High-voltage BMS (Battery Management System) monomer sampling device

Abstract

The utility model discloses a high-voltage BMS (Battery Management System) monomer sampling device. The device comprises a microcontroller MCU, at least two digital isolation chips, at least two AFE data acquisition modules, a battery pack unit module and the like, each digital isolation chip is connected with the microcontroller MCU, each digital isolation chip is independently connected with one AFE data acquisition module, each AFE data acquisition module is connected with the battery pack unit module, and each AFE data acquisition module is connected with the battery pack unit module. When a sampling instruction is received, a sampling signal is sent and sampling data is acquired through the connection relation of the components, so that no oscillation or transformer coupling signal is ensured in the sampling process, the problems of radiation emission or immunity and the like are avoided, the requirements of interference resistance and data integrity in the data transmission process are met, and the data transmission efficiency is improved. And the MCU directly reads the corresponding AFE data acquisition module through the connected digital isolation chip, and cascade transmission among a plurality of AFE data acquisition modules is not needed, so that the real-time performance of the sampled data is improved.

Description

Technical Field

[0001] One or more embodiments of the present specification relate to the field of battery monitoring technology, and in particular, to a high-voltage BMS single-cell sampling device. Background Art

[0002] Most of the existing high-voltage BMS (Battery Management System) single cell voltage and temperature sampling adopts the SPI (Serial Peripheral Interface) daisy chain method. That is, by cascading the AFE (Analog Front-End) chip with the next-level chip, according to the solution provided by the AFE chip manufacturer, the data is coupled to the port of the next-level AFE chip through an isolation transformer, and finally the single cell voltage and temperature data of each two cascaded AFEs are obtained through the bridge chip. However, the existing high-voltage BMS single cell sampling devices generally have the following problems: 1. In the process of SPI daisy chain mode, when AFE and AFE are cascaded and coupled through the network transformer, the differential data is susceptible to external interference, resulting in data instability or loss. 2. In the process of data transmission, due to the alternation of network transformer signals, problems such as radiation emission and anti-interference are prone to occur. 3. Since the data is passed from the highest-level AFE chip to the next-level AFE step by step, and finally interacts with the MCU through the SPI interface of the bridge chip, when the number of battery cells is relatively large, it takes a long time for the MCU to read all the data, affecting the real-time sampling of the single cell voltage and temperature. Utility Model Content

[0003] In order to solve the above problems, one or more embodiments of this specification describe a high-voltage BMS monomer sampling device.

[0004] According to a first aspect, a high-voltage BMS monomer sampling device is provided, the device comprising: a microcontroller MCU, at least two digital isolation chips, at least two AFE data acquisition modules and a battery pack unit module, each of the digital isolation chips is respectively connected to the microcontroller MCU, each of the digital isolation chips is individually connected to one AFE data acquisition module, each of the AFE data acquisition modules is connected to the battery pack unit module, and the number of the digital isolation chips is consistent with the number of the AFE data acquisition modules;

[0005] The digital isolation chip is used to receive the sampling signal sent by the microcontroller MCU, and send the sampling signal to the AFE data acquisition module;

[0006] The AFE data acquisition module is used to collect single cell data in the battery pack unit module and transmit the single cell data to the digital isolation chip.

[0007] Preferably, the microcontroller MCU includes at least two chip select pins and an SPI interface, each of the chip select pins is individually connected to one of the digital isolation chips, and the SPI interface is connected to each of the digital isolation chips.

[0008] Preferably, the digital isolation chip includes a low voltage interface and a high voltage interface, the low voltage interface is connected to a control power supply of the microcontroller MCU, and the high voltage interface is connected to an independent power supply.

[0009] Preferably, the voltage of the control power supply is 3.3V.

[0010] Preferably, the voltage of the independent power supply is 5V.

[0011] Preferably, the digital isolation chip is used to convert the encoded data sent by the AFE data acquisition module into electromagnetic data or optical data.

[0012] Preferably, each of the digital isolation chips is provided with a data input terminal and a data output terminal, the data input terminal is used to receive the encoded data sent by each of the AFE data acquisition modules, and the data output terminal is used to send the electromagnetic data or optical data to the microcontroller MCU.

