acute angle. The number of groove walls 413 of the mounting groove 410 is generally four, and the angles between the four groove walls 413 and the groove depth direction of the mounting groove 410 are generally equal. In other embodiments, the angles between the four groove walls 413 and the groove depth direction of the mounting groove 410 may also be unequal; the groove wall 413 of the mounting groove 410 is set to facilitate color mixing of light emitted by the light-emitting diode chip 100.

[0046] In a specific embodiment, under the premise of a preset angle of 20°, if the groove depth of the mounting groove 410 is 0.5204 mm, the total luminous flux (i.e., energy ratio) of the LED chip 100 is 99.5%; if the groove depth of the mounting groove 410 is 0.66 mm, the total luminous flux (i.e., energy ratio) of the LED chip 100 is 95.5%; if the groove depth of the mounting groove 410 is 0.8 mm, the total luminous flux (i.e., energy ratio) of the LED chip 100 is 91.5%.

[0047] Under the premise that the preset angle is 28°, if the groove depth of the mounting groove 410 is 0.5204 mm, the total luminous flux (i.e., energy ratio) of the LED chip 100 is 99.8%; if the groove depth of the mounting groove 410 is 0.66 mm, the total luminous flux (i.e., energy ratio) of the LED chip 100 is 95.9%; if the groove depth of the mounting groove 410 is 0.8 mm, the total luminous flux (i.e., energy ratio) of the LED chip 100 is 92.1%.

[0048] Under the premise that the preset angle is 36°, if the groove depth of the mounting groove 410 is 0.5204 mm, the total luminous flux (i.e., energy ratio) of the LED chip 100 is 100%; if the groove depth of the mounting groove 410 is 0.66 mm, the total luminous flux (i.e., energy ratio) of the LED chip 100 is 96.3%; if the groove depth of the mounting groove 410 is 0.8 mm, the total luminous flux (i.e., energy ratio) of the LED chip 100 is 92.7%.

[0049] Reference Figure 7 In one embodiment, the mounting carrier 400 has a back side 414 disposed opposite to the groove bottom 412; the light-emitting module also includes an electrical connection portion, which is located on the back side 414; the electrical connection portion includes a program burning pin 310, which is electrically connected to the driver chip 200, and the program burning pin 310 is used to burn the compensation correction program onto the driver chip 200, so that the driver chip 200 can compensate and correct the light emitted by the light-emitting diode chip 100.

[0050] When the light-emitting module of the present application is used, the driver chip 200 will not only accurately compensate the current or voltage of the light-emitting diode chip 100 according to the compensation and correction program burned into the driver chip 200 through the program burning pin 310, but also automatically adjust the PWN (English full name: Pulse Width Modulation, Chinese name: pulse width modulation) and other parameters used for the light-emitting diode chip 100 to compensate and correct the light emitted by the light-emitting diode chip 100 in real time; by adopting the driver chip 200 in the present application, the problem of color difference of the light emitted by the light-emitting diode chip 100 is effectively solved, and the consistency and stability of the color of the light emitted by the light-emitting module are ensured; at the same time, by adopting the program burning pin 310 in the present application, not only can the compensation and correction program be conveniently burned into the driver chip 200 in advance for use by the driver chip 200, but also personalized parameter configuration and function expansion can be performed for the driver chip 200, broadening the usage scenarios and scope.

[0051] Reference Figure 3 and Figure 4 In one embodiment, the number of the LED chips 100 is three, and the three LED chips 100 can emit red light, green light, and blue light respectively.

[0052] Reference Figure 4 , Figure 6 as well as Figure 8 In one embodiment, the electrical connection portion further includes a first power pin 330, a first drive ground pin 360 and an LED pad 320, wherein the first power pin 330 is electrically connected to the LED chip 100; the first drive ground pin 360 is located on one side of the first power pin 330, and the first drive ground pin 360 is electrically connected to the driver chip 200; the LED pad 320 is installed in the installation carrier 400 and has a connection surface exposing the groove bottom 412, the LED chip 100 is installed on the connection surface, and the first power pin 330 is connected to the LED pad 320; the back side 414 has a straight edge, the LED pad 320 is close to the straight edge, and the first power pin 330 and the first drive ground pin 360 are both arranged adjacent to the straight edge.