[0013] Preferably, each of the AFE data acquisition modules is provided with an SP interface, and the digital isolation chip is connected to the SP interface of the AFE data acquisition module via an SPI communication bus.

[0014] Preferably, each of the AFE data acquisition modules is connected to the battery pack unit module via a wiring harness.

[0015] Preferably, the microcontroller MCU and each of the digital isolation chips are connected via an SPI communication bus.

[0016] The device provided in the embodiments of the present specification is provided with components such as a microcontroller MCU, at least two digital isolation chips, at least two AFE data acquisition modules and a battery pack unit module, and each digital isolation chip is respectively connected to the microcontroller MCU, each digital isolation chip is individually connected to an AFE data acquisition module, and each AFE data acquisition module is connected to the battery pack unit module. When a sampling instruction is received, a sampling signal is sent and sampling data is obtained through the connection relationship of the above components, thereby ensuring that the sampling data in the sampling process always remains as an SPI digital signal, without oscillation or transformer coupling signals, avoiding the occurrence of problems such as radiation emission or anti-interference, and meeting the anti-interference and data integrity requirements during data transmission. In addition, the microcontroller MCU directly reads the corresponding AFE data acquisition module through the digital isolation chip, without the need for cascade transmission between multiple AFE data acquisition modules, thereby improving the real-time performance of the sampling data. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0018] Figure 1 It is a structural schematic diagram of a high-voltage BMS monomer sampling device in one embodiment of this specification. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application.

[0020] In the following introduction, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance. The following introduction provides multiple embodiments of the present application, and different embodiments can be replaced or combined, so the present application can also be considered to include all possible combinations of the same and / or different embodiments recorded. Therefore, if one embodiment includes features A, B, and C, and another embodiment includes features B and D, then the present application should also be considered to include embodiments containing one or more of all other possible combinations of A, B, C, and D, although the embodiment may not be clearly recorded in the following text.

[0021] The following description provides examples and does not limit the scope, applicability or examples set forth in the claims. Changes may be made to the functions and arrangements of the elements described without departing from the scope of the present application. Various processes or components may be appropriately omitted, substituted or added to each example. For example, the described method may be performed in an order different from the order described, and various steps may be added, omitted or combined. In addition, features described in some examples may be combined in other examples.

[0022] See also Figure 1 , Figure 1 It is a structural schematic diagram of a high-voltage BMS monomer sampling device provided in an embodiment of the present application. In the embodiment of the present application, the device includes: a microcontroller MCU, at least two digital isolation chips, at least two AFE data acquisition modules and a battery pack unit module, each of the digital isolation chips is respectively connected to the microcontroller MCU, each of the digital isolation chips is individually connected to one AFE data acquisition module, each of the AFE data acquisition modules is connected to the battery pack unit module, and the number of the digital isolation chips is consistent with the number of the AFE data acquisition modules;

[0023] The digital isolation chip is used to receive the sampling signal sent by the microcontroller MCU, and send the sampling signal to the AFE data acquisition module;

[0024] The AFE data acquisition module is used to collect single cell data in the battery pack unit module and transmit the single cell data to the digital isolation chip.

[0025] In the embodiments of this specification, Figure 1As shown, the high-voltage BMS monomer sampling device includes a microcontroller MCU, multiple digital isolation chips, multiple AFE data acquisition modules and a battery pack unit module. Optionally, 4 digital isolation chips and 4 AFE data acquisition modules can be set, and the number of settings can be determined by the type and size of the required sampling data. Among them, one end of each digital isolation chip is connected to the microcontroller MCU, and the other end is connected to the AFE data acquisition module. Each AFE data acquisition module is also connected to the battery unit module, and each digital isolation chip is individually connected to an AFE data acquisition module, so the number of digital isolation chips is the same as the number of AFE data acquisition modules. In the high-voltage BMS monomer sampling device, each digital isolation chip can be used to receive a sampling signal sent by the microcontroller MCU, and transmit the sampling signal to the AFE data acquisition module through the connection with the AFE data acquisition module. Each AFE data acquisition module can also be used to collect monomer data in the battery pack unit module connected thereto, and transmit the collected monomer data to the corresponding digital isolation chip. Among them, the digital isolation chip is usually in an isolation state. When a sampling signal is received and the low-voltage interface and high-voltage interface of the digital isolation chip meet the power supply requirements, the digital isolation chip will be in an on-working state.

[0026] Among them, the microcontroller MCU can adopt the STM32 series or the AURIX series, the AFE data acquisition module can adopt the BQ76930 or the BQ756506-Q1, and the digital isolation chip can adopt the ADUM1201 model chip of Analog Devices or the ISO7241C model chip of Texas Instruments.

[0027] As an example, when using the high-voltage BMS single-cell sampling device to perform single-cell sampling on a battery pack unit, the sampling instruction automatically issued by the microcontroller MCU receiving system or manually issued by the terminal can be firstly received, and the number of types of sampling data required to be obtained in the sampling instruction can be analyzed, and a sampling signal can be sent to the corresponding digital isolation chip. Each sampling instruction corresponds to one or more sampling signals. After the digital isolation chip connected to the microcontroller MCU receives the corresponding sampling signal, the sampling signal is transmitted to the AFE data acquisition module connected thereto. Further, after the AFE data acquisition module receives the sampling signal, data sampling is performed on the battery pack unit module, and the collected single-cell data is transmitted to the microcontroller MCU through the above connection relationship, thereby completing the single-cell sampling of the high-voltage BMS.

[0028] In one possible implementation, the microcontroller MCU includes at least two chip select pins and an SPI interface, each of the chip select pins is individually connected to one of the digital isolation chips, and the SPI interface is connected to each of the digital isolation chips.

[0029] In the embodiments of this specification, when a microcontroller MCU is used to send a sampling signal to a digital isolation chip, multiple chip select pins and an SPI interface may be set in the microcontroller MCU. Figure 1 As shown, four chip select pins and an SPI interface are set in the microcontroller MCU, and the four chip select pins are CS1, CS2, CS3 and CS4. Among them, each chip select pin is individually connected to a corresponding digital isolation chip. As an example, the chip select pin CS1 is connected to the digital isolation chip IC1. The set SPI interfaces are each connected to the digital isolation chip, that is, the digital isolation chip IC1, the digital isolation chip IC2, the digital isolation chip IC3 and the digital isolation chip IC4 share an SPI interface when connected to the microcontroller MCU.

[0030] When the microcontroller MCU sends a sampling signal to each digital isolation chip, it can be achieved through the set chip select pin, that is, if the single cell data collected by the AFE1 data acquisition module needs to be obtained, the real-time level of the chip select pin CS1 is changed to make the sampling signal transmitted to the digital isolation chip IC1 through the chip select pin CS1, and then further transmitted to the AFE1 data acquisition module. Then, the AFE1 data acquisition module transmits the single cell data collected by the battery pack unit module to the SPI interface of the microcontroller MCU through the digital isolation chip IC1. Similarly, the single cell data collected by other AFE data acquisition modules can be obtained through other chip select pins to achieve the purpose of high-voltage BMS single cell sampling.

[0031] In one possible implementation, the digital isolation chip includes a low voltage interface and a high voltage interface, the low voltage interface is connected to a control power supply of the microcontroller MCU, and the high voltage interface is connected to an independent power supply.

[0032] In the embodiment of this specification, the digital isolation chip can disconnect the direct connection between the two interfaces in the circuit in order to isolate the low-voltage control circuit from the high-voltage working circuit in the electrical system, ensure the safe operation of the system and the accurate transmission of the signal. The digital isolation chip transmits signals through electrical isolation technology, such as capacitive coupling, transformer coupling or optical coupling, so as to avoid damage to the microcontroller MCU on the low-voltage side due to voltage surge or current overload on the high-voltage side. In the digital isolation chip, two interfaces can be set in different parts, one of which is provided with a low-voltage interface and the other is provided with a high-voltage interface. Among them, the low-voltage interface can be connected to the control power supply of the microcontroller MCU to meet the low-voltage power supply demand, and the high-voltage interface needs to be connected to an independent power supply to meet the high-voltage power supply demand. Only when the low-voltage interface and the high-voltage interface of the digital isolation chip meet the power supply demand, the digital isolation chip can work normally to transmit signals and data. In order to meet the different power supply requirements on both sides, the low-voltage interface can be connected to the control power supply of the microcontroller MCU, and the high-voltage interface can be connected to an independent power supply.