[0053] In this embodiment, the LED pad 320 is electrically connected to the driver chip 200 through a wire; a first mounting groove is provided on the groove bottom 412, and the LED pad 320 is fixedly installed in the first mounting groove; the first power pin 330 is directly connected to the LED pad 320 for supplying power to the LED chip 100.

[0054] The LED pad 320 not only serves to carry the LED chip 100, but also serves as an electrical connection, so that the first power pin 330 can supply power to the LED chip 100 and the driver chip 200. In addition, it also serves to disperse heat, so that the LED chip 100 can be cooled quickly, thereby avoiding local overheating of the LED chip 100. In addition, to ensure the connection strength between the first power pin 330 and the LED pad 320, the first power pin 330 and the LED pad 320 are an integrally formed part.

[0055] Reference Figure 4 , Figure 6 as well as Figure 7 In one embodiment, the electrical connection portion further includes a second power pin 340, which is directly connected to the LED pad 320, and is located between the first power pin 330 and the first driving ground pin 360. The area of ​​the second power pin 340 is larger than that of the first power pin 330, which facilitates the heat dissipation of the LED pad 320. To ensure the connection strength between the second power pin 340 and the LED pad 320, the second power pin 340 and the LED pad 320 are integrally formed.

[0056] Reference Figure 4 , Figure 6 as well as Figure 7 In one embodiment, the electrical connection portion further includes a driving pad 350, which is located on one side of the light-emitting diode pad 320, and the driving pad 350 is installed in the mounting carrier 400. The driving chip 200 is fixedly installed on the driving pad 350 and is electrically connected to the driving pad 350.

[0057] In this embodiment, a second mounting groove is provided on the groove bottom 412, and the driving pad 350 is fixedly installed in the second mounting groove; the driving chip 200 is fixedly installed on the surface of the driving pad 350 close to the opening 411, and the first driving ground pin 360 is directly connected to the driving pad 350 for grounding the driving chip 200. The driving pad 350 not only plays the role of carrying the driving chip 200, but also plays a connecting role, so that the first driving ground pin 360 can be electrically connected to the driving chip 200. In addition, it also plays a role in dispersing heat, so that the driving chip 200 can be quickly cooled down, avoiding local overheating of the driving chip 200. In addition, in order to ensure the connection strength between the first driving ground pin 360 and the driving pad 350, the first driving ground pin 360 and the driving pad 350 are an integrally formed part.

[0058] Reference Figure 4 , Figure 6 as well as Figure 7In one embodiment, the electrical connection portion further includes a second driving ground pin 370 and a third driving ground pin 380, the second driving ground pin 370 is located on one side of the first driving ground pin 360, the second driving ground pin 370 is directly connected to the driving pad 350, and the third driving ground pin 380 is located on one side of the first driving ground pin 360 and on one side of the second driving ground pin 370, and is directly connected to the driving pad 350. The second driving ground pin 370 and the third driving ground pin 380 in the present application are used in conjunction with the first driving ground pin 360, which not only improves the stability and safety of the operation of the driving chip 200, but also improves the anti-interference ability of the driving chip 200. To improve the connection strength between the second driving ground pin 370 and the driving pad 350, the second driving ground pin 370 and the driving pad 350 are integrally formed; to improve the connection strength between the third driving ground pin 380 and the driving pad 350, the third driving ground pin 380 and the driving pad 350 are integrally formed.

[0059] Reference Figure 4 , Figure 6 as well as Figure 7 In one embodiment, the electrical connection portion also includes a mounting pad 390, which is located on one side of the light-emitting diode pad 320 and on one side of the driving pad 350, and the mounting pad 390 is installed in the mounting carrier 400; the program burning pin 310 is directly connected to the mounting pad 390.