[0033] In one possible implementation, the voltage of the control power supply is 3.3V.

[0034] In the embodiments of this specification, since the microcontroller MCU is generally powered by low voltage, in order to meet the low voltage interface power supply requirements of the digital isolation chip, the low voltage interface can be directly connected to the control power supply of the microcontroller MCU, and the voltage of the control power supply is set to 3.3V.

[0035] In one possible implementation, the voltage of the independent power supply is 5V.

[0036] In the embodiments of this specification, the high-voltage interface of the digital isolation chip generally requires 5V power supply, so the voltage of the independent power supply connected to the high-voltage interface independent power supply is set to 5V. Among them, the independent power supply can design a linear power supply through the AFE data acquisition module to supply power to the high-voltage side of the digital isolation chip. When the AFE data acquisition module is awakened, the DRIVE pin of the AFE can output 5.7V, and then output it to the step-down end through the power supply port of the AFE to obtain a 5V independent power supply.

[0037] In one possible implementation, the digital isolation chip is used to convert the encoded data sent by the AFE data acquisition module into electromagnetic data or optical data.

[0038] In the embodiment of this specification, after the high and low voltage power supply requirements on both sides are met, the digital isolation chip can transmit the sampling signal to the AFE data acquisition module connected thereto. After receiving the sampling signal, the AFE data acquisition module converts the collected monomer data into coded data based on the SPI protocol, and then sends it to the high voltage side of the corresponding digital isolation chip. The digital isolation chip converts the coded data sent by the AFE data acquisition module into electromagnetic data or optical data, and sends it to the microcontroller MCU by connecting to the microcontroller MCU.

[0039] Among them, the most common digital isolation chips are the ADUM1201 chip from Analog Devices or the ISO7241C chip from Texas Instruments.

[0040] In one possible implementation, each of the digital isolation chips is provided with a data input terminal and a data output terminal, the data input terminal is used to receive the encoded data sent by each of the AFE data acquisition modules, and the data output terminal is used to send the electromagnetic data or optical data to the microcontroller MCU.

[0041] In the embodiments of this specification, each digital isolation chip can be provided with two ports when transmitting data, namely, a data input port and a data output port. The provided data input port can be connected to the corresponding AFE data acquisition module to receive the encoded data sent by the AFE data acquisition module. The provided data output port can be connected to the microcontroller MCU to send the converted electromagnetic data or optical data to the microcontroller MCU.

[0042] In one possible implementation manner, each of the AFE data acquisition modules is provided with an SP interface, and the digital isolation chip is connected to the SP interface of the AFE data acquisition module via an SPI communication bus.

[0043] In the embodiments of the present specification, an SP interface is set in each AFE data acquisition module. When the AFE data acquisition module receives a sampling signal and collects single cell data in the battery pack unit module, the SP interface of the AFE data acquisition module can be connected to the corresponding digital isolation chip through the SPI communication bus.

[0044] In one possible implementation, each of the AFE data acquisition modules is connected to the battery pack unit module via a wiring harness.

[0045] In the embodiments of the present specification, after receiving the sampling signal, each AFE data acquisition module can connect each AFE data acquisition module with the battery pack unit module through a wiring harness when sampling the battery pack unit module.

[0046] In one possible implementation manner, the microcontroller MCU and each of the digital isolation chips are connected via an SPI communication bus.

[0047] In the embodiments of this specification, each digital isolation chip can transmit the converted electromagnetic data or optical data to the microcontroller MCU through the SPI communication bus connection, and the microcontroller MCU further performs data analysis on the electromagnetic data or optical data to complete the single-cell sampling of the high-voltage BMS.