[0060] In this embodiment, a third mounting groove is provided on the groove bottom 412, and the mounting pad 390 is fixedly installed in the third mounting groove. The provided mounting pad 390 plays a connecting role, so that the program burning pin 310 can be electrically connected to the driver chip 200. In addition, in order to ensure the connection strength between the program burning pin 310 and the mounting pad 390, the program burning pin 310 and the mounting pad 390 are an integrally formed part.

[0061] Reference Figure 4 , Figure 6 as well as Figure 7In one embodiment, the electrical connection portion further includes a signal input pad 3100 and a clock input pad 3110, and the signal input pad 3100 and the clock input pad 3110 are arranged at intervals; a fourth mounting groove and a fifth mounting groove are provided on the groove bottom 412, the signal input pad 3100 is installed in the fourth mounting groove, and the clock input pad 3110 is installed in the fifth mounting groove, and the signal input pad 3100 and the clock input pad 3110 are both electrically connected to the driver chip 200; the electrical connection portion further includes a signal input pin 3120 and a clock input pin 3121. Input pin 3130, signal input pin 3120 is directly connected to signal input pad 3100; clock input pin 3130 is directly connected to clock input pad 3110; signal input pin 3120 and clock input pin 3130 are arranged alternately, signal input pin 3120 and clock input pin 3130 are both located between first power pin 330 and program burning pin 310, signal input pin 3120 and clock input pin 3130 are both located on the side of first driving ground pin 360 away from second driving ground pin 370.

[0062] In this embodiment, the signal input pad 3100 and the clock input pad 3110 are located on the same side of the driving pad 350, and the signal input pad 3100 and the clock input pad 3110 are generally electrically connected to the driving chip 200 through a wire; the signal input pad 3100 is fixedly installed in the fourth mounting groove, and the clock input pad 3110 is fixedly installed in the fifth mounting groove; the signal input pin 3120 is electrically connected to the signal input pad 3100, and the signal input pin 3120 is used to receive an external signal; the clock input pin 3130 is electrically connected to the clock input pad 3110. The use of the signal input pin 3120 and the clock input pin 3130 in the present application not only significantly improves the processing capability of the driving chip 200 for the input signal, but also ensures that multiple input signals remain synchronized. In addition, the overall power consumption of the driving chip 200 is effectively reduced. In addition, to ensure the connection strength between the signal input pin 3120 and the signal input pad 3100, the signal input pin 3120 and the signal input pad 3100 are integrally formed; to ensure the connection strength between the clock input pin 3130 and the clock input pad 3110, the clock input pin 3130 and the clock input pad 3110 are integrally formed.

[0063] Reference Figure 4 , Figure 6 as well as Figure 7In one embodiment, the electrical connection portion further includes a signal output pad 3140 and a clock output pad 3150, and the signal output pad 3140 and the clock output pad 3150 are arranged at intervals; a sixth mounting groove and a seventh mounting groove are provided on the groove bottom 412, the signal output pad 3140 is installed in the sixth mounting groove, and the clock output pad 3150 is installed in the seventh mounting groove, and the signal output pad 3140 and the clock output pad 3150 are both electrically connected to the driver chip 200; the electrical connection portion further includes a signal output pin 3160 and a clock output Pin 3170, the signal output pin 3160 is directly connected to the signal output pad 3140; the clock output pin 3170 is directly connected to the clock output pad 3150; the signal output pin 3160 and the clock output pin 3170 are arranged alternately, and the signal output pin 3160 and the clock output pin 3170 are both located between the first drive ground pin 360 and the third drive ground pin 380, and the signal output pin 3160 and the clock output pin 3170 are both located on the side of the second drive ground pin 370 away from the program burning pin 310.

[0064] In this embodiment, the signal output pad 3140 and the clock output pad 3150 are located on the same side of the driving pad 350, and the signal output pad 3140 and the clock output pad 3150 are generally electrically connected to the driving chip 200 through a wire; the signal output pad 3140 is fixedly installed in the sixth mounting slot, and the clock output pad 3150 is fixedly installed in the seventh mounting slot; the signal output pin 3160 is electrically connected to the signal output pad 3140, and the signal output pin 3160 is used to output the signal; the clock output pin 3170 is electrically connected to the clock output pad 3150. The signal output pin 3160 and the clock output pin 3170 in this application are used together to not only significantly improve the timing accuracy of the output signal, but also ensure that multiple output signals remain synchronized. In addition, the anti-interference performance of the output signal is effectively improved. In addition, to ensure the connection strength between the signal output pin 3160 and the signal output pad 3140, the signal output pin 3160 and the signal output pad 3140 are integrally formed; to ensure the connection strength between the clock output pin 3170 and the clock output pad 3150, the clock output pin 3170 and the clock output pad 3150 are integrally formed.

[0065] Reference Figure 7In one embodiment, a surface of the first power pin 330 away from the opening 411 is flush with the back side 414, a surface of the second power pin 340 away from the opening 411 is flush with the back side 414, a surface of the first driving ground pin 360 away from the opening 411 is flush with the back side 414, a surface of the second driving ground pin 370 away from the opening 411 is flush with the back side 414, a surface of the third driving ground pin 380 away from the opening 411 is flush with the back side 414, a surface of the signal input pin 3120 away from the opening 411 is flush with the back side 414, a surface of the clock input pin 3130 away from the opening 411 is flush with the back side 414, a surface of the signal output pin 3160 away from the opening 411 is flush with the back side 414, and a surface of the clock output pin 3170 away from the opening 411 is flush with the back side 414.

[0066] Reference Figures 2 to 5 In one embodiment, the light emitting module further includes a temperature sensor, which is electrically connected to the driving chip 200 and is used to detect the temperature of the light emitting diode chip 100 .

[0067] In this embodiment, the temperature sensor can detect the operating temperature of the LED chip 100 in real time and provide feedback to the driver chip 200, so that the driver chip 200 can dynamically adjust parameters such as current, voltage and PWM to suppress the influence of temperature on the color of the light emitted by the LED chip 100, and further ensure the consistency and stability of the color of the light emitted by the light-emitting module.

[0068] Reference Figures 1 to 8 According to another aspect of the present application, an embodiment of the present application further provides an atmosphere lamp, which includes a capacitor 3180 and the above-mentioned light-emitting module, the capacitor 3180 is close to the straight edge, the first end of the capacitor 3180 is electrically connected to the first power pin 330, and the second end of the capacitor 3180 is electrically connected to the first drive ground pin 360.

[0069] The capacitor 3180 not only enhances the voltage stability of the driver chip 200 during operation, ensuring that the driver chip 200 can operate stably, but also because the first power pin 330 and the first drive ground pin 360 are both arranged close to the preset straight line edge, the capacitor 3180 is easy to connect with the first power pin 330 and the first drive ground pin 360.

[0070] In summary, the light-emitting module and atmosphere lamp provided in this embodiment have at least the following beneficial technical effects: when the light-emitting module of the present application is used, the light-emitting surface 110 of the light-emitting diode chip 100 emits light toward the opening 411. During this process, the light emitted to the bottom of the groove 412 will be reflected by the first reflective layer 500 to the position of the opening 411, and the light emitted to the driver chip 200 will also be reflected by the second reflective layer 600 to the position of the opening 411, so that the light output brightness of the light-emitting module can be improved; by using the first reflective layer 500 and the second reflective layer 600 in the present application, not only the light output brightness of the light-emitting module is improved, but also it is beneficial to mix the light emitted by the light-emitting diode chip 100. The provided installation carrier 400 plays a bearing role; the provided installation groove 410 not only plays a role in mixing the light emitted by the light-emitting diode chip 100, but also plays a role in protecting the light-emitting diode chip 100 and the driver chip 200, and in addition, it also plays a role in reducing the volume of the light-emitting module.