[0048] Among them, during the entire high-voltage BMS single-cell sampling process, the transmission sampling signal can be achieved by changing the level state of the chip select pin CS of the microcontroller MCU. When the level of the chip select pin CS is pulled low, that is, when 3.3V power supply is selected, the corresponding digital isolation chip is turned on, the working state is turned on, and the sampling signal is transmitted to the corresponding AFE data acquisition module. After the AFE data acquisition module completes the sampling of the battery pack unit module, it first transmits the sampling data to the digital isolation chip through the SPI communication bus and then uploads it to the microcontroller MCU. After the sampling is completed, the level of the corresponding chip select pin CS is pulled high. Similarly, the single-cell sampling of all AFE data acquisition modules can be realized.

[0049] It should be noted that, in this high-voltage BMS single-cell sampling device, receiving sampling signals, transmitting sampling signals, using the AFE data acquisition module to sample the battery pack unit module, converting and transmitting sampling data, etc. are all well-known technologies familiar to those skilled in the art, and the focus of this application is not the algorithm / program itself involved in the above technology, but the overall system that can realize these functions through the above connection relationship. Therefore, the specific implementation process of the above algorithm / program will not be described in detail here.

[0050] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0051] The above is only an exemplary embodiment of the present disclosure, and the scope of the present disclosure cannot be limited thereto. That is, any equivalent changes and modifications made according to the teachings of the present disclosure are still within the scope of the present disclosure. After considering the specification and practicing the disclosure here, those skilled in the art will easily think of the implementation scheme of the present disclosure. This application is intended to cover any modification, use or adaptation of the present disclosure, which follows the general principles of the present disclosure and includes common knowledge or customary technical means in the technical field not recorded in the present disclosure. The description and examples are regarded as exemplary only, and the scope and spirit of the present disclosure are defined by the claims.

Claims

1. A high-voltage BMS monomer sampling device, characterized in that: The device comprises: a microcontroller MCU, at least two digital isolation chips, at least two AFE data acquisition modules and a battery pack unit module, each of the digital isolation chips is respectively connected to the microcontroller MCU, each of the digital isolation chips is individually connected to one AFE data acquisition module, each of the AFE data acquisition modules is connected to the battery pack unit module, and the number of the digital isolation chips is consistent with the number of the AFE data acquisition modules; The digital isolation chip is used to receive the sampling signal sent by the microcontroller MCU, and send the sampling signal to the AFE data acquisition module; The AFE data acquisition module is used to collect single cell data in the battery pack unit module and transmit the single cell data to the digital isolation chip.

2. The device according to claim 1, characterized in that The microcontroller MCU comprises at least two chip selection pins and an SPI interface, each of the chip selection pins is individually connected to one of the digital isolation chips, and the SPI interface is connected to each of the digital isolation chips.

3. The device according to claim 1, characterized in that The digital isolation chip comprises a low voltage interface and a high voltage interface, the low voltage interface is connected to a control power supply of the microcontroller MCU, and the high voltage interface is connected to an independent power supply.

4. The device according to claim 3, characterized in that The voltage of the control power supply is 3.3V.

5. The device according to claim 3, characterized in that The voltage of the independent power supply is 5V.

6. The device according to claim 1, characterized in that The digital isolation chip is used to convert the coded data sent by the AFE data acquisition module into electromagnetic data or optical data.

7. The device according to claim 6, characterized in that Each of the digital isolation chips is provided with a data input terminal and a data output terminal, the data input terminal is used to receive the coded data sent by each of the AFE data acquisition modules, and the data output terminal is used to send the electromagnetic data or optical data to the microcontroller MCU.

8. The device according to claim 1, characterized in that Each of the AFE data acquisition modules is provided with an SP interface, and the digital isolation chip is connected to the SP interface of the AFE data acquisition module via an SPI communication bus.

9. The device according to claim 1, characterized in that Each of the AFE data acquisition modules is connected to the battery pack unit module via a wiring harness.

10. The device according to claim 1, characterized in that The microcontroller MCU is connected to each of the digital isolation chips via an SPI communication bus.

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