[0071] The above are only preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A light emitting module, characterized in that: include: A mounting carrier (400), wherein the mounting carrier (400) is provided with a mounting groove (410), wherein the mounting groove (410) has an opening (411) and a groove bottom (412), and the opening (411) and the groove bottom (412) face each other; At least one light-emitting diode chip (100) is mounted on the groove bottom (412) and is used for emitting light, the light-emitting diode chip (100) having a light-emitting surface (110) disposed toward the opening (411); A driving chip (200), located on one side of the light-emitting diode chip (100), mounted on the groove bottom (412), and electrically connected to the light-emitting diode chip (100), and used to control the light-emitting diode chip (100) to emit light; A first reflective layer (500) is installed and covers the groove bottom (412) and is used to reflect the light emitted by the light-emitting diode chip (100) toward the opening (411); a surface of the first reflective layer (500) close to the opening (411) is located on a side of the light-emitting surface (110) close to the groove bottom (412); The second reflective layer (600) is mounted and covers the surface of the driving chip (200) close to the opening (411), and is used to reflect the light emitted by the light-emitting diode chip (100) toward the opening (411).

2. The light emitting module according to claim 1, characterized in that: The material of the second reflective layer (600) includes silica gel, reflective material and magnetic material.

3. The light emitting module according to claim 2, characterized in that: The material of the first reflective layer (500) includes silica gel, reflective material and magnetic material.

4. The light emitting module according to claim 3, characterized in that: The light-emitting module further comprises a transparent packaging portion (700), wherein the transparent packaging portion (700) is fixedly filled in the mounting groove (410) and is used to enable the light-emitting diode chip (100) and the driving chip (200) to be fixedly mounted in the mounting groove (410).

5. The light emitting module according to claim 1, characterized in that: The surface of the driving chip (200) close to the opening (411) is located on a side of the light-emitting surface (110) close to the opening (411).

6. The light emitting module according to claim 5, characterized in that: The light emitting surface (110) is located on a side of the opening (411) close to the groove bottom (412), and the surface of the driving chip (200) close to the opening (411) is located on the side of the opening (411) close to the groove bottom (412).

7. The light emitting module according to claim 6, characterized in that: The installation groove (410) has a groove wall (413), the groove wall (413) is connected to the groove bottom (412), the groove wall (413) is a plane, and a preset angle is formed between the groove wall (413) and the groove depth direction of the installation groove (410), and the preset angle is an acute angle.

8. The light emitting module according to any one of claims 1 to 7, characterized in that: The mounting carrier (400) has a back side (414) arranged opposite to the groove bottom (412); the light-emitting module further comprises an electrical connection portion, the electrical connection portion is located on the back side (414); the electrical connection portion comprises a program burning pin (310), the program burning pin (310) is electrically connected to the driving chip (200); The number of the light emitting diode chips (100) is three, and the three light emitting diode chips (100) can respectively emit red light, green light and blue light.

9. The light emitting module according to claim 8, characterized in that: The electrical connection portion further comprises: a first power pin (330), wherein the first power pin (330) is electrically connected to the light emitting diode chip (100); A first driving ground pin (360), located at one side of the first power pin (330), the first driving ground pin (360) being electrically connected to the driving chip (200); A light-emitting diode pad (320), the light-emitting diode pad (320) being mounted in the mounting carrier (400) and having a connection surface exposing the groove bottom (412), the light-emitting diode chip (100) being mounted on the connection surface, and the first power pin (330) being connected to the light-emitting diode pad (320); The back surface (414) has a straight edge, the light-emitting diode pad (320) is close to the straight edge, and the first power pin (330) and the first driving ground pin (360) are both arranged adjacent to the straight edge.

10. An atmosphere lamp, characterized in that: The atmosphere lamp comprises a capacitor (3180) and the light-emitting module according to claim 9, wherein the capacitor (3180) is close to the straight edge, a first end of the capacitor (3180) is electrically connected to the first power pin (330), and a second end of the capacitor (3180) is electrically connected to the first drive ground pin (360).

